Intel is slowly preparing to launch its next-generation Meteor Lake mobile processor family, dropping the Core i brand name in favor of Core Ultra. Today, we are witnessing some early Geekbench v6 benchmarks with the latest leak of the Core Ultra 7 155H processor, boasting an integrated Arc GPU featuring 8 Xe-Cores—the complete configuration expected in the GPU tile. This tile is also projected to be a part of the more potent Core 9 Ultra 185H CPU. The Intel Core Ultra 7 155H processor has been benchmarked in the new ASUS Zenbook 14, which houses a 16-core and 22-thread hybrid CPU configuration capable of boosting up to 4.8 GHz. Paired with 32 GB of memory, the configuration was well equipped to supply CPU and GPU with sufficient memory space.

Perhaps the most interesting information from the submission was the OpenCL score of the GPU. Clocking in at 33948 points in Geekbench v6, the GPU is running over AMD's Radeon 780M GPU found in APU solutions like AMD Ryzen 9 7940HS and Ryzen 9 7940U, which scored 30585 and 27345 points in the same benchmark, respectively. The GPU tile is millimeters away from closing the gap between itself and the desktop Intel Arc A380 discrete GPU, which scored 37105 points for less than a 10% difference. The Xe-LPG GPU version is bringing some interesting performance points for the integrated GPU platform, which means that Intel's Meteor Lake SKUs will bring more performance/watt than ever.

MAINGEAR, the leader in premium-quality, high-performance, custom PCs, today announced the launch of its latest lineup of Pro Series Workstation PCs, meticulously engineered and configurable with the industry's most powerful components, to cater to the diverse needs of professionals across multiple industries.

Ideal for game developers, photo editors, graphics designers, videographers, 3D rendering artists, music producers, CAD engineers, data scientists, and AI/Machine Learning developers, the MAINGEAR ProWS Series introduces a range of desktop workstations crafted to crush the most intensive tasks, elevate productivity and streamline workflow.

ASUS today announced that an international group of elite overclockers has set nine world records and achieved sixteen first-place finishes in a variety of performance benchmarks with ASUS Pro WS WRX90E-SAGE SE and ASUS Pro WS TRX50-SAGE WIFI workstation motherboards. The motherboards leveraged AMD Ryzen Threadripper PRO 7000 WX-Series and AMD Ryzen Threadripper 7000 series processors which featured up to 96 cores and 192 threads. The group of overclockers included Der8auer, Elmor, Massman, OGS, Safedisk, Seby and Shamino.

Ready for CPU and memory overclocking
For AMD Threadripper 7000 series workstations and high-end desktop (HEDT) models, AMD offers CPU and DRAM overclocking options. To fully leverage the performance of the AMD processors, ASUS has incorporated an innovative dual power supply design on Pro WS WRX90E-SAGE SE and Pro WS TRX50-SAGE WIFI motherboards. Along with robust power delivery and advanced cooling modules, these boards exhibit rock-solid stability during overclocking.

G.SKILL International Enterprise Co., Ltd., the world's leading brand of performance overclock memory and PC components, is excited to announce the Zeta R5 Neo series overclocked DDR5 R-DIMM memory kits for the latest AMD Ryzen Threadripper 7000 series and AMD Ryzen Threadripper Pro 7000 WX-series processors with AMD TRX50 chipset motherboards. This is the first R-DIMM platform from AMD that officially supports memory overclocking, so the Zeta R5 Neo features AMD EXPO memory overclocking profiles for easy memory overclocking. Built with hand-screened ICs and will be available in DDR5-6400 CL32 16 GB x4 and 32 GB x4 kit specifications at launch, Zeta R5 Neo series is the ideal R-DIMM memory solution to build an overclocked performance AMD workstation.

