TrendForce's latest investigations found that the enterprise SSD market experienced significant growth in 3Q24, driven by robust demand from AI-related applications. Prices surged as suppliers struggled to keep pace with market needs, pushing overall industry revenue up by an impressive 28.6% QoQ. Demand for high-capacity models was especially strong, fueled by the arrival of NVIDIA's H-series products and sustained orders for AI training servers. As a result, the total procurement volume for enterprise SSDs rose 15% compared to the previous quarter.

Looking ahead to 4Q24, TrendForce forecasts a slowdown in enterprise SSD revenue as procurement demand begins to cool. Total procurement volume is expected to dip, with the peak buying period behind and server OEM orders being slightly revised downward. As shipment volume declines, overall industry revenue is also projected to decrease in the fourth quarter.

TrendForce reports that the global notebook market in 2024 is projected to recover at a moderate pace, hindered by high interest rates and geopolitical uncertainties. Annual shipments are forecast to reach 174 million units, marking a 3.9% YoY increase. Looking ahead to 2025, reduced political uncertainty following the U.S. presidential election and the Federal Reserve's rate cuts in September 2024 are expected to stimulate capital flow. Combined with the end-of-service for Windows 10 and demand for commercial device upgrades, global notebook shipments are predicted to grow by 4.9% to 183 million units in 2025.

TrendForce notes that notebooks remain primarily productivity tools, with shipment growth driven largely by deferred replacement demand. The impact of AI-integrated notebooks on the overall market remains limited for now. However, AI features are expected to naturally integrate into notebook specifications as brands gradually incorporate them, resulting in a steady rise in the penetration rates of AI notebooks.

TrendForce's latest findings reveal that NAND Flash products have been impacted by weaker-than-expected seasonal demand in the second half of 2024, leading to a decline in wafer contract prices in Q3. This downward trend is projected to deepen, with prices expected to drop by more than 10% in Q4.

Enterprise SSDs are the only segment likely to see modest price growth—supported by stable order momentum—with contract prices forecast to rise by 0-5% in Q4. However, PC SSDs and UFS will see more cautious procurement strategies from buyers, as weaker-than-expected sales of end products drive buyers to adopt a conservative approach. As a result, TrendForce projects overall NAND Flash contract prices will decline by 3-8% in Q4.

TSMC announced that its revenue for September 2024 reached NT$251.87 billion (US$7.80 billion), representing a 39% increase compared to the same month last year. The cumulative revenue for the first three quarters of 2024 climbed to NT$2,025.85 billion (US$62.72 billion), showing a 32% year-over-year growth. The company's third-quarter revenue amounted to NT$759.7 billion (US$23.52 billion), exceeding TSMC's own guidance of NT$706.6 billion to NT$731.5 billion (US$22.4 billion to US$23.2 billion). TSMC will report full third-quarter earnings on Oct. 17.

A report from Data Center Dynamics quotes sources saying that, due to increasing demand from NVIDIA and others, TSMC has been forced to change its CoWoS capacity expansion plan several times. In response, TSMC is building two more fabs, named P4 and P5, in Kaohsiung, Taiwan, raising the company's total number of facilities in the region to five. Four months ago, the company announced that it would build a third 2 nm fab at Nanzih Technology Industrial Park in Kaohsiung. The company's P1 fab, which started in August 2022, is expected to begin mass production next year, while P2 and P3 are still in the construction phase. TSMC's CoWoS monthly capacity is expected to reach more than 40,000 wafers by the end of 2024, 65,000 wafers in 2025, and at least 80,000 wafers in 2026.

TrendForce's latest findings reveal that weaker consumer demand has persisted through 3Q24, leaving AI servers as the primary driver of memory demand. This dynamic, combined with HBM production displacing conventional DRAM capacity, has led suppliers to maintain a firm stance on contract price hikes.

Smartphone brands continue to remain cautious despite some server OEMs continuing to show purchasing momentum. Consequently, TrendForce forecasts that Q4 memory prices will see a significant slowdown in growth, with conventional DRAM expected to increase by only 0-5%. However, benefiting from the rising share of HBM, the average price of overall DRAM is projected to rise 8-13%—a marked deceleration compared to the previous quarter.

