Igor's Lab discovered that AMD may be working on as many as twelve desktop Ryzen G "Renoir" processors with integrated graphics. These include six SKUs each covering the 65 W and 35 W TDP categories, and include two each of 8-core/16-thread, 6-core/12-thread, and 4-core/8-thread SKUs per TDP category. All twelve chips feature increased power limits from their mobile siblings, and a reference memory frequency of DDR4-3200. The parts also feature iGPU maximum engine clock boost frequency as high as 2.10 GHz, to overcome the compute unit deficit "Renoir" has against its predecessor, "Picasso/Raven Ridge," with their up to 11 CUs.

The series appears to be led by an 8-core/16-thread SKU with CPU boost frequency as high as 4.45 GHz, iGPU engine clock as high as 2.10 GHz, and various power-state clock speeds detailed in the table below. The 6-core/12-thread part boosts up to 4.30 GHz, with iGPU engine clock up to 1.90 GHz. The 4-core/8-thread part boosts up to 4.10 GHz, with up to 1.70 GHz iGPU engine clocks. The 35 W TDP parts have, on average, 200-300 MHz lower max CPU core boost- and nominal clock speeds, but more aggressive power-management as defined in the various P-states. Half of these OPNs point to chips with identical clock speeds and core configurations. These are probably differentiated from each other with some of them being Ryzen PRO SKUs.

Even as review embargoes remain on Intel's latest 10th Gen CPUs, benchmark scores that show what these 14 nm CPUS are capable of are already flooding the web. Case in point: a Cinebench 15 benchmark of Intel's unlocked Core i9-10900K running at an overclocked 5.4 GHz on all cores @ 1.35 V core. The 10-core CPU features a base clockspeed set at 3.7 GHz, so we're looking at a frequency increase of around 46%.

At those speeds, tested on an ASRock Phantom Gaming 4/AX motherboard and 16 GB of G.Skill DDR4-3200 MHz CL14 memory, the Intel Core i9-10900K managed to post a 3002 multi-core score. When at stock, it achieved a relatively paltry 2347 points. An AMD Ryzen 7 3800X CPU (8-core, 16-thread) typically scores around 2200 points, and an AMD Ryzen 9 3900X CPU (12-core, 24-thread) achieves a 3200 score. They do so at stock frequencies, though; and the Intel Core i9-10900K is sandwiched in-between those when it comes to core-count, but not on price: 10 Intel cores will set you back $488.00, while AMD's 8-core launched at $399 (and is now cheaper) and AMD's 12-core CPU launched for $499. Adding to the benchmarking caveat, the operating temperatures for this particular Core i9-10900K show 0º min and 69º max, so assuming the temperature report is correct, it's fair to say an air cooler wasn't used for this overclocking feat.

GeIL has today announced a new line of memory for Intel 10th Gen and AMD Ryzen 4000 series mobile processors. The new 64 GB kit offered as 2x 32 GB DDR4-3200 modules is simply called "SO-DIMM". This new kit features high-density chips and a standard operating voltage of 1.2 V which helps maximize system performance. The new series of modules will also feature lower speed kits in DDR4 2933 MHz 64 GB and DDR4 2666 MHz 64 GB. The 3200 MHz kit comes with a latency of 22-22-22-52 while the 2933 Mhz features 21-21-21-48 and the 2666 MHz 19-19-19-43 which are all similar to other vendors offerings. These new kits should offer gamers and content creators a robust memory upgrade path for mobile devices, pricing and availability were not announced.

AMD formally announced its AGESA ComboAM4 1.0.0.5 microcode. The new microcode is intended to be encapsulated into motherboard UEFI firmware updates and distributed by motherboard- and OEM desktop manufacturers, at their discretion. AGESA 1.0.0.5 improves POST (time) with select Micron Technology DDR4-3200 memory chips. An intermittent virtual memory error with certain Realtek onboard Ethernet PHY chips has been fixed. The microcode also improves PCI-Express bus stability and interoperability, in general. A PCIe lane configuration issue with Ryzen 3 Pro 2100GE has been fixed. Besides these, all other performance- and stability-improvements part of older 1.0.0.4 a/ab/abb/abba microcodes are incorporated into 1.0.0.5. Keep an eye on the BIOS updates section of your socket AM4 motherboard's product page on its company website.

