Renesas Electronics Corporation, a premier supplier of advanced semiconductor solutions, announced today that it has designed and tested a 32-bit CPU core based on the open-standard RISC-V instruction set architecture (ISA). Renesas is among the first in the industry to independently develop a CPU core for the 32-bit general-purpose RISC-V market, providing an open and flexible platform for IoT, consumer electronics, healthcare and industrial systems. The new RISC-V CPU core will complement Renesas' existing IP portfolio of 32-bit microcontrollers (MCUs), including the proprietary RX Family and the RA Family based on the Arm Cortex -M architecture.

RISC-V is an open ISA which is quickly gaining popularity in the semiconductor industry, due to its flexibility, scalability, power efficiency and open ecosystem. While many MCU providers have recently created joint investment alliances to accelerate their development of RISC-V products, Renesas has already developed a new RISC-V core on its own. This versatile CPU can serve as a main application controller, a complementary secondary core in SoCs, on-chip subsystems, or even in deeply embedded ASSPs. This positions Renesas as a leader in the emerging RISC-V market, following previous introductions of its 32-bit voice-control and motor-control ASSP devices, as well as the RZ/Five 64-bit general purpose microprocessors (MPUs), which were built on CPU cores developed by Andes Technology Corp.

MediaTek, one of the first adopters of Wi-Fi 7 technology, now has the industry's most comprehensive Wi-Fi 7 portfolio with today's introduction of the company's new Filogic 860 and Filogic 360 solutions. Together, these second-generation additions aim to further expand MediaTek's platform of cutting-edge products that utilize the latest technology advancements in connectivity while achieving peak performance and always-on reliability.

Filogic 860 combines a Wi-Fi 7 dual-band access point with a new advanced network processor solution and is ideal for enterprise access points, service provider Ethernet gateways and mesh nodes, as well as retail and IoT router applications. Filogic 360 is a stand-alone client solution that integrates Wi-Fi 7 2x2 and dual Bluetooth 5.4 radios in a single chip, and is designed to deliver next-generation Wi-Fi 7 connectivity to edge devices, streaming devices and a vast array of other consumer electronics.

ADLINK Technology Inc., a global leader in edge computing, a global supplier of industrial PCs and motherboards, and a Titanium member of the Intel Partner Alliance, announces the launch of the new IMB-M47 industrial ATX motherboard for 12th and 13th Gen Intel Core i9/i7/i5/i3 processors. The IMB-M47 ATX motherboard delivers high-performance computing power, with multiple I/O and expansion ports, including three simultaneous independent displays, USB 3.2 Gen 2x2 (20 Gb/s), up to 128 GB DDR5 4800 MHz, 3x 2.5 GbE, multi-M.2 Key M, TPM 2.0, and PCIe 5.0 high-performance add-on cards for complex Edge AIoT processing tasks in industrial automation, machine vision, factory automation, and logistics.

The IMB-M47 industrial ATX motherboard supports 12th and 13th Gen Intel Core processors that utilize a high-performance hybrid architecture with up to sixteen E-cores (Efficient-cores) for multi-threaded background task management and multitasking, and up to eight P-cores (Performance-cores) for demanding single-threaded work such as graphics and video rendering. The 13th Gen Intel Core processors speed up edge applications that benefit from faster memory performance with faster DDR5 memory.

Synopsys, Inc. (Nasdaq: SNPS) today announced it has extended its ARC Processor IP portfolio to include new RISC-V ARC-V Processor IP, enabling customers to choose from a broad range of flexible, extensible processor options that deliver optimal power-performance efficiency for their target applications. Synopsys leveraged decades of processor IP and software development toolkit experience to develop the new ARC-V Processor IP that is built on the proven microarchitecture of Synopsys' existing ARC Processors, with the added benefit of the expanding RISC-V software ecosystem.

