GIGABYTE TECHNOLOGY Co. Ltd, a leading manufacturer of motherboards, graphics cards, and hardware solutions, today revealed the supreme performance of XMP DDR5-8000 on Z790 AORUS XTREME and Z790 AORUS MASTER motherboards with Team Group gaming modules T-FORCE DELTA RGB DDR5 memory. Enhanced with the exclusive Low Latency and High Bandwidth technology, this achievement proves again that GIGABYTE motherboard is the ultimate choice to unleash memory performance, as well as the leading role of memory performance by the teamwork of GIGABYTE vs. Team Group.

It's always been challenging to constantly exceed the high-frequency record of memory, and stable motherboards and high-performance memories make a perfect team to accomplish this difficult task. To provide superior performance and user experience, GIGABYTE has been working closely with Team Group on the record-breaking performance from DDR5-7600, DDR-7800, to XMP DDR5 8000. The detailed memory information is listed in the memory support list of the motherboard, users can check on the site for the best performance matrix on the Z790 platform.

KLEVV, an emerging memory brand introduced by Essencore, unveils its latest DDR5 standard U-DIMM and SO-DIMM memory running at 5600MT/s. Designed to support both AMD's latest Ryzen 7000 series processors and AM5 platform as well as Intel's 13th Gen Raptor Lake processors and Z790 motherboards, featuring blisteringly fast speed with a highly efficient power to performance ratio.

To cater the growing demand for high-speed computing with a highly versatile product selection, KLEVV introduces a brand-new 5600 MT/s version to its DDR5 standard desktop and laptop memory lineup. Fully compliant with JEDEC standards, the new 5600MT/s DDR5 memory is the latest addition to KLEVV's DDR5 U-DIMM and SO-DIMM lineup with the pre-existing 4800 MT/s memory.

SMART Modular Technologies, Inc. ("SMART"), a division of SGH and a global leader in memory solutions, solid-state drives and hybrid storage products today announced the addition of new DDR5 16 GB and 32 GB Very Low Profile Error-Correction Code Unbuffered Dual In-Line Memory Modules (VLP ECC UDIMM) to its lineup of blade memory VLP module products.

SMART's new DuraMemory DDR5 VLP ECC UDIMMs are designed for 1U blade servers and blade enclosure systems used in networking, telecom, compute and storage applications that are optimized to minimize space and power. DDR5 VLP ECC UDIMMs are designed to meet height, density, power, and performance specifications needed to enable the next generation of memory applications.

G.SKILL International Enterprise Co., Ltd., the world's leading brand of performance overclock memory and PC components, is thrilled to showcase extreme memory bandwidth performance of high-frequency DDR5-8000 32 GB (16 GB x2) & DDR5-7800 32 GB (2x 16 GB) overclocked memory kits on the latest Intel Core i9-13900K Processor and ASUS ROG MAXIMUS Z790 APEX motherboard. Working in close partnership with the ASUS motherboard team, a single G.SKILL memory module was overclocked to a staggering DDR5-10000 under air cooling.

Dedicated to developing the fastest possible DDR5 memory on the latest 13th Gen Intel Core processor and Intel Z790 chipset, G.SKILL showcases the high memory bandwidth performance of DDR5-8000 32 GB (2x16GB) memory kit on the ASUS ROG MAXIMUS Z790 APEX motherboard. The following screenshots show the DDR5-8000 CL40 32 GB (2x16GB) and DDR5-7800 CL38 32 GB (2x 16 GB) memory kits validated on an Intel Core i9-13900K processor and ASUS ROG MAXIMUS Z790 APEX motherboard (BIOS 0702) platform, with the DDR5-8000 CL40 32 GB (2x16GB) memory kit reaching memory bandwidth read speed of over 124 GB/s and write speed of over 120 GB/s on the AIDA64 memory benchmark.

