Infineon has announced that its gallium nitride (GaN) power semiconductor production is on schedule, confirming that its 300 mm wafer fab will deliver customer samples in Q4 2025. The German semiconductor manufacturer becomes the first company to successfully integrate 300 mm GaN wafer technology into its existing high-volume production infrastructure, achieving a 2.3x higher chip yield per wafer compared to conventional 200 mm processes. Infineon plans to capitalize on the projected annual market growth of 36%, with GaN power applications expected to reach $2.5 billion by 2030, according to an analysis by the Yole Group. The timing proves particularly strategic, as TSMC has announced plans to shut down its GaN production lines and dismantle facilities within two years, creating a significant market vacuum.

The new announcement addresses a fundamental industry challenge: scaling GaN production while maintaining cost competitiveness with silicon alternatives. Infineon's integrated device manufacturer (IDM) model provides complete process control from wafer fabrication through final product delivery, enabling what the company projects will be cost parity between comparable silicon and GaN devices. Johannes Schoiswohl, Head of GaN Business Line, emphasized that the scaled 300 mm manufacturing leverages Infineon's existing infrastructure investments while supporting rapid capacity expansion for emerging applications, including AI system power supplies, automotive charging systems, and industrial motor control. TSMC's strategic retreat from GaN manufacturing indicates that the company's focus remains on high-margin logic processors, leaving specialized power semiconductor companies like Infineon to dominate the expanding GaN market. In this market, GaN's superior power density, switching speeds, and thermal performance deliver measurable system-level advantages over traditional silicon-based solutions.

On July 1, 2025, UGREEN, a global leader in consumer electronics, introduced the Nexode Retractable Series to European markets, including Germany, the United Kingdom, France, Italy, and seven other countries across the continent.

The UGREEN Nexode Retractable Series is designed as a hassle-free travel power kit, addressing common charging pain points including cable clutter, slow charging speeds, forgotten charging cables, and durability concerns. Drawing on direct feedback from users, UGREEN has combined built-in retractable cables with fast-charging capabilities to offer a simpler and more efficient alternative to traditional chargers. Each retractable cable is engineered for long-term reliability, standing up to over 25,000 pull tests and 10,000 bend tests.

Infineon Technologies AG is revolutionizing the power delivery architecture required for future AI data centers. In collaboration with NVIDIA, Infineon is developing the next generation of power systems based on a new architecture with central power generation of 800 V high-voltage direct current (HVDC). The new system architecture significantly increases energy-efficient power distribution across the data center and allows power conversion directly at the AI chip (Graphic Processing Unit, GPU) within the server board. Infineon's expertise in power conversion solutions from grid to core based on all relevant semiconductor materials silicon (Si), silicon carbide (SiC) and gallium nitride (GaN) is accelerating the roadmap to a full scale HVDC architecture.

This revolutionary step paves the way for the implementation of advanced power delivery architectures in accelerated computing data centers and will further enhance reliability and efficiency. As AI data centers already are going beyond 100,000 individual GPUs, the need for more efficient power delivery is becoming increasingly important. AI data centers will require power outputs of one megawatt (MW) and more per IT rack before the end of the decade. Therefore, the HVDC architecture coupled with high-density multiphase solutions will set a new standard for the industry, driving the development of high-quality components and power distribution systems.

At Display Week 2025, Aledia, the leader in nanowire and 3D silicon-based microLED display technology, will showcase FlexiNOVA - a new product-ready platform built on its proprietary nanowire microLED technology and designed to scale production of next-gen displays. With its first industrial chip format now defined and available for sampling in 6 V and 9 V variants starting in H2 2025, FlexiNova empowers OEMs and display makers to integrate microLEDs into devices as diverse as smartwatches, automotive dashboards, luxury TVs and ultra-high-resolution monitors while maximizing power efficiency.

