Leopard Imaging Inc. a global leader in high-definition embedded camera design and manufacturing, and an Elite Partner of Nvidia Jetson Platform, is announcing its plans for the Consumer Electronics Show (CES) 2022 from January 5th to 8th showcasing advanced imaging solutions and AI edge computing solutions. The company will exhibit demos of 3D Depth Camera Hawk on the Jetson Edge AI and Isaac Robotics Platforms. As an imaging solution development veteran, Leopard Imaging will exhibit customized cameras for autonomous driving, drones, IoT, robotics, and AI edge computing devices at CES 2022. The company will exchange ideas with its partners, industry experts, and customers to develop more advanced imaging solutions.

In November, Leopard Imaging collaborated with NVIDIA launching Hawk 3D Depth stereo camera LI-AR0234CS-STEREO-GMSL2, supporting NVIDIA Isaac Robotics platform and NVIDIA Jetson platform, and taking camera solutions to the next level. Leopard Imaging empowers the imaging quality with Active Alignment (AA) technology through its powerful manufacturing capabilities. Its full integration services will help customers incorporate this camera with different robotic projects.

UP Bridge the Gap, a brand belonging to AAEON, a leading manufacturer of AI Edge hardware solutions, is excited to announce the new UP Squared 6000 is available for pre-order and will start shipping in February 2022. UP Squared 6000 is the newest addition to the extensive UP Squared lineup. It brings greater expandability and performance over previous generations and is available as both a board and compact edge system.

Based on the latest Intel Atom x6000E Series and Intel Pentium and Intel Celeron N and J Series processors (formerly Elkhart Lake), UP Squared 6000 offers up to 1.7x better compute performance and twice the performance for 3D graphics compared with the previous generation. With a flexible I/O loadout and powerful computing capabilities, the UP Squared 6000 is an astonishingly power-efficient platform.

Rugged embedded computer brand Cincoze announces the launch of three new 16:9 widescreen sunlight-readable display modules in 15", 21", and 24" to extend the CRYSTAL product line of industrial PCs and monitors. The 16:9 widescreen sunlight-readable display modules boast vivid colors, high brightness, responsive touch, and industrial-grade rugged design. The modules are ideal for IoT and smart cities, and they are the first choice for HMI applications such as vehicle charging piles, outdoor kiosks, and self-service platforms.

The Cincoze sunlight-readable display module lineup currently includes 8" to 19" 4:3 modules, and the newly added 15", 21", and 24" 16:9 modules provide a more comprehensive range of size options. The new modules inherit the design concepts of the CRYSTAL series, including the patented convertible display system (CDS) modular system. CDS enables the addition of a P2000/P1000 series embedded system module to create a sunlight-readable panel PC or the addition of the M1000 series display module to create a sunlight-readable industrial monitor. Multiple and flexible solutions to facilitate future upgrades and maintenance.

Normally we wouldn't really cover kitchen gadgets, but Asus has just launched its PureGo PD100 in the US market and it's the company's first entry in this market space. However, it's also an "IoT" gadget, as it features Bluetooth connectivity and an app, as well as wireless charging.

At this point, you're probably wondering what the heck it is though, well, ASUS calls it a "Fruit and Vegetable Cleanliness Detector". In reality, it appears to be a sensor that detects pesticides and other "harmful" pollutants in water. In other words, you have to fill up your sink, wash your fruit or vegetables, then plop the PD100 in the water to tell you how dirty the water is. The idea is that you replace the dirty water with clean water until the device tells you that there's no more pollutants in the water. At $199.99 it's hard to see how this is going to be a big seller for ASUS, but maybe it'll be this year's gift from tech people to their loved ones.

