G.SKILL International Enterprise Co., Ltd., the world's leading manufacturer of extreme performance memory and gaming peripherals, is thrilled to announce the availability of the latest Trident Z Royal Elite memory series, along with the introduction of new high-speed, low-latency performance memory specifications at DDR4-4000 CL14-15-15-35 and DDR4-3600 CL14-14-14-34. Built with Samsung 8 Gb B-die ICs to achieve these incredibly low latency timings, these new DDR4 memory specifications are the ideal choice for building a powerful workstation or the ultimate gaming system.

G.SKILL is dedicated to developing high-speed, low-latency memory kits for high performance PC systems, and achieving an extremely low CL14 latency on high-speed dual-ranked memory modules is no easy feat. Created with Samsung B-die ICs, G.SKILL is launching the incredible DDR4-4000 CL14-15-15-35 memory specification with 16 GB modules for a 32 GB (16 GB x2) kit capacity. Below is a screenshot showing the memory kit on the ASUS ROG STRIX Z590-E GAMING WIFI motherboard with the Intel Core i7-11700KF processor.

The EUROCOM Sky Z7 R2 has unmatched levels of upgradeability through the Mobile Supercomputer's modular slots, allowing the safe removal and replacement of important hardware components such as the laptop's CPU, GPU, Memory, Storage, LCD, and more. Having slots or sockets allows the Sky Z7 R2 to customized, upgraded and modified with compatible parts- giving this Eurocom Mobile Supercomputer the ability to run the most demanding applications and perform high level tasks for a very long time. As newer and improved technologies emerge within the same chipset, the EUROCOM Sky Z7 R2's hardware components such as the CPU, GPU, RAM, storage, LCD, to name a few, can all be upgraded and replaced relatively easy in order to acquire more power as desired. Having modular components greatly increases the laptop's lifespan for many years and prevents the cycle of having to buy new laptops every few years, which can be the case with most laptops that have non-upgradeable components.

Eurocom's Sky Z7 R2 is one of the few laptops that utilizes modular GPU technology based on the MXM 3.1 version 2.0 socket technology. This means the Mobile Supercomputer's high performance GPU can be replaced at any time as long as it is compatible in the chipset, allowing the EUROCOM Sky Z7 R2 to perform at an extremely high level throughout the duration of its long lifespan. This Mobile Supercomputer can be configured up to the GeForce RTX 3080 which delivers twice the performance as its previous generation counterpart (GeForce RTX 2080). The EUROCOM Sky Z7 R2 offers seamless and stutter-free 4K gaming at 60 FPS, as well as 8K video editing, rendering and gaming.

EliteMini TL50 is an ultra-compact and high-performance mini PC specially designed for home and office use. Equipped with Intel 11th generation CPU and Intel Iris Xe graphics. Intel Wi-Fi 6 & triple output, upgrade-friendly & windows 10 pro pre-installed.

TL50 comes with Intel Core i5-1135G7 processor (Tiger Lake), 4 cores/8 threads, backed up by Intel Iris Xe graphics, with 8M Cache, max turbo frequency up to 4.20 GHz. It is 20% faster than its predecessor with more cache memory, DDR4-3200 memory and PCIe 4.0 support. Not only ordinary work but also a little heavy games and video editing can be done comfortably.

XMG introduces an additional configuration variant to the high-end NEO range of gaming laptops with Intel's new Tiger Lake H45 processors. The eight-core CPUs from the 11th Core generation not only offer higher performance compared to their predecessors, but also boast the advantages of a completely updated platform. These includes support for PCI Express 4.0 and Thunderbolt 4 - features that the AMD version of the XMG NEO cannot offer. In addition, the models utilising the new Intel processor also benefit from a slight performance increase on the graphics card side. The GPU in the XMG NEO 15 and NEO 17 (M21) now operates with a TGP of up to 165 instead of 150 watts.

