AMD's Ryzen Threadripper Pro 7000 "Storm Peak" CPU series has not received any form of official announcement—we have relied solely on leaks to find out nitty-gritty details about Team Red's Zen 4-based follow-up to the Ryzen Threadripper Pro 5000 lineup. Pre-release samples have been landing online at an increased rate—courtesy of benchmark suite database leaks—with various news sites theorizing that AMD is preparing for an autumn launch window. This prediction is seemingly coming into focus, according to the latest information from insiders at AMD and connected supply chains.

Wccftech reckons that an October 19 launch day has been pencilled in: "Our sources have told us that AMD is all set to unveil its Ryzen Threadripper PRO 7000 CPU family on the 19th of October. This marks more than 1.5 years since the introduction of the Zen 3-based Ryzen Threadripper Pro 5000 CPUs. The new processors will once again be primarily positioned in the premium workstation segment with limited DIY availability. OEMs will be offering their pre-built designs along with DIY TRX50 motherboards from various manufacturers."

Today, Google announced its next generation of Chromebook devices, called the Chromebook Plus, said to improve upon the legacy set by Chromebooks over a decade ago. Starting at an enticing price point of $399, this new breed of Chromebooks integrates powerful AI capabilities and a range of built-in Google apps. Notably, it features tools like the Google Photos Magic Eraser and web-based Adobe Photoshop, positioning itself as a dynamic tool for productivity and creative exploration. In collaboration with hardware manufacturers such as Acer, ASUS, HP, and Lenovo, Google is launching a lineup of eight Chromebook Plus devices on the launch date, with more possibly coming in the future.

Each model boasts improved hardware configurations over the regular Chromebook, including processors like the Intel Core i3 12th Gen or the AMD Ryzen 3 7000 series, a minimum of 8 GB RAM, and 128 GB storage. Users are also in for a visual treat with a 1080p IPS display, ensuring crisp visuals for entertainment and work. And for the modern remote workforce, video conferencing gets a substantial upgrade. Every Chromebook Plus comes equipped with a 1080p camera and utilizes AI enhancements to elevate video call clarity, with compatibility spanning various platforms, including Google Meet, Zoom, and Microsoft Teams. Set to be available from October 8, 2023, in the US and October 9 in Canada and Europe, the Chromebook Plus is positioning itself as the go-to device for many users. On the other hand, the AI features are slated for arrival in 2024, when companies ensure their software is compatible.Below you can see the upcoming models.

AMD Radeon RX 7900 series enthusiast-segment graphics cards now start at a street price of $719. A PowerColor Radeon RX 7900 XT Hellhound custom-design graphics card is listed on Newegg for $749, with a coupon code that shaves a further $30 off, bringing it down to this new low price. At this price, the RX 7900 XT offers significantly higher performance per Dollar than the GeForce RTX 4070 Ti, which starts at $799, and is tested to offer around 5% lower performance than the RX 7900 XT.

Meanwhile, prices of AMD's flagship graphics card, the RX 7900 XTX, has been on a downward slope, too, with a PowerColor RX 7900 XTX Red Devil premium custom-design card being listed for as low as $889 with a coupon discount. This would space the RX 7900 XTX at least $200 apart from the cheapest GeForce RTX 4080, which is starting at $1,089.

Kevin Scott, Microsoft's chief technology officer was interviewed at last week's Code Conference (organized by Vox Media), where he was happy to reveal that his company is having an easier time acquiring Team Green's popular HPC GPU hardware: "Demand was far exceeding the supply of GPU capacity that the whole ecosystem could produce...That is resolving. It's still tight, but it's getting better every week, and we've got more good news ahead of us than bad on that front, which is great." Microsoft is investing heavily into its internal artificial intelligence endeavors and external interests alike (they are a main backer of OpenAI's ChatGPT system). Having a healthy budget certainly helps, but Scott has previously described his experience in this field as "a terrible job" spanning five years of misery (as of May 2023).