As the global vaccination rate rose, and border restrictions in Europe and North America eased, social activities also began to enter a period of recovery, with the consumer electronics market seemingly ready for the arrival of the traditional peak season in 2H21, according to TrendForce's latest investigations. At the same time, however, the global supply chain was affected by delays in maritime transport, skyrocketing shipping costs, and component shortages, in addition to already-prohibitive price hikes for certain components in 1H21. Given the parallel rise in both material and manufacturing costs, the market for end products has not undergone the expected cyclical upturn in 2H21. Even so, the overall demand for and shipment of smartphones, notebook computers, and monitors experienced QoQ increases in 3Q21, thereby driving up businesses for major OSAT (outsourced semiconductor assembly and test) companies. For 3Q21, the revenues of the top 10 OSAT companies reached US$8.89 billion, a 31.6% YoY increase.

ADATA Technology, a leading manufacturer of high-performance DRAM modules, NAND Flash products, and mobile accessories today announces the new upgraded ADATA IM2P33E8 PLP PCIe Gen3x4 M.2 2280 solid state drive (SSD) with Power Loss Protection (PLP) technology. Since its launch in 2019, the IM2P33E8 has been recognized by industry insiders and customers involved in 5G, IoT, cloud, AI and other industrial applications for its excellent performance, high capacities, and comprehensive data security mechanism.

In order to meet the requirements of industrial applications in the era of 5G, IoT, Cloud, AI, and big data analytics, ADATA is offering an SSD that is able to operate for longer after power outages and reduce the misidentification of bad blocks. This was achieved by the inclusion of tantalum polymer capacitors to the IM2P33E8 PLP. Tantalum polymer capacitors have the ability to reduce the detriment caused by power outages, most notably data loss.

The NFC Forum, the global standards and advocacy association for Near Field Communication (NFC) technology, announced today that its Board of Directors approved and adopted the Wireless Charging Specification (WLC) 2.0. The WLC 2.0 makes it easier and more convenient to charge low-power devices such as wireless earbuds, smart watches, digital stylus pens, headsets, fitness trackers and other consumer products using smartphones and other NFC-enabled devices at a power transfer rate of up to one watt. It allows for wireless charging by enabling a single antenna in an NFC-enabled device to manage both communications and charging.

What's new with WLC 2.0 is that it supports even smaller antenna sizes expanding the range of small, battery-powered consumer and IoT devices that can be wirelessly charged using smartphones and other NFC-enabled devices. This is transformative for device manufacturers and solution providers because it allows for the design of smaller, lighter and more affordable wireless products. In addition, the NFC Forum estimates that the majority of mobile phones are interoperable with the extra small antennas covered in WLC 2.0.

ADATA Industrial, a leading manufacturer of high-performance DRAM modules, NAND Flash products, and mobile accessories today announces the launch of a new generation of industrial-grade DDR5 memory modules that offer a major leap forward in performance. They are geared toward assisting the development of 5G, AI, Edge Computing, High-Performance Computing, Automated Vehicles, and Smart Healthcare, to name a few.

According to Yole Developments, DDR5 memory shipments will exceed DDR4 by 2023 and DDR5 sales will account for 90% of the market by 2026. DDR5 will be the undisputed standard of the future and a key component of 5G, AIoT, and other applications. To meet the future demands of its customers, ADATA has unveiled a slew of DDR5 memory modules, including U-DIMM and SO-DIMM variants. The modules utilize select high-quality ICs straight from the manufacturer and will come with capacities of 8 GB and above. Compared with DDR4, DDR5 has twice the bandwidth and offers higher frequencies of up to 4800 MHz. What's more, they operate on just 1.1 V for improved energy efficiency.

5G and AIoT need more speed and more capacity. And PCIe 4.0 delivers, doubling the speed of PCIe 3.0 and providing the much-needed performance boost to keep pace with innovation and industry trends. Not only speed and capacity, but tolerance of wide-range temperature is also crucial. Consumer-grade products aren't tough enough to withstand the high temperatures of outdoor and industrial settings, so Innodisk is introducing the first industrial-grade PCIe 4.0 SSDs built to handle those challenging conditions.