To bring microLED to mass production, performance alone isn't enough—industrial viability is key. Until now, microLEDs have mostly stayed in the lab due to high costs and manufacturing challenges for chips smaller than 30 µm. FlexiNOVA removes these barriers, making it easier for manufacturers to transition to microLED displays, which are brighter, more energy-efficient and have a longer battery life than OLED and LCD. What makes FlexiNOVA stand out is its flexibility: chip size, shape and power usage can be tailored to product needs without sacrificing performance.

TRENDnet, a global leader and award-winning provider of reliable networking, surveillance, transportation, and power solutions, is announcing today that it has launched PoE++ switches featuring GaN power technology. GaN (gallium-nitride) technology delivers power with increased efficiency with a smaller carbon footprint.

TRENDnet's first two network switches featuring GaN power technology are the 6-Port 2.5G GaN Power PoE++ Switch with 10G SFP+ Ports (TPE-BG5062), and the 9-Port 2.5G GaN Power PoE++ Switch with 10G SFP+ Port (TPE-BG5091). Both switches feature high-efficiency GaN internal power supplies, and deliver up to 95 watts of PoE power per port, ideal for power hungry PoE devices, such as advanced security cameras, high-power access points, digital signage, and access controls.

Belkin, a leading consumer electronics brand for over 40 years, today introduced a collection of innovative new products across its Mobile Power, Audio and Connectivity portfolios. Showcased at ShowStoppers at Mobile World Congress - the world's most influential technology showcase for media with a focus on mobile technology - these new additions highlight Belkin's commitment to design excellence, sustainability, and quality.

Belkin Sustainability
Belkin remains committed to its goal of 100% carbon neutrality in its offices and operations (scope 1 & 2) by 2025 with the goal of carbon neutrality across its entire business, including product-level (scope 3) emissions, by 2030. Two years after beginning its transition to using 72-75% post-consumer recycled (PCR) materials in its products, Belkin has transitioned over 359 products and has replaced 432 metric tons of virgin plastics with PCR materials.

Element Six (E6), a pioneer in the development of synthetic diamond advanced material solutions, will launch an innovative Cu-diamond product at Photonics West 2025. Cu-Diamond is a copper plated diamond composite material that has a high thermal and electrical conductivity. Designed to address the increasingly critical thermal management challenges in advanced semiconductor devices, this cost-effective solution enables greater performance and reliability for applications such as Artificial Intelligence (AI), high-performance computing (HPC), and GaN RF devices.

As semiconductor devices have grown larger and more powerful, managing heat dissipation has become a significant challenge for the industry. More than 50 percent of all electronic device failures are heat-related, and data centers, which today consume 3.7 percent of total U.S. power demand, are predicted to reach 10 percent by 2029. As a result, thermal management innovation is critical to enabling next-generation performance and energy efficiency.

During the International CES 2025, AUKEY unveiled six new charging products, led by the Comet Mix 7, a 300 W GaN charger. The compact device can power six devices simultaneously and features a real-time power output display, with its gallium nitride technology enabling faster charging and reduced heat generation. The company introduced two MagFusion wireless chargers for Apple device users. The MagFusion Titan, a 6-in-1 magnetic charging station, features a 180-degree adjustable stand and 15 W fast wireless charging for iPhones, Apple Watches, and AirPods. Its counterpart, the MagFusion 3-in-1 Pro, offers a simplified design with active cooling for optimal charging performance.

UGREEN introduced new products at CES 2024 including a high-wattage charger, and a Thunderbolt 5 dock. The company revealed its Nexode 500 W desktop charger, which can power six devices (about five average laptops) simultaneously. Its highest-capacity port delivers 240 W through USB Power Delivery 3.1, enough to charge demanding devices including e-bikes. The charger uses GaN technology to achieve its power output while maintaining a desktop-friendly size.

UGREEN, a leading innovator in consumer electronics, is due to showcase its latest innovations at CES 2025 under the theme of "Activate the Possibility of AI." The highlight of the event will be the unveiling of the highly anticipated NASync iDX6011 and NASync iDX6011 Pro devices, which are from the cutting-edge AI NAS lineup of the NASync series. Alongside these groundbreaking products, the Nexode 500 W 6-Port GaN Desktop Fast Charger and the Revodok Max 2131 Thunderbolt 5 Docking Station will also take center stage.

