TrendForce reports that inventory reduction in Q1 fell short of expectations and coincided with the industry's traditional off-season, leading to overall subdued demand. However, due to new product release and a surge in urgent orders for specialized specifications, Q1 revenue of the global top ten IC design houses remained on par with 4Q22, with a modest QoQ increase of 0.1% for a total revenue of US$33.86 billion. Changes in ranking included Cirrus Logic slipping from the top ten as well as the ninth and tenth positions being replaced by WillSemi and MPS, respectively. The rest of the rankings remained unchanged.

The smartphone supply continues to grapple with overstock, but AI applications are entering a period of rapid growth
Qualcomm witnessed an uptick in its revenue, largely attributed to the launch and subsequent shipments of its latest flagship chip, the Snapdragon 8Gen2. The company saw 6.1% in QoQ growth in its smartphone business, which effectively offset the downturn from its automotive and IoT sectors. As a result, Qualcomm's Q1 revenue increased marginally by 0.6%, cementing its position at the top of the pack with a market share of 23.5%.

GIGABYTE unveiled the first Mini-ITX motherboard to feature the entry-level AMD A620 chipset. The UD-A620I-X offers a comprehensive I/O feature-set. The board draws power from a 24-pin ATX and a single 8-pin EPS, and uses a 9-phase VRM to power the SoC. This board is restricted to 65 W TDP processors (7600, 7700, 7900 and possibly Ryzen PRO desktop processors that are 65 W). The processor is wired to two DDR5 DIMM slots, and a PCI-Express 4.0 x16, which is really all you need for this generation of graphics cards.

A downside of the A620 platform is that it doesn't support PCIe Gen 5 on even the CPU-attached M.2 NVMe slots—the one on this board is Gen 4. Display connectivity on the UD-A620I includes an HDMI and DisplayPort. Networking interfaces include Wi-Fi 6 wireless, and 2.5 GbE wired. Storage connectivity, besides the Gen 4 NVMe slot, includes two SATA 6 Gbps ports. You get at least two USB 3.2 ports from the processor, four USB 3.2 type-A ports on the rear I/O, an internal type-E port (for security keys), and an internal USB 3.2 header. The company didn't reveal pricing.

Gamers Nexus has uploaded a video feature dedicated to the history of AMD's Zen CPU architecture—editor-in-chief and founder Stephen Burke ventured to Team Red's Austin, Texas-based test and engineering campus. Longer and more in-depth coverage of his lab tour will be released at a later date, but today's upload included an interesting segment covering unreleased hardware. The Gamers Nexus crew spent some time looking at several examples of current and past generation AMD 3D V-Cache CPUs. Prototype Ryzen 7000-series Zen 4 designs were shown off by principal engineer Amit Mehra and technical team member Bill Alverson. They also brought out older 5000-series Zen 3 units that never reached retail—the 16-core Ryzen 9 5950X3D was demonstrated as having a 3.5 GHz base clock, and it can boost up to 4.1 GHz. The 12-core Ryzen 9 5900X3D had 3.5 GHz base and 4.4 GHz boost clocks.

Team Red only sells one AM4 3D V-Cache model at the moment, in the form of its well received Ryzen 7 5800X3D CPU. It was released over a year ago, but recent price cuts have resulted in increased unit sales—system builders looking to maximize the potential of their older generation Ryzen 5000-series compatible mainboards are snapping up 5800X3Ds. AMD could be readying a cheaper alternative, with previous reports proposing that a "Ryzen 5 5600X3D" is positioned to take on Intel's 13th Gen Core i5 series (with DDR4). The unreleased Ryzen 9 5950X3D and 5900X3D have 3D V-Cache stacks on both of their CCDs (granting 192 MB of L3 cache), which is unique given that all retail 3D V-Cache CPUs (released so far) restrict this to a single CCD stack. Apparently AMD decided to stick with the latter setup due to it offering the best balance of performance and efficiency, plus gaming benchmarks demonstrated that there was not much of a difference between the configurations.

Harukaze5719 has brought attention to a curious registration of unreleased AsRock graphics cards at the Eurasian Economic Commission (ECC) regulatory office. The self-described (South) Korean PC Tech enthusiast has found out that ASRock is likely preparing for an imminent launch of custom design AMD Radeon RX 7800 XT PG 16 GB and RX 7800 XT PGW 16 GB models.

