Rugged embedded computing brand - Cincoze continues to deepen its embedded computer range. Two newly launched industrial computers (P2202 Series and P1201), released in 2023, have been widely favored by customers for their thin and light design, especially in mobile devices (AGV/AMR), control cabinets, and other space-constrained applications. Among their striking designs, the One Computer / Two Purposes function has attracted particular attention. They are not only slim embedded computers but, through the patented CDS (Convertible Display System, Patent no. M482908) technology, can also be transformed into panel PCs. They provide performance, screen size, display ratio, and touch options for various application environments, thereby creating diverse and flexible HMI and KIOSK applications.

The P2202 Series includes two models: P2202 and P2202E with PCIe expansion. They are equipped with an Intel Core i3/i5 U-Series (Alder Lake-P) CPU and support up to 64 GB of DDR5-4800 memory. The slim design (254.5 x 190 x 41.5 mm, Model: P2202) has rich native I/O and can also support 4G, Wi-Fi, and Bluetooth wireless modules through the built-in Mini PCIe and M.2 Key E slots. The P2202E also has a PCIe x4 slot which supports 75 W expansion cards. Moreover, Cincoze's exclusive modular expansion design allows user to add additional functions, such as PoE and IGN. The P2202 Series adheres to Cincoze's consistently high quality requirements, so in addition to being adaptable to wide temperatures (-40°C to 70°C) and voltages (9 to 48VDC), it has also successfully passed a variety of vibration and shock reliability tests, including sinusoidal vibration (1G), random vibration (5G), and shock resistance (50G). At the same time, it has passed industrial environment EMC standards (EN 61000-6-2 and EN 61000-6-4), reflecting reliability of the P2202 Series.

IBASE Technology Inc. (TPEx: 8050), a leading provider of embedded computing solutions, introduces the IB837 3.5" single board computer that is designed for a wide range of IoT applications, including industrial automation, smart retail, healthcare, smart city and edge AI solutions, combining powerful processing capabilities with extensive connectivity options.

At the heart of the IB837 is the onboard Intel Celeron N & J series (formerly Elkhart Lake) processor, offering a good balance of performance and power efficiency. With support for up to 16 GB of DDR4-3200 SO-DIMM memory, the SBC ensures smooth multitasking and efficient operation, delivering exceptional performance while consuming minimal power for applications requiring a compact form factor.

Nfina announces the addition of two new server systems to its lineup, customized for small to medium businesses and virtualized environments. Featuring 3rd Gen Intel Xeon Scalable Processors, these scalable server systems fill a void in the marketplace, bringing exceptional multi-socket processing performance, easy setup, operability, and Nfina's five-year warranty.

"We are excited to add two new 3rd generation Intel systems to Nfina's lineup. Performance, scalability, and flexibility are key deciding factors when expanding our offerings," says Warren Nicholson, President and CEO of Nfina. "Both servers are optimized for high- performance computing, virtualized environments, and growing data needs." He continues by saying, "The two servers can also be leased through our managed services division. We provide customers with choices that fit the size of their application and budget - not a one size fits all approach."

Amid the push for technology independence, Chinese companies are pushing out more products to satisfy the need for the rapidly soaring demand for domestic data processing silicon. Today, we have information that Chinese Loongson has launched a 3D5000 CPU with as many as 32 cores. Utilizing chiplet technology, the 3D5000 represents a combination of two 16-core 3C5000 processors based on LA464 cores, based on LoongArch ISA that follows the combination of RISC and MIPS ISA design principles. The new chip features 64 MB of L3 cache, supports eight-channel DDR4-3200 ECC memory achieving 50 GB/s, and has five HyperTransport (HT) 3.0 interfaces. The TDP configuration of the chip is officially 300 Watts; however, normal operation is usually at around 150 Watts, with LA464 cores running at 2 GHz.

Scaling of the new chip goes beyond the chiplet, and pours over into system, as 3D5000 supports 2P and 4P configurations, where a single motherboard can become a system of up to 128 cores. To connect them, Loongson uses a 7A2000 bridge chip that is reportedly 400% faster than the previous solution, although we have no information about the last chip bridge. Based on the LGA-4129 package, the chip size is 75.4x58.5×6.5 mm. Regarding performance, Loongson compares it to the average Arm chip that goes into smartphones and claims that its designs are up to four times faster. In SPEC2006, performance reaches 425 points, while maintaining a single TeraFLOP at dual-precision 64-bit format. On the other hand, the processor was built for security, as the chip has a custom hardware-baked security to prevent Spectre and Meltdown, has an on-package Trusted Platform Module (TPM), and has a secret China-made security algorithm with an embedded custom security module that does encryption and decryption at 5 Gbps.

