MSI announcing today a new lineup of AMD Ryzen 7000 Series processors that will be compatible with all MSI's X670 and B650 motherboards. The new AMD Ryzen CPU will include the AMD Ryzen 9 7900, Ryzen 7 7700, and the Ryzen 5 7600 which will have a default TDP of 65 W. Even with a lower TDP, these CPUs will up to 12 cores and 24 threads as their respective CPUs and be able to hit their theoretical max boost clock of over 5 GHz. All X670 and B650 motherboards from MSI will be compatible and ready at launch with the newest BIOS version "AGESA COMBO PI-1.0.0.4" update.

MSI has 3 unique features to help users to overclock their systems which are called Performance Switch, PBO Thermal Point, and Config TDP with the new launch of AMD Ryzen 7000 Series processors. Earlier this year, MSI introduced a brand-new function called Performance Switch within the MSI BIOS. Performance Switch provides 3 levels of preset and an advanced option for users to choose from. Then combines both AMD's default PBO "Precision Boost Overdrive" and MSI's OC settings to provide a much higher CPU performance in both single-core and multi-core.

AMD today announced its new Ryzen 7000X3D high-end desktop processors to much fanfare, with availability slated for February 2023, you can read all about them in our older article. In our coverage, we noticed something odd about the cache sizes of the 12-core 7900X3D and 16-core 7950X3D. Whereas the 8-core, single-CCD 7800X3D comes with 104 MB of total cache (L2+L3), which works out to 1 MB L2 cache per core and 96 MB of L3 cache (32 MB on-die + 64 MB stacked 3DV cache); the dual-CCD 7900X3D and 7950X3D was shown with total caches of 140 MB and 144 MB, while they should have been 204 MB or 208 MB, respectively.

In our older article, we explored two possibilities—one that the 3DV cache is available on both CCDs but halved in size for whatever reason; and the second more outlandish possibility that only one of the two CCDs has stacked 3DV cache, while the other is a normal planar CCD with just the on-die 32 MB L3 cache. As it turns out, the latter theory is right! AMD put out high-resolution renders of the dual-CCD 7000X3D processors, where only one of the two CCDs is shown having the L3D (L3 cache die) stacked on top. Even real-world pictures of the older "Zen 3" 3DV cache CCDs from the 5800X3D or EPYC "Milan-X" processors show CCDs with 3DV caches having a distinct appearance with dividing lines between the L3D and the structural substrates over the regions of the CCD that have the CPU cores. In these renders, we see these lines drawn on only one of the two CCDs.

Besides the sensational Ryzen 7000X3D processors taking the fight to Intel's "Raptor Lake," AMD expanded the desktop Ryzen 7000 even downwards, with the introduction of three new 65 W processor SKUs that include boxed stock coolers. These include the Ryzen 5 7600 6-core/12-thread, the Ryzen 7 7700 8-core/16-thread, and the Ryzen 9 7900 12-core/24-thread. There's no 16-core part in this segment. These processors come with TDP values set at just 65 W, and PPT values in the range of 90 W to 120 W, and so their clock speeds and maximum boost speeds are lower compared to the 7000X series, with more aggressive power-management.

The 7600 boosts up to 5.10 GHz, and packs a 65 W-capable Wraith Stealth boxed cooling solution. The 7700 boosts up to 5.30 GHz, and the 7900 up to 5.40 GHz. Both the 7700 and 7900 include a Wraith Prism RGB cooler that can handle thermal loads of up to 140 W. The three chips are priced lower than their 7000X series cousins, with the 7600 going for USD $229, the 7700 at $329, and the 7900 at $429. The three chips are drop-in compatible with existing Socket AM5 motherboards without needing any BIOS update.

