ASUS IoT, the global AIoT solution provider, today announced PE1100N, a unmatched, ultra-compact computer for AI inferencing at the edge, and based on the next-generation and world-leading NVIDIA Jetson Orin series. It features a fanless design for quiet operation, rich industrial connectivity for serious flexibility and supports a wide range of power inputs and operating temperatures for maximum versatility and durability.

With the powerful Jetson platform, featuring an efficient Arm processor and embedded NVIDIA GPU, PE1100N delivers energy-efficient computing with powerful AI-inferencing capabilities, making it ideal for diverse, scalable edge AI applications in smart city, transportation, manufacturing and more - including traffic analysis, people-tracking, counting and surveillance. Also, PE1100N's compact size and anti-vibration design make it especially ideal for smart manufacturing solutions, such as automated guided vehicle (AGVs), autonomous mobile robots (AMRs), AI-powered automated optical inspection (AOI) and robotics applications - accelerating time to market for AI applications.

ASRock Industrial is introducing new choices in industrial motherboards powered by 13th Gen Intel Core Processors (Raptor Lake-S) with up to 24 cores and 32 threads that boost computer-intensive edge performance. They come equipped with Intel W680, Q670, and H610 chipsets, and offer support for up to DDR5-5600 memory modules and PCIe Gen 5, allowing expanded possibilities and seamless integration within industry-specific applications.

By harnessing the power of the 13th Gen Intel Core Processors, they leap up to 1.04x/1.34x/1.25x faster in single-thread, multi-thread, and CPU image classification inference performance, respectively, compared to the preceding 12th Gen Intel Core processors. The new 13th Gen Intel CPU motherboards with DDR5 support, available in Mini-ITX, Micro-ATX, and ATX form factors, have been specifically designed to cater to the unique requirements of the Edge AIoT applications in commerce, automation, robot, entertainment, and security industries.

Metalenz, the world leader in metasurface optics, today announced it has partnered with leading semiconductor foundry United Microelectronics Corporation ("UMC") to release its direct supply chain to mass production and bring the unrivaled scale and precision of semiconductor manufacturing to the optics industry. The announcement marks the launch of metasurface optics on the open market for the first time and follows multiple design wins for Metalenz with leading OEMs in Asia.

"After initially designing meta-optics in partnership with one of the leading suppliers of 3D sensing solutions, we are now engaged with OEMs directly to bring the benefits of metasurface optics to their 3D sensing applications. By partnering with a world-class foundry like UMC, we gain the manufacturing capabilities, expertise, and global reach to serve customers interested in adopting our meta-optics technology," said Rob Devlin, Co-founder and CEO of Metalenz. "This will further accelerate our growth as we are becoming the leading provider of precision optics for 3D sensing solutions."

Broadcom Inc. today announced sample availability of its second generation of wireless connectivity chipset solutions for the Wi-Fi 7 ecosystem, spanning Wi-Fi routers, residential gateways, enterprise access points, and client devices. The new chips build on the ecosystem of products with Broadcom's first-generation Wi-Fi 7 chips while delivering additional functionality to a wider market.

The first chip, the BCM6765, is a highly-optimized residential access point chip that supports 320 MHz 2-stream Wi-Fi operation. This new platform system-on-chip (SoC) allows the productization of Wi-Fi 7 mass-market access points and smart repeater solutions which span the spectrum of cost, form factor, and performance. The second chip, the BCM47722, is an enterprise access point chip that also supports 320 MHz 2-stream operation along with dual IoT radios that support simultaneous operation for Bluetooth Low Energy (BLE), Zigbee, Thread, and Matter protocols. This SoC addresses the growing needs of Internet of things (IoT) applications in the enterprise Wi-Fi market. The third chip, the BCM4390, is a low-power Wi-Fi, Bluetooth, and 802.15.4 combo chip designed for use in mobile devices such as handsets and tablets. It supports 160 MHz 2-stream Wi-Fi operation, dual Bluetooth, and Zigbee, Thread, and Matter protocols to service a broad set of mobile markets.

TrendForce reports that inventory reduction in Q1 fell short of expectations and coincided with the industry's traditional off-season, leading to overall subdued demand. However, due to new product release and a surge in urgent orders for specialized specifications, Q1 revenue of the global top ten IC design houses remained on par with 4Q22, with a modest QoQ increase of 0.1% for a total revenue of US$33.86 billion. Changes in ranking included Cirrus Logic slipping from the top ten as well as the ninth and tenth positions being replaced by WillSemi and MPS, respectively. The rest of the rankings remained unchanged.