Intel has quietly let out details of its latest-generation Xeon W series workstation processors based on the 14 nm "Rocket Lake" silicon. These chips are built in the same Socket LGA1200 package as the 11th Gen Core desktop processors, but compatible with the W580 chipset. The lineup includes two 6-core/12-thread; and five 8-core/16-thread parts. Leading the pack is the Xeon W-1390P, with clock speeds of up to 5.30 GHz, followed by the W-1390, at 5.20 GHz. These two SKUs feature Thermal Velocity Boost, and are analogous with the 11th Gen Core i9 series.

Next up, are the Xeon W-1370P and W-1370, clocked at speeds of up to 5.20 GHz, and 5.10 GHz respectively, These parts lack Thermal Velocity Boost, and are comparable in many ways to the 11th Gen Core i7 SKUs. The slowest of these 8-core parts is the energy-efficient W-1390T, ticking at nominal clocks of just 1.50 GHz, with 4.90 GHz maximum boost, but a TDP of just 35 W. Among the other SKUs, the "P" SKUs have rated TDP of 125 W, while the non-P ones have 80 W. The 6-core/12-thread SKUs include the W-1350P and W-1350, clocked up to 5.10 GHz and 5.00 GHz, respectively. All Xeon W processors support up to 128 GB of dual-channel DDR4-3200 memory with ECC support.

AMD has today updated its Radeon Software Adrenalin 2020 Edition version 21.5.1 drivers, bringing many features on board as well as fixing a lot of issues that have appeared in the past. Starting with support for the Resident Evil Village PC game, AMD promises to deliver up to 13% better frame rate at 4K maximum settings, while using the Radeon RX 6800 XT graphics card. The comparison was conducted with a reference to the previous driver, 21.4.1, which didn't allow the card to reach as high FPS as it is now possible with the proper support for the game. Another game that is added to the support list is Metro Exodus PC Enhanced Edition. Some fixes have been implemented, as the incorrect performance metrics that may have incorrectly reported temperatures on Ryzen 5 1600 series processors. For a detailed list of bug fixes, please take a look at the list below.DOWNLOAD: AMD Radeon Software Adrenalin 2020 Edition 21.5.1

IBASE Technology Inc. (TPEx: 8050), IBASE, a leading provider of industrial motherboards and embedded systems, launches its latest 3.5" SBC IB953 powered by 11th Gen Intel Core processors (codenamed Tiger Lake). Measuring 146 x 102 mm in a compact footprint, the single board computer offers impressive I/O and computing performance, making it an ideal platform for a broad range of demanding applications in factory automation, machine vision, healthcare, as well as retail environments.

The IB953 features a 5G compatible M.2 3052 socket and the latest 11th Gen. Intel Core and Celeron processors built on 10 nm SuperFin process, delivering up to 25% faster performance and greater AI acceleration. With the Intel Core i7-1185G7 (IBASE model IB953AF-I7) comes the new Iris Xe (Xe-LP) graphics architecture supporting 96 EUs (Execution Units) which equals 768 cores and runs at 1.35 GHz, an increase of 250 MHz over the previous 11-gen graphics to provide up to twice the performance and improved power efficiency. The graphics engine's hardware acceleration can drive up to four simultaneous 4K HDR displays (via 2x DisplayPort + eDP and LVDS).

Intel's fabled 8-core "Tiger Lake-H" silicon built on the 10 nm SuperFin process, is close to reality. The company's upcoming 11th Gen Core "Tiger Lake-H" processors for performance- and gaming notebooks, leverages this die. An HD Tecnologia report leaks alleged company slides from Intel that detail the processor line up and feature-set. To begin with, the 11th Gen Core-H series processors come in core-counts ranging from 4-core/8-thread, to 6-core/12-thread, and 8-core/16-thread. Look at the embargo date on the leaked slides, one could expect a formal launch as close as May 11, 2021.

