Axiomtek - a world-renowned leader relentlessly devoted to the research, development, and manufacturing of innovative and reliable industrial computer products of high efficiency - is proud to introduce the IPC972, its new industrial edge AI system with dual GPU support. The highly expandable edge computer supports the Intel Xeon or 10th gen Intel Core i7/i5/i3 processor (code name: Comet Lake S) with the Intel W480E chipset. With the ability to support two NVIDIA GeForce RTX 3090 GPU cards, the IPC972 enables to facilitate image processing, real-time control, data analysis, deep learning, AOI, data acquisition, and more automation tasks.

Axiomtek's IPC972 continues the IPC970 series design, offering flexible expansion options with one I/O module slot and four PCIe slots. In addition, it has one M.2 Key B 3042/3050 slot with SIM slot for 5G wireless connection, one M.2 Key E 2234 slot for Wi-Fi/Bluetooth modules and one full-size PCIe Mini Card slot with SIM slot for Wi-Fi/Bluetooth/LTE modules. With the compact and front-facing I/O design, the IPC972 provides the advantages of fast set-up and easy access and deployment. For stable operation in mission-critical environments, the IPC972 has a wide operating temperature range of -10°C to +60°C and a power input of 24 V DC (uMin=19 V/uMax=30 V) with power-on delay function, over-voltage protection, over current protection, and reverse voltage protection.

Intel is reportedly giving finishing touches to the Core i9-10900KS Special Edition desktop processor. The SKU was leaked to the web in an "eligible products list" as part of a "Crysis Remastered" game bundle campaign. This would be the third in a string of special edition processor models from Intel, after the Core i7-8086K, and the Core i9-9900KS. The i9-10900KS could be a 10-core/20-thread processor based on the "Comet Lake-S" silicon, but with higher clock-speeds than the i9-10900K, possibly even a high all-core boost frequency. The timing of this launch is curious, as we're just 6-7 weeks from market availability of the 11th Gen Core "Rocket Lake-S" launch.

In related news, Intel is refreshing the bottom end of its 10th Gen Core "Comet Lake" lineup with the company's latest corporate identity and packaging. This is probably being done to cater to entry-level 400-series chipsets such as the H410 and B460, which will not support "Rocket Lake" processors. A Malaysian tech publication posted a picture of a refreshed Core i3-10105F 4-core/8-thread processor retail package. In all likelihood, the refreshed 10th Gen chips are speed-bumps.

Earlier this week, Intel shook the DIY PC market, particularly the vast mainstream segment, by revealing that its mid-tier B460 and entry-level H410 desktop motherboard chipsets will not be compatible with 11th Gen Core "Rocket Lake-S" processors, and that only its top-tier Z490 and H470, will. We have an explanation into what's going on, after consulting with people in the know, thanks to our friends at Hardware Zone Israel, who spoke with sources within Intel. It turns out, that some batches of B460 and H410 PCH dies are re-badged from older generations of PCH, and built on the 22 nm silicon fabrication process; whereas the Z490 and H470 are based on a newer generation that's built on 14 nm. This is similar to Intel's move to carve out the B365 chipset from the older H170.

In addition to being limited to an older version of Intel ME (Management Engine), the H460 and H410 PCH lack the ability to communicate with "Rocket Lake-S" processors over side-band, using PMSYNC/PMDN signals, a design change Intel introduced with the "Tiger Lake" and "Rocket Lake" microarchitectures. The chipsets faced no such limitation with "Comet Lake-S." Intel's decision to re-badge older 22 nm-class PCH silicon as B460 and H410 may have been dictated by the company's 14 nm node volume constraints. HotHardware reports that some motherboard vendors, such as GIGABYTE, found a clever (albeit expensive) way around this limitation, by creating "V2" revisions of their existing B460 and H410 motherboards, which actually use the 14 nm H470 chipset.

