ASUS today announced ExpertCenter PN53, a mini PC that harnesses the power of the latest AMD Ryzen 7000 series processors and AMD Radeon 600M series graphics. ExpertCenter PN53 features a triple-storage design that can accommodate a variety of storage combinations. Two PCIe 4.0 M.2 SSDs and DDR5 memory ensure fast boot-up and app loading times. In addition, ExpertCenter PN53 includes cleverly designed cooling features, AI-powered noise-cancelation technology for improved voice communications, and can support a single 8K monitor or up to four 4K monitors.

ExpertCenter PN53 offers up to 34% better single-thread performance and up to a 29% boost in multithread performance, compared to the previous PN51 model. In PCMark 10 Essentials group tests, ExpertCenter PN53 showed a 10% improvement in web browsing, videoconferencing, and app start-up times. It also performed 10% better than ExpertCenter PN51 in the Productivity test group that measures system performance with everyday office applications, including spreadsheets and writing workloads.

AMD today released its Ryzen 7040U series "Zen 4" mobile processors for the Ultraportable segment. These are processors with a 15 W TDP that's configurable up to 30 W by notebook designers to enable better boost frequency residency. AMD technically announced its entire Ryzen 7040 series at the 2023 International CES, but put out details for only the 7040HS series with a 28 W to 45 W TDP targeting thin-and-light and mainstream notebook form-factors. This would be the first time we're seeing details of the 7040U series. The company announced that processors in the 7040U series are shipping to notebook manufacturers, but it did not put out a specific date on which you can buy notebooks powered by these processors.

The Ryzen 7040U series consists of four processor models (SKUs). The lineup is led by the Ryzen 7 7840U, followed by the Ryzen 5 7640U, the Ryzen 5 7540U, and has the Ryzen 3 7440U at the entry level. All four processor models offer the latest "Zen 4" CPU cores and RDNA3 graphics. The Ryzen 7 7840U packs an 8-core/16-thread CPU clocked at 3.30 GHz with up to 5.10 GHz boost frequency. The Ryzen 5 7640U has a 6-core/12-thread CPU clocked at 3.50 GHz with up to 4.90 GHz boost. The Ryzen 5 7540U differs from the 7640U not just in slightly lower CPU clock speeds—3.20 GHz with up to 4.90 GHz boost—but also the lack of the XDNA Ryzen AI feature. The Ryzen 3 7440U has a leaner CPU still, with just 4-core/8-thread, clocked at 3.00 GHz with up to 4.70 GHz boost, half the shared L3 cache size of the other three models, and a lack of Ryzen AI.

AMD has already announced that its Ryzen 7040HS laptop processors will be shipping in April, missing its original March date. As these are still nowhere to be seen on retail/e-tail shelves, AMD has now confirmed these chips have shipped to OEMs, and it is just a matter of time before these laptops become available.

Speaking to Tom's Hardware, AMD representative confirmed that the company has start to ramp production of Ryzen 7040 series chips, started shipping those chips last quarter, and the first Ryzen 7040HS systems should hit retail/e-tail "over the next several weeks". As said, it appears that AMD's original statement regarding the delay was about shipping those chips to OEMs, rather than OEMs shipping actual products.

A bunch of unreleased AMD Radeon RX 7000 series graphics card have been spotted in ROCm 5.6 pull request, including the Radeon RX 7950 XTX, 7950 XT, 7800 XT, 7700 XT, 7600 XT, and 7500 XT. AMD has not yet launched its mainstream Radeon RX 7000 graphics cards, but according to the latest pull request, there are several unreleased graphics cards in for both high-end and mainstream segments. While the pull request has been removed from GitHub, it has been saved on Reddit. So far, it appears that AMD's RDNA 3 Radeon 7000 series lineup will be based on just three GPUs, Navi 33, Navi 32, and the Navi 31.