AMD today released its first mobile discrete GPUs based on its latest RDNA3 graphics architecture, the Radeon RX 7600M series, and the RX 7600S series. Although based on the latest architecture, AMD decided to built these GPUs on monolithic 6 nm dies, along with many of the power-management features incorporated from Ryzen 6000-series "Rembrandt" processors. The unnamed silicon these GPUs are based on physically features 32 RDNA3 compute units (2,048 stream processors), along with the updated dual instruction-issue rate SIMD components, 2nd generation Ray Accelerators, and AI acceleration. The silicon also features a 128-bit GDDR6 memory interface, supporting speeds of up to 18 Gbps.

The Ryzen 7600M series consists of the top RX 7600M XT with 32 CU, and the slightly lower RX 7600M with 28 CU. Both come with 8 GB of GDDR6 memory across the chip's 128-bit memory interface. The RX 7600M XT uses 18 Gbps memory clocks, while the RX 7600M uses 16 Gbps. The RX 7600M XT has a power band of 75 W to 120 W, while the RX 7600M needs 50 W to 90 W. The RX 7700S and RX 7600S have the same core-configurations as the RX 7600M XT and RX 7600M, respectively, but lower power draw (up to 100 W for the RX 7700S, and up to 75 W for the RX 7600S). Both GPUs feature updated display- and media-acceleration engines, with support for QHD+ displays up to 240 Hz. AMD claims that the RX 7600M XT beats the performance of desktop NVIDIA GeForce RTX 3060 12 GB.

AMD today launched two distinct kinds of mobile processors, the Ryzen 7045 "Dragon Range" serves the 45 W H- and HX-segments of performance and enthusiast notebooks with CPU core counts of up to 16-core/32-thread; while the U-segment, P-segment, and a portion of the H-segment (ranges of 15 W, 28 W, and 35 W), will be led by the Ryzen 7040 "Phoenix Point." Unlike the "Dragon Range" MCM, "Phoenix Point" is a monolithic silicon built entirely on the TSMC 4 nm EUV foundry node, and introduces a wealth of process-level and system-level power-management features.

AMD "Phoenix Point" combines an 8-core/16-thread CPU based on the "Zen 4" microarchitecture, with a powerful iGPU based on the latest RDNA3 graphics architecture, and a feature-packed AI acceleration engine based on the XDNA architecture AMD built after the Xilinx acquisition. The CPU component is a fully-fledged "Zen 4" CCX, with 8 CPU cores featuring 1 MB of dedicated L2 cache per-core, and sharing a large 32 MB L3 cache. This is an increase from the previous generation "Rembrandt" and "Cezanne" dies that had a reduced 16 MB L3 shared among the eight "Zen 3" or "Zen 3+" CPU cores.

AMD today solved the biggest challenge affecting its mobile processor family against Intel—CPU core-counts in the high-end HX-segment, with the introduction of the new Ryzen 7045HX series "Dragon Range" mobile processors. Based on the "Zen 4" microarchitecture, these processors offer core-counts of up to 16-core/32-thread, and target enthusiast gaming notebooks and mobile workstations. The processors debut the new "Dragon Range" multi-chip module (MCM). This is essentially a non-socketed version of the desktop "Raphael" MCM built in a mobile-friendly BGA package with a thin substrate and no IHS, with up to two 5 nm "Zen 4" 8-core CCDs, and a 6 nm cIOD (client I/O die).

The "Dragon Range" MCM uses the same chiplets as desktop "Raphael" Ryzen 7000 processors, and so its I/O is similar. The cIOD puts out a dual-channel (4 sub-channel) DDR5 memory interface, and a PCI-Express 5.0 x16 interface for discrete graphics, along with two PCI-Express 5.0 x4 links for up to two Gen 5 NVMe SSDs. The platform core-logic (chipset) is functionally similar to the desktop AMD B650E. All processor models in the series come with a TDP of 45 W, and a package power tracking (PPT) of "at least" 75 W. Each "Zen 4" CPU core comes with 1 MB of dedicated L2 cache, and each CCD has 32 MB of L3 cache.

