ASUS today announced availability of a BIOS update for its X670 and X670E motherboards that enables full compatibility with the latest AMD Ryzen 7000 Series X3D CPUs featuring AMD 3D V-Cache technology.

The proven gaming performance of the AMD Ryzen 7 5800X3D CPU made it a long-standing favorite for PC builders. ASUS motherboards gave those builders high-performance, feature-rich options for assembling a potent gaming machine built around one of these chips. Now, AMD is upping its game with two new Ryzen 7000 Series CPUs with AMD 3D V-Cache technology: the Ryzen 9 7950X3D and the Ryzen 9 7900X3D. Combining a 3D vertical cache and all the advantages of the cutting-edge X670 platform, these chips are poised to seize the gaming performance crown.

YEYIAN Gaming, the prominent designer and manufacturer of innovative pre-built gaming PCs, peripherals, and computer components, is thrilled to announce the market launch of their latest offering, the ODACHI Gaming PCs. These high-performance gaming machines are powered by the cutting-edge AMD Ryzen 9 7900X3D and 7950X3D gaming CPUs, providing gamers with a remarkable gaming experience. The ODACHI Gaming PCs are available in three impressive models, the ODACHI 795DC-490, ODACHI 790DC-480, and ODACHI 790DC-79W. Each model is expertly crafted to meet the specific needs and preferences of discerning gamers who demand nothing but the best.

These new additions to flagship ODACHI gaming PCs are designed to meet the fluctuating demands of pro gamers, content creators, and streamers. Powered by the latest AMD Ryzen 9 7900X3D and 7950X3D gaming processors incorporating next-gen AMD 3D V-Cache. The new ODACHI gaming desktop PCs are integrated with the latest AMD RX 7900XTX and NVIDIA RTX 4000 series graphic cards, supporting the fastest DDR5-6000 memory and Gen 4 x4 M.2 NVMe SSD for unparalleled system performance and reliability. Gamers can now enjoy the latest games, live stream broadcasts, and multitask with ease, without experiencing any lags or slowdowns.

GIGABYTE TECHNOLOGY Co. Ltd, a leading manufacturer of motherboards, graphics cards, and hardware solutions, announced today that GIGABYTE X670, B650 motherboard lineup with advanced configuration provides a perfect match for the latest AMD Raphael X3D processors with 3D V-Cache technology. This match delivers remarkable improvements on gaming performance for building ultimate gaming systems.

AMD first launched 3D V-Cache technology on Ryzen 7 5800X3D processors in 2022 and made it one of the best gaming CPUs. Now AMD brings 3D V-Cache technology to Zen 4 and introduces AMD Ryzen 9 7950X3D, Ryzen 9 7900X3D, and upcoming Ryzen 7 7800X3D processors with superior gaming performance. This new generation 3D V-Cache CPUs with more cores also raise L3 cache up to 128 MB, and boost gaming performance thanks to the extra 64 MB cache of 3D V-Cache.

MSI announced today a new lineup of AMD Ryzen 7000 Series processors with AMD 3D V-Cache Technology that will be compatible with all MSI's X670 and B650 motherboards. The new AMD Ryzen processors include the AMD Ryzen 9 7950X3D and Ryzen 9 7900X3D which will have a TDP of 120 W while increasing its L3 Cache by 50% compared to the regular Ryzen 7000 processors. Even with a slightly lower TDP of 120 W, these AMD Ryzen 7000 Series processors with AMD 3D V-Cache Technology processors have up to 16 cores and 32 threads while still being able to hit their theoretical max boost clock of up to 5.70 GHz.

With the latest AGESA COMBO PI-1.0.0.5c BIOS from MSI will be ready and have the most performance-optimized patch for the new AMD Ryzen 7000 Series processors with AMD 3D V-Cache Technology. However, previous BIOS versions are still compatible with any MSI's X670 and B650 motherboards as well. With the latest launch of AMD Ryzen 9 7950X3D and Ryzen 9 7900X3D processors, MSI is proud to announce the MAG X670E TOMAHAWK WIFI to our AMD Series lineup of the motherboard and will support all AMD Ryzen 7000 Series processors at launch. Inspired by military concept, the design MAG X670E TOMAHAWK WIFI is shown as a symbol of robust and durability that allow the users to have the optimal experience.

