Team Group's creator series T-CREATE launches three DDR5 memory products: T-CREATE EXPERT DDR5 Desktop Memory, T-CREATE CLASSIC DDR5 Desktop Memory, and T-CREATE CLASSIC DDR5 Laptop Memory, comprehensively tailored for creators' demands. Equipped with a variety of frequency specifications from 5,200 to 6,400 MHz and a maximum storage capacity of 32 GB per module, the newly launched products offer a smooth experience for creators working on 4K/8K ultra-high-resolution video editing, professional 3D illustration software and system, as well as multitasking on their desktop computers and laptops.

Specifically built for heavy and complicated processing needs, T-CREATE EXPERT DDR5 Desktop Memory comes in ultra-high frequency options of 6,400 MHz and 6,000 MHz. Paired with low latency specifications, it features unprecedentedly exceptional performance and robust stability to fully support the complex operations and computing demands in professional 3D rendering and long-form super-high resolution video editing. Creators can ensure authenticity and optimal quality in each frame.

GIGABYTE TECHNOLOGY Co. Ltd, a leading manufacturer of motherboards, graphics cards, and hardware solutions, today announced the ultimate overclocking motherboard Z790 AORUS TACHYON with the latest 13th gen Intel Core processors has smashed 10 world O.C. records including PCMark 7, 3D Mark…etc, as well as 16 GFP (Global First Place) of individual category test by different core numbers, and obtained 9 HFP (Hardware First Place) highest record in specific CPU ID vs. core count. Designed by world-famous overclocker, GIGABYTE Z790 AORUS TACHYON packs overclocker-exclusive features with top-quality components to become the dream motherboard for overclockers, which delivers unparalleled O.C performance with a more friendly and thoughtful interface to set its leading role on Z790 O.C. motherboards.

"It's inspiring that Z790 AORUS TACHYON breaks 10 overclocking world records and more than 20 various overclocking scores, which not only proves GIGABYTE's strong R&D strength but also demonstrates that GIGABYTE's devotion to providing formidable O.C motherboard. We believe this is just the beginning and will continue to create superior overclocking performance and records by Z790 AORUS TACHYON. We look forward to seeing more overclockers around the world using this motherboard to break more world records!" said Jackson Hsu, Director of the GIGABYTE Channel Solutions Product Development Division.

Team Group's gaming brand, T-FORCE, launches T-FORCE DELTAα RGB DDR5, a gaming memory built for AMD Ryzen 7000 Series Processors and 600 Series Motherboard. DELTAα RGB DDR5 supports the latest overclocking technology from AMD EXPO, enhancing memory performance through excellent compatibility and delivering fast and reliable OC speeds with a single click. T-FORCE is dedicated to providing outstanding performances for gamers around the world and is proud to join forces with AMD to create the ultimate gaming experience.

Modeled after a stealth aircraft, T-FORCE DELTAα RGB DDR5 features a strong and clean geometric silhouette with 120° ultra-wide lighting to deliver a fierce military style. The new gaming memory is compatible with lighting effect software such as ASUS Aura Sync, GIGABYTE RGB Fusion 2.0, MSI Mystic Light Sync, ASROCK-Polychrome Sync, and BIOSTAR Advanced VIVID LED DJ[1]. With the RGB DDR5, gamers can design their own lighting effects and create an incredibly stunning RGB system. T-FORCE DELTAα RGB DDR5 is equipped with PMIC for better power management and a strengthened PMIC cooling design using thermally conductive silicon or more effective cooling and stable PMIC operations. The memory also supports on-die ECC and one-click overclocking with AMD EXPO so that gamers can enjoy the extreme speeds of overclocking with one simple click.

SK hynix Inc. announced today that it has developed working samples of DDR5 Multiplexer Combined Ranks (MCR) Dual In-line Memory Module, the world's fastest server DRAM product. The new product has been confirmed to operate at the data rate of minimum 8 Gbps, and at least 80% faster than 4.8 Gbps of the existing DDR5 products. MCR DIMM is an achievement coming from out-of-the-box thinking with an aim to improve the operation speed of DDR5. Challenging the prevailing concept that the operation speed of DDR5 relies on that of DRAM chip itself, engineers sought to find a way to improve the speed of modules instead of chips for development of the latest product.