The 10 nm SuperFin "Tiger Lake-H" silicon features 8 "Willow Cove" CPU cores, and an updated iGPU based on the company's latest Gen12 Xe LP graphics architecture. Each of the eight CPU cores has 1.25 MB of L2 cache, and they share a massive 24 MB of L3 cache. The Gen12 Xe LP iGPU only has 32 execution units (EUs), according to the slides, 1/3rd those of the 96 EUs on the "Tiger Lake-U." The uncore component is also updated, now featuring dual-channel DDR4-3200 native support, and a 28-lane PCI-Express 4.0 root-complex. 16 of these lanes are wired out as PEG (PCI-Express Graphics), four as a CPU-attached NVMe slot, and eight toward the 8-lane DMI 3.0 chipset bus.

The 11th Gen Intel Core S-series desktop processors (code-named "Rocket Lake-S") launched worldwide today, led by the flagship Intel Core i9-11900K. Reaching speeds of up to 5.3 GHz with Intel Thermal Velocity Boost, the Intel Core i9-11900K delivers even more performance to gamers and PC enthusiasts.

Engineered on the new Cypress Cove architecture, 11th Gen Intel Core S-series desktop processors are designed to transform hardware and software efficiency and increase raw gaming performance. The new architecture brings up to 19% gen-over-gen instructions per cycle (IPC) improvement for the highest frequency cores and adds Intel UHD graphics featuring the Intel Xe graphics architecture for rich media and intelligent graphics capabilities. That matters because games and most applications continue to depend on high-frequency cores to drive high frame rates and low latency. Designed to Game: With its new 11th Gen desktop processors, Intel continues to push desktop gaming performance to the limits and deliver the most amazing immersive experiences for players everywhere.Read the TechPowerUp Reviews of the Core i9-11900K and Core i5-11600K.

As the industry is preparing for a shift to the new DDR standard, companies are trying to adopt the new technology and many companies are manufacturing the latest DDR5 memory modules. One of them is Shenzhen Longsys Electronics Co. Ltd, a Chinese manufacturer of memory chips, which has today demonstrated the power of DDR5 technology. Starting with this year, client platforms are expected to make a transition to the new standard, with the data center/server platform following. Using Intel's yet unreleased Alder Lake-S client platform, Longsys has been able to test its DDR5 DIMMs running at an amazing 6400 MHz speed and the company got some very interesting results.

Longsys has demoed a DDR5 module with 32 GB capacity, CAS Latency (CL) of 40 CL, operating voltage of 1.1 V, and memory modules clocked at 6400 MHz. With this being an impressive memory module, this is not the peak of DDR5. According to JEDEC specification, DDR5 will come with up to 8400 MHz speeds and capacities that are up to 128 GB per DIMM. Longsys has run some benchmarks, using an 8-core Alder Lake CPU, in AIDA64 and Ludashi. The company then proceeded to compare these results with DDR4-3200 MHz CL22 memory, which Longsys also manufactures. And the results? In AIDA64 tests, the new DDR5 module is faster anywhere from 12-36%, with the only regression seen in latency, where DDR5 is doubling it. In synthetic Ludashi Master Lu benchmark, the new DDR5 was spotted running 112% faster. Of course, these benchmarks, which you can check out here, are provided by the manufacturer, so you must take them with a grain of salt.

The 11th Gen Intel Core S-series desktop processors (code-named "Rocket Lake-S") launched worldwide today, led by the flagship Intel Core i9-11900K. Reaching speeds of up to 5.30 GHz with Intel Thermal Velocity Boost, the Intel Core i9-11900K delivers even more performance to gamers and PC enthusiasts.

Engineered on the new Cypress Cove architecture, 11th Gen Intel Core S-series desktop processors are designed to transform hardware and software efficiency and increase raw gaming performance​. The new architecture brings up to 19% gen-over-gen instructions per cycle (IPC) improvement for the highest frequency cores and adds Intel UHD graphics featuring the Intel Xe graphics architecture for rich media and intelligent graphics capabilities. That matters because games and most applications continue to depend on high-frequency cores to drive high frame rates and low latency.