The NASync series AI NAS models are set to redefine expectations with integrated large language models (LLMs) for advanced natural language processing and AI-driven interactive capabilities. Powered by cutting-edge Intel Core Ultra Processors, the iDX6011 and iDX6011 Pro deliver unmatched performance, enabling seamless functionality and exceptional AI applications. These models build on the success of earlier NASync series products, such as the NASync DXP models, which garnered widespread attention and raised over $6.6 million during a Kickstarter campaign in March 2024.

At CES 2025, Lenovo unveiled a bold lineup of AI-powered business solutions designed to redefine the modern workplace. Highlights include the boldly redesigned Lenovo ThinkPad X9 Aura Editions, the innovative and unique ThinkBook Plus Gen 6 with rollable display, and the latest commercial desktops, including the high performance ThinkCentre M90a Pro Gen 6, and the groundbreaking ThinkCentre neo 50q QC powered by Snapdragon. Lenovo also introduces its next-generation ThinkVision P Series monitors and a comprehensive ecosystem of smart accessories, all engineered to elevate productivity and connectivity. Rounding out the announcements, Lenovo showcases cutting-edge proof-of-concept innovations that push the boundaries of technology, offering a glimpse into the future of intelligent, adaptable business solutions.

Lenovo Unveils ThinkPad X9 Series: Revolutionary Design Meets Pro-Level Performance
Lenovo introduces the ThinkPad X9 14 and X9 15 Aura Editions, its latest premium business laptops designed for innovative thinkers from prosumers to small and medium businesses to large corporations. These Copilot+ PCs powered by Intel Core Ultra processors are cutting-edge, AI-enhanced devices for creative professionals that combine powerful and efficient Intel and Windows 11 platforms, personalized AI-enabled experiences, in an all-new progressive design. ThinkPad X9 offers the ideal toolkit for today's hybrid users who demand high performance, proven reliability, and seamless productivity.

Belkin, a leading consumer electronics brand for 40 years, today introduced several new products across its Mobile Power, Audio and Future Ventures portfolios, underscoring Belkin design excellence, dedication to quality, and commitment to building products more responsibly. Belkin is showcasing its newly announced products at CES Unveiled Las Vegas - the official media event of CES 2025.

Built more responsibly with up to 90% recycled materials
Two years since introducing its transition to using 72-75% post-consumer recycled (PCR) materials in its products, Belkin has transitioned over 359 products and has replaced 432 metric tons of virgin plastics with PCR materials.

After announcing the world's first 300-millimeter gallium nitride (GaN) power wafer and opening the world's largest 200-millimeter silicon carbide (SiC) power fab in Kulim, Malaysia, Infineon Technologies AG has unveiled the next milestone in semiconductor manufacturing technology. Infineon has reached a breakthrough in handling and processing the thinnest silicon power wafers ever manufactured, with a thickness of only 20 micrometers and a diameter of 300 millimeters, in a high-scale semiconductor fab. The ultra-thin silicon wafers are only a quarter as thick as a human hair and half as thick as current state-of-the-art wafers of 40-60 micrometers.

"The world's thinnest silicon wafer is proof of our dedication to deliver outstanding customer value by pushing the technical boundaries of power semiconductor technology," said Jochen Hanebeck, CEO at Infineon Technologies. "Infineon's breakthrough in ultra-thin wafer technology marks a significant step forward in energy-efficient power solutions and helps us leverage the full potential of the global trends decarbonization and digitalization. With this technological masterpiece, we are solidifying our position as the industry's innovation leader by mastering all three relevant semiconductor materials: Si, SiC and GaN."

Belkin, a leading consumer electronics brand for 40 years, today announced the launch of its latest innovation, the Connect USB-C 11-in-1 Pro GaN Dock 150 W. Designed for businesses and professionals, this all-in-one docking station integrates Gallium Nitride (GaN) technology to create a compact yet powerful and efficient workstation solution.