Thermaltake today announced its TOUGHRAM Z-ONE series premium PC memory without RGB LED embellishments. The TOUGHRAM Z-ONE series, which debuted in December 2019, originally feature an RGB LED diffuser on top. The new modules instead feature a brushed aluminium crown of a contrasting shade to the heatspreaders, which gives it an Art Deco look when viewed from the top. The company launched two SKUs today, "R010D408GX2-3600C18A" is a 16 GB dual-channel (2x 8 GB) kit rated for DDR4-3600, while "R010D408GX2-3200C16A" is its DDR4-3200 rated sibling. The 3600 MHz variant achieves its marketed speeds with a tested CAS latency of 18T, and 1.35 V vDIMM. The DDR4-3200 variant does so at 16T CAS latency, and 1.35 V. Both variants pack Intel XMP profiles to enable advertised speeds, and are tested to work on Intel X299, Z390, and AMD X570 platforms. The company didn't reveal pricing.

MSI announced its Bravo 15 and Bravo 17 Full HD gaming notebooks manned by an all-AMD crew. The two offer Full HD displays with 120 Hz refresh-rates, made of "IPS-level" panels (very likely AHVA). The Bravo 15 features 15.6-inch panel size, while its sibling is a 17.3-incher.

Under the hood, both notebooks pack an AMD Ryzen 7 4800H (8-core/16-thread) "Renoir" processor, Radeon RX 5500M discrete graphics, AMD SmartShift technology (load balancing between the iGPU and dGPU), and 16 GB of DDR4-3200 memory. The Bravo 15 packs a 512 GB NVMe SSD, while the Bravo 17 gives you a 1 TB 7200 RPM HDD in addition to the same SSD. Two each of USB 3.2 type-C and type-A ports add to their connectivity. The Bravo 15 starts at USD $929, and the Bravo 17 at $1,099.

ADATA Technology, a leading manufacturer of high-performance DRAM modules, NAND Flash products, and mobile accessories is pleased to announce the launch of its industrial-grade 32 GB DDR4-3200 memory modules. With tested transfer rates of up to 3200 MT/s and 32 GB of capacity, the modules are ideal for segments and applications experiencing continuous growth of temporarily stored data as a result of 5G network and AIoT deployment, and thus require higher capacity and performance. These segments and applications include telecommunications, surveillance systems, autonomous vehicles, medical equipment, and industrial robots among others.

The modules come in U-DIMM, SO-DIMM, R-DIMM, ECC-DIMM, and ECC SO-DIMM variants and are compatible with the latest 3rd Gen AMD Ryzen and 10th Gen Intel Core processors. Made with the latest advancements in soldering and manufacturing. Utilizing a 288-pin design, operating voltage has been reduced from 1.5 V on DDR3 to 1.2 V, which not only helps save power by 20%, but also boosts transfer bandwidth speed.

ASUS today rolled out the 2020 TUF Gaming A15 and A17 gaming notebooks powered by AMD Ryzen 7 4800H 8-core/16-thread processor, and two combinations of NVIDIA GeForce discrete graphics. The TUF506IV-AS76 features GeForce RTX 2060 (mobile) graphics, a 1 TB NVMe SSD, and 16 GB of DDR4-3200 memory; while its sibling, the TUF506IU-ES74, features GTX 1660 Ti (mobile) graphics, 512 GB NVMe SSD, and 16 GB of DDR4-2667 memory.

The star-attraction with both are their 15.6-inch Full HD IPS displays with 144 Hz refresh-rates. The A17 (TUF706IU-AS76) sits between the two, with a larger 17.3-inch Full HD IPS display that has the same 144 Hz refresh-rate, but GTX 1660 Ti (mobile) graphics, 16 GB of DDR4-3200 memory, and 1 TB NVMe SSD. All three feature a pair of USB 3.1 gen 1 type-A, one USB 3.1 gen 2 type-C, illuminated keyboards, large 90 Whr batteries, 1 GbE wired, and 802.11ac WLAN. The A15 TUF506IV-AS76 is priced at USD $1,200, the A15 TUF506IU-ES74 at $1,000; and the A17 TUF706IU-AS76 at $1,100.