IBASE Technology Inc., a leading global provider of industrial-grade digital signage players, is pleased to unveil the SI-111-N, a palm-sized fanless 4K digital signage player system based on the Intel Atom x6211E and Celeron N6210 processors. Equipped with an HDMI 2.0b port that supports 3840 x 2160 @60Hz resolution, the industrial-grade system enables businesses to easily connect to a 4K display and create immersive visual experiences that attract attention and effectively promote their products or services.

IBASE values sustainable development and ESG practices. The SI-111-N incorporates various energy-saving features, including IBASE's proprietary iSMART green technology that enables power on/off scheduling with power resume capabilities, and the Observer utility that remotely monitors system voltages and temperature to ensure the system is operating efficiently while minimizing energy consumption. The SI-111-N's extensive I/O connectivity offers a rich array of expansion options, reliable data handling, and wireless operation, which includes 1x 2.5GbE LAN, 1x COM (RS-232) port, 1x M.2 M-Key (2280) and 1x M.2 E-Key (2230) sockets.

Minisforum announced its first Mars series mini PC MC560 last December, and today it is finally going on sale. Unlike previous versions, the MC560 upgrades the CPU from Ryzen 5 5600U to Ryzen 5 5625U. It has 6 cores and 12 threads and is based on the Zen 3 architecture. The based clock is 2.30 GHz and can be boosted up to 4.30 GHz. The chip is manufactured on the 7 nm TSMC process. The MC560 is different from other mini PCs. It is an all-in-one conference mini PC that combines feature of computer, camera, mic and speakerphone all together to reduce wasted space and cross cabling by taking off unnecessary devices.

It has a 2.5K webcam with HDR support and a 93.8-degree field of view. The adjustable base offers 10°tilt change to the view. With the help of 4 Ω/3 W dual independent speaker design, the maximum sound distortion does not exceed 5%, reflecting authentic human voice. The microphone uses the MEMS dual array with an independent DSP chip for assistance. Combined with the AI intelligence algorithm, it can not only suppress the reverberation, intelligently recognize human voice, but also eliminate environmental noise, thereby accurately restoring human voice.

Cooler Master at the 2023 International CES showed off the Cooling X, a patent-pending unique desktop PC architecture by the company where the liquid cooling of the CPU and GPU isn't confined to a couple of closed loop AIOs, but rather a giant liquid-cooling loop that even involves the side-panels of the case itself, that double up as additional heat-dissipation surfaces. Notice how some compact fanless cases use extruded-aluminium body panels that double up as heatsinks, to cool the hot components? The Cooling X re-imagines this, where instead of dissipating heat from a heatpipe, the extruded-aluminium body panels have coolant channels, so some of the heat from the liquid-cooling loop is dissipated. These panels supplement a conventional liquid-cooling radiator that's located along the rear panel, which has active ventilation. The liquid-cooling loop cools the processor and GPU.

For its compact dimensions of just 266 mm x 149 mm x 371 mm (LxWxH), the Cooling X prebuilt packs some mighty high-end hardware—an AMD Ryzen 9 5950X 16-core processor, and a Radeon RX 6800 XT GPU up to 64 GB of dual-channel DDR4-3200 memory, two 2 TB M.2 NVMe SSDs, and a homebrew 850 W 80 Plus Gold SFX power supply. For now Cooling X is just a codename, and Cooler Master intends to take this concept forward with high-performance gaming/creator prebuilt desktops sold under its own marquee.

Nfina announces the addition of three new server systems to its lineup, customized for hybrid/multi-cloud, hyperconverged HA infrastructure, HPC, backup/disaster recovery, and business storage solutions. Featuring 3rd Gen Intel Xeon Scalable Processors, Nfina-Store, and Nfina-View software, these scalable server systems fill a void in the marketplace, bringing exceptional multi-socket processing performance, easy-to-use management tools, built-in backup, and rapid disaster recovery.

