Kingston Technology Company, Inc., a world leader in memory products and technology solutions, today announced it has been ranked top third-party DRAM module supplier in the world, according to the latest rankings by revenue from analyst firm TrendForce (formerly DRAMeXchange). Kingston retains its number 1 position with an estimated 78.7% market share on $14.2B (USD) revenue. TrendForce states that Kingston increased revenue by 8% YoY marking the 19th consecutive year that Kingston has held the top spot.

According to the report, the world's top five memory module houses accounted for 90% of total sales in 2021 with Kingston holding nearly 80% of that market. As one of the leading buyers of DRAM chips in the world, Kingston provides a highly customized production model which has led to continuous growth in shipment scale and drove increased revenue by 8%. TrendForce states that pandemic-induced lifestyle changes and the demand for distance learning grew in the past two years, driving the growth of DRAM module shipments. Kingston took the approach to be prepared for those segments. Kingston's success is largely attributed to their working attitude of 'Kingston Is With You,' which solidifies the dominant force the company holds among consumers and organizations alike looking to upgrade new and existing systems.

Courtesy of Wccftech, we now have a complete picture of what Intel is planning to announce on the 27th of this month. The information is extremely detailed and covers no less than 14 different processor SKUs, ranging from the Core i9-13900K/KF to the Core i5-13400/F. All of the CPUs except the Core i5-13400/F and the upcoming Core i3 models will support memory speeds of up to DDR5 5600, whereas the lower end parts will be limited to DDR5 4800. All 13th Gen Intel CPUs should also support DDR4 3200 memory. Just as with the 12th Gen CPUs, the 13th Gen KF and F will not support ECC memory and of course, no IGP.

There's nothing that really stands out when looking at the specs and most things are expected based on earlier rumours. The Core i9-13900K/KF will indeed boost up to 5.8 GHz on up to two cores and all P-cores will boost up to 5.4 GHz, with the E-cores boosting up to 4.3 GHz. The Core i7-13700K/KF will have a much bigger gap here, compared to the the Core i7-12700K/KF versus the Core i9-12900K/KF where there was a 200 MHz boost frequency gap, which has now been extended to 400 MHz, as the Core i7-13700K/KF only boosts up to 5.4 GHz on two cores. Interestingly, the base clock frequency for the P-cores seems to have dropped 200 MHz on theK/KF parts, compared to 12th Gen equivalents in the product stack. For the remaining details, have a look at the data provided below.

At this point, we don't know if this is a limitation at AMD's level or ASRock's, but someone with access to a retail ASRock X670E Steel Legend motherboard, with all its packaged paraphernalia in place, spotted an interesting sticker covering the board's four DDR5 DIMM slots. The sticker has some info on the ideal DIMM slot selection for dual-channel memory (4x sub-channels); but what catches our eye is a table which states just how long the motherboard will take to train the memory the first time it's booted up, or after a clear-CMOS operation (where your BIOS settings are erased).

The table says that a typical setup with two 16 GB modules (read: two single-rank modules in a 1 DIMM per channel/1DPC configuration), takes 100 seconds to train (or until first boot). Two 32 GB modules (typically a pair of dual-rank modules in 1DPC configuration) take 200 seconds, as do four 16 GB modules (four single-rank modules in a 2DPC configuration). The least optimal config, four dual-rank modules in a 2DPC configuration, takes a whopping 400 seconds (almost 7 minutes) to train. That's 100 to 400 seconds of a black screen, or no display signal, enough to unnerve anyone and assume something is DOA.Update Sep 2nd: The source behind this story confirmed that this is an ASRock-level issue, and that it's been "fixed" with the latest BIOS.

Update Sep 8th: This has been fixed according to ASRock.

Montage Technology, a leading data processing and interconnect IC design company, today announced that it is delivering the world's first Gen1 DDR5 Clock Driver (CKD or DDR5CK01) samples to the top DRAM memory vendors for their development of memory modules used in new-generation desktop and notebook computers.

For a long time, the clock driver functions have been integrated onto the register clock driver (RCD) device, which is used in the server platforms, rather than the PC computers. With the boost of the DDR5 data rate, the frequency of the clock signal becomes higher and higher, and the signal integrity issue of the clock becomes more and more challenging. As the DDR5 data rate reaches 6400MT/s and above, the memory modules such as UDIMMs and SODIMMs used in desktop and notebook computers, will need an on-DIMM clock driver to buffer and re-drive the clock signal of the memory modules, to meet the signal integrity and reliability requirement of the high-speed clock signal.