SK hynix designed the product in a way that enables simultaneous operation of two ranks by utilizing the data buffer installed onto the MCR DIMM based on Intel's MCR technology. By enabling simultaneous operation of two ranks, MCR DIMM allows transmission of 128 bytes of data to CPU at once, compared with 64 bytes fetched generally in conventional DRAM module. An increase in the amount of data sent to the CPU each time supports the data transfer rate of minimum 8 Gbps, twice as fast as a single DRAM.

Lattice Semiconductor, the low power programmable leader, today unveiled Lattice Avant, a new FPGA platform purpose-built to bring the company's power efficient architecture, small size, and performance leadership to mid-range FPGAs. Lattice Avant offers best-in-class power efficiency, advanced connectivity, and optimized compute that enable Lattice to address an expanded set of customer applications across the Communications, Computing, Industrial, and Automotive markets.

"With Lattice Avant, we extend our low power leadership position in the FPGA industry and are poised to continue our rapid pace of innovation, while also doubling the addressable market for our product portfolio," said Jim Anderson, President and CEO, Lattice Semiconductor. "We created Avant to address our customers' need for compelling mid-range FPGA solutions, and we're excited to help them accelerate their designs with new levels of power efficiency and performance."

January 3, 2023, on the sidelines of the International CES, Intel could launch dozens upon dozens of 13th Gen Core processor SKUs spanning every conceivable client PC platform. The event is expected to bring "Raptor Lake" to the mobile platform, with announcements spanning the ultra-portable "Raptor Lake-U," the thin-and-light performance "Raptor Lake-P," the mainstream mobile "Raptor Lake-H," and the enthusiast mobile "Raptor Lake-HX." This would cover almost every mobile device segment, including 7-9 W U-segment, to the 15-28 W P-segment, the 35-45 W H-segment, and the >55 W HX-segment, with several SKUs per segment across the four brand extensions (Core i3 thru Core i9).

For the desktop platform, Intel is expected to announce its new Core i9-13900KS "Raptor Lake-S" flagship, the world's first 6 GHz processor, besides a large number of 13th Gen Core "Raptor Lake-S" non-K SKUs in the 65 W TDP class, forming the bulk of the company's desktop processor lineup. Besides these, the company will also announce the more affordable Intel H770 and B760 desktop motherboard chipsets, bringing down platform costs (the 13th Gen Core processors are already supported on inexpensive motherboards based on the B660 and H670 chipsets via a BIOS update). Lastly, the company could announce "Raptor Lake" processors for the workstation segment, possibly compatible with the W780 chipset, and supporting ECC DDR5 memory, among other features relevant to the commercial desktop and workstation segments.

Intel's Sapphire Rapids CPUs are designed to represent the company's finest work for the server/enterprise and high-end desktop processor (HEDT) sector. According to Wccftech, we have an idea of the launch date and availability of the HEDT Sapphire Rapids Workstation counterparts, codenamed Fishhawk Falls. The Intel Sapphire Rapids-WS CPU and W790 motherboard unveil should happen on the 7th week of 2023, which means the 12th Feb - 18th Feb launch window. For availability, April of 2023 is scheduled to meet the needs of the upcoming HEDT clients. With a declining HEDT market, Intel is in no rush to deliver the CPUs, with priority being the server Sapphire Rapids designs.

As a reminder, the HEDT models should come with up to 56 cores and 112 threads, 105 MB of L3 cache, 350 W TDP, and 112 PCIe Gen 5.0 lanes. For memory, the platform support 8-channel DDR5-4400 (1DPC) / DDR5-4800 (2DPC) configurations with a capacity of up to 4 TB.

TechPowerUp in partnership with Team Group are giving away six pieces of Team Group T-Force gaming hardware. We've actually been at this since November 14, and entries close tomorrow, November 25. That leaves you with a day to fill up a tiny form and answer a couple of quizzy questions on Team Group; for a chance to win a T-Force Delta RGB DDR5-6400 CL40 32 GB (2x 16 GB) memory kit, or one of five Vulcan Z 1 TB SSDs! The Delta RGB DDR5 would be a great addition to your next-generation desktop build, as its DDR5-6400 frequency goes great with the latest "Raptor Lake" and "Zen 4" processors! The Vulcan Z 1 TB makes for a decent game storage drive to add some room to your game library. Both look great when powered up and viewed through a tempered glass panel! Hurry up!

For more details, and to participate, visit this page. Entries close November 25 (tomorrow).