We are coming to you live from the 2023 International CES! AMD CEO Dr Lisa Su is kicking things off with her Keynote address, where her company is expected to announce its next generation Ryzen 7000 series "Zen 4" mobile processors, a much broader range of Ryzen 7000 desktop processors, including the fabled X3D processors; and much more!02:29 UTC: The show is about to begin with AMD CEO Dr Lisa Su taking centerstage, as CEA inaugurates its 2023 show.02:38 UTC: "Intelligence needs computing power"

ASUS Republic of Gamers (ROG) today announced a wide range of exclusive performance-focused products during the For Those Who Dare: Maxed Out virtual launch event for CES 2023. During the event, ROG showcased multiple product premieres, including impressively fast and stunning displays, powerhouse laptops with latest-gen processors and graphics, faster-than-ever routers, and a wide variety of peripherals to complete the most maxed-out gaming setups. This wide array of innovations includes the ROG Swift Pro PG248QP and ROG Swift OLED PG27AQDM gaming displays; ROG Azoth gaming keyboard; ROG Raikiri Pro PC controller; ROG Destrier Ergo gaming chair; ROG G22CH gaming desktop; and much more.

This year more than ever, ROG is evolving its gaming lineup to drive performance beyond limits. New additions presented during the event include Strix Scar and Strix G series gaming laptops, in 16-, 17-, and 18-inch versions. These gaming powerhouses host up to AMD Ryzen 9 Zen 4 and 13th Gen Intel Core processors, liberating more power than ever before for maxed-out performance, and NVIDIA GeForce RTX 40 Series Laptop GPUs, working in concert with a MUX Switch and NVIDIA Advanced Optimus to deliver never-before-seen performance on a laptop.

Alienware and Dell today reveal six new gaming laptops including: Alienware m18 and m16, Alienware x16 and x14, and Dell G16 and G15. And these aren't small updates either - the roster debuts updated form factors and materials, best-in-class performance upgrades, design and comfort enhancements, as well as an overhauled Alienware Command Center.

As what defines preeminent gaming experiences constantly evolves, Alienware and Dell continue to set itself apart with meaningful high-impact innovation that meets the changing needs of gamers. Whether you're a competitive or hobby gamer, if freedom without compromise is what you value most, look no further than our intrepid new fleet of high-performance laptops.

Today, Alienware crushes new barriers with the introduction of the world's fastest refresh rate of 500Hzi on a Fast IPS Gaming Monitor and the evolved Aurora R15 gaming desktop with AMD technology. These industry-leading display and desktop advancements further Alienware's competitive edge, underscoring our longtime legacy as both technology pioneers and gamers at heart. Following last year's incredible portfolio upgrades, we're full throttle into 2023 with no signs of slowing down.

Introducing the monitor with the world's fastest refresh rate of 500Hzi, the Alienware 500 Hz Gaming Monitor (AW2524H), a CES 2023 Innovation Award and Best of Innovation winner, delivers the world-class speed today's champions demand. Coming in at a 24.5-inch full high-definition (FHD) resolution with a supersonic refresh rate of 500 Hz overclocked (480 Hz native) on a Fast IPS panel, this elite display offers incredible frame rates to deliver stunning motion clarity in fast-paced games and help gamers clinch victory.

Acer announced two powerful Predator Helios gaming laptops and a pair of Predator gaming monitors. The laptops feature an all-new design with 16-inch and 18-inch display sizes, the latest 13th Gen Intel Core mobile processors and NVIDIA GeForce RTX 40 Series GPUs, making them Acer's most powerful gaming laptops to date. The Predator X45 showcases a massive 800R curved monitor and has earned a CES Innovation Award in the "Computer Peripherals & Accessories" category. Along with the Predator X27U, both monitors include OLED technology with fast 240 Hz refresh rates.

