GIGABYTE TECHNOLOGY Co. Ltd, a leading manufacturer of motherboards, graphics cards, and hardware solutions, today announced all Z690, B660, and following motherboards will support EXPO memory. Users can enjoy performance boost with ease on GIGABYTE motherboards of all platforms with either AMD EXPO or Intel XMP supported memories.

AMD recently announced the new EXPO technology for DDR5 memory on the latest AM5 platform, which allows easy DDR5 memory accelerating with built-in overclocking profiles for the performance uplift, just like XMP technology. Along with this new technology, all major memory module brands release EXPO memories correspondingly. GIGABYTE leads to provide both AMD EXPO and Intel XMP DDR5 support on AM5 motherboards, and carry on the innovative design to Intel platform, which enable users to speed up their DDR5 memories on Z690, B660, and following motherboards by simply activate XMP and EXPO in the BIOS setting for the performance boost.

Bitspower, one of the world's leading suppliers of water-cooling equipment for performance computers, today launched the Bitspower AM5 kit which can transform AMD-based Bitspower CPU water blocks into an AM5-compatible product. More and more setups used by gamers, streamers, and creators will harness AMD's new AM5 platform, which provides native support for up to 170 W—meaning there's power to do more, play more, and create more than ever before. However, with this increased power comes higher temperatures.

Fortunately, AMD has ensured that existing AM4 cooling solutions can be supported with their newest motherboards, with the product's height and port distance being managed in a 7 mm increment. With the new AM5 kit, Bitspower's current range of AMD CPU blocks can directly migrate to AM5 socket motherboards. The company's latest generation CPU water blocks, such as the M Pro Water Blocks, are optimized for cooling Ryzen 7000-series CPUs, allowing users to take that already-powerful processor to new heights.

The Minisforum Neptune HX90G all-AMD high-performance mini-PC went on sale at introductory prices. The lunchbox-sized mini-PC packs some serious kit, which includes an AMD Ryzen 9 5900HX "Zen 3" 8-core/16-thread processor, Radeon RX 6600M RDNA2 graphics with 8 GB VRAM, memory options that include dual-channel DDR4 16 GB, 32 GB, and 64 GB; and storage options that include a M.2 NVMe Gen 4 SSD with up to 512 GB capacity. You can also buy it as a barebones, and drop in your own SSD and DDR4 SO-DIMM memory.

What's new here are the introductory prices. The barebones (which gives you the processor and GPU, but not memory or SSD), is priced at $799, down from its $940 regular price. The model with 2x 8 GB memory and 512 GB SSD, is priced at $909, compared to its $1,069 regular price. The 2x 16 GB memory + 512 GB SSD model is going for $969, compared to $1,129 regular price. The top model with 2x 32 GB RAM + 512 GB SSD, can be had at $1,079, compared to its $1,269 regular price.

AMD's "Zen 3" architecture, particularly in its low-power mobile iterations, change their clock speeds at a very high rate of speed (switching between lower idle clock-speeds to higher boost clock bins), finds a study by Chips and Cheese, which tested 17 processors across brands and machine-architectures, including mobile SoCs. The interesting finding here is that the Ryzen 7 5800U "Zen 3" mobile processor has a much faster speed-ramp than even SoC powering handhelds, such as the Qualcomm Snapdragon 821, returning a ramp-time of just 1.6 ms, compared to 19.6 ms on the Snapdragon. We now see why AMD likes its processors to run detached from the 10 ms tick-rate of Windows internal power-management (the rate at which the OS reports its workload to the processor, so it could respond with a higher performance state). A rapid boost clock ramp rate allows the processor to better ration its power budget in response to workload.

Here's the very first sketch of an AMD RDNA3 Radeon RX 7000-series flagship graphics card with the "Navi 31" chip in the middle. This will be AMD's first chiplet-based GPU built on a philosophy similar to that of the Ryzen desktop and EPYC server processors. The main number crunching machinery that benefits the most from the latest foundry process, will be built on 5 nm logic chiplets (up to two of these on the "Navi 31," one of these on the "Navi 32"), while the components that don't really benefit from the latest process, such as the memory controllers, display/media accelerators, etc., will be disintegrated into chiplets built on a slightly older node, such as 6 nm. This way AMD gets to maximize its 5 nm allocation at TSMC, which it has to share among not just the logic tiles of RDNA3 GPUs, but also its "Zen 4" processors.