Overclocked DDR5-6400 R-DIMM Kits Designed for Quad-Channel AMD TRX50 Platform
With the launch of the AMD TRX50 workstation platform that supports DDR5 R-DIMM overclocking, G.SKILL is bringing AMD EXPO memory overclocking profile support to its R-DIMM memory lineup under the Zeta R5 Neo series. Available in quad-channel configurations of DDR5-6400 CL32-39-39-102 64 GB (16 GB x4) and 128 GB (32 GB x4) specifications, visit the G.SKILL product pages for more product information.

Leading global motherboard manufacturer, ASRock, today launched ASRock AI QuickSet software tool. ASRock AI QuickSet software tool can help users quickly download, install and set up artificial intelligence (AI) applications. The first version is launched based on the Microsoft Windows 11 64-bit platform and utilizes the powerful computing performance of ASRock's own AMD Radeon RX 7000 series graphics cards to optimize the operating performance of two well-known open source artificial intelligence (AI) drawing applications, Shark and Stable Diffusion web UI, so that interested users can quickly experience the fun of artificial intelligence (AI) at their fingertips.

Today at Microsoft Ignite, AMD and Microsoft featured how AMD products, including the upcoming AMD Instinct MI300X accelerator, AMD EPYC CPUs and AMD Ryzen CPUs with AI engines, are enabling new services and compute capabilities across cloud and generative AI, Confidential Computing, Cloud Computing and smarter, more intelligent PCs.

"AMD is fostering AI everywhere - from the cloud, to the enterprise and end point devices - all powered by our CPUs, GPUs, accelerators and AI engines," said Vamsi Boppana, Senior Vice President, AI, AMD. "Together with Microsoft and a rapidly growing ecosystem of software and hardware partners, AMD is accelerating innovation to bring the benefits of AI to a broad portfolio of compute engines, with expanding software capabilities."

TYAN, an industry leader in server platform design and a subsidiary of MiTAC Computing Technology Corporation, debuts its new server line-up for 4th Gen AMD EPYC & AMD Ryzen Processors at SC23, Booth #1917, in the Colorado Convention Center, Denver, CO, November 13-16.

AMD EPYC 9004 processor features leadership performance and is optimized for a wide range of HPC, cloud-native computing and Generative AI workloads
TYAN offers server platforms supporting the AMD EPYC 9004 processors that provide up to 128 Zen 4C cores and 256 MB of L3 Cache for dynamic cloud-native applications with high performance, density, energy efficiency, and compatibility.

During its Ignite conference, Microsoft introduced a duo of custom-designed silicon made to accelerate AI and excel in cloud workloads. First of the two is Microsoft's Azure Cobalt 100 CPU, a 128-core design that features a 64-bit Armv9 instruction set, implemented in a cloud-native design that is set to become a part of Microsoft's offerings. While there aren't many details regarding the configuration, the company claims that the performance target is up to 40% when compared to the current generation of Arm servers running on Azure cloud. The SoC has used Arm's Neoverse CSS platform customized for Microsoft, with presumably Arm Neoverse N2 cores.

The next and hottest topic in the server space is AI acceleration, which is needed for running today's large language models. Microsoft hosts OpenAI's ChatGPT, Microsoft's Copilot, and many other AI services. To help make them run as fast as possible, Microsoft's project Athena now has the name of Maia 100 AI accelerator, which is manufactured on TSMC's 5 nm process. It features 105 billion transistors and supports various MX data formats, even those smaller than 8-bit bit, for maximum performance. Currently tested on GPT 3.5 Turbo, we have yet to see performance figures and comparisons with competing hardware from NVIDIA, like H100/H200 and AMD, with MI300X. The Maia 100 has an aggregate bandwidth of 4.8 Terabits per accelerator, which uses a custom Ethernet-based networking protocol for scaling. These chips are expected to appear in Microsoft data centers early next year, and we hope to get some performance numbers soon.