Predator Helios 16, Predator Helios 18 Laptops
The all-new Predator Helios 16 (PH16-71) and Predator Helios 18 (PH18-71) bring the latest and greatest tech to Acer's most powerful gaming laptop series. Sporting a completely new design and upgraded thermals, they both offer models that include 13th Gen Intel Core i9 or i7 HX processors paired with up to NVIDIA GeForce RTX 4080 Laptop GPU (MGP up to 165 W) and a plethora of must-have top-of-the-line gaming features.

AMD's latest GPUs have been reported to be experiencing overheating issues, with many users claiming that the vapor chamber cooler works better in a vertical rather than a horizontal position. Regardless of orientation, vapor chamber coolers should equal roughly the same heat dissipation performance and move the heat away from the source; however, testing showed that some reference AMD Radeon RX 7900 XTX GPUs feature defect coolers. According to the testing conducted by Roman "der8auer" Hartung, AMD's Radeon RX 7900 XTX RDNA3 GPUs are experiencing problems with overheating caused by a faulty vapor chamber design.

What der8auer found is that these coolers could have a defect in the manufacturing process, where the liquid inside the vapor chamber faces problems in circulation after condensation. It could relate to manufacturing issues of the cooler itself, with an inadequate amount of fluid or insufficient pressure inside the chamber. For more in-depth testing and performance benchmarks, see the video below. It is important to note that we didn't see other reports that replicate this behavior, so always take these reports with a dash of salt.

Just over a month ago, news broke that NVIDIA is planning to move its logistics center from Hong Kong to Taiwan and it now looks like AMD is getting ready to follow suit. The news is coming via Taiwan's United Daily News (UDN) and the paper claims that AMD will be setting up its logistics center in the Farglory free trade zone area in the Dayuan district of Taoyuan, which is next to Taiwan's main international airport. Currently companies like ASML and Asus operate inside the free trade zone and Farglory is currently in the last phase of an expansion of the free trade zone, which should be finalised sometime early in 2023. As such, there should be plenty of space for both NVIDIA and AMD to set up their logistics centers there.

The move for AMD doesn't seem to make as much sense as that of NVIDIA, as AMD's main graphics card partners, which should be Sapphire and XFX (Pine Group), are Hong Kong based companies. That said, AMD still has PowerColor, ASRock, Asus, Gigabyte and MSI in Taiwan, but only PowerColor is an exclusive AMD partner. This does of course not take motherboards or servers into account, where its Taiwanese partners are key. On the other hand, just as NVIDIA, AMD produces its GPUs at TSMC, so for products that doesn't end up in the PRC, it would make more sense to have them go straight to a logistics center in Taiwan, rather than having to ship them out to Hong Kong and then back to Taiwan again. According to UDN it's apparently also cheaper for AMD to shop goods directly from Taiwan to the PRC, as it's apparently quite costly to ship via Hong Kong. Another reason is of course the ongoing trade war between the US and the PRC, which could lead to future issues for both AMD and NVIDIA. Hong Kong has also slowly lost its importance as a key center in the electronics business, with Taiwan and Singapore having become more important hubs, according to UDN.

EK, the premium liquid cooling gear manufacturer, is releasing yet another unique pump-reservoir-water block combo. This time for AMD AM5 Socket, Ryzen 7000-series CPUs, and AM5 socket-based motherboards. It features the latest socket-specific EK-Quantum Velocity² cooling engine, while the CPU water block has an integrated DDC 4.2 PWM pump that is cooled by the metal part of the water block acting as a heatsink. The combo is the perfect companion for ITX (SFF) builds where space for a dedicated pump and reservoir is an issue. This product effectively combines four different products into a single small enclosure for ultimate space-saving.

The product combines a Velocity² CPU water block, a genuine DDC 4.2 PWM pump with a reservoir, and a DDC heatsink. All this is contained in an assembly significantly smaller than the sum of its parts. A total of four products in a footprint of a hefty CPU water block that fits perfectly. EK-Quantum Velocity² series CPU water blocks embed the next-generation cooling engine. They use a specific combination of mounting pressure and coldplate geometry tailored for the IHS and chiplet layout of AMD AM5 socket processors. Low hydraulic flow restriction enables these products to be used in setups with weaker water pumps or lower pump speeds for added silent operation while still being able to easily achieve top performance. The lathe-turned coldplate is made with precision to cover the IHS effectively and put pressure on the die area.

