NVIDIA today expanded the NVIDIA Jetson lineup with the launch of new Jetson Orin Nano system-on-modules that deliver up to 80x the performance over the prior generation, setting a new standard for entry-level edge AI and robotics. For the first time, the NVIDIA Jetson family spans six Orin-based production modules to support a full range of edge AI and robotics applications. This includes the Orin Nano—which delivers up to 40 trillion operations per second (TOPS) of AI performance in the smallest Jetson form factor—up to the AGX Orin, delivering 275 TOPS for advanced autonomous machines.

Jetson Orin features an NVIDIA Ampere architecture GPU, Arm-based CPUs, next-generation deep learning and vision accelerators, high-speed interfaces, fast memory bandwidth and multimodal sensor support. This performance and versatility empower more customers to commercialize products that once seemed impossible, from engineers deploying edge AI applications to Robotics Operating System (ROS) developers building next-generation intelligent machines.

ASUS IoT, a global AIoT solution provider, today announced a partnership agreement with Canonical to provide pre-installed and certified versions of the Ubuntu Linux operating system for embedded boards and systems in diverse edge computing applications. New ASUS IoT devices such as the PE100A will be guaranteed by Canonical for optimized performance with Ubuntu Linux, in the interest of improving development time, configuration and installation.

This collaboration between ASUS IoT and Canonical ensures that individual hardware I/O functions conform to industrial-grade standards and to the version of Ubuntu running on the device. Moreover, it provides up to 10 years of Linux security (with five years of bundled ESM service) along with updated capabilities for users in industrial manufacturing, smart retail, smart transportation, surveillance and many other application sectors.

According to the latest TrendForce statistics, revenue of the top ten global IC design houses reached US$39.56 billion in 2Q22, growing 32% YoY. Growth was primarily driven by demand for data centers, networking, IoT, and high-end product portfolios. AMD achieved synergy through mergers and acquisitions. In addition to climbing to third place, the company also posted the highest annual revenue growth rate in 2Q22 at 70%.

Qualcomm continues in the No. 1 position worldwide, exhibiting growth in the mobile phone, RF front-end, automotive, and IoT sectors. Sales of mid/low-end mobile phone APs were weak but demand for high-end mobile phone APs was relatively stable. Company revenue reached US$9.38 billion, or 45% growth YoY. NVIDIA benefitted from expanded application of GPUs in data centers to expand this product category's revenue share past the 50% mark to 53.5%, making up for the 13% YoY slump in its game application business, bringing total revenue to US$7.09 billion, though annual growth rate slowed to 21%. AMD reorganized its business after the addition of Xilinx and Pensando. The company's embedded division revenue increased by 2,228% YoY. In addition, its data center department also made a considerable contribution. AMD posted revenue of US$6.55 billion, achieving 70% growth YoY, highest amongst the top ten. Broadcom's sales performance in semiconductor solutions remained solid and demand for cloud services, data centers, and networking is quite strong. The company's purchase order backlog is still increasing with 2Q22 revenue reaching US$6.49 billion, an annual growth rate of 31%.

Robustel strengthen their industry leading portfolio of Industrial IoT routers and gateways with a brand-new series of cost competitive, fully integrated EDGE Computing gateways. With a deep, well-established product range specialising in industrial IoT/M2M solutions, Robustel are always looking for new and innovative ways to service customers in key industrial verticals. Since the company's founding in 2010 the key directive has been to listen and engage with the market to provide solutions that meet real world requirements and a competitive price point allowing for the scale and potential of massive IoT.

With the release of Robustel's first generation 5G Industrial Gateway the R5020 in 2020, the company has seen a massive global trend in customers relying on Cloud IoT infrastructure to deliver a variety of IoT solutions across all verticals; However, there is a growing subsector of customers with demand for more processing being performed at the network edge, to avoid unnecessary network noise and congestion from high volumes of data being streamed over the cellular network.