Even though the global economy shows signs of recovery, worldwide shipments of traditional PCs dipped 2.4% year-over-year (YoY) to 68.8 million units, during the third quarter of 2024 (3Q24), according to preliminary results from the International Data Corporation (IDC) Worldwide Quarterly Personal Computing Device Tracker. Factors including rising costs and inventory replenishment led to a surge in shipments in the previous quarter, resulting in a slightly slower sales cycle.

"Demand, without a doubt, has returned for PCs amongst consumers and commercial buyers," said Jitesh Ubrani, research manager with IDC's Worldwide Mobile Device Trackers. "However, much of the demand was still concentrated at the entry-level thanks to a recovering economy and the back-to-school season in North America. That said, newer AI PCs such as Copilot+ PCs from Qualcomm along with Intel and AMD's equivalent chips as well as Apple's expected M4-based Macs are expected to drive the premium segment in coming months."

A new forecast from the International Data Corporation (IDC) Worldwide Quarterly Personal Computing Device Tracker shows shipments of personal computing devices are expected to grow 2.6% year over year in 2024 to 398.9 million units. The traditional PC market will remain flat in 2024 with 261 million units shipped while the tablet market is forecast to grow 7.2% year over year as a refresh cycle and project investments are expected to drive the market.

For traditional PCs, the global market excluding China is expected to grow 2.8% in 2024 as China continues to suffer through a confluence of macroeconomic challenges, including high youth employment, deflation, and a tumultuous real estate market. However, China's economic concerns have largely impacted just the PC market as tablet demand has proven to be more resilient thanks to Huawei's efforts.

The demand for AI accelerators is going strong, and the world's largest semiconductor manufacturer, TSMC, has just confirmed that with its July 2024 revenue report. According to its latest July 2024 data, TSMC has reported a consolidated revenue of NT$256.95 billion, or about $7.94 billion at the time of writing. This represents a massive 23.6% jump from June 2024 and a 44.7% from July 2023, when revenue came in at NT$207.869 billion and NT$177.616 billion, respectively. For revenue throughout the year, measured from January to July, TSMC booked NT$1.523 trillion, or about $47 billion at the current rate. For this 7-month period, TSMC's revenue has increased by 30.5% Year-on-Year (YoY), showing great demand and an uptick in the company's production capabilities.

Of course, this is possible thanks to the massive demand driving AI chip sales from various startups and established giants like NVIDIA and AMD. Another vital customer for TSMC is Apple, which produces smartphone and Mac chips at Taiwanese facilities. The solid financial results from TSMC suggest that other fabless chip designers in its ecosystem may also experience positive outcomes in their earnings. It's worth noting that the semiconductor supply chain operates on a long-term planning basis, with arrangements made months in advance. As such, we can expect advanced silicon solutions to reach new customers in the coming months, further driving growth in the sector.

In a conversation with Intel's CEO Pat Gelsinger, industry analyst Patrick Moorhead revealed that Intel's Meteor Lake CPU platform suffers from some production issues. More specifically, Intel has been facing some yield and/or back-end production issues with its Meteor Lake platform, resulting in a negative impact on Intel's margins when producing the chip. The market is showing great demand for these chips, and Intel has been forced to run productions of "hot lots"-- batch production of silicon with the highest priority that gets moved to the front of the production line so they can get packaged as fast as possible. While this is a good sign that the demand is there, running hot lots increases production costs overall as some other wafers have to go back so Meteor Lake can pass.

The yield issues associated with Meteor Lake could be stemming from the only tile made by Intel in the MTL package: the compute tile made on the Intel 4 process. Intel 4 process is specific to Meteor Lake. No other Intel product uses it, not even the Xeon 6, which uses Intel 3, or any of the upcoming CPUs like Arrow Lake, which uses the Intel 20A node. So, Intel is doing multiple nodes for multiple generations of processors, further driving up costs as typical high-volume production with a single node for multiple processors yields lower costs. Additionally, the company is left with lots of "wafers to burn" with Intel 4 node, so even with Meteor Lake having yield issues, the production is ultimately fine, while the operating costs and margins take a hit.