The top-dog "Navi 31" silicon is expected to feature a 384-bit wide GDDR6 memory interface, which is why you see 12 memory chips surrounding the GPU package. AMD is expected to deploy fast 19-21 Gbps class GDDR6 memory chips, as well as double-down on the Infinity Cache technology. The package looks like a GPU die surrounded by HBM stacks, but those are actually the memory/display chiplets. If this PCB is from an AMD reference design, it could be the biggest hint that AMD isn't switching over to the 12+4 pin ATX 12HPWR connector just yet, and could stick with three 8-pin PCIe connectors for power, just like the current RX 6950 XT. USB-C with DisplayPort passthrough could prominently feature with RDNA3 graphics cards, besides standard DisplayPort and HDMI connectors.

OneRaichu, who has access to engineering samples of both the AMD "Raphael" Ryzen 7000-series, and Intel 13th Gen Core "Raptor Lake," performed IPC comparisons between the two, by disabling E-cores on the "Raptor Lake," fixing the clock speeds of both chips to 3.60 GHz, and testing them across a variety of DDR5 memory configurations. The IPC testing was done with SPEC, a mostly enterprise-relevant benchmark, but one that could prove useful in tracing where the moderately-clocked enterprise processors such as EPYC "Genoa" and Xeon Scalable "Sapphire Rapids" land in the performance charts. OneRaichu also threw in scores obtained from a 12th Gen Core "Alder Lake" processor for this reason, as its "Golden Cove" P-core powers "Sapphire Rapids" (albeit with more L2 cache).

With DDR5-4800 memory, and testing on SPECCPU2017 Rate 1, at 3.60 GHz, the AMD "Zen 4" core ends up with the highest scores in SPECint, topping even the "Raptor Cove" P-core. It scores 6.66, compared to 6.63 total of the "Raptor Cove," and 6.52 of the "Golden Cove." In the SPECfp tests, however, the "Zen 4" core falls beind "Raptor Cove." Here, scores a 9.99 total compared to 9.91 of the "Golden Cove," and 10.21 of the "Raptor Cove." Things get interesting at DDR5-6000, a frequency AMD considers its "sweetspot," The 13th Gen "Raptor Cove" P-core tops SPECint at 6.81, compared to 6.77 of the "Zen 4," and 6.71 of "Golden Cove." SPECfp sees the "Zen 4" fall behind even the "Golden Cove" at 10.04, compared to 10.20 of the "Golden Cove," and 10.46 of "Raptor Cove."

AMD's upcoming Ryzen 9 7950X 16-core processor can boost at speeds of up to 5.85 GHz, even though its maximum boost frequency in the specs is 5.70 GHz. The processor needs temperatures below 50°C to boost up to 5.85 GHz. Above these temperatures, it will only boost up to the 5.70 GHz on the tin. There are four frequencies to keep in mind about the 7950X. First is the base frequency, of 4.50 GHz. Next up, is the all-core boost frequency, of 5.10 GHz. This is the frequency at which the processor can run all 16 of its cores, provided it stays away from the 95°C temperature throttle. 5.70 GHz is the maximum boost frequency you'll get on "some" of the cores if the temperature is maintained between 50-95°C. If you're able to keep temperature below 50°C, the processor can boost up to 5.85 GHz. AMD refers to 5.85 GHz as the "peak clock."

To be able to hit peak clocks, you should ideally need some serious cooling, such as a 360 mm DIY liquid cooling setup, or a 420 mm AIO CLC; however in some circumstances, such as the system starting up from a cold-boot in a room with low ambient temperatures, the processor should hit peak clocks as it's approaching the 50°C-mark. AMD is making no pretenses that the 7950X is a high-power chip. Its TDP is rated at 170 W, and its PPT (package power tracking) limit at 230 W. By setting the TDP at 170 W from the get go, AMD is hinting that one can forget about aftermarket tower-type air-cooling, and head straight to AIO liquid cooling.