Synopsys ARC-V Processor IP includes high-performance, mid-range, and ultra-low power options, as well as functional safety versions, to address a broad range of application workloads. To accelerate software development, the Synopsys ARC-V Processor IP is supported by the robust and proven Synopsys MetaWare Development Toolkit that generates highly efficient code. In addition, the Synopsys.ai full-stack AI-driven EDA suite is co-optimized with ARC-V Processor IP to provide an out-of-the-box development and verification environment that helps boost productivity and quality-of-results for ARC-V-based SoCs.

Advantech has skillfully incorporated 13th Gen Intel Core processors across a wide array of products, setting new benchmarks for performance and capability. These enhanced solutions harness cutting-edge CPU architectures in their latest designs, delivering a noticeable performance boost over the previous processor generation. This upgrade significantly enhances application efficiency in smart factories, computer vision, intelligent retail, healthcare, and edge AI applications. At Advantech, we are unwavering in our commitment to providing long-term support, ensuring that customers can rely on our products for uninterrupted operation.

Advantech's new solutions offer Intel processors with up to 24 cores and 32 threads, up to 128 GB of DDR5 memory, and a PCIe 4.0/5.0 x16 slot for efficient multitasking. Experience optimized productivity with Advantech's Embedded Design-In Services and quality solutions featuring industrial-grade components. Advantech's embedded OS and value-added software options include Windows, Ubuntu, and Yocto BSP, along with the Edge AI Suite for AI performance evaluation and DeviceOn for device management.

ASUS today announced that the official signing ceremony with Intel Corporation, marking the handover of the Intel Next Unit of Computing (NUC) product lines, has been successfully completed. ASUS will now manufacture and sell Intel NUC 10th to 13th generation systems product lines, and will develop future NUC systems. Intel NUC solutions are small-form-factor devices or compute elements that are customizable and ideal for business, edge computing, and gaming environments.

A smooth transition
Following the official handover from Intel, ASUS kicked-off its NUC business and started to take orders for NUC 10th to 13th generation systems on September 1. The new business is generating a wide variety of exciting opportunities for the company and the transition has progressed smoothly for NUC customers. The vision of the newly established ASUS NUC BU is to provide the most impactive edge computing with comprehensive commercial and AIoT solutions that can sustain the industry and businesses.

NETGEAR, Inc., the leading provider of award-winning connected products designed to simplify and improve people's lives, today took its award-winning Orbi line to new heights with a powerful new antenna design and exclusive, patented technology that enhance the benefits of WiFi 7. Born of over 25 years of NETGEAR pioneering WiFi expertise, the Orbi 970 Series delivers unparalleled performance, speeds of up to 27 Gbps, a slim, elegant design and high-performance antennas for 360-degree coverage across just about any home, no matter the layout.

With the rise of faster multi-gig internet speeds now available to more households, the growing number of connected devices per family and the ever-increasing growth of bandwidth-intensive applications such as 4K/8K video streaming, HD Zoom calls, graphics-focused work, highly interactive real-time gaming and immersive AR/VR entertainment, the need for faster WiFi speeds, lower latency and more capacity becomes imperative. Enter WiFi 7. While WiFi 6E opened the 6 GHz band as a superhighway for the latest, fastest devices, WiFi 7 builds on that promise by expanding the channels to 320 MHz and unleashing unprecedented speeds and performance. The Orbi 970 Series maximizes the potential of the new standard with innovative, new technology that ensures the benefits are delivered throughout the home, from the front door to the backyard, across all devices simultaneously.

ASRock Industrial releases the 4X4 BOX 7040 Series Mini PCs powered by AMD Ryzen 7040U Series APUs, featuring up to 8 "Zen 4" cores and 16 threads. With the new AMD Ryzen AI, the first AI engine for an x86 platform, and support of dual-channel DDR5 5600 MHz memory up to 64 GB, the new Series sprint ahead in speed, performance, and AI capability, while guaranteeing extended runtime. The 4X4 BOX 7040 Series comes with enriched I/O connectivity in a compact appearance, enabling 4K quad-display outputs, five USB ports with two USB4, dual storage, and dual LAN up to 2.5G, Wi-Fi 6E. The faster performance with AI engine and longer runtime bring about productivity boost and next-level experience in content creation, gaming, entertainment, commerce, and many other AIoT applications.