Innodisk is proud to announce multiple new products coinciding with Embedded World 2021, to be held from 1 - 5 March 2021. As a leading global provider of industrial-grade flash, DRAM, and embedded peripherals, Innodisk strives to maintain its unrelenting pace of innovation in the face of the past year's pandemic challenges. Kicking off this year of the Ox on a high note, Innodisk is announcing new PCIe Gen 4 NVMe flash storage, DDR4-3200 DRAM, and CANbus & LAN modules.

Innodisk's NVMe flash storage series now supports the latest PCIe Gen 4 interface with a staggering 7.88 GB/s transfer rate—double the bandwidth of Gen 3—that simultaneously lowers overall power consumption, reducing the overheating issues of many PCIe SSDs. Smart temperature control through thermal throttling firmware technology is convenient for users to monitor temperature changes of SSDs at any time, and protect data with higher performance.

A leaked marketing slide from MSI Japan confirmed specifications of three 11th Gen Core "Rocket Lake-S" desktop processors that gamers and enthusiasts have their eyes on—the flagship Core i9-11900K, the next-best Core i7-11700K, and the performance-segment Core i5-11600K. The slides confirm that both the i9-11900K and i7-11700K are 8-core/16-thread parts, while the i5-11600K is 6-core/12-thread. With the "Rocket Lake-S" die capping out at 8 cores, Intel's product managers have lesser wiggle room to segment the Core i7 part from the Core i9 flagship.

The i9-11900K comes with a base frequency of 3.50 GHz, Turbo Boost 2.0 frequency of 5.10 GHz, Turbo Boost Max 3.0 frequency of 5.20 GHz, and Thermal Velocity Boost frequency of 5.30 GHz. Its all-core boost frequency is 4.80 GHz. The i7-11700K, on the other hand, lacks TVB. It ticks at 3.60 GHz base, 4.90 GHz Turbo Boost 2.0, and 5.00 GHz Turbo Boost Max 3.0. The i5-11600K lacks Turbo Boost Max 3.0 and TVB, it does 3.90 GHz base, with 4.90 GHz Turbo Boost 2.0. The Core i9 and Core i7 parts are joined at the hip with not just identical core counts, but also the same amount of L3 cache, at 16 MB. The i5 comes with 12 MB. All three Unlocked "K" SKUs come with native support for DDR4-3200 memory frequency, and their TDP is rated at 125 W. Intel is expected to launch these processors by late-March, 2021.

The leading global motherboard manufacturer, graphics card, and small form factor PC manufacturer, ASRock, proudly announces the compact Mini PC - Jupiter X300. This product supports AMD Ryzen 4000G Series processors and up to 64 GB fast DDR4-3200 MHz memory. This delivers decent performance for a wide range of home entertainment and business use. Jupiter X300 provides perfect expandability with only 1L of size, a PCIe Gen3 Ultra M.2 (2280) SSD slot, a 2.5-inch SATA 6 Gb/s hard drive bay, and a M.2 Key-E slot for Wi-Fi module.

The connectivity of ASRock Jupiter X300 Mini PC includes dual USB Type-C ports, six USB Type-A connectors as well as three simultaneous display outputs which include DisplayPort, HDMI, and D-Sub. In this way, ASRock Jupiter X300 Mini PC offers users productivity and flexibility for any scenario. In addition, Jupiter X300 is also available with the model equipped with DASH LAN and TPM function for Enterprise Solutions.