Last week's follow-up conversation on-stage in Dana Point, California revealed that conditions have improved since springtime: "It's easier now than when we talked last time." The improved supply circumstances have made his "job of adjudicating these very gnarly conflicts less terrible." Industry reports have Microsoft secretly working on proprietary AI chips with an unnamed partner—CNBC pinpointed Arm as a likely candidate—Scott acknowledged that something is happening behind-the-scenes but it will not be ready imminently: "I'm not confirming anything, but I will say that we've got a pretty substantial silicon investment that we've had for years...And the thing that we will do is we'll make sure that we're making the best choices for how we build these systems, using whatever options we have available. And the best option that's been available during the last handful of years has been NVIDIA."

Acer today launched the company's first Chromebook Plus laptops, the Acer Chromebook Plus 515 and Acer Chromebook Plus 514, debuting with Google's Chromebook Plus initiative that offers a new tier of Chromebook performance, emphasizing better hardware designs with upgraded displays and cameras, and paired with new productivity, creativity, and multimedia capabilities.

The Acer Chromebook Plus 515 and Acer Chromebook Plus 514 both have the hardware and technology features customers need to stay productive, entertained and connected. These new models are powered by modern high-performance processors, and high-resolution IPS displays and 1080p crystal clear cameras flanked by narrow bezels to keep the focus on the vibrant visuals.

"Strix Point" is the codename for AMD's next-generation mobile processor succeeding the current Ryzen 7040 series "Phoenix." More details of the processor emerged thanks to "All The Watts!!" on Twitter. The CPU of "Strix Point" will be heterogenous, in that it will feature two different kinds of CPU cores, but with essentially the same ISA and IPC. It is rumored that the processor will feature 4 "Zen 5" CPU cores, and 8 "Zen 5c" cores.

Both core types feature an identical IPC, but the "Zen 5" cores can hold onto higher boost frequencies, and have a wider frequency band, than the "Zen 5c" cores. From what we can deduce from the current "Zen 4c" cores, "Zen 5c" cores aren't strictly "efficiency" cores, as they still offer the full breadth of core ISA as "Zen 5," including SMT. In its maximum configuration, "Strix Point" will hence be a 12-core/24-thread processor. The two CPU core types sit in two different CCX (CPU core complexes), the "Zen 5" CCX has 4 cores sharing a 16 MB L3 cache, while the "Zen 5c" CCX shares a 16 MB L3 cache among 8 cores. AMD will probably use a software-based solution to ensure the right kind of workload from the OS is processed by the right kind of CPU core.

MINISFORUM today is launching their BD770i ITX "Mobile on Desktop" motherboard which comes equipped with AMD's 8-core "Zen 4" Ryzen 7 7745HX. Upon the CPU sits a custom "integrated advanced cooling system" which partially exhausts out of the I/O shield and supports installation of a 120 mm fan, which is not included. The board features dual actively cooled M.2 2280 PCI-E Gen 5 SSDs plus M.2 2230 E-Key for WLAN cards, 2.5G Ethernet, a pair of USB 2.0 ports, another pair of USB 3.2 Gen 1 ports, and a USB 3.2 Gen 2 Type-C port that also supports display out as DisplayPort 1.4. The BD770i also features dual SODIMM slots for up to DDR5-5200 DRAM, as well as a full length PCI-E Gen 5 x16 for dedicated graphics cards. A small detail we noticed in the product images is the silhouette of two more M.2 ports on the rear of the board that aren't in the specifications. On the product page there are mentions of a higher-end BD790i with the Ryzen 9 7945HX which does not seem to be available yet, so perhaps this higher end board will feature these extra ports.

Despite the AMD Ryzen 7 7745HX supporting overclocking features such as an unlocked multiplier, AMD EXPO, and Precision Boost Overdrive; MINISFORUM has chosen to not support those features on the BD770i. Perhaps the upcoming BD790i will include OC support and features, we'll have to wait and see. Pricing for the BD770i is currently set at $399 USD for early orders, however the price is expected to increase to $499 USD after the launch period promotion expires.