ENERMAX, a leading designer and manufacturer of high-performance PC hardware products, is pleased to announce that a selection of its current all-in-one (AIO) liquid and air coolers will be fully compatible with AM5 (LGA1718) socket designed for the upcoming AMD Ryzen 7000 Series CPUs. A list of compatible ENERMAX coolers is provided in the table below. For users who already own the selected ENERMAX CPU coolers and plan to switch motherboard to AMD Ryzen 7000 series, you may contact your ENERMAX local branch for assistance. For the latest installation guide and video, please visit this page.

AMD's recently announced Ryzen 7000-series Socket AM5 processors are expected to go on sale from September 27, but on that day, you'll only be able to choose between the top-grade AMD X670E chipset, and the second-best X670. Although AMD announced the mid-tier B650E and B650 chipsets, they will be available from a later date. We're not getting confirmation of at least one important date—October 4, 2022. On this date, various motherboard manufacturers are expected to announce their products based on the B650E and B650, and we'll probably hear retail availability closer to that day. The table below shows the key specs differentiating the B650E/B650 from the X670E/X670. The B650E/B650 are a single-chip chipset, as opposed to the X670E/X670 being a dual-chip solution. You get fewer downstream PCIe lanes, one less 20 Gbps USB port, six less 10 Gbps ports.

Super Micro Computer, Inc. (SMCI), a global leader in enterprise computing, storage, networking solutions, and green computing technology, is announcing its most advanced GPU server, incorporating eight NVIDIA H100 Tensor Core GPUs. Due to its advanced airflow design, the new high-end GPU system will allow increased inlet temperatures, reducing a data center's overall Power Usage Effectiveness (PUE) while maintaining the absolute highest performance profile. In addition, Supermicro is expanding its GPU server lineup with this new Universal GPU server, which is already the largest in the industry. Supermicro now offers three distinct Universal GPU systems: the 4U,5U, and new 8U 8GPU server. The Universal GPU platforms support both current and future Intel and AMD CPUs -- up to 400 W, 350 W, and higher.

"Supermicro is leading the industry with an extremely flexible and high-performance GPU server, which features the powerful NVIDIA A100 and H100 GPU," said Charles Liang, president, and CEO, of Supermicro. "This new server will support the next generation of CPUs and GPUs and is designed with maximum cooling capacity using the same chassis. We constantly look for innovative ways to deliver total IT Solutions to our growing customer base."

Flex Logix Technologies, Inc., supplier of high performance and efficient edge AI inference accelerators and the leading supplier of eFPGA IP, today announced the InferX Hawk - a hardware and software-ready Mini-ITX x86 system designed to help customers quickly and easily customize, build and deploy edge and embedded AI systems. The InferX Hawk system includes the Flex Logix InferX X1 AI accelerator chip, AMD Ryzen Embedded R2314 SoC, InferX Runtime software, and the EasyVision platform running Linux or Windows to deliver an integrated low power, high-performance AI system.

The AMD Ryzen Embedded R2314 delivers performance per watt efficiency using "Zen+" core architecture and Radeon Graphics. With the Hawk Mini-ITX solution, customers can save over six months of hardware and software development time, additional system costs and power over NVIDIA and other solutions.

AMD's Technical Marketing Director, Robert Hallock has decided to leave the company after 12+ years with the company, to "explore new opportunities and experiences" as he puts in a post on LinkedIn. He apparently left the company last Friday, but only shared the news today. "After just over 12 adventure-packed years at AMD, I'm leaving to explore new opportunities and experiences. Over the years, I've had the honor and privilege of publicly teaching others about some truly stellar innovation: the Zen core family, 3D V-Cache, chiplet packaging, HBM memory, FreeSync, low-overhead graphics APIs, and much more. After working in both graphics and processors for roughly 6 years each, I've learned so much."

He thanked several current and ex colleagues at AMD, as well as thanking the PC hardware reviewer community and the AMD community on Reddit and Discord among others. He ended his post by saying he'll be taking some time off to travel and think about what he'll be doing next, so it doesn't seem like he has any fixed plans for the future.

AMD today announced it is joining the newly created PyTorch Foundation as a founding member. The foundation, which will be part of the non-profit Linux Foundation, will drive adoption of Artificial Intelligence (AI) tooling by fostering and sustaining an ecosystem of open source projects with PyTorch, the Machine Learning (ML) software framework originally created and fostered by Meta.