A few months ago, AMD has launched its highly anticipated Ryzen 7000 series of processors based on Zen 4 architecture. However, the company only launched the "X" SKUs (example being 7900X) for now, while the remaining ones are awaiting a launch date. Today, we have information from VideoCardz that confirm AMD's new launch on January 10th, when team red plans to update its remaining processor family with Ryzen 7000 series non-X SKUs. There will be three initial models to choose from Ryzen 9 7900 (12C/24T), Ryzen 7 7700 (8C/16T), and Ryzen 5 7600 (6C/12T). These SKUs follow the traditional Zen 4 path; however, the only distinction from their "X" counterparts is the reduced TDP to 65 Watts, down from up to 170 Watt TDP in some of those models.

A leaked slide from AMD's product presentation regarding these SKUs is a comparison between AMD's own Ryzen 9 5900X and Ryzen 9 7900, where the Zen 4 variant successfully beat the older SKU by a significant percentage. Pricing and further details are listed on the slides below.

BIOSTAR, a leading manufacturer of motherboards, graphics cards, and storage devices today, is delighted to announce the brand new B650M-SILVER motherboard. Designed based on the AMD M5 socket, the B650M-SILVER motherboard is fully stacked to enable the latest Ryzen 7000 series processors. Leveraging the latest DDR5 memory technology, it performs exceptionally well at any given task, powered by advanced design elements like support for both AMD EXPO and Intel XMP RAM modules.

The B650M-SILVER, despite its Micro-ATX form factor, offers top-shelf features like a PCI-E Gen4 x16 slot with iron protection. The SILVER series motherboard combines 14 phase (10+2+2) power design with a 90 A power stage VRM solution to match today's power-hungry hardware, thanks to the company's signature DIGITAL PWM and 90 A Dr.MOS technologies.

TechPowerUp today released the latest version of TechPowerUp GPU-Z, the popular PC graphics information, monitoring, and diagnostics utility. Version 2.52.0 adds support for AMD Radeon RX 7900 XTX, RX 7900 XT, RX 6300 OEM; NVIDIA GeForce RTX 4070 Ti, and a few rare "Ampere" based GPUs in circulation these days, including the RTX 3080 Ti 20 GB, RTX 3070 Ti based on GA102 silicon, RTX 3050 based on GA107, and the PCIe AIC version of the A800 80 GB accelerator. Detection is improved for the Xe LP-based iGPU of Intel Core "Raptor Lake" processors. NVIDIA GPUs with ECC memory now have ECC status reported in the Advanced panel. On GPUs where the boost frequency can't be read, the base frequency will be used to calculate fillrates. Clock speed detection for Intel Arc "Alchemist" GPUs has been improved. Vendor detection has been added for several new graphics card brands such as Corsair (gaming notebooks), Maxsun, and Wingtech.

DOWNLOAD: TechPowerUp GPU-Z v2.52.0

AMD released the Adrenalin 22.12.2 WHQL drivers exclusively for the recently launched Radeon RX 7900 XTX and RX 7900 XT graphics cards. These drivers do not support any other product series (which is why TechPowerUp isn't hosting them in our Downloads section). Compared to the previous 22.11.2 WHQL drivers from mid-December (which lack RX 7900 series support), the 22.12.2 WHQL doesn't pack any game-specific optimizations, but corrects a handful of issues.

To begin with, AMD has improved the power-consumption of the RX 7900 series cards during hardware-accelerated video playback. Display corruption observed for Virtual Super Resolution (VSR) with multi-display configurations, has been fixed. A system crash observed when changing display modes in machines with 4 display, has been fixed. An application crash or driver timeout observed with Marvel's Spider-Man: Miles Morales after enabling ray tracing, has been fixed. Grab the driver from the link below.

