Lexar, a leading global brand of flash memory solutions, is excited to reveal its cutting-edge Lexar ARES DDR5 Desktop Memory. The ARES DDR5 leverages next-gen technology, with speeds starting at 4800, DDR5-4800 is 1.5x the bandwidth faster than DDR4-3200. Features a sleek aluminium heatspreader to keep your system and motherboard running cool. It is perfect for PC enthusiasts, hardcore gamers and content creators who are looking to next-level performance, increased capacity and maximum power efficiency.

Whether you are operating speed-demanding video games, video editing software, or processing intensive workloads, the Lexar ARES DDR5 Desktop Memory accelerates your PC performance for multitasking with increased performance while on the latest 12th Gen Intel Core processor. Moreover, ARES DDR5 elevates the power efficiency and product reliability. It is built with an on-die ECC, which fully leverages real-time data error correction for increased data stability and reliability. With built-in Power Management IC (PMIC), the DDR5 computer memory module provides better power control and power delivery while operating at a low voltage of 1.1 V.

CORSAIR, a world leader in enthusiast components for gamers, creators, and PC builders, today announced new kits of its acclaimed DOMINATOR PLATINUM RGB DDR5 high-performance memory reaching frequencies up to a blistering 6,400 MHz. Available in kits of 2x16GB, DOMINATOR PLATINUM RGB 6,200 MHz and 6,400 MHz hit a new milestone with these unprecedented speeds, and are now more customizable than ever thanks to the new XMP Manager in CORSAIR iCUE software.

CORSAIR led the charge in next-generation memory with the release of DOMINATOR PLATINUM RGB DDR5 and VENGEANCE DDR5 for the Intel Z690 platform earlier this year, delivering higher frequencies in greater capacities than previously possible. Now the ceiling for DDR5 performance has risen again, with DOMINATOR PLATINUM RGB once more pushing the boundaries for the most powerful systems leveraging 12th Generation Intel Core Processors.

Quite possibly the first sighting of a next-generation AMD processor with DDR5 memory surfaced on the web. A BAPCo CrossMark Database entry references a prototype processor with the name-string "AMD Eng Sample: 100-000000560-40_Y," running on a platform titled "ASUSTeK COMPUTER INC. M3402RA." The chip has 16 GB of memory across 2 memory channels, and a memory frequency of 4800 MHz DDR. The platform here could be either a desktop motherboard, or a notebook. 4800 MHz is an unusual memory speed for a mobile platform, unless it's a single stick of DDR5-4800 SO-DIMM, with two 40-bit channels.

The first notebooks with DDR5 memory make landfall early next year, when Intel launches mobile variants of its 12th Gen Core "Alder Lake" processors. This would mean that DDR5 SO-DIMMs are already in circulation with OEMs. If the theory of this being a mobile chip holds true, it could very well be the "Rembrandt" APU that combines "Zen 3+" CPU cores with an iGPU based on the RDNA2 graphics architecture. If however the platform is a prototype Socket AM5 motherboard, it could be one of the first sightings of a next-generation "Raphael" desktop processor with "Zen 4" CPU cores, and a combination of DDR5 memory and PCI-Express Gen 5.

Leading global memory provider TEAMGROUP has been actively expanding in the industrial control field for many years. With the arrival of the new DDR5 generation, the company today announced the DDR5 ECC DIMM and DDR5 R-DIMM Industrial Server Memory modules. In recent years, there has been a steady growth in AI and HPC data applications, driving memory specifications toward higher capacities and greater performance. To meet this rising demand, TEAMGROUP has created multiple solutions with its latest innovations of DDR5 industrial server memory.

Its next-gen server memory modules can reach speeds of 6,400 MT/s, come with a maximum capacity of up to 128 GB, and operate at 1.1 V, resulting in lower overall power consumption. The memory also features two innovations in its power supply architecture and channel architecture. The new power supply architecture shifts power management from the motherboard to the DIMM itself, enhancing signal integrity and resistance to interference. The channel architecture is updated with two independent sub-channels per memory module (DIMM) to significantly improve memory access efficiency and meet the elevated demands of smart platform applications.