AMD has released the AMD Software Adrenalin Edition Preview Driver which add support for AMD Fluid Motion Frames (AFMF) technical preview which is available in several games and only works on AMD Radeon RX 7000 series graphics cards. AMD Fluid Motion Frames (AFMF) will be available as a part of FidelityFX Super Resolution 3.0 (FSR3), which is expected to launch tomorrow and supported in Forspoken and Immortals of Aveum games.

With the new AMD Software Adrenalin Edition Preview Driver, AMD enables Frame Generation on a driver level as "Fluid Motion Frame" option, which can be enabled via HYPR-X, or individually for each game by using the Global Graphics Settings page. AMD has an extensive list of over 20 titles, including Star Wars Jedi: Survivor, Starfield, Hogwarts Legacy, The Last of Us Part 1, Far Cry 6, Shadow Of The Tomb Raider, The Witcher 3: Wild Hunt, and others. AMD also notes that AFMF can also be manually for any title such as Cyberpunk 2077 using the per-app settings within AMD Software: Adrenalin Edition.

DOWNLOAD: AMD Software: Adrenalin Edition Preview Driver for AMD Fluid Motion Frames

A couple of slides from AMD's internal presentation were leaked to the web by Moore's Law is Dead, referencing what's allegedly the next-generation "Zen 5" microarchitecture. Internally, the performance variant of the "Zen 5" core is referred to as "Nirvana," and the CCD chiplet (CPU core die) based on "Nirvana" cores, is codenamed "Eldora." These CCDs will make up either the company's Ryzen "Granite Ridge" desktop processors, or EPYC "Turin" server processors. The cores themselves could also be part of the company's next-generation mobile processors, as part of heterogenous CCXs (CPU core complex), next to "Zen 5c" low-power cores.

In broad strokes, AMD describes "Zen 5" as introducing a 10% to 15% IPC increase over the current "Zen 4." The core will feature a larger 48 KB L1D cache, compared to the current 32 KB. As for the core itself, it features an 8-wide dispatch from the micro-op queue, compared to the 6-wide dispatch of "Zen 4." The integer execution stage gets 6 ALUs, compared to the current 4. The floating point unit gets FP-512 capabilities. Perhaps the biggest announcement is that AMD has increased the maximum cores per CCX from 8 to 16. At this point we don't know if it means that "Eldora" CCD will have 16 cores, or whether it means that the cloud-specific CCD with 16 "Zen 5c" cores will have 16 cores within a single CCX, rather than spread across two CCXs with smaller L3 caches. AMD is leveraging the TSMC 4 nm EUV node for "Eldora," the mobile processor based on "Zen 5" could be based on the more advanced TSMC 3 nm EUV node.

Square Enix has released Forspoken Version Update Patch 1.22, making it the first game to officially support the AMD FidelityFX Super Resolution 3. In addition to FSR 3 support, the new Forspoken Version Update Patch 1.22 also adds the Native AA quality mode options and fixes some issues with save data between the main game and DLC.

According to the release notes, the update will not come to the PlayStation 5 version, and the Microsoft Store version will be updated as soon as the patch is approved. Surprisingly, Square Enix describes the AMD FidelityFX Super Resolution 3 as technology that "combines temporal upscaling and frame generation to deliver significantly higher performance," and says that the frame generation is enabled separately from upscaling and is available when using AMD Radeon RX 5000 Series, NVIDIA GeForce RTX 20 Series, and Intel Arc 7 Series or newer GPUs. It is left to be seen if these will indeed work on Intel Arc series GPUs, as it was never officially confirmed by AMD.

AMD has confirmed that FidelityFX Super Resolution 3 (FSR 3) will launch tomorrow, September 29, with Forspoken and Immortals of Aveum listed as first game titles to support it. The news was announced by Frank Azor over at Twitter, with the promise of more titles coming soon. In case you missed it back when it was announced in August, the FidelityFX Super Resolution 3 Fluid Motion (FSR 3 Fluid Motion) is AMD's direct answer to NVIDIA's DLSS 3 Frame Generation. As promised back then, the FSR 3 will work on the latest AMD Radeon RX 7000 series and previous-generation Radeon RX 6000 series graphics cards based on the RDNA3 architecture, as well as NVIDIA GeForce RTX 40-, RTX 30-, and RTX 20-series graphics cards.