With its recent announcement of the Ryzen 7000 desktop processors, the action now shifts to the server, with AMD preparing a wide launch of its EPYC "Genoa" and "Bergamo" processors this year. Powered by the "Zen 4" microarchitecture, and contemporary I/O that includes PCI-Express Gen 5, CXL, and DDR5, these processors dial the CPU core-counts per socket up to 96 in case of "Genoa," and up to 128 in case of "Bergamo." The EPYC "Genoa" series represents the main trunk of the company's server processor lineup, with various internal configurations targeting specific use-cases.

The 96 cores are spread twelve 5 nm 8-core CCDs, each with a high-bandwidth Infinity Fabric path to the sIOD (server I/O die), which is very likely built on the 6 nm node. Lower core-count models can be built either by lowering the CCD count (ensuring more cores/CCD), or by reducing the number of cores/CCD and keeping the CCD-count constant, to yield more bandwidth/core. The leaked product-stack table below shows several of these sub-classes of "Genoa" and "Bergamo," classified by use-cases. The leaked slide also details the nomenclature AMD is using with its new processors. The leaked roadmap also mentions the upcoming "Genoa-X" processor for HPC and cloud-compute uses, which features the 3D Vertical Cache technology.

Dedicated to innovation in embedded board computing, AAEON are delighted to announce an impressive breakthrough in its ATX motherboard range with the release of the new ATX-Q670A, AAEON's first ATX board with DDR5 support. With this innovation, the ATX-Q670A can provide customers with an unprecedented 50% increase in bandwidth and also a decrease in power consumption compared to prior generations. Particularly suited to IoT applications, the ATX-Q670A also combines the greatest maximum SATA performance with the very fastest SSD to give customer applications access to higher I/O speeds.

The ATX-Q670A is not just faster, but also far more expansive and accommodating to higher-performance modules, offering two PCIe [x16] slots alongside both a PCIe [x4] and PCIe [x1] slot, in addition to a further three PCI slots. Such specifications, alongside the ATX-Q670A's dual graphic card support mean that it can facilitate everything from video capture to AI calculation for vision-based applications, with four independent 4K@60 Hz resolution display capabilities to complete the package.

The new Lenovo ThinkBook 16p Gen 3 will help content creators and power users unleash their creativity without limitations. The latest supercharged ThinkBook features up to AMD Ryzen 9 6000 H-series processors and NVIDIA GeForce RTX 3060 discrete graphics to deliver flagship performance with Windows 11. The immersive narrow-bezel 16-inch 2.5K IPS display options include TÜV Rheinland Low Blue Light and TÜV Eyesafe certifications to maximize eye comfort and include an Ambient Light Sensor that adjusts screen and keyboard backlight brightness. Two display options are available including a 400nit 60 Hz panel and a new 500nit 165 Hz VESA Certified HDR400 panel offers vivid colors and increased shadow and highlight detail. Both display options are also X-Rite Pantone Certified and support Dolby Vision content.

Super processing power of the AMD Ryzen 6000 Series Mobile Processors and NVIDIA GeForce RTX graphics help users tackle the most arduous demands of hybrid working. The addition of up to 32 GB dual-channel LPDDR5 memory, up to 2 TB through dual SSD storage and a 71Wh battery should keep users powered throughout the day. New working styles also require high-speed reliable connectivity and port availability for flexible and versatile connections. Conveniently connect to wireless networks, peripherals, and AV equipment thanks to Wi-Fi 6 support and two USB Type-C ports including one USB4, two USB-A 3.2 Gen 2 and an HDMI 2.1 port.

AMD in its Discord AMA confirmed DDR5-6000 to be the "sweetspot" memory overclock for its upcoming Ryzen 7000 "Zen 4" processors. A sweetspot frequency in AMD jargon is an inflection of performance, stability, cost, and ease. For the very first Ryzen, this was DDR4-3200. For Ryzen 2000, it was DDR4-3400. For the Ryzen 3000 "Zen 2," it climbed to DDR4-3800, the Ryzen 5000 "Zen 3" it was DDR4-4000.

At the architectural-level, it is usually the highest frequency where FClk, UClk, and MClk maintain a 1:1:1 ratio, before having to engage dividers that impact performance, making it a point of diminishing returns for investing in faster memory modules. AMD's Robert Hallock, leading the Discord AMA, recommended that FClk be left untouched at "Auto" for the best results, and overclockers look for an Auto:1:1 ratio for the FClk, UClk, and MClk. As with both AMD and Intel now, the highest frequencies are possible only with one single-rank DIMM per memory channel (1DPC), and memory overclocking yield lower results with dual-rank DIMMs, or two DIMMs per memory channel. Among the AMD EXPO-certified DIMMs announced over the past few days, some do engage memory clocks beyond DDR5-6000. It would be interesting to see how they affect the "golden ratio" for Zen 4.