As a founding member, AMD joins others in the industry to prioritize the continued growth of PyTorch's vibrant community. Supported by innovations such as the AMD ROCm open software platform, AMD Instinct accelerators, Adaptive SoCs and CPUs, AMD will help the PyTorch Foundation by working to democratize state-of-the-art tools, libraries and other components to make these ML innovations accessible to everyone.

With next-generation GPUs around the corner, the market seems to be flooded with ASICs for any board partner willing to buy them and use as they see fit—including building desktop graphics cards with mobile GPUs. Several Chinese board partners are found selling desktop graphics cards based on the mobile Radeon RX 6600M at prices ranging between the equivalent of USD $180 to $214.

The RX 6600M has essentially the same specs as the desktop RX 6600 (non-XT), with 1,792 stream processors across 28 RDNA2 compute units, 8 GB of 14 Gbps GDDR6 memory across a 128-bit wide memory bus, and similar clock-speeds of 2177 MHz (compared to 2044 MHz of the desktop RX 6600). In fact the RX 6600M has much better typical board power specs of 100 W, compared to 132 W of the desktop RX 6600. The best part of this deal has to be the price. An RX 6600 (non-XT) starts around the $250-mark in the US market. So even with shipping costs added, the $180 RX 6600M comes across as a slightly better deal.

AMD Ryzen 5 7600X "Zen 4" 6-core/12-thread processor is shaping up to be a speed-demon for purely gaming builds, with the company claiming higher gaming performance than Intel current flagship Core i9-12900K. A combination of high clock speeds (4.70 GHz nominal, 5.30 GHz max boost), high power limits from 105 W TDP (130 W limit), the "Zen 4" IPC, and the fact that all that power headroom is available to just 6 cores, means that the chip is able to sustain boost frequencies better. But what when Core Performance Boost (CPB) is disabled? VideoCardz scored screenshots of a Cinebench R23 run to answer just that.

With CPB disabled (in the motherboard BIOS), the Ryzen 5 7600X scores 1681 points in the single-threaded test, and 13003 points in the multi-threaded one. With CPB enabled (which is the default setting), the 7600X bags 1920 points single-threaded, and 14767 points multi-threaded, which is a 14% performance increase just from the processor's boosting algo. Disabling CPB is generally seen as a silver-bullet against high temperatures for AMD processors, and even here, we see the chip running under 60°C, and pulling 60.2 W peak, as measured by HWinfo; whereas with CPB enabled, the chip can run as hot as 92.1°C, pulling up to 110 W, pushing clock speeds up to 4.45 GHz.

During Evercore ISI TMT conference, Intel announced that the company would continue to lose market share, with a possible bounce back in the coming years. According to the latest report, Intel's CEO Pat Gelsinger announced that he expects the company to continue to lose its market share to AMD as the competition has "too much momentum" going for it. AMD's Ryzen and EPYC processors continue to deliver power and efficiency performance figures, which drives customers towards the company. On the other hand, Intel expects a competing product, especially in the data center business with Sapphire Rapids Xeon processors, set to arrive in 2023. Pat Gelsinger noted, "Competition just has too much momentum, and we haven't executed well enough. So we expect that bottoming. The business will be growing, but we do expect that there continues to be some share losses. We're not keeping up with the overall TAM growth until we get later into '25 and '26 when we start regaining share, material share gains."

The only down years that are supposed to show a toll of solid competition are 2022 and 2023. As far as creating a bounceback, Intel targets 2025 and 2026. "Now, obviously, in 2024, we think we're competitive. 2025, we think we're back to unquestioned leadership with our transistors and process technology," noted CEO Gelsinger. Additionally, he had a say about the emerging Arm CPUs competing for the same server market share as Intel and AMD do so, stating that "Well, when we deliver the Forest product line, we deliver power performance leadership versus all Arm alternatives, as well. So now you go to a cloud service provider, and you say, 'Well, why would I go through that butt ugly, heavy software lift to an ARM architecture versus continuing on the x86 family?"

AMD late Thursday unveiled the FidelityFX Super Resolution 2.1 (FSR 2.1) performance enhancement, which builds on the performance-quality gains of FSR 2.0, while improving the visual fidelity and correcting several kinds of upscaling artifacts visible to the keen eye. To begin with, it corrected ghosting issues with geometry carrying motion vectors not matching the underlying pixel colors, which were causing a "shimmering" effect. There are also changes to the disocclusion logic that let it detect disocclusions in areas with little depth separating objects, which again should address some ghosting issues.