As explained back then, AMD FSR 3 Fluid Motion is a frame-rate doubling technology that generates alternate frames by estimating an intermediate between two frames rendered by the GPU. While Frank did not specifically mention any game titles, back in August, AMD confirmed that Forsaken and Immortals of Aveum will be the first two titles with FSR 3 Fluid Motion support.

Earlier this year, we introduced the world to the ROG Ally: a Windows gaming handheld that can play all your games, anywhere you go. With its bright and colorful 1080p 120 Hz screen, ergonomic form factor, and incredible AMD Ryzen Z1 Extreme APU, the ROG Ally is a AAA monster, taking modern handhelds to a new level. Now, we're happy to announce that the Ryzen Z1 variant of the ROG Ally is also available for purchase, with all the same features and a more affordable price tag.

The AMD Ryzen Z1 comes is built on the same Zen 4 architecture as the Ryzen Z1 Extreme, with the latest RDNA 3 graphics engine and full support for AMD's incredible upscaling technologies like FidelityFX Super Resolution (FSR) and Radeon Super Resolution (RSR). With six cores and twelve threads alongside four graphics compute units, the Ryzen Z1 has the same robust power delivery and ROG Intelligent Cooling improvements that make the Z1 Extreme so potent, at a more affordable price.

AMD today released the latest version of the AMD Software Adrenalin drivers. Version 23.9.3 WHQL comes with optimization for "Cyberpunk 2077: Phantom Liberty," and "PAYDAY 3." The drivers also add optimization for generative AI tools MeanVarianceNormalization (MVN) and Stable Diffusion variants. With this release, the company didn't include any fixes, but identified a handful new issues.

Adrenalin 23.9.3 WHQL, along with its preceding 23.9.2 WHQL, see AMD release separate installers for RDNA-only and RDNA + pre-RDNA GPUs, both with the same release notes. The RDNA release supports only Radeon RX 5000 series, RX 6000 series, and RX 7000 series; while the RDNA + pre-RDNA combo release is meant for Radeon RX Vega series, RX 500 series, and RX 400 series (Polaris) on top of the RX 5000 (or later) GPUs. The RDNA-only release is 640 MB in size, while the RDNA + pre-RDNA combo package is 1.2 GB.

DOWNLOAD: AMD Software Adrenalin 23.9.3 WHQL (RX 5000 and later) | AMD Software Adrenalin 23.9.3 (RX Vega and older)

TSMC today announced the new 3Dblox 2.0 open standard and major achievements of its Open Innovation Platform (OIP) 3DFabric Alliance at the TSMC 2023 OIP Ecosystem Forum. The 3Dblox 2.0 features early 3D IC design capability that aims to significantly boost design efficiency, while the 3DFabric Alliance continues to drive memory, substrate, testing, manufacturing, and packaging integration. TSMC continues to push the envelope of 3D IC innovation, making its comprehensive 3D silicon stacking and advanced packaging technologies more accessible to every customer.

"As the industry shifted toward embracing 3D IC and system-level innovation, the need for industry-wide collaboration has become even more essential than it was when we launched OIP 15 years ago," said Dr. L.C. Lu, TSMC fellow and vice president of Design and Technology Platform. "As our sustained collaboration with OIP ecosystem partners continues to flourish, we're enabling customers to harness TSMC's leading process and 3DFabric technologies to reach an entirely new level of performance and power efficiency for the next-generation artificial intelligence (AI), high-performance computing (HPC), and mobile applications."

AMD today announced the AMD Alveo UL3524 accelerator card, a new fintech accelerator designed for ultra-low latency electronic trading applications. Already deployed by leading trading firms and enabling multiple solution partner offerings, the Alveo UL3524 provides proprietary traders, market makers, hedge funds, brokerages, and exchanges with a state-of-the-art FPGA platform for electronic trading at nanosecond (ns) speed.