Intel has apparently begun shipment of its discrete Iris Xe LP-based DG1 graphics card to OEMs and system integrators, which means we will soon see these graphics cards hitting the market - in a manner of speaking. The quantities aren't yet known, but considering Intel's intentions of only shipping it to OEMs, volume shouldn't be quite significant. It remains to be seen whether DG1-toting systems will even be available to the general public, or if these will be sold primarily to business customers. However, considering that the discrete DG1 only offers entry-level performance due to its 80 EUs (less than even the 96 available through integrated graphics on Intel Tiger Lake CPUs), hopes placed on this particular graphics card as somewhat remedying the current industry ailment of undersupply won't materialize.

One interesting tidbit, however, is that system integrators will have to use specific hardware on the systems they build that carry Intel's DG1, as the blue giant has specified that these graphics cards will only work pending specific firmware updates that enable them to function on certain chipset and processor products. Namely, and according to Intel speaking to Legit Reviews, "The Iris Xe discrete add-in card will be paired with 9th gen (Coffee Lake-S) and 10th gen (Comet Lake-S) Intel Core desktop processors and Intel B460, H410, B365, and H310C chipset-based motherboards and sold as part of pre-built systems. These motherboards require a special BIOS that supports Intel Iris Xe, so the cards won't be compatible with other systems."

Intel is betting big on an 8-core processor to revive its gaming performance leadership, and that chip is the 11th Generation Core "Rocket Lake-S," coming this March. In its 2021 International CES online event, Intel disclosed more details about "Rocket Lake-S," including the first true-color die-shot. PC enthusiast @Locuza_ on Twitter annotated the die for your viewing pressure. For starters, nearly half the die-area of the "Rocket Lake-S" is taken up by the uncore and iGPU, with the rest going to the eight "Cypress Cove" CPU cores.

The "Cypress Cove" CPU core is reportedly a back-port of "Willow Cove" to the 14 nm silicon fabrication node, although there are some changes, beginning with its cache hierarchy. A "Cypress Cove" core is configured with the same L1I and L1D cache sizes as "Willow Cove," but differ with L2 and L3 cache sizes. Each "Cypress Cove" core is endowed with 512 KB of dedicated L2 cache (which is a 100% increase from the 256 KB on "Skylake" cores); but this pales in comparison to the 1.25 MB L2 caches of "Willow Cove" cores on the "Tiger Lake-U" silicon. Also, the L3 cache for the 8-core "Rocket Lake-S" die is 16 MB, spread across eight 2 MB slices; while the 4-core "Tiger Lake-U" features 12 MB of L3, spread across four 3 MB slices. Each core can address the whole L3 cache, across all slices.

Benchmark numbers of an upcoming Intel Core i9-11900 (non-K) and i9-11900K processor engineering samples allegedly obtained on CPU-Z Bench reveal that the chip will deliver on the company's "double-digit IPC gain" promise for the "Rocket Lake" microarchitecture. The i9-11900 (non-K) sample posted a single-threaded performance score of 582 points, while the i9-11900K ES posted 597 points, which are roughly 12% higher than typical CPU-Z Bench single-thread numbers for the current-gen i9-10900 (non-K) and i9-10900K "Comet Lake-S" processors. The multi-threaded score of the i9-11900 (non-K) ES, at 5262 points, ends up just around 5-10% lower than that of the i9-10900, despite a deficit of two cores. Intel's 11th Gen Core "Rocket Lake-S" story is hence shaping up to be that of increased gaming performance from the IPC gain, while roughly the same multi-threaded performance as the 10th Gen "Comet Lake-S."

Intel today commenced the process of discontinuation of the "Avengers Edition" SKUs of its 10th Generation Core "Comet Lake-S" desktop processors, through a product change notification (PCN). The said PCN #117894-00 mentions December 16, 2020 as a common date for all four key discontinuation milestones in the product's lifecycle, namely Product Discontinuation Support commencement, Last Product Discontinuance Order (the last opportunity for distributors to place orders from Intel for), the date for these orders to become non-cancelable and non-returnable; and the date for the last order to ship. Normally, the latter two milestones are spaced 6 months and 12 months apart from the date of the product discontinuation PCN. To put this in simpler terms—and unless the PCN doesn't have a typo with its dates—Intel is expeditiously discontinuing its 10th Gen Core "Comet Lake-S" desktop processors, marking them EOL (end of life).