Researchers at Graz University of Technology and the Helmholtz Center for Information Security have released their paper on CacheWarp—the latest vulnerability affecting some of the prior generation AMD EPYC CPUs. Titled CVE-2023-20592, the exploit targets first-generation EPYC Naples, second-generation EPYC Rome, and third-generation EPYC Milan. CacheWarp operates by exploiting a vulnerability in AMD's Secure Encrypted Virtualization (SEV) technology, specifically targeting the SEV-ES (Encrypted State) and SEV-SNP (Secure Nested Paging) versions. The attack is a software-based fault injection technique that manipulates the cache memory of a virtual machine (VM) running under SEV. It cleverly forces modified cache lines of the guest VM to revert to their previous state. This action circumvents the integrity checks that SEV-SNP is designed to enforce, allowing the attacker to inject faults without being detected.

Unlike attacks that rely on specific guest VM vulnerabilities, CacheWarp is more versatile and dangerous because it does not depend on the characteristics of the targeted VM. It exploits the underlying architectural weaknesses of AMD SEV, making it a broad threat to systems relying on this technology for security. The CacheWarp attack can bypass robust security measures like encrypted virtualization, posing a significant risk to data confidentiality and integrity in secure computing environments. AMD has issued an update for EPYC Milan with a hot-loadable microcode patch and updated the firmware image without any expected performance degradation. And for the remaining generations, AMD states that no mitigation is available for the first or second generations of EPYC processor (Naples and Rome) since the SEV and SEV-ES features are not designed to protect guest VM memory integrity, and the SEV-SNP is not available.

AMD Socket AM4 users are in for a treat, as the company plans two more processor models in the Ryzen 5000X3D series, according to chi11eddog, a reliable source with AMD leaks. Although based on the older "Zen 3" microarchitecture, these chips feature 3D Vertical Cache technology, which helps shore up their gaming performance to levels comparable at least to 12th Gen Intel Core "Alder Lake," giving Socket AM4 platform users a cost-effective upgrade path to prolong their gaming PC builds that could be as old as 5 years now. If you recall, AMD has formally extended "Zen 3" and 3D V-cache support to all Socket AM4 chipset generations, including AMD 300-series.

Among the two new processor models are the Ryzen 7 5700X3D, and the Ryzen 5 5500X3D. The 5700X3D is an 8-core/16-thread processor with 100 MB of total cache (that's 512 KB of L2 cache per core, plus 96 MB of L3 cache); while the Ryzen 5 5500X3D is a 6-core/12-thread chip with 99 MB of total cache. What sets the 5700X3D and 5500X3D apart from the 5800X3D and 5600X3D are lower clock speeds, and possibly, lower TDP. Both chips come with a base frequency of 3.00 GHz, compared to the 3.30 GHz of the 5600X3D and 3.40 GHz of the 5800X3D. The 5700X3D boosts up to 4.10 GHz compared to the 4.50 GHz of the 5800X3D; while the 5500X3D boosts up to 4.00 GHz when compared to 4.40 GHz of the 5600X3D. Both the 5800X3D and 5600X3D have their TDP rated at 105 W, so it's possible that AMD is using lower TDP and PPT values for the 5700X3D and 5500X3D. There's no word on when the two new chips are coming out, although AMD continues to release updates to the Socket AM4 AGESA microcode, with the latest version ComboAM4v2 1.2.0.B being released as recently as September 2023.

AMD today announced at Smart Production Solutions 2023 the AMD Ryzen Embedded 7000 Series processor family, optimized for the high-performance requirements of industrial markets. By combining "Zen 4" architecture and integrated Radeon graphics, Ryzen Embedded 7000 Series processors deliver performance and functionality not previously offered for the embedded market. With its expanded features and integration, Ryzen Embedded 7000 Series processors are ideal for a wide range of embedded applications, including industrial automation, machine vision, robotics and edge servers.

The Ryzen Embedded 7000 Series processor is the first embedded processor to use next-generation 5 nm technology with a 7-year manufacturing availability commitment. The new embedded processor integrates AMD Radeon RDNA 2 graphics that eliminates the need for a discrete GPU for industrial applications. And because embedded applications require additional operating system software options, Ryzen Embedded 7000 Series processors include support for both Windows Server and Linux Ubuntu, on top of Windows 10 and Windows 11. Ryzen Embedded 7000 Series processors also include up to 12 high-performance "Zen 4" CPU cores, which combined with its integrated features and wide operating system choices, offers unparalleled ease of integration for system designers.