PCIe 4.0 increases the maximum capacity to 4 TB, doubles the bandwidth, and raises the speed to 16 GT/s which is twice that of PCIe Gen3. Although third-generation PCIe offered only modest speed increases over the popular SATA III for storage applications, it did provide the much sought-after advantages of full forward and backward compatibility. PCIe 4.0 retains that coveted compatibility while also adding noticeable speed increases.

Leading global memory brand TEAMGROUP has been expanding in the industrial field for many years. Today, the company launched multiple industrial-grade innovative technology solutions, including the M.2 SATA SSD S750-M80, the mSATA SSD S750-3A, and the DDR4 WT DIMM product series. They feature a graphene cooling solution patented in the U.S. (Patent No. US 11,051,392 B2) and Taiwan (Patent No. I703921) to deliver the industry's best performance and heat dissipation technology. Utilizing this novel technology, TEAMGROUP is doubling down on high-speed 5G computing, on-board computing, AIoT, and edge computing applications. Every industrial product from TEAMGROUP has passed military-grade testing standards for shock (MIL-STD-202G and MIL-STD-883K) and vibration resistance (MIL-STD-810G), guaranteeing stability and durability to overcome the extreme conditions of industrial applications.

In view of the ongoing production capacity shortage in the semiconductor industry and the resultant price hike of chips, revenue of the top 10 IC design companies for 2Q21 reached US$29.8 billion, a 60.8% YoY increase, according to TrendForce's latest investigations. In particular, Taiwanese companies put up remarkable performances during this period, with both MediaTek and Novatek posting YoY growths of more than 95%. AMD, on the other hand, experienced a nearly 100% YoY revenue growth, the highest among the top 10.

TrendForce indicates that the ranking of the top five companies for 2Q21 remained unchanged from the previous quarter, although there were major changes in the 6th to 10th spots. More specifically, after finalizing its acquisition of Inphi, Marvell experienced a major revenue growth and leapfrogged Xilinx and Realtek in the rankings from 9th place in 1Q21 to 7th place in 2Q21.

At the company's HDD Reimagine event today, Western Digital Corp. (NASDAQ: WDC) introduced a new flash-enhanced drive architecture that breaks traditional boundaries of storage. Building on the company's unique ability to innovate with HDD and flash, the new storage architecture with OptiNAND technology optimizes and integrates HDDs with iNAND embedded flash drives. This gives customers - like hyperscale cloud, CSPs, enterprises, smart video surveillance partners, NAS suppliers and more - a solution to meet the exponential growth in data creation by delivering the capacity, performance and reliability needed to store vast amounts of data today and well into the future.

Leveraging industry-first technologies including triple-stage actuator (TSA) and HelioSeal technology, the first products featuring the new drive architecture will deliver an unsurpassed 2.2 TB per platter, extending capacities gains on proven ePMR technology. Setting a new industry milestone, Western Digital has shipped samples of new nine-disk, 20 TB ePMR flash-enhanced drives with OptiNAND technology to select customers.

Tachyum Inc. today announced that it has successfully executed the Linux boot process on the field-programmable gate array (FPGA) prototype of its Prodigy Universal Processor, in 2 months after taking delivery of the IO motherboard from manufacturing. This achievement proves the stability of the Prodigy emulation system and allows the company to move forward with additional testing before advancing to tape out.

Tachyum engineers were able to perform the Linux boot, execute a short user-mode program and shutdown the system on the fully functional FPGA emulation system. Not only does this successful test prove that the basic processor is stable, but interrupts, exceptions, timing, and system-mode transitions are, as well. This is a key milestone, which dramatically reduces risk, as booting and running large and complex pieces of software like Linux reliably on the Tachyum FPGA processor prototype shows that verification and hardware stability are past the most difficult turning point, and it is now obvious that verification and testing should successfully complete in the coming months. Designers are now shifting their attention to debug and verification processes, running hundreds of trillions of test cycles over the next few months, and running large scale user mode applications with compatibility testing to get the processor to production quality.