Samsung Electronics today reported financial results for the second quarter ended June 30, 2024. The Company posted KRW 74.07 trillion in consolidated revenue and operating profit of KRW 10.44 trillion as favorable memory market conditions drove higher average sales price (ASP), while robust sales of OLED panels also contributed to the results.

Memory Market Continues To Recover; Solid Second Half Outlook Centered on Server Demand
The DS Division posted KRW 28.56 trillion in consolidated revenue and KRW 6.45 trillion in operating profit for the second quarter. Driven by strong demand for HBM as well as conventional DRAM and server SSDs, the memory market as a whole continued its recovery. This increased demand is a result of the continued AI investments by cloud service providers and growing demand for AI from businesses for their on-premise servers.

With the growing demand for high-speed computing, more effective cooling solutions for AI servers are gaining significant attention. TrendForce's latest report on AI servers reveals that NVIDIA is set to launch its next-generation Blackwell platform by the end of 2024. Major CSPs are expected to start building AI server data centers based on this new platform, potentially driving the penetration rate of liquid cooling solutions to 10%.

Air and liquid cooling systems to meet higher cooling demands
TrendForce reports that the NVIDIA Blackwell platform will officially launch in 2025, replacing the current Hopper platform and becoming the dominant solution for NVIDIA's high-end GPUs, accounting for nearly 83% of all high-end products. High-performance AI server models like the B200 and GB200 are designed for maximum efficiency, with individual GPUs consuming over 1,000 W. HGX models will house 8 GPUs each, while NVL models will support 36 or 72 GPUs per rack, significantly boosting the growth of the liquid cooling supply chain for AI servers.

TrendForce's latest industry report on AI servers reveals that high demand for advanced AI servers from major CSPs and brand clients is expected to continue in 2024. Meanwhile, TSMC, SK hynix, Samsung, and Micron's gradual production expansion has significantly eased shortages in 2Q24. Consequently, the lead time for NVIDIA's flagship H100 solution has decreased from the previous 40-50 weeks to less than 16 weeks.

TrendForce estimates that AI server shipments in the second quarter will increase by nearly 20% QoQ, and has revised the annual shipment forecast up to 1.67 million units—marking a 41.5% YoY growth.

In 2016, TSMC developed and named its InFO FOWLP technology, and applied it to the A10 processor used in the iPhone 7. TrendForce points out that since then, OSAT providers have been striving to develop FOWLP and FOPLP technologies to offer more cost-effective packaging solutions.

Starting in the second quarter, chip companies like AMD have actively engaged with TSMC and OSAT providers to explore the use of FOPLP technology for chip packaging and helping drive industry interest in FOPLP. TrendForce observes that there are three main models for introducing FOPLP packaging technology: Firstly, OSAT providers transitioning from traditional methods of consumer IC packaging to FOPLP. Secondly, foundries and OSAT providers packaging AI GPUs that are transitioning 2.5D packaging from wafer level to panel level. Thirdly, panel makers who are packaging consumer ICs.

TrendForce reports that while the enterprise sector continues to invest in server infrastructure—especially with the rising adoption of AI driving demand for enterprise SSDs—the consumer electronics market remains lackluster. This, combined with NAND suppliers aggressively ramping up production in the second half of the year, is expected to push the NAND Flash sufficiency ratio up to 2.3% in the third quarter, curbing the blended price hike to a modest 5-10%.

This year, NAND Flash prices saw a robust rebound as manufacturers kept production in check during the first half, helping them regain profitability. However, with a noticeable ramp-up in production and sluggish retail demand, wafer spot prices have dropped significantly. Some wafer prices are now over 20% below contract prices, casting doubts on the sustainability of future price hikes.

Corsair Gaming, Inc. (Nasdaq: CRSR) ("Corsair" or the "Company"), a leading global provider and innovator of high-performance products for gamers, streamers, content-creators, and gaming PC builders, today announced financial results for the first quarter ended March 31, 2024.