SMART Modular Technologies, Inc. a global leader in memory solutions, solid-state drives, and hybrid storage products announces its new Compute Express Link (CXL) Memory Module, the XMM CXL memory module. SMART's new DDR5 XMM CXL modules helps boost server and data center performance by enabling cache coherent memory to be added behind the CXL interface, further expanding big data processing capabilities beyond the current 8-channel/12-channel limitations of most servers.

The industry adoption of composable serial-attached memory architecture enables a whole new era for the memory module industry. Serial-attached memory adds capacity and bandwidth capabilities beyond main memory DIMM modules. Servers with XMM CXL modules can be dynamically configured for different applications and workloads without being shut down. Memory can be shared across nodes to meet throughput and latency requirements.

XPG, a fast-growing provider of systems, components, and peripherals for Gamers, Esports Pros, and Tech Enthusiasts, today announces announced the launch of the new XPG LANCER 5600 DDR5 memory module, its first DDR5 to support AMD EXPO (Extended Profiles for Overclocking); What's more, all ADATA's and XPG's full lineup of DDR5 memory modules are compatible with AMD's latest platforms, ensuring optimal stability and performance.

XPG LANCER DDR5-5600 is capable of delivering performance of up to 5600 MT/s and comes in variants with or without RGB lighting. They also come with two heat sink color options to choose from to meet different preferences, including Midnight Black and Snow White. As AMD Ryzen 7000 series processors have been announced, XPG took the initiative to launch the XPG LANCER DDR5-5600 to allow gamers who are still on the sidelines to upgrade to DDR5 and enjoy the benefits of AMD EXPO for easy overclocking. XPG's full range of DDR5 memory models, including CASTER, LANCER, and HUNTER will all support AMD EXPO and be available globally in October.

GeIL is readying a fairly large lineup of its EVO V and Polaris RGB DDR5 memory lines featuring the AMD EXPO technology. These modules will pack both AMD EXPO and Intel XMP 3.0 profiles, but their advertised specs will apply on AMD Ryzen 7000-series platforms, whereas the XMP 3.0 profiles included will be an approximation of these specs. GeIL's lineup includes 32 GB dual-channel kits of two 16 GB modules. Frequencies include DDR5-4800 (JEDEC native), DDR5-5200 (JEDEC native), and EXPO-backed DDR5-5600, DDR5-6000, DDR5-6000 with tighter timings, DDR5-6200, and DDR5-6400. The exact part number, timings, and module voltages, are in the table below.

G.SKILL International Enterprise Co., Ltd., the world's leading brand of performance overclock memory and PC components, is excited to announce two new DDR5 memory series, the Trident Z5 Neo and Flare X5 series, designed for the new AMD Ryzen 7000 Series processors and 600 series motherboards. The Trident Z5 Neo family offerings include RGB (Trident Z5 Neo RGB) and non-RGB (Trident Z5 Neo) variants. Programmed with AMD EXPO technology and created with hand-screened memory ICs, the Trident Z5 Neo and Flare X5 series allow PC enthusiasts, gamers, and overclockers to experience the performance of the new AMD AM5 platform.

Designed for DDR5 memory-enabled AMD Ryzen 7000 Series desktop processors, the Trident Z5 Neo and Flare X5 series are pre-programmed with the latest AMD EXPO (EXtended Profiles for Overclocking) memory profiles, which allow users to easily overclock the memory kits. By simply enabling the AMD EXPO profile in the BIOS with a compatible motherboard and processor, users can unleash overclocked memory speeds on AMD Ryzen 7000 Series processors.

CORSAIR, a world leader in enthusiast components for gamers, creators, and PC builders, today announced the launch of DOMINATOR PLATINUM RGB DDR5 for AMD, VENGEANCE RGB DDR5 for AMD and VENGEANCE DDR5 for AMD, featuring new AMD EXPO technology and ready to power the next generation of Ryzen 7000-series powered PCs.

Available in frequencies up to a screaming-fast 6,000MT/s, and even higher in the future, all CORSAIR DDR5 for AMD kits offer AMD EXPO (Extended Profiles for Overclocking), allowing these modules to be set to their rated speed and performance in just a few clicks. AMD EXPO technology makes setup simple and ensures users can easily run their memory at the speed it was created to run at.