"We know we must build systems for the business IT needs of today while planning for unknown future demands. Flexible infrastructure is key, optimized for hybrid/multi-cloud, backup/disaster recovery, HPC, and growing storage needs," says Warren Nicholson, President, and CEO of Nfina. He continues by saying, "Flexible infrastructure also means offering managed services like IaaS, DRaaS, etc., that provide customers with choices that fit the size of their application and budget - not a one size fits all approach like many of our competitors. Our goal is to serve many different business IT applications, any size, anywhere, at any time."

Axiomtek - a world-renowned leader relentlessly devoted to the research, development, and manufacture of series of innovative and reliable industrial computer products of high efficiency - is pleased to announce the iNA200, a DIN-rail cybersecurity gateway for operational technology (OT) network security. The iNA200 is powered by the Intel Atom x6212RE or x6414RE processor (Elkhart Lake) and has one DDR4-3200 SO-DIMM for up to 32 GB of system memory. For demanding rugged environments, this fanless IIoT edge gateway comes with a wide operating temperature range of -40°C to 70°C and supports wide power input of 9 to 36 VDC with dual power input. The iNA200 also has two 2.5G LAN ports, sufficient storage, and high expandability for various industrial application needs.

"OT cybersecurity is essential for Industry 4.0. Axiomtek's iNA200 is designed to safeguard your OT assets and avoid network threats for critical infrastructure," said Kevin Hsiao, a product manager of Network Computing Platform Division at Axiomtek. "Additionally, our iNA200 features an M.2 Key B slot to enable 5G connectivity for next-generation industrial use cases. With the Trusted Platform Module 2.0 (TPM 2.0) support, this cybersecurity gateway increases security offering hardware-level protection against malware and sophisticated cyber-attacks."

Axiomtek, a world-renowned leader relentlessly devoted to the research, development, and manufacturing of innovative and reliable industrial computer products of high efficiency—is glad to introduce the IMB540, a superior industrial ATX motherboard featuring the LGA1700 socket for the 12th generation Intel Core i9/i7/i5/i3 processors (code name: Alder Lake-S). In addition to providing high computing performance, the IMB540 ATX motherboard features quad displays and dual GPU expansion, delivering intelligent workload optimization and highly scalable graphics for next-gen edge AIoT applications.

he Axiomtek's IMB540 is built with Intel R680E chipset and features ranging CPU options with the 12th generation Intel Core, Intel Pentium and Intel Celeron processors. In addition to this, it is equipped with four DDR4-3200 ECC/non-ECC un-buffered Long-DIMM slots with a total capacity of 128 GB. This motherboard has a total of five PCIe slots—two PCIe 4.0 x16 slots and three PCIe x4 slots—for GPU, AI acceleration, frame grabber, NIC, and motion control card configurations. The networking interfaces consist of a 2.5 GbE LAN port with time sensitive networking (TSN), a GbE LAN port, as well as a PCIe Mini Card slot with SIM slot for Wi-Fi/Bluetooth/LTE connectivity. Featuring Intel Iris Xe Graphics, the IMB540 supports up to four independent displays via HDMI, DVI-D, VGA, and DisplayPort.

In December of 2021, we covered the appearance of Russia's home-grown Baikal-S processor, which has 48 cores based on Arm Cortex-A75 cores. Today, thanks to the famous chip photographer Fritzchens Fritz, we have the first die shows that show us exactly how Baikal-S SoC is structured internally and what it is made up of. Manufactured on TSMC's 16 nm process, the Baikal-S BE-S1000 design features 48 Arm Cortex-A75 cores running at a 2.0 GHz base and a 2.5 GHz boost frequency. With a TDP of 120 Watts, the design seems efficient, and the Russian company promises performance comparable to Intel Skylake Xeons or Zen1-based AMD EPYC processors. It also uses a home-grown RISC-V core for management and controlling secure boot sequences.

Below, you can see the die shots taken by Fritzchens Fritz and annotated details by Twitter user Locuza that marked the entire SoC. Besides the core clusters, we see that a slum of cache connects everything, with six 72-bit DDR4-3200 PHYs and memory controllers surrounding everything. This model features a pretty good selection of I/O for a server CPU, as there are five PCIe 4.0 x16 (4x4) interfaces, with three supporting CCIX 1.0. You can check out more pictures below and see the annotations for yourself.

