ASRock's socket LGA2011 motherboard lineup doesn't end with X79 Extreme7 as thought before, the company thinks there's scope for an even more loaded model that's literally bursting with connectivity and expansion features. Enter the X79 Extreme9. This board uses high-grade digital PWM circuitry to power the CPU. It draws power for the CPU VRM from two 8-pin EPS connectors. Unlike the X79 Extreme7, this board features eight DDR3 DIMM slots, two per memory channel. Expansion slots include five PCI-Express 3.0 x16, and a PCIe x1.

Since it completely ran out of room on the main PCB, ASRock put two important connectivity features on a separate (included) addon card, called the ASRock "Game Blaster". This card occupies the PCIe x1 slot, it packs a next-generation Creative SoundCore3D audio processor (more advanced than X-Fi), and a low-overhead/low-latency gigabit Ethernet connection. It's not exactly known if this connection is driven by a Killer 2100 or a more common PCIe GbE PHY backed by ASRock's proprietary packet prioritization software (XLAN).

ASRock showed off pictures of the first socket LGA2011 motherboard in the compact micro-ATX form-factor, the ASRock X79 Extreme4-M Within its small board footprint of 240 x 240 mm, the X79 Extreme4-M offers almost every feature the platform has to offer. To begin with, the LGA2011 socket is powered by an 8-phase VRM that makes use of high-grade solid-state chokes, and driver-MOSFETs. It is wired to four DDR3 DIMM slots, two on either sides of the socket. All four expansion slot bays available to the mATX form-factor are made use of, with three PCI-Express 3.0 x16 and one legacy PCI.

The electrical configuration of the three PCI-Express slots appears to be x16, x8, x16 (permanent). The chipset is cooled by an active fan-heatsink. All six of its SATA ports are wired as internal ports, with two SATA 6 Gb/s and four SATA 3 Gb/s. Connectivity features include 8+2 channel HD audio with optical and coaxial SPDIF outputs, four USB 3.0 ports (two on the rear panel, two via header), one gigabit Ethernet, a number of USB 2.0 ports, Firewire, and legacy PS/2. The CMOS can be reset from the rear panel. The board will be driven by UEFI firmware.

Matrox Graphics Inc. today announced that Shuttle Inc., a leading specialist in innovative mini PCs, has validated the Matrox M-Series multi-display graphics cards with the new Shuttle XPC H7 5820S mini PC. The M-Series PCI Express (PCIe) x16 boards support up to eight DisplayPort or single-link DVI monitors at resolutions of up to 2560x1600 per display. A second M-Series card can be combined within the H7 5820S workstation, allowing system integrators to actualize a wide range of multi-display installations in corporate, digital signage, security surveillance, process control, and other professional environments.

Measuring only 19 centimeters (7.5 inches) in height, the space-saving Shuttle XPC H7 5820S mini PC comes equipped with an Intel Core i7 processor with up to six cores and up to 16 GB of DDR3 memory to reliably run the most demanding professional applications. The high-performance H7 5820S can be incorporated with one or two M9128 dual-monitor, M9138 triple-monitor, M9140/M9148 quad-monitor, and M9188 octal boards. With up to 2 GB of on-board memory and advanced desktop management features such as stretched and independent desktop modes, M-Series cards render pristine image quality and exceptional functionality across all displays.

Gigabyte released its newest premium HTPC motherboard in the mini-ITX form-factor, the A75N-USB3. As the name might suggest, this is a socket FM1 motherboard based on the AMD A75 chipset, and features USB 3.0 connectivity. Despite its compact dimensions, the board crams in everything a HTPC can benefit from. First, the FM1 socket seats AMD A-Series accelerated processing units (APUs), which pack up to four x86-64 cores with up to 4 MB cache, dual-channel DDR3-1866 integrated memory controller, and more importantly, a very powerful integrated graphics processor in the Radeon HD 6500 class. The FM1 socket on this board is powered by a 3+1 phase VRM that makes use of driver-MOSFETs. Power is drawn by a 24-pin ATX and a 4-pin CPU power connector.