AMD Ryzen 7000-series "Zen 4" desktop processors got their first round of price-cuts on leading retailer Newegg, as the company has a hard time justifying their launch-prices in the wake of Intel's 13th Gen Core "Raptor Lake" and declining demand in the PC components market. The new pricing sees the top Ryzen 9 7950X 16-core/32-thread chip priced at USD $574, down from $700 (an 18% price-cut). The 12-core/24-thread Ryzen 9 7900X sees its price go down from $550 to $474 (down 14%).

The 8-core/16-thread Ryzen 7 7700X gets a $50 price-cut sending its price down from $400 to roughly $350. The 6-core/12-thread Ryzen 5 7600X gets a similar $50 cut, which means the chip can now be had for roughly $250, down from its $300 launch price. All four SKUs face stiff competition from the aggressively priced 13th Gen Core SKUs, which include the i9-13900K, the i7-13700K, and the i5-13600K. Prices of Socket AM5 motherboards are another big put-off as they're a major contributor to platform costs, which is restricted to DDR5 memory. The Intel platform currently includes entry-level chipset options, as well as motherboards with DDR4 support.

AMD will build "Zen 4" based Ryzen Threadripper processors in an attempt to meet competition from Intel, which is rumored to launch HEDT processors of its own based on "Sapphire Rapids." While Intel's chip tops out at 60-core/120-thread and has a constellation of task-specific hardware-accelerators, AMD will arm its processors with raw CPU core-count, going as high up as 96-core/192-thread. The company has assigned the codename "Storm Peak" for these chips.

The Ryzen Threadripper 7000-series "Storm Peak" processor engineering samples surfaced on the Einstein@Home user database. As many as three OPNs have surfaced, "AMD Eng Sample: 100-000000884-21_N" and "AMD Eng Sample: 100-000000884-20_Y," which are 96-core/192-thread; and the "AMD Eng Sample: 100-000000454-20_Y," which is 64-core/128-thread. "Storm Peak" is likely just a variation of EPYC "Genoa," geared for higher frequencies.

BIOSTAR, a leading manufacturer of motherboards, graphics cards, and storage devices today, is delighted to introduce its premier SILVER series, the Z790A-SILVER motherboard. Built around the Intel Z790 platform, the Z790A-SILVER is a masterful piece of tech designed to serve gamers, content creators, and casual users faithfully. With support for 12th/ 13th Generation Intel Core processors, a quad DIMM DDR5 ram interface, and a PCIe 5.0 x16 slot tailored for that beastly new graphics card, make it the ideal choice for a hardy gaming rig that turns average gamers into true champions.

As an expansion of BIOSTAR's RACING series motherboard range, the Z790A-SILVER carries a robust build and styling handed down by its predecessors, showcasing the classic RACING stripes on its PCB and the Silver colored cooling blocks. PCIe M.2 4.0 and SATA III (6 Gb/s) are the chosen storage technology for the Z790A-SILVER motherboard. They are highly stable and efficient for any given task, with superior USB 3.2 (Gen2) type-C and USB 3.2 (Gen2) type-A ports for blisteringly fast data transfers.

Supermicro, Inc., a Total IT Solution Provider for Cloud, AI/ML, Storage, and 5G/Edge, at the 2022 Super Computing Conference is unveiling the most extensive portfolio of servers and storage systems in the industry based on the upcoming 4th Gen Intel Xeon Scalable processor, formerly codenamed Sapphire Rapids. Supermicro continues to use its Building Block Solutions approach to deliver state-of-the-art and secure systems for the most demanding AI, Cloud, and 5G Edge requirements. The systems support high-performance CPUs and DDR5 memory with up to 2X the performance and capacities up to 512 GB DIMMs and PCIe 5.0, which doubles I/O bandwidth. Intel Xeon CPU Max Series CPUs (formerly codenamed Sapphire Rapids HBM High Bandwidth Memory (HBM)) is also available on a range of Supermicro X13 systems. In addition, support for high ambient temperature environments at up to 40° C (104° F), with servers designed for air and liquid cooling for optimal efficiency, are rack-scale optimized with open industry standard designs and improved security and manageability.

"Supermicro is once again at the forefront of delivering the broadest portfolio of systems based on the latest technology from Intel," stated Charles Liang, president and CEO of Supermicro. "Our Total IT Solutions strategy enables us to deliver a complete solution to our customers, which includes hardware, software, rack-scale testing, and liquid cooling. Our innovative platform design and architecture bring the best from the 4th Gen Intel Xeon Scalable processors, delivering maximum performance, configurability, and power savings to tackle the growing demand for performance and energy efficiency. The systems are rack-scale optimized with Supermicro's significant growth of rack-scale manufacturing of up to 3X rack capacity."