According to the list, we can expect a high-end refresh with Radeon RX 7950 XTX/XT version, also based on Navi 31 GPU. The list also shows that the Radeon RX 7800 series will be the only one based on the Navi 32 GPU, at least for now, while the Navi 33 GPU should cover the entire mainstream lineup, including the Radeon RX 7700 series, Radeon RX 7600 series, and the Radeon RX 7500 series. The list only includes XT versions, while non-XT should show up later, as it was the case with the Radeon RX 6000 series graphics cards. AMD's President and CEO, Dr. Lisa Su, already confirmed during Q1 2023 earnings call that mainstream Radeon RX 7000 series GPUs based on RDNA 3 architecture will launch during this quarter, and earlier rumors suggest we might see them at Computex 2023.

In a blog post, NVIDIA claims that its AV1 video encoder is vastly superior in terms of quality, compared to both AMD and Intel's alternatives. The still shot provided by NVIDIA to show its superior quality over its competitors, was encoded at 4K60p, obviously using the AV1 codec. Nvidia used its own GeForce RTX 4080 card and compared it to an AMD Radeon RX 7900 XT and an Intel Arc A770, with all three cards encoding the video at 12 Mbps using the latest release of OBS Studio.

It just so happens that OBS Studio 29.1 added support for AV1 over the Enhanced Real-Time Messaging Protocol (RTMP) and now allows for live streaming using AV1 to YouTube. This is also the main reason for the NVIDIA blog post, as prior to this release, it wasn't possible to stream using AV1 in OBS Studio. NVIDIA has been known for the quality of its video encoder for quite some time, but we'd like to see some independent testing before we give NVIDIA the win here, especially as the company has only provided a single screenshot as proof of its superiority.

AMD's upcoming Radeon RX 7800 XT has made an appearance online, having been tested in Geekbench. The entire system appears to be some kind of internal test system at AMD, as it's listed as "Advanced Micro Devices X670_E7" on Geekbench. The system consists of an AMD Ryzen 9 7950X CPU paired with what should be 64 GB of RAM and oddly enough running Debian Linux. It's also entirely possible that this is a fake submission, which makes somewhat sense considering the weak performance. The Radeon RX 7800 XT was tested using the Vulkan test in Geekbench and you can find the numbers below.

Overall, the card scored 113,819 points in the Vulkan test, which is close to what an AMD Radeon RX 6700 XT scores on an older Ryzen 7 5700X system with 32 GB of RAM, so not too much should be read into the performance figures here. However, this gives us the first indication that AMD is readying its RX 7800 XT GPUs—assuming it's a real submission—which may or may not be announced at Computex later this month. However, there have been rumours that the RX 7800 XT has been pushed back, with the lower-end cards launching first, but we don't have long until we find out at least.

AMD CEO Dr Lisa Su, in her Q1-2023 Financial Results call with investors and analysts, confirmed that the company plans to expand the Radeon RX 7000 series with the addition of new "mainstream" GPUs based on the RDNA3 graphics architecture in this quarter (Q2-2023). This confirms the launch of the Radeon RX 7600 XT later this month, but could also hint at other SKUs the company considers mainstream, such as the RX 7500 XT. AMD has for long considered the RX x700 series as performance-segment, and the RX 7600 XT launch right after the high-end RX 7900 series would hint that the company is still figuring out the economics of its RX 7700 series and RX 7800 series.

"In gaming graphics, channel sell-through of our Radeon 6000 and Radeon 7000 series GPUs increased sequentially. We saw strong sales of our high-end Radeon 7900 XTX GPUs in the first quarter, and we're on track to expand our RDNA 3 GPU portfolio with the launch of new mainstream Radeon 7000 series GPUs this quarter," said Dr Lisa Su. With GPU prices in free-fall since the GPU-accelerated crypto-mining crash, AMD is in the process of clearing out its Radeon RX 6000 series inventory as it creates room for the RX 7000 series. Enthusiast-segment SKUs of the yesteryear, such as the RX 6900 series, could be had at prices under $600.