SK hynix today announced that it has shipped samples of 24 Gigabit (Gb) DDR5* DRAM with the industry's largest density for a single DRAM chip. The announcement of SK hynix releasing the industry's largest density DDR5 chip comes in just 14 months after the Company became the first to release DDR5 DRAM in October 2020, further solidifying the chipmaker's technological leadership in DDR5.

The new 24 Gb DDR5 was produced with the cutting-edge 1 anm technology that utilizes EUV process. It has a density of 24Gb per chip, which is up from the existing density of 16 Gb in 1 ynm DDR5, with improved production efficiency and increased speed by up to 33%. In addition, SK hynix managed to reduce the product's power consumption by *25% compared to existing products while lowering energy use in manufacturing through enhanced production efficiency. SK hynix expects the product to bring about reduction in carbon emissions as well, which is meaningful in the context of ESG management.

FinalWire Ltd. today announced the immediate availability of AIDA64 Extreme 6.60, Engineer 6.60, Business 6.60, and Network Audit 6.60 software. The latest AIDA64 update introduces optimized benchmarks for Intel "Alder Lake" and "Raptor Lake" processors, improvements for DDR5 memory modules and XMP 3.0 memory profiles, and supports the latest AMD and Intel CPU platforms as well as the new graphics and GPGPU computing technologies by both AMD and NVIDIA.

The AIDA64 product family for Windows PCs consists of three business editions and a home edition. The company's flagship IT asset management offering with hardware diagnostic features is AIDA64 Business, while a dedicated network inventory solution called AIDA64 Network Audit is also available, for a lower license fee. Designed for corporate engineers and IT technicians, AIDA64 Engineer includes expert tools not available in AIDA64 Extreme, the home edition of the software. Today all four AIDA64 editions are updated to v6.60.

KINGMAX, has introduced the latest DDR5 4800 MHz 16 GB desktop memory. Fully compatible with Intel's 12th-generation Alder Lake and Z690 platform, it has secured the QVL certification of a good number of main stream motherboard manufacturers, thereby attesting to its platform compatibility essential for this new era for PCs already here.

Compared with its predecessors, DDR5 4800 MHz memory stands out as an utter upgrade in overall performance. In terms of speed, DDR5 starts with a base frequency of 4800 MHz and its bandwidth of 38.4 MB/s is at least 1.5 times faster than the maximum of 25.6 MB/s offered by its DDR4 3200 MHz peers. Coupled with dual sub-channels (32-bit) that run independently, data processing becomes substantially more efficient as the memory controller enjoys a much lower data access latency.

Just yesterday, thanks to the Linux driver update, we found information stating that AMD's upcoming EPYC Genoa processor generation based on Zen 4 core IP will have a 12-channel memory controller. However, we didn't know how AMD engineered the memory controller of this processor generation and some of its maximum capabilities. However, there is an exciting discovery. According to the report from ComputerBase, with information exclusive to them, AMD will enable up to 12 TB of DDR5 memory spread across 12 memory channels. The processor supports DDR5-5200 memory, but when all 24 memory slots (two per channel) are populated, the DDR5 maximum speed drops to 4000 MT/s.

It is unclear why this is the case, and if any difficulties were designing the controller, so the maximum speed drops when every slot is used. One reassuring thing is that the bandwidth created by 12 memory channels should be sufficient to make up for the lost speed of DDR5 memory reduction.

ZADAK, announces the next step forward in gaming DRAM. The newest member of its high-end SPARK lineup is a DDR5 RGB illuminated gaming DRAM module which is available in 16 GB and 32 GB capacities. Gamers who demand the fastest clock speeds will be able to choose from modules ranging from 4800 MHz all the way up to 7200 MHz.