The lone expansion slot is a PCI-Express 2.0 x16. The CPU is wired to two full-length DDR3 DIMM slots, which can take in up to 32 GB (that's right, future 16 GB DIMMs are supported) of dual-channel DDR3-1866 MHz memory. The AMD A75 chipset gives out four internal SATA 6 Gb/s ports, and one eSATA 6 Gb/s port on the rear panel. Display outputs include HDMI 1.4a and DVI. Analog outputs are done away with. Audio is handled by a high-quality Realtek ALC889 HD audio codec. Although this codec supports 8+2 output channels, it is wired to a 5.1 channel shared audio jack cluster, apart from the internal HDA_FP header. Those needing 7.1 channel output can still use the TOSLINK connector, that supports 7.1 channel output with 24-bit, 192 kHz resolution and Dolby Home Theater support. If even that's not enough, the HDMI connector gives you 7.1 channel HDMI audio with Dolby Prologic support.

EVGA released a teaser picture of its X79 FTW motherboard. This is EVGA's third LGA2011 motherboard, after the E-ATX Super Record 3 and XL-ATX X79 Classified. This board confines itself to the dimensions of a standard ATX form-factor motherboard (240 x 300 mm). It targets the gamer-overclocker market. The LGA2011 socket is powered by a 14-phase VRM, while the memory, 4-phase. EVGA completely did away with cylindrical conductive polymer capacitors, and used a 100% POSCAP capacitor design. Power is drawn in from a 24-pin ATX (angled) connector, 8-pin EPS, and a 4-pin Molex (for PCIe slot electrical stability). There are just four DDR3 DIMM slots, one per memory channel.

Expansion slots include four PCI-Express 3.0 x16 (two are x16 capable, all four are x8 capable), a PCI-Express 2.0 x16 (electrical x8), and one PCIe x1. NVIDIA 4-way SLI and AMD CrossFireX are supported. The only internal SATA ports on this board are the ones the X79 PCH gives out, two SATA 6 Gb/s and four SATA 3 Gb/s. There are two eSATA ports, driven by a third-party controller. There are as many as eight USB 3.0 ports on the rear-panel, and two via internal header. 8+2 channel HD audio, two GbE connections, a Bluetooth connection, and PCH-wired USB 2.0 ports (for keyboard/mouse) make for the rest of the standard connectors. There is an EVBot header on the rear-panel, that lets you connect to the EVBot monitoring/control module. The UEFI BIOS is stored in two separate EEPROMs, and a 2-way switch lets you manually switch between the two. Expect the X79 FTW to be a part of the company's first wave of LGA2011 motherboards.

As Intel's Core i7 "Sandy Bridge-E" processors in the LGA2011 package inch closer to their mid-November launch, there is already hectic activity among manufacturers of related components such as motherboards, memory, and coolers. By now, a large section of the industry has engineering samples to help design and test their components. OCWorkbench was witness to one such pre-release setup on which a Core i7 "Sandy Bridge-E" (unknown model, could even be quad-core for all we know), overclocked to 4.92 GHz with a "regular" air-cooler. The chip was idling at 45°C.

Sandy Bridge-E, as we know, can be effectively overclocked by increasing its base clock (BClk). On this particular setup, the BClk was set at 120 MHz, with a multiplier value of 41X, and core voltage of 1.51V. The memory used was DDR3-2400 MHz with CAS latency of 10T. This is particularly encouraging, not just to enthusiasts on a tight budget, but also the cooling products industry in general. Core i7 "Sandy Bridge-E" retail boxes don't contain a cooling solution, and Intel has been showing off its branded closed-loop water-cooling solution (to be purchased separately) as something that's "recommended" for Core i7 "Sandy Bridge-E". This gave many an impression that you need at least closed-loop water coolers for any hope of achieving decent overclocked speeds with these chips, and that perhaps these chips are bad overclockers in general. The likes of Xigmatek, Thermalright, Noctua, and Scythe can breathe a huge sigh of relief.

ASUS' top-tier LGA2011 lineup is completed by the TUF Sabertooth X79. This board, along with the ROG Rampage IV Extreme and P9X79 Deluxe makes up for it. There will be many more affordable LGA2011 boards by ASUS, one such model we're hearing about is the P9X79 Pro. The TUF Sabertooth family is based on the idea of rock-solid stability and component durability, these motherboards are built to last, if not score accolades with overclocking like the ROG boards are designed for.