The Alveo UL3524 delivers a 7X latency improvement over prior generation FPGA technology, achieving less than 3ns FPGA transceiver latency for accelerated trade execution. Powered by a custom 16 nm Virtex UltraScale + FPGA, it features a novel transceiver architecture with hardened, optimized network connectivity cores to achieve breakthrough performance. By combining hardware flexibility with ultra-low latency networking on a production platform, the Alveo UL3524 enables faster design closure and deployment compared to traditional FPGA alternatives.

GIGABYTE Technology, Giga Computing, a subsidiary of GIGABYTE and an industry leader in high-performance servers, server motherboards, and workstations, today announced ahead of exhibiting at the OCP Global Summit new OCP ORv3 based solutions, including ones designed for GPU centric workloads in immersion cooling. The new GIGABYTE products include a 2OU node tray, TO25-BT0, and compute nodes: TO25-S10, TO25-S11, TO25-S12, TO25-Z10, TO25-Z11, and TO25-Z12. For immersion cooling server deployments with ORv3 specifications are the new GPU servers: TO15-S40, TO15-S41, and TO15-Z40.

Our commitment to support Open Compute Project's designs dates back almost a decade starting with our OCP v1.0 products, and now we are releasing some well-designed, in demand ORv3 products. Through discussions with several customers, we decided to move forward with the development of these configurations. These designs check the boxes for specifications that are required," said Vincent Wang, Sales VP at Giga Computing. "We will continue supporting ORv3 specifications and we have more products on the horizon in Q1 2024.

CORSAIR, a world leader in enthusiast components for gamers, creators, and PC builders, today launched the much anticipated latest addition to its award-winning memory line-up, DOMINATOR TITANIUM DDR5 memory. Built using some of the fastest DDR5 ICs alongside patented CORSAIR DHX cooling technology for improved overclocking potential, DOMINATOR TITANIUM continues the DOMINATOR legacy with a stunning design and blazing performance.

Sporting an elegant, fresh new aesthetic and built using premium materials and components, DOMINATOR TITANIUM DDR5 memory will be available for both Intel and AMD platforms, supporting Intel XMP 3.0 when paired with 12th and 13th-Gen Core processors or AMD EXPO for Ryzen 7000 CPUs. These technologies enable easy overclocking in just a couple of clicks on compatible platforms.

The burgeoning AI market is significantly impacting TSMC's CoWoS (Chip on Wafer on Substrate) advanced packaging production capacity, causing it to overflow due to high demand from major companies like NVIDIA, AMD, and Amazon. To accommodate this, TSMC is in the process of expanding its production capacity by acquiring additional CoWoS machines from equipment manufacturers like Xinyun, Wanrun, Hongsu, Titanium, and Qunyi. These expansions are expected to be operational in the first half of the next year, leading to an increased monthly production capacity, potentially close to 30,000 pieces, enabling TSMC to cater to more AI-related orders. These endeavors to increase capacity are in response to the amplified demand for AI chips from their applications in various domains, including autonomous vehicles and smart factories.

Despite TSMC's active steps to enlarge its CoWoS advanced packaging production, the overwhelming client demand is driving the company to place additional orders with equipment suppliers. It has been indicated that NVIDIA is currently TSMC's largest CoWoS advanced packaging customer, accounting for 60% of its production capacity. Due to the surge in demand, companies like AMD, Amazon, and Broadcom are also placing urgent orders, leading to a substantial increase in TSMC's advanced process capacity utilization. The overall situation indicates a thriving scenario for equipment manufacturers with clear visibility of orders extending into the following year, even as they navigate the challenges of fulfilling the rapidly growing and immediate demand in the AI market.

