AMD is slowly gearing up to launch the latest 7000 series Ryzen processors codenamed "Raphael." Thanks to the famous hardware leaker @9550pro on Twitter, we have evidence of B650 motherboards for the next-generation hardware. According to the image posted by the leaker, it appears like AMD's Ryzen 7000 series Raphael processor is running on MSI's MAG B650 motherboard at a very high voltage of 1.5 Volts VCore. While we don't know the exact SKU running here, we see a note referring to it as an Engineering Sample, meaning that this is not a final product. It is expected to see the new AM5 platform make a debut alongside DDR5 and PCIe 5.0 technology, so we have to wonder what the B650 chipset can support.

AMD's first desktop processor with DDR5 memory support, the Ryzen 7000 series "Raphael," based on the "Zen 4" microarchitecture, will come with a design focus on DDR5 memory overclocking capabilities, with the company claiming that the processors will be capable of handling DDR5 memory clock speeds "you maybe thought couldn't be possible," according to Joseph Tao who is a Memory Enabling Manager at AMD.

Tao stated: "Our first DDR5 platform for gaming is our Raphael platform and one of the awesome things about Raphael is that we are really gonna try to make a big splash with overclocking and I'll just kinda leave it there but speeds that you maybe thought couldn't be possible, may be possible with this overclocking spec." We are hearing reports of AMD innovating a new overclocking standard for DDR5 memory, which it calls RAMP (Ryzen Accelerated Memory Profile), which it is positioning as a competing standard to Intel's XMP 3.0 spec.

ADATA Technology (Taiwan Stock Exchange: 3260.TWO), a manufacturer of high-performance DRAM modules, NAND Flash products, mobile accessories, gaming products, electric power trains, and industrial solutions today announces that it has been awarded six 2022 Red Dot Design Awards for product design excellence. The award winners include the XPG CASTER and SLAYER DDR5 DRAM, XPG ALPHA and PRIMER mice, and ADATA ELITE SE920 and SE880 external solid state drives (SSD).

"From three Red Dot winners last year to six winners this year, ADATA has shown its unwavering emphasis on product design as a key aspect of the user experience," said Ibsen Chen, Senior Product Marketing Director at ADATA. "Whether they be DRAM, gaming mice, or external SSDs, we not only offer users the performance and functionality they require but also a fitting industrial design that appeals to them on an emotional level." The Red Dot Design Award is a globally recognized award that honors innovative companies, praises design excellence, and ultimately recognizes those responsible for tomorrow's trends. An international jury of design experts with a variety of backgrounds assesses each submission on its merits.

Here is the first picture of a next-generation AMD EPYC "Genoa" processor with its integrated heatspreader (IHS) removed. This is also possibly the first picture of a "Zen 4" CPU Complex Die (CCD). The picture reveals as many as twelve CCDs, and a large sIOD silicon. The "Zen 4" CCDs, built on the TSMC N5 (5 nm EUV) process, look visibly similar in size to the "Zen 3" CCDs built on the N7 (7 nm) process, which means the CCD's transistor count could be significantly higher, given the transistor-density gained from the 5 nm node. Besides more number-crunching machinery on the CPU core, we're hearing that AMD will increase cache sizes, particularly the dedicated L2 cache size, which is expected to be 1 MB per core, doubling from the previous generations of the "Zen" microarchitecture.

Each "Zen 4" CCD is reported to be about 8 mm² smaller in die-area than the "Zen 3" CCD, or about 10% smaller. What's interesting, though, is that the sIOD (server I/O die) is smaller in size, too, estimated to measure 397 mm², compared to the 416 mm² of the "Rome" and "Milan" sIOD. This is good reason to believe that AMD has switched over to a newer foundry process, such as the TSMC N7 (7 nm), to build the sIOD. The current-gen sIOD is built on Global Foundries 12LPP (12 nm). Supporting this theory is the fact that the "Genoa" sIOD has a 50% wider memory I/O (12-channel DDR5), 50% more IFOP ports (Infinity Fabric over package) to interconnect with the CCDs, and the mere fact that PCI-Express 5.0 and DDR5 switching fabric and SerDes (serializer/deserializers), may have higher TDP; which together compel AMD to use a smaller node such as 7 nm, for the sIOD. AMD is expected to debut the EPYC "Genoa" enterprise processors in the second half of 2022.

Here's the first picture of AMD Socket SP5, the huge new CPU socket the company is building its next-generation EPYC "Genoa" enterprise processors around. "Genoa" will be AMD's first server products to implement the new "Zen 4" CPU cores, and next-gen I/O, including DDR5 memory and PCI-Express Gen 5. SP5, much like its predecessor SP3, is a land-grid array (LGA) socket, and has 6,096 pins.

The vast pin-count enables power to support CPU core-counts of up to 96 on the EPYC "Genoa," and up to 128 on the EPYC "Bergamo" cloud processor; a 12-channel DDR5 memory interface (24 sub-channels); and up to 128 PCI-Express 5.0 lanes. The socket's retention mechanism and processor installation procedure appears similar to that of the SP3, although the thermal requirements of SP5 will be entirely new, with processors expected to ship with TDP as high as 400 W, compared to 280 W on the current-generation EPYC "Milan." AMD is expected to debut EPYC "Genoa" in the second half of 2022.

G.SKILL International Enterprise Co., Ltd., the world's leading manufacturer of extreme performance memory and gaming peripherals, has received the honor of Red Dot Award: Product Design 2022 for the Trident Z5 RGB and Ripjaws S5 series DDR5 memory for outstanding and innovative product design.

Standing out amongst more than thousands of entries, both G.SKILL Trident Z5 RGB and Ripjaws S5 series DDR5 memory products exceeded the juror panel's strict criteria and expectation in multiple areas of product standards, including the degree of innovation, functionality, formal quality, ergonomics, durability, symbolic and emotional content, product periphery, self-explanatory quality, and ecological compatibility.

XanxoGaming has now posted its first game benchmark with the Ryzen 7 5800X3D, paired with a NVIDIA GeForce RTX 3080 Ti Founders Edition. They put it up against an Intel Core i9-12900KS and Core i9-12900K. However, as you might have deduced from the headline of this news post, so far, they've only run a single game, but are promising to deliver more results shortly. That single game so far is Shadow of the Tomb Raider at 720p and using low settings, which means that this is a far cry from a real world scenario, but it does at least give a first taste of what's to come. For whatever reason, the Core i9 systems are using an NVIDIA GeForce RTX 3090 Ti and the CPUs are paired with DDR5 memory rated at 4800 MHz CAS 40. The Ryzen 7 5800X3D has been given another pair of 8 GB modules, so it's now using dual rank memory, but still at 3200 MHz and CAS 14.

In their test, the Core i9-12900K averages around 190 FPS, which they place as their baseline. The Core i9-12900KS manages around 200 FPS, or a bit over a five percent improvement. These benchmark numbers are provided by CapFrameX that claims that due to the low resolution used, the GPU doesn't really matter and although it's not an apples-to-apples comparison, it's very close. So what about the Ryzen 7 5800X3D? Well, it gets an average FPS number of 231, which is a bit odd, since the Intel CPU benchmarks are rounded and the AMD ones are not. Regardless, that's over a 20 percent increase over the Core i9-12900K and over 15 percent of the Core i9-12900KS. XanxoGaming is promising more benchmarks and those will be delivered at 1080p at Ultra settings according to the publication. In other words, this is still not what most of us have been waiting for.

The next-generation AMD Ryzen 7000 "Raphael" desktop processors in the Socket AM5 package are rumored to enter mass-production soon, according to Greymon55 on Twitter, a reliable source with AMD leaks. Silicon fabrication of the chips may already be underway, as the source claims that packaging (placing the dies on the fiberglass substrate or package), will commence by late-April or early-May. "Raphael" is a multi-chip module of "Zen 4" CCDs fabricated on the TSMC N5 (5 nm) node, combined with a cIOD built on a yet-unknown node. A plant in China performs packaging.