Leading memory provider TEAMGROUP today announced that all of its industrial storage products have passed military standards testing for shock and vibration resistance. The company's unique graphene-coated copper heatsink was also awarded a U.S. utility patent and is the world's first heat sink to be used for industrial SSDs. In response to the growing Artificial Intelligence of Things (AIoT) and edge computing trends, TEAMGROUP continues to improve the durability, reliability, and safety of its industrial products, striving to create innovative solutions in the field of industrial control.

TEAMGROUP's industrial product series, including industrial memory modules, SSDs and memory cards, have all been tested and certified to meet military shock (MIL-STD-202G and MIL-STD-883K) and vibration (MIL-STD-810G) standards. Whether focused on edge computing or 5G related applications, these products are guaranteed to handle high-speed data processing and computing for long periods of continuous operation. TEAMGROUP has once again proven the stability and durability of its industrial products, which meet the demanding needs for data security and industrial control in extreme conditions.

Zyxel Communications today announced the upcoming launch of a new WiFi 6 series, the DX3300, DX3301, EX3300, EX3301 and WX3100. The series includes a complete portfolio of DSL/Ethernet Gateways/IADs along with an extender. This new offering will be one of Zyxel's most cost-competitive product series for migration to WiFi 6 Mesh and is a great choice for service providers who want to offer these capabilities under an existing copper or fiber infrastructure.

"With the steady growth of IoT applications and connected appliances in households, customer demand for super-fast and reliable WiFi is immense," said James Harris, Senior Product Director for Zyxel Communications in EMEA. "This WiFi 6 Mesh series is giving service providers the opportunity to provide their customers with superior WiFi service on all their devices - anywhere in their home."

Huawei's HiSilicon subsidiary, which specialized in the design and development of semiconductor devices like processors, has made a big announcement today. A while back, the US government has blacklisted Huawei from using any US-made technology. This has rendered HiSilicon's efforts of building processors based on Arm architecture (ISA) practically useless, as the US sanctions applied to that as well. So, the company had to turn to alternative technologies. Today, HiSilicon has announced the new HiSilicon Hi3861 development board, based on RISC-V architecture. This represents an important step to Huawei's silicon independence, as RISC-V is a free and open-source ISA designed for all kinds of workloads.

While the HiSilicon Hi3861 development board features a low-power Hi3861 chip, it is the company's first attempt at building a RISC-V design. It features a "high-performance 32-bit microprocessor with a maximum operating frequency of 160 MHz". While this may sound very pale in comparison to the traditional HiSilicon products, this chip is used for IoT applications, which don't require much processing power. For tasks that need better processing, HiSilicon will surely develop more powerful designs. This just represents an important starting point, where Huawei's HiSilicon moves away from Arm ISA, and steps into another ISA design and development. This time, with RISC-V, the US government has no control over the ISA, as it is free to use by anyone who pleases, with added benefits of no licensing costs. It is interesting to see where this will lead HiSilicon and what products the company plans to release on the new ISA.

Think Silicon S.A., the leading provider of ultra-low power GPU IP for embedded systems, and Ambiq, a technology leader recognized in ultra-low power microcontrollers (MCU), System-on-Chips (SoC) and Real-time Clocks (RTC), today announced the companies are working together to bring high-end graphics capabilities to designers of everyday wearable devices.

To provide high-performance, low-power graphics, Ambiq's newest Apollo4 SoC family now incorporates Think Silicon's NEMA |pico GPU and NEMA |dc display controller IP. The Apollo4 SoC family is the fourth-generation processor solution built upon Ambiq's proprietary Subthreshold Power-Optimized Technology (SPOT ) platform. The Apollo4's complete hardware and software solution enables the battery-powered endpoint devices of tomorrow to achieve a higher level of intelligence without sacrificing battery life. The Apollo4 is purpose-built to serve as both an application processor and a coprocessor for battery-powered endpoint devices, including smartwatches, children's watches, fitness bands, animal trackers, far-field voice remotes, predictive health and maintenance devices, smart security devices, and smart home devices.