Powered by AMD Ryzen 7040U Series APU (Ryzen 7 7840U/Ryzen 5 7640U), ASRock Industrial's 4X4 BOX 7040 Series contain selections: 4X4 BOX-7840U and 4X4 BOX-7640U. Featuring 4 nm "Zen 4" architecture with up to 8 cores and 16 threads, and enhanced dual-channel DDR5 5600 MHz SO-DIMM memory up to 64 GB, the Series guarantee faster productivity, content creation, and gaming with extended runtime. Moreover, with built-in AMD Ryzen AI - the pioneer of dedicated AI hardware in an X86 processor, the 4X4 BOX 7040 Series usher in advanced potentials in power, efficiency, and intuition for the future AI working world. This integration transforms the 4X4 BOX 7040 Series into a reliable personal virtual assistant, propelling dynamic AI applications, enhancing video conferencing, and delivering AI-inspired visuals.

OpenHW Group today announced that the industry's most comprehensive Development Kit for an open-source RISC-V MCU is now available to be ordered. The OpenHW CORE-V MCU DevKit includes an open-source printed circuit board (PCB) which integrates OpenHW's CORE-V MCU and various peripherals, a software development kit (SDK) with a full-featured Eclipse-based integrated development environment (IDE), as well as connectivity to Amazon Web Services (AWS) via AWS IoT ExpressLink for secure and reliable connectivity between IoT devices and AWS cloud services.

The comprehensive open-source CORE-V MCU DevKit enables software development for embedded, internet-of-things (IoT), and artificial intelligence (AI)-driven applications. The CORE-V MCU is based on the open-source CV32E40P embedded-class processor, a small, efficient, 32-bit, in-order open-source RISC-V core with a four-stage pipeline that implements the RV32IM[F]C RISC-V instruction extensions.

MaxLinear, Inc., a leader in data storage accelerator solutions, today announced the production-release of the OCP 3.0 storage accelerator adapter card for Panther III. The ultra-low latency accelerator is designed to quicken key storage workloads, including database acceleration, storage offload, encryption, compression, and deduplication enablement for maximum data reduction. The Panther III OCP card is ideal for use in modern data centers, including public to edge clouds, enterprise data centers, and telecommunications infrastructure, allowing users to access, process, and transfer data up to 12 times faster than without a storage accelerator. The OCP version of the card is available immediately with a PCIe version available in Q3 2023.

"In an era where the amount of data generated exceeds new storage installations by multiple fold, Panther III helps reduce the massive storage gap while improving TCO per bit stored," said Dylan Patel, Chief Analyst at SemiAnalysis.

ASUS IoT, the leading global AIoT solution provider, today announced Tinker Board 3N series, a versatile, Arm -based single-board computer (SBC) that empowers easy system integration, broad adaptability and superb expandability - elevating it to the perfect choice for the emerging Industrial Internet of Things (IIoT) era.

The NUC-sized SBC series is equipped with rich I/O and supports Linux Debian, Yocto, and Android operating systems, presenting an all-new premium option for developers and system integrators' diverse IIoT projects. Its optimized thermal design simplifies deployment of embedded applications, ensuring efficient operation in demanding environments. With its durable and reliable design, Tinker Board 3N offers enhanced computing performance, low power consumption and a wide range of interfaces, so it's primed and ready for smart manufacturing applications powering the IoT revolution.

Semiconductor industry players Robert Bosch GmbH, Infineon Technologies AG, Nordic Semiconductor, NXP Semiconductors, and Qualcomm Technologies, Inc., have come together to jointly invest in a company aimed at advancing the adoption of RISC-V globally by enabling next-generation hardware development.

Formed in Germany, this company will aim to accelerate the commercialization of future products based on the open-source RISC-V architecture. The company will be a single source to enable compatible RISC-V based products, provide reference architectures, and help establish solutions widely used in the industry. Initial application focus will be automotive, but with an eventual expansion to include mobile and IoT.