With its sleek, space-saving design, the 11-in-1 Pro GaN Dock provides seamless connectivity, offering up to 150 W of power in a compact, clutter-free form. The dock features a wide array of ports, including support for up to three external displays, making it an ideal choice for professionals who demand multi-screen setups and fast data transfer speeds.

Infineon Technologies AG today announced that the company has succeeded in developing the world's first 300 mm power gallium nitride (GaN) wafer technology. Infineon is the first company in the world to master this groundbreaking technology in an existing and scalable high-volume manufacturing environment. The breakthrough will help substantially drive the market for GaN-based power semiconductors. Chip production on 300 mm wafers is technologically more advanced and significantly more efficient compared to 200 mm wafers, since the bigger wafer diameter offers 2.3 times more chips per wafer.

GaN-based power semiconductors find fast adoption in industrial, automotive, and consumer, computing & communication applications, including power supplies for AI systems, solar inverters, chargers and adapters, and motor-control systems. State-of-the art GaN manufacturing processes lead to improved device performance resulting in benefits in end customers' applications as it enables efficiency performance, smaller size, lighter weight, and lower overall cost. Furthermore, 300 mm manufacturing ensures superior customer supply stability through scalability.

Researchers at Fraunhofer IAF have made a significant advance in semiconductor materials by successfully fabricating aluminum yttrium nitride (AlYN) using metal-organic chemical vapor deposition (MOCVD). AlYN, known for its outstanding properties and compatibility with gallium nitride (GaN), shows great potential for energy-efficient, high-frequency electronics. Previously, AlYN could only be deposited via magnetron sputtering, but this new method opens the door to diverse applications. Dr. Stefano Leone from Fraunhofer IAF highlights AlYN's ability to enhance performance while reducing energy consumption, making it vital for future electronics.

In 2023, the team achieved a 600 nm thick AlYN layer with a record 30% yttrium concentration. They have since developed AlYN/GaN heterostructures with high structural quality and promising electrical properties, particularly for high-frequency applications. These structures demonstrate optimal two-dimensional electron gas (2DEG) properties and are highly suitable for high electron mobility transistors (HEMTs).

Cooler Master, a leading provider of PC components, gaming peripherals, and tech lifestyle solutions, has recently announced an expanded partnership with Infineon Technologies AG, a global semiconductor leader in power systems and IoT. This collaboration brings together Cooler Master's expertise in thermal and power design with Infineon's advanced semiconductor technology to introduce the X series high-wattage power supplies. These new power solutions, ranging from 850 W to 2000 W, are engineered to meet the growing demands of high-performance gaming, AI, and industrial applications.

"Cooler Master is thrilled to collaborate with Infineon, leveraging their cutting-edge semiconductor technology to enhance our power supply products," says Jimmy Sha, Cooler Master CEO. "This partnership underscores our commitment to delivering high-performance solutions to meet the evolving needs of our customers." Infineon Technologies is renowned for its cutting-edge power systems and semiconductor solutions, providing reliable and efficient components. This partnership is a significant leap forward in delivering efficient power and innovative thermal management to Cooler Master's power supply products.

While it was keen to show off its earlier released Live Gamer ULTRA 2.1 (GC553G2) USB and Live Gamer 4K 2.1 (GC575) PCIe HDMI 2.1 capture cards which have recently got a big firmware update, giving them 4K144 capture, support for 5.1 multi-channel audio, and support for Windows 11 Dynamic Lighting, AVerMedia had a lot of other new things to show at the Computex 2024 show, including the new Premium Go Series, which includes the world's first Capture Dock, the X'tra Go GC515, the Elite Go GC313Pro and Core Go GC313 GaN charger and capture device, new AVerMedia Streaming Center software, and a couple of NVIDIA Jetson Orin NX-based Box PCs for edge AI.

As said, the new AVerMedia Premium Go Series kicks off with the X'tra Go GC515, which is the world's first Capture Dock for various handheld devices. The Xtra Go GC515 does exactly what you think it does, and that is record 4K30 or 1080p120 footage from a handheld gaming device with just a simple click and without a computer. It is compatible with popular models like Nintendo Switch, Steam Deck, ROG Ally, and probably most other handheld consoles. Of course, since it does not require a PC, it records everything on a microSD card. The Premium Go Series also features GaN chargers with video capture capability, including the Elite Go GC313Pro, a 100 W charger with HDMI 4K60 output, USB-C 1080p60 capture, and an ability to charge multiple device. There is also the Core Go GC313 GaN charger and capture device, which allows users to display their video signal on a monitor at up to 4K60 via HDMI while the device is charging.

ASUS at the 2024 Computex showed off the latest revisions of its ROG Strix Platinum and ROG Thor Titanium III power supplies that pack a slew of cutting edge innovations for high-end gaming PCs. In their latest revisions, these PSUs meet the ATX 3.1 specification, and offer updated 12V-2x6 (H++) graphics card power connectors, but there's a key bit of innovation here.

Notice the purple 2-pin connector on the PSU? It is a set of sense pins that lead to the 12V-2x6 connectors, and lets the PSU get active feedback from the graphics card (rather than the motherboard) on how the voltage stability is, so it can actively hold the +12 V domain within a tight tolerance band. This mechanism lets the PSU observe voltage drops and spikes beyond the excursion tolerances of the ATX 3.1 spec. ASUS holds the patent for this innovation. Another major innovation with both these PSU lines is the use of modern GaN MOSFETs for improved switching efficiency, and compact dimensions, which vastly improves the layout of the PSU's mainboard, and serves up more room for heatsinks or airflow. ASUS is backing both these PSU lines with 10-year warranties.

ASUS today announced the ROG Ally X, its ambitious new handheld game console that's a step up from the ROG Ally that the company launched last year. The ROG Ally X is powered by the same AMD Ryzen Z1 Extreme processor as the ROG Ally, but with 50% more unified memory—now up to 24 GB of LPDDR5X-7500, which runs at an 18% higher speed than the 16 GB LPDDR5-6400 of the original. The designers also implemented an M.2-2280 NVMe SSD slot, which opens the console up to the widest possible selection of NVMe SSDs. The console includes a 1 TB drive, which is double that of the 500 GB that the ROG Ally comes with. The company has also significantly upgraded the thermal solution of the console with a larger fan, and better thermal venting, which offers 6°C lower gaming temperatures.

Perhaps the biggest feature upgrade is the battery, which is 80 Wh, a 100% increase from the 40 Wh of the original ROG Ally. This may not be a linear 100% increase in battery life from the ROG Ally (due to the various hardware upgrades), but should still pose significant improvements to it. Other hardware updates include USB4, which includes DisplayPort passthrough from the iGPU; besides a separate USB 3.2 Gen 2 type-C. The console supports USB-PD with 140 W fast-charging, and is paired with a first-party GaN-based 140 W fast-charger. Dimensions are similar to those of the ROG Ally, except for 4 mm added thickness, and 70 g added weight (608 g vs. 678 g). Available from July, the ROG Ally X is priced at $799, and includes a 3-month Xbox Game Pass. We went hands on with the console at ASUS's pre-Computex event. Stay tuned for several more announcements form the company in the coming days.

Acer today announced three new gaming monitors in its Predator lineup, designed to appeal to professional gamers and gaming enthusiasts who want reliable machines for everyday use. The new models include the Predator X27U F3, Predator X34 X5, and Predator X32 X3 featuring brilliant OLED displays, high refresh rates, and ultra-smooth performance.

These powerhouse monitors are NVIDIA G-SYNC Compatible to eliminate stuttering, flicker, and visual artifacts for a smooth and tear-free experience. The monitors also seamlessly integrate AMD FreeSync Premium Pro to eliminate ghosting, provide fluidity and ensure that every frame is rendered flawlessly. With true 10-bit color depth, they deliver cinematic visuals with stunning contrast and vibrant colors further enhanced by DCI-P3 99% color gamut and Delta E<1 color accuracy. In addition, VESA DisplayHDR True Black 400 ensures deep blacks and incredible brightness for lifelike visuals.