Elitegroup Computer Systems (ECS), the global leading motherboard, Mini-PCs, Notebooks, mobile device, and smart city solutions provider, is proud to introduce "Be fast and free" as the core of the excellent and comprehensive All-in-One LIVA G24-MH610. It is versatile and features support for Intel 12th Gen processors with LGA1700 Socket for everyday computing use. It uses DDR4 dual-channel memory technology and expands through the M.2 slot to meet various needs. The LIVA G24-MH610 is built for commercial and home use with a full HD 23.8-inch display, 178 degrees wide viewing angle, and 10-point multi-touch screen. It's suitable for any business application such as interactive whiteboard, hotel check-in, retail kiosk, video conferencing, and so on.

LIVA G24-MH610 equips with Intel 12th Generation Core i3, i5, i7 processors to bring the efficient and stable computing experience for daily work tasks and high-performance computing like terminals and gates. It supports dual-channel DDR4-3200 memory up to 64 GB, one 2.5-inch HDD or SSD with SATA interface and one M.2 2280 SSD slot to easily upgrade computing efficiency and storage space. In addition, LIVA G24-MH610 provides multiple options on the availability of ODD, touch screen and extra set of 2.5-inch HDD/SSD slot for different scenarios.

Colorful Technology Company Limited, a professional manufacturer of graphics cards, motherboards, all-in-one gaming and multimedia solutions, and high-performance storage, announce the launch of the COLORFUL X15-AT 22 gaming laptop equipped with a 12th generation Intel Core i9 processor and NVIDIA GeForce RTX 3060 graphics. The COLORFUL X15-AT 22 is coming to the United States via Newegg.

The COLORFUL X15-AT 22 is equipped with the latest 12th generation Intel Core i9-12900H processor with 8 cores and 16 threads, and a maximum boost clock of 4.60 GHz. The gaming laptop is also fitted with 16 GB of DDR4-3200 memory - upgradeable to 64 GB. For storage, the X15-AT 22 packs a 512 GB PCIe Gen4 SSD. The X15-AT 22 also features a Thunderbolt 4 port with up to 40 Gbps transfer speed.

Silicon Motion Technology Corporation ("Silicon Motion"), a global leader in designing and marketing NAND flash controllers and solid-state storage devices today announces MonTitan, a PCIe Gen5 SSD solution platform perfectly suited for the most challenging Datacenter and Enterprise applications. Silicon Motion's new MonTitan platform features an entirely new, purpose-built ASIC and FW architecture, optimized for performance and QoS. Its unique Layered FW stack enables the development of customer differentiated solutions with a high degree of flexibility and accelerated time to market, all while reducing engineering cost.

"SSD storage solutions are evolving to address new challenges in data centers which demand changes in storage platforms and operating models," said Nelson Duann, Silicon Motion's Senior Vice President of Marketing and R&D. "Our MonTitan SSD solution is an innovative PCIe Gen5 SSD platform designed to satisfy the unique demands of datacenters today while providing flexibility and programmability to meet future evolving standards."

GIGABYTE Technology, an industry leader in high-performance servers and workstations, today announced support for AMD Ryzen Threadripper PRO 5000WX Series processors on GIGABYTE motherboards, MC62-G40 and MC62-G41, and a workstation, W771-Z00; additionally, a BIOS update is available now to support the new CPU series. The Threadripper PRO line of CPUs is designed for the best in productivity at professional workstations. These GIGABYTE workstation products have enterprise-class reliability and have been in the market supporting the prior generation Threadripper PRO 3000WX series, and now these products will support the 5000WX series for fast rendering, encoding, compiling, modeling, simulating, and more.

Intel today debuted the 12th Gen Core HX "Alder Lake" processors for high-end gaming notebooks and mobile workstations. These processors are designed to bring desktop-class performance to the mobile segment, and debut the "Alder Lake" C0 silicon in a mobile package. Until now, the fastest Core "Alder Lake" mobile processor was based on a silicon that physically had 6 performance cores (P-cores), and 8 efficiency cores (E-cores). The HX-series sees the desktop C0 silicon, with its 8 P-cores and 8 E-cores, and 30 MB of L3 cache, in the mobile form factor.