ASRock Industrial, the leading provider of global industrial motherboards and systems, has released new Mini PCs and motherboards powered by Intel Processor N97 (Alder Lake-N). The available selections include NUC BOX-N97, iBOX-N97, and Motherboard Series consisting of NUC-N97, Pico-ITX (SOM-P104), SBC 3.5" (SBC-260, SBC-261), and Mini-ITX (IMB-1005, IMB-1006, IMB-1007) form factors. Compared to the previous Intel Celeron Processor J6412 (Elkhart Lake), the Intel Processor N97 (Alder Lake-N) showcases remarkable CPU performance increase of up to 37% and graphics performance up to 154%. The new NUC BOX-N97, iBOX-N97, and NUC-N97 Motherboard Series provide rich I/O and expansion options, including triple displays up to 4K at 60 Hz, dual 2.5G LAN, and dual storage option with SATA 3.0 and M.2 Key M, catering to diverse application needs, such as entertainment, office, business, retail, transportation, embedded, industrial, and beyond.

BIOSTAR, a leading manufacturer of motherboards, graphics cards, and storage devices, today announced its latest line-up of industrial motherboards and application systems. BIOSTAR's latest BIQ67-AHP, the BIW68-AHP, and the BIELK-PAT motherboards, with MT-J6412, and MT PRO-J6412 application systems are built to address various system integration and industrial needs, offering innovative features that ensure high performance, reliability, and longevity.

The BIQ67-AHP and BIW68-AHP motherboards are excellent for system integration, general industrial systems and GPU AI workstation. These allow businesses to have reliable computers that help stay up-to-date on customers' contact details, transaction history, accounts, communication, and business management on a reliable and efficient platform. Featuring Intel Q670 chipset and Intel W680 chipset respectively, the BIQ67-AHP and BIW68-AHP motherboards carry additional features and functionality such as DDR4 support up to 128 GB, dual Intel LAN, multiple PCI/PCIe slots, M.2 slots, USB 3.2, COM ports, and more. The BIELK-PAT motherboard, with its wide range temperature -40 °C ~ 85 °C and voltage support, is built to withstand and function optimally in diverse environments and outdoor applications. It is ideal for uses such as EV charging stations, kiosks, refrigerated factories, and is great for HMI applications for businesses of all sizes.

Earlier today Logitech International was invited and honored to participate in the US National Label for Consumer IoT Security launch at the White House in Washington DC. The event, sponsored by the National Security Council, was led by chairwoman of the FCC, Jessica Rosenworcel, and included members of both organizations, as well as other leading tech companies focused on and making strides in product security for consumers.

Logitech is an active contributor in industry efforts to integrate security into the core standards that its products use. Through its participation in the Product Security Working Group (PSWG) and Matter Working Group within the Connectivity Standards Alliance (CSA), the company continues to work with others in the industry to write and certify the standards by which next generation products will operate.

Today, Intel announced it has agreed to a term sheet with ASUS, a global technology solution provider, for an agreement to manufacture, sell and support Intel Next Unit of Compute (NUC) 10th to 13th generations systems product line, and develop future NUC systems designs. "Our NUC systems product team delivered unique products that spurred innovation in the ultra-small form factor market. As we pivot our strategy to enable ecosystem partners to continue NUC systems product innovation and growth, our priority is to ensure a smooth transition for our customers and partners. I am looking forward to ASUS continuing to deliver exceptional products and supporting our NUC systems customers," said Sam Gao, Intel vice president and general manager of Intel Client Platform Solutions.

Intel is pivoting its strategy to enable ecosystem partners to continue NUC systems product line innovation and growth. ASUS's expertise and track record delivering industry-leading mini PCs to customers make it ideally suited to continue driving innovation and growth in NUC systems products. "Thank you, Intel, for your confidence in us to take the NUC systems product line forward. I am confident that this collaboration will enhance and accelerate our vision for the mini PC - greatly expanding our footprint in areas such as AI and AIoT," said Joe Hsieh, ASUS chief operating officer. "We are committed to ensuring the excellent support and service that NUC systems customers expect."