No specifications were found in the ECC registration, so it is too early to confirm whether the leaked RX 7800 XT series is based on AMD's RDNA 3 Navi 31 or Navi 32 GPU. Igor Lab's simulated a hypothetical version via the benchmarking of a workstation Radeon Pro W7800 (Navi 31) 32 GB graphics card. Model codes (registered on May 18 2023) indicate that the two AsRock Radeon RX 7800 XT models could sport the company's Phantom Gaming (PG) triple-fan cooling solution, possibly available in a standard shade or a (PGW) white option.

AMD recently revealed its Instinct MI300X GPU at their Data Center and AI Technology Premiere event on Tuesday (June 15). The keynote presentation did not provide any details about the new accelerator model's power consumption, but that did not stop one tipster - Hoang Anh Phu - from obtaining this information from Team Red's post-event footnotes. A comparative observation was made: "MI300X (192 GB HBM3, OAM Module) TBP is 750 W, compared to last gen, MI250X TBP is only 500-560 W." A leaked Giga Computing roadmap from last month anticipated server-grade GPUs hitting the 700 W mark.

NVIDIA's Hopper H100 took the crown - with its demand for a maximum of 700 W - as the most power-hungry data center enterprise GPU until now. The MI300X's OCP Accelerator Module-based design now surpasses Team Green's flagship with a slightly greater rating. AMD's new "leadership generative AI accelerator" sports 304 CDNA 3 compute units, which is a clear upgrade over the MI250X's 220 (CDNA 2) CUs. Engineers have also introduced new 24G B HBM3 stacks, so the MI300X can be specced with 192 GB of memory (as a maximum), the MI250X is limited to a 128 GB memory capacity with its slower HBM2E stacks. We hope to see sample units producing benchmark results very soon, with the MI300X pitted against H100.

AMD today released a one-off driver update specifically for the Radeon RX 7600 graphics card, with optimization for F1 23 (besides features consistent with the most recent AMD Software Adrenalin 23.5.2. Besides this optimization, the company released a couple of fixes specific to the RX 7600: sub-optimal performance or stuttering noticed in some VR games; and an intermittent application crash with Blender. The company also released AMD Software Adrenalin 22.40.57.06 for other cards (that's RX 7000 and older except RX 7600); with F1 23 optimization. Since this driver release isn't from AMD's main Adrenalin software trunk, we are not hosting it.

DOWNLOAD: AMD Software 23.10.01.37 for F1 23 on Radeon RX 7600 | AMD Software 22.40.57.06 for F1 23 on other Radeon SKUs

Simply NUC, Inc, a leading mini computer solutions company, today announced a new Simply NUC designed and branded mini PC product family called Moonstone. Equipped with the latest AMD Ryzen 7000 processors in a compact 4x4 design with an innovative cooling solution, Moonstone delivers top-tier computing performance for a wide range of usages. Supporting up to 64 GB of DDR5-4800 high-speed RAM and up to 16 TB of storage, Moonstone will increase your computing output while keeping a minimal footprint on both your desk and energy bill.

"Perfect for working or gaming, we saw an opportunity to set the new standard of innovation-driven mini PC performance," said Aaron Rowsell, Simply NUC co-CEO, "Moonstone is the highest performing 4x4 ever launched."

An AMD Navi 32 die was belatedly observed in a Forbes video feature on the company's CEO and President Lisa Su—this small tidbit fired up the PC hardware community once again with speculation about why Team Red has not yet released proper mid-range RDNA 3 game-oriented models. A handful of news sites have recently reported that a Navi 32 GPU sits at the heart of AMD's fairly new workstation-grade AMD Radeon Pro W7800 32 GB GDDR6 graphics card, but fact checkers have quickly pointed out that the $2499 (MSRP) product is actually based on Navi 31. Sites have theorized about the makeup of a possible "Radeon RX 7800" GPU and assumed that a similarly named/numbered workstation model would offer a preview of things to come.

