AMD at a special media event titled "together we advance_data centers," formally launched its 4th generation EPYC "Genoa" server processors based on the "Zen 4" microarchitecture. These processors debut an all new platform, with modern I/O connectivity that includes PCI-Express Gen 5, CXL, and DDR5 memory. The processors come in CPU core-counts of up to 96-core/192-thread. There are as many as 18 processor SKUs, differentiated not just in CPU core-counts, but also the way the the cores are spread across the up to 12 "Zen 4" chiplets (CCDs). Each chiplet features up to 8 "Zen 4" CPU cores, depending on the model; up to 32 MB of L3 cache, and is built on the 5 nm EUV process at TSMC. The CCDs talk to a centralized server I/O die (sIOD), which is built on the 6 nm process.

The processors AMD is launching today are the EPYC "Genoa" series, targeting general purpose servers, although they can be deployed in large cloud data-centers, too. To large-scale cloud providers such as AWS, Azure, and Google Cloud, AMD is readying a different class of processor, codenamed "Bergamo," which is plans to launch later. In 2023, the company will launch the "Genoa-X" line of processor for technical-compute and HPC applications, which benefit from large on-die caches, as they feature the 3D Vertical Cache technology. There will also be "Siena," a class of EPYC processors targeting the telecom and edge-computing markets, which could see an integration of more Xilinx IP.

ASUS, a leading provider of server systems, server motherboards and workstations, today announced new best-in-class server solutions powered by the latest AMD EPYC 9004 Series processors. ASUS also launched superior liquid-cooling solutions that dramatically improve the data-center power-usage effectiveness (PUE).

The breakthrough thermal design in this new generation delivers superior power and thermal capabilities to support class-leading features, including up to 400-watt CPUs, up to 350-watt GPUs, and 400 Gbps networking. All ASUS liquid-cooling solutions will be demonstrated in the ASUS booth (number 3816) at SC22 from November 14-17, 2022, at Kay Bailey Hutchison Convention Center in Dallas, Texas.

The SiSoft SANDRA user database has just been pinged by two new unreleased AMD Ryzen 7000 series "Zen 4" processor models, the Ryzen 7 7700 and Ryzen 5 7600. These chips have the same 8-core/16-thread and 6-core/12-thread core-counts as the 7700X and 7600X, respectively; but with lower clock speeds, and more importantly, a lower TDP of just 65 W. This would put their package power tracking (PPT) limit around 90 W, down from the 105 W and 140 W of the their "X" siblings.

The 7600 and 7700 come with a base frequency of 3.80 GHz, as detected by SANDRA. Every other specification, such as cache size, is the unchanged from the 7600X or 7700X. There's no word on the availability, but it's likely that AMD would debut these chips in the OEM channel first, especially given that the 7600 has the potential to undercut sales of the embattled 7600X. Things could get interesting as Intel debuts the lower end of its 13th Gen Core i5 series, which are rumored to be based on the "Alder Lake" microarchitecture, and 6P+4E SKUs.

Hewlett Packard Enterprise (NYSE: HPE) today announced it is making supercomputing accessible for more enterprises to harness insights, solve problems and innovate faster by delivering its world-leading, energy-efficient supercomputers in a smaller form factor and at a lower price point.

The expanded portfolio includes new HPE Cray EX and HPE Cray XD supercomputers, which are based on HPE's exascale innovation that delivers end-to-end, purpose-built technologies in compute, accelerated compute, interconnect, storage, software, and flexible power and cooling options. The supercomputers provide significant performance and AI-at-scale capabilities to tackle demanding, data-intensive workloads, speed up AI and machine learning initiatives, and accelerate innovation to deliver products and services to market faster.

In a bid to clear inventory of its Radeon RX 6000 series RDNA2 graphics cards in the lead up to its next-generation, AMD is bundling two of the latest AAA game titles. Besides this, the company has significantly lowered prices of its RX 6000 series over several months now. The company is bundling "Dead island 2," and "The Callisto Protocol" with new purchases of Radeon RX 6000 graphics cards.