TYAN, an industry-leading server platform design manufacturer and a MiTAC Computing Technology Corporation subsidiary, brings its upcoming server platforms powered by 4th Gen Intel Xeon Scalable processors optimized for HPC and storage markets at SC22 on November 14-17, Booth#2000 in the Kay Bailey Hutchison Convention Center Dallas.

"Greater availability of new technology like 4th Gen Intel Xeon Scalable processors continue driving the changes in the HPC landscape", said Danny Hsu, Vice President of MiTAC Computing Technology Corporation's Server Infrastructure Business Unit. "The advances in chip technology coupled with the rise in cloud computing has brought high levels of compute power within reach for smaller organizations. HPC now is affordable and accessible to a new generation of users."

AIC Inc., (from now on referred to as "AIC"), a leading provider in enterprise storage and server solutions, today revealed its new edge server appliance powered by 4th Gen AMD EPYC processors (codename Genoa). The new server, EB202-CP, is designed to deliver superior performance in a compact size while offering excellent cost efficiency. Combined with the 4th Gen AMD EPYC processors, EB202-CP is expected to drive the innovations in AI, training simulation, autonomous vehicles and edge applications. AIC will showcase EB202-CP at SC22 expo from November 14th to 17th, 2022.

AIC EB202-CP is a 2U rackmount server with 22 inches in depth. It supports eight E1.S/ E3.S or U.2 SSDs which are front-serviceable and hot-swappable. The E1.S/ E3.S drives are Enterprise and Datacenter SSD Form Factor (EDSFF) that enables EB202-CP to provide high-density all-flash NVMe for half petabyte storage capabilities and enhance IOPS and space utilization. EB202-CP has great expansion functionality and supports up to two double-stack GPU or accelerator cards, two FHHL/HHHL PCIe 5.0 cards and an OCP 3.0 card. Based on AIC server board Capella, EB202-CP supports single 4th Gen AMD EPYC processor and eight DDR5 DIMMs. The 4th Gen AMD EPYC processors, built on "Zen 4" architecture, are optimized for general-purpose workloads across enterprise, cloud and edge. This new generation of AMD EPYC features the world's highest-performing x86 processor, PCIe 5.0 ready, and enables low TCO. It also delivers leadership energy efficiency as well as state-of-the-art security features.

Yesterday, AMD announced its latest addition to the data center family of processors called EPYC Genoa. Named the 4th generation EPYC processors, they feature a Zen 4 design and bring additional I/O connectivity like PCIe 5.0, DDR5, and CXL support. To disrupt the cloud, enterprise, and HPC offerings, AMD decided to manufacture SKUs with up to 96 cores and 192 threads, an increase from the previous generation's 64C/128T designs. Today, we are learning more about the performance and power aspects of the 4th generation AMD EPYC Genoa 9654, 9554, and 9374F SKUs from 3rd party sources, and not the official AMD presentation. Tom's Hardware published a heap of benchmarks consisting of rendering, compilation, encoding, parallel computing, molecular dynamics, and much more.

In the comparison tests, we have AMD EPYC Milan 7763, 75F3, and Intel Xeon Platinum 8380, a current top-end Intel offering until Sapphire Rapids arrives. Comparing 3rd-gen EPYC 64C/128T SKUs with 4th-gen 64C/128T EPYC SKUs, the new generation brings about a 30% increase in compression and parallel compute benchmarks performance. When scaling to the 96C/192T SKU, the gap is widened, and AMD has a clear performance leader in the server marketplace. For more details about the benchmark results, go here to explore. As far as comparison to Intel offerings, AMD leads the pack as it has a more performant single and multi-threaded design. Of course, beating the Sapphire Rapids to market is a significant win for team red, so we are still waiting to see how the 4th generation Xeon stacks up against Genoa.

TYAN, an industry-leading server platform design manufacturer and a MiTAC Computing Technology Corporation subsidiary, today introduced AMD EPYC 9004 Series processor-based server platforms highlighting energy efficiency and performance breakthroughs designed for next generation server architecture for data centers. "Facing the post-COVID economy world, data centers are required to build on more environmentally friendly, secure and flexible features to respond to the growing of teleworking, video streaming, IoT and 5G," said Danny Hsu, Vice President of MiTAC Computing Technology Corporation's Server Infrastructure BU. "TYAN's new server platforms powered by 4th Gen AMD EPYC processors efficiently enable data centers by doing more tasks with the same number of servers."