Vinpower, Inc., through a strategic alliance with Phihong Technology, are back in the lab improving on their multiple award winning and highly anticipated release of the iXCharger 65 W, which is a first of its kind compact combination external hard drive and battery charger for nearly every smartphone, tablet, and laptop computer. The upcoming enhanced iXCharger 140 W offers multiple upgrades including 140 W GaN power charger, two separate USB Type-C connections with PD Fast Charging capabilities, up to 2 TB of data storage capacity, and an enhanced Apple App for iOS iPhones and iPads. Yet, all iXCharger models will still offer the patented Trust Circle AES 256 KeyLock Data Protection technology to ensure the stored data is protected against unauthorized access or hackers.

United Microelectronics Corporation ("UMC"), a leading global semiconductor foundry, today announced the industry's first 3D IC solution for RFSOI technology. Available on UMC's 55 nm RFSOI platform, the stacked silicon technology reduces die size by more than 45% without any degradation of radio frequency (RF) performance, enabling customers to efficiently integrate more RF components to address the greater bandwidth requirements of 5G.

As mobile device manufacturers pack more frequency bands in newer generations of smartphones, the company's 3D IC solution for RFSOI addresses the challenge of integrating more RF front-end modules (RF-FEM) - critical components in devices to transmit and receive data - in a device by vertically stacking dies to reduce surface area. RFSOI is the foundry process used for RF chips such as low noise amplifiers, switches, and antenna tuners. Utilizing wafer-to-wafer bonding technology, UMC's 3D IC solution for RFSOI resolves the common issue of RF interference between stacked dies. The company has received multiple patents for this process, which is now ready for production.

Edifier International, the award-winning audio electronics designer, reveal the QR65 Desktop Active Monitor speakers - a new all-in-one unit that combines the brand's renowned acoustic technology with immersive Lumia light effects and TurboGaN fast-charging capabilities.

One of 4 Edifier products to win a prestigious Visual Grand Prix 2024 award and also highly recommended with a much sought after VGP 2024 Gold Medal Award, the QR65 is remarkably versatile, placing an emphasis on both compatibility and multi-use functionality. As the brand name develops, audio quality remains paramount with the QR65 featuring an advanced Acoustic Architecture. Equipped with 2.75" mid-low drivers, an aluminium alloy diaphragm and a long-throw design, the QR65 can produce consistently punchy bass frequencies whilst bolstering rich and full-bodied mids. Thanks to 1.25" silk diaphragm dome tweeters, finely tuned by Edifier's world-leading audio engineers, the speakers boast precision-tooled high frequency reproduction, creating crisp and bright trebles that stand out above even the most bass-laden of mixes.

OLED is the future of flat screen displays, as they provide superior color reproduction, dynamic range, response-times, and energy efficiency, over LCD. The latest crop of OLED panels powering notebooks and desktop monitors, however, have a problem that wasn't as prevalent with OLED-based televisions—burn-in. This is what happens when an OLED panel displays a static image for too long, causing regions of the panel to permanently discolor. Some PC monitor makers are jumping in to offer extended warranties against burn-in to their customers, as they realize that they just sold an expensive, exotic piece of technology that could potentially degrade within- or not long after their standard warranty periods. Scientists at the University of Cambridge think they have found a breakthrough solution against OLED burn-in.

Scientists discovered that the main culprit behind OLED burn-in is the blue diode. The blue LED has been an elusive technology that only came into existence several decades after green and red. It's only with the arrival of the blue LED that white could be made, turning LED into mankind's primary lighting source, and eventually the OLED panel. Blue is a relatively higher energy diode, and uses more exotic GaN substrate. The Cambridge scientists discovered that jacketing the blue diode alkylene straps would cut down burn-in, and make the manufacturing process more efficient. They have published their method in the Nature magazine. Unfortunately, it will be a while before display manufacturers take an interest in the new method, and re-tool their OLED production lines to incorporate it—we imagine at least a couple of years.