Today, U.S. Deputy National Security Advisor Anne Neuberger, Chairwoman of the Federal Communications Commission (FCC) Jessica Rosenworcel, and Laurie Locascio, Director of the National Institute of Standards and Technology (NIST) unveiled the U.S. national IoT security label at the White House.

Infineon Technologies AG supports this action to address the growing need for IoT security. The new label supports the IoT security requirements under NISTIR 8425, which resulted from an Executive Order to improve the nation's cybersecurity. This label will recognize products that meet these requirements by permitting them to display a U.S. government label and be listed in a registry indicating that these products meet U.S. cybersecurity standards.

BeagleBoard.org, a leading developer of open-source hardware platforms, is thrilled to announce the highly anticipated launch of BeagleV-Ahead, an innovative single board computer (SBC) based on TH1520, a quad core 64-bit RISC-V SoC from T-Head. This groundbreaking open-source SBC brings a new level of accessibility, performance, and flexibility to the rapidly growing RISC-V ecosystem.

BeagleV-Ahead is set to revolutionize the world of embedded systems and empower developers and enthusiasts worldwide. It represents a significant milestone in the democratization of computer architecture and open-source hardware development. Built around the powerful and energy-efficient RISC-V instruction set architecture (ISA), the BeagleV-Ahead SBC offers unparalleled opportunities for developers, hobbyists, and researchers to explore and experiment with RISC-V technology.

ASUS IoT, the global AIoT solution provider, today announced PE1100N, a unmatched, ultra-compact computer for AI inferencing at the edge, and based on the next-generation and world-leading NVIDIA Jetson Orin series. It features a fanless design for quiet operation, rich industrial connectivity for serious flexibility and supports a wide range of power inputs and operating temperatures for maximum versatility and durability.

With the powerful Jetson platform, featuring an efficient Arm processor and embedded NVIDIA GPU, PE1100N delivers energy-efficient computing with powerful AI-inferencing capabilities, making it ideal for diverse, scalable edge AI applications in smart city, transportation, manufacturing and more - including traffic analysis, people-tracking, counting and surveillance. Also, PE1100N's compact size and anti-vibration design make it especially ideal for smart manufacturing solutions, such as automated guided vehicle (AGVs), autonomous mobile robots (AMRs), AI-powered automated optical inspection (AOI) and robotics applications - accelerating time to market for AI applications.

ASRock Industrial is introducing new choices in industrial motherboards powered by 13th Gen Intel Core Processors (Raptor Lake-S) with up to 24 cores and 32 threads that boost computer-intensive edge performance. They come equipped with Intel W680, Q670, and H610 chipsets, and offer support for up to DDR5-5600 memory modules and PCIe Gen 5, allowing expanded possibilities and seamless integration within industry-specific applications.

By harnessing the power of the 13th Gen Intel Core Processors, they leap up to 1.04x/1.34x/1.25x faster in single-thread, multi-thread, and CPU image classification inference performance, respectively, compared to the preceding 12th Gen Intel Core processors. The new 13th Gen Intel CPU motherboards with DDR5 support, available in Mini-ITX, Micro-ATX, and ATX form factors, have been specifically designed to cater to the unique requirements of the Edge AIoT applications in commerce, automation, robot, entertainment, and security industries.

Metalenz, the world leader in metasurface optics, today announced it has partnered with leading semiconductor foundry United Microelectronics Corporation ("UMC") to release its direct supply chain to mass production and bring the unrivaled scale and precision of semiconductor manufacturing to the optics industry. The announcement marks the launch of metasurface optics on the open market for the first time and follows multiple design wins for Metalenz with leading OEMs in Asia.

"After initially designing meta-optics in partnership with one of the leading suppliers of 3D sensing solutions, we are now engaged with OEMs directly to bring the benefits of metasurface optics to their 3D sensing applications. By partnering with a world-class foundry like UMC, we gain the manufacturing capabilities, expertise, and global reach to serve customers interested in adopting our meta-optics technology," said Rob Devlin, Co-founder and CEO of Metalenz. "This will further accelerate our growth as we are becoming the leading provider of precision optics for 3D sensing solutions."

Broadcom Inc. today announced sample availability of its second generation of wireless connectivity chipset solutions for the Wi-Fi 7 ecosystem, spanning Wi-Fi routers, residential gateways, enterprise access points, and client devices. The new chips build on the ecosystem of products with Broadcom's first-generation Wi-Fi 7 chips while delivering additional functionality to a wider market.

The first chip, the BCM6765, is a highly-optimized residential access point chip that supports 320 MHz 2-stream Wi-Fi operation. This new platform system-on-chip (SoC) allows the productization of Wi-Fi 7 mass-market access points and smart repeater solutions which span the spectrum of cost, form factor, and performance. The second chip, the BCM47722, is an enterprise access point chip that also supports 320 MHz 2-stream operation along with dual IoT radios that support simultaneous operation for Bluetooth Low Energy (BLE), Zigbee, Thread, and Matter protocols. This SoC addresses the growing needs of Internet of things (IoT) applications in the enterprise Wi-Fi market. The third chip, the BCM4390, is a low-power Wi-Fi, Bluetooth, and 802.15.4 combo chip designed for use in mobile devices such as handsets and tablets. It supports 160 MHz 2-stream Wi-Fi operation, dual Bluetooth, and Zigbee, Thread, and Matter protocols to service a broad set of mobile markets.

TrendForce reports that inventory reduction in Q1 fell short of expectations and coincided with the industry's traditional off-season, leading to overall subdued demand. However, due to new product release and a surge in urgent orders for specialized specifications, Q1 revenue of the global top ten IC design houses remained on par with 4Q22, with a modest QoQ increase of 0.1% for a total revenue of US$33.86 billion. Changes in ranking included Cirrus Logic slipping from the top ten as well as the ninth and tenth positions being replaced by WillSemi and MPS, respectively. The rest of the rankings remained unchanged.

The smartphone supply continues to grapple with overstock, but AI applications are entering a period of rapid growth
Qualcomm witnessed an uptick in its revenue, largely attributed to the launch and subsequent shipments of its latest flagship chip, the Snapdragon 8Gen2. The company saw 6.1% in QoQ growth in its smartphone business, which effectively offset the downturn from its automotive and IoT sectors. As a result, Qualcomm's Q1 revenue increased marginally by 0.6%, cementing its position at the top of the pack with a market share of 23.5%.

To help bridge the growing gap between modern systems and the legacy technology still in use around the world, global industrial computing specialists, OnLogic (www.onlogic.com), have released the Helix 511 Edge Computer. Designed for use in manufacturing, automation, energy management, and other edge and IoT applications, the Helix 511 easily interfaces with on-site systems thanks to a broad selection of modern and legacy connectivity options.

"We frequently have conversations with customers who are struggling to update their technology infrastructure simply because they can't connect existing systems to newer, more powerful and more capable devices," says OnLogic Product Manager, Hunter Golden. "The embedded computing space has traditionally lagged behind when it comes to adopting new technologies. We want to shift that paradigm while still allowing innovators to access and exchange data with their existing equipment. In many cases, you don't need to rip and replace everything, you just need a Helix 511."

GlobalFoundries Inc., a global leader in feature-rich semiconductor manufacturing, and STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, announced today the conclusion of the agreement to create a new, jointly-operated, high-volume semiconductor manufacturing facility in Crolles (France), which was announced on 11 July 2022.

"I would like to thank Minister Le Maire, the French Minister of the Economy and Finance, and his team for their support and the dedication for the last 12+ months that have made celebrating today's milestone possible," said Dr. Thomas Caulfield, President and CEO of GlobalFoundries. "In partnership with ST in Crolles, we are further expanding GF's presence within Europe's dynamic technology ecosystem while benefiting from economies of scale to deliver additional capacity in a highly capital efficient manner. Together we will deliver GF's market leading FDX technology and ST's comprehensive technology roadmap, in alignment with customer demand which is expected to remain high for Automotive, IoT, and Mobile applications over the next decades."