The leading global motherboard, graphics card, and small form factor PC manufacturer, ASRock, today announced the brand new compact Mini PC - Mars 4000U Series, embedded the AMD Ryzen 4000 U-series processors to deliver exceptional performance. The Mars 4000U Series Mini PC support dual-channel DDR4-3200 MHz memory up to 64 GB as well as equip with Intel Wi-Fi 6 for high-speed connectivity. For Storage, the Mars 4000U Series Mini PC provide a PCIe NVMe M.2 SSD slot and a 2.5-inch SATA hard drive bay; all imply into 0.7-liter chassis with 26 mm height.

ASRock Mars 4000U Series Mini PC offers abundant USB devices connectivity, features a total of 7 USB ports, including one Type-C port; In addition, the native SD card reader and dual display outputs provide more convenience and productivity. All of these features make Mars 4000U Series Mini PC well suited for a wide range of uses, including business, gaming and home entertainment.

Colorful Technology Company Limited, professional manufacturer of graphics cards, motherboards, all-in-one gaming and multimedia solutions and high-performance storage, launches the CVN Guardian RGB DDR4 gaming memory for the latest AMD platforms and the WARHALBERD DDR4 memory for the 3rd generation AMD Ryzen platform and Intel desktop platforms. The COLORFUL CVN Guardian RGB Gaming Memory sports an eye-catching heat sink with an RGB lightbar that supports motherboard RGB sync. On the other hand, the WARHALBERD is a value-oriented DDR4 memory featuring CXMT memory modules for a wide application from gaming to office PCs.

The CVN Guardian RGB DDR4 gaming memory is the latest addition to the CVN family. Designed for gamers, the CVN Guardian sports a futuristic high-performance heat spreader with superb heat dissipation to ensure stable gaming performance. COLORFUL uses specially selected Hynix CJR memory modules that offer stable performance and excellent overclocking capabilities. The CVN Guardian Gaming Memory supports XMP 2.0 automatic overclocking function for a quick performance boost.

TeamGroup recently announced another addition to their DDR4 memory lineup especially aimed at creators. The new, aptly named T-Create lineup features clean, back-to-basics aesthetics with slim metal heatspreaders that aren't too gaudy and are absent of any RGB. The new chips are available in capacities ranging from 16 GB (2 x 8 GB) through to 64 GB (2x 32 GB). Available speeds are set at DDR4-3200 (22-22-22-52 timings and 1.20 V) and DDR4-2666 (19-19-19-43 timings and 1.20 V).

The TeamGroup T-Create Classic 10L feature a 10-layer PCB and limited lifetime warranty, and are available in silvery-white. Pricing starts at $56.99 for the 2x 8 GB 2666 MHz kit and goes up to $216.99 for the 2x 32 GB 3200 MHz one.

A lot is riding for Intel on its 11th Gen Core "Tiger Lake" system-on-chip (SoC), which will launch exclusively on mobile platforms, hoping to dominate the 7 W thru 15 W ultraportable form-factors in 2020, while eventually scaling up to the 25 W thru 45 W H-segment form-factors in 2021, with a variant that is rumored to double core-counts. The chip is built on Intel's new 10 nm SuperFin silicon fabrication node that enables a double digit percentage energy efficiency growth over 10 nm, allowing Intel to significantly dial up clock speeds without impacting the power envelope. The CPU and iGPU make up the two key components of the "Tiger Lake" SoC.

The CPU component on the "Tiger Lake" processors that launch in a few weeks from now features four "Willow Cove" CPU cores. Coupled with HyperThreading, this ends up being a 4-core/8-thread setup, although much of Intel's innovation is in giving these cores significant IPC increases over the "Skylake" core powering "Comet Lake" processors, and compared to the "Sunny Cove" cores powering "Ice Lake" a minor IPC (although major net performance increase from clock speeds). The "Willow Cove" CPU core appears to be a derivative of the "Sunny Cove" core, designed to take advantage of the 10 nm SuperFin node, along with three key innovations.