Intel has announced the availability of its 12th Gen Intel Core SoC processors for IoT Edge. Representing a new lineup of purpose-built edge products optimized for Internet of Things (IoT) applications, this first-of-its-kind socketed system-on-chip (SoC) delivers high performance integrated graphics and media processing for visual compute workloads, a compact footprint to enable smaller innovative form factor designs, and a wide operating thermal design power (TDP) that enables fanless designs and helps customers achieve product sustainability goals.

"As the digitization of business processes continues to accelerate—fueled by workforce demand, supply chain constraints and changing consumer behavior—the amount of data created at the edge and the need for it to be processed and analyzed locally continues to explode. Intel understands the challenges that businesses face—across a wide range of vertical industries—and is committed to help them continue to deliver innovative use cases," said Jeni Panhorst, Intel vice president and general manager of the Network and Edge Compute Division.

Dedicated to innovation in embedded board computing, AAEON are delighted to announce an impressive breakthrough in its ATX motherboard range with the release of the new ATX-Q670A, AAEON's first ATX board with DDR5 support. With this innovation, the ATX-Q670A can provide customers with an unprecedented 50% increase in bandwidth and also a decrease in power consumption compared to prior generations. Particularly suited to IoT applications, the ATX-Q670A also combines the greatest maximum SATA performance with the very fastest SSD to give customer applications access to higher I/O speeds.

The ATX-Q670A is not just faster, but also far more expansive and accommodating to higher-performance modules, offering two PCIe [x16] slots alongside both a PCIe [x4] and PCIe [x1] slot, in addition to a further three PCI slots. Such specifications, alongside the ATX-Q670A's dual graphic card support mean that it can facilitate everything from video capture to AI calculation for vision-based applications, with four independent 4K@60 Hz resolution display capabilities to complete the package.

KIOXIA America, Inc. today announced that it has begun sampling the latest generation of its JEDEC e-MMC Ver. 5.1-compliant embedded flash memory products for consumer applications. The new products are available in capacities of 64 and 128 gigabytes (GB) and integrate the company's BiCS FLASH 3D flash memory and a controller in a single package.

Demand for mid-range capacities in consumer products such as tablets and IoT devices continues to grow, and though the market continues to shift to UFS, there are cases where e-MMC may still be used. The new KIOXIA e-MMC devices expand the available options. A leading provider of flash memory and storage for consumer applications and mobile devices, KIOXIA has been supporting e-MMC since 2007 and was the first supplier to introduce the higher performance follow-on solution to e-MMC, UFS, in early 2013. Today, the broad KIOXIA lineup of e-MMC and UFS solutions provides support across a wide range of densities (4 GB-1 TB).

Network security is of paramount importance in the energy, oil and gas industries, which is why AAEON, a leading manufacturer of industrial IoT and AI Edge solutions, has introduced the ICS-6280, its latest Industrial-Grade Network Appliance. Powered by the Intel Atom x6000E series processors (formerly Elkhart Lake), the ICS-6280 is specially designed for optimal performance in rugged industrial environments, with features such as redundant power supply capabilities supporting wide voltage inputs from 9Vdc to 48Vdc. This is bolstered by its wide operating temperature of -40°C ~ 75°C, which ensures continuity of operation in industrial settings.

While durable and rugged, the ICS-6280 maintains excellent connectivity via its sophisticated and purpose-built I/O, with LAN Bypass and wireless network support, including expansion options to facilitate Wi-Fi and cellular network connections for excellent networking even in remote deployment scenarios. The most important element to be considered when building an industrial IoT network is security, particularly in the energy, oil and gas sectors. Therefore, the ICS-6280 insures against threats by incorporating physical security features such as an isolated COM port, alongside NGFW, redundant power supply, and UTM support to its mechanism.

The UEFI Forum today announced the release of the Unified Extensible Firmware Interface (UEFI) 2.10 specification and Advanced Configuration and Power Interface (ACPI) 6.5 specification. The new specification versions expand support for new processor types, memory interfaces and platform types, while allowing for crypto agility in post-quantum system security.

"We are excited to share the new Conformance Profiles feature, responsive to community pull for a way to make the UEFI Forum's work useful," said Mark Doran, UEFI Forum President. "The Conformance Profiles feature will expand the platform types UEFI can support to an ever wider range of platform types like IoT, embedded and automotive spaces - beyond general purpose computers."

Seeed Studio, a provider of AIoT Hardware Service Platform, today announced it has joined NVIDIA Metropolis, a partner program focused on bringing to market a new generation of vision AI applications. NVIDIA Metropolis nurtures a rich ecosystem and offers powerful developer tools to supercharge vision AI applications that are designed to make the world's most important spaces and operations safer and more efficient.

Seeed is a reseller of NVIDIA embedded systems and a member of the NVIDIA Jetson ecosystem for edge AI. The company offers NVIDIA Jetson module powered full system and carrier boards, integrating software into AI solutions spanning many industries. Offering a one-stop product experience, Seeed speeds time to market for customers by handling all licensing, integration, manufacturing, fulfillment, and distribution.

The LattePanda Team launched the world's thinnest pocket-sized hackable computer - LattePanda 3 Delta with global electronic components distributors. The collaboration will ensure that the product choice for LattePanda 3 Delta is passed on to customers through quick, easy online selection via the website of global electronic components distributors and LattePanda.

"LattePanda Team is so proud to cooperate with the global electronic components distributors for this joint launch. It delivers an exciting message to our customers that they can gain fast, easy access to our high-performance and hackable LattePanda 3 Delta anywhere in the world. Our collaboration will assure even higher levels of customer service," said Sandy Zhang, CMO of LattePanda Team.

Bringing new AI and robotics applications and products to market, or supporting existing ones, can be challenging for developers and enterprises. The NVIDIA Jetson AGX Orin 32 GB production module—available now—is here to help. Nearly three dozen technology providers in the NVIDIA Partner Network worldwide are offering commercially available products powered by the new module, which provides up to a 6x performance leap over the previous generation.

With a wide range of offerings from Jetson partners, developers can build and deploy feature-packed Orin-powered systems sporting cameras, sensors, software and connectivity suited for edge AI, robotics, AIoT and embedded applications. Production-ready systems with options for peripherals enable customers to tackle challenges in industries from manufacturing, retail and construction to agriculture, logistics, healthcare, smart cities, last-mile delivery and more.

Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, today announced that its new package 100BGA LPDDR4/4X had achieved the JEDEC JED209-4 standard to ensure energy conservation and carbon reduction. The LPDDR4/4X is now available in a space-saving 100BGA package measuring only 7.5X10mm2. The device is ideal for IoT applications requiring higher throughput in a small package to allow designers to reduce the PCB size for more compact IoT designs.

Winbond's LPDDR4/4X memory is available in density of 1Gb and 2Gb, supporting speeds of up to 4267 Mbps. It is available in both Single-Die-Package (SDP) with a 2Gb density and Dual-Die-Package (DDP) with a 4Gb density. The higher speed of LPDDR4 1CH x16 4267 Mbps offers improved performance over previous DDR4 x16 3200 Mbps devices, which is especially useful for consumer applications.

Axiomtek - a world-renowned leader relentlessly devoted in the research, development and manufacture of series of innovative and reliable industrial computer products of high efficiency - is pleased to announce the IMB760, a server-grade extended ATX motherboard (330 mm x 305 mm) powered by the dual LGA4189 socket 3rd Gen Intel Xeon scalable processors (code name: Ice Lake-SP) with the Intel C627A chipset. It comes with an effective load balancing between two CPUs and multiple accelerator cards to stabilize computation loads and maximize computing power. Featuring optimized performance, more PCI Express Card slots, and high-density memory expansion, this EATX server motherboard enables high level computing, AI workload and deep learning for the data-fueled future.

"Performance, security, and flexibility are indispensable for AI in next-gen computing. As the first and flagship EATX motherboard of Axiomtek, the IMB760 features built-in AI and crypto acceleration functions as well as advanced security capabilities to meet the specific needs of automated manufacturing, robotics, image or video analytics, and other AIoT applications. This server-grade motherboard has sixteen DDR4-3200 RDIMM sockets with a memory capacity of up to 1 TB. Ready for the demands of massive data storage and high-speed data transmission, the industrial motherboard supports two NVMe SSD, one IPMI LAN, and two 10GbE LAN ports. Rich expansions with enough PCIe x16 slots and PCIe x8 slots for GPU acceleration, making IM760 a perfect solution for computationally intensive imaging, intelligent video analytics, and heavy workload processing," said Wayne Chung, the product manager of AIoT Team at Axiomtek.

New product alert! In January last year, we launched the $4 Raspberry Pi Pico, our first product built on silicon designed here at Raspberry Pi. At its heart is the RP2040 microcontroller, built on TSMC's 40 nm low-power process, and incorporating two 133 MHz Arm Cortex-M0+ cores, 264kB of on-chip SRAM, and our unique programmable I/O subsystem. Since launch, we've sold nearly two million Pico boards, and RP2040 has found its way into a huge number of third-party products. We always believed that RP2040 was a great fit for commercial and industrial applications, but the global semiconductor shortage has vastly accelerated adoption. With millions of units on hand today, and pipeline in place for tens of millions more, design engineers who have been let down by their current suppliers have a perfect excuse to experiment.

Fast cores, large memory, and flexible interfacing make RP2040 a natural building block for Internet of Things (IoT) applications. But Pico itself has one obvious missing feature for IoT: a method for connecting to the network. Now, this is about to change. Today, we're launching three new members of the Pico family. Raspberry Pi Pico W is priced at $6, and brings 802.11n wireless networking to the Pico platform, while retaining complete pin compatibility with its older sibling. Pico H ($5) and Pico WH ($7) add pre-populated headers, and our new 3-pin debug connector, to Pico and Pico W respectively. Pico H and Pico W are available today; Pico WH will follow in August.

As global adoption of Edge AI continues to rise through smart transitions, ASRock Industrial is excited to release the new iEPF-9010S/iEP-9010E Series Robust Edge AIoT Platform, enabled by 12th Gen Intel Core Processors (Alder Lake S) with R680E/H610 chipsets to bring breakthrough performance at the Edge. Featuring excellent computing power with energized Edge AI acceleration, the iEPF-9010S/iEP-9010E Series provide high memory capacity, rich I/Os and expandability, wide RF connectivity- 4G LTE, 5G, Wi-Fi 6E, BT 5.2 with real-time TSN/TCC, plus ruggedness for industrial environments. The Series is an effective all-in-one consolidation for high-demanding workloads, tailor-made for mission-critical industrial applications such as factory automation, machine automation, robotic control, AI AOI, autonomous vehicles, smart cities, and much more.

AMD today announced the Ryzen Embedded R2000 Series, second-generation mid-range system-on-chip (SoC) processors optimized for a wide range of industrial and robotics systems, machine vision, IoT and thin-client equipment. Ryzen Embedded R2000 Series doubles the core count and delivers a significant performance uplift compared to the prior generation, with the new R2514 model exhibiting up to 81 percent higher CPU and graphics performance than the comparable R1000 series processor. Performance-per-watt efficiency is also optimized using "Zen+" core architecture with AMD Radeon graphics for rich and versatile multimedia capabilities. Ryzen Embedded R2000 processors can power up to four independent displays in brilliant 4K resolution.

Embedded R2000 Series processors are scalable up to four "Zen+" CPU cores with eight threads, 2 MB of L2 cache and 4 MB of shared L3 cache. This gives embedded system designers great flexibility to scale performance and power efficiencies with a single processing platform. With support for up to 3200 MT/s DDR4 dual-channel memory and expanded I/O connectivity, the Ryzen Embedded R2000 Series processors deliver 33 percent higher memory bandwidth and up to 2X greater I/O connectivity compared to R1000 series processors.

MediaTek today unveiled its new Genio platform for AIoT devices and introduced the first chip in the Genio family, the Genio 1200 designed for premium AIoT products. MediaTek Genio is a complete platform stack for the AIoT with powerful and ultra- efficient chipsets, open platform software development kits (SDKs) and a developer portal with comprehensive resources and tools. This all-in-one platform makes it easy for brands to develop innovative consumer, enterprise and industrial smart applications at the premium, mid-range and entry levels, and bring these devices to market faster. With MediaTek Genio, customers have access to all the hardware, software and resources needed to go from concept to design and manufacturing.

Customers can choose from a range of Genio chips to suit their product needs, and then use MediaTek's developer resources and the Yocto Linux open platform SDK to customize their designs. MediaTek also makes it easy for customers to access its partners' system hardware and software, and leverage partners' networks and sales channels. By offering an integrated, easy-to-use platform, MediaTek Genio reduces development costs and speeds up time to market, while providing long-term support for operating system updates and security patches that extend the product lifecycle. "Today MediaTek powers the most popular AIoT devices on the market. As the industry enters the next era of innovation, MediaTek's Genio platform delivers flexibility, scalability and development support brands need to cater to the latest market demands," said Jerry Yu, MediaTek Corporate Senior Vice President and General Manager of MediaTek's Computing, Connectivity and Metaverse Business Group. "We look forward to seeing the new user experiences brands bring to life with the Genio 1200 and its powerful AI capability, support for 4K displays and advanced imaging features."

Today MaxLinear announced the immediate availability of two 1000BASE-T Ethernet Switches (GSW125, GSW145) and a quad-port 2.5GBASE-T PHY (GPY245), expanding its Ethernet product portfolio to better serve the industrial, telecommunications, and networking outdoor markets, where products must perform efficiently in harsh temperature environments. With the increase of outdoor Wi-Fi access points, Industrial IoT and Industrial PCs used to collect, monitor and control equipment, products must operate in either high heat or frigid cold environments. Extreme temperatures can impact network operation, data transmission, and system reliability, causing interruptions and downtime, leading to security risks and costly emergency repairs.

"MaxLinear has a 40-year history of being a leading supplier in industrial interface devices, having shipped over 1B serial transceivers over the past five years," said James Lougheed, Vice President of Marketing, High Performance Analog. "As the requirements for industrial-grade Ethernet products continue to grow, we continue to invest to remain in a strong position to support these fast-growing markets."

As industries compete to capitalize on the abundance of data generated by intelligent, connected devices, implementation of an intelligent data strategy has become even more critical. Edge computing has played an instrumental role to address this demand, but the edge itself has continued to evolve with the ever-growing need for even more demanding, real-time computing. Rugged edge computing enables applications that require real-time, low latency data processing and storage to function reliably in volatile environments that are not friendly to regular systems.

Trends and technologies such as Industry 4.0, AIoT, and 5G are driving the need for improved intelligence at the rugged edge. Businesses and organizations want more computing power at the edge because of the benefits it provides to their operations. NVM Express (NVMe) is an essential enabling technology for rugged edge computing, reducing latency and accelerating data processing to the point where connected devices can operate anywhere to perform machine learning, artificial intelligence, and inference computing. Real-time data access and analytics are turning rugged edge computing into a competitive necessity across all sectors and industries.

ADATA Technology, a leading manufacturer of high-performance DRAM modules, NAND Flash products, and mobile accessories has today launched new industrial-grade Registered DIMM (R-DIMM) DDR5 memory modules. This completes a full suite of industrial-grade DDR5 including U-DIMM, SO-DIMM and now R-DIMM modules designed for the latest Intel 12th Generation processors, and future DDR5 platforms.

ADATA industrial-grade R-DIMM DDR5 memory modules are suitable for a wide range of applications, including 5G backhaul equipment, AIoT, High-Performance Computing, Server, Data Center, Edge Computing, Networking, Surveillance and more. DDR5 is expected to account for 90% of the global memory market by 2026, and ADATA's DDR5 memory is ready to support the growing demand for reliable, high bandwidth memory.

ADATA Technology (Taiwan Stock Exchange: 3260.TWO), a global leading brand of industrial-grade memory, including flash storage products and DRAM modules, today announces that its in-house developed firmware for 112-Layer (BiCS5) 3D NAND PCIe solid state drives has become University of New Hampshire InterOperability Laboratory (UNH-IOL) NVMe 1.4 certified. The certification reaffirms ADATA's core competencies in R&D and commitment to offering high performance SSDs. UNH-IOL is an independent test facility that provides interoperability and standards conformance testing for networking, telecommunications, data storage, and consumer technology products.

The IM2P32A8 M.2 2280 and IM2P32A4 M.2 2242 industrial-grade solid state drives will benefit from the newly certified firmware. What's more, both SSDs feature 112-layer 3D TLC Flash memory developed by WD and KIOXIA, supports the PCIe Gen3x4 interface, and provides large capacities of up to 2 TB. With ADATA's firmware, they provide improved performance and interoperability. In addition to processing large volumes of data, the SSDs can also serve as storage devices or a boot disk, which can fulfill the needs of applications such as 5G, Industrial Internet of Things (IIoT), smart cities, and telemedicine.

Apacer has taken 3D NAND Flash optimization to new heights. Today, it announces the release of SLC-liteX industrial SSDs that can provide an incredible 100,000 P/E cycles. That's 3 to 33 times higher than competing 2D MLC or 3D TLC products can offer. 5G and AIoT manufacturers who are invested in large-scale data collection and analysis, including those demanding higher capacities, higher performance and higher endurance, will quickly see the advantages of this development. According to Allied Market Research, "the global 3D NAND flash memory market size was valued at $12.38 billion in 2020, and is projected to reach $78.42 billion by 2030, registering a CAGR of 20.3% from 2021 to 2030."

The endurance of any NAND Flash product can be measured in P/E cycles. Every time a write or erase action is performed, the Flash cell will suffer irreparable damage. In the industrial world, 3,000 P/E cycles was considered quite a competitive number. But with increasing demands for greater endurance thresholds in applications such as 5G O-RAN and edge computing switches, the market was hungry for more - while still recognizing the paramount importance of cost-effectiveness. Apacer's crack team of firmware experts tackled the problem and were able to tweak the technology to deliver 100,000 P/E cycles. Careful cell distribution management of the 3D TLC structure was necessary in order to correctly adjust the voltage delta and charge sensing. Furthermore, powered by carefully selected industrial grade NAND components, the firmware structure is specifically optimized to enhance NAND flash stability during daily operations, and the error handling algorithm is significantly improved to avoid any unexpected ECC errors.

In celebration of Pi Day, OnLogic, a global industrial computing manufacturer and solution provider known for their reliable, orange industrial PCs, has announced that their new Factor 201 Raspberry Pi-powered device is available for pre-order. In addition, they've released more details about the next model in the Factor 200 Series, the Factor 202. Both devices are powered by the Raspberry Pi Compute Module 4, which was developed specifically for industrial products.

"We're delighted that OnLogic has chosen to develop the Factor 201 around Raspberry Pi. Using Raspberry Pi Compute Module 4 with their custom-designed carrier boards and industrial enclosure has allowed OnLogic to offer their customers flexible and reliable solutions, and we see Raspberry Pi hardware being increasingly widely adopted in industry with products like this one," said Gordon Hollingworth, Chief Product Officer at Raspberry Pi Ltd.

UP! Bridge the Gap, a brand belonging to a leading manufacturer of AI Edge hardware solutions, AAEON, has unveiled the UP Squared 6000 Edge Computing Kit - a compact, industrial turnkey solution featuring an innovative software package to ease and simplify the development process for system integrators, independent software vendors (ISVs), and IoT developers.

Based on the latest Intel Atom x6000E series processors (formerly Elkhart Lake), the UP Squared 6000 Edge Computing Kit delivers upgraded single-thread, multi-thread, and graphical performances to accelerate computer vision and deep learning applications and enables the features of the Intel Programmable Services Engine (Intel PSE).