Intel just finalized the launch date of its 4th Gen Xeon Scalable "Sapphire Rapids" server processors. The company plans to launch them on January 10, 2023. The new processors will be launched at a special event dedicated to the company's various new Data Center (group) innovations, which cover server processors, new networking innovations, possible launches from Intel's ecosystem partners, and more.

A lot is riding on the success of "Sapphire Rapids," as they see the introduction of Intel's new high-performance CPU core on in the enterprise segment at core-counts of up to 60-core/120-thread per socket; along with cutting-edge new I/O that includes DDR5 memory, PCI-Express Gen 5, next-gen CXL, and on-package HBM memory on certain variants.

Micron Technology, Inc., announced today that it is shipping qualification samples of its 1β (1-beta) DRAM technology to select smartphone manufacturers and chipset partners and has achieved mass production readiness with the world's most advanced DRAM technology node. The company is debuting its next generation of process technology on its low-power double data rate 5X (LPDDR5X) mobile memory, delivering top speed grades of 8.5 gigabits (Gb) per second. The node delivers significant gains across performance, bit density and power efficiency that will have sweeping market benefits. Beyond mobile, 1β delivers the low-latency, low-power, high-performance DRAM that is essential to support highly responsive applications, real-time services, personalization and contextualization of experiences, from intelligent vehicles to data centers.

The world's most advanced DRAM process node, 1β represents an advancement of the company's market leadership cemented with the volume shipment of 1α (1-alpha) in 2021. The node delivers around a 15% power efficiency improvement and more than a 35% bit density improvement with a 16Gb per die capacity. "The launch of our 1-beta DRAM signals yet another leap forward for memory innovation, brought to life by our proprietary multi-patterning lithography in combination with leading-edge process technology and advanced materials capabilities," said Scott DeBoer, executive vice president of technology and products at Micron. "In delivering the world's most advanced DRAM technology with more bits per memory wafer than ever before, this node lays the foundation to usher in a new generation of data-rich, intelligent and energy-efficient technologies from the edge to the cloud."

GIGABYTE TECHNOLOGY Co. Ltd, a leading manufacturer of motherboards, graphics cards, and hardware solutions, today announced that Z790 AORUS TACHYON pushes the envelope of memory performance to XMP DDR5-8333 and DDR5-9300 O.C. with air cooling. On top of that, the phenomenal performance of XMP DDR5-8000 on Z790 AORUS XTREME and Z790 AORUS MASTER motherboards proves the enhancements from hardware to firmware including top-quality components, new generation Shielded Memory Routing design, and High Bandwidth of BIOS setting greatly improve memory stability and performance.

Enhanced by the new generation Shielded Memory Routing and low signal-loss PCB design, GIGABYTE Z790 AORUS TACHYON, Z790 AORUS XTREME, and Z790 AORUS MASTER can effectively reduce the internal and external signal loss or interference, which ensures blasting-fast DDR5 memory speed. In addition, the abundant BIOS setting of DDR5 Memory Upgrade and XMP 3.0 User Profile lead to the breakthrough performance of memories.

BIOSTAR, a leading manufacturer of motherboards, graphics cards, and storage devices, today announces the brand new Z790 VALKYRIE motherboard, built to run the all-powerful Intel 13th gen raptor-lake processors. Designed on the base of Intel Z790 single-chip architecture, the Z790 VALKYRIE is the latest addition to BIOSTAR's top-of-the-line flagship motherboard range.

Carrying the latest technology in a sleek, highly refined platform, the stylish design of VALKYRIE exhuberates the pinnacle of BIOSTAR product design and technical prowess. Enter any battle with confidence backed by the unwavering performance and reliability of BIOSTAR's latest Z790 VALKYRIE motherboard. Built to support the latest DDR5 memory, Z790 VALKYRIE holds 4 DIMMs of high-speed DDR 5 memory up to 128Gb with boosted clock speeds exceeding 7200+(OC) MHz.

Colorful Technology Company Limited, a professional manufacturer of graphics cards, motherboards, all-in-one gaming and multimedia solutions, and high-performance storage, announces the new Battle-AX memory kits with support for the latest Intel platform, available in DDR4 and DDR5 memory modules. COLORFUL also launches two new CN Series NVMe SSDs in PCIe Gen4 and PCIe Gen3 interfaces. The new memory and storage products aim to provide builders upgrading to the newer mainstream system platforms as well as older generation systems with DDR4 memory and PCIe Gen 3 M.2 SSD slots.

The COLORFUL Battle-AX DDR5 and DDR4 memory is perfect for mainstream users that plan to upgrade to the latest Intel platforms. The Battle-AX DDR5 memory sports a black heatspreader while the Battle-AX DDR4 sports a white heatspreader. The Battle-AX DDR5 memory is available in 8 GB and 16 GB modules and frequencies of DDR5-4800 and DDR5-5200. The Battle-AX DDR4 memory is also available in 8 GB and 16 GB modules and frequencies of DDR4-3200 and DDR4-3600. The Battle-AX DDR5 memory supports Intel XMP 3.0 for quick and easy memory overclocking via the BIOS. The COLORFUL Battle-AX Series memory is covered with 3-year warranty.

GIGABYTE TECHNOLOGY Co. Ltd, a leading manufacturer of motherboards, graphics cards, and hardware solutions, today revealed the phenomenal performance of XMP DDR5-7800 on Z790 AORUS XTREME and Z790 AORUS MASTER motherboards with Team Group gaming modules T-FORCE DELTA RGB DDR5 memory. Enhanced with the new generation Shielded Memory Routing design, exclusive BIOS setting, top-quality components, and advanced design from hardware to firmware on motherboards, this achievement of memory stability and performance proves again GIGABYTE's strong leading role in high-performance motherboards in the market.

When it comes to pushing the memory frequency to the limits, a stable platform with top-quality materials always plays a key role in addition to high-performance memories. Enhanced by the new generation Shielded Memory Routing and low signal-loss PCB design, Z790 AORUS XTREME and Z790 AORUS MASTER can effectively reduce the internal and external signal loss or interference, which ensures blasting-fast DDR5 memory speed. In addition, the abundant BIOS setting of DDR5 Memory Upgrade and XMP 3.0 User Profile lead to the breakthrough performance of XMP DDR5-7800 with T-FORCE DELTA RGB DDR5. The detailed memory information is listed in the memory support list of the motherboard, users can check on the site for the best performance matrix on the Z790 platform.

GIGABYTE TECHNOLOGY Co. Ltd, a leading manufacturer of motherboards, graphics cards, and hardware solutions, today announced the overclocking world record of Cinebench R23 56783 pts, verified by HWBOT and chalked up by the latest Z790 AORUS TACHYON with Core i9-13900K all-core O.C 7584 MHz and DDR5-8300 O.C. Instead of high-frequency on single core but fail to all benchmarks, Z790 AORUS TACHYON showcases the unbridled performance with all-core O.C. Designed by world-famous overclocker, GIGABYTE Z790 AORUS TACHYON packs overclocker-exclusive features with top-quality components to become the dreaming motherboard for overclockers, which delivers more user-friendly and stable O.C. operation along with unparalleled performance.

"We are very proud of this amazing O.C. world record of Cinebench R23 set by Z790 AORUS TACHYON, verified by HWBOT and proves GIGABYTE's strong R&D on overclocking. With optimal components, ultimate design, and friendly interfaces, Z790 AORUS TACHYON is the most formidable O.C motherboard in the market, and the best choice for refreshing overclocking world record." said Jackson Hsu, Director of the GIGABYTE Channel Solutions Product Development Division.