DDR5 also features another important upgrade: power management is no longer handled by the motherboard, but by a PMIC (power management integrated circuit) on the module itself. While DDR4 modules consume 1.2V, DDR5 modules only require 1.1V. It sounds like a small difference, but over hours and days of gaming, it adds up to significant power savings. The PMIC also gives overclockers more options when it comes to tweaking settings.

VIPER, a trademarked brand of PATRIOT, is excited to announce the availability of the new VIPER VENOM RGB and non-RGB DDR5 high-performance DRAM modules which will be available in Q1 2022. The VIPER VENOM DDR5 memory modules provide enhanced speeds ranging from 4800 MHz to 6200 MHz with kit capacities of 16 GB to 32 GB equipped with the exclusive VENOM heatspreader design with an option for RGB illumination catering to both PC hardware enthusiasts and hardcore gamers.

VIPER VENOM RGB DDR5 modules come with the stylish VENOM heatshield design with a new design to combine the LED light bar and the heatshield. The RGB light bar is an entirely new design with updated synchronization software and illumination patterns. The unique architecture of DDR5 has localized voltage adjustments based on a locked/unlocked PMIC (power management integrated circuit) and SPD HUB (serial presence detection), which provides simultaneous monitoring, threshold protection, intelligent voltage control, and power management to achieve more comprehensive voltage control.

Thanks to a Linux driver update, we now know that AMD's upcoming Zen 4 based EPYC CPUs will support up to 12 channels of DDR5 memory, an upgrade over the current eight. The EDAC driver, or Error Detection and Correction driver update from AMD contained details of the memory types supported by AMD's upcoming server and workstation CPUs and although this doesn't tell us much about what we'll see from the desktop platform, some of this might spill over to a future Ryzen Threadripper CPU.

The driver also reveals that there will be support for both RDDR5 and LRDDR5, which translates to Registered DDR5 and Load-Reduced DDR5 respectively. LRDDR5 is the replacement for LRDIMMs, which are used in current servers with very high memory densities. Although we don't know when AMD is planning to announce Zen 4, even less so the new EPYC processors, it's expected that it will be some time in the second half next year.

There has been a lot of discourse about the cost of Z690 motherboards, so we decided to ask around to find out what has changed compared to the previous generation of Intel motherboards. There are obviously several factors that have come together to create something like the perfect storm, as the simple answer is that all parts combined have resulted in more expensive motherboards, but there are a few key components that are major contributing factors.

A lot of speculation has been about the cost of the PCB itself and although it's correct that the PCB is a contributing factor, we're talking about a couple of dollars in extra cost, not only for the higher quality PCB materials themselves but also the fact that boards with DDR5 memory are more costly to produce, as more care needs to be taken with the overall design. However, the big surprise to us is that the single part that has driven up the cost the most is the physical LGA-17xx CPU socket and retention mechanism, which is apparently around four times as expensive as the LGA-12xx socket.

China's technology reliance on 3rd party companies seems to be getting smaller. One of the leading technology companies in China, Huawei, has designed a laptop powered by a custom 5 nm Kirin SoC with DDR5 memory. Called the Dyna Cloud L420, Huawei has prepared this model for the Chinese market to provide a fully functional laptop that will get the job done, with no risk of the potential security backdoors implemented in the processor. Powered by a brand new Kirin 9006C SoC manufactured on TSMC's 5 nm process, it features eight unknown cores running at 3.1 GHz frequency. We assume that those are custom cores designed by Huawei. This SoC is accompanied by 8 GB of LPDDR5 memory, with 256 GB and 512 GB UFS 3.1 configurations storage options.