New purchases of the Radeon RX 6600, RX 6600 XT, RX 6650 XT, RX 6700, RX 6700 XT, RX 6750 XT, RX 6800, RX 6800 XT, RX 6900 XT, and RX 6950 XT, will receive both games. New purchases of the RX 6500 XT and RX 6400 will receive just "Dead Island 2." The bundle is only available in select markets, and through participating retailers. Find where you can grab it, from the source link below.

Supermicro, a Total IT Solution Provider for Cloud, AI/ML, Storage, and 5G/Edge, announces its JumpStart remote access program - Supermicro H13 JumpStart -- for workload testing and application tuning on 4th Gen AMD EPYC processor-based systems. Developers and IT administrators in AI, Deep Learning, Manufacturing, Telco, Storage, and other industries will get immediate access to leading-edge technologies to accelerate their solution deployment on Supermicro's extensive portfolio of upcoming H13 systems. Customers will be able to test compatibility with previous generations of AMD EPYC processor-based systems and optimize their applications to take advantage of DDR5 memory, PCI-E 5.0 storage, networking, accelerators, and CXL 1.1+ peripherals of the 4th Gen AMD EPYC processors.

"Supermicro's 4th Gen AMD EPYC processor JumpStart program is poised to give customers a market advantage over their competitors through quick validation of workload performance to accelerate data center deployments," said Charles Liang, president and CEO, Supermicro. "Supermicro's application-optimized servers incorporate the latest technologies to improve performance per watt, energy efficiency, and reduced TCO."

KLEVV, an emerging memory brand introduced by Essencore, unveils its latest DDR5 standard U-DIMM and SO-DIMM memory running at 5600MT/s. Designed to support both AMD's latest Ryzen 7000 series processors and AM5 platform as well as Intel's 13th Gen Raptor Lake processors and Z790 motherboards, featuring blisteringly fast speed with a highly efficient power to performance ratio.

To cater the growing demand for high-speed computing with a highly versatile product selection, KLEVV introduces a brand-new 5600 MT/s version to its DDR5 standard desktop and laptop memory lineup. Fully compliant with JEDEC standards, the new 5600MT/s DDR5 memory is the latest addition to KLEVV's DDR5 U-DIMM and SO-DIMM lineup with the pre-existing 4800 MT/s memory.

Microsoft formally released the DirectStorage 1.1 API to game developers on Monday, allowing them to take advantage of GPU-accelerated game asset decompression, to help minimize game loading times. DirectStorage establishes a path for GPUs to directly access storage devices on a system. With version 1.1, the API introduces a way by which the PC can use the GPU to decompress game assets. Microsoft is also promoting GDeflate, a new file compression format developed by NVIDIA, which is optimized for highly parallelized decompression techniques, making it suitable for GPUs. NVIDIA, Intel, and AMD, have each responded positively to this development, and rolled out early drivers with DirectStorage 1.1 support, which can be used by game developers or students. The three will add official DirectStorage 1.1 support to their regular driver update channels later.

DOWNLOAD: DirectStorage 1.1 early-support (not official) drivers for NVIDIA GeForce | AMD Radeon | Intel Arc

An alleged leaked company slide details AMD's upcoming 5 nm "Navi 31" GPU powering the next-generation Radeon RX 7900 XTX and RX 7900 XT graphics cards. The slide details the "Navi 31" MCM, with its central graphics compute die (GCD) chiplet that's built on the 5 nm EUV silicon fabrication process, surrounded by six memory cache dies (MCDs), each built on the 6 nm process. The GCD interfaces with the system over a PCI-Express 4.0 x16 host interface. It features the latest-generation multimedia engine with dual-stream encoders; and the new Radiance display engine with DisplayPort 2.1 and HDMI 2.1a support. Custom interconnects tie it with the six MCDs.

Each MCD has 16 MB of Infinity Cache (L3 cache); and a 64-bit GDDR6 memory interface (two 32-bit GDDR6 paths). Six of these add up to the GPU's 384-bit GDDR6 memory interface. In the scheme of things, the GPU has a contiguous and monolithic 384-bit wide memory bus, because every modern GPU uses multiple on-die memory controllers to achieve a wide memory bus. "Navi 31" hence has a total Infinity Cache size of 96 MB—which may be less in comparison to the 128 MB on "Navi 21," but AMD has shored up cache sizes across the GPU. The L0 caches on the compute units is now increased numerically by 240%. The L1 caches by 300%, and the L2 cache shared among the shader engines, by 50%. The RX 7900 XTX is confirmed to use 20 Gbps GDDR6 memory in this slide, for 960 GB/s of memory bandwidth.

Based on details from a PCWorld livestream following AMD's launch of the Radeon RX 7000-series, it was revealed that AMD has designed the Navi 31 GPU to be able to scale as high as 3 GHz. In other words, it appears that AMD has power limited its cards, at least for the SKUs that the company has announced so far. This could be for many reasons, but most likely to try to find a balance between power and performance. The details of the 3 GHz scaling did however not come from AMD directly, but rather from Jarred Walton over at Tom's Hardware. That said, the information was apparently shared with the media by AMD at the event.

In the livestream, it was also confirmed that partner cards will be able to overclock, so expect to see some factory overclocked cards, with higher power draw. This could be why, in part, that ASUS went with a much larger cooler on its TUF Gaming Radeon RX 7900-series cards. As ASUS didn't reveal any clock speeds or TDPs of its two cards, we don't really know what to expect, but we'd be surprised if these cards weren't factory overclocked to some degree when they launch in December.

The long-awaited 3rd of November is here with the latest AMD Radeon RX 7000-series GPUs launch. More good news is that EK, the premium water-cooling gear manufacturer, is ready with EK-Quantum Vector² water blocks for the reference models of the new AMD Radeon RX 7900 XTX GPUs. The new Radeon graphics cards come with a special memory cache dies (MCD) next to the main chip - Graphics Compute Die (GCD). The cooling engine has been modified to cool the MCDs as well, aside from the usual GPU components that are also being cooled, like the VRM, VRAM, Voltage Controllers, and the chip die.

The new Radeon RX 7900 XTX GPUs have GCD that is manufactured in a cutting edge 5 nm process, allowing 54% improvement of performance per watt. While the GPU is efficient, it does still use more power than the previous generation. At 355 W total board power that is packed in a smaller package than ever, with 300 mm² GCD that contains 165% more transistors per mm² than the previous generation. Overall these GPUs feature 58 billion transistors for 61 TFLOPs of performance.

AMD on Thursday launched the Radeon RX 7900 XTX and RX 7900 XT RDNA3 graphics cards. With these, the company claims to have repeated its feat of a 50+ percent performance/Watt gain over the previous-generation, which propelled the RX 6000-series to competitiveness with NVIDIA's fastest RTX 30-series SKUs. AMD's performance claims for the Radeon RX 7900 XTX put the card at anywhere between 50% to 70% faster than the company's current flagship, the RX 6950 XT, when tested at 4K UHD resolution. Digging through these claims, and piecing together relevant information from the Endnotes, HXL was able to draw an extrapolated performance comparison between the RX 7900 XTX, the real-world tested RTX 4090, and previous-generation flagships RTX 3090 Ti and RX 6950 XT.

The graphs put the Radeon RX 7900 XTX menacingly close to the GeForce RTX 4090. In Watch_Dogs Legion, the RTX 4090 is 6.4% faster than the RX 7900 XTX. Cyberpunk 2077 and Metro Exodus see the two cards evenly matched, with a delta under 1%. The RTX 4090 is 4.4% faster with Call of Duty: Modern Warfare II (2022). Accounting for the pinch of salt usually associated with launch-date first-party performance claims; the RX 7900 XTX would end up within 5-10% of the RTX 4090, but pricing changes everything. The RTX 4090 is a $1,599 (MSRP) card, whereas the RX 7900 XTX is $999. Assuming the upcoming RTX 4080 (16 GB) is around 10% slower than the RTX 4090; the main clash for this generation will be between the RTX 4080 and RX 7900 XTX. Even here, AMD gets ahead with pricing, as the RTX 4080 was announced with an MSRP of $1,199 (exactly 20% pricier than the RX 7900 XTX). With the FSR 3.0 Fluid Motion announcement, AMD also blunted NVIDIA's DLSS 3 Frame Generation performance advantage.

Although we're over a month away from any kind of actual availability of AMD's just announced Radeon RX 7900 cards, ASUS has already shown off what is the first custom Radeon RX 7900-series cards. The two cards are the TUF Gaming Radeon RX 7900 XTX and unsurprisingly the TUF Gaming Radeon RX 7900 XT. ASUS has gone for what the company calls a 3.63-slot design and the TUF cards appear to be a fair bit taller than the AMD reference designs. ASUS has gone with larger fans, which requires a bigger cooler shroud and the company claims they provide 13.8 percent more airflow and an eight percent increase in static pressure compared to its last gen—presumably Radeon RX 6900—cards, while maintaining the same noise level.

ASUS claims to have added wider vents on the backplate to help improve airflow and to have increased the total heat dissipation area by 22.8 percent, whatever that actually means, as ASUS didn't show off the rear of its cards. The TUF Gaming Radeon RX 7900 XTX sports three 8-pin power connectors and has a 17+4 power stage design. Unlike AMD's reference cards, the ASUS TUF cards won't have a USB-C port at the rear, as the company has gone for three DP 2.1 ports and one HDMI 2.1 port. ASUS didn't reveal clock speeds and the remaining specs are as announced by AMD.

AMD today announced the Radeon RX 7900 XTX and Radeon RX 7900 XT gaming graphics cards debuting its next-generation RDNA3 graphics architecture. The two new cards come at $999 and $899—basically targeting the $1000 high-end premium price point.Both cards will be available on December 13th, not only the AMD reference design, which is sold through AMD.com, but also custom-design variants from the many board partners on the same day. AIBs are expected to announce their products in the coming weeks.The RX 7900 XTX is priced at USD $999, and the RX 7900 XT is $899, which is a surprisingly small difference of only $100, for a performance difference that will certainly be larger, probably in the 20% range. Both Radeon RX 7900 XTX and RX 7900 XT are using the PCI-Express 4.0 interface, Gen 5 is not supported with this generation. The RX 7900 XTX has a typical board power of 355 W, or about 95 W less than that of the GeForce RTX 4090. The reference-design RX 7900 XTX uses conventional 8-pin PCIe power connectors, as would custom-design cards, when they come out. AMD's board partners will create units with three 8-pin power connectors, for higher out of the box performance and better OC potential. The decision to not use the 16-pin power connector that NVIDIA uses was made "well over a year ago", mostly because of cost, complexity and the fact that these Radeons don't require that much power anyway.

AMD today is expected to launch its next-generation RDNA3 graphics architecture and next-generation Radeon RX 7000-series graphics cards, along with new gaming technologies as part of the company's "together we advance_gaming" event, unfurled by CEO Dr Lisa Su. In this live-blog we track the various announcements made in the event.20:01 UTC: AMD's roadmap is supremely busy:20:02 UTC: "today it's all about gaming"

Here's the first picture of the "Navi 31" GPU at the heart of AMD's fastest next-generation graphics cards. Based on the RDNA3 graphics architecture, this will mark an ambitious attempt by AMD to build the first multi-chip module (MCM) client GPU featuring more than one logic die. MCM GPUs aren't new in the enterprise space with Intel's "Ponte Vecchio," but this would be the first such GPU meant for hardcore gaming graphics products. AMD had made MCM GPUs in the past, but those have been packages with just one logic die, surrounded by memory stacks. "Navi 31" is an MCM of as many as eight logic dies, and no memory stacks (no, those aren't HBM stacks in the picture below).

