Thursday, September 1st 2022
AMD EPYC "Genoa" Zen 4 Product Stack Leaked
With its recent announcement of the Ryzen 7000 desktop processors, the action now shifts to the server, with AMD preparing a wide launch of its EPYC "Genoa" and "Bergamo" processors this year. Powered by the "Zen 4" microarchitecture, and contemporary I/O that includes PCI-Express Gen 5, CXL, and DDR5, these processors dial the CPU core-counts per socket up to 96 in case of "Genoa," and up to 128 in case of "Bergamo." The EPYC "Genoa" series represents the main trunk of the company's server processor lineup, with various internal configurations targeting specific use-cases.
The 96 cores are spread twelve 5 nm 8-core CCDs, each with a high-bandwidth Infinity Fabric path to the sIOD (server I/O die), which is very likely built on the 6 nm node. Lower core-count models can be built either by lowering the CCD count (ensuring more cores/CCD), or by reducing the number of cores/CCD and keeping the CCD-count constant, to yield more bandwidth/core. The leaked product-stack table below shows several of these sub-classes of "Genoa" and "Bergamo," classified by use-cases. The leaked slide also details the nomenclature AMD is using with its new processors. The leaked roadmap also mentions the upcoming "Genoa-X" processor for HPC and cloud-compute uses, which features the 3D Vertical Cache technology.
Sources:
yuuki_ans (Twitter), Wccftech, VideoCardz
The 96 cores are spread twelve 5 nm 8-core CCDs, each with a high-bandwidth Infinity Fabric path to the sIOD (server I/O die), which is very likely built on the 6 nm node. Lower core-count models can be built either by lowering the CCD count (ensuring more cores/CCD), or by reducing the number of cores/CCD and keeping the CCD-count constant, to yield more bandwidth/core. The leaked product-stack table below shows several of these sub-classes of "Genoa" and "Bergamo," classified by use-cases. The leaked slide also details the nomenclature AMD is using with its new processors. The leaked roadmap also mentions the upcoming "Genoa-X" processor for HPC and cloud-compute uses, which features the 3D Vertical Cache technology.
26 Comments on AMD EPYC "Genoa" Zen 4 Product Stack Leaked
It is really the same concept.
Problem with servers is data centers move at glacial pace to change in my experience, especially new platforms etc.
It is not the same concept as P/E cores of Intel which has different ISA and causing compatibility issues.
i can't see them not adding AVX512 to their e-cores but we will see
And the declining sales.
However based on the current situation of Sapphire Rapids, their multi chiplet design isn't going too well..
It's more like a strategy decision rather than an engineering or a design challenge.
The chiplet approach is the best for high core count servers, because it greatly improves the core per socket density.
They have huge resource so they can overtime fix them but it slow them down quite a lot. The worst example of that is Ponte Vecchio that is just an absurb manufacturing nightmare. Intel can't stand not being the top and it make them over ambitious. Same thing with their foundry nodes. Their 10mn now renamed Intel 7 is very good, but it was such a big step from 14nm that they had huge issue to figure out all the problem.
Glue is great at most times, at least for the last 15-20 years, no matter what the marketing departments of the competing companies say.
fuse.wikichip.org/news/6102/intels-gracemont-small-core-eclipses-last-gen-big-core-performance/
For AVX512, Intel could resort to emulation in the hardware, but there's also a possibility of software emulation. Not that it could achieve usable performance but it could keep a thread from crashing if it gets assigned, by mistake, to an E-core. I'd say it's a bit more complex - Bergamo will hit a different point in the performance-power-area curve, and area is tied to both the price and the density. We'll see if Bergamo will be marketed as an universal processor or intended for specific use cases only (and it may not even have AVX512 if those use cases don't need it). We the desktop users are beta testers for server technology. It's not the other way around (and that's good). The 3D V-cache is just the latest example of that. I hope we'll know more details some day (much later, that's for sure). Is it the multi chiplet design that doesn't want to work as intended, or those pesky universities that find and report new vulnerabilites at regular intervals so you can never be done with the new design, or both, or something else? Also, why is there no leaks, no news, nothing at all, about single chiplet workstation Xeons with SPR inside? I'm very sure Intel is hard at work developing those, but the design may be collapsing faster than it's being built.
Intel is on a hiding to nothing in this space. They should focus on HEDT. Sapphire Rapids for work stations before AMD gets Zen 4 Threadripper out.
I think we all know where all the Intel 'Leaks' came from.
So I am not surprised not seeing 'Leaks' for a product currently at 'something hit the fan' state.