When it comes to the rest of the laptop, it rocks a 14-inch 2160x1440 display. I/O options are solid as well, as this machine has an HDMI video output, two USB-A, one USB-C, and Gigabit Ethernet using a mini-RJ45 port. Connectivity is provided by Wi-Fi 6 and Bluetooth 4.2. There is a 56 W/h battery that provides the juice to keep it running when it comes to the battery. And to complete all of that, this laptop officially only supports Huawei's proprietary Kirin OS (KOS) and Unity OS (UOS), with expected support for HarmonyOS in the future. Pricing and availability information is a mistery at the present date.

AMD apparently finds itself with quite a bit of undigested 7 nm "Renoir" silicon, which it plans to repackage as Socket AM4 processors, reports VideoCardz, citing sources on ChipHell forums. The most interesting aspect of this leak is that the silicon variant, codenamed "Renoir X," comes with a disabled iGPU. This is hence a case of AMD harvesting enough "Renoir" dies with faulty iGPU components, to sell them off as desktop processors. It is also learned that these chips don't feature all of the 8 "Zen 2" CPU cores present on the silicon, but rather AMD is looking to carve out entry-level SKUs, such as the Ryzen 3 or Athlon. The company lacks Athlon desktop SKUs based on "Zen 2" or later, although traditionally the company sought to include some basic iGPU solution with its Athlon SKUs.

In related news, the source reports that AMD will refresh its Ryzen desktop processor family with the new "Vermeer S" Ryzen processors. Built on the existing Socket AM4 package, these use AMD's "Zen 3" CCDs that feature 3D Vertical Cache (3DV Cache), much like the recently announced EPYC "Milan X" server processors. AMD claimed that the 3DV Cache technology has a significant performance uplift on performance akin to a generational update. These could be the company's first response to Intel Core "Alder Lake," although since they're based on the older AM4 platform, could only feature DDR4 and PCIe Gen 4. Much like the Ryzen 3000XT series, these appear to be a stopgap product lineup, with AMD targeting late-Q2/early-Q3 for next-generation "Raphael" Socket AM5 processors based on the "Zen 4" architecture, with DDR5 and PCIe Gen 5.

As Amazon is continuing to grow its AWS business, both with new instances powered by AMD's third generation of EPYC processors and it's new EC2 C5g instances powered by its current Graviton2 processors and Nvidia's T4G tensor core GPUs. However, the company is also opening up its first EC2 C7g preview instances using its brand new Graviton3 processors, which the company claims offer vastly improved performance over the Graviton2 on specific workloads.

EC2 stands for Elastic Compute Cloud and judging by the fact that the Graviton3 is said to have up to twice as past FPU performance for scientific workloads and being twice as fast for cryptographic workloads and up to three times faster for machine learning workloads, you can guess who these new EC2 instances are intended for. Amazon didn't reveal much in terms of technical details about the Graviton3, but it'll utilize DDR5 memory, which makes it one of the first, if not the first server CPU to use DDR5. It's also said to use up to 60 percent less energy than the Graviton2, while delivering up to 25 percent more compute performance. It's implied that it uses the Arm v9 architecture and the Neoverse N2 Arm cores, although this hasn't been officially announced.

T-FORCE, TEAMGROUP's gaming sub-brand, today announced the launch of the T-FORCE DELTA TUF Gaming Alliance RGB DDR5 Gaming Memory in collaboration with ASUS TUF Gaming Alliance, the industry's first co-branded DDR5 gaming memory. Samples have been sent to TUF Gaming for testing with future DDR5 motherboards to ensure optimal compatibility and reliability. The T-FORCE DELTA TUF Gaming Alliance RGB DDR5 Gaming Memory is set to create another splash for its speed and style that combines TUF Gaming's signature military aesthetics and T-FORCE's unique gaming elements.