It's hard to predict retail availability, but for the Ryzen 5000 "Vermeer" processors, this development milestone was reached in June 2020, with the first products hitting shelves 4 months later, in November. This was, however, in the thick of the pre-vaccine COVID-19 pandemic. The "Zen 4" CPU cores are expected to introduce an IPC increase, as well as higher clock speeds. Also on offer will be next-gen connectivity, including PCI-Express Gen 5 (including CPU-attached Gen 5 NVMe), and DDR5 memory. These processors will launch alongside Socket AM5 motherboards based on the new AMD 600 series chipsets.

G.SKILL International Enterprise Co., Ltd., the world's leading manufacturer of extreme performance memory and gaming peripherals, is delighted to announce the launch of a high-capacity, ultra-low-latency DDR5-6000 CL30 64 GB (32 GB x2) overclocked performance memory kit under the Trident Z5 family, designed for the latest 12th Gen Intel Core desktop processors and Intel Z690 chipset motherboard.

As the leader in developing high performance memory products, G.SKILL launches an all new high-capacity, ultra-low-latency dual-channel memory kit, rated at a blistering DDR5-6000 CL30-40-40-96 in 64 GB (32 GB x2) kit capacity. Using only the best-in-class memory components to achieve high-speeds with 32 GB module capacity, this extreme overclocked memory specification represents the next step in high-capacity DDR5 performance. The screenshot below shows this memory kit validated with the Intel Core i7-12700K processor and ASUS ROG Maximus Z690 Hero motherboard.

As unreliable as Geekbench can be as a comparative benchmark, it's also an excellent source for upcoming hardware leaks and in this case more details about AMD's upcoming Zen 4 based Genoa server and workstation processors has leaked. Someone with access to a 32-core engineering sample thought it was a good idea to run geekbench on it and upload the results. As the engineering sample CPU is locked at 1.2 GHz, the actual benchmark numbers aren't particularly interesting, but the one interesting titbit we get is that AMD has increased the L2 cache to 1 MB per core, or twice as much as its predecessor.

What seems to be missing from this engineering sample is any kind of 3D V-Cache, as it only has a total of 128 MB L3 cache. Despite the gimped clock speed, the Genoa CPU is close to an EPYC 7513 in the single core tests and that CPU has a 2.6 GHz base clock and a 3.65 GHz boost clock, both system running Ubuntu 20.04 LTS. It manages to beat it in a couple of the sub-tests, such as Navigation, SQLite, HTML5, gaussian blur and face detection and it's within a few points in things like speech recognition and rigid body physics. This is quite impressive considering the Genoa engineering sample is operating at less than half the clock speed, or possibly even at a third of the clock speed of the EPYC 7513. AMD is said to be launching its Zen 4 based Genoa CPUs later this year and models with up to 96 core and 192 threads, with 12-channel DDR5 memory and PCIe 5.0 support are expected.

Memtest86+, the spiritual successor of MemTest86, has been somewhat stuck in development hell, but now the developer behind the memory testing software has promised to deliver version 6.00 sometime this summer. Version 5.31b was released in April 2020, some six years after the previous release and still not released as a final build, largely due to the pandemic. Version 6.00 promises a host of new features and the developers are already now asking for people that want to pitch in and help out with the project, since it's an open-source project.

The goal of version 6.00 is to deliver 64-bit support, UEFI and DDR5 with XMP support, as well as support for up to 256 CPU cores. Other features that are said to come include PXE and native USB boot. The goal is to provide a beta build sometime in April, but for those that don't mind compiling their own version of the code, can give it a try now, although the developers are warning that the code is going to be buggy at this point. The base code is said to have been re-written from scratch compared to prior versions and a lot of features are still missing and some features from the older versions are said to have been dropped, at least for the time being.

ADATA Technology, a leading manufacturer of high-performance DRAM modules, NAND Flash products, and mobile accessories has today launched new industrial-grade Registered DIMM (R-DIMM) DDR5 memory modules. This completes a full suite of industrial-grade DDR5 including U-DIMM, SO-DIMM and now R-DIMM modules designed for the latest Intel 12th Generation processors, and future DDR5 platforms.