SK hynix Inc. reported today revenues of 10.98 trillion won, operating profit of 1.66 trillion won (with OP margin of 15%), and net income of 1.1 trillion won (with net income margin 10%) in the third quarter of 2022. Sales and operating profits decreased 20.5%, 60.5% respectively QoQ. SK hynix analyzed that revenues fell QoQ as both sales volume and price decreased due to sluggish demand for DRAM and NAND products amid worsening macroeconomic environment worldwide. In addition, SK hynix explained that despite the company improved cost competitiveness by increasing the sales proportion and yield of the latest 1anm DRAM and 176-layer 4D NAND, operating profit also decreased due to greater price drop than cost reduction.

SK hynix diagnosed that the semiconductor memory industry is facing an unprecedented deterioration in market conditions as uncertainties in the business environment continued. The deterioration occurred as the shipments of PCs and smartphone manufacturers, which are major buyers of memory chips, have decreased.

Elitegroup Computer Systems (ECS), the global leading motherboard, mini PC, notebook, mobile device, and smart solution provider, will exhibit at Infocomm SEA 2022, the Professional Audio Visual event in Southeast Asia at Bangkok, Thailand, Booth no. Z12 from Nov. 2 to 4 to showcase the latest LEET gaming series, the comprehensive LIVA Mini PC family and the All-in-One PC to apply for wide range of applications.

ECS will first launch the new LEET Gaming series, LEET Gaming Motherboard Z790H7-A and LEET Gaming Barebone PC B660 during Infocomm SEA 2022. To offer users exceptional PC performance, LEET Z790H7-A designs with the next-generation technology to support the latest Intel 12th & 13th Gen Processors for LGA 1700 socket, dual channel DDR5 RAM up to 128 GB, PCIe 5.0 slot, 2.5 Gb LAN and the latest wireless networking. Besides, LEET Gaming series also provides a gaming PC system, LEET B660, for user to build their own PC more easily. LEET B660 includes a B660H7-M20 Motherboard supported by the Intel 12th Gen Processor for LGA1700 socket, an NVIDIA GeForce RTX 30 series Graphic Card or AMD Radeon RX 6000 series Graphic Card and a power supply up to 650-watt into a 26-liter system case.

Intel Core i9-13900K processor has just been launched, and overclockers worldwide got their hand on a few samples to make history. According to the HWBot submission, a Swedish overclocker named "elmor" has pushed Intel's top-end consumer SKU to a fantastic 8.812 GHz. For more than eight years, the record for the single-highest overclocking speed was held by AMD FX-8370, from the now-bygone era of AMD Black Edition processors. The overclocking attempt was performed using liquid nitrogen (LN2) that cools the chip using its −195.8 °C temperature. Pushing core voltage to 1.850 Volts and VCCIN to 2 Volts, multiplier set to x88, and a bus speed of 100.15 MHz. In addition to the Core i9-13900K CPU, elmor used ASUS ROG Maximus Z790 APEX motherboard and 32 GB DDR5 GSKILL memory running at 4808 MT/s.

As a reminder, the FX-8370 CPU was holding the number one sport for eight years with a speed of 8.722 GHz. Beating the FX-8370 by just 90 MHz, it will be interesting to see if any of the upcoming CPU SKUs can match this overclocking record, and we are curious if any contender will come to beat elmor's current record.

ASUS today announced the availability of new Intel Z790 motherboards, including the ROG Maximus Z790 Apex, TUF Gaming Z790-PLUS WiFi and ProArt Z790-Creator WiFi - all of which provide DDR5 memory module support and PCIe 5.0 slots for video cards and storage.ASUS Z790 motherboards offer tremendous value to anyone assembling an Intel 13th Gen machine that includes AEMP II, AI Overclocking, AI Cooling II, PCIe 5.0 M.2 slots, Thunderbolt 4, WiFi 6E, Quick Charge 4+ technology and comprehensive connectivity. Overall, new ASUS Z790 motherboards are ideal solutions for any user who wants to build a next-gen machine or upgrade their existing system.