ASRock has released new BIOS to support the latest AMD Ryzen 7000 Series Processors with AMD 3D V-Cache Technology, with new BIOS on ASRock X670E/B650E/B650 motherboards, you may enjoy the enhanced gaming performance powered by AMD Ryzen 7000X3D series processors. The latest BIOS is already available to download on ASRock website, be sure to update to the latest BIOS to enjoy the ultimate gaming experience with AMD 3D V-Cache Technology.

BIOSTAR, a leading manufacturer of motherboards, graphics cards, and storage devices today, is excited to announce a list of compatible motherboards for AMD's newly announced AMD Ryzen 7000X3D processors. AMD Ryzen 7000X3D processors, which include the Ryzen 9 7950X3D, Ryzen 9 7900X3D, and Ryzen 7 7800X3D, promise unparalleled gaming and compute performance thanks to their groundbreaking 3D V-Cache technology. Expected to provide top-of-the-line performance for demanding users, BIOSTAR announces that their AMD-AM5 motherboards are ready to support these new processors.

Flagship tier X670E VALKYRIE, RACING series B650EGTQ, and B650M-SILVER motherboards are the first batch of compatible BIOSTAR motherboards, ready to take on the shiny new AMD Ryzen 7000X3D processors. They are engineered with cutting-edge technology to ensure smooth and efficient performance for high-end gaming and professional applications.

Jon Peddie Research reports that the growth of the global PC-based graphics processor unit (GPU) market reached 64.2 million units in Q4'22 and PC CPU shipments decreased by -35% year over year. Overall, GPUs will have a compound annual growth rate of 0.19% during 2022-2026 and reach an installed base of 3,013 million units at the end of the forecast period. Over the next five years, the penetration of discrete GPUs (dGPUs) in PCs will grow to reach a level of 32%.

Year to year, total GPU shipments, which include all platforms and all types of GPUs, decreased by -38%, desktop graphics decreased by -24%, and notebooks decreased by -43%—the largest decrease since its peak in 2011. AMD's overall market share percentage from last quarter increased 0.4%, Intel's market share decreased by -1.1%, and Nvidia's market share increased 0.68%, as indicated in the following chart.

AMD's top two new desktop processors, the Ryzen 9 7950X3D 16-core/32-thread; and the Ryzen 9 7900X3D 12-core/24-thread, go on sale later today (starting 3 PM Central European time, 9 AM EST). The two "Zen 4" processors feature the company's 3D Vertical Cache technology, which significantly improves gaming performance. The 7950X3D in particular attains parity with the Intel Core i9-13900K in both gaming and multi-threaded productivity performance.

3D Vertical Cache is a 64 MB SRAM die that augments the 32 MB on-die L3 cache of one of the two CCDs in these processors. The combined 96 MB cache has a profound impact on compute latencies for gaming. In our testing, the 7950X3D matches the gaming performance of the i9-13900K "Raptor Lake," which means AMD now has a truly competitive processor with Intel's latest. It also matches or exceeds the I/O feature-set, including DDR5 memory, PCIe Gen 5 (including for the CPU-attached NVMe slot); and an iGPU, although it loses out on DDR4 memory support. The Ryzen 9 7950X3D commands an MSRP of USD $700, and the 7900X3D $600.

Catch the TechPowerUp Review of the AMD Ryzen 9 7950X3D.

Today at MWC 2023, Lenovo unveiled its latest PC and Chromebook solutions to help embrace dispersed hybrid working styles and provide advanced features that empower users across a broad selection of requirements and needs. Encompassing a progressive and contemporary design philosophy, the latest PC solutions, including a comprehensive refresh across the ThinkPad portfolio, focus on improvements in system performance, increased use of more sustainable materials, and continued enhancements to user experience. ThinkPad Z13 and Z16 second generation Windows 11 laptops enhance key areas of hardware and software functionality to help users maintain a creative edge. ThinkPad Z13 also presents a new Flax Fiber top cover, using bio-based materials, for a unique individual look and feel. Lenovo also introduced a redesigned fourth generation ThinkPad X13 and X13 Yoga with narrower bezels, new colors, materials and features to facilitate hybrid work and mobility. The ThinkPad portfolio for 2023 is completed with fourth generation ThinkPad T14s, T14 and second generation T16 workhorse laptops along with the fourth generation ThinkPad L13, L13 Yoga, L14 and L15, designed for businesses with a wide range of mobile computing needs.