The Sabertooth X79 uses an ASUS-designed Digi+ VRM to power the CPU, which is spread across two sides of the socket (north and west). The heatsink cooling the VRM components to the west is actively cooled by a 40 mm fan, the one over the X79 PCH is cooled by a similarly sized lateral blower, too. Like with the other two top-tier boards from ASUS' stable, this one provides eight DDR3 DIMM slots supporting quad-channel memory.

Here are the first pictures of ASUS P9X79 Deluxe, the company's premium segment LGA2011 motherboard based on the X79 chipset. This features in ASUS' main motherboard lineup, and not sub-lineups such as Republic of Gamers (ROG) or The Ultimate Force (TUF). The P9X79 Deluxe is loaded with features and connectivity options. To begin with, the LGA2011 socket is powered by a next-generation Digi+ VRM design by ASUS, driven by Dual Intelligent Processors III (next-generation Energy Processing Unit (EPU) chip and TurboV Processing Unit (TPU)). Like with the ROG Rampage IV Extreme, VRM is spread across three sides of the socket, and each cluster of MOSFETs is cooled by heatsinks. The socket is wired to eight DDR3 DIMM slots in two sets of four slots, supporting quad-channel DDR3. The memory VRM uses a Digi+ design, too.

Among the six expansion slots, there are four PCI-Express x16 slots, and two PCIe x1. The PCH gives out six SATA ports, two 6 Gb/s (white), four 3 Gb/s (blue), the two additional 6 Gb/s ports come from a third-party controller. There are two power-eSATA ports on the rear panel. The eight USB 3.0 ports on this board are spread across as six ports on the rear-panel, and two via standard header. Other connectivity includes 8+2 channel HD audio, two gigabit Ethernet connections, USB 2.0, and Bluetooth.

Here is ASUS' top of the line LGA2011 motherboard targeting the gamer-overclocker market, the Republic of Gamers (ROG) Rampage IV Extreme. This board offers all the expansion room and connectivity you'll ever need, plus a wealth of nifty features that help overclockers and ease incremental upgrades. To begin with, the Rampage IV Extreme employs a strong digital PWM circuitry that supports heavy voltage-assisted overclocking with Vdroop control.

The LGA2011 socket is wired to eight DDR3 DIMM slots (two per channel). CPU and memory VRM areas are located along three sides of the socket, all cooled by heatsinks that are connected by heat pipes. These VRM heatsinks share heat with the one over the X79 PCH, which is actively cooled by a fan.

AMD detailed its upcoming "Virgo" PC platform that consists of next-generation "Trinity" APU (accelerated processing unit), and current-generation AMD A75 "Hudson-D" chipset. A notable revelation here is that the next-gen APUs will be compatible with AMD A75, although it will be designed for a new socket called FM2. It remains to be seen if FM1 and FM2 are pin-compatible.

"Trinity" packs four x86-64 cores based on the next-generation "Piledriver" architecture, arranged in two Piledriver modules. A module is a closely-knit group of two cores, with certain shared and dedicated resources. Each Piledriver module has 2 MB of L2 cache shared between the two cores. In all, Trinity, with its two modules, has 4 MB of L2 cache without any L3 cache.

Just as its detractors thought they were done with it, and just as people started to think that attrition among some of its "popular" designers cost EVGA dearly, the company hit back with teaser pictures of the Super Record 3 or SR3, it promised back in June, it would deliver to the enthusiast community. And yes, it matches its description! The SR3 is a dual socket LGA2011 2P enthusiast desktop/workstation motherboard in the E-ATX form factor. Socket 0 is wired to eight DDR3 DIMM slots (two DIMMs/channel), while socket 1 to four slots (1 DIMM/channel).

In LGA2011 2P systems, the processor sitting on socket 0 is wired to the PCH (SR3 looks to have Patsburg-T), while the processor on socket 1 is wired to the one on socket 0 using two QPI links, closing the daisy-chain. Socket 0, apart from its 4 GB/s DMI link, has a PCI-Express 2.0 x4 (another 4 GB/s) link to supplement the DMI link, so the storage controllers don't get bottlenecked with just DMI. Both processors contribute to the PCI-Express lane budget of the motherboard. There are seven PCI-Express x16 slots, among which four are PCI-Express 3.0 x16 capable, every slot is PCI-Express 3.0 x8 capable. NVIDIA 4-way SLI is supported. This board will support Sandy Bridge-EP Xeon processors, though we don't know at this juncture if Core i7 Sandy Bridge-E is 2P capable.

MSI is readying a new LGA2011 HEDT (high-end desktop) motherboard based on the Intel X79 chipset, which features eight DDR3 DIMM slots, two per memory channel, letting you take advantage of the fast quad-channel DDR3 IMC of Sandy Bridge-E Core i7 processors, as well as not letting you fall short of memory expansion. The X79A-GD65 8D, as it's called, makes room for eight DIMM slots, four on either sides of the socket. The CPU is powered by a 5+2 phase VRM, and the memory by a 4-phase VRM.

Expansion slots include four PCI-Express x16, from which four are wired to the CPU socket, two are PCI-Express 3.0 x16 capable, four are PCI-E 3.0 x8 capable (depending on the way the slots are populated with add-on cards), one is PCI-E 2.0 x4 capable and is wired to the chipset. Then there's the lone PCI-E x1. NVIDIA 4-way SLI and AMD 4-way CrossFireX are supported.

Gigabyte teased us with pictures of its high-end socket LGA2011 motherboard featured in its G1.Killer series of motherboards designed for the gamer-overclocker market. The G1.Assassin 2, as it's called, is based on the Intel X79 chipset. We don't have landscape pictures of the board, yet, but whatever little bits of pictures we do have, reveal quite a bit. To begin with, this board will retain the black+green "weapon" styling of predecessors in the series. The LGA2011 socket is wired to four DDR3 DIMM slots, in sets of two, on either sides of the socket. Each DIMM slot has its own memory channel.

From the CPU VRM heatsink, a heat pipe is finding its way to a stylized X79 PCH heatsink. This heatsink is designed to look like a handgun. Since it's so small, it isn't looking as realistic as the clip design featured on other G1.Killer motherboards. There are just six internal SATA ports we can find from the picture, two 6 Gb/s, and four 3 Gb/s. In terms of expansion slots, we could spot three PCI-Express 3.0 x16 slots, these could be arranged in the x16/x16/NC or x16/x8/x8 lane configuration.

EVGA was missing on the LGA2011 motherboard wall at this year's Computex event in June. EVGA is one of the top brands overclockers and enthusiasts look forward to, for motherboards. As a late consolation, EVGA gave out a teaser picture of one of its upcoming X79 motherboards a little later in June. At GeForce LAN 6, however, EVGA made full use of the spotlight to unveil its X79 Classified (E799), a top-tier socket LGA2011 motherboard clearly designed for overclockers.

The X79 Classified uses a traditional LGA2011 motherboard layout, but with wide open spaces to make insulating it (against condensation) easier. The CPU power delivery seems to be in the hands of some very high-grade VRM design, it draws power from two 8-pin EPS connectors apart from the 24-pin ATX (that's right-angled). There are just four DDR3 DIMM slots, one per memory channel. A 4-phase memory VRM is deployed. Over the chipset area, a large contiguous heatsink covers most hot components in the central-right region. We don't expect there to be a bridge chip.

Corsair, a worldwide designer and supplier of high-performance components to the PC gaming hardware market, today announced the world's first high-performance quad channel Dominator 32GB DDR3 memory kit.

The Dominator 32GB Quad Channel kit (part number CMT32GX3M4X1866C9) consists of four rigorously-screened 8GB DDR3 DRAM modules with Corsair's patented DHX+ heatsinks. It operates at 1.5V and is designed to run at 1866MHz, with 9-10-9-27 C9 timing. Corsair has compatibility tested the new 32GB Quad Channel kit with upcoming quad channel platforms as well as current dual channel platforms.

HIS released its latest mainstream graphics card, the HIS HD 6670 iSilence4. As the name suggests, this is a silent (fanless) graphics card based on the Radeon HD 6670 graphics processor. The card's design is based around Zalman's VNF100 GPU heatsink that provides passive cooling to the GPU, the DDR3 memory and simple FET configuration VRM fend for themselves. VNF100 features a variable fin profile design, that works to improve heat dissipation efficiency.