Scott Herkelman, Senior Vice President and General Manager of AMD's Graphics Business Unit, has announced that he will be leaving AMD at the end of this year. As noted in his Twitter post, he spent last seven years at AMD, and launches three generations of RDNA graphics architectures. Scott Herkelman is a veteran of the industry, and was General Manager for GeForce at NVIDIA back in the day. After briefly switching to a start-up, he then joined AMD back in 2016 as Vice President and General Manager of Graphics Business Unit, the role he held for seven years while becoming Senior Vice President in 2022.

Scott said farewell to his colleagues in a brief Twitter post, and we are are certainly looking forward to see where he will be going next, as Scott is a PC and a gaming industry fan, through and through. Meanwhile, as spotted by Videocardz.com and according to AMD's own website, Jack Huynh will take over at the Senior Vice President and General Manager of AMD's Graphics Business Unit.

UPDATE: As pointed out by some comments and a couple of readers, Jack Huynh will not replace Scott Herkelman. Jack Huynh replaced Rick Bergman back in April as Senior Vice President and General Manager of AMD's Graphics Business Unit.

Samsung Electronics today announced a new collaboration with AMD to advance 5G virtualized RAN (vRAN) for network transformation. This collaboration represents Samsung's ongoing commitment to enriching vRAN and Open RAN ecosystems to help operators build and modernize mobile networks with unmatched flexibility and optimized performance. The two companies have completed several rounds of tests at Samsung's lab to verify high-capacity and telco-grade performance using FDD bands and TDD Massive MIMO wide-bands, while significantly reducing power consumption. In this joint collaboration, Samsung used its versatile vRAN software integrated with the new AMD EPYC 8004 processors, focused on telco and intelligent edge. During technical verification, the EPYC 8004 processors combined with Samsung's vRAN solutions delivered optimized cell capacity per server as well as high power efficiency.

"This technical collaboration demonstrates Samsung's commitment to delivering network flexibility and high performance for service providers by building a larger vRAN and Open RAN ecosystem," said Henrik Jansson, Vice President and Head of SI Business Group, Networks Business at Samsung Electronics. "Samsung has been at the forefront of unleashing the full potential of 5G vRAN technology to meet rising demands, and we look forward to collaborating with industry leaders like AMD to provide operators the capabilities to transform their networks."

Fueled by an AI-driven inventory stocking frenzy across the supply chain, TrendForce reveals that Q2 revenue for the top 10 global IC design powerhouses soared to US $38.1 billion, marking a 12.5% quarterly increase. In this rising tide, NVIDIA seized the crown, officially dethroning Qualcomm as the world's premier IC design house, while the remainder of the leaderboard remained stable.

AI charges ahead, buoying IC design performance amid a seasonal stocking slump
NVIDIA is reaping the rewards of a global transformation. Bolstered by the global demand from CSPs, internet behemoths, and enterprises diving into generative AI and large language models, NVIDIA's data center revenue skyrocketed by a whopping 105%. A deluge of shipments, including the likes of their advanced Hopper and Ampere architecture HGX systems and the high-performing InfinBand, played a pivotal role. Beyond that, both gaming and professional visualization sectors thrived under the allure of fresh product launches. Clocking a Q2 revenue of US$11.33 billion (a 68.3% surge), NVIDIA has vaulted over both Qualcomm and Broadcom to seize the IC design throne.

Techtesters, a Dutch online publication and YouTube channel, took the time to investigate whether AMD's Radeon RX 7800 XT 16 GB GPU can compete with NVIDIA's GeForce RTX 4070 12 GB GPU in power efficiency stakes. Naturally, Team Red loses with their new mid-ranger running under normal conditions when lined up against its main rival - ranging from 252 W to 286 W versus 200 W (sometimes 196 W during gaming sessions) respectively. Nada Overbeeke (of Techtesters) chose to set a 90% power limit for their main subject matter—Gigabyte's custom design Navi 32-based Gaming OC model—through AMD software adjustments.