The T-FORCE DELTA TUF Gaming Alliance RGB DDR5 Gaming Memory maintains the RGB lighting along the top edges and its geometric wide-angled contour. With the addition of stealth fighter design elements to enhance the overall look, this new version is more striking than ever before. TEAMGROUP, in collaboration with TUF Gaming Alliance, gave the heatspreader a special camouflage pattern that showcases the unique gaming style of the TUF co-branding, which is sure to be a hit among fans of TUF. The dazzling RGB effects of the T-FORCE DELTA TUF Gaming Alliance RGB DDR5 Gaming Memory can be synchronized using ASUS Aura software, allowing gamers to easily create their own lighting setup. In terms of specifications, the memory clocks in at an impressive 6000 MHz and comes in a 2X16GB dual-channel memory kit. This memory will satisfy gamers looking for the latest-gen hardware and give them a whole new feeling of extreme speed.

Prominent chip designers like AMD and NVIDIA could bless consumers with a broader offering of their new products as soon as CES 2022 arrives. AMD should present its rumored Rembrandt-H lineup of processors based on the enhanced Zen 3 core, sometimes referred to as Zen 3+. According to the latest report coming from MyLaptopsGuide, Bluetooth SIG has some data entry about ASUS'es upcoming ROG Zephyrus Duo GX650 laptop that integrates AMD Rembrandt-H processors and NVIDIA GeForce RTX 30-series graphics. As the website claims, the heart of this laptop will be AMD Ryzen 9 6900HX processor built on TSMC's 6 nm manufacturing process. We don't know much about this model, but we expect it to refine the previous Ryzen 9 5900HX.

We again see the rumored NVIDIA GeForce RTX 3080 Ti graphics card for mobile, powering the graphics side of things. This model is supposedly based on GA103S GPU SKU, which is likely tailor-made for laptops in mind and exclusive to them. ASUS has also paired 16 GB of DDR5-4800 RAM with an AMD Ryzen processor, suggesting that Rembrandt-H has a new memory controller in place. This laptop model also has a 16-inch 300 Hz Full HD screen with anti-glare; however, the amount of information ended there. We have to wait for CES 2022 launch to find out more.

Today, MSI announced the latest lineup of gaming desktops equipped with Intel 12th Gen Alder Lake processor. Based on a new hybrid architecture, the 12th generation Intel Core processor combines a mix of Performance cores (P-cores) and Efficiency cores (E-cores) to maximize performance, increases multi-thread performance by up to 55%, the gaming performance has more than 13% increase compared to the previous generation.

The full lineup of K Series gaming desktops adopted DDR5 memory with read speed up to 60% higher than the previous generation equipped with DDR4. Support for PCIe 5 which is primed to provide speedy and improved transmission. Additionally, MSI has also upgraded MSI Center and MSI App Player. The new MSI Center helps to control and customize your system. With innovation in MSI App Player, it is easier to play mobile games on the PC. The lineup also features 2.5G Ethernet LAN and Wi-Fi 6E to offer faster data transfer speeds. MSI launched 3 models of gamer-oriented desktops, including Aegis Series, Trident Series and Codex X5 series to cater towards all types of gamers.

AMD later this month is preparing to address investors as part of a yet-unknown event. The company typically hosts Financial Analyst Day events around Q1-Q2, and goes to the investors with substantial material on the current state of the organization, the products on offer, what's on the horizon, and how it could impact the company's financials. An alleged presentation related to the November 2021 event was leaked to the web. The presentation provides a guided tour of the entire product portfolio of the company, spanning server processors, compute accelerators, consumer graphics, some client processors, and the semi-custom business.

The presentation outlines that the company has so far successfully executed its roadmaps for the client-CPU, server-CPU, graphics, and compute-accelerator segments. In the client CPU segment, it shows a successful execution up to 2021 with the "Zen 3" microarchitecture. In the server space, it mentions successful execution for its EPYC processors up to "Zen 3" with its "Milan" processors, and confirms that its next-generation "Zen 4" microarchitecture, and its sister-architecture, the "Zen 4c," will be built on the 5 nm silicon fabrication node (likely TSMC N5). The presentation also details the recently announced "Milan-X" processor for existing SP3 platforms, which debuts the 3D Vertical Cache technology, bringing up to 96 MB of L3 cache per CCD, and up to 768 MB of L3 cache (804 MB L1+L2+L3 cache) per socket.Update 10:54 UTC: The presentation can now be found on the AMD Investor Relations website.