Researchers at the Technical University of Berlin have published a paper called "faulTPM: Exposing AMD fTPMs' Deepest Secrets," highlighting AMD's firmware-based Trusted Platform Module (TPM) is susceptible to the new exploit targeting Zen 2 and Zen 3 processors. The faulTPM attack against AMD fTPMs involves utilizing the AMD secure processor's (SP) vulnerability to voltage fault injection attacks. This allows the attacker to extract a chip-unique secret from the targeted CPU, which is then used to derive the storage and integrity keys protecting the fTPM's non-volatile data stored on the BIOS flash chip. The attack consists of a manual parameter determination phase and a brute-force search for a final delay parameter. The first step requires around 30 minutes of manual attention, but it can potentially be automated. The second phase consists of repeated attack attempts to search for the last-to-be-determined parameter and execute the attack's payload.

Once these steps are completed, the attacker can extract any cryptographic material stored or sealed by the fTPM regardless of authentication mechanisms, such as Platform Configuration Register (PCR) validation or passphrases with anti-hammering protection. Interestingly, BitLocker uses TPM as a security measure, and faulTPM compromises the system. Researchers suggested that Zen 2 and Zen 3 CPUs are vulnerable, while Zen 4 wasn't mentioned. The attack requires several hours of physical access, so remote vulnerabilities are not a problem. Below, you can see the $200 system used for this attack and an illustration of the physical connections necessary.

AMD (NASDAQ:AMD) today announced revenue for the first quarter of 2023 of $5.4 billion, gross margin of 44%, operating loss of $145 million, net loss of $139 million and diluted loss per share of $0.09. On a non-GAAP basis, gross margin was 50%, operating income was $1.1 billion, net income was $970 million and diluted earnings per share was $0.60.

"We executed very well in the first quarter as we delivered better than expected revenue and earnings in a mixed demand environment," said AMD Chair and CEO Dr. Lisa Su. "We launched multiple leadership products and made significant progress accelerating our AI roadmap and customer engagements in the quarter. Longer-term, we see significant growth opportunities as we successfully deliver our roadmaps, execute our strategic data center and embedded priorities and accelerate adoption of our AI portfolio."

GIGABYTE TECHNOLOGY Co. Ltd, a leading manufacturer of motherboards, graphics cards, and hardware solutions, announced today that its AMD AM5 platform with X670, B650 and A620 motherboards now support 24 GB and 48 GB DDR5 memory modules after a BIOS update. This update increases the maximum RAM support up to 192 GB across four DIMMs, and up to 96 GB across two DIMMs from the previous maximums of 128 GB and 64 GB, respectively.

By enabling support for non-binary memory on both AMD EXPO and Intel XMP platforms, GIGABYTE motherboards now offer an effortless boost in memory capacity and system performance. This translates to improved multitasking and productivity for gamers and other users with demanding RAM needs. If you want to experience the benefits of this upgrade, get your GIGABYTE motherboard today.

Overclocking expert Roman "der8auer" Hartung has unveiled the new Ryzen 7000 direct die water block, the AM5 Mycro Direct Die cooler. The new direct die water block promises significantly lower temperatures compared to all-in-one (AiO) liquid coolers.

Of course, users will have to remove the Ryzen 7000 series IHS in order for the block to be in direct contact with the processor, or more precisely, chiplets on the AMD Ryzen 7000 series CPUs. It works with Der8auer's high-performance heatspreader. As tested on the AMD Ryzen 9 7900X CPU, the new Mycro Direct Die cooler can lower the temperature down to 65°C, which is significantly lower than standard 280 mm AiO coolers. The Mycro Direct Die cooler shows its true cooling potential on overclocked CPUs, offering up to 28°C lower temperatures.

As expected with AMD's activity on GitHub, ROCm 5.5 has now been officially released. It brings several big changes, including better RDNA 3 support. While officially focused on AMD's professional/workstation graphics cards, the ROCm 5.5 should also bring better support for Radeon RX 7000 series graphics cards on Linux.