First up is the ROG Maximus Z790 Apex. The ultimate option for memory overclocking enthusiasts, this motherboard boasts a cutting-edge feature set. Then, for creative professionals of all kinds, ASUS offers the ProArt Z790-Creator WiFi. This motherboard offers premium connectivity and bespoke style, and it's fully ready for next-gen graphics cards and ultra-fast PCIe 5.0 storage. Finally, ASUS is bolstering its TUF Gaming lineup with the TUF Gaming Z790-Plus WiFi, which brings DDR5 support to the family.

Thermaltake, the leading PC DIY premium brand for Case, Power, Cooling, Gaming peripherals, and enthusiast Memory solutions, proudly announced that their air coolers, AIOs, and custom liquid-cooling parts, would be fully compatible with the upcoming 13th Gen Intel Core processors; that is to say, you can upgrade to the brand new 13th Gen Intel Core processors while keeping the cooler you're running at the moment.

Whichever Intel 13th Gen Core processor you choose for your new PC; Thermaltake's cooler can be suitable for your build and free of any compatibility issues when upgrading to your new CPUs. However, you may need extra mounting kits for certain models to transition to the LGA1700 platform; therefore, please contact your local Thermaltake representative office or resellers for more details. To release the full potential of the 13th Gen Intel Core processors, you can also go with Thermaltake's new series of ultra-fast DDR5 memory and utilize the new chips to their maximum.

BIOSTAR, a leading manufacturer of motherboards, graphics cards, and storage devices, today excited to announce the partnership with leading memory brand Team Group to release the all new T-FORCE DELTA RGB DDR5 VALKYRIE Edition desktop memory. The new T-FORCE DELTA RGB DDR5 VALKYRIE Edition desktop RAMs are the collaborative effort of two leading tech brands, Team Group and BIOSTAR. Carrying the legendary DNA of BIOSTAR's flagship VALKYRIE design language and T-FORCE DELTA RGB DDR5 desktop memory technology, the all new T-FORCE DELTA RGB DDR5 VALKYRIE Edition RAMs bring superior design, technology, and next-level engineering with jaw-dropping performance unparalleled in its class.

Its stealth fighter-influenced look features the signature wide-angled heatspreader with mesmerizing RGB lightning, unlike any other RAM on the market. Powered by a next-generation intelligent RGB control chip, it allows users full reign over limitless lighting customization using BIOSTAR's Advanced VIVID LED DJ software to create a highly personalized ambiance inside the system. Furthermore, the signature golden wings logo of BIOSTAR's VALKYRIE, together with T-FORCE's iconic wings logo, signify the Norse warriors' majestic wings and stands as a symbol of power and authority with its sleek streamlined design elements.

G.SKILL International Enterprise Co., Ltd., the world's leading brand of performance overclock memory and PC components, is excited to announce new extreme overclocked performance DDR5 DRAM specifications up to DDR5-7800 under the Trident Z5 family. Designed for use with the latest 13th Gen Intel Core desktop processor and Intel Z790 chipset platform, these new flagship specifications mark a new era of DDR5 performance.

Pushing the memory performance to the limits of the latest 13th Gen Intel Core desktop processor and Intel Z790 chipset platform, G.SKILL is announcing new DDR5 memory specifications up to a blazing speed of DDR5-7800 at CL38 with 32 GB (2x 16 GB) kit capacity, under the flagship Trident Z5 family. Refer to the screenshot below to see the DDR5-7800 memory kit validated on the Intel Core i9-13900K desktop processor and ASUS ROG Maximus Z790 Apex motherboard.

According to the latest TrendForce research, pandemic-induced materials shortages abated in the second half of this year and the supply and delivery of short-term materials has recovered significantly. However, assuming materials supply is secure and demand can be met, the annual growth rate of server shipments in 2023 is estimated to be only 3.7%, which is lower than 5.1% in 2022.