Igor Wallossek (of Igor's Lab fame) has conducted an interesting investigation into this matter. He has put a Radeon Pro W7800 test unit through its paces as a gaming card, but the high-end nature of the Navi 31 GPU leads him to believe that the performance level on tap would be roughly equivalent to a hypothetical "RX 7800 XT." Igor assumes that his simulated gaming card will have access to a smaller pool of VRAM (16 GB instead of 32 GB)—he achieves this via the memtestcl program, since "RDNA 3 no longer allows us to emulate the cards directly." He also sets provisions for differing power consumption due to the workstation card being an efficiency-focused product: "The Radeon Pro W7800 has a TBP of 260 watts, my own extrapolation results in a TBP of around 270 watts for the RTX 7800XT based on the efficiency values of the other two Navi 31 cards."

Razer today launched the 2023 Razer Blade 14. This segment-disruptive 14-inch notebook packs gaming performance comparable to much thicker enthusiast-class notebooks; in a thin-and-light form-factor comparable to business/commercial notebooks. Across the market landscape, the Razer Blade 14 is designed to compete with the Apple MacBook Pro of a comparable screen size. Razer is timing launch of this notebook with that of the AMD Ryzen 7040HS "Phoenix" processor, because it's based on one. The notebook measures 31 cm x 22.8 cm x 1.79 cm (WxDxH with lid closed), and is 11.5% thinner than the 2022 Razer Blade 14. It's also 9% lighter, at 1.83 kg. Despite its size, the notebook packs a 68.1 Wh battery, which when paired with the rather high-end hardware, offers up to 10 hours of productivity.

Under the hood, the Razer Blade 14 (2023) rocks an AMD Ryzen 9 7940HS "Phoenix" processor, with an 8-core/16-thread "Zen 4" CPU, Ryzen AI accelerator, and Radeon 780M (12 CU) integrated graphics. The main graphics muscle, though, is the GeForce RTX 4070 Ada with 140 W TGP. The notebook provides the ability to switch between the discrete- and integrated graphics. The notebook also comes with two DDR5 SO-DIMM slots for up to 64 GB of socketed DDR5 memory; and an M.2-2280 Gen 4 NVMe slot for the main storage, a Gen 4 SSD. The WLAN module is also socketed, and offers Wi-Fi 6E and Bluetooth 5.2. The display is a 14-inch, 16:10 aspect-ratio QHD+ (2560 x 1600 pixels) unit, with 240 Hz refresh rate, and 3 ms response time. The display has 500 nits maximum brightness.

AMD today launched its Ryzen 7040HS line of mobile processors targeting consumer notebooks of conventional thickness and portability, which AMD considers thin-and-light. This class of devices is positioned between ultraportable notebooks, and gaming notebooks or portable workstations. AMD already powers several segments of gaming notebooks and portable workstations with its Ryzen 7045HX series "Dragon Range" mobile processors, with CPU core counts ranging between 6 and 16; as well as the ultraportable segment with the Ryzen 7040U series; but while the 7045 series have their TDP rated in the 45 W to 65 W range, and the Ryzen 7040U in the 15 W to 28 W range, the company was lacking a current-generation processor lineup in the 35 W to 54 W segment, which the company is filling up with today's Ryzen 7040HS series launch.

The Ryzen 7040HS series processors are based on the 4 nm "Phoenix" monolithic silicon, just like the 7040U series, and is based on a combination of "Zen 4" microarchitecture for its CPU, RDNA3 graphics architecture for its iGPU, and the new XDNA architecture for its Ryzen AI on-chip accelerator. Physically, the "Phoenix" silicon features an 8-core/16-thread "Zen 4" CPU. Each core has 1 MB of dedicated L2 cache, and a 16 MB L3 cache is shared among the 8 cores. The iGPU features 12 RDNA3 compute units, which amount to 768 stream processors, along with 24 AI Accelerators (specific to the RDNA3 architecture); 24 Ray Accelerators, 48 TMUs, and 32 ROPs. The iGPU meets the full DirectX 12 Ultimate logo requirements. The Ryzen AI XDNA accelerator features 20 AI acceleration tiles, each with local memory.