Surprisingly, the release notes do not officially mention RDNA 3 improvements in its release notes, but those have been already tested and confirmed. The GPU support list is pretty short including AMD GFX9, RDNA, and CDNA GPUs, ranging from Radeon VII, Pro VII, W6800, V620, and Instinct lineup. The release notes do mention new HIP enhancements, enhanced stack size limit, raising it from 16k to 128k, new APIs, OpenMP enhancements, and more. You can check out the full release notes, downloads, and more details over at GitHub.

AMD has reportedly signed up with Samsung Electronics to shift some of its 4 nm processor silicon fabrication from TSMC. The apex Taiwan-based foundry is reportedly operating at capacity for its 4 nm-class nodes, with customers such as Apple and Qualcomm sourcing 4 nm mobile SoCs on the node, leaving AMD with limited allocation and/or bargaining power with TSMC. The company relies on 4 nm for its Ryzen 7040 series "Phoenix" mobile processors, and is in the process of adapting its design for Samsung's 4 nm-class nodes (of which there are five types for AMD to choose from).

Switching to Samsung probably gives AMD more scalability, particularly given that "Phoenix" has missed its release timeline, leaving AMD with the 5 nm + 6 nm Ryzen 7045 series "Dragon Range" MCM in the premium segments, and older 6 nm 7035 series "Rembrandt-R" in the mainstream and ultraportable segments, but nothing "apt" to compete against Intel "Raptor Lake-U" and "Raptor Lake-P." AMD has a limited window in which to ramp up "Phoenix," as Intel readies "Meteor Lake" for a 2H-2023 debut, with a focus on mobile variants.

AMD is late in releasing its Phoenix Zen 4 lineup of mobile APUs - the original April launch has been missed, and laptops bearing Ryzen 7000HS & H-series are expected to arrive at some point this month. Preview hardware has made its way into the hands of testers, and one particular outlet - Golden Pig Upgrade, a content creator on the Chinese Bilibili video site - has performed benchmark tests. He seems to be the first reviewer to get hands-on time with AMD Ryzen 7040 Phoenix APUs, and his findings point to class leading performance results in terms of graphical capabilities - the 7840HS (packing a Radeon 780M RDNA3 iGPU) is compared to the Rembrandt-based 7735H, as well as a pair of Intel Raptor Lake CPUs - the 13700H and 13500H models.

AMD's newest Phoenix APU is the group leader in GPU performance stakes, but the jump up from the last-gen Rembrandt (RDNA2 iGPU) chip is not all that significant. VideoCardz reckons that the Radeon 780M integrated GPU is roughly equivalent to an NVIDIA GeForce MX550 dGPU and not far off from a GeForce GTX 1650 Max-Q graphics card (in terms of benchmark performance). According to AMD's internal documentation the RDNA 3 core architecture utilized in Phoenix APUs is referred to as "2.5" so this perhaps explains why the 780M is not doing laps around its older silbing(s).

DigiTimes has been informed that many of TSMC's customers are likely to postpone usage of the foundry's 3 nm process node into 2024 or beyond, due to a slowdown in the PC hardware market - insider sources suggest that AMD will be sticking with 4 nm and 6 nm nodes for many of its future CPU lineups. The next generation Zen 5-based family is expected to launch in 2024 - which aligns with information issued by AMD via financial reports - a roadmap (based on DigiTime's findings) points to AMD offering a range of mainstream desktop (Granite Ridge) and laptop/mobile CPUs (Fire Range).

No high-end desktop (HEDT) options are marked for release in 2024, and DigiTimes reckons that AMD is planning to release Zen 5-based Ryzen Threadripper processors in the following year. The codename for the Ryzen Threadripper 8000-series seems to be "Shimada Peak" and industry experts think that these HEDT CPUs will eventually succeed the Threadripper "Storm Peak" 7000 family (due for launch later in 2023) - a shared socket design is also a likelihood due to AMD wanting to stretch out the lifespan of mounting connection standards by avoiding costly decisions - their sTRX4/SP3r3 socket only survived for one generation.