ASRock Rack Inc., the leading innovative server company, today is set to showcase a comprehensive range of servers for diverse AI workloads catering to scenarios from the edge, on-premises, and to the cloud at booth #1737 at SC 23 held at the Colorado Convention Center in Denver, USA. The event is from November 13th to 16th, and ASRock Rack will feature the following significant highlights:

At SC 23, ASRock Rack will demonstrate the NVIDIA-Qualified 2U4G-GENOA/M3 and 4U8G series GPU server solutions along with the NVIDIA H100 PCIe. The ASRock Rack 4U8G and 4U10G series GPU servers are able to accommodate eight to ten 400 W dual-slot GPU cards and 24 hot-swappable 2.5" drives, designed to deliver exceptional performance for demanding AI workloads deployed in the cloud environment. The 2U4G-GENOA/M3, tailored for lighter workloads, is powered by a single AMD EPYC 9004 series processor and is able to support four 400 W dual-slot GPUs while having additional PCIe and OCP NIC 3.0 slots for expansions.

AMD's "Phoenix" monolithic processor silicon drives the company's Ryzen 7040 series mobile processor lineup, and possible some of its upcoming Ryzen 7000G desktop processor models. It is the first chip from the AMD camp to feature an AI accelerator, besides up to 8 "Zen 4" CPU cores, and a large iGPU based on the latest RDNA3 graphics architecture, with up to 12 compute units, the latest display I/O and media acceleration capabilities. Over the course of its lifecycle, AMD realized that it can't use the nearly 200 mm² silicon built on the expensive 4 nm node to power lower-end processor SKUs, and so developed the smaller 137 mm² "Phoenix 2" silicon that lacks the AI accelerator, has a smaller iGPU with just 4 compute units, and a unique hybrid CPU with 2 "Zen 4" and 4 "Zen 4c" cores. We're now hearing that the company is designing even more derivatives.

The PCI ID Repository discovered two new IDs believed to reference the iGPU models of "Phoenix 3" and "Phoenix 4" chips. At this point we have no clue what the two chips could be, and what the mixture of their CPU, iGPU, and AI accelerator components could be, especially given that AMD is able to carve out Ryzen 3 SKUs from "Phoenix 2." We speculate that "Phoenix 3" and "Phoenix 4" could reference rebranding such as "Escher," although it could even be entirely new chips with different combinations of "Zen 4" and "Zen 4c" cores.

Today, Lenovo announced the new ThinkStation P8 tower workstation powered by AMD Ryzen Threadripper PRO 7000 WX-Series processors and NVIDIA RTX GPUs. Designed to deliver unparalleled performance, reliability and flexibility for professionals who demand the best from their workstations, the bold new ThinkStation P8 builds on the success of the award-winning P620, the world's first workstation powered by AMD Ryzen Threadripper PRO processors. Featuring an optimized thermal design in a versatile Aston Martin inspired chassis, the ThinkStation P8 combines Lenovo's legendary reliability, customer experience and innovation with breakthrough compute architecture courtesy of AMD and NVIDIA. ThinkStation P8 raises the bar for intense workloads across multiple segments focused on outcome-based workflow agility.

"At Lenovo, we understand that our customers need high-quality workstations that can adapt to their changing and diverse needs. That's why we collaborated with AMD and NVIDIA to create the ThinkStation P8, a workstation that combines power, flexibility and enterprise-grade features," said Rob Herman, vice president and general manager, Workstation and Client AI Business Unit, Lenovo. "Designed to offer unparalleled performance and scalability, whether to run complex simulations, render stunning visuals, or develop cutting-edge AI applications, the ThinkStation P8 can handle it all. And with Lenovo's certifications, security and support, you can trust that the ThinkStation P8 will exceed expectations."