On the obverse side of the PCB, there is just the base of the heatsink, from here, heat is conveyed to the main portion of the heatsink that's over the reverse side of the PCB, using three heat pipes. The Radeon HD 6670 GPU is built on the 40 nm process, is DirectX 11 compliant, packs 480 stream processors, and features a 128-bit wide memory interface. On this card, 1 GB of AMD-branded DDR3 memory is used. The GPU is clocked at 800 MHz, and the memory at 1600 MHz DDR (25.6 GB/s bandwidth). Display outputs include one each of DVI, D-Sub, and HDMI. The card relies entirely on the PCI-Express slot for power. HIS did not give out pricing details.

ADATA Technology, a leading manufacturer of high-performance DRAM modules and NAND Flash application products, today announced the launch of its new Premier Pro DRAM modules.

The Premier Pro DRAM modules are designed for IT professionals who need to deliver rock-solid quality computer systems to their customers. The quality of ADATA Premier Pro modules are enhanced in two aspects. First, the modules are engineered for long term reliability. "When memory devices are not reliably engineered," said Ukyo Jeong, Vice President of DRAM product engineering at ADATA, "there is very high chance that the memory module will fail within the first year of usage." He continued: "a 1.6 to 3.2% rate of system failure due to problems with DRAM is not acceptable for IT professionals, and this is the typical failure range when a DRAM module uses components that are not subjected to burn-in process."

ASRock is readying is new, high-end socket LGA2011 motherboard targeting the upper-most tier of the PC enthusiast market, the X79 Extreme7. This board will be a part of the company's first wave of LGA2011 motherboards, which are slated for mid-November, 2011. Pictures scored by XFastest reveal the board to be filled to the brim with features. The CPU socket is powered by a 16-phase VRM making use of high-grade chokes, and server-grade poscap capacitors.

The socket is wired to six DDR3 DIMM slots arranged in sets of three on either sides of the socket, powered by a 4-phase VRM. Among channels A, B, C, and D; channels B and D have two DIMM slots wired, so if you have four DDR3 modules, you should populate slots 0, 2, 3, and 5; to take advantage of quad-channel DDR3 memory. There are heatsinks over the memory VRM areas, that are connected to the heatsink over the CPU VRM using heat pipes.

ASUS is ready with a new PCI-Express 3.0 compliant socket LGA1155 motherboard, adding to its recently-launched line of Intel Z68 chipset-based boards that feature Gen 3.0 PCI-Express x16 slots. This latest one is part of the elite Republic of Gamers (ROG) family, and is built on the compact micro-ATX form factor, called Maximus IV Gene-Z/Gen 3. This is the second modification of the Maximus IV Gene, the original was based on Intel P67 chipset, the Gene-Z replaced the chipset with Intel Z68 that supports Smart Response technology, while the Gene-Z/Gen 3 adds PCI-Express 3.0 x16 slots.

The board uses a 12-phase Digi+ VRM for the CPU, it is wired to four DDR3 DIMM slots supporting DRAM speeds of up to DDR3-2200 MHz with overclocking. The socket is wired to two PCI-Express 3.0 x16 slots over Gen 3 compliant switches and electrical components, the slots configure to PCI-Express 3.0 x8/x8 when both are populated. PCI-Express Gen 3 support requires next-generation 22 nm Ivy Bridge Core processors, which will be launched next year. The only other expansion slot is an open-ended PCI-Express 2.0 x4, wired to the Z68 PCH. NVIDIA SLI and AMD CrossFire are supported.

Gigabyte rolled out its latest budget socket LGA1155 motherboard in the micro-ATX form-factor, the GA-H61M-USB3-B3 rev. 2.0. This new board adds to the slim feature-set of Intel H61 with third-party SATA 6 Gb/s and USB 3.0 controllers. The CPU is powered by a 6-phase VRD12 compliant VRM, it is wired to just two DDR3 DIMM slots, supporting dual-channel DDR3-1333 MHz memory. Expansion slots include one PCI-Express 2.0 x16, a legacy PCI, and two PCI-Express 2.0 x1.