ADATA industrial-grade R-DIMM DDR5 memory modules are suitable for a wide range of applications, including 5G backhaul equipment, AIoT, High-Performance Computing, Server, Data Center, Edge Computing, Networking, Surveillance and more. DDR5 is expected to account for 90% of the global memory market by 2026, and ADATA's DDR5 memory is ready to support the growing demand for reliable, high bandwidth memory.

Intel's Arc discrete lineup of graphics card are set to hit the notebook/laptop segment first, and today's discovery is no different. BHPhotoVideo, one of the largest US tech retailers, has posted a listing of Samsung's Galaxy Book2 Pro laptop, spotting Intel's Arc discrete graphics solution. According to the listing, this model was spotting an undisclosed Intel Arc Graphics, 2.1 GHz 12-core CPU, 16 GB of LPDDR5-6400 memory, 512 GB of NVMe PCIe Gen4 storage, 15.6-inch 1080p AMOLED display, WiFi-6E, and came in just 1.13 KG body weight. All of this is packed at 1349.99 USD, which is an early sign of the structure of laptop prices carrying Intel's Arc GPUs.

BHPhotoVideo has now taken down the website listing; however, we still have evidence thanks to the leaker, which you can see below. For more information regarding the exact SKU and more Arc Alchemist data, we have to wait for the March 30th launch.

Intel and AMD will be releasing new CPUs that support DDR5 DRAM solutions for PCs and servers this year. In response, the DRAM industry led by South Korean suppliers is developing solutions to complement the arrival of the new CPUs. In the midst of the gradual shift to DDR5, DRAM suppliers will also scale back the supply of DDR3 solutions, according to TrendForce's latest investigations. With Korean suppliers accelerating their withdrawal from DDR3 production, Taiwanese suppliers yet to kick off mass production using newly installed capacities, and Chinese suppliers falling short of their expected yield rate, the global supply of DDR3 solutions will undergo an impending decline. With respect to the demand side, however, not only has the supply of networking chips been ramping up, but material shortage issues are also gradually easing. As such, buyers are now procuring DDR3 solutions ahead of time, resulting in a tight supply and demand situation in the DDR3 market. TrendForce therefore expects DDR3 DRAM prices to recover from a bearish first quarter and undergo a 0-5% QoQ increase in 2Q22.

Chinese motherboard maker ONDA released the first Intel Socket LGA1700 motherboard that features both DDR4 and DDR5 memory support—something we learned quite early on that Intel either isn't allowing or is "discouraging" motherboard vendors to do. The ONDA H610M+ is based on the entry-level Intel H610 chipset, and is an otherwise basic-looking motherboard. The memory sub-system is interesting.

While the board supports both DDR5 and DDR4, there's only one of each slots, so you're limited to single-channel, and like every motherboard from the past that supported multiple memory types; you can't use the DDR5 and DDR4 slots at the same time. The board runs DDR4 at a maximum frequency of DDR4-3200, and the DDR5 slot at DDR5-4800 (max). That's not all, the board is quite possibly the only H610 chipset-based motherboard with a Gen 5 PCI-Express x16 slot (every other H610 board we've come across has Gen 4, to keep costs low). PCIe Gen 5 is allowed for the H610 platform. Another interesting bit is the M.2 E-key slot, so you can drop in a WLAN module. It's likely that this board will only be available in the Chinese market.

Silicon Power (SP) releases its newest UDIMM memory module with the latest, groundbreaking DDR5 technology. Read on to learn why it's time to ditch your DDR4 module and make the upgrade. Taking speed, capacity, and reliability even further, the cutting-edge technology of this DDR5 module gives that next-level edge for your system's performance. With aggressive speeds of 4800 MHz, it's 1.5x faster than standard 3200 MHz DDR4 to provide multi-core CPUs with extreme responsiveness and the power to multi-task seamlessly.

Even with all of its extra power, this DDR5 module improves upon its predecessor with on-module voltage regulation. A power management integrated circuit (PMIC) reduces the burden on the motherboard control and results in a lower voltage of 1.1 V versus 1.2 V for DDR4 for even less power consumption.