Upscaled output quality has been improved by turning some upscaler computations from FP16 to FP32 (full-precision), which should improve color range and temporal stability of the upscaled image. Ghosting issues on transparent geometry has also been improved by updates to the reactive mask. Ghosting issues on geometry with motion vectors not matching underlying pixel colors have been addressed with improvements to the composition and transparency mask. AMD detailed FSR 2.1 in its GPUOpen page, and has made the software available to game developers. Any game currently implementing FSR 2.0 can release FSR 2.1 support through patches. The latest version 1.7.1 patch of Farming Simulator 2022 implements FSR 2.1.AMD also put together a video presentation with Farming Simulator 2022, highlighting the improvements made with FSR 2.1.

Kingston FURY, the gaming division of Kingston Technology Company, Inc., a world leader in memory products and technology solutions, announced today the addition of AMD EXPO certified DDR5 modules to the Kingston FURY Beast line of memory. Always aiming to provide the latest options to gamers and enthusiasts, these new overclock specs modules and kits are optimized for AMD's upcoming AM5 platform with two factory tuned profiles, plus one user customizable profile.

Qualified by the world's leading motherboard manufacturers, the Kingston FURY Beast line offers aggressive speeds up to 6000MT/s1 with a bold low-profile heatspreader design. Now with AMD EXtended Profile for Overclocking, users can trust that their selected Kingston FURY Beast DDR5 modules and kits are exactly what their AMD AM5 system needs to maximize performance, while also maintaining stability.

According to the latest TrendForce statistics, revenue of the top ten global IC design houses reached US$39.56 billion in 2Q22, growing 32% YoY. Growth was primarily driven by demand for data centers, networking, IoT, and high-end product portfolios. AMD achieved synergy through mergers and acquisitions. In addition to climbing to third place, the company also posted the highest annual revenue growth rate in 2Q22 at 70%.

Qualcomm continues in the No. 1 position worldwide, exhibiting growth in the mobile phone, RF front-end, automotive, and IoT sectors. Sales of mid/low-end mobile phone APs were weak but demand for high-end mobile phone APs was relatively stable. Company revenue reached US$9.38 billion, or 45% growth YoY. NVIDIA benefitted from expanded application of GPUs in data centers to expand this product category's revenue share past the 50% mark to 53.5%, making up for the 13% YoY slump in its game application business, bringing total revenue to US$7.09 billion, though annual growth rate slowed to 21%. AMD reorganized its business after the addition of Xilinx and Pensando. The company's embedded division revenue increased by 2,228% YoY. In addition, its data center department also made a considerable contribution. AMD posted revenue of US$6.55 billion, achieving 70% growth YoY, highest amongst the top ten. Broadcom's sales performance in semiconductor solutions remained solid and demand for cloud services, data centers, and networking is quite strong. The company's purchase order backlog is still increasing with 2Q22 revenue reaching US$6.49 billion, an annual growth rate of 31%.

Starting next year, AMD will move to a new model number scheme for its mobile processors and it appears that the company has decided to use the first digit to represent the model year, which should alleviate some past confusion. The second digit in the model name will represent where in the product stack the specific chip will sit and here we're potentially getting some new 6 and 8 models, although nothing guarantees that AMD will actually implement these segments into real products. The third digit represents the architecture, so a four equals Zen 4 for example.

The last digit in the model names is a new addition where AMD has sub SKUs that offer some performance advantage of the base SKU of a specific model and this digit will apparently only be represented by a 0 or a 5. Finally AMD has added a new suffix too, where C stands for Chromebook. This translates to 15-28 Watt chips that have been designed specifically for Chromebook usage. The current HX, HS and U suffix lettering will carry over, alongside the lower-case e for 9 W versions the U SKUs. AMD has also segmented it's mobile CPUs according to the chart below, to try and deliver a clearer use case for its various CPU models. The chart is pretty self explanatory, although some of the segmentation will apply to updated models of current designs, whereas others will only apply to new laptop designs. The new model numbering scheme will apply to at least 2025.