DOWNLOAD: AMD Software Adrenalin 22.12.2 WHQL (for RX 7900 series only)

AMD won't release its Ryzen Threadripper 7000WX "Storm Peak" workstation processors any time before September 2023, suggests a reliable source with AMD leaks. The push to Q3 probably has to do with giving AMD enough "Zen 4" CCD volumes to ship high-margin EPYC "Genoa" server processors first, before the company can turn its attention to the HEDT and workstation markets.

While all indications are that AMD give the "Zen 4" Threadripper a similar treatment this generation as it did with the "Zen 3," by confining it to the workstation segment with only Threadripper 7000WX SKUs that could be OEM-exclusives before crawling their way to the retail market; the source has an interesting theory, that the company could even target the client HEDT market with these chips. The company will also adequately segment the Threadripper 7000WX SKUs apart from EPYC "Genoa" processors.

Samsung Electronics Co., Ltd., the world leader in advanced memory technology, today announced the development of its 16-gigabit (Gb) DDR5 DRAM built using the industry's first 12-nanometer (nm)-class process technology, as well as the completion of product evaluation for compatibility with AMD. "Our 12 nm-range DRAM will be a key enabler in driving market-wide adoption of DDR5 DRAM," said Jooyoung Lee, Executive Vice President of DRAM Product & Technology at Samsung Electronics. "With exceptional performance and power efficiency, we expect our new DRAM to serve as the foundation for more sustainable operations in areas such as next-generation computing, data centers and AI-driven systems."

"Innovation often requires close collaboration with industry partners to push the bounds of technology," said Joe Macri, Senior VP, Corporate Fellow and Client, Compute and Graphics CTO at AMD. "We are thrilled to once again collaborate with Samsung, particularly on introducing DDR5 memory products that are optimized and validated on "Zen" platforms."

Ahead of CES, Lenovo unveiled its latest generation of consumer devices loaded with standout features and enhancements designed to help people connect with their passions and achieve their daily goals. With five new performance-driving and portable IdeaPad laptops, a sleek and compact IdeaCentre desktop, and a 9-inch Lenovo tablet, these devices are designed for all the spaces and places in line with the on-the-go lifestyle of today's consumer. Whether working, studying, creating, or just catching up with friends out of town, these new products offer speed, versatility, and convenience to suit their needs wherever they are.

"As consumers continue to seek out the most effective ways of working and studying in a hybrid world where versatility and convenience are paramount, Lenovo's IdeaPad products continue to provide reliability and performance at incredible value," says Jun OuYang, Vice President of the Consumer Segment, Intelligent Devices Group, Lenovo. "This latest generation of products come with a range of striking new features and enhancements that significantly improve the user experience while still maintaining its reputation as an affordable product."

The first EK-Quantum Vector² RX 7900 XTX water block for an AIB partner Radeon RX 7000 Series GPU has just been released. EK, the premium water cooling gear manufacturer, is introducing its water block for the new PowerColor Red Devil AMD Radeon RX 7900 XTX. The Red Devil conquers by relentlessly pushing its power to the limit making the EK-Quantum Vector² water block an ideal match for achieving the best performance and minimum noise. Still, it's recommended you refer to the EK Cooling Configurator for a precise compatibility match.

This AMD Radeon Edition Vector² water block effortlessly solves the issue of excessive heat generation during high load on the GPU. This liquid cooling solution cools the graphics compute die, voltage regulation module, voltage controllers, VRAM, and MCDs on the Red Devil Radeon RX 7900 XTX graphics card. The new Radeon RX 7900 XTX GPUs have GCD manufactured in a cutting-edge 5 nm process, allowing a 54% improvement in performance per watt. While the GPU is efficient, it still uses more power than the previous generation. Its 300 mm² GCD contains 165% more transistors per mm² than the previous generation. This means these GPUs feature 58 billion transistors for 61 TFLOPs of performance—all the more reason to have them water-cooled.