AMD today announced the Ryzen 7000 series "Zen 4" desktop processors. These debut the company's new "Zen 4" architecture to the market, increasing IPC, performance, with new-generation I/O such as DDR5 and PCI-Express Gen 5. AMD hasn't increased core-counts over the previous-generation, the Ryzen 5 series is still 6-core/12-thread, the Ryzen 7 8-core/16-thread, and Ryzen 9 either 12-core/24-thread, or 16-core/32-thread; but these are all P-cores. AMD is claiming a 13% IPC uplift generation over generation, which coupled with faster DDR5 memory, and CPU clock speeds of up to 5.70 GHz, give the Ryzen 7000-series processor an up to 29% single-core performance gain over the Ryzen 5000 "Zen 3."

At their press event, AMD showed us an up to 35% increase in gaming performance over the previous-generation, and an up to 45% increase in creator performance (which is where it gets the confidence to stick to its core-counts from). The "Zen 4" CPU core dies (CCDs) are built on the TSMC 5 nm EUV (N5) node. Even the I/O die sees a transition to 6 nm (N6), from 12 nm. The switch to 5 nm gives "Zen 4" 62 percent lower power for the same performance, or 49% more performance for the same power. versus the Ryzen 5000 series on 7 nm. The "Zen 4" core along with its dedicated L2 cache is 50% smaller, and 47% more energy efficient than the "Golden Cove" P-core of "Alder Lake."

Possible launch SEP pricing of AMD's Ryzen 7000 series "Zen 4" desktop processors leaked to the web by Wccftech, which appear to be similar to those of the Ryzen 5000 "Zen 3" at launch. AMD will launch a slim set of four SKUs in its first round of these processors—the flagship Ryzen 9 7950X (16-core/32-thread), followed by the second-best Ryzen 9 7900X (12-core/24-thread), the Ryzen 7 7700X (8-core/16-thread), and the mid-range Ryzen 5 7600X (6-core/12-thread).

Apparently, the series debuts with the Ryzen 5 7600X at $299, or the same SEP of the Ryzen 5 5600X at launch. The Ryzen 7 7700X launches at $449. The Ryzen 9 7900X comes in at $549, and the flagship Ryzen 9 7950X at $799, which again, is identical to that of the 5950X. Besides processors, motherboard vendors are expected to launch their first Socket AM5 motherboards, debuting with the AMD X670E and X670 chipsets. There's talk of mid-range chipsets such as the B650 and B650E, but we haven't seen any confirmed products show up on motherboard vendors' websites, yet. Pre-launch pricing for the X670E and X670 put them at a significant premium over the current Socket AM4 flagship boards based on the X570. Besides processors and motherboards, we could see announcements from memory vendors launching their first DDR5 memory products to feature AMD EXPO technology.

AMD's upcoming launch of Ryzen 7000 series processors will bring an entirely new AM5 platform that will enable newer technologies and protocols. We have DDR5 memory and PCIe 5.0 connection with everything at level five. However, the upcoming chipsets AMD has designed to work alongside the new processors will be available in several variants. There will be regular X670 and B650 versions that support either a PCIe 5.0 GPU or a PCIe 5.0 M.2 NVIMe SSD. Today, we got a confirmation that not only the big X670 chipset has an "E" or "Extreme" version, but its smaller brother B650 as well. With X670E and B650E, users get both PCIe 5.0 connectivity for their GPU and M.2 NVIMe SSD. For more information, we have to wait for AMD's official launch information later today.

Intel 700-series chipset motherboards could come with improved memory overclocking capabilities, suggest an alleged leaked specs-sheet of an MSI Intel Z790 chipset motherboard. As the pioneering platform for DDR5, Intel 600-series chipset motherboards, particularly those based on the Z690, typically marketed DDR5 memory overclock speeds of around DDR5-6000 or DDR5-6200 in their specs sheets, as the then-expensive DDR5 memory kits started at JEDEC-spec speeds of DDR5-4800 in the entry-level, with performance-segment kits around the DDR5-6000 mark.

The unnamed MSI Z790 chipset motherboard supports DDR5 overclocked frequencies of over DDR5-6800 at 1DPC (one DIMM per channel) with single-rank modules; over DDR5-6400 with 1DPC + dual-rank modules; over DDR5-6400 with 2DPC + single-rank modules; and over DDR5-5600 with 2DPC + dual-rank. Earlier reports suggested that Intel is "discouraging" motherboard vendors from coming up with 700-series motherboards that feature DDR4 memory slots, but this doesn't mean there won't be any. MSI has an Intel Z790 motherboard with DDR4 slots in the works, and it's capable of overclocks of up to DDR4-5000 in the most optimal configuration, and DDR4-4000 in the least optimal one.