ASUS today announced the Pro Q670M-C-CSM business motherboard with support for 12th Gen Intel Core processors and DDR5 memory. The Pro Q670M-C-CSM joins the ASUS B660 and H610 models launched in January to deliver a full lineup for customers ranging from small-to-medium businesses to enterprise. These models are designed to deliver enhanced security, reliability, manageability, and serviceability that every company needs to build their IT systems. The board is equipped with anti-sulfur resistors, anti-moisture coating, and a stainless-steel rear I/O port to prevent internal corrosion and adhesion in order to prolong the board's life in humid environments.

Although Intel's upcoming 13th generation of desktop CPUs that goes under the code name of Raptor Lake, are expected to retain support for DDR4 memory, it has come to our attention that Intel will make a big push towards DDR5 when the platform launches later this year. Intel is apparently already asking motherboard makers to avoid using DDR4 in combination with the upcoming 700-series chipsets and the only reason for this would be to speed up the transition to DDR5. According to various leaks and rumors we should expect to see support for DDR5 at 5600 MHz for Raptor Lake, which is at least a step in the right direction.

What this doesn't mean, is that Intel has removed support for DDR4 in the CPUs, as it's still very much present and is expected to work fine in 600-series chipset motherboards. As such, there shouldn't be any issues upgrading to a new CPU, at least not after a quick UEFI update. From our understanding, it's partially related to the fact that DDR4 and DDR5 motherboards have quite different UEFI code when it comes to the memory support and in turn it means that the board makers are going to end up spending a lot more time getting their boards working, as is already the case with the 600-series chipsets. We can sort of understand Intel's sentiment here, but we're also expecting to see some motherboards based on the 700-series chipsets with DDR4 support, least not from the likes of ASRock that has always liked to create non-conforming motherboards. However, this also looks like it's the end for DDR4 support from Intel, which wasn't entirely unexpected.

Kingston FURY, the gaming division of Kingston Technology Company, Inc., a world leader in memory products and technology solutions, announces the release of Kingston FURY Impact DDR5 SODIMMs. Perfect for the gamer or PC enthusiast who want the latest cutting-edge performance from their laptop or small form factor machine.

Kingston FURY Impact DDR5 is fifty percent faster than DDR4 to provide a boost in gaming, rendering, and multitasking, while its low power consumption and increased efficiency keeps your system cool at 1.1 V. Available in Intel XMP 3.0 Certified SODIMM kit capacities up to 64 GB, Kingston FURY Impact DDR5 packs all the enhanced features of DDR5 into a slim, compact form factor. With innovative Plug N Play overclocking technology and on-die ECC, it automatically supports DDR5-4800 at lower latencies than standard DDR5-4800. Thus, improving system performance without having to enable a profile and maintains data integrity while hitting extreme speeds.

Having been developing its brand in the consumer market and creating high-quality gaming products for many years, TEAMGROUP continues to heavily invest in R&D and design, and is now utilizing its strong product development capabilities and foresight to invest in the NFT (non-fungible token) market. With the expansion of NFT applications, TEAMGROUP is launching innovative limited edition digital card content, providing consumers around the world the joy of card collecting, and bringing an all-new type of value to its digital content. TEAMGROUP invites everyone to join together for creative, next-gen thinking in the Metaverse, leading gamers to a new era of collectibles in consumer electronics.

According to statistics provided by blockchain analysis company, Chainalysis, up until December 15th, 2021, US$40.9 billion has been invested in the smart contracts of developing global NFT. TEAMGROUP announced today that it is entering the NFT market through the world's largest NFT trading platform, OpenSea, with the release of its first limited edition TEAMGROUP NFT card. The design team has meticulously crafted its digital content to be highly collectible and to give players an exciting collecting experience. The product is not only unique in the virtual world but also an important asset in the future Metaverse. From digital art creation to venturing into the creative blockchain market, TEAMGROUP forges brand new paths, showing its determination and strength in technological innovation.

Acer today updated its popular Swift line of notebooks with new models of the Swift 5 and Swift 3. To push the limits of what's possible with a thin and light device, these new laptops come with 12th Gen Intel Core processors, gorgeous touchscreen displays, and all-day battery life: everything a mobile professional needs.