Transcend, a leading brand of industrial-grade memory products and storage solutions, recently announced the release of a new series of industrial-grade DDR4-3200 memory modules. Aiming at 5G networking and intelligent computing at the edge, DDR4-3200 memory modules feature high transmission bandwidth at 3200MT/s, low latency, and low power consumption, running at 1.2 V. The line-up includes Unbuffered Long-DIMM, Unbuffered SO-DIMM, ECC Long-DIMM, ECC SO-DIMM, and Registered Long-DIMM, addressing the varied, and often strict, form factor requirements of vertical markets. Fully complied with JEDEC specification, DDR4-3200 memory modules are optimized for Intel, AMD, and ARM processors. The DDR4-3200 DIMMs are ready to power up embedded telecommunication, in-vehicle, gaming, and smart healthcare applications in the approaching AIoT decade.

With the SCHENKER VIA 15 Pro (M20), Schenker Technologies presents an ultra-mobile high-performance laptop, whose top of the range version uses the eight-core AMD Ryzen 7 4800H APU. The deliberate omission of an additional, dedicated graphics card, places the laptop in an exclusive position in the European market. In contrast to its little brother, the SCHENKER VIA 15 (E20), the Leipzig-based laptop manufacturer has equipped the Pro version with more flexible connectivity options and dual-channel memory support. Indespensible features such as the 91 Wh battery and the robust lightweight chassis remain untouched.

Schenker Technologies presents the SCHENKER VIA 15 Pro with AMD's current Renoir APUs - the Ryzen 5 4600H and Ryzen 7 4800H. The powerful, multithreaded and efficient six and eight-core models each operate in the maximum configurable 54 W TDP envelope. Compared to the regular SCHENKER VIA 15 (Non-Pro), whose AMD Ryzen 5 3550U is limited to a TDP of only 15 watts, the Pro offers a remarkable performance improvement. While the majority of competitors focus on coupling AMD's mobile H-APUs with an expensive, dedicated graphics solution, the SCHENKER VIA 15 Pro takes a more efficient approach. The integrated Vega 7 graphics unit is more than capable when powering everyday applications.

The AMD Ryzen Threadripper HEDT processors support up to 2 TB of quad-channel ECC memory, which means some companies can choose to cut costs by opting for 3rd gen Ryzen Threadrippers over EPYC "Rome" processors, if they're okay with a narrower memory bus. There weren't any server-grade AMD TRX40 chipset motherboards, until ASRock Rack picked up the challenge, with the new TRX40D8-2N2T. This motherboard is designed for high-uptime use, featuring server-grade VRM, networking interfaces, and an ASPEED IPMI+display+iKVM chip.

Built in the ATX form-factor, the TRX40D8-2N2T features one sTRX4 socket supporting 3rd gen Ryzen Threadripper processors (including the 3990X), eight DDR4 DIMM slots supporting up to 256 GB (32 GB per DIMM) of quad-channel DDR4 memory, with or without ECC. Memory speeds of up to DDR4-3200 are supported. The sTRX4 socket is wired to three PCI-Express 4.0 x16 slots and one open-ended PCI-Express 4.0 x8. Storage connectivity includes six SATA 6 Gbps ports, and two M.2-22110 slots with PCI-Express 4.0 x4 wiring. Networking includes two 10 GbE ports driven by an Intel X710-AT2 controller, and two 2.5 GbE ports put out by a pair of Intel i225-LM controllers. The ASPEED AST2500 chip puts out a GbE port and D-Sub (basic display) connector of its own. There's no onboard audio. The company didn't reveal pricing.

Intel's Investor Relations head Trey Campbell, in a "fire-side chat" with top investors at the Cowen Virtual Technology Media and Telecom Conference, reaffirmed Intel's commitment to its server processor roadmap. Intel is on course to introducing its 10 nm Xeon "Ice Lake-SP" enterprise processor family by the end of 2020, and "Sapphire Rapids" sometime within 2021.