GIGABYTE, the world's leading computer brand, is known for its stylish and high-performing motherboards, graphics cards, gaming monitors, and more. The award-winning products are praised by worldwide consumers for their class-leading build quality and performance. What makes GIGABYTE products even more impressive is their friendly designs based on a thorough understanding of user needs and expectations. These ingenious designs are primed to make the products easier to assemble and upgrade for a much-enhanced user experience.

GIGABYTE's Intel-based Z790 series and AMD AM5-based X670, B650 gaming motherboards are equipped with tech that makes PC building and upgrades as easy as possible. The DIY-friendly PCIe EZ-Latch design allows users to easily detach the graphics card from the PCIe slot with a quick-release mechanism; the M.2 EZ-Latch makes installing M.2 SSDs effortless thanks to the screwless design. These latest-gen motherboards also support Intel XMP and AMD EXPO overclocking memory modules for maximum compatibility, and GIGABYTE BIOS comes packaged with pre-installed profiles to help users get greater performance with ease.

MSI was conspicuous with its lack of Radeon RX 7900 series graphics cards at launch, with neither product announcements, nor even placeholder product pages on its website as of this writing. Rumors started to fly on social media that the company is skipping the RX 7900 series, and that all is not well between MSI and AMD Radeon group. MSI last week laid many of these rumors to rest, with its MSI Gaming Twitter handle quote-tweeting an AMD Radeon handle with the message "Available Soon."

Andreas Schilling of HardwareLuxx.de added more clarity on the issue with some first-hand info: although MSI skipped the December 12/13 launch dates, the company is preparing to release some custom-design RX 7900 series cards, and will present them in Q1-2023. The company is however skipping the launch of reference-design MBA (made by AMD) cards under its own brand—something most other AMD add-in board (AIB) partners did release on December 12. Although AMD directly sells reference-design cards, it also sells them through its AIB partners, by allowing them to use their own brand identity, custom packaging, inclusions, and product warranty specific to the brand.

Ahead of their market debut early January, we got confirmation of the specifications of the three upcoming AMD Ryzen 7000 series non-X processor SKUs. There will indeed only be three new SKUs, the 6-core/12-thread Ryzen 5 7600, the 8-core/16-thread Ryzen 7 7700, and the 12-core/24-thread Ryzen 9 7900; and no 16-core part. All three SKUs have their TDP rated at 65 W, which means that their PIB (processor in box) retail packages will include a stock cooling solution. The 7600 comes with a Wraith Stealth cooler that's capable of handling thermal loads of 65 W TDP processors at stock speeds; while the 7700 and 7900 will include a feature-packed Wraith Prism RGB cooler that's designed for 140 W TDP processors. Since Socket AM5 has cooler compatibility with AM4, AMD could simply be reusing the same coolers it packed with past-generation Ryzen processors.

The Ryzen 5 7600 comes with an MSRP of USD $229, clock speeds of up to 5.10 GHz boost, and targets the likes of the Intel Core i5-13600 or i5-12600. The $329 MSRP Ryzen 7 7700 ticks at speeds of up to 5.30 GHz boost, and is designed to compete with the Core i7-13700 or i7-12700. The Ryzen 9 7900 has an interesting price tag of $429 (MSRP), ticks at speeds of up to 5.40 GHz boost, and purportedly competes against the Core i9-13900 (non-K) and i9-12900. The three chips should be drop-in compatible with Socket AM5 motherboards being sold right now, likely with no need for a BIOS update. Although launch of these three SKUs in January is certain, the company might use the 2023 International CES keynote address by its CEO Dr Lisa Su to either tease or announce the Ryzen 7000X3D processors featuring 3D Vertical Cache memory, which is known to boost gaming performance.