TrendForce indicates that this growth slowdown is due to three factors. First, once material mismatch issues had eased, buyers began adjusting previously placed purchase order overruns. Thus, ODM orders also decreased but this will not affect the 2022 shipment volume of whole servers for the time being. Second, due to the impact of rising inflation and weakness in the overall economy, corporate capital investment may trend more conservative and IT-related investment will emphasize flexibility, such as the replacement of certain server terminals with cloud services. Third, geopolitical changes will drive the continuing emergence of demand for small-scale data centers and previous construction of hyperscale data centers will slow. The recent ban on military/HPC servers issued by the U.S. Department of Commerce on October 7 has a very low market share in terms of its application category, so the impact on the overall server market is limited at present. However, if the scope of the ban is expanded further in the future, it will herald a more significant slowdown risk for China's server shipment momentum in 2023.

Verizon, the Network America relies on, together with Razer, the leading global lifestyle brand for gamers, today unveiled the Razer Edge 5G, the ultimate 5G handheld gaming device during the keynote address of RazerCon 2022. This groundbreaking collaboration will bring to market the world's first dedicated 5G handheld console—equipped with the world's most advanced display of any gaming handheld, powered by the latest Snapdragon G3xFort Gen 1 Gaming Platform, and running on Verizon 5G Ultra Wideband, the 5G network for gaming. It is specifically engineered to provide the best gaming performance while on the go.

"The core concept of every product we put out always boils down to one thing, our 'For Gamers. By Gamers.' motto," said Richard Hashim, Head of Razer's Mobile & Console Division. "With the Razer Edge, we've created the ultimate handheld gaming platform. Together with Verizon and Qualcomm, we designed the Razer Edge 5G to be a true gamer device, capable of supporting gamers' entire catalogs of AAA games or allowing them to stream endlessly online, taking their gaming experience on the go with low latency."

With the arrival of AMD's Ryzen 7000 series desktop processors based on the new Zen 4 architecture, the world's leading computer brand, GIGABYTE today announces its B650E and B650 motherboards ready to power these next-gen CPUs. Sporting the new AM5 socket, the AORUS B650E and B650 gaming motherboards are equipped with a direct digital power design and a full-covered cooling module to keep the circuitry cool. These AORUS motherboards come with PCIe 5.0 connectivity and support for DDR5 memory, which are AMD EXPO and Intel XMP capable of up to DDR5-6600 and beyond. The AORUS gaming motherboards are also equipped with the DIY-friendly PCIe and M.2 device fast installation and removal design, making future upgrades quick and easy.

Power delivery and thermal design have always been the top factors when it comes to CPU performance. To meet the needs of gamers looking for powerful yet stable system performance, the AORUS B650E and B650 gaming motherboards are designed with a maximum 16+2+2-phase twin digital power, covered by a massive heatsink that has four times more surface than the previous generation to ensure the smoothest power delivery even under loads. Other thermal designs, such as 8 mm mega-heatpipes and dedicated heatsinks on key components, greatly improves the system's stability and overall performance. With the friendly design of PCIe and M.2 EZ-Latch features on the AORUS B650 gaming motherboards, GIGABYTE makes components swapping a whole lot easier.

GIGABYTE TECHNOLOGY Co. Ltd, a leading manufacturer of motherboards, graphics cards, and hardware solutions, today revealed the breakthrough DDR5 performance of XMP DDR5-7600 and O.C. performance to DDR5-7950 under fan cooling on Z790 AORUS XTREME and MASTER motherboards with Team Group gaming modules T-FORCE DELTA RGB DDR5 7200 memory. Featuring Shielded Memory Routing of SMD memory DIMM, exclusive DDR5 overclocking BIOS setting, top-quality components, and enhanced design from hardware to firmware on motherboards, this performance proves GIGABYTE's strong leading role in product quality and performance.