Keen-eyed hardware tipster momomo_us this week spotted that an upcoming AMD data center "Siena Dense" CPU has received verification, in the general sense, for SATA and PCI support - courtesy of the Serial ATA International Organization (SATA-IO). The information dump was uploaded to SATA-IO's online database on April 6 of this year - under the heading: "AMD EPYC 8004 Series Processors." As covered by TPU mid-way through this month the family of enterprise-grade processors, bearing codename Siena, is expected to be an entry-level alternative to the EPYC Genoa-X range, set for launch later in 2023.

The EPYC Siena series is reported to arrive with a new socket type - SP6 (LGA 4844) - which is said to be similar in size to the older Socket SP3. The upcoming large "Genoa-X" and "Bergamo" processors will sit in the already existing Socket SP5 (LGA 6096) - 2022's EPYC Genoa lineup makes use of it already. AMD has not made its SP6 socket official to the public, but industry figures have been informed that it can run up to 64 "Zen 4" cores. This new standard has been designed with more power efficient tasks in mind - targeting intelligent edge and telecommunication sectors. The smaller SP6 socket will play host to CPUs optimized for as low as 70 W operation, with hungrier variants accommodated up to 225 W. This single platform solution is said to offer 6-channel memory, 96 PCIe Gen 5.0 lanes, 48 lanes for CXL V1.1+, and 8 PCIe Gen 3.0 lanes.

AMD's marketing department this week continued its battle to outwit arch rival NVIDIA in GPU VRAM pricing wars - Sasa Marinkovic, a senior director at Team Red's gaming promotion department, tweeted out a simple and concise statement yesterday: "Our @amdradeon 16 GB gaming experience starts at $499." He included a helpful chart that lines up part of the AMD Radeon GPU range against a couple of hand-picked NVIDIA GeForce RTX cards, with emphasis on comparing pricing and respective allotments of VRAM. The infographic indicates AMD's first official declaration of the (last generation "Big Navi" architecture) RX 6800 GPU bottoming out at $499, an all time low, as well as hefty cut affecting the old range topping RX 6950 XT - now available for $649 (an ASRock version is going for $599 at the moment). The RX 6800 XT sits in-between at $579, but it is curious that the RX 6900 XT did not get a slot on the chart.

AMD's latest play against NVIDIA in the video memory size stake is nothing really new - earlier this month it encouraged potential customers to select one of its pricey current generation RX 7900 XT or XTX GPUs. The main reason being that the hefty Radeon cards pack more onboard VRAM than equivalent GeForce RTX models - namely the 4070 Ti and 4080 - therefore future-proofed for increasingly memory hungry games. The latest batch of marketing did not account for board partner variants of the (RDNA3-based) RX 7900 XT GPU selling for as low as $762 this week.

AOKZOE is trying to drum up interest for its latest handheld gaming console - the A1 Pro - with a countdown to a type of early bird sale starting tomorrow. Early adopters will be offered a special starter price of just $799 for the baseline version, and that cost of entry will climb to $999 later on at retail. AOKZOE boasts that the A1 Pro is the first handheld gaming device to pack an AMD 7 7840U APU - a customized version of this SoC (AMD Z1 processor series) is set to debut as part of the ASUS ROG Ally handheld system. The current AOKZOE A1 model is powered by an older AMD Ryzen 7 6800U APU, which sat at the heart of various laptops and mobile gaming devices in 2022. This year's A1 Pro models are powerful enough to take on Valve's Steam Deck (and the previously mentioned ROG Ally) thanks to impressive internal specifications - AOKZOE reckons that the Pro upgrade offer a 20% performance leap over previous gen devices (6800U).

The Zen 4-based Ryzen 7 7840U APU, part of the "Phoenix" range of mobile processors, is available in all configurations of the A1 Pro - the base model gets 32 GB of memory and 512 GB of storage, and the headliner has 64 GB of memory and 2 TB of storage. AOKZOE states that the A1 Pro utilizes the LPDDR5-6400 RAM and PCIe 3.0 x4 standards - their handheld system is also capable of running M.2 2280 PCIe 4.0 drives. The A1 Pro features an 8-inch FHD (1920 x 1200) IPS display - its nearest rivals have smaller 7-inch screens. Hardcore game controller enthusiasts will be happy to discover that hall effect sensor technology has been integrated into the new handheld's pair of analog sticks.

The 43rd edition of the Symposium on VLSI Technology & Circuits, held annually in Kyoto Japan, is charting the way forward for the devices of the future. Held between June 11-16, 2023, this year's symposium will see structured presentations, Q&A, and discussions on some of the biggest technological developments in the logic chip world. The lead (plenary) sessions drop a major hint on the way the wind is blowing. Leadning from the front is an address by Suraya Bhattacharya, Director, System-in-Package, A*STAR, IME, on "Multi-Chiplet Heterogeneous Integration Packaging for Semiconductor System Scaling."

Companies such as AMD and Intel read the tea-leaves, that Moore's Law is buckling, and it's no longer economically feasible to build large monolithic processors at the kind of prices they commanded a decade ago. This has caused companies to ration their allocation of the latest foundry node to only the specific components of their chip design that benefit the most from the latest node, and identify components that don't benefit as much, and disintegrate them into separate dies build on older foundry nodes, which are then connected through innovative packaging technologies.

According to investigations undertaken by Igor's Lab and Hardware Busters this week it seems that AMD's problematic lineup of Ryzen 7000 & Ryzen 7000X3D CPUs are consuming unexpected levels of power in short bursts when running in idle mode. In conducting more in-depth tests over the past few days, Igor Wallossek and (outgoing TPU PSU expert) Aristeidis Bitziopoulos have both found that that the aforementioned AMD processors are producing (to the testers' slight concern) power spikes in situations involving minimal computing activity. It is not currently known whether the sharp climbs in power consumption are in any way related to the burnout issues experienced by unlucky overclockers this week.

Aris/crmaris (at Hardware Busters) says that he has tested many of the affected processors in the past, but was not privy to any major problems relating to burnout or power consumption spikes. By running new tests this week, using his own Powenetics v2 board, Aris has found out that: "There are some interesting facts here, which I didn't pay much attention to during the reviews because I only look at the average values and not the peak ones in idle. In the 7950X3D, there is a high spike during idle at 130 W, which is unjustified because the peak CPU load is only 3.53%. Even with the Curve Optimized enabled and a -15 setting, the idle power spike is close to 125 W, so something is happening there. On the 7800X3D, the spike during idle stays low, but this is not the case for the 7900X, which has an idle power spike at 109 W, while the peak CPU load at idle was at 5.12%, so these 109 W are not justified, either."

Ericsson is boosting its Open RAN and Cloud RAN ecosystem commitment through an agreement with US-based global ICT industry leader AMD. The agreement - intended to strengthen the Open RAN ecosystem and vendor-agnostic Cloud RAN environment - aims to offer communications service providers (CSPs) a combination of high performance and additional flexibility for open architecture offerings.

The Ericsson-AMD collaboration will see additional processing technologies in the Ericsson Cloud RAN offering. The expanded offering aims to enhance the performance of Cloud RAN and secure high-capacity solutions. The collaboration will enable joint exploration of AMD EPYC processors and T2 Telco accelerator for utilization in Cloud RAN solutions, while also investigating future platform generations of these technologies.

MSI has been in close contact with the AMD and has referred to their official technical guidance to provide users with a safer and more optimized hardware environment. To achieve this goal, MSI will release a new list of BIOS updates specifically for the AMD Ryzen 7000 series CPU.

According to AMD's design specifications, the Ryzen 7000X3D series CPU does not fully support overclocking or overvoltage adjustments, including CPU ratio and CPU Vcore voltage. However, AMD EXPO technology can be used to optimize memory performance by appropriately increasing the CPU SoC voltage to ensure system stability when operating at higher memory frequencies.

AMD today released the latest version of its Adrenalin drivers. Version 23.4.3 WHQL comes with optimization for "Star Wars: Jedi Survivor." It also comes with fixes for display corruption in "World War Z: Aftermath" when using the Vulkan API; and longer than expected shader compilation times with "The Last of Us: Part 1." AMD has disabled the Factory Reset feature in the installer to fix issues noticed during PC upgrades. In the meantime, AMD recommends using the AMD Cleanup Utility during PC upgrades. Some glaring bugs with "Hogwarts Legacy" with Radeon RX 580 "Polaris" are being addressed with the developer.

DOWNLOAD: AMD Software Adrenalin 23.4.3 WHQL

AMD has today released another statement to the press, following on from controversy surrounding faulty Ryzen 7000X3D series processors - unlucky users are reporting hardware burnouts resulting from voltage-assisted overclocking. TPU has provided coverage of this matter this week, and made light of AMD's first statement yesterday. AMD ensures customers that it has fully informed ODM partners (motherboard manufacturers) about up-to-date and correct voltages for the Ryzen processor family - yet user feedback (via online hardware discussions) suggests that standard Ryzen 7000 models are also being affected by the burnout issue - this side topic has not been addressed by AMD (at the time of writing). This second statement repeats the previous one's recommendation that affected users should absolutely make contact with AMD Support personnel:

AMD Statement"We have root caused the issue and have already distributed a new AGESA that puts measures in place on certain power rails on AM5 motherboards to prevent the CPU from operating beyond its specification limits, including a cap on SOC voltage at 1.3 V. None of these changes affect the ability of our Ryzen 7000 Series processors to overclock memory using EXPO or XMP kits or boost performance using PBO technology. We expect all of our ODM partners to release new BIOS for their AM5 boards over the next few days. We recommend all users to check their motherboard manufacturers website and update their BIOS to ensure their system has the most up to date software for their processor.

Anyone whose CPU may have been impacted by this issue should contact AMD customer support. Our customer service team is aware of the situation and prioritizing these cases."

ASUS today unveiled the TUF Gaming A620-PRO WiFi, a Socket AM5 motherboard based on the entry-level AMD A620 chipset. When ASUS debuted its A620 motherboard lineup, it lacked a product in the ATX form-factor, and its top motherboard model at the time was the Micro-ATX TUF Gaming A620M-Plus WiFi. The new A620-PRO WiFi is feature-packed, and looks like a product from a segment above. It draws power from a combination of 24-pin ATX, and 8+4 pin EPS, and although you don't get CPU overclocking support with this chipset, there's plenty of CPU power delivery for even 12-core and 16-core processors. A 13-phase VRM conditions power for the processor.

The Socket AM5 is wired to four DDR5 DIMM slots, a PCI-Express 4.0 x16 slot, and two CPU-attached M.2 NVMe slots, each with PCI-Express 4.0 x4 wiring. A PCI-Express 3.0 x16 slot (electrical Gen 3 x2), and two Gen 3 x1 slots wired to the A620 FCH, make for the rest of the expansion feature-set. Besides the CPU-attached M.2 NVMe slots, you get four SATA 6 Gbps ports from the A620 chipset for storage. Display connectivity includes a DisplayPort and HDMI. Networking connectivity consists of a 2.5 GbE wired Ethernet driven by a Realtek 8125 series controller; and 802.11ax (WiFi 6), with Bluetooth 5.3 (possibly an Intel WLAN module). USB ports include two 10 Gbps USB 3.2 Gen 2 type-A, two 5 Gbps USB 3.2 Gen 1 type-A and type-C, and four 5 Gbps ports via two internal USB 3.2 headers or internal ports, besides a handful USB 2.0 headers. The onboard audio solution is driven by an entry-level Realtek ALC892 CODEC, with 7.1-channel analog jacks. The motherboard offers USB BIOS Flashback. The company didn't reveal pricing.