All four of the chipset's SATA 3 Gb/s ports are internal (H61 lacks SATA 6 Gb/s). An additional Marvell 88SE9172 controller gives out two SATA 6 Gb/s ports with RAID 0/1/0+1 support. An Etron EJ168 controller gives out two USB 3.0 ports on the rear panel. Gigabyte used a cost-effective Atheros AR8151 to handle gigabit Ethernet, while squeezing in the high-grade Realtek ALC889 HD audio codec to handle 6-channel audio. Display connectivity includes DVI, HDMI, and D-Sub. A number of USB 2.0 ports, and serial COM port (via header) make for the rest of the connectivity. The board is driven by dual AwardBIOS, with HybridEFI technology that lets it boot from >2 TB volumes. Pricing is unknown.

Super Talent Technology (San Jose, CA) announces a new line of Green-line series lower-power consumption DDR3 memory modules for severs.

These new eco-friendly modules feature lower operating voltages, lightweight and smaller form factors which improve cooling while continuing to satisfy the latest JEDEC standards. Super Talent engineers worked to reduced product height and succeeded with modules that measure 0.72 inches high; a full 39% reduction from a standard size module, yet can deliver speeds at 1600MHz and at 4GB capacities. The short form factor lets the system to run cooler by affording airflow across other components. These design also reduces the Voltage requirements a full 10%, from the traditional 1.5V traditional voltage to the new 1.35 volt standard.

ZOTAC International, a leading innovator and channel manufacturer of graphics cards, motherboards and mini-PCs, today launches the latest addition to the ZBOX nano product lineup with the new ZBOX nano VD01 series - an affordable palm-sized mini-PC powered by a VIA Nano X2 processor.

The ZOTAC ZBOX nano VD01 series combines the latest VIA Nano X2 U4025 CPU and VX900H media system processor for outstanding energy-efficiency and performance. VIA Chrome9 graphics with ChromotionHD 2.0 processing enables the ZOTAC ZBOX nano VD01 series to deliver silky-smooth playback of popular high-definition video formats, including Blu-ray, MPEG2, H.264, VC-1 and streaming Internet video.

BIOSTAR Group, a world famous manufacturer of motherboards, graphics cards, industrial computing systems and computer peripherals, proudly announces the TA990FXE motherboard aimed at the most demanding overclockers and gamers.

The TA990FXE is made in the ATX form-factor on the flagship AMD 990FX chipset in combination with the most advanced SB950 Southbridge which guarantees the support of the latest technologies and ensures the unprecedented performance. The board supports all Socket AM3+ based Phenom II X6, Phenom II X4, Phenom II X3, Phenom II X2, Athlon II X4, Athlon II X3, Athlon II X2 and Sempron CPUs including top 6-core and 8-core AMD FX, AMD Phenom II and AMD Athlon II chips with the maximum thermal design up to 140W.

Corsair, a worldwide designer and supplier of high-performance components to the PC gaming hardware market, today announced the addition of 8GB DDR3 memory modules to its Vengeance and Value Select product lines.

The new 8GB Vengeance DDR3 memory operates at 1.5V for compatibility with the new 2nd generation Intel Core processor family and is guaranteed to operate at 1600MHz. Providing 8GB of rigorously-screened DRAM on a single module allows gamers and performance enthusiasts to build systems with 32GB of high-performance memory.

Plextor Japan introduced its latest generation of solid state drives (SSDs) in the 2.5-inch SATA form factor. The drives take advantage of the SATA 6 Gb/s interface. The lineup currently consists of two models, the 128 GB PX-128M2P, and the 256 GB PX-256M2P. Both drives make use of Marvell 88SS9174 controller, and Toshiba TH58TV68D2FDA88 Multi-level cell (MLC) NAND flash built on the 34 nm process.

The 128 GB model features a 256 MB DDR3 cache, while the 256 GB model is backed by 512 MB DDR3 cache. Sequential speeds vary between the two models. The 256 GB drive can transfer data at 500 MB/s read and 440 MB/s write; while the 128 GB drive transfers at 500 MB/s read and 320 MB/s write. The drives feature SMART, NCQ, TRIM, Bad Block Management, Instant Restore, and Plextor TrueSpeed firmware. The 256 GB drive is priced at 46,800 JPY, an equivalent of US $610, while the 128 GB model is priced at 21,800 JPY, or $284.