Just a few days ago, Intel has decided to surprise us and give out information about its upcoming Rocket Lake-S platform designed for desktop users. Arriving early next year (Q1) the Rocket Lake-S platform is yet another iteration of the company's 14 nm node. However, this time we are getting some real system changes with a new architecture design. Backporting its Golden Cove core to 14 nm, Intel has named this new core type Cypress Cove. What used to be the heart of Ice Lake CPUs, is now powering the Rocket Lake-S platform. Besides the new core, there are other features of the platform like PCIe 4.0, new Xe graphics, and updated media codecs. You can check that out here.

Today, we have gotten the first benchmarks of the Intel Rocket Lake-S system. In the Userbenchmark bench, an unknown eight-core Rocket Lake CPU has been compared to Intel's 10th generation Comet Lake-S processors. The Rocket Lake engineering sample ran at 4.2 GHz while scoring a single-core score of 179. Compared to the Core i9-10900K that runs at 5.3 GHz, which scored 152 points, the Cypress Cove design is 18% faster. And if the new design is compared to the equivalent 8C/16T Compet Lake CPU like Core i7-10700K clocked at 5.1 GHz and scoring 148 points, the new CPU uarch is up to 22% faster. This represents massive single-threaded performance increases, however, please take the information with a grain of salt, as we wait for the official reviews.

Intel launched the Core i3-10100F, an interesting option for entry-level gaming PC builds. This 4-core/8-thread processor lacks an iGPU, unlike the $120 Core i3-10100, but that shaves nearly a quarter off of its price, with the Intel ARK page for the chip reporting a price band of $79-$97 (per chip in 1,000-unit quantities). The lack of an iGPU means that the chip is targeted at gaming PC builds with discrete graphics cards. It otherwise has the same specs as the i3-10100, with four cores based on the 10th Generation "Comet Lake-S" microarchitecture, nominal clock speeds of 3.60 GHz with 4.30 GHz Turbo Boost, 6 MB of shared L3 cache, a dual-channel DDR4 memory controller that natively supports DDR4-2667 memory, and 65 W TDP. Its retail package includes a cooling solution. The i3-10100F should be drop-in compatible with any Socket LGA1200 motherboard. Do catch our review of the i3-10100, which should give you an idea of how the i3-10100F should perform.

Have you ever felt the need that your motherboard needs more ports? Different peripherals can occupy quite a lot of USB ports and almost fill up all of them quickly. That is where the Portwell PEB-9783G2AR motherboard comes into play. Being built on Intel's latest W480E/Q470E chipset designed to accommodate any 10th generation 10 core CPU with a TDP of up to 80 W, the board can run either a Xeon W CPU or regular Comet Lake-S Core CPU. However, what makes this board unique is not its chipset or anything, it is the number of USB ports present.

Portwell has put an astonishing 20 (you read that right) USB 3.1 Gen1 ports on the board, which you can run at a full 5 Gbit/s data signaling rate at the same time. The board doesn't use any splitting technology so you are getting the full bandwidth. To get that many ports to run at full capacity, Portwell has presumably re-routed chipset lanes for SATA 3 connectors and used them for USB ports, leaving only two SATA 3 ports. The board is built for the FlexATX form factor and features a sideways PCIe 3.0 port. Being built for Xeon, the board also features support for ECC memory and up to 128 GB of it. While the pricing is not yet available, you can get a quote on Portwell's website.