ASUS today unveiled its top-spec ROG Strix GA35 series gaming desktop, the GA35-G35DX. This pre-built desktop comes with some serious hardware specs geared toward AAA gaming at 4K UHD resolution and future-proofing for many years. Under the hood is a potent combination of an AMD Ryzen 9 3950X 16-core processor, NVIDIA GeForce RTX 2080 Ti graphics, an ROG Strix X570 motherboard, and 64 GB of DDR4-3200 memory. Storage includes a 1 TB PCI-Express 4.0 x4 M.2 NVMe SSD, and a 2 TB SATA HDD. 802.11ac WLAN with Bluetooth 5.1, 1 GbE Ethernet, and SupremeFX integrated audio make for the rest of it.

ASUS is using a 240 mm AIO liquid CPU cooler for the Ryzen 9 3950X, while the graphics card retains ASUS's custom-cooling solution for the ROG Strix A11G variant of the RTX 2080 Ti. The ASUS in-house design case features several RGB embellishments which, along the with AIO and graphics card, can be controlled using the Aura Sync tab in Armory Crate. The case features a plastic handle along the top. The front hides a panel that reveals two 2.5-inch hot-swap drive bays with SATA 6 Gbps back-planes. Front-panel connectivity includes two USB 3.1 type-C, two USB 3.1 type-A, and HDA jacks. A 700 W 80 Plus PSU powers it. The desktop ships with Windows 10 Pro pre-installed. The company didn't reveal pricing.

SMART Modular Technologies, Inc., a subsidiary of SMART Global Holdings, Inc., and a leader in specialty memory, storage and hybrid solutions including memory modules, Flash memory cards and other solid state storage products,today announced its lineup of DDR4-3200 32 GB Low Profile industrial Mini-DIMMs. SMART has several new 32 GB Mini-DIMMs which include ULP (Ultra Low Profile) and VLP (Very Low Profile) with registered and unbuffered ECC options to meet a wide range of use cases. SMART has been providing Mini-DIMM support for many years, offering customers long-term support as well as a solid roadmap of new higher-density, higher-speed options.

SMART's DDR4-3200 32 GB industrial Mini-DIMMs undergo stringent in-house environmental temperature screening to operate between -40 °C to +85 °C which makes SMART's DDR4 Mini-DIMMs an ideal solution for telecom and networking equipment being deployed under harsh operating conditions. Customized ruggedizing features can be added, such as conformal coating and anti-sulfur resistors to protect against toxic operating conditions or underfill for excessive vibration, all to allow reliable, long-term system operation.

The Designare brand of motherboards by GIGABYTE target content creators, and the company is extending the brand to memory, with the new Designare Memory series. It debuts with a high-capacity 64 GB dual-channel memory kit using two 32 GB modules. The rationale behind these densities is that creators may need them to deal with large data-sets. These are not off-spec "double height" modules, but are common dual-rank modules that stick to JEDEC compatibility spec, and pack XMP profiles that can run them at DDR4-3200 with 16-18-18-38 timings at 1.35 V.

GIGABYTE has tested these modules to work on all of its AMD X570, AMD B450, AMD TRX40, Intel X299, and Intel Z390 motherboards. For X570 and B450, however, the company states that only 3rd generation "Matisse" processors can handle this memory density. In its compatibility testing, GIGABYTE used 18-19-19-39 timings. Physically, the Designare modules have regular 32 mm height, a black PCB, and aluminium heatspreaders. GIGABYTE is backing the modules with lifetime warranty. The company didn't reveal pricing.

Zhaoxin is a brand that makes multi-core 64-bit x86 processors primarily for use in Chinese state IT infrastructure. It's part of the Chinese Government's ambitious plan to make its IT hardware completely indigenous. Zhaoxin's x86-64 CPU cores are co-developed by licensee VIA, specifically its CenTaur subsidiary that's making NCORE AI-enabled x86 processors. The company's KaiXian KX-6780A processor is now commercially available in China to the DIY market in the form of motherboards with embedded processors.

The KaiXian KX-6780A features an 8-core/8-thread x86-64 CPU clocked up to 2.70 GHz, 8 MB of last-level cache, a dual-channel DDR4-3200 integrated memory controller, a PCI-Express gen 3.0 root-complex, and an iGPU possibly designed by VIA's S3 Graphics division, which supports basic display and DirectX 11.1 readiness. The CPU features modern ISA, with instruction sets that include AVX, AES-NI, SHA-NI, and VT-x comparable virtualization extensions. The chip has been fabricated on TSMC 16 nm FinFET process.