AMD on Tuesday (June 13) launched the EPYC 9004 "Bergamo" 128-core/256-thread high density compute server processor, and with it, debuted the new "Zen 4c" CPU microarchitecture. A lot had been made out about Zen 4c in the run up to yesterday's launch, such as rumors that it is a Zen 4 "lite" core that has lesser number-crunching muscle, and hence lower IPC, and that Zen 4c is AMD's answer to Intel's E-core architectures, such as "Gracemont" and "Crestmont." It turns out that it's neither a lite version of Zen 4, nor is it an E-core, but a physically compacted version of the Zen 4 core, with identical number crunching machinery.

First things first—Zen 4c has the same exact IPC as Zen 4 (that's performance at a given clock-speed). This is because its front-end, execution stage, load/store component, and internal cache hierarchy is exactly the same. It has the same 88-deep load queue, 64-deep store queue, the same 675,000 µop cache, the exact same INT+FP issue width of 10+6, the same exact INT register file, the same scheduler, and cache latencies. The L1I and L1D caches are the same 32 KB in size as "Zen 4," and so is the dedicated L2 cache, at 1 MB.

Supermicro, Inc., a Total IT Solution Provider for Cloud, AI/ML, Storage, and 5G/Edge, is announcing that its entire line of H13 AMD based-systems is now available with support for 4th Gen AMD EPYC processors, based on "Zen 4c" architecture, and 4th Gen AMD EPYC processors with AMD 3D V-Cache technology. Supermicro servers powered by 4th Gen AMD EPYC processors for cloud-native computing, with leading thread density and 128 cores per socket, deliver impressive rack density and scalable performance with energy efficiency to deploy cloud native workloads in more consolidated infrastructure. These systems are targeted for cloud operators to meet the ever-growing demands of user sessions and deliver AI-enabled new services. Servers featuring AMD 3D V-Cache technology excel in running technical applications in FEA, CFD, and EDA. The large Level 3 cache enables these types of applications to run faster than ever before. Over 50 world record benchmarks have been set with AMD EPYC processors over the past few years.

"Supermicro continues to push the boundary of our product lines to meet customers' requirements. We design and deliver resource-saving, application-optimized servers with rack scale integration for rapid deployments," said Charles Liang, president, and CEO of Supermicro. "With our growing broad portfolio of systems fully optimized for the latest 4th Gen AMD EPYC processors, cloud operators can now achieve extreme density and efficiency for numerous users and cloud-native services even in space-constrained data centers. In addition, our enhanced high performance, multi-socket, multi-node systems address a wide range of technical computing workloads and dramatically reduce time-to-market for manufacturing companies to design, develop, and validate new products leveraging the accelerated performance of memory intensive applications."

ASRock Rack, the leading innovative server company, today announced its support of 4th Gen AMD EPYC processors with AMD "Zen 4c" architecture and 4th Gen AMD EPYC processors with AMD 3D V-Cache technology, as well as the expansion of their new products ranging from high-density storage, GPU, multi-nodes servers all for the new AMD processors.

"4th Gen AMD EPYC processors offer the highest core density of any x86 processor in the world and will deliver outstanding performance and efficiency for cloud-native workloads," said Lynn Comp, corporate vice president, Server Product and Technology Marketing, AMD. "Our latest family of data center processors allow customers to balance workload growth and flexibility with critical infrastructure consolidation mandates, enabling our customers to do more work, with more energy efficiency at a time when cloud native computing is transforming the data center."

Giga Computing, a subsidiary of GIGABYTE and an industry leader in high-performance servers, server motherboards, and workstations, today announced support for the latest 4th Gen AMD EPYC processors. The new processors, based on "Zen 4c" architecture and featuring AMD 3D V-Cache technology, enhance Giga Computing's enterprise solutions, enabling superior performance and scalability for cloud native computing and technical computing applications in GIGABYTE enterprise solutions. To date, more than thirty unique GIGABYTE systems and platforms support the latest generation of AMD EPYC 9004 processors. As time goes on Giga Computing will roll out more new GIGABYTE models for this platform, including more SKUs for immersion-ready servers and direct liquid cooling systems.

"For every new generation of AMD EPYC processors, GIGABYTE has been there, offering diverse platform options for all workloads and users," said Vincent Wang, Sales VP at Giga Computing. "And with the recent announcement of new AMD EPYC 9004 processors for technical computing and cloud native computing, we are also ready to support them at this time on our current AMD EPYC 9004 Series platforms."