BIOSTAR finalized the design of its flagship Socket AM5 motherboard, the X670E Valkyrie. While the PCB design appears identical to the board BIOSTAR showed at Computex 2022, there are some aesthetic improvements, such as some ARGB lighting elements with acrylic diffusers on the large VRM heatsink and the chipset heatsink. The board draws power from a combination of 24-pin ATX, and two 8-pin EPS connectors. Powering the CPU is a 22-phase VRM that uses 105 A DrMOS. The Socket AM5 is wired to four DDR5 slots, two PCI-Express 5.0 x16 slots (x16/NC or x8/x8), and a couple of M.2 Gen 5 slots.

Storage options on the BIOSTAR X670E Valkyrie include two M.2 slots with PCI-Express 5.0 x4 wiring, two additional M.2 slots with PCI-Express 4.0 x4 wiring, and six SATA 6 Gbps ports. Besides the Gen 5 x16 slots from the CPU, there's one PCI-Express 4.0 x16 (electrical x4) slot wired to the chipset, and an M.2 E-key slot for the WLAN card. There's no WLAN module included with the board, but there's preparation that includes two coaxial antenna jacks, and a cable leading up to the M.2 E-key slot. Wired networking comes from a 2.5 GbE interface powered by an Intel i225 controller. The board is expected to go on sale alongside Ryzen 7000 series processors, in September.

The intensification of the greenhouse effect has caused unusually high summer temperatures and heat waves that continue to engulf Europe and the rest of the world. Extreme temperatures have caused numerous data centers in Europe to suspend operations to ensure the safety of their equipment and data. In view of this, Team Group has placed greater emphasis on developing more innovative solutions for high-temperature applications, providing consumers with more reliable and durable industrial storage products. Equipped with the industry's first temperature sensing and warning technology and exclusive liquid cooling technology (Taiwan Utility Model Patent: M626519), Team Group's industrial products can help maintain the continuous operation of industrial equipment and monitor equipment temperature to avoid unexpected problems. These solutions help industrial customers and equipment reduce carbon emissions and move towards the goal of sustainable development while remaining under stable operation.

ASUS Republic of Gamers (ROG) today announced the latest gaming gear at Gamescom 2022, including the AMD X670E series motherboards, AIO coolers, PSU, displays, networking products, and peripherals. Along with these products, ROG released its first music single Reality, with vocals by renowned voice actor and musician Troy Baker, more commonly known for his roles in video games like The Last of Us and Uncharted series. An anime-inspired interactive 360° music video featuring the song is available on YouTube.

ROG Swift OLED PG42UQ / PG48UQ: The 42-inch ROG Swift OLED PG42UQ is designed for immersive desktop gaming and features 4K visuals at an overclocked 138 Hz refresh rate. The OLED panel ensures the deepest hues, as well as vibrant colors thanks to a 98% DCI-P3 color gamut and Delta E < 2 color difference. An ultrafast 0.1 ms (GTG) response time ensures great viewing and gaming experiences. The larger, 48-inch ROG Swift OLED PG48UQ is ideal for those looking to play their games on an even bigger scale. ROG OLED monitors include a custom heatsink that offers more surface area for heat exchange, resulting in up to 8% lower operating temperatures compared to ROG monitors without a heatsink to ensure better OLED performance and longevity.

ASUS today announced a new generation of AMD-based motherboards to accompany the ROG Crosshair X670E Extreme and support the latest Ryzen 7000 processors: the ROG Crosshair X670E Hero, the ROG Strix X670E-E Gaming WiFi, and the TUF Gaming X670E-Plus WiFi. Introducing the new generation of AMD ROG motherboards: the X670E series. Featuring support for DDR5 memory modules and PCIe 5.0 devices, the ROG Crosshair X670E Hero, ROG Strix X670E-E Gaming WiFi, and TUF Gaming X670E-Plus WiFi is equipped with improved bandwidth capabilities, stability, and overall connectivity.

All three boards feature the latest ASUS Q-Design innovations. The ROG Crosshair X670E Hero and ROG Strix X670E-E Gaming WiFi includes the PCIe Q-Release button, a feature that lets users release their graphics card from the PCIe slot with one press. In addition, all three featured motherboards will include the single-sided Q-DIMM latching design to ensure ease of installation and allowing memory sticks to hold firmly in place. Lastly, the boards include the M.2 Q-latch, allowing users to secure or loosen an M.2 drive with just their fingertips.