The smartphone supply continues to grapple with overstock, but AI applications are entering a period of rapid growth
Qualcomm witnessed an uptick in its revenue, largely attributed to the launch and subsequent shipments of its latest flagship chip, the Snapdragon 8Gen2. The company saw 6.1% in QoQ growth in its smartphone business, which effectively offset the downturn from its automotive and IoT sectors. As a result, Qualcomm's Q1 revenue increased marginally by 0.6%, cementing its position at the top of the pack with a market share of 23.5%.

To help bridge the growing gap between modern systems and the legacy technology still in use around the world, global industrial computing specialists, OnLogic (www.onlogic.com), have released the Helix 511 Edge Computer. Designed for use in manufacturing, automation, energy management, and other edge and IoT applications, the Helix 511 easily interfaces with on-site systems thanks to a broad selection of modern and legacy connectivity options.

"We frequently have conversations with customers who are struggling to update their technology infrastructure simply because they can't connect existing systems to newer, more powerful and more capable devices," says OnLogic Product Manager, Hunter Golden. "The embedded computing space has traditionally lagged behind when it comes to adopting new technologies. We want to shift that paradigm while still allowing innovators to access and exchange data with their existing equipment. In many cases, you don't need to rip and replace everything, you just need a Helix 511."

GlobalFoundries Inc., a global leader in feature-rich semiconductor manufacturing, and STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, announced today the conclusion of the agreement to create a new, jointly-operated, high-volume semiconductor manufacturing facility in Crolles (France), which was announced on 11 July 2022.

"I would like to thank Minister Le Maire, the French Minister of the Economy and Finance, and his team for their support and the dedication for the last 12+ months that have made celebrating today's milestone possible," said Dr. Thomas Caulfield, President and CEO of GlobalFoundries. "In partnership with ST in Crolles, we are further expanding GF's presence within Europe's dynamic technology ecosystem while benefiting from economies of scale to deliver additional capacity in a highly capital efficient manner. Together we will deliver GF's market leading FDX technology and ST's comprehensive technology roadmap, in alignment with customer demand which is expected to remain high for Automotive, IoT, and Mobile applications over the next decades."

ASUS today announced the availability of the ExpertWiFi EBM68 and EBR63, two routers designed to serve commercial needs ranging from small cafes to medium-sized businesses. The ASUS ExpertWiFi EBM68 is a tri-band AX7800 mesh system suited to mid-size businesses or spaces with multiple-stories such as a hotel or a retail store, and the ASUS ExpertWiFi EBR63 is a dual band AX3000 business router suited to cafes, small offices or home offices (SOHOs).

With the ExpertWiFi series, ASUS uniquely delivers Self-Defined Network (SDN) and a variety of other innovative features to the business router ecosystem, including customizable guest portals with user-friendly interface and guidance for simple and accessible settings. They also bring VLAN and VPN support for advanced protection of business information and data, streamlined network expansion options, space-saving designs and easy device management with the new ASUS ExpertWiFi app.

Samsung Electronics today announced the global launch of its full 2023 Smart Monitor lineup. The new M8, M7 and M5 Smart Monitors (Model Name: M80C, M70C, M50C) from Samsung enable users to tailor their monitors to their unique styles and needs, as they watch, play and work.

"We are raising the bar for Smart Monitors globally with our new lineup and especially our enhanced M8 model," said Hoon Chung, Executive Vice President of Visual Display Business at Samsung Electronics. "Within a single monitor, users can enjoy the best of entertainment and gaming, productivity, design and personalized convenience and comfort."

Global memory leader, Team Group, continues to develop and manufacture innovative, high-performance, and reliable industrial memory storage products, providing customers with convenient and flexible solutions. Today, it is releasing the brand new P845-M30 SSD, designed for the M.2 2230 form factor and PCIe Gen 4 interface. This compact, high-performance SSD is suitable for mini industrial PCs, handheld embedded applications, and AIoT-related tasks.

The P845-M30 comes with 112 layers of high-quality 3D NAND flash memory and uses page mapping technology to reduce its block P/E cycling frequency, extending its lifespan, and increasing its random access speeds. It is available in capacities ranging from 256 GB to 1 TB and measures only 30 mm in length. In addition, its support of the PCIe Gen 4 interface allows it to provide high-speed transfers with low power consumption. The P845-M30 can upgrade your device's performance without taking up space, making it the ideal SSD solution for mini industrial computers, which require a small form factor and large capacities.