Intel today has officially launched their new Core i9-10850K CPU. The 10-core, 20-thread design slots in between the top of the line i9-10900K and the i9-10800K, and only features a small (100 MHz) clock reduction compared to the 10900K across all clocks (this means base, set at 3.6 GHz; Turbo Boost Max 2.0, reaching 5.0 GHz; Turbo Boost 3.0 going up to 5.1 GHz. Thermal Velocity Boost tech is also supported, which should allow for up to 5.2 GHz on a single core and a 4.8 GHz clock across all cores. The TDP remains the same as the 10900K at 125 W, with the same Tau and PL1/PL2 values as 10900K (56 sec, 125 W, and 250 W).

The new CPU improves on the value proposition of the 10900K by being available at around 10% less than Intel's top-of-the-line Comet Lake-S CPU, with pricing set at $453 (at 1K tray quantities). As Intel's manufacturing woes and 14 nm production output keep failing to meet demand, it's likely that the company will continue to fine-tune its product stack with as many CPUs as it can, in order to achieve higher ASP on each model than they would if they had to only count on manufacturing yields and/or manually disabling cores in chips that can't quite hit their advertised speeds for each CPU model. The Core i9-10850K retains compatibility with Intel's Z490, H470 and B460-based motherboards.

This one is sort of a brain-scratcher. Storefronts have started listing Core i9 KA versions of Intel's 10th Gen processors based on Comet Lake-S. The A part of the suffix is one we've never seen Intel use before - the K denotes an unlocked multiplier, which allows for chip overclocking, and Intel's F chips denote ones without integrated graphics built into the silicon. however, KA is a new one. It's being postulated online that these could be CPUs that don't achieve Intel's Boost clocks - but are capable enough of running at the stipulated base clocks for their K-only cousin.

These have been listed on Lithuanian shops, and pricing seems to be mostly in-line with that of Intel's F CPUs. The listed CPUs are the Core i9-10900KA (part number BX8070110900KA), with a 3.7 GHz Base clock, for €525; the Core i9-10850KA (BX8070110850KA) with a 3.6 GHz base clock, for €485; the Core i9-10700KA (BX8070110700KA) with a 3.8 GHz base clock, for €408; and the Core i9-10600KA (X8070110600KA) with a 4.1 GHz base clock, for €278. All CPUs also seem to have the same L3 cache size. That Core i9 naming scheme on the 10700KA and 10600KA though... Seems very, very strange.

In a clear sign of Intel's 11th Gen Core "Rocket Lake-S" desktop processors being prepared to support the company's 400-series chipsets, including the entry-level H410, the Russian language manual of the company's Infinite 915 pre-built compact gaming desktop that uses an Intel H410 chipset motherboard. The manual references support for the 65 W TDP versions of "CML-S" (10th Gen "Comet Lake-S") and "RKL-S" (11th Gen "Rocket Lake-S") processors in the manual. Besides increased IPC (single-threaded performance) riding on the new "Cypress Cove" CPU cores that are a backport of "Willow Cove" to the 14 nm process, "Rocket Lake-S" features an updated Gen12 Xe iGPU.

Intel's upcoming Core i9-10850K desktop processor, which was earlier believed to be an OEM-exclusive, is coming to the DIY retail channel after all. The 10-core Socket LGA1200 processor surfaced on retailers Cyclotron and LambdaTek as pre-orders, priced at 472€ and £459, including taxes, which aligns with its rumored USD $449 pre-tax price Stateside. At these prices, the i9-10850K is closer in price to the locked i9-10900 than to the top i9-10900K part.

Based on the 14 nm "Comet Lake-S" silicon, the Core i9-10850K is a 10-core/20-thread processor clocked up to 5.20 GHz, with 20 MB of L3 cache. Where it differs from the i9-109xx series is the lack of the Thermal Velocity Boost (TVB) feature. You still get an unlocked multiplier. The i9-10850K is hence provides a roughly $50 saving over the i9-10900K to give up the 100 MHz higher clock speed enabled by TVB. In the retail channel, the chip goes by the SKU "BX8070110850K."