Intel NUC 11 Extreme is the spiritual successor to the "Hades Canyon" and "Skull Canyon" NUC, and implements the company's next-generation 10 nm+ "Tiger Lake" processor. Codenamed "Panther Canyon," the NUC 11 Extreme represents a line of ultra-compact desktops with serious computing power, bringing together the company's highest-performance CPU cores and iGPUs. The "Tiger Lake-U" SoC powering the NUC 11 Extreme will reportedly be configured with a 28-Watt TDP, and will come in Core i3, Core i5, and Core i7 variants.

The "Tiger Lake-U" processor is expected to combine next-generation "Willow Cove" CPU cores with an iGPU based on Intel's new Xe graphics architecture, in what could be the first commercial outing for both. The NUC 11 Extreme "Panther Canyon" will also support up to 64 GB of dual-channel DDR4-3200 memory over SO-DIMMs, an M.2-2280 slot with PCI-Express 4.0 x4 and SATA 6 Gbps wiring, and option for Intel Optane M10 cache memory. On the connectivity front, and Intel AX-201 WLAN card provides 802.11ax Wi-Fi 6, and Bluetooth 5. A 2.5 GbE wired interface will also be available. These will also be among the first NUCs to feature front- and rear-Thunderbolt ports (possibly next-gen 80 Gbps given that the platform implements PCIe gen 4.0). The NUC 11 Extreme "Panther Canyon" is expected to launch some time in the second half of 2020.

G.SKILL International Enterprise Co., Ltd., the world's leading manufacturer of extreme performance memory and gaming peripherals, is excited to announce an all-new high-capacity, low-latency DDR4-3200 CL14-18-18-38 memory kit specification based on 32 GB modules across the Trident Z RGB, Trident Z Royal, and Trident Z Neo series. Available in 256 GB (32GBx8), 128 GB (32GBx4), and 64 GB (32GBx2) kit capacities for quad-channel and dual-channel platforms, these new DDR4 memory specifications are built with the latest high-density 16Gb components and provide the perfect mix of extreme performance and high memory capacity.

DDR4-3200 CL14 has always been the ultimate sweet spot for performance since the early days of DDR4 memory, and G.SKILL is now bringing the legendary high-performance efficiency to the latest 32 GB high-capacity DDR4 modules. Designed for the latest HEDT platforms with quad-channel support, the DDR4-3200 CL14-18-18-38 specification with 256 GB (32GBx8) memory kit capacity can be seen validated in the screenshots below with the new Intel Core i9-10900X processor on the ASUS ROG RAMPAGE VI EXTREME ENCORE motherboard and the Intel Core i9-10940X processor on the MSI Creator X299 motherboard.

Thermaltake, the leading PC DIY premium brand for Cooling, Gaming Gear and Enthusiast Memory solutions, today announced the release of the Thermaltake TOUGHRAM Z-ONE RGB DDR4 Memory Kit 3,200 MHz, which is supported by Intel and AMD platforms. Featuring 10-layer PCB construction for enhanced performance and stability, the TOUGHRAM Z-ONE RGB is equipped with high-performance components including tightly-selected memory chips, 2oz copper inner layer for enhanced electrical conduction, and 10μ gold fingers for high resistance ensuring ultimate gaming performance.

Furthermore, the TOUGHRAM Z-ONE RGB memory can be controlled by our software to monitor the real-time temperatures, frequency and performance and create stunning lighting effects with over 25 lighting modes. Users can also sync with TT RGB PLUS to maximize unique settings for their RGB color theme. Synchronize TT RGB PLUS, TT AI Voice Control, Razer Chroma, and Amazon Alexa RGB with TOUGHRAM Z-ONE RGB, users can build their own ecosystem with 10 super-bright addressable LEDs for stunning 16.8M RGB illumination. The TOUGHRAM Z-ONE RGB also support motherboards that have 5 V addressable RGB headers - ASUS Aura Sync, GIGABYTE RGB Fusion, MSI Mystic Light Sync and ASRock Polychrome.

G.SKILL International Enterprise Co., Ltd., the world's leading manufacturer of extreme performance memory and gaming peripherals, is announcing new high-capacity, high-performance memory kit specifications based on 32 GB modules across several memory series, including Trident Z Royal DDR4-3200 CL16 256 GB (32 GB x8), Trident Z Royal DDR4-4000 CL18 128 GB (32 GB x4), Trident Z Neo DDR4-3600 CL18 128 GB (32 GB x4), and Trident Z Neo DDR4-3800 C18 64 GB (32 GB x2). Built with the latest high-density 16Gb components, these DDR4 memory kits are the perfect choice for pushing the performance limits of high memory capacity.