"Designed for executives and mobile professionals, the latest Acer Swift 5 offers a perfect balance of performance and portability," said James Lin, General Manager, Notebooks, IT Products Business, Acer. "The Intel Evo-verified laptop not only provides a great experience, it is housed in a stylish thin-and-light CNC-machined unibody chassis featuring a gorgeous touchscreen display." "Intel and Acer have a long history of co-engineering to deliver amazing laptops," said Josh Newman, VP and GM of Client Computing Group Mobile Innovation. "Now, more than ever, our engineers are focused on the experiences that matter most with the Intel Evo platform, powered by 12th Gen Intel Core processors."

Today, Intel expands the 12th Gen Intel Core mobile processor lineup with the official launch of 12th Gen Intel Core P-series and U-series processors. Engineered for blazing performance and superior productivity, these 20 new mobile processors will power the next generation of thin-and-light laptops. The first devices will be available in March 2022, with more than 250 coming this year from Acer, Asus, Dell, Fujitsu, HP, Lenovo, LG, MSI, NEC, Samsung and others.

"Following our launch of the fastest mobile processor for gaming, we're now expanding our 12th Gen Intel Core processor family to deliver a massive leap forward in performance for thin-and-light laptops. From the ultra-thin form factors to enthusiast-grade performance in a sleek design, we're providing consumers and businesses with leadership performance and cutting-edge technologies."

Intel Xeon Scalable "Sapphire Rapids" is an upcoming enterprise processor with a CPU core count of up to 60. This core-count is achieved using four dies inter-connected using EMIB. Locuza, who leads social media with logic die annotation, posted one for "Sapphire Rapids," based on a high-resolution die-shot revealed by Intel in its ISSCC 2022 presentation.

Each of the four dies in "Sapphire Rapids" is a fully-fledged multi-core processor in its own right, complete with CPU cores, integrated northbridge, memory and PCIe interfaces, and other platform I/O. What brings four of these together is the use of five EMIB bridges per die. This allows CPU cores of a die to transparantly access the I/O and memory controlled any of the other dies transparently. Logically, "Sapphire Rapids" isn't unlike AMD "Naples," which uses IFOP (Infinity Fabric over package) to inter-connect four 8-core "Zeppelin" dies, but the effort here appears to be to minimize the latency arising from an on-package interconnect, toward a high-bandwidth, low-latency one that uses silicon bridges with high-density microscopic wiring between them (akin to an interposer).

AMD on Thursday unveiled its Ryzen 6000 series "Rembrandt" mobile processors. The company claims these chips offer generational increases in CPU performance, along with big leaps in energy-efficiency and integrated graphics performance. At the heart of these processors is the new 6 nm "Rembrandt" silicon that the company is building on the TSMC N6 silicon fabrication node that leverages EUV lithography.

The "Rembrandt" silicon broadly combines an 8-core/16-thread CPU based on the new Zen 3+ microarchitecture, a large new iGPU based on the RDNA2 graphics architecture, complete with real-time ray tracing support; a DDR5 + LPDDR5 memory controller, and a full PCI-Express Gen4 root-complex. The iGPU, memory interface, and PCIe interface are generational updates over the previous-gen "Cezanne," and it may seem like the CPU is largely unchanged, but AMD claims there are several optimizations that have gone into the CPU to earn the "+" tag.

Introducing the EVGA Z690 DARK K|NGP|N - The Motherboard Designed by and Used by Professional Overclockers. EVGA DARK motherboards blaze the trail for other boards to follow, and the Z690 DARK K|NGP|N is no exception. The ability to destroy world records is insignificant next to the power of a 21-phase VRM and a 10-layer PCB - capable of driving the most powerful 12th Gen Intel Core processors. With support for 64 GB of DDR5 memory at up to 6600 MHz+(OC), PCIe Gen5, and PCIe Gen4 M.2 NVMe SSDs, a new DARK age of overclocking will rise as quickly as new hardware becomes available. The Z690 DARK K|NGP|N is today's choice for the future of overclocking and gaming.