Value-conscious businesses seeking focused productivity features can select a fifth generation ThinkPad E14 with new 16:10 displays or a new 16-inch form factor in the ThinkPad E16. Frequent travellers will like the additional protection provided by the new ThinkPad Professional Sleeve, available in 13-inch and 14-inch sizes to support a broad selection of laptops. The highly versatile ThinkCentre Tiny-in-One Gen 5 Monitor offers improved audio-visual capabilities and redesigned features capable of supporting multiple work scenarios. Finally, consumers can enjoy the flexibility offered by the latest IdeaPad Duet 3i, a Windows 11 detachable laptop that seamlessly transitions between clamshell and tablet modes; or relish the ChromeOS eco-system with the latest IdeaPad Slim 3 Chromebook featuring a range of audio, visual, and connectivity upgrades.

EK, the premium PC liquid cooling gear manufacturer, is launching the EK-Quantum Momentum² Strix X670E-I Gaming D-RGB - Plexi, the latest AMD AM5 socket-based monoblock. It is engineered specifically for the ASUS ROG STRIX X670E-I GAMING motherboard and features the latest EK Velocity² cooling engine for top-level CPU cooling. This Quantum line monoblock has addressable D-RGB LED compatible with ASUS Aura Sync RGB control, offering complete lighting customization for every diode at any time. It is also EK-Matrix7 compatible and doesn't require removing the factory-mounted heatsink before installation.

GELID Solutions unveils the new GELID Liquid 240 Ultimate AIO CPU Cooler as a product of the GELID Solutions GAMER product line. The epitome of superior liquid cooling technologies the GELID Liquid 240. Ultimate cooling performance is provided by its premium-class high-density radiator, connected with two 120 mm quiet fans (Smart ARGB PWM control) and high-class water pump with the most demanding modern needs being handled by the integrated cooling.

The low noise water pump includes a temperature display. Further the 2 ARGB PWM Fans provide 750-1800 RPM and low noise level at 29.6dBA, AIO240 is the masterpiece of top-notch liquid cooling technologies. The all-in-one cooling handles the latest requirements, even the most powerful LGA 1700 CPU from Intel( ) and AM5 from AMD, a truely multi compatible All-in-One CPU water cooler. The support of TDP over 240 W makes the GELID Liquid 240 an overkill CPU AIO cooling solution for pro gamers and overclockers.

AMD's Ryzen 7000-series CPUs with 3D V-Cache are set to launch next week and alongside the launch, there will obviously be reviews of the upcoming CPUs. As with many other companies, AMD prepared a reviewers guide for the media, to give them some guidance, as well as expected benchmark numbers based on the test hardware AMD used in-house. Parts of that reviewers guide has now appeared online, courtesy of a site called HD Tecnologia. For those that can't wait until next week's reviews, this gives a glimpse of what to expect, at least based on the games tested by AMD.

AMD put the Ryzen 9 7950X3D up against Intel's Core i9 13900K, both systems were equipped with 32 GB of DDR5-6000 memory and liquid cooling. Tests were done with both AMD's own Radeon RX 7900 XTX and an NVIDIA GeForce RTX 4090 graphics card. We won't go into details of the various benchmarks here, as you can find those below, but according to AMD's figures, AMD came out on top with a 5.6 percent win over the Intel CPU, at 1080p using the Radeon RX 7900 XTX and by 6 percent using the GeForce RTX 4090. This was across 22 different games, with Horizon Zero Dawn and F1 2021 being the games favouring the AMD CPU the most and Far Cry 6 and the CPU test in Ashes of the Singularity being the games favouring the AMD CPU the least. TechPowerUp will of course have a review ready for your perusing by the time the new CPUs launches next week, so you'll have to wait until then to see if AMD's own figures hold true or not.