First Quarter 2024 Select Financial Metrics

• Net revenue was $337.3 million compared to $417.3 million in the fourth quarter of 2023 and $354.0 million in the first quarter of 2023. Gaming Components and Systems segment net revenue was $230.3 million compared to $280.5 million in the fourth quarter of 2023 and $265.0 million in the first quarter of 2023, while Gamer and Creator Peripherals segment net revenue was $107.0 million compared to $136.8 million in the fourth quarter of 2023 and $88.9 million in the first quarter of 2023.
• Net loss attributable to common shareholders was $12.5 million, or net loss of $0.12 per diluted share, compared to net income of $6.2 million, or net income of $0.06 per diluted share, in the fourth quarter of 2023 and a net loss of $1.1 million, or a net loss of $0.01 per diluted share, in the first quarter of 2023.
• Adjusted net income was $9.5 million, or net income of $0.09 per diluted share, compared to adjusted net income of $23.2 million, or net income of $0.22 per diluted share in the fourth quarter of 2023 and adjusted net income of $11.9 million, or net income of $0.11 per diluted share, in the first quarter of 2023.
• Adjusted EBITDA was $18.0 million, compared to $33.7 million in the fourth quarter of 2023, and $20.6 million in the first quarter of 2023.
• Cash and restricted cash was $130.2 million as of March 31, 2024.

North American customers are increasing their orders for storage products as energy efficiency becomes a key priority for AI inference servers. This, in turn, is driving up demand for QLC enterprise SSDs. Currently, only Solidigm and Samsung have certified QLC products, with Solidigm actively promoting its QLC products and standing to benefit the most from this surge in demand. TrendForce predicts shipments of QLC enterprise SSD bits to reach 30 exabytes in 2024—increasing fourfold in volume from 2023.

TrendForce identifies two main reasons for the increasing use of QLC SSDs in AI applications: the products' fast read speeds and TCO advantages. AI inference servers primarily perform read operations, which occur less frequently than the data writing required by AI training servers. In comparison to HDDs, QLC enterprise SSDs offer superior read speeds and have capacities that have expanded up to 64 TB.

NVIDIA's next-gen Blackwell platform, which includes B-series GPUs and integrates NVIDIA's own Grace Arm CPU in models such as the GB200, represents a significant development. TrendForce points out that the GB200 and its predecessor, the GH200, both feature a combined CPU+GPU solution, primarily equipped with the NVIDIA Grace CPU and H200 GPU. However, the GH200 accounted for only approximately 5% of NVIDIA's high-end GPU shipments. The supply chain has high expectations for the GB200, with projections suggesting that its shipments could exceed millions of units by 2025, potentially making up nearly 40 to 50% of NVIDIA's high-end GPU market.

Although NVIDIA plans to launch products such as the GB200 and B100 in the second half of this year, upstream wafer packaging will need to adopt more complex and high-precision CoWoS-L technology, making the validation and testing process time-consuming. Additionally, more time will be required to optimize the B-series for AI server systems in aspects such as network communication and cooling performance. It is anticipated that the GB200 and B100 products will not see significant production volumes until 4Q24 or 1Q25.

Ryan McCurdy, President of Lenovo North America, revealed ambitious forward-thinking product roadmap during an interview with CRN magazine. A hybrid strategic approach will create an anticipated AI fast lane on future hardware—McCurdy, a former Intel veteran, stated: "there will be a steady stream of product development to add (AI PC) hardware capabilities in a chicken-and-egg scenario for the OS and for the (independent software vendor) community to develop their latest AI capabilities on top of that hardware...So we are really paving the AI autobahn from a hardware perspective so that we can get the AI software cars to go faster on them." Lenovo—as expected—is jumping on the AI-on-device train, but it will be diversifying its range of AI server systems with new AMD and Intel-powered options. The company has reacted to recent Team Green AI GPU supply issues—alternative units are now in the picture: "with NVIDIA, I think there's obviously lead times associated with it, and there's some end customer identification, to make sure that the products are going to certain identified end customers. As we showcased at Tech World with NVIDIA on stage, AMD on stage, Intel on stage and Microsoft on stage, those industry partnerships are critical to not only how we operate on a tactical supply chain question but also on a strategic what's our value proposition."