It's rumored that "Navi 31" features one or two SIMD chiplets dubbed GCDs, featuring the GPU's main number crunching machinery, the RDNA3 compute units. These chiplets are likely built on the most advanced silicon fabrication node, likely TSMC 5 nm EUV, but we'll see. The GDDR6 memory controllers handling the chip's 384-bit wide GDDR6 memory interface, will be located on separate chiplets built on a slightly older node, such as TSMC 6 nm. This is not multi-GPU-a-stick, because both SIMD chiplets have uniform access to the entire 384-bit wide memory bus (which is not 2x 192-bit but 1x 384-bit), besides the other ancillaries. The "Navi 31" MCM are expected to be surrounded by JEDEC-standard 20 Gbps GDDR6 memory chips.

With Core Storm and Core Wind, Alphacool offers new complete water cooling kits that include all components for building a performance-oriented CPU cooling system. With the included mounting hardware, the CPU cooler is compatible with popular mainstream sockets from AMD and Intel. Even AMD's newest AM5 socket can be water-cooled with the Core Wind or Core Storm sets without any difficulties.

The sets are not only aimed at beginners, but also at enthusiasts. The selected components are optimally matched and come from Alphacool's DIY program. Thanks to the included quick-connect coupling, the loop can be easily expanded with additional components such as radiators, GPU coolers or sensors without having to drain or rebuild the water loop.

AMD has dropped the price on most of its Ryzen 5000-series CPUs on its official web store and some models have been discounted by as much as US$250 over the MSRP. However, the most interesting discount here might be the Ryzen 7 5800X3D, which has been discounted from US$449 to US$329, which makes it a pretty good deal for anyone considering getting what is one of the best CPUs out there for gaming.

Unfortunately, AMD's discounted deal appears to have been very popular and as such the Ryzen 7 5800X3D is currently sold out. It's unclear if AMD will add more stock at the same price point, but what is clear is that the Ryzen 7 5800X3D is a popular CPU, especially at what now appears to be the right price point. As mentioned, AMD has discounted its entire lineup of Ryzen 5000-series CPUs, so if you've been on the fence whether to upgrade or not, now might be a good time to do so. That said, most online retailers appear to be offering the same CPUs at the same, or at least almost the same price, making the Ryzen 7 5800X3D the only real bargain to be had, if it comes back in stock. Unfortunately, AMD hasn't discounted its CPUs in other regions, so if you're outside of the US, you're not going to see any special deals if you visit the AMD web store.

AMD (NASDAQ:AMD) today announced revenue for the third quarter of 2022 of $5.6 billion, gross margin of 42%, operating loss of $64 million, net income of $66 million and diluted earnings per share of $0.04. On a non-GAAP(*) basis, gross margin was 50%, operating income was $1.3 billion, net income was $1.1 billion and diluted earnings per share was $0.67.

"Third quarter results came in below our expectations due to the softening PC market and substantial inventory reduction actions across the PC supply chain," said AMD Chair and CEO Dr. Lisa Su. "Despite the challenging macro environment, we grew revenue 29% year-over-year driven by increased sales of our data center, embedded and game console products. We are confident that our leadership product portfolio, strong balance sheet, and ongoing growth opportunities in our data center and embedded businesses position us well to navigate the current market dynamics."

Intel's upcoming Sapphire Rapids processors have faced multiple delays over the past few years. Built on Intel 7 manufacturing process, the CPU is supposed to bring new advances for Intel's clients and significant performance uplifts. However, TrendForce reports that the mass production of Sapphire Rapids processors will be delayed from Q4 of 2022 to the first half of 2023. The reason for this (yet another) delay is that the Sapphire Rapids MCC die is facing a meager yield on Intel 7 manufacturing technology, estimated to be at only 50-60% at the time of writing. Economically, this die-yielding percentage is not profitable for Intel since many dies are turning out to be defective.

This move will stop many OEMs and cloud service providers (CSPs) from rolling out products based on the Sapphire Rapids design and will have to delay it until next year's mass production. On the contrary, AMD is likely to reap the benefits of Intel's delay, and AMD's x86 server market share will jump from 15% in 2022 to 23% in 2023. Given that AMD ships processors with the highest core counts, many companies will opt for AMD's solutions in their data centers. With more companies being concerned by their TCO measures with rising energy costs, favors fall in the hand of single-socket servers.