This also brings PCI-Express 5.0 x16 PEG connectivity for discrete graphics cards, 8-lane DMI 4.0 chipset bus, and a mobile variant of the Z690 chipset, which can put out two M.2 NVMe Gen 4 slots in addition to the one from the processor die. The additional PCIe budget should allow up to two discrete Thunderbolt 4 controllers. Memory support includes dual-channel (4 sub-channel) DDR5-4800, dual-channel DDR4-3200, and LPDDR4-4267. Certain models even have ECC memory support, targeted at mobile workstations. Intel is using the highest bins of the C0 die, coupled with some aggressive power-management, to achieve processor base power (PBP) of 55 W (10 W lower than the 65 W PBP of the desktop Core i9-12900). The maximum turbo power value for all SKUs is set at 154 W. All processor models in the Core HX series will come with memory overclocking support, some even with CPU overclocking support.

Sabrent Rocket 8 GB, 16 GB, and 32 GB DDR4 SO-DIMM 3200 MHz Memory Module for laptop, Ultrabook, and mini-PC. Expand your horizons with Sabrent Rocket DDR4 memory. Your favorite SSD company wants to make sure the rest of your system feels responsive, too. We provide affordable, high-capacity DRAM options to make sure you never feel left behind. Our passion for memory matches your desire to exceed the limits of your imagination. Our design is tight and cool, making sure never to get in the way of your dreams.

Running out of memory? Providing up to 32 GB of memory per stick, Sabrent's Rocket DDR4 has all your needs covered. You're just a single upgrade away from a lag-free experience. Don't let your lack of memory slow you down - realize the potential to multi-task like never before. Our DRAM will improve your productivity and your gaming experience, all at the same time.

GIGABYTE Technology, an industry leader in high-performance servers and workstations, today announced a new enterprise-grade motherboard, MC62-G41, for AMD Ryzen Threadripper PRO 3000WX and next generation processors, and another board for the Intel platform, MW34-SP0, featuring enterprise features such as ECC memory support for 12th Gen Intel Core processors. Both platforms will ensure a high level of productivity, availability, and security for professional workstations.

AMD recently drew the curtain on AMD Ryzen Threadripper PRO next generation workstation processors. For this new series of processors, GIGABYTE launched the MC62-G41 using the WRX80 platform that is also backwards compatible with the AMD Ryzen Threadripper PRO 3000 WX Series processors. The WRX80 chipset supports CPUs up to 64 cores and 128 threads, along with 8-channel memory (ECC/non-ECC) DDR4-3200 and 128 PCIe 4.0 lanes.

ASRock Industrial launches a new range of industrial motherboards powered by 12th Gen Intel Core Processors (Alder Lake-S) with up to 16 cores and 24 threads, supporting the new Intel 600 Series W680, Q670, and H610 chipsets. Featuring high computing power with performance hybrid architecture and enhanced AI capabilities, rich IOs and expansions for up to quad displays 4K@60 Hz, USB 3.2 Gen2x2 (20 Gbit/s), triple Intel 2.5 GbE LANs with real-time TSN, multi M.2 Key M, ECC memory, plus TPM 2.0, and wide voltage support. The new series covers comprehensive form factors, including industrial Mini-ITX, Micro-ATX, and ATX motherboards for diverse applications, such as factory automation, kiosks, digital signage, smart cities, medical, and Edge AIoT applications.

Today, Intel announced the Intel NUC 12 Extreme (code-named Dragon Canyon) and the Intel NUC 12 Extreme Compute Element (code-named Eden Bay), a highly modular desktop PC kit engineered to provide phenomenal performance for high-end gaming and content creation tasks. With the latest 12th Gen Intel Core desktop processors, capacity for full-size 12-inch discrete graphics cards and a full range of I/O ports including Thunderbolt 4, the Intel NUC 12 Extreme delivers massive performance and features that enthusiast gamers and professional creators need in a compact and modular form factor.

The Intel NUC 12 Extreme brings Intel's new performance hybrid architecture and a socketed motherboard to the NUC line for the first time. For those who want a powerful system with a small footprint and more versatility than ever before, the Intel NUC 12 Extreme Kit is an outstanding option. The most powerful Intel NUC yet encompasses new features, like performance hybrid architecture and access to faster PCIe interfaces, accelerating load times, all in a footprint that can fit on any desk.

With the rapid development of advanced technologies, such as 5G, the Internet of Things (IoT), Artificial Intelligence (AI), and 8K, people are placing more stringent requirements on the convenience, intelligence, and functional integration of their electronics. This has given rise to new development opportunities in the storage industry. As we progress further into the digital revolution, intelligent electronics will require small-capacity storage products which feature an increased level of reliability and stability. High-temperature tolerance in storage products will be vital for customers in the intelligent and small-sized consumer electronics market.