McCurdy did not go into detail about upcoming Intel-based server equipment, but seemed excited about AMD's Instinct MI300X accelerator—Lenovo was (previously) announced as one of the early OEM takers of Team Red's latest CDNA 3.0 tech. CRN asked about the firm's outlook for upcoming MI300X-based inventory—McCurdy responded with: "I won't comment on an unreleased product, but the partnership I think illustrates the larger point, which is the industry is looking for a broad array of options. Obviously, when you have any sort of lead times, especially six-month, nine-month and 12-month lead times, there is interest in this incredible technology to be more broadly available. I think you could say in a very generic sense, demand is as high as we've ever seen for the product. And then it comes down to getting the infrastructure launched, getting testing done, and getting workloads validated, and all that work is underway. So I think there is a very hungry end customer-partner user base when it comes to alternatives and a more broad, diverse set of solutions."

Asetek reported fourth-quarter revenue of $16.6 million, an increase of 75% from the same period of 2022. Revenue for the year amounted to $76.3 million, an increase of 51% from 2022. The growth in both periods mainly reflects increased shipments of liquid cooling products. Gross margin was 47% in the fourth quarter and 45% for 2023, compared with 41% in each of the same periods of 2022. The gross margin increase reflects a richer product mix, reduced costs and favorable exchange rates for both periods.

"2023 represented a material rebound for our Liquid Cooling business and expansion of the SimSports product program to wide acclaim from the sim racing community. I'm proud of delivering our second-best year ever measured by revenue and profit, reflecting strong demand for our products," said André Sloth Eriksen the CEO of Asetek. "We remain confident of the long-term potential in our markets, but at the same time we continue to experience low near-term revenue visibility. However, we are adapting and have aligned our strategic priorities accordingly, and our focus in 2024 is to execute on these."

The NVIDIA H100 Tensor Core GPU was last year's hot item for HPC and AI industry segments—the largest purchasers were reported to have acquired up to 150,000 units each. Demand grew so much that lead times of 36 to 52 weeks became the norm for H100-based server equipment. The latest rumblings indicate that things have stabilized—so much so that some organizations are "offloading chips" as the supply crunch cools off. Apparently it is more cost-effective to rent AI processing sessions through cloud service providers (CSPs)—the big three being Amazon Web Services, Google Cloud, and Microsoft Azure.

According to a mid-February Seeking Alpha report, wait times for the NVIDIA H100 80 GB GPU model have been reduced down to around three to four months. The Information believes that some companies have already reduced their order counts, while others have hardware sitting around, completely unused. Maintenance complexity and costs are reportedly cited as a main factors in "offloading" unneeded equipment, and turning to renting server time from CSPs. Despite improved supply conditions, AI GPU demand is still growing—driven mainly by organizations dealing with LLM models. A prime example being Open AI—as pointed out by The Information—insider murmurings have Sam Altman & Co. seeking out alternative solutions and production avenues.

CableMod issued a statement—just before the last Christmas holiday—detailing a safety recall of 16-pin 12VHPWR angled adapters, version 1.0 and 1.1. This announcement received widespread media coverage (at least in tech circles), but some unfortunate customers have not yet received the memo about faulty adapters—CableMod's 90° angled and 180° hard connectors can overheat and in worst case scenarios, actually melt. HotHardware, amusingly named given this context, was the first hardware news outlet to notice that the Consumer Product Safety Commission (CPSC) had published a "GPU Angled Adapter" recall notice to its website earlier today, under "Recall number 24-112."

The US government body's listing outlines aforementioned hazardous conditions, along with an estimated 25,300 affected unit count. The CPSC's recommended "Remedy" advice is as follows: "Consumers should immediately stop using the recalled angled adapters and contact CableMod for instructions on how to safely remove their adapter from the GPU and for a full refund, including cost of shipping, or a $60 store credit for non-customized products, with free standard shipping. Consumers will be asked to destroy the adapter and upload a photo of the destroyed product to cablemod.com/adapterrecall/. The instructions on how to safely remove the adapter are also located on that site. Once destroyed, consumers should discard the adapter in accordance with local laws." The Safety Commission has gathered some customer feedback intelligence on this matter: "The firm (CableMod Ltd., of China) has received 272 reports of the adapters becoming loose, overheating and melting into the GPU, with at least $74,500 in property damage claims in the United States. No injuries have been reported."