GIGABYTE TECHNOLOGY Co. Ltd, a leading manufacturer of motherboards, graphics cards, and hardware solutions, announced today that GIGABYTE X670, B650 motherboard lineup with advanced configuration provides a perfect match for the latest AMD Raphael X3D processors with 3D V-Cache technology. This match delivers remarkable improvements on gaming performance for building ultimate gaming systems.

AMD first launched 3D V-Cache technology on Ryzen 7 5800X3D processors in 2022 and made it one of the best gaming CPUs. Now AMD brings 3D V-Cache technology to Zen4 and introduces AMD Ryzen 9 7950X3D, Ryzen 9 7900X3D, and upcoming Ryzen 7 7800X3D processors with superior gaming performance. This new generation 3D V-Cache CPUs with more cores also raise L3 cache up to 128 MB, and boost gaming performance up to 50% thanks to the extra 64 MB cache of 3D V-Cache.

With the releases of the latest generation of Intel and AMD platforms, the era of PCIe 5.0 SSD has officially arrived. Team Group today has launched the T-FORCE CARDEA Z540 M.2 PCIe 5.0 SSD. Developed with outstanding technological expertise, it is the SSD gamers of all kinds have been waiting for. Now it's ready to lead the consumer SSD market into the new era of Gen 5. The Z540 PCIe 5.0 SSD uses the latest PCIe Gen 5 x 4 interface and supports the latest NVMe 2.0 protocol, allowing it to reach read and write speeds of up to 12,000 MB/s and 10,000 MB/s respectively, nearly double the theoretical speed limit of PCIe 4.0. Possessing cutting-edge specifications, Z540 SSD brings gamers an unprecedented, next-generation gaming experience.

The T-FORCE CARDEA Z540 M.2 PCIe 5.0 SSD is equipped with an exclusive ultra-thin graphene heatspreader that combines multiple patented technologies. It's made of 100% recyclable graphene material and utilizes the advantages of hexagonal honeycomb lattice structures to rapidly and evenly disperse heat horizontally, providing Z540 SSD with top-notch cooling. The Z540's ultra-thin graphene heatspreader is less than 1 mm thick and is compatible with various PCIe 5.0 motherboard heatsinks. Based on T-FORCE LAB's internal testing, the operating temperature of Z540 SSD combining motherboard heatsink and graphene heatspreader is 3-5°C lower than the temperature with only motherboard heatsinks. Moreover, CARDEA Z540 uses the latest intelligent thermal regulation technology with built-in temperature sensing to automatically adjust performance and prevent overheating. T-FORCE LAB has created numerous temperature solutions for the Z540 SSD to not only enhance and protect data integrity of the SSD but also maintain good operating temperatures at high speeds, extending the lifespan of the SSD.

ASUS began rolling out Beta UEFI firmware updates for its Socket AM5 motherboards encapsulating AGESA 1.0.0.5 patch-C microcode. This exposes several new options to end-users through the UEFI Setup Program, which gives them greater control over the way the processor prioritizes workload among the two CCDs (CPU complex dies) on 12-core and 16-core Ryzen 7000 series processors, including the upcoming 7000X3D processors.

While AMD is working to release Chipset Software updates that include "3D V-cache Optimization driver" components that introduce OS-level awareness of the asymmetric implementation of 3D V-cache on the 7900X3D and 7950X3D where only one of the two CCDs has the additional cache; these firmware-level options give users control on prioritizing one CCD over the other for workload. The firmware-level optimization is OS-agnostic, so pretty much any OS should benefit from 3D V-cache the way it was intended (where less parallelized workloads such as games are prioritized on the CCD with the 3D V-cache.

AMD announced that it is bundling "Company of Heroes 3" with retail PIB packages of Ryzen 5000 series "Zen 3" desktop processors. The WWII-setting real-time strategy (RTS) is being bundled with new purchases of Ryzen 9 5950X, 5900X; Ryzen 7 5800X3D, 5800X, 5700X; Ryzen 5 5600X, 5600, and 5500. The 5700G and 5600G APUs are not eligible for this promotion. The bundle is limited to participated retailers, and in select markets. The company also has a separate running promotion for Ryzen 7000 series "Zen 4" desktop PIBs, where the company is giving away "Star Wars Jedi: Survivor."