"We designed 4th Gen AMD EPYC processors to give our customers exactly what they said they needed, high performance, exceptional energy efficiency and low total cost of ownership," said Ram Peddibhotla, corporate vice president, EPYC product management, AMD. "With the latest "Zen 4" architecture that incorporates modern security by design, 4th Gen AMD EPYC processors are an outstanding choice for IT professionals looking to optimize their data centers for leadership performance while helping address environmental goals."

SK hynix announced that its DRAM, and CXL solutions have been validated with the new AMD EPYC 9004 Series processors, which were unveiled during the company's "together we advance_data centers" event on November 10. SK hynix has worked closely with AMD to provide fully compatible memory solutions for the 4th Gen AMD EPYC processors.

4th Gen AMD EPYC processors are built on an all-new SP5 socket and offer innovative technologies and features including support for advanced DDR5 and CXL 1.1+ memory expansion. SK hynix 1ynm, 1a nm 16 Gb DDR5 and 1a nm 24Gb DDR5 DRAM support 4800 Mbps on 4th Gen AMD EPYC processors, which deliver up to 50% more memory bandwidth than DDR4 product. SK hynix also provides CXL memory device that is a 96 GB product composed of 24 Gb DDR5 DRAMs based on 1a nm. The company expects high customer satisfaction of this product with flexible configuration of bandwidth and capacity expanded cost-efficiently.

GIGABYTE Technology, an industry leader in high-performance servers and workstations, today announced its portfolio of products ready to support the new AMD EPYC 9004 Series Processors in the first wave of GIGABYTE solutions that will target a wide range of demanding workloads that include GPU-centric, high-density, edge, and general computing. A new x86 platform, a new socket, and a wealth of highly performant technologies provided new opportunities for GIGABYTE to tailor products for leading data centers. So far, GIGABYTE has released twenty-two new servers and motherboards to support the new AMD "Zen 4" architecture. Both single-socket and dual-socket options are available to handle big data and digital transformation. The ongoing collaboration between GIGABYTE and AMD has allowed for a comprehensive portfolio of computing solutions that are ready for the market.

The new 4th Gen AMD EPYC processors feature substantial compute performance and scalability by combing high core counts with impressive PCIe and memory throughput. In terms of out of the box performance, AMD estimates found that 4th Gen AMD EPYC CPUs are the highest performing server processors in the worldi. With the advancement to 5 nm technology and other performant innovations, the new AMD EPYC 9004 series processors move to a new SP5 socket. The new architecture leads the way to faster data insights with high performance and built-in security features, and this platform targets HPC, AI, cloud, big data, and general enterprise IT.

ASUS, a leading provider of server systems, server motherboards and workstations, today announced new best-in-class server solutions powered by the latest AMD EPYC 9004 Series processors. ASUS also launched superior liquid-cooling solutions that dramatically improve the data-center power-usage effectiveness (PUE).

The breakthrough thermal design in this new generation delivers superior power and thermal capabilities to support class-leading features, including up to 400-watt CPUs, up to 350-watt GPUs, and 400 Gbps networking. All ASUS liquid-cooling solutions will be demonstrated in the ASUS booth (number 3816) at SC22 from November 14-17, 2022, at Kay Bailey Hutchison Convention Center in Dallas, Texas.

ASUS, a global technology leader renowned for continuously reimagining today's technologies for tomorrow, today announced ExpertBook B6 Flip (B6602F)—the first Expert-series flippable mobile workstation.

This high-performance mobile workstation with its versatile 360° hinge is designed specifically to help architecture, engineering and construction (AEC) companies running industry-leading software solutions like 3ds Max, MicroStation, and Vectorworks. With immense power packed in a slim and flippable form, ExpertBook B6 Flip handles complex workloads seamlessly across AEC disciplines. It helps users bring design concepts to life through BIM software like ArchiCAD, effortlessly transition from 2D sketches to 3D modelling and printing via tools like Creo and Solidworks, and handle data-intensive applications for deeper insights and better decision-making—delivering the edge that AEC companies need in today's competitive market.

Today, Intel launched the new Intel NUC 13 Extreme Kit (code-named Raptor Canyon) and Intel NUC 13 Extreme Compute Element, which combine to make the most powerful Intel NUC ever built. The NUC 13 Extreme features unlocked 13th Gen Intel Core desktop processors and space for new triple-slot, 12-inch graphics cards to unleash even more performance for enthusiast gamers and content creators.