To unleash the ultimate DDR5 performance, GIGABYTE Z790 AORUS XTREME and MASTER implement new generation Shielded Memory Routing design. By optimizing memory trace width, length, and style from HPC simulation to actual implementation, overall impedance is lowered between CPU memory controller and memory modules. Further with low signal-loss PCB, signal loss inside PCB and external interference are greatly reduced which can maintain high-speed DDR5 signal transmission to achieve higher DDR5 speed. In addition, the abundant BIOS setting of DDR5 Memory Upgrade and XMP 3.0 User Profile lead to the breakthrough performance of XMP DDR5-7600 and DDR5-7950 O.C. under fan cooling with T-FORCE DELTA RGB DDR5 7200 memory. The detailed memory information is listed in the memory support list of the motherboard.

Samsung Electronics Co., Ltd., a world leader in advanced semiconductor technology, today showcased a series of cutting-edge semiconductor solutions set to drive digital transformation through the decade, at Samsung Tech Day 2022. An annual conference since 2017, the event returned to in-person attendance at the Signia by Hilton San Jose hotel after three years.

This year's event, attended by more than 800 customers and partners, featured presentations from Samsung's Memory and System LSI business leaders—including Jung-bae Lee, President and Head of Memory Business; Yong-In Park, President and Head of System LSI Business; and Jaeheon Jeong, Executive Vice President and Head of Device Solutions (DS) Americas Office—on the company's latest advancements and its vision for the future.

BIOSTAR today introduced the Racing B650EGTQ, a Socket AM5 motherboard based on the AMD B650E chipset, in the Micro-ATX form-factor. The board offers a premium feature-set, including PCI-Express Gen 5 for both the x16 PEG slot, and the M.2 NVMe slot wired to the CPU. The board draws power from a combination of 24-pin ATX, and 8+4 pin EPS. It uses a 14-phase VRM with 90 A DrMOS to power the processor. The processor is wired to four DDR5 DIMM slots, a PCI-Express 5.0 x16, and two M.2 NVMe slots with PCI-Express 5.0 x4 wiring. Other expansion slots include a PCI-Express 4.0 x16 (electrical Gen 4 x4) wired to the B650E chipset.

Storage connectivity on the BIOSTAR Racing B650EGTQ includes two M.2 NVMe Gen 5, one M.2 NVMe Gen 4, and four SATA 6 Gbps ports. This is one of the very few motherboards to wire out both Gen 5 x4 GPP interfaces of the Socket AM5 SoC as M.2 NVMe slots. Network connectivity include a 2.5 GbE driven by a Realtek 8125B controller; and preparation for a WLAN card, although the board doesn't have any M.2 E-key slots. The onboard audio soludion features a premium Realtek ALC1220 CODEC. The company didn't reveal pricing.

GIGABYTE TECHNOLOGY Co. Ltd, a leading manufacturer of motherboards, graphics cards, and hardware solutions announced the latest AMD B650 motherboards based on the success of the X670 series. The comprehensive lineup includes AORUS, AERO, and GAMING series to provide more reasonable options with notable features for users. GIGABYTE select B650 motherboards adopt PCIe 5.0 / 4.0 x16 graphics interface and PCIe 5.0 / 4.0 M.2 slots with EZ-Latch technology, making it easier than ever for users to upgrade graphics cards and M.2 SSDs, avoiding accidental damage to the surrounding components. Further, up to 16+2+2 phase Twin Digital power, 105 Amps Smart Power Stage, and up to 12-layer PCB provide increased stability, optimal compatibility, and performance for AMD Ryzen 7000 series processors. With the advanced thermal design, VRM temperature is reduced, stabilizing the power and performance of the PCIe 5.0 slot and PCIe 4.0 M.2 SSD and avoiding performance drop due to thermal throttling. Meanwhile, the enhanced shielding design of SMD slots strengthens the reliability of signals and slot structure. In addition, select models take advantage of Active OC Tuner technology to deliver optimized performance with a more flexible and user-friendly experience.