AMD and Arm have been gaining up on Intel in the server CPU market in the past few years, and the margins of the share that AMD had won over were especially large in 2022 as datacenter operators and server brands began finding that solutions from the number-2 maker growing superior to those of the long-time leader, according to Frank Kung, DIGITIMES Research analyst focusing primarily on the server industry, who anticipates that AMD's share will well stand above 20% in 2023, while Arm will get 8%.

Prices are one of the three major drivers that resulted in datacenter operators and server brands switching to AMD. Comparing server CPUs from AMD and Intel with similar numbers of cores, clockspeed, and hardware specifications, the price tags of most of the former's products are at least 30% cheaper than the latter's, and the differences could go as high as over 40%, Kung said.

Thanks to the attribution of Puget Systems, we have a preview of Intel's latest Xeon W-3400 and Xeon W-2400 workstation processors based on Sapphire Rapids core technology. Delivering up to 56 cores and 112 threads, these CPUs are paired with up to eight TeraBytes of eight-channel DDR5-4800 memory. For expansion, they offer up to 112 PCIe 5.0 lanes come with up to 350 Watt TDP; some models are unlocked for overclocking. This interesting HEDT family for workstation usage comes at a premium with an MSRP of $5,889 for the top-end SKU, and motherboard prices are also on the pricey side. However, all of this should come as no surprise given the expected performance professionals expect from these chips. Puget Systems has published test results that include: Photoshop, After Effects, Premiere Pro, DaVinci Resolve, Unreal Engine, Cinebench R23.2, Blender, and V-Ray. Note that Puget Systems said that: "While this post has been an interesting preview of the new Xeon processors, there is still a TON of testing we want to do. The optimizations Intel is working on is of course at the top, but there are several other topics we are highly interested in." So we expect better numbers in the future.Below, you can see the comparison with AMD's competing Threadripper Pro HEDT SKUs, along with power usage using different Windows OS power profiles:

AMD is preparing to release the latest version of its Chipset software. Version 5.01.29.2026 WHQL should be of particular interest for users planning to buy an upcoming Ryzen 7000X3D series processor. The chipset driver includes the "3D V-Cache Performance Optimizer driver" component, version 1.0.0.7. This gives Windows a degree of awareness of the asymmetric nature of 3DV cache on the 16-core 7950X3D and 12-core 7900X3D, where only one of the two CCDs (chiplets) has the 3DV cache memory, while the other is a regular "Zen 4" CCD with 32 MB on-die L3 cache. This awareness should in theory improve performance in less-parallelized workloads (such as games). The AMD website doesn't yet list this driver, but it should appear as we head closer to the market-availability date of the 7950X3D and 7900X3D (February 28). From the looks of it, the optimization works for both Windows 11 and Windows 10, so those on the older operating system for reasons, can keep rocking it.

While AMD Radeon PC discrete GPUs have a lot of catching up to do against NVIDIA GeForce products in terms of market-share, the two companies' quarterly revenue figures paint a very different picture. For Q4 2022, AMD pushed $1.644 billion in GPU products encompassing all its markets, namely the semicustom chips powering Xbox Series X/S and PlayStation 5 consoles; and AMD Radeon products. In the same period, NVIDIA raked in $1.831 billion in revenues from semicustom chips powering Nintendo Switch console, GeForce NOW cloud-gaming service, and NVIDIA GeForce products. In purely revenue terms, AMD is bringing in 89% the revenue of NVIDIA from client graphics IP, which begins to explain how AMD is a major player in this market.

AMD today released the latest version of its Adrenalin graphics software. Version 23.2.2 WHQL works with all GPU generations dating back to the RX 400 series. This release adds optimization for "Atomic Heart," the much awaited survival horror FPS, as well as "Company of Heroes 3." Some display corruption observed with window-switching for the Netflix app, has been fixed. Maximum video encode bitrate being limited to 100 Mbps for some applications, has been fixed. AMD Bug Report Tool pop-up or system hang on some hybrid graphics notebooks, has been fixed. An application crash noticed with "Hitman 3" with RT enabled, has been fixed. Valve Index VR headset showing a blank screen with 144 Hz on GPUs such as the RX 7900 series, has been fixed. A performance drop observed on RX 6000 series + Ryzen machines, has been fixed.