Hackboard today announced the launch of Hackboard 2, an affordable single-board computer (SBC) about the size of a smartphone but with the power of a desktop computer and one of the lowest-priced Intel-powered and Windows-based single-board computers ever made. It's ideal for Makers and Hobbyists, IoT, Edge Computing, and Embedded Solutions with customizable Hackboards, contact Support@Hackboard.com for more info. Soon, Hackboard will ship Personal Computer Kits, ideal for work-from-home users, remote learners and the classroom.

The Hackboard 2 allows users to create their ideal computing environment at an affordable price, while taking advantage of the benefits of industry standard technology. With optional 4G or 5G modules, users can connect to the internet from almost anywhere. Users can plug the system into nearly any monitor with an HDMI input, including their TV.

Goldkey and IIoT technology manufacture company SECO have announced a strategic collaboration for the Asia-Pacific (APAC) region. The collaboration involves mutual specification of both companies' products, joint customer approach, and promotion of CLEA, the IoT-AI platform developed by SECO, towards existing and potential opportunities with Goldkey DRAM solutions under the auspices of SECO Microelectronics and Goldkey Technology Corporation. The Memorandum of Understanding (MoU) was signed at NürnbergMesse on 14th March 2023.

Complementing the company's expansion of DRAM development in the Industrials sector Vicky Tseng, CEO of Goldkey Technology Corporation states: "The collaboration underlines the symbiosis between both companies. SECO's innovations in IoT hardware which include cyber-security firmware and the AI software-platform address the need for all-encompassing least-complicated answers to modern IoT requirements," adding "SECO is indeed an industry forerunner in highly advanced IIoT technology, and together with Goldkey's industrial-DRAM portfolio, we are confident to providing comprehensive solutions to meeting unique requirements of customers in the region."

LattePanda launched the powerful and hackable single board server, the LattePanda Sigma. With its super computing power, this device opens up endless possibilities for tech enthusiasts, developers, small businesses & enterprises. With its innovative design and unique features, the LattePanda Sigma is poised to redefine the world of single board servers and drive innovation to new heights.

The LattePanda Sigma is powered by the 13th-generation Intel Core i5-1340P Rapter Lake (12-Core, 16-Thread) processor and features Intel Iris Xe Graphics, providing optimal graphics performance. Its optimized power consumption minimizes power usage by almost 50%, making it an eco-friendly choice. With 16 GB of high-speed Dual-Channel LPDDR5-6400 MHz RAM, the LattePanda Sigma can handle even the most demanding tasks with ease, making it perfect for graphic design, gaming, and video editing.

The global economy has faced increased inflation risks and downstream inventory corrections in 2H22, which have affected IC design houses faster than wafer foundries, as they are far more sensitive and responsive to market reversals. TrendForce reports that adverse factors such as weak overall consumption, restrictions from China, and the slowdown of corporate IT spending and CSP demand have impacted the revenue performance of the world's top 10 IC design houses in 4Q22, leading to a QoQ decline of 9.2%, or approximately US$33.96 billion.

TrendForce predicts that the revenue of these top 10 companies keep declining—though with a slight convergence—into 1Q23, owing to ongoing inventory corrections across the entire supply chain as well as Q1 being the traditional off-season for consumer demand. Demand will continue to be weak despite new product launches and inventory replenishment in the supply chain.

Following its successful demonstration of a MIPI camera solution using the UP Squared Pro 7000 at Embedded World, AAEON have announced a MIPI Expansion Kit for the newly released third generation board. Equipped with the Intel Atom Processors x7000E Series, Intel Core i3-N305 Processor and Intel Processor N Series (formerly Alder Lake-N) and an FPC port supporting MIPI-CSI interface, the UP Squared Pro 7000 emphasizes AAEON's continued dedication to bringing the latest Intel technologies to a wider variety of platforms. One such platform is the LI-ADL-ADP-IMX415-MIPI-081H, a 4K MIPI Camera Module from leading intelligent embedded camera creator, Leopard Imaging Inc.

The company recently announced that the camera has been designed with full-function drivers to support the Intel Atom Processors x7000E Series, Intel Core i3-N305 Processor, and Intel Processor N Series (formerly Alder Lake-N), allowing users to take advantage of the peripheral Intel technologies that come with the processor platform, such as Intel UHD Graphics on a Windows 10 IoT Enterprise OS.

Samsung Electronics, a world leader in advanced semiconductor technology, today announced its first ultra-wideband (UWB) chipset, the Exynos Connect U100. With single-digit centimeter accuracy, the new UWB solution is optimized for use in mobile, automotive and Internet of Things (IoT) devices, offering precise distance and location information. Samsung also unveiled 'Exynos Connect', a new brand that consolidates its short-range wireless communication solutions, such as UWB, Bluetooth and Wi-Fi that are essential in facilitating an increasingly hyper-connected world.

"Our Exynos Connect U100 combines sophisticated ranging and positioning capabilities with strong security to enable hyper-connectivity between people and everyday objects, fueling a range of new applications in positioning and location tracking," said Joonsuk Kim, Executive Vice President of the Connectivity Development Team at Samsung Electronics. "Building on our technology leadership in communications technologies, we are committed to driving innovation in short-range communication solutions to transform the way we connect and relate to the world around us."

Intel has quietly canceled its Thunder Bay hybrid system-on-chip (SoC) that combines standard general-purpose CPU Cores and Movidius Vision Processing Unit (VPU) cores. Such chips were aimed at commercial and Internet-of-Things (IoT) applications that relied on computer vision acceleration and edge-computing applications. According to the latest report, it appears that Thunder Bay is canceled as Intel has released a set of patches that removed the Thunder Bay code from the Linux kernel.

Intel kept Thunder bay details well hidden and while earlier rumors pointed to a combination of Intel Xeon x86 CPU cores and Movidius VPU cores, the only Thunder Bay support in Linux patches where showing a combination of ARM Cortex-A53 low-power cores with the Movidius VPU. Intel acquired Movidius back in 2016 and while it is not something that Intel talks about often, there are several products based on Movidius VPUs, including Neural Compute Stick, Intel drones, the Intel RealSense Tracking Camera, and most recently, the Intel Movidius 3700VC VPU, formerly Keem Bay. In any case, it appears that Intel is abandoning an idea of combining general purpose x86 CPU cores and Movidius VPU cores.

Qualcomm Technologies, Inc. today announced the world's first integrated 5G IoT processors that are designed to support four major operating systems, in addition to two new robotics platforms, and an accelerator program for IoT ecosystem partners. These new innovations will empower manufacturers participating in the rapidly expanding world of devices at the connected intelligent edge.

The need for connected, intelligent, and autonomous devices is growing rapidly, and it is expected to hit $116 billion by 2030 according to Precedence Research. Businesses attempting to compete in this fast-moving economy need a reliable source of control and connectivity technology for their IoT and robotic devices. Qualcomm Technologies, which has shipped over 350 million dedicated IoT chipsets, is uniquely capable of providing manufacturers with the platforms needed to address this expanding segment.

DFI, the global provider of industrial computers, has introduced its ECX700-AL ruggedized x86 PC for outdoor edge computing applications. Its impeccable performance capabilities, compact size, and high durability make it the ideal solution for outdoor operations. The ECX700-AL is a rugged computer with a waterproof and dust-proof design to withstand harsh environments and any type of climate. Stable performance is ensured with its wide operating temperature of -40 to 70 degrees Celsius. It is also equipped with a smart vent that drains water automatically, preventing typical problems such as condensation within the system or excessive heat.

An external SIM slot provides convenience for users when changing SIM cards, and the high-gain antenna delivers a high-quality signal. Versatile I/O settings including a combo port that supports 2 CANs and 2 COMs as well as selective display ports (HDMI/VGA) help integrators meet demands for various applications.

MediaTek, a fabless semiconductor company powering two billion devices a year, and Kontron, a leading global provider of IoT and Embedded Computer Technology (ECT), today announced that Kontron is integrating MediaTek's Genio 1200 and Genio 700 chipsets into its new modules for IoT applications.

MediaTek Genio is a complete platform stack for IoT, offering brands powerful and efficient chipsets, open platform software development kits (SDK), and a developer portal with comprehensive resources and tools. Genio chipsets are ideal for a wide variety of commercial, industrial, and retail applications that require highly responsive processing, advanced multimedia support, and multi-tasking.

Kontron, a leading global provider of IoT/Embedded Computer Technology (ECT), will present an Mini-ITX motherboard based on Intel Core i3 processors as well as Intel N-series processors with latest UHD Gen12 graphics at embedded world 2023, thus expanding its product family of compact, power-saving motherboards "Designed and Made in Germany." The K3931-N Mini-ITX is available in four variants with different CPUs and is particularly suitable for use in the areas of casino gaming, digital signage, kiosk, POS/POI, ticketing as well as for applications in industrial and medical technology.