CORSAIR, a world leader in high-performance gear and systems for gamers, content creators, and PC enthusiasts, today announced the availability of the CORSAIR VOYAGER a1600 AMD Advantage Edition laptop from the CORSAIR webstore and distributors worldwide. Starting at an MSRP of $2,699.99, the CORSAIR VOYAGER a1600 features state-of-the-art AMD processor and graphics for mobile systems working in tandem using exclusive AMD smart technologies, alongside CORSAIR and Elgato software and technologies, to create a gaming and streaming experience like no other.

The CORSAIR VOYAGER a1600 comes equipped with AMD's most advanced components to deliver high-end performance in an incredibly thin 19.8 mm form-factor. An 8-core, 16-thread AMD Ryzen 9 6900HS processor and AMD Radeon RX 6800M mobile graphics enable players to game at maximum settings while capturing gameplay at high frame rates, bolstered by AMD smart technologies such as AMD Smart Access Memory to get even more performance out of your top-of-the-line components. CORSAIR VENGEANCE DDR5 SODIMM memory rounds out the CORSAIR VOYAGER a1600's powerful hardware, delivering the incredibly high frequencies of the DDR5 platform.

Today, AMD (NASDAQ: AMD) announced "together we advance_PCs," a livestream premiere to unveil next generation AMD PC products. Chair and CEO Dr. Lisa Su, CTO and EVP Mark Papermaster, and other AMD executives will present details on the latest "Zen 4" architecture that powers upcoming AMD Ryzen processors and the all new AM5 platform built around the latest technologies including DDR5 and PCIe 5.0, all designed to drive a new era of performance desktop PCs.

The show will premiere at 7 p.m. ET on Monday, August 29, on the AMD YouTube channel. A replay can be accessed a few hours after the conclusion of the event at AMD.com/Ryzen.

CORSAIR, a world leader in enthusiast components for gamers, creators, and PC builders, today announced its readiness for the new AMD Ryzen 7000 Series processors and accompanying motherboard chipsets. Featuring all new Zen 4 CPU architecture, AMD Ryzen 7000 Series chips deliver a substantial performance boost over previous-generation processors, and CORSAIR has the components to help support this generational upgrade. Those looking to build a new AMD system can take advantage of the free online CORSAIR PC Builder to help shortlist compatible parts for their new system.

CORSAIR has been working closely with AMD in the lead-up to the AMD Ryzen 7000 Series launch, and has already updated its PC Builder database to include the new processors so that you can curate a parts list for a powerful new AMD PC in minutes. The CORSAIR PC Builder takes your chosen CPU, graphics card, and motherboard and checks them for compatibility against a vast database of PC parts, coming up with a comprehensive list of CORSAIR parts guaranteed to work with your system. From a correctly sized case and appropriate fans, to a PSU rated to power your build and even RGB lighting, the CORSAIR PC Builder takes the guesswork out of building your new Ryzen 7000 Series powered PC. The CORSAIR PC Builder is even able to intelligently optimize the parts selected, so that you don't overspend or bottleneck your build with a mismatched component.

AMD has reportedly pushed market-availability date of its next-generation Ryzen 7000 series "Zen 4" desktop processors from September 15 to September 27, 2022. This would clash with the rumored product-announcement date of the Intel 13th Generation Core "Raptor Lake" processor series. If true, this is possibly a move designed to prevent Intel from sharing performance numbers of Ryzen 7000-series processors in the product-announcement presentation of "Raptor Lake," as Intel can only compare the chips it is announcing with competing AMD products that are available in the market at the time.

A September 27 market availability could still mean a late-August product announcement along the sidelines of Gamescom, with product reviews in the following weeks. It's just that the market availability date is now pushed to late-September. Intel's launch cycle for "Raptor Lake" could see a late-September announcement, but it remains to be seen if product availability is immediate, or timed weeks later. The 13th Gen Core "Raptor Lake" processor is built on the same LGA1700 package as current "Alder Lake," and compatible with existing Intel 600-series motherboards with a UEFI firmware update; although will be launched alongside new Intel 700-series chipset motherboards. AMD's Ryzen 7000-series product launch will be timed with those of compatible Socket AM5 motherboards based on the AMD 600-series chipset, and a new line of DDR5 memory modules featuring the AMD EXPO technology.