TYAN, an industry-leading server platform design manufacturer and a subsidiary of MiTAC Computing Technology Corporation, today announced availability of high-performance server platforms supporting 4th Gen AMD EPYC processor for growing cloud native environments and 4th Gen AMD EPYC processors with AMD 3D V-Cache technology for technical computing applications.

"Data centers prioritize sustainability, offering an opportunity to improve efficiency and meet goals," said Eric Kuo, Vice President of MiTAC Computing Technology Corporation's Server Infrastructure Business Unit. "TYAN's server platforms, powered by 4th Gen AMD EPYC processors, contribute to environmental sustainability through power-efficient, high-performance solutions. Our leading workload performance enables efficient scale-out cloud-native workloads, achieving more with less power consumption."

Today, at the "Data Center and AI Technology Premiere," AMD announced the products, strategy and ecosystem partners that will shape the future of computing, highlighting the next phase of data center innovation. AMD was joined on stage with executives from Amazon Web Services (AWS), Citadel, Hugging Face, Meta, Microsoft Azure and PyTorch to showcase the technological partnerships with industry leaders to bring the next generation of high performance CPU and AI accelerator solutions to market.

"Today, we took another significant step forward in our data center strategy as we expanded our 4th Gen EPYC processor family with new leadership solutions for cloud and technical computing workloads and announced new public instances and internal deployments with the largest cloud providers," said AMD Chair and CEO Dr. Lisa Su. "AI is the defining technology shaping the next generation of computing and the largest strategic growth opportunity for AMD. We are laser focused on accelerating the deployment of AMD AI platforms at scale in the data center, led by the launch of our Instinct MI300 accelerators planned for later this year and the growing ecosystem of enterprise-ready AI software optimized for our hardware."

Today, at the "Data Center and AI Technology Premiere," AMD announced the addition of two new, workload optimized processors to the 4th Gen EPYC CPU portfolio. By leveraging the new "Zen 4c" core architecture, the AMD EPYC 97X4 cloud native-optimized data center CPUs further extend the EPYC 9004 Series of processors to deliver the thread density and scale needed for leadership cloud native computing. Additionally, AMD announced the 4th Gen AMD EPYC processors with AMD 3D V-Cache technology, ideally suited for the most demanding technical computing workloads.

"In an era of workload optimized compute, our new CPUs is pushing the boundaries of what is possible in the data center, delivering new levels of performance, efficiency, and scalability," said Forrest Norrod, executive vice president and general manager, Data Center Solutions Business Group, AMD. "We closely align our product roadmap to our customers' unique environments and each offering in the 4th Gen AMD EPYC family of processors is tailored to deliver compelling and leadership performance in general purpose, cloud native or technical computing workloads."

Forbes published its video interview with AMD CEO and President Lisa Su at the end of May, but it has taken two weeks for hardware news sites to realize that unreleased silicon was in plain view within the spotlight piece. Folks likely regarded it as a simple puff piece due to the title reading "This CEO Made AMD Billions - Now She Wants To Dominate The Market With AI." Hoang Anh Phu, a Vietnamese technology enthusiast, managed to pay close attention to a curious segment in the Forbes video and uploaded AI-upscaled screengrabs to Twitter along with the comment/question: "Navi 32 die shot(?!)."

RDNA3 Navi 31 and Navi 33 GPU products have already reached the retail market—AMD's high-end (chiplet design) Radeon RX 7900-series is based on the former and it launched last December. The latter arrived in the (monolithic N33 XL) form of Radeon RX 7600 cards at the end of May 2023. Even board partners are seemingly becoming impatient about a lack of new offerings in the mid-range—Sapphire is very likely to release another previous gen Radeon RX 6750 XT custom card this week in China. Team Red has not publicly acknowledged that Navi 32 is a work in-progress, so it is slightly odd that an example sat next to EPYC Genoa, Raphael, and Raphael X3D dies on a table—as spotted in the Forbes feature. Screenshots show an Infinity Cache setup with four memory stacks on a previously unseen die. Leaks have indicated that Navi 32 will be a chiplet design with a GCD (200 mm²) in the middle, surrounded by the four MCDs (37.5 mm²). The full package area size is eyeball estimated to occupy around 350 mm² of space, which corroborates info uncovered in the past.