The Intel Core i3 and Intel N series processors set new standards for x86 processors in the power range from 6 W to 15 W. They use the same Efficient-cores and Intel UHD graphics as the 12th Gen Intel Core processors based on the Xe architecture. This makes it easier to port applications and solutions across Intel CPU performance and power ranges. Support for Intel AVX2 and Intel Deep Learning Boost - combined with up to 32 execution units - provides accelerated deep learning inference and media processing for diverse edge applications.

Phison Electronics, a global leader in NAND flash and storage solutions, announced today the launch of IMAGIN+, an upgraded platform offering R&D resource sharing and ASIC (Application-Specific Integrated Circuit) design services for NAND flash controllers, storage solutions, PMIC, and Redrivers/Retimers. The introduction of IMAGIN+ comes during the Embedded World Exhibition & Conference (March 14-16) in Nuremberg, a premier global event for the embedded community.

Phison's rejuvenated platform, bolstered by more than two decades of research and development expertise, empowers global partners and customers to create not just ASIC chips and NAND flash storage solutions but also to participate in the growth of a thriving ecosystem of emerging technologies. Phison understands that success in today's fast-paced market requires more than just providing NAND storage solutions; it requires the ability to influence and shape the industry through signal integrity and power management ICs, Compute Express Link and other value-added offerings.

BIOSTAR, a leading manufacturer of motherboards, graphics cards, and storage devices today, is showcasing its latest lineup of Intel 12th / Elkhart Lake motherboards and Barebone systems at the Embedded World 2023 exhibition, currently underway from March 14th to 16th in Nuremberg, Germany. As the largest international trade fair for embedded systems, the exhibition attracts professionals and enthusiasts from various industries worldwide. BIOSTAR's product lineup includes six industrial motherboards - BIH11-AHB, EIB7B-AXI, BIH61-IHP, BIH60-IHP, BICMA-IHP, and BIELK-IHT - equipped with advanced features such as high-performance processing, support for multiple displays, and various connectivity options. These motherboards are ideal for applications in digital signage, medical, transportation, and other industries.

In addition to the motherboards, BIOSTAR is also showcasing six barebone systems, including the MP-J4125, MP-J6412, MT-J6412, MT-J6412 PRO, MS-J6412, and MS-N3160. These systems offer powerful performance, efficient energy consumption, and compact design, making them suitable for home entertainment, office productivity, AI, edge computing, and many more versatile applications.

ASUS IoT, the global AIoT solution provider, today announced PE6000G - the industry's first edge AI system that supports up to a 450 W GPU for high-throughput, demanding GPU-computing applications. Powered by a 12th Gen Intel Core processor and paired with the Intel R680E chipset, PE6000G supports up to 450 W graphics card power and is ready for the latest PCI Express (PCIe ) 5.0 standard, meeting requirements for enabling real-time AI inference at the edge.

Demand for high-performance GPU-accelerated solutions at the edge is increasing to satisfy mission-critical AI applications. Users who require rugged and durable systems to withstand shocks and vibration, plus wide-range operating temperatures to accommodate high GPU computing power, face the dilemma of finding solutions that provide the necessary specifications to meet physical space constraints, along with heat dissipation and power consumption within a rugged mechanical design. The all-new PE6000G series strikes a balance between all these needs for deployment in a variety of challenging environments.

NFC-based sensing controllers with energy-harvesting capabilities are critical for the development of passive smart devices that can operate with high accuracy, efficiency, and design convenience in a wide range of IoT applications. With the NGC1081, Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) expands its product portfolio of NFC tag-side controllers. The new IC is a single-chip solution that enables the IoT industry to develop low-cost, miniaturized, smart edge computing/sensing devices, maximizing the benefits for both end-users and manufacturers. Such devices can be controlled and powered by mobile phones, with potential applications ranging from medical patches and disposable point-of-case testers to data loggers, smart thermostats, and sensor inlays.

The tag-side controller supports a dual power supply function, allowing it to operate in a passive mode (battery-free) based on energy harvesting, or in a battery-powered mode, operating as a self-contained sensing node via a 3 to 3.3 V external power supply. In passive mode, the entire sensing system, including the IC and its connected sensors, can draw power via energy harvesting from the NFC field of a mobile phone. Together with its naturally galvanically isolated sensing interface, these features open up countless possibilities for creating many innovative sensing use cases that require no batteries and minimal maintenance. This is particularly useful for applications where the power supply needs to be galvanically isolated to meet the safety requirement.