The PC version of "Red Dead Redemption 2" received official support for the AMD FidelityFX Super Resolution 2.0 (FSR 2.0) performance enhancement with the latest Version 1.31 patch. The game now supports FSR 2.0 as well as DLSS. The update also includes improvements to the temporal anti-aliasing (TAA) implementation in the PC version. The update comes two months following a community mod that added FSR 2.0 to the game unofficially, which required you to run the game with its DirectX 12 renderer, and add or replace certain game files. The official 1.31 patch adds FSR 2.0 support for both the DirectX 12 and Vulkan renderers. The 433 MB patch is being pushed through Steam.

EK, the market leader in high-end water cooling for PC products, wishes to inform existing and future customers regarding the compatibility of our existing cooling solutions with the highly anticipated AMD Socket AM5 platform. Compared to Socket AM4, the backplate mounting hole pattern is still 54 x 90 mm and uses UNC 6-32 threads, but the AM5 motherboards now have an integrated CPU-socket backplate. The stock backplate is best kept untouched since removing it also means fiddling with the CPU loading mechanism and exposing the socket pins. To avoid such risks, some EK products need to be updated, but fear not, as compatibility is handled for all existing EK products.

AMD Ryzen 7000 "Zen 4" processors can hit up to 95 °C at stock settings, with cooling most appropriate to the TDP level. This is because the PPT (package power tracking) limits for the 170 W TDP processors is as high as 230 W, and for the 105 W TDP models, it's 130 W. After reaching this temperature threshold, the processor begins to downclock itself to lower temperatures. Harukaze5719 discovered that higher than needed core voltages could be at play, and manually undervolting the processors could free up significant thermal headroom, letting the processors hold on to higher boost multipliers better.

A Cinebench R23 picture of AMD's recently announce Ryzen 9 7950X CPU having been put through its paces have appeared online via a post on Baidu, which has been taken down since the picture was posted. However, courtesy of @harukaze5719 it lives on, on Twitter and gives us a first glimpse into the Cinebench R23 performance of the upcoming CPU. The CPU is said to have been air cooled, so it's possible that we'll see even higher benchmark numbers with better cooling, so take these numbers with a pinch of sodium chloride, just to be on the safe side. The test system was also using Windows 10, so there's the potential of some extra performance by changing to Windows 11 here as well.

In the single score test, the Ryzen 9 7950X scores 2,205 points, which is in line with Cinebench R23 leaks for Intel's upcoming Core i9-13900K CPU, if a smidgen slower. The multi-core score is obviously not going to compete with Intel's Core i9-13900K due to the overall lower core count, but at 29,649, but it's ahead of the Core i9-12900K by a decent margin. It'll be interesting to see how AMD positions the 7000-series of CPUs, as although it seems like the company has done a good job in improving the overall performance compared to the 5000-series, it's not quite enough to take the performance crown this time around, if these early benchmark leaks from both sides are anything to go by.

Update 10:27 UTC: A new picture hjas appeared where the CPU has been kitted out with better cooling at the multi-core score has jumped from 29,649 to 36,256, which makes it competitive with the Core i9-13900K scores that have leaked in the past.

At this point, we don't know if this is a limitation at AMD's level or ASRock's, but someone with access to a retail ASRock X670E Steel Legend motherboard, with all its packaged paraphernalia in place, spotted an interesting sticker covering the board's four DDR5 DIMM slots. The sticker has some info on the ideal DIMM slot selection for dual-channel memory (4x sub-channels); but what catches our eye is a table which states just how long the motherboard will take to train the memory the first time it's booted up, or after a clear-CMOS operation (where your BIOS settings are erased).

The table says that a typical setup with two 16 GB modules (read: two single-rank modules in a 1 DIMM per channel/1DPC configuration), takes 100 seconds to train (or until first boot). Two 32 GB modules (typically a pair of dual-rank modules in 1DPC configuration) take 200 seconds, as do four 16 GB modules (four single-rank modules in a 2DPC configuration). The least optimal config, four dual-rank modules in a 2DPC configuration, takes a whopping 400 seconds (almost 7 minutes) to train. That's 100 to 400 seconds of a black screen, or no display signal, enough to unnerve anyone and assume something is DOA.Update Sep 2nd: The source behind this story confirmed that this is an ASRock-level issue, and that it's been "fixed" with the latest BIOS.

Update Sep 8th: This has been fixed according to ASRock.