Intel debuted its 12th Gen Core "Alder Lake-S" desktop processor family late last month with only the unlocked "K" and "KF" SKUs targeting gamers and PC enthusiasts, alongside only the top Z690 chipset motherboards. The company is preparing to expand the lineup early next year with the addition of at least seven more SKUs (excluding additional "F" variants that lack integrated graphics). These processors could also introduce more value-conscious motherboard chipsets, such as the B660 and H670. momomo_us on Twitter, a reliable source with hardware leaks, predicts specs and a possible mid-January launch date for these chips.

The lineup possibly includes the Core i9-12900 and i9-12900F at the top, followed by the i7-12700 and i7-12700F, and the meaty Core i5 lineup that includes the i5-12600 and i5-12600F; the i5-12500, and the i5-12400/F. At least two Core i3 series SKUs could also be launched. The possible clock-speeds, and L3 cache sizes for the SKUs are tabulated below. What stands out from these SKUs is the specs of the Core i5-12600. We earlier thought it would be based on the larger "C0" silicon, with 6 P-cores and 4 E-cores, but it turns out, that the SKU is based on the smaller "H0" silicon with just 6 P-cores and no E-cores. Read more about the two silicon variants of "Alder Lake-S" in our older article. The i5-12600 will have significantly different performance and energy efficiency numbers than the i5-12600K.

During Samsung's Tech Day 2021, the company presented some interesting insights about the future of system memory technologies and how it plans to execute its production. Starting with the latest DDR5 standard, the company intends to follow JEDEC documents and offer some overclocking modules that surpass the specification advised by JEDEC. While the DDR5 standard specifies memory modules with 6,400 MT/s, Samsung will develop modules capable of overclocking up to 8,400 MT/s. These are not yet confirmed as they are still in the development phase. However, we can expect to see them in the later life of DDR5 memory.

The company also talked about the DDR6 standard, which is supposedly twice as fast as DDR5. The new DDR6 standard is still in early development, and all we know so far is that the number of memory channels per module is seeing a twofold increase over DDR5 to four channels. The number of memory banks also increases to 64. In addition to DDR6 for desktop and server use cases, the company is also working on Low Power DDR6 (LPDDR6) for mobile applications. While the company's LPDDR5 memory goes into volume production using the 1a-nm process at the beginning of 2022, the LPDDR6 is still in early development. The base speed for DDR6 modules will allegedly arrive at 12,800 MT/s, while overclocking modules will join the party at up to 17,000 MT/s. Mobile-oriented LPDDR6 version is also supposed to come with up to 17,000 MT/s speeds.

With its 12th Gen Core "Alder Lake-P" mobile processors still on the horizon, Intel is already building test batches of the 14th Gen "Meteor Lake" mobile processors, at its Fab 42 facility in Chandler, Arizona. "Meteor Lake" is a multi-chip module that leverages Intel's Foveros packaging technology to combine "tiles" (purpose built dies) based on different silicon fabrication processes depending on their function and transistor-density/power requirements. It combines four distinct tiles across a single package—the compute tile, with the CPU cores; the graphics tile with the iGPU: the SoC I/O tile, which handles the processor's platform I/O; and a fourth tile, which is currently unknown. This could be a memory stack with similar functions as the HBM stacks on "Sapphire Rapids," or something entirely different.

The compute tile contains the processor's various CPU core types. The P cores are "Redwood Cove," which are two generations ahead of the current "Golden Cove." If Intel's 12-20% generational IPC uplift cadence holds, we're looking at cores with up to 30% higher IPC than "Golden Cove" (50-60% higher than "Skylake."). "Meteor Lake" also debuts Intel's next-generation E-core, codenamed "Crestmont." The compute tile is rumored to be fabricated on the Intel 4 node (optically a 7 nm-class node, but with characteristics similar to TSMC N5).