GIGABYTE Technology, Giga Computing, a subsidiary of GIGABYTE and an industry leader in high-performance servers, server motherboards, and workstations, continues to be a leader in cooling IT hardware efficiently and in developing diverse server platforms for Arm and x86 processors, as well as AI accelerators. At SC23, GIGABYTE (booth #355) will showcase some standout platforms, including for the NVIDIA GH200 Grace Hopper Superchip and next-gen AMD Instinct APU. To better introduce its extensive lineup of servers, GIGABYTE will address the most important needs in supercomputing data centers, such as how to cool high-performance IT hardware efficiently and power AI that is capable of real-time analysis and fast time to results.

Advanced Cooling
For many data centers, it is becoming apparent that their cooling infrastructure must radically shift to keep pace with new IT hardware that continues to generate more heat and requires rapid heat transfer. Because of this, GIGABYTE has launched advanced cooling solutions that allow IT hardware to maintain ideal performance while being more energy-efficient and maintaining the same data center footprint. At SC23, its booth will have a single-phase immersion tank, the A1P0-EA0, which offers a one-stop immersion cooling solution. GIGABYTE is experienced in implementing immersion cooling with immersion-ready servers, immersion tanks, oil, tools, and services spanning the globe. Another cooling solution showcased at SC23 will be direct liquid cooling (DLC), and in particular, the new GIGABYTE cold plates and cooling modules for the NVIDIA Grace CPU Superchip, NVIDIA Grace Hopper Superchip, AMD EPYC 9004 processor, and 4th Gen Intel Xeon processor.

MSI, a leading global server provider, is showcasing its latest GPU and CXL memory expansion servers powered by AMD EPYC processors and 4th Gen Intel Xeon Scalable processors, which are optimized for enterprises, organizations and data centers, at SC23, booth #1592 in the Colorado Convention Center in Denver from November 13 to 16.

"The exponential growth of human- and machine-generated data demands increased data center compute performance. To address this demand, liquid cooling has emerged as a key trend, said Danny Hsu, General Manager of Enterprise Platform Solutions. "MSI's server platforms offer a well-balanced hardware foundation for modern data centers. These platforms can be tailored to specific workloads, optimizing performance and aligning with the liquid cooling trend."

AMD today announced the AMD Radeon PRO W7700, the most powerful professional workstation graphics card under $1,000, offering an ideal combination of reliability, stability and extraordinary price/performance for content creation, CAD and AI applications. The new workstation graphics card is designed to meet the evolving demands of professional workflows, including increasingly complex computer-generated designs, the continual growth in the development of visual effects and animations, a global surge in construction, and the explosive growth in advanced AI applications. The AMD Radeon PRO W7700 graphics card unleashes professionals' creativity through exceptional performance, stunning visuals and future-ready capabilities.

"We built and optimized the AMD Radeon PRO W7700 graphics cards to create premium workstation graphics experiences, enabling our customers to boost innovation and productivity," said Dan Wood, corporate vice president, Radeon product management at AMD.

ASUS today announced a showcase of the latest AI solutions to empower innovation and push the boundaries of supercomputing, at Supercomputing 2023 (SC23) in Denver, Colorado, from 12-17 November, 2023. ASUS will demonstrate the latest AI advances, including generative-AI solutions and sustainability breakthroughs with Intel, to deliver the latest hybrid immersion-cooling solutions, plus lots more - all at booth number 257.

At SC23, ASUS will showcase the latest NVIDIA-qualified ESC N8A-E12 HGX H100 eight-GPU server empowered by dual-socket AMD EPYC 9004 processors and is designed for enterprise-level generative AI with market-leading integrated capabilities. Related to NVIDIA announcement on the latest NVIDIA H200 Tensor Core GPU at SC23, which is the first GPU to offer HBM3E for faster, larger memory to fuel the acceleration of generative AI and large language models, ASUS will offer an update of H100-based system with an H200-based drop-in replacement in 2024.

Valve has announced an updated version of the Steam Deck and the headline feature is the new 7.4-inch OLED display. That's a mere 0.4-inches bigger than the original Steam Deck LCD display and it retains the same 1280 x 800 resolution. However, everything else related to the display has been improved and the refresh rate is now 90 Hz rather than 60 Hz. The display is also a lot brighter, with an SDR rating of 600 nits and an HDR rating of 1000 nits. Valve also claims a 110 percent P3 colour gamut, a one million to one contrast ratio and a sub 0.1 ms response time. On top of that, Valve has added what the company calls "high performance touch" which is said to improve the responsiveness of the display.

It's not just the display that has been improved, as Valve has moved to a 6 nm AMD Zen 2 based SoC which seems to allow the GPU to run at 1.6 GHz at all times, as Valve no longer lists a frequency range for the GPU. The power envelope remains the same though, with a range of 4-15 Watts. Paired with the new SoC is faster LPDDR5 memory at 6400 MT/s, up from 5500 MT/s, which should provide a small boost in gaming performance. An improved cooling solution is also part of the package, which is also likely a reason for the more constant GPU clocks. Gone are the entry level storage SKUs and the OLED version of the Steam Deck only comes with 512 GB or 1 TB of internal storage. The WiFi and Bluetooth module has also been overhauled and now supports WiFi 6E and Bluetooth 5.3. The battery has also been boosted from a 40 Whr pack to a 50 Whr pack and Valve now claims three to 12 hours of battery life during gaming, as well as faster charging times. Finally the weight has dropped by 29 grams, which might not be much, but still impressive considering the larger battery pack. The downside you ask? That would be the price, as Valve is asking for US$549/€569 for the 512 GB version, with the 1 TB coming at US$649/€679 when it becomes available on the 16th of November.

A curious piece of marketing material on the Chiphell forum has sent ripples through the tech community, featuring what appears to be an Alienware desktop equipped with an unannounced AMD Ryzen 9000-series processor. The authenticity of this flyer is up for debate, with possibilities ranging from a simple typo by Alienware to a fabricated image, or it could even suggest that AMD is on the cusp of unveiling its next-generation Ryzen CPUs for desktop PCs. While intrigue is high, it's important to approach such revelations cautiously, with a big grain of salt. AMD's existing roadmap points toward a 2024 release for its Zen 5-based Ryzen desktop processors and EPYC server CPUs, which casts further doubt on the Ryzen 9000 series appearing ahead of schedule.

We have to wait for AMD's major upcoming events, including the "Advancing AI" event on December 6, where the company will showcase how its partners and AMD use AI for applications. Next, we hope to hear from AMD about upcoming events such as CES in January and Computex in May, but we don't have any official information on product launches in the near term. If the company is preparing anything, the Alienware flyer pictured below should indicate it, if the source is confirmed. However, the doubt remains, and we should be skeptical of its truthfulness.

Micron Technology, Inc. (Nasdaq: MU), today demonstrated its industry leadership by announcing its 32Gb monolithic die-based 128 GB DDR5 RDIMM memory featuring best-in-class performance of up to 8000 MT/s to support data center workloads today and into the future. These high-capacity, high-speed memory modules are engineered to meet the performance and data-handling needs of a wide range of mission-critical applications in data center and cloud environments, including artificial intelligence (AI), in-memory databases (IMDBs) and efficient processing for multithreaded, multicore count general compute workloads.

Powered by Micron's industry-leading 1β (1-beta) technology, the 32Gb DDR5 DRAM die-based 128 GB DDR5 RDIMM memory delivers the following enhancements over competitive 3DS through-silicon via (TSV) products:

• more than 45% improved bit density
• up to 24% improved energy efficiency
• up to 16% lower latency
• up to a 28% improvement in AI training performance

AMD is weaning the market off its older gaming graphics card series that predate the Radeon RX 5000 series. The company is reportedly putting older GPUs based on the "Vega" and "Polaris" graphics architectures on a slower driver update track, which means driver updates to these GPUs will be less frequent. The company's RX 5000, RX 6000, and RX 7000 series, on the other hand, will continue on with the current driver update track that includes one or more driver releases each month, including releases to fix glaring game bugs, or day-zero performance updates.