"Ice Lake-SP" processor will introduce the new "Whitley" platform, with a new 4,189-pin LGA socket, which leverages PCI-Express gen 4.0. While retaining the DDR4 memory standard, the memory interface has been broadened to 8-channel, and reference memory clock speeds are expected to be increased to DDR4-3200. The company's "Sapphire Rapids" processor is expected to shake up the market, as it introduces next-generation I/O, when it launches alongside the "Eagle Stream" platform in 2021. The processor will be built on the refined 10 nm+ silicon fabrication node, feature "Willow Cove" CPU cores, and I/O feature set that sees the introduction of DDR5 memory standard, and PCI-Express gen 5.0.

HP unveiled its V8 RGB line of DDR4 memory modules targeted at the DIY market. The full-height UDIMM module is characterized by dark aluminium heatspreaders and an RGB LED silicone diffuser crown. The module comes in 8 GB single-rank, and 16 GB dual-rank densities, and speeds of DDR4-3000, DDR4-3200, DDR4-3466, and DDR4-3600. The lighting supports ARGB control through popular apps such as ASUS Aura, GIGABYTE RGB Fusion, MSI Mystic Light, and ASRock Polychrome. HP intends to sell the V8 RGB in single-module kits. The company didn't reveal pricing.

Igor's Lab discovered that AMD may be working on as many as twelve desktop Ryzen G "Renoir" processors with integrated graphics. These include six SKUs each covering the 65 W and 35 W TDP categories, and include two each of 8-core/16-thread, 6-core/12-thread, and 4-core/8-thread SKUs per TDP category. All twelve chips feature increased power limits from their mobile siblings, and a reference memory frequency of DDR4-3200. The parts also feature iGPU maximum engine clock boost frequency as high as 2.10 GHz, to overcome the compute unit deficit "Renoir" has against its predecessor, "Picasso/Raven Ridge," with their up to 11 CUs.

The series appears to be led by an 8-core/16-thread SKU with CPU boost frequency as high as 4.45 GHz, iGPU engine clock as high as 2.10 GHz, and various power-state clock speeds detailed in the table below. The 6-core/12-thread part boosts up to 4.30 GHz, with iGPU engine clock up to 1.90 GHz. The 4-core/8-thread part boosts up to 4.10 GHz, with up to 1.70 GHz iGPU engine clocks. The 35 W TDP parts have, on average, 200-300 MHz lower max CPU core boost- and nominal clock speeds, but more aggressive power-management as defined in the various P-states. Half of these OPNs point to chips with identical clock speeds and core configurations. These are probably differentiated from each other with some of them being Ryzen PRO SKUs.

Even as review embargoes remain on Intel's latest 10th Gen CPUs, benchmark scores that show what these 14 nm CPUS are capable of are already flooding the web. Case in point: a Cinebench 15 benchmark of Intel's unlocked Core i9-10900K running at an overclocked 5.4 GHz on all cores @ 1.35 V core. The 10-core CPU features a base clockspeed set at 3.7 GHz, so we're looking at a frequency increase of around 46%.

At those speeds, tested on an ASRock Phantom Gaming 4/AX motherboard and 16 GB of G.Skill DDR4-3200 MHz CL14 memory, the Intel Core i9-10900K managed to post a 3002 multi-core score. When at stock, it achieved a relatively paltry 2347 points. An AMD Ryzen 7 3800X CPU (8-core, 16-thread) typically scores around 2200 points, and an AMD Ryzen 9 3900X CPU (12-core, 24-thread) achieves a 3200 score. They do so at stock frequencies, though; and the Intel Core i9-10900K is sandwiched in-between those when it comes to core-count, but not on price: 10 Intel cores will set you back $488.00, while AMD's 8-core launched at $399 (and is now cheaper) and AMD's 12-core CPU launched for $499. Adding to the benchmarking caveat, the operating temperatures for this particular Core i9-10900K show 0º min and 69º max, so assuming the temperature report is correct, it's fair to say an air cooler wasn't used for this overclocking feat.