ECS today rolled out the SF110 Q470 line of mini-PC barebones designed for 10th Gen Core "Comet Lake-S" desktop processors. The SF110 Q470 comes in two variants based maximum processor TDP supported - a 35-Watt model, and a 65-Watt model. The former includes a 90 W power brick, while the latter comes with a 120 W power brick and a meatier CPU cooling solution inside. Both barebones are based in the Intel Q470 chipset.

Inside, you'll get two DDR4 SODIMM slots supporting up to 64 GB of dual-channel DDR4-2933 memory, an M.2-2280 slot with both PCI-Express 3.0 x4 and SATA 6 Gbps wiring, and a 2.5-inch drive bay with a SATA 6 Gbps backplane. USB connectivity includes two 10 Gbps USB 3.2 gen 2 ports on the front panel, one 10 Gbps USB 3.2 gen 2 type-C port, and four 5 Gbps USB 3.2 gen 1 type-A ports on the rear panel. Networking includes a 1 GbE connection driven by an Intel i219-V controller, and 802.11ac + Bluetooth 4.2 WLAN card (you can opt for a newer AX201 card with 802.11ax + Bluetooth 5). Both the 35 W and 65 W variants physically measure 205 mm x 176 mm x 33 mm (HxDxW). Display outputs include an HDMI 2.0, two DisplayPorts, and a D-Sub. A COM port covers legacy connectivity. The company didn't reveal pricing.

Intel is giving final touches to a mysterious Core i9-10850K processor that was unearthed from the Geekbench database by TUM_APISAK. This would be the second new 10-core "Comet Lake-S" desktop processor SKU discovered in the past week, since the Apple-exclusive i9-10910. The i9-10850K is fascinating, in that it features an unlocked multiplier, 100 MHz lower nominal clocks than the i9-10900K, at 3.60 GHz, the same 5.20 GHz Turbo Boost Max 3.0 frequency; but an unknown Thermal Velocity Boost frequency.

It wouldn't surprise us if the processor lacked TVB altogether. It's likely that the i9-10850K is an OEM-exclusive targeted at pre-built designers that don't want to deal with the steep cooling requirements of the i9-10900K to give end-users visible boosting to its TVB Max frequencies of 5.30 GHz. The i9-10850K offers nearly identical Geekbench performance to the i9-10900K.

Intel today updated the public data-sheet of its 10th Gen Core "Comet Lake-S" desktop processor to reveal precise power limit and tau values of each specific SKU. PL 1 or power level 1 is interchangeable with the processor's TDP as a power value. PL 1 is sufficient for a processor to sustain its base frequency (nominal clocks). For example, a processor with 65 W TDP has PL 1 at 65 W. PL 2 is what affords the processor the power to seek out boost frequencies. This value varies with between model to model, with the unlocked K/KF SKUs getting higher PL 2 values than the locked ones. The company also disclosed Tau. This is a timing variable that tells the processor how long (in seconds) can it stay within PL 2, before having to retreat to PL 1.

A roadmap slide from an Intel Partner Connect presentation suggests that the company's client-segment processor lineup will be unchanged for the rest of 2020, with the company briskly launching its 10th generation "Comet Lake-S" desktop processor lineup through May-June, and "Comet Lake-H" a month prior. The Core X "Cascade Lake-X" processor lineup will continue to lead the company in the high core-count HEDT segment, with no indications of new models, at least none higher than 18 cores.

More importantly, this slide dulls expectations of the company refreshing its desktop process segment just before Holiday 2020 with the 11th generation "Rocket Lake-S" silicon that has next-gen "Willow Cove" CPU cores, Gen12 Xe integrated graphics, and PCIe gen 4.0 connectivity, especially with engineering samples of the chips already hitting the radar. Intel is expected to launch 10 nm "Ice Lake-SP" Xeon enterprise processors in 2020, and there was hope for some of this IP to power Intel's next HEDT platform, the fabled "Ice Lake-X," especially with AMD's "Castle Peak" 3rd gen Threadrippers dominating this segment. While there's little doubt that the slide may have originated from Intel, its context must be studied. Partner Connect is a platform for Intel to interact with its channel partners (distributors, retailers, system integrators, etc), and information about future products is far more restricted on these slides, than presentations intended for large OEMs, motherboard manufacturers, etc. Then again, with the COVID-19 pandemic throwing supply chains off rails, it wouldn't surprise us if this slide spells Gospel.