"This year marks the 10-year anniversary for our impressive lineup of Intel NUC products, and the Intel NUC 13 Extreme (code named Raptor Canyon) is an excellent representation of how far we've come. Our first ever NUC demonstrated a breakthrough in the miniaturization of a small desktop PC into an ultra-small PC form factor. While much larger than our tiniest mini-PC, our latest Intel NUC 13 Extreme sets a new bar for how to pack stellar gaming performance in a form factor that is 70% smaller than a typical 50L gaming tower. Along with the epic performance you expect from an Intel NUC product, we also deliver exceptional product quality and feature density in a completely modular and customizable design," said Brian McCarson, Intel Vice President and General Manager of the Intel NUC Group.

GIGABYTE TECHNOLOGY Co. Ltd, a leading manufacturer of motherboards, graphics cards, and hardware solutions, today revealed the supreme performance of XMP DDR5-8000 on Z790 AORUS XTREME and Z790 AORUS MASTER motherboards with Team Group gaming modules T-FORCE DELTA RGB DDR5 memory. Enhanced with the exclusive Low Latency and High Bandwidth technology, this achievement proves again that GIGABYTE motherboard is the ultimate choice to unleash memory performance, as well as the leading role of memory performance by the teamwork of GIGABYTE vs. Team Group.

It's always been challenging to constantly exceed the high-frequency record of memory, and stable motherboards and high-performance memories make a perfect team to accomplish this difficult task. To provide superior performance and user experience, GIGABYTE has been working closely with Team Group on the record-breaking performance from DDR5-7600, DDR-7800, to XMP DDR5 8000. The detailed memory information is listed in the memory support list of the motherboard, users can check on the site for the best performance matrix on the Z790 platform.

KLEVV, an emerging memory brand introduced by Essencore, unveils its latest DDR5 standard U-DIMM and SO-DIMM memory running at 5600MT/s. Designed to support both AMD's latest Ryzen 7000 series processors and AM5 platform as well as Intel's 13th Gen Raptor Lake processors and Z790 motherboards, featuring blisteringly fast speed with a highly efficient power to performance ratio.

To cater the growing demand for high-speed computing with a highly versatile product selection, KLEVV introduces a brand-new 5600 MT/s version to its DDR5 standard desktop and laptop memory lineup. Fully compliant with JEDEC standards, the new 5600MT/s DDR5 memory is the latest addition to KLEVV's DDR5 U-DIMM and SO-DIMM lineup with the pre-existing 4800 MT/s memory.

SMART Modular Technologies, Inc. ("SMART"), a division of SGH and a global leader in memory solutions, solid-state drives and hybrid storage products today announced the addition of new DDR5 16 GB and 32 GB Very Low Profile Error-Correction Code Unbuffered Dual In-Line Memory Modules (VLP ECC UDIMM) to its lineup of blade memory VLP module products.

SMART's new DuraMemory DDR5 VLP ECC UDIMMs are designed for 1U blade servers and blade enclosure systems used in networking, telecom, compute and storage applications that are optimized to minimize space and power. DDR5 VLP ECC UDIMMs are designed to meet height, density, power, and performance specifications needed to enable the next generation of memory applications.

G.SKILL International Enterprise Co., Ltd., the world's leading brand of performance overclock memory and PC components, is thrilled to showcase extreme memory bandwidth performance of high-frequency DDR5-8000 32 GB (16 GB x2) & DDR5-7800 32 GB (2x 16 GB) overclocked memory kits on the latest Intel Core i9-13900K Processor and ASUS ROG MAXIMUS Z790 APEX motherboard. Working in close partnership with the ASUS motherboard team, a single G.SKILL memory module was overclocked to a staggering DDR5-10000 under air cooling.

Dedicated to developing the fastest possible DDR5 memory on the latest 13th Gen Intel Core processor and Intel Z790 chipset, G.SKILL showcases the high memory bandwidth performance of DDR5-8000 32 GB (2x16GB) memory kit on the ASUS ROG MAXIMUS Z790 APEX motherboard. The following screenshots show the DDR5-8000 CL40 32 GB (2x16GB) and DDR5-7800 CL38 32 GB (2x 16 GB) memory kits validated on an Intel Core i9-13900K processor and ASUS ROG MAXIMUS Z790 APEX motherboard (BIOS 0702) platform, with the DDR5-8000 CL40 32 GB (2x16GB) memory kit reaching memory bandwidth read speed of over 124 GB/s and write speed of over 120 GB/s on the AIDA64 memory benchmark.