AMD on Monday issued a statement refuting reports of performance deltas noticed for its Ryzen 7000-series "Zen 4" desktop processors observed between Windows 11 and Windows 10 operating systems when gaming. The company said that while it is investigating the reports, it has not been able to reproduce these performance deltas, and maintains that Ryzen 7000 series should perform consistently between both operating systems. Architecturally, "Zen 4" isn't different from "Zen 3" with the exception of its AVX-512 ISA that even Windows 10 supports. Windows 10 has awareness for "Zen 4" multi-core topology since it isn't any different from Ryzen 5000 "Vermeer." AMD stated that it continues to work with game developers to ensure their titles are optimized for Ryzen processors.The statement from AMD on the matter follows.

Some AMD Ryzen 5 7600X 6-core/12-thread processors could be made with dual-CCD "Raphael" packages, reveals a de-lidding feat by der8auer. This is functionally the same processor as a single-CCD package, all 6 CPU cores are located on just one of the two CCDs; while the other CCD is completely disabled. This wouldn't be the first time that AMD carved out low core-count SKUs using dual-CCD MCMs, we've seen instances of such dual-CCD Ryzen 5 and Ryzen 7 processors from past generations, such as the Ryzen 3000 "Matisse" and Ryzen 5000 "Vermeer." Normally, the Ryzen 5 and Ryzen 7 SKUs are based on a single-CCD package, with the substrate physically lacking a second CCD. The IHS is small and sturdy enough to not need the second CCD as a structural support. This leads us to speculate that the 7600X is being harvested out of dual-CCD packages that have been produced surplus to demand.

Here's what is possibly the very first picture of an AMD Radeon RX 7900 XTX RDNA3 graphics card. AMD engineering samples and prototypes tend to use red color PCBs, which is what this card is. It reveals what could be the final design of the reference cooling solution for the card, and it seems to match the teasers the company put out in its Ryzen 7000-series launch event.

The RX 7900 XTX cooling solution design builds on that of its predecessor. The card itself has 3 slots thick, but slightly longer than the RX 6900 XT. The aluminium fin-stack heatsink is bulkier than the one on the RX 6900 XT cooler, and appears to be bursting out of the vents. It stretches out to the edges of the cooler shroud. The bulge toward the tail-end could be housing the tips of the heat-pipes. The prototype card has two 8-pin PCIe power inputs. There's no backplate, because the PCB has several headers in place for diagnostics and developmental use by AIBs and OEMs.

AMD's next-generation Radeon RX 7000-series graphics cards based on the RDNA3 graphics architecture, are expected to launch in early-December 2022, according to greymon55, a reliable source with AMD leaks. The cards will be unveiled at a media event to be held on November 3, 2022, with market availability following a month after (between 1st to 5th December). The company is expected to take a top-down product-stack release cycle similar to that of NVIDIA, with the release of two of its top SKUs, the Radeon RX 7900 XTX and the RX 7900 XT. Both these cards are based on the 5 nm Navi 31 MCM GPU. This will be AMD's first client-graphics MCM GPU with more than one logic die. The company has a decade of experience with MCMs, but past generations have been one logic die surrounded with on-package HBM. Navi 31 has on-package logic chiplets, but discrete GDDR6 memory, like most other GPUs in the market today. It's rumored that the company is targeting a 100% performance uplift over the previous-generation, which means team-red is on the prowl to compete with NVIDIA's fastest SKUs, including the RTX 4090 and upcoming RTX 4080.

Cougar today introduced the Envision, a high-resolution game capture and streaming box. The Envision supports display passthrough of resolutions as high as 4K at 60 Hz, or 1440p at 144 Hz; which recording video at resolutions of up to 4K @ 30 FPS, or 1440p @ 60 FPS. An interesting feature here is support for AMD FreeSync, so your HDMI 2.0 passthrough can retain support for the technology. Besides the passthrough, the box connects to your PC over a 5 Gbps USB 3.1 Gen 1 connection, with a type-C connector out of the box (which is how it sends video back to software for recording or streaming). Most popular streaming software are supported. The company didn't reveal pricing.