Newegg is currently running a promo offer on an ASRock AMD Radeon RX 6600 Challenger D 8 GB graphics card—a code can be used at checkout to remove a further $20 from the already low retail base price of $199.99. Prices of this previous generation GPU are falling internationally, but Newegg's all-time-low price is only available to customers in North America. The recent launch of a successor (Radeon RX 7600) has ultimately caused retail outlets to lower their asking prices for older cards—VideoCardz notes that certain custom RX 6600 custom cards have dropped this week to around €209 in Europe, following consistent downward trends since new AMD and NVIDIA offerings hit the market in late May.

TPU's review of AMD's Radeon RX 7600 GPU states that this new lower end RDNA3 card offers a 25% gen-over-gen performance uplift versus RDNA2's RX 6600 (non-XT). The latter certainly offers excellent value at its current very low price on Newegg, with a saving of $90 over the RX 7600's steadfast MSRP of $269.99. Further drops are anticipated following the arrival of NVIDIA's GeForce RTX 4060 (non-Ti) on June 29, but Newegg's next batch of promotional codes could be less generous with discounts by then.

AMD today announced its Ryzen PRO 7040 line of processors for the all-important commercial notebook segment. A commercial notebook is a class of notebook that are purchased in large quantities by businesses or government organizations, to be handed out to their employees. The key distinction from consumer notebooks is their in-built security and remote-management features that let the organization remotely handle user credentials, securely store company data, and remotely deploy software updates. Most importantly, the organization maintains ownership over the device and can remotely de-activate it at whim. This is a particularly important market segment for both AMD and Intel (which sells 13th Gen Core vPro processors). AMD's launch today includes Ryzen PRO 7040 series mobile processors for both the 15 W to 28 W ultraportable, and 35 W to 55 W thin-and-light (mainstream) commercial notebook form-factors.

At the heart of the Ryzen PRO 7040 series processors is the 4 nm "Phoenix" silicon, which combines the "Zen 4" microarchitecture for the CPU, with RDNA3 graphics architecture for the iGPU, and introduces the Ryzen AI on-die accelerator based on the Xilinx-designed XDNA architecture, to the commercial notebook segment. The silicon physically features an 8-core/16-thread "Zen 4" CPU, with several processor models boosting to the 5.00 GHz-mark. Each core has 1 MB of dedicated L2 cache, and the eight cores share a 16 MB L3 cache. The iGPU meets full DirectX 12 Ultimate logo requirements, and features 12 RDNA3 compute units, which work out to 768 dual issue-rate stream processors, 24 AI Accelerators (intrinsic to RDNA3 and not related to Ryzen AI); and 12 Ray Accelerators, besides 48 TMUs and industry-leading 32 ROPs. AMD is backing the iGPU on these processors with AMD Software PRO (the same class of drivers as Radeon PRO GPUs), which come with superior support from AMD, and special packages for remote deployment by organizations.

In addition to the Ryzen PRO 7045 series mobile processors for commercial notebooks, AMD announced the Ryzen PRO 7000 processors for commercial desktops. These are desktops deployed by medium-large businesses and enterprises in their offices, which remain connected to the enterprise network at all times, and require remote management and security features. This particular segment is addressed by Intel using its 13th Gen Core vPro processors. The Ryzen PRO 7000 processors are based on the Socket AM5 platform, which is ready for next-generation connectivity. AMD is also introducing a new motherboard chipset to go with these processors, although they are compatible with consumer AMD 600-series chipset motherboards.

The Ryzen PRO 7000 series processor models being launched today are based on the "Raphael" MCM, which depending on the model, comes with one or two 5 nm "Zen 4" CCDs, and a 6 nm I/O die. What makes these processors especially formidable compared to past attempts by AMD at commercial desktop processors, is that while the previous-generation chips were based on monolithic APU dies for their integrated graphics; these chips are based on the full-featured MCM for this generation, with integrated graphics as standard. AMD's decision to make integrated graphics standard should prove particularly helpful for adoption in the commercial desktop space.