DOWNLOAD: AMD Software Adrenalin 23.2.2 WHQL

According to SkatterBench, a website known for incredible overclocking attempts, we get to see AMD's Ryzen 7000 series integrated GPU get up to 42% performance improvement from overclocking. Specifically, the SKU used in the attempt was the Ryzen 9 7900 non-X model with 12 cores and 24 threads, clocked at 3.7 GHz base frequency and 5.4 GHz boost speed. The SKU contains a basic AMD GPU integrated into the package; however, not meant for any serious gaming tasks. Nonetheless, it is interesting to see what a two-core RDNA2 GPU clocked at 2.2 GHz managed to achieve once overclocked. The memory clock of the GPU is set to 2.4 GHz at stock.

Running at the base voltage of 0.997 volts under Furmark workload, the iGPU consumes around 38.5 Watts. However, the overclocking attempt pushed the voltage to 1.395 Volts, resulting in a 3.1 GHz iGPU frequency. The GPU Memory clock is now set to 3200 MHz, and the GPU+SOC power is 60.689 Watts, almost double compared to the stock settings. The overclocker used a GFX curve optimizer with various system tweaks to achieve these numbers. While the OC attempt was successful, the most significant performance improvement was a 42% increase, with some game titles averaging less. Below, the blue bar indicates stock, while the green bar indicates OC'd performance. You can check out the YouTube video as well to see more details.

EK, the leading liquid cooling gear manufacturer, launches a workstation and a 1U rack-compatible high-performance liquid cooling solution for AMD Zen 4-based EPYC server processors. Code-named "Genoa," these AMD CPUs come with up to 96 cores and 192 threads and have a TDP of up to 360W. These specifications render these processors perfect for liquid cooling, especially in a dual-socket motherboard environment.

EK-Pro CPU WB SP5 Ni + Acetal
This is a dedicated enterprise-grade water block developed specifically for AMD processors. It features three standard G1/4" threaded ports located on the top of the water block and is intended for workstations and taller server racks.

AMD in its ISSCC 2023 presentation detailed how it has advanced data-center energy-efficiency and managed to keep up with Moore's Law, even as semiconductor foundry node advances have tapered. Perhaps its most striking prediction for server processors and HPC accelerators is multi-layer stacked DRAM. The company has, for some time now, made logic products, such as GPUs, with stacked HBM. These have been multi-chip modules (MCMs), in which the logic die and HBM stacks sit on top of a silicon interposer. While this conserves PCB real-estate compared to discrete memory chips/modules; it is inefficient on the substrate, and the interposer is essentially a silicon die that has microscopic wiring between the chips stacked on top of it.

AMD envisions that the high-density server processor of the near-future will have many layers of DRAM stacked on top of logic chips. Such a method of stacking conserves both PCB and substrate real-estate, allowing chip-designers to cram even more cores and memory per socket. The company also sees a greater role of in-memory compute, where trivial simple compute and data-movement functions can be executed directly on the memory, saving round-trips to the processor. Lastly, the company talked about the possibility of an on-package optical PHY, which would simplify network infrastructure.

On January 7th, the Minisforum UM773 was launched in China with the AMD Ryzen 7 7735HS processor and received widespread praise from consumers. Now, the new version of UM773, UM773 Lite, has arrived globally with a more affordable price. Considering that users usually connect external keyboards and mouses, the two USB 3.2 ports have been replaced with USB 2.0 ports. All other design will be the same as UM773. The price, however, will be more favorable.

The new UM773 Lite features the new AMD Ryzen 7 7735HS, AMD Radeon 680M Integrated Graphics, DDR5 dual-channel memory, PCIe 4.0 SSD, and the most advanced USB4 Type-C port. The Ryzen 7 7735HS is one of AMD's new Ryzen 7000 series mobile processors, featuring 8 cores and 16 threads, with a based clock of 3.2 GHz and a maximum turbo clock of 4.75 GHz and a default TDP targeted at 54 W. The RDNA2 Radeon 680M integrated GPU has 12 CUs up to 2.4 GHz.