AMD over the past couple of months began segregating RDNA (RX 5000 series and later) and pre-RDNA (older than RX 5000 series) GPUs through their driver releases. The latest drivers come in an RDNA-only package (denoted by "rdna" in the installer's file name), which is around 600 MB in size; and a larger 1.1 GB package that supports both RDNA and pre-RDNA GPUs. The company now announced that the pre-RDNA GPUs will switch to a slower driver update track as is characteristic with older-generation GPUs that AMD wants to discontinue support for.

According to @momomo_us, Intel has discontinued its Cryo Cooling Technology as of July 1, 2023, marking the end of one of the tech industry's few sub-ambient cooling options. The technology, which could chill CPUs to 0 degrees Celsius to enhance performance, accompanied Intel's processors from the 10th-generation Comet Lake to the 13th-generation Raptor Lake. Despite its innovative approach to boosting CPU performance, the cooling solution was not widely embraced. The discontinuation comes just before the arrival of the 14th Generation Raptor Lake Refresh, which will not support the Cryo Cooling tech. Intel plans to maintain updates for the existing Cryo Cooling hardware until December 31, 2023.

This specialized cooling method did see some use in products like the Cooler Master MasterLiquid ML360 Sub-Zero and the EKWB EK-QuantumX Delta TEC waterblocks. Interestingly, the technology has managed to work even with non-Intel CPUs, which famous overclocker der8auer managed to get up and running on AMD's Ryzen 9 5950X. Some modifications were in place, but it was possible to do so. The likely reason for shutting down the cryo cooling project is the need for more financial sense to continue to pursue this technology and the effort to keep the cost of R&D down and make funds available for other projects at Intel's laboratories.

AMD is bundling "Avatar: Frontiers of Pandora," the hotly anticipated RPG based on the popular movie franchise, with its processors, graphics cards, and pre-builts that combine the two. The list of eligible product spans the higher end of the Ryzen 7000 series desktop processors, the entire Radeon RX 7000 series graphics cards (in the retail channel); and notebooks that combine select Ryzen 7000 series mobile processors and Radeon RX 6000M or 7000M series discrete graphics solutions.

The list of eligible desktop processors include Ryzen 9 7950X3D, 7950X, 7900X3D, 7900X, and 7900, and Ryzen 7 7800X3D. Eligible desktop graphics cards include Radeon RX 7900 XTX, RX 7900 XT, RX 7900 GRE, RX 7800 XT, RX 7700 XT, and RX 7600. For gaming notebooks, there must be a combination of the following processors and discrete graphics solutions: Ryzen 9 7945HX, 7845HX, 7940HS, Ryzen 7 7840HS, and 7735HS; and Radeon RX 7900M, RX 7700S, RX 7600S, RX 7600M XT, and RX 6550M. The promotion is open now, and runs until December 30, 2023; while the code redemption period closes January 27, 2024. The game itself releases on December 7.

LG Electronics USA announced today pricing and availability of two new models to its LG UltraGear gaming monitor lineup - the 45-inch LG UltraGear GR75DC and the 45-inch LG UltraGear GR65DC. The GR65DC is available to purchase for $799.99 now at LG.com and LG-authorized retailers. For a limited time, customers shopping on LG.com can preorder the LG UltraGear GR75DC for $899.99 and receive an UltraGear GP9 gaming speaker ($399 ARV) along with free expedited shipping.

The newest LG UltraGear models feature a 45-inch 32:9 Ultrawide Dual QHD screen - providing what is the equivalent of two 24-inch 16:9 QHD displays on one monitor at the same time. Engineered for multi-tasking, the built in PBP (picture by picture) and PIP (picture in picture) features allow users to play console games while simultaneously streaming content on an ultra-wide screen.