There are apparently two steppings of the 10th generation Intel Core i5 desktop processor in circulation, and the two have major physical differences, even if their specifications are identical per SKU. These are Q0 and G1. The Q0 stepping of the 10th gen Core i5 is based on the 10-core variant of "Comet Lake-S" silicon, the 200-odd mm² die, which comes with Intel's die-thinning innovation, and more importantly, soldered thermal interface material (STIM). For these chips, four cores on the 10-core die are disabled by Intel to carve out the 6-core/12-thread Core i5 SKU. The G1 stepping, on the other hand, is based on the 6-core variant of "Comet Lake-S," which is similar in design to the 6-core "Coffee Lake" die. The G1-stepping chips lack STIM, and use a thermal paste.

What's more, Q0 and G1 steppings have different SPEC codes. For the Core i5-10400F, the Q0 stepping variant's SPEC code is "SRH79" and the G1 stepping variant's code is "SRH3D." The underside of the processor's package looks different between the two steppings (pictured below). You won't be able to tell the underside of the package through the little window in your processor's retail package, but the SPEC code is printed on the IHS. There's no geographic marker as to which stepping is found in what particular market. Both steppings appear to be distributed uniformly, wherever available. Since Intel is using this stepping-level differentiation only among non-K SKUs, we don't expect the two to have any different performance, but possibly different thermals.

The 10th generation Intel Core desktop processor family was launched recently along with its companion motherboards based on the Intel 400-series chipsets. The new processors (codename "Comet Lake-S") utilize the LGA 1200 socket which shares the same mechanicals and has the identical 75x75mm spacing of mounting holes as the older LGA 1151 and other 115x sockets. All current GELID CPU coolers that support LGA 115x are also compatible with the new LGA 1200 socket, no additional mounting kits or accessory upgrades are required.

And especially, our latest Phantom, Phantom Black and Sirocco CPU Coolers also fully support overclocking capabilities of the top unlocked Core i9-10900K, Core i7-10700K and Core i5-10600K processors enabling boosted performance and enhanced cooling for your power-hungry gaming rigs.

The Japanese cooler specialist Scythe confirms the compatibility of its cooler line-up to the upcoming LGA 1200 socket based Intel 10th Gen "Comet Lake-S" Desktop CPU. All Scythe CPU cooler models, which are offering compatibility to sockets LGA 1150, LGA 1151, LGA 1155 and LGA 1156, can be installed on motherboards with the new socket LGA 1200. No additional mounting clips are required and users are able to use the supplied LGA 115X clips, when installing the compatible Scythe CPU coolers on the new socket. The updated manuals are available for download on Scythe website.

ASRock Industrial Computer Corporation, the world's leader in Industrial PC motherboards, unveils a broad range of industrial motherboards powered by the Intel 10th Generation Core Processors (Comet Lake-S) with up to 10 Cores and supporting Intel 400-series Q470E, H420E, and W480E chipsets. Featuring improved multi-threaded computing performance and rich I/O functionality, ASRock Industrial's new series of product lineup covers comprehensive form factors, including industrial Mini-ITX, Micro-ATX, and ATX motherboards, are ideal for diverse applications, such as industrial automation, retail kiosks, digital signage, and AIoT solutions.

ASRock Industrial introduces the industry's first Intel 10th Gen Core Processors Industrial Motherboards with Q470E chipset, including the IMB-1220-L/IMB-1220-D and IMB-1222/IMB-1222-WV Mini-ITX motherboards, the IMB-1313 Micro-ATX motherboard and the IMB-1711 ATX motherboard. For value and cost-effective options, there are also new Mini-ITX motherboards with H420E chipset, the IMB-1221-L/IMB-1221-D comes with high-rise IO and the IMB-1223/IMB-1223-WV with thin IO.

MSI updated its pre-built gaming desktop product stack with the introduction of two models that are powered by 10th generation Intel Core "Comet Lake-S" desktop processors. The Codex R 10th features a more conventional ATX mid-tower design, and comes in two variants. The top variant (model: CODEXR10SC002) is powered by an Intel Core i7-10700F processor, 16 GB of memory, and GeForce RTX 2060 graphics, The value variant (CODEXR10SC003) comes with a Core i5-10400F processor, 8 GB of RAM, and GeForce GTX 1660 Super graphics. Both are based on an Intel B460 chipset motherboard, and offer a 512 GB SSD. A Clutch GM11 mouse and Vigor GK30 keyboard come included with both.

Next up, is the MEG Trident X, a high-end compact gaming desktop that brings the coveted MEG brand to the segment. Inside its 5.1" x 15.06" x 15.6" chassis is high-end hardware that comes in three variants. The top "TridentX862" variant packs a Core i9-10900K processor, 64 GB of DDR4 memory, GeForce RTX 2080 Ti graphics, and a combination of 1 TB NVMe SSD and 1 TB HDD. The middle variant, "TridentX863," is powered by a Core i7-10700F processor, 32 GB of memory, GeForce RTX 2080 Ti graphics, and 1 TB NVMe SSD. The most affordable "TridentX864" variant uses the same i7-10700F processor and 32 GB of memory, but paired with RTX 2070 Super graphics. All three use a Z490 chipset Mini-ITX motherboard. Clutch GM11 and Vigor GK30 come included with all three variants. The company didn't reveal pricing.

Internal documents of Intel's 10th generation Core "Comet Lake" processor family, leaked by momomo_us, reveal the CPUID, TDP, and configurable-TDP values of the various desktop SKUs. Intel broadly classifies Comet Lake by core-count and companion iGPU tier. The 10-core Comet Lake die ships with 125 W, 65 W, and 35 W TDP, for the K/KF, locked, and T-SKUs, respectively.

For the desktop Comet Lake-S, there are only two iGPU tiers, GT2 (iGPU present in UHD 630 flavor), or completely disabled (denoted as GT0). The charts detailing the non-Turbo clock speeds reveal that the presence or absence of iGPU has no impact on TDP, cTDP, or CPU frequencies. The "Comet Lake" 10-core + GT2 silicon is listed with a CPUID of A0655h, while the 6-core + GT2 and 4-core + GT2 variants share the A0653h CPUID.

Ahead of its launch, tech publication HD Tecnologia posted the press-deck of Intel's 10th generation Core "Comet Lake-S" desktop processor series, as its launch is imminent (30th April, according to the slides). Right upfront, we see Intel's new retail packaging for the flagship Core i9 parts. Gone is the large acrylic dodecahedron, and in its place is a conventional paperboard-looking cuboidal box with a large triangular cutout window (probably made of LDPE) on the front face, which reveals the processor inside.

The next slide reveals all that's new with the 10th generation Core processor family, starting with clock speeds of up to 5.30 GHz, the desktop debut of Intel's Thermal Velocity Boost technology, HyperThreading being enabled across the board (Core i9 thru Core i3), native support for DDR4-2933, new CPU- and memory-overclocking features, and new platform I/O through the 400-series chipset. Next up, we see overclocker-relevant new features. Apparently, these processors allow you to toggle HyperThreading on a per-core basis. Until now, you could toggle HTT only across all cores. Next up, is "overclocking" for the PCI-Express x16 link (PEG) and DMI chipset bus. There are improved V/F curve controls with this generation. Intel is preparing to announce updated XTU and Performance Maximizer utilities. There are some packaging-level refinements, too, such as a physically thinner die (Z-height), making way for a thicker IHS. The internal TIM is still solder. We now move on to the actual SKUs.