TrendForce reports that 3Q23 has been a historic quarter for the world's leading IC design houses as total revenue soared 17.8% to reach a record-breaking US$44.7 billion. This remarkable growth is fueled by a robust season of stockpiling for smartphones and laptops, combined with a rapid acceleration in the shipment of generative AI chips and components. NVIDIA, capitalizing on the AI boom, emerged as the top performer in revenue and market share. Notably, analog IC supplier Cirrus Logic overtook US PMIC manufacturer MPS to snatch the tenth spot, driven by strong demand for smartphone stockpiling.

NVIDIA's revenue soared 45.7% to US$16.5 billion in the third quarter, bolstered by sustained demand for generative AI and LLMs. Its data center business—accounting for nearly 80% of its revenue—was a key driver in this exceptional growth.

TrendForce reports that consumer appetite for electronic products took a hit from high inflation, with global DRAM module sales in 2022 reaching US$17.3 billion—a 4.6% YoY decline. Revenue performance varied significantly among module makers due to the different domains they supply.

TrendForce's data indicated that the top five memory suppliers in 2022 accounted for 90% of total sales, with the top ten collectively capturing 96% of global market revenue. Kingston maintained its dominant market share of 78%. Even with a slight revenue dip, it held steadfast to its position as the global leader. Despite poor end-market demand, Kingston's robust brand scale, along with its comprehensive product supply chain, limited its revenue decline to a modest 5.3%, keeping it firmly at the top of market share rankings.

TrendForce research indicates that in 1H23, the utilization rate of 8-inch production capacity primarily benefited from sporadic inventory restocking orders for Driver ICs in the second quarter. Additionally, wafer foundries initiated pricing strategies to encourage clients into early orders, offering solid backup. However, in 2H23, persistent macroeconomic and inventory challenges led to the evaporation of an anticipated demand surge.

Meanwhile, stockpiles in automotive and industrial control segments grew after meeting initial shortages, tempering demand. Under fierce price competition from PMIC leader Texas Instruments (TI), inventory reductions for Fabless and other IDMs were drastically inhibited. With IDMs ushering in output from their new plants and pulling back outsourced orders, this compounded reductions to wafer foundries. This dynamic saw 8-inch production capacity utilization dipping to 50-60% in the second half of the year. Both Tier 1 and Tier 2/3 8-inch wafer foundries saw a more lackluster capacity utilization performance compared to the first half of the year.

TrendForce expects that memory suppliers will continue their strategy of scaling back production of both DRAM and NAND Flash in 2024, with the cutback being particularly pronounced in the financially struggling NAND Flash sector. Market demand visibility for consumer electronic is projected to remain uncertain in 1H24. Additionally, capital expenditure for general-purpose servers is expected to be weakened due to competition from AI servers. Considering the low baseline set in 2023 and the current low pricing for some memory products, TrendForce anticipates YoY bit demand growth rates for DRAM and NAND Flash to be 13% and 16%, respectively. Nonetheless, achieving effective inventory reduction and restoring supply-demand balance next year will largely hinge on suppliers' ability to exercise restraint in their production capacities. If managed effectively, this could open up an opportunity for a rebound in average memory prices.

PC: The annual growth rate for average DRAM capacity is projected at approximately 12.4%, driven mainly by Intel's new Meteor Lake CPUs coming into mass production in 2024. This platform's DDR5 and LPDDR5 exclusivity will likely make DDR5 the new mainstream, surpassing DDR4 in the latter half of 2024. The growth rate in PC client SSDs will not be as robust as that of PC DRAM, with just an estimated growth of 8-10%. As consumer behavior increasingly shifts toward cloud-based solutions, the demand for laptops with large storage capacities is decreasing. Even though 1 TB models are becoming more available, 512 GB remains the predominant storage option. Furthermore, memory suppliers are maintaining price stability by significantly reducing production. Should prices hit rock bottom and subsequently rebound, PC OEMs are expected to face elevated SSD costs. This, when combined with Windows increasing its licensing fees for storage capacities at and above 1 TB, is likely to put a damper on further growth in average storage capacities.