Longsys recently launched the FORESEE DDR4, which utilizes 96-ball thin fine ball grid array (TFBGA) encapsulation. The product's manufacturing process, transmission speed, power consumption, and high-temperature reliability all perform at an industry-leading level.

With the 15.6 and 17.3 inch XMG APEX gaming laptops, XMG is positioning a new model series below its own high-end range consisting of the NEO and PRO series. These new laptops combine mobile AMD eight-core processors up to the Ryzen 9 5900HX with NVIDIA GeForce RTX graphics cards up to the RTX 3070. The company is simultaneously introducing the XMG FOCUS, a new product series in the entry-level segment. Intel's Core i7-11800H and an NVIDIA GeForce RTX 3050 Ti offer decent gaming performance, while good connectivity and memory round off the overall package. All four new models feature an IPS display with 144 Hz.

Until now, the XMG APEX 15 in the older E20 generation represented uncompromising desktop CPU performance, with processors up to the Ryzen 9 3950X in a laptop. Although XMG is already working on a direct successor under a slightly different name, it is unleashing the XMG APEX 15 and APEX 17 of the M21 generation for the time being with the currently fastest eight-core mobile processors from AMD. The laptops are available with an AMD Ryzen 7 5800H as well as with the slightly faster Ryzen 9 5900HX from the 54 watt TDP class, as well as with an NVIDIA GeForce RTX 3070 or RTX 3060 in the respective maximum TGP configuration (RTX 3070: 125 watts plus 15 watts Dynamic Boost 2.0; RTX 3060: 115 watts plus 15 watts Dynamic Boost 2.0).

TYAN, an industry-leading server platform design manufacturer and a MiTAC Computing Technology Corporation subsidiary, today introduced a new Intel Xeon E-2300 processor-based server motherboard to the market. The new product is designed to offer enhanced performance, greater PCIe support and faster memory speeds for entry-level servers in data centers and prevailing Multi-access Edge Computing (MEC) servers in 5G networks.

"TYAN's Tempest CX S5560 server motherboard based on Intel Xeon E-2300 processor is optimized for cloudand edge computing applications. By utilizing Intel's features of increased DDR4 speeds, double M.2 slots, and PCIe 4.0 capabilities, TYAN's customers can get outstanding performance and maintain their competitiveness with cost-effective benefit", said Danny Hsu, Vice President of MiTAC Computing Technology Corporation's Server Infrastructure Business Unit.

Intel today launched its newest generation Intel Xeon W-3300 processors, available today from its system integrator partners. Built for advanced workstation professionals, Intel Xeon W-3300 processors offer uncompromised performance, expanded platform capabilities, and enterprise-grade security and reliability in a single-socket solution.

Intel Xeon W-3300 processors are intelligently engineered to push the boundaries of performance, with a new processor core architecture that transforms for what expert workstation users can accomplish on a workstation.

The Intel Xeon W-3300 processors are designed for next-gen professional applications with heavily threaded, input/output-intensive workloads. Use cases stretch across artificial intelligence (AI), architecture, engineering, construction (AEC), and media and entertainment (M&E). With a new processor core architecture to transform efficiency and advanced technologies to support data integrity, Intel Xeon W-3300 processors are equipped to deliver uncompromising workstation performance.

Following the Intel versions of the high-end laptops from the NEO model series, XMG is also revamping the CORE 15 and CORE 17 from the upper mid-range performance sector. The discreetly elegant gaming notebooks combine Intel's Core i7-11800H with an NVIDIA GeForce RTX 3060 with maximum TGP. But the upgrade to the new Tiger Lake processors is not only accompanied by the transition to PCI Express 4.0 connections to the graphics card and M.2 SSD. The M21 model generation of the CORE laptops also integrates a Thunderbolt 4 connection for the first time and introduces extended options for CPU undervolting and memory tuning.

Just this January, XMG introduced the E21 model generation of its CORE laptops with NVIDIA's GeForce RTX 3060 and either AMD or Intel processors. Following the launch of the new 11th generation Core processors, the Intel-based versions of the XMG CORE 15 and CORE 17 (M21) now receive an update to the latest eight-core CPU i7-11800H. This is still accompanied by a GeForce RTX 3060 in the maximum configuration with a TGP of up to 130 watts, including 15 watts Dynamic Boost 2.0. A MUX switch allows NVIDIA Optimus to be disabled via the BIOS.