Samsung Electronics today announced the global launch of the Odyssey OLED G9 gaming monitor (G95SC model), which has been enhanced with next-level AI upscaling technology. Building on the success of last year's Odyssey OLED G8 (G85SB), the new monitor joins the lineup to open a new era of OLED gaming. "Last year, Samsung addressed the demands and expectations of even the most experienced gamers with the launch of the Odyssey OLED G8," said Hoon Chung, Executive Vice President of the Visual Display Business at Samsung Electronics. "With the introduction of the Odyssey OLED G9, equipped with unrivaled picture quality, we are excited to offer our customers these powerful gaming monitors and raise the bar for OLED gaming."

Measuring 49 inches in size with a 1800R curvature, the Odyssey OLED G9 is the first OLED monitor to offer Dual Quad High Definition (DQHD; 5,120 x 1,440) resolution with a 32:9 ratio. The large and wide screen ratio enable users to lose themselves in super-ultrawide vistas—equivalent to two QHD screens side by side. At the same time, its rapid 0.03 ms gray-to-gray (GtG) response time and 240 Hz refresh rate offer players a competitive edge.

AMD's RDNA3 Navi 32 GPU is reportedly in the works, but PC hardware enthusiasts are getting frustrated with the lack of announcements in regards to Team Red's supposed mid-to-high level "Radeon RX 7700 & 7800 series" card offerings. Current generation options are only available in the form of pricey flagship models - RX 7900 XT and XTX, as well as the recently released lower end RX 7600, with nothing classed as brand new appearing in the middle ground. Notable AMD board partner Sapphire Technology is also getting impatient with this situation and has decided to dip back into RDNA2—technology news site ITHome has discovered that the company is releasing another Radeon RX 6750 XT 12 GB GDDR6 card. This third variant follows previously issued NITRO+ and Pulse models.

Sources have indicated that this new model is called the "Overseas Edition," so it is possible that it will be getting international distribution. Sapphire's custom card has not hit the South East Asia market yet, and the company has not created (at the time of writing) an entry for it on their website or product catalog. ITHome reckons that the Radeon RX 6750 XT Overseas Edition will likely get a retail release to coincide with this week's 618 shopping festival. The card seems to offer a marginal performance advantage (0.9% factory set overclock) over AMD's reference specs—with a 2623 MHz boost clock. It shares the same features as its NITRO+ sibling—namely a Dual BIOS switch and two power connectors.

ASUS today announced ESC N8-E11, its most advanced HGX H100 eight-GPU AI server, along with a comprehensive PCI Express (PCIe) GPU server portfolio—the ESC8000 and ESC4000 series empowered by Intel and AMD platforms to support higher CPU and GPU TDPs to accelerate the development of AI and data science.

ASUS is one of the few HPC solution providers with its own all-dimensional resources that consist of the ASUS server business unit, Taiwan Web Service (TWS) and ASUS Cloud—all part of the ASUS group. This uniquely positions ASUS to deliver in-house AI server design, data-center infrastructure, and AI software-development capabilities, plus a diverse ecosystem of industrial hardware and software partners.

AMD is finally coming around to the idea of a 6-core processor with 3D Vertical Cache technology, only this time it's for the older Socket AM4 platform. The new Ryzen 5 5600X3D could be positioned competitively against the lower end of Intel's 13th Gen Core i5 processor series, so it could attract a class of DIY gaming PC builders that can take advantage of cheap Socket AM4 motherboards and DDR4 memory to build formidable mainstream gaming PC builds.

The Ryzen 5 5600X3D is based on the same "Vermeer" 3DV cache MCM as the 5800X3D. It is a 6-core/12-thread processor with a base frequency of 3.30 GHz, and 4.40 GHz boost, which are both 100 MHz less than those of the 5800X3D. The processor gets the full 96 MB of last-level cache (that's 32 MB of on-die L3 cache + 64 MB of 3DV cache), which the 5800X3D offers. It bears the OPN "100-000001176." The company didn't reveal pricing, but given that the 5800X3D can be had for as low as $290, the 5600X3D could possibly target a $200-225 price, making it an attractive option, given that you can pair it with even cheap B450 chipset motherboards priced well under $100, and 32 GB of DDR4 memory that can be had around the $60-mark. The 5600X3D could also provide an affordable upgrade path to those still on the AM4 platform, with Ryzen 3000-series processors.