DDR5 may soon have reason to be an even more expensive early-adopter piece of tech than it currently is, according to electronic component supplier 12chip. While semiconductor manufacturers worldwide grapple with logistics and components shortages, the DRAM market has been left somewhat unscathed - up to now. DRAM fabrication - even DDR5 - isn't done on leading-edge nodes but on older, more mature ones (such as 14 nm). According to 12chip, manufacturers are having no problem in scaling their DRAM manufacturing on these older nodes to meet demand.

However, DDR5 is being directly impacted by the current logistics issues due to lack of adequate Power Management Integrated Circuit (PMIC) chips - which DDR5 has integrated in the DIMM proper. Currently, lead times for PMIC orders are estimated at 35 weeks, placing additional strain on system assemblers and DRAM manufacturers - and forcing delays and bottlenecks throughout the supply chain. Additionally, the fact that PMIC chips for DDR5 are ten times as expensive as equivalent DDR4 power management solutions doesn't bode well for future price action on DDR. Should this situation continue, higher prices for DDR5 modules are to be expected due to a deteriorating supply/demand ratio - particularly relevant if you're thinking about putting together a build based on Intel's Alder Lake platform. As always, take this report with a grain of salt.

During the Supercomputing (SC) 21 event, Intel has disclosed additional information regarding the company's upcoming Xeon server processor lineup, codenamed Sapphire Rapids. One of the central areas of improvement for the new processor generation is the core architecture based on Golden Cove, the same core found in Alder Lake processors for consumers. However, the only difference between the Golden Cove variant found in Alder Lake and Sapphire Rapids is the amount of L2 (level two) cache. With Alder Lake, Intel equipped each core with 1.25 MB of its L2 cache. However, with Sapphire Rapids, each core receives a 2 MB bank.

One of the most exciting things about the processors, confirmed by Intel today, is the inclusion of High-Bandwidth Memory (HBM). These processors operate with eight memory channels carrying DDR5 memory and offer PCIe Gen5 IO expansion. Intel has confirmed that Sapphire Rapids Xeons will feature up to 64 GB of HBM2E memory, including a few operating modes. The first is a simple HBM caching mode, where the HBM memory acts as a buffer for the installed DDR5. This method is transparent to software and allows easy usage. The second method is Flat Mode, which means that both DDR5 and HBM are used as contiguous address spaces. And finally, there exists an HBM-only mode that utilizes the HBM2E modules as the only system memory, and applications fit inside it. This has numerous benefits, primarily drawn from HBM's performance and reduced latency.

TEAMGROUP, the leading brand in the global memory product market is introducing the highly anticipated T-FORCE DELTA RGB DDR5 and T-FORCE VULCAN DDR5 desktop memory. The phenomenal speed and visualization properties of DELTA RGB DDR5 reach an exceptional maximum frequency of 6,400 MHz and have recently been verified by major motherboard manufacturers to be compatible with their lighting control software. Meanwhile, the maximum frequency of VULCAN DDR5 is 5,200 MHz. Marking a new page in the DDR5 series, the two newly developed products with pioneering specifications will be available globally this month on Newegg and Amazon.

T-FORCE DELTA RGB DDR5 overclocking memory is equipped with a power management IC with professional thermal conductive silicone rubber to enhance heat dissipation. It also supports on-die ECC error correction code to deliver stability and efficiency in power and system operations. The dual-channel memory offers a 2x16GB capacity, and consumers can choose from two frequency specifications, 6,000 MHz and 6,400 MHz. T-FORCE DELTA RGB DDR5 desktop memory sustains the series original geometric design featuring optimized simplicity in its silhouette inspired by stealth aircraft. The RGB intelligent control chip and 120° ultra-wide range illumination properties allow users to effortlessly immerse in DDR5 memory's extraordinary performance and distinguishing visualization.