Its "aggressive" 200 W undervolted state was compared to stock performance in a number of modern game environments (refer to the charts below). The Gigabyte RX 7800 XT Gaming OC—using stock settings—consumed around 40% more power while managing only a 9% performance increase over its 200 W undervolted guise. VideoCardz notes that AMD's reference model requires 24% more power at stock: "As mentioned, a 9% performance boost should not be underestimated, but the substantial reduction in power consumption also resulted in quieter GPU operation and lower temperatures." It would have been interesting to see Techtesters undervolt their RTX 4070 FE candidate as well, but emphasis seemed to be placed on the newer card.

With the XMG CORE 16, XMG's CORE series gets a new 16-inch model, whose features are based on the current top models of the NEO seri
es in many details. Powered by AMD's Ryzen 7 7840HS and an NVIDIA GeForce RTX 4070 or 4060, the laptop is aimed at the upper mid-range, but also adds features from the premium segment. These include, for example, an optional keyboard with CHERRY MX Ultra Low Profile Tactile switches, a 99 Wh battery and a liquid metal thermal compound for cooling the processor and graphics card. For the first time, there is also a configuration option for up to 96 GB DDR5 RAM.

The XMG CORE 16 (L23) is the first laptop in the CORE series to come in a 16-inch format and, alongside the APEX 15 and APEX 17, is now the third model to be based on an AMD Phoenix CPU featuring the Ryzen 7 7840HS with 8 cores and 16 threads. XMG offers the laptop with either an NVIDIA GeForce RTX 4070 or an RTX 4060, each with a graphics power of 140 watts (115 watts plus 25 watts Dynamic Boost). A composite cooling system with four heat pipes, separate heat sinks on all four air outlets and liquid metal for improved heat transfer from both the CPU and GPU is utilised to provide high continuous performance.

AMD has updated its Radeon Adrenalin driver with the latest edition, 23.9.2. The newest version brings unified driver support for AMD Radeon RX 7700 and RX 7800, which the previous driver lacked, and there was a separate download for these two SKUs. Besides merging into a single unified driver, the new update brings Lies of P, Party Animals, and The Crew Motorfest game support for AMD Radeon graphics. In this driver release, the AMD Radeon Anti-Lag+ feature is introduced for Starfield, Witcher 3, ELDEN RING, Immortals of Aveum, and an Anti-Lag+ screen overlay for system latency. AMD fixed some issues like application crashing while playing Baldur Gate 3 with Vulkan API on RX 7900 XTX, limited GPU clock tuning on RX 7700 XT and RX 7800 XT, application crash while playing SMITE on RX 7900 XTX, and application crash or driver timeout while playing F1 2023 on RX 7800 XT. There is no Cyberpunk 2077 update yet in this driver release.

You can download the Radeon Adrenalin Edition 23.9.2 Driver here.See the full list of changes below:

Thermaltake, the leading PC DIY premium brand for Case, Power, Cooling, Gaming peripherals, and enthusiast Memory solutions, is pleased to unveil the Pacific SW1 Plus CPU Water Block and the Pacific SF Fittings - Silver Black. The custom liquid cooling system provides considerable flexibility in design, allowing you to demonstrate your aesthetic sense. If you are an industrial chic enthusiast, the Pacific SW1 Plus and the Pacific SF Fittings, which feature a New Industrial Style, are the ideal components for leveling up your cooling system's appearance while ensuring thermal performance and installation compatibility.

Pacific SW1 Plus CPU Water Block
Designed with a modern industrial style, the Pacific SW1 Plus CPU Water Block comes in solid aluminium alloy with a screw design, displaying a beautiful glow of metals. The copper base is finished with anti-corrosive nickel plating, matching the overall industrial design and offering an outstanding heat transfer for the CPU. The central inlet design of the base enables the coolant to be distributed evenly through the 0.2 mm microchannels, achieving more effective heat dissipation. What's more, through the TT RGB Plus 2.0 software, you can simply monitor coolant temperature and customize the lighting effects of the water block's 12 addressable LEDs. To fit the latest CPUs, the Pacific SW1 Plus is also compatible with Intel LGA 1700 and AMD AM5 sockets and can be installed without additional brackets.