With the availability of higher density memory at the consumer level, G.SKILL memory is pushing the performance boundary to DDR4-3200 on current HEDT platforms with up to 8 modules of 32 GB for a total of 256 GB. As shown in the screenshot below, the Trident Z Royal DDR4-3200 CL16 256 GB (32GBx8) is validated on the latest X299-based ASUS ROG Rampage VI Extreme Encore motherboard and the Intel Core i9-9820X processor. Such extremely high-capacity memory kits are the ideal choice for powerful workstations or for systems running multiple virtual machines.

Intel's short-term reaction to AMD's 3rd generation Ryzen processor family is the 10th generation Core "Comet Lake." These processors are based on existing "Skylake" cores, but have core-counts increased at the top-end, and HyperThreading enabled across the entire lineup. The Core i3 series are now 4-core/8-thread; the Core i5 series a 6-core/12-thread, the Core i7 series are 8-core/16-thread, and the new Core i9 series are 10-core/20-thread. Besides core-counts, Intel has given its 14 nanometer node one last step of refinement to come up with the new 14 nm+++ nodelet. This enables Intel to significantly dial up clock speeds across the board. These processors come in the new LGA1159 package, and are not backwards-compatible with LGA1151 motherboards. These chips also appear to feature an on-package PCH, instead of chipset on the motherboard.

Leading the pack is the Core i9-10900KF, a 10-core/20-thread chip clocked at 4.60 GHz with 5.20 GHz Turbo Boost, 20 MB of shared L3 cache, native support for DDR4-3200, and a TDP of 105 W. Intel's new 10-core die appears to physically lack an iGPU, since none of the other Core i9 10-core models offer integrated graphics. For this reason, all three processor models have the "F" brand extension denoting lack of integrated graphics. The i9-10900KF is closely followed by the i9-10900F clocked at 4.40/5.20 GHz, the lack of an unlocked multiplier, and 95 W TDP rating. The most affordable 10-core part is the i9-10800F, clocked at 4.20 GHz with 5.00 GHz boost, and a TDP of just 65 W. Intel has set ambitious prices for these chips. The i9-10900KF is priced at $499, followed by the i9-10900F at $449, and the i9-10800F at $409.

ZADAK may have dropped the "511" from its name, but remains a sought-after boutique hardware brand for case-modders. At its Computex 2019 booth, the company showed off its latest memory modules, cooling products, and a few case-mods that put the two together. The centerpiece at the booth was the Spark line of premium DDR4 memory modules. Silver accents of brushed aluminium top a darker shade, crowned by a silicone addressable-RGB LED diffuser. Each module has five lighting zones - top, top sides, and corners, which the maker calls "Dynamic multi-zone RGB." Each module cycles between 8 lighting presets, although with a 3-pin ARGB connection, you can play with the lighting via software.

ZADAK Spark memory comes in single-module, dual-channel, and quad-channel kits of 8 GB and 16 GB modules, which are further differentiated in four speeds, DDR4-3000, DDR4-3200, DDR4-3600, and DDR4-4133. Up to 3200 MHz, these modules offer timings of 16-18-18-38@1.35V, which loosen to 17-19-19-39@1.35V for DDR4-3600, and 19-21-21-42@1.4V for DDR4-4133. ZADAK claims it tested each memory kit for advertised settings on both Intel Core and AMD Ryzen platforms. Prices start at USD $159.99 for a 2x 8 GB DDR4-3200 memory kit. Next up, is the ZADAK Spark AIO closed-loop liquid CPU cooler.

An AMD-based system's most important performance pairing lies in the CPU and system RAM, as a million articles written ever since the introduction of AMD's first generation Ryzen CPUs have shown (remember the races for Samsung B-die based memory?). There are even tools that allow you to eke out the most performance out of your AMD system via fine memory overclocking and timings adjustment, which just goes to show the importance the enthusiast community derives from such tiny details that maximize your AMD Zen-based CPU performance. Now, notorious leaker @momomo_us has seemingly confirmed that AMD has worked wonders on its memory controller, achieving a base JEDEC 3200 MHz specification - up from the previously officially supported DDR4-2666 speeds in the first-gen Ryzen (updated to DDR4-2933 speeds on the 12 nm update).