TAITRA (Taiwan External Trade and Development Council) announced today that NVIDIA will be delivering a keynote, entitled "The Transformational Power of Accelerated Computing, from Gaming to the Enterprise Data Center" at COMPUTEX 2021 Hybrid. Jeff Fisher, Senior Vice President of NVIDIA's GeForce Business Unit, will present on June 1 at 1:00 pm Taiwan time on the massive opportunities that GeForce PC gaming represents for the Taiwan ecosystem.

Manuvir Das, Head of Enterprise Computing at NVIDIA, will then address "The Coming Democratization of AI." He will share three shifts driving this trend and explain how enterprises that embrace them can thrive in the coming years.

ATP Electronics, the global leader in specialized storage and memory solutions, has announced the launch of its tiniest NVMe flash storage offering: the N700 Series PCIe Gen3 x4 NVMe solid state drives (SSDs, which are available as M.2 Type 1620 heatsink ball-grid array (HSBGA) package. Complying with M.2 specifications, the M.2 Type 1620 HSBGA measures just 16 (L) x 20 (W) x 1.6 (H) mm, supporting high-speed PCIe 3.0 interface x4 lanes and NVMe protocol to deliver up to 32 Gb/s bandwidth at 8 Gb/s per lane. The soldered-down design makes them vibration-proof, while the 291-ball packaging takes up minimal space within tightly confined systems.

For customers who prefer a removable and field-replaceable design, ATP can accommodate the HSBGA onto an M.2 2230 module with the same firmware and NAND configuration. Both variants are suitable for thin and light systems in embedded, industrial and mobile applications. N700 Series SSDs are built with 3D triple-level cell (TLC) configured as pseudo single-level cell (pSLC) NAND flash. By storing only one bit per cell, they increase the reliability and endurance of the NAND flash memory, while benefiting from the lower cost compared with native SLC, due to the higher cell density.

- AAEON, an industry leader in embedded AI edge computing systems, announces a lineup of platforms currently under development powered by the newly released NVIDIA Jetson TX2 NX system on module (SOM). This range of systems, named the BOXER-823x Series, will augment AAEON's lineup of diverse solutions powered by the NVIDIA Jetson edge AI platform. With these platforms planned for release in mid-2021, early adopters have a chance to demo the systems while in development.

The NVIDIA Jetson TX2 NX is the latest addition to NVIDIA's Jetson lineup, slotting in between the NVIDIA Jetson Nano and NVIDIA Xavier NX. Jetson TX2 NX is powered by a NVIDIA Pascal GPU, quad-core Arm Cortex -A57 MPCore processor complex, offering 256 CUDA Cores, 4 GB of onboard LPDD4 memory, and 51.2 GB/s of memory bandwidth compatible with extensions of various standard bus interfaces. In total, this offers AI processing speeds up to 1.33 TFLOPS.

Kingston Digital, Inc., the flash memory affiliate of Kingston Technology Company, Inc., a world leader in memory products and technology solutions, today announced it is partnering with NXP Semiconductors on their new i.MX 8M Plus applications processors. NXP is a leading applications processor developer for creating infrastructure solutions involving smart technology, and Kingston is proud that its eMMC embedded memory solution is part of the reference board for its latest application processor.

Smart device makers requesting NXP's engineering verification kits featuring the i.MX 8M Plus chipset will see Kingston's eMMC onboard. This creates a terrific opportunity to expand the relationship with NXP and also further showcase Kingston embedded memory solutions to other IoT manufacturers. Kingston's discrete memory and storage solutions were also embedded on NXP's previous-generation i.MX 6 and i.MX 7 series processor boards.

Xilinx, Inc., the leader in adaptive computing, today announced the company has expanded its UltraScale+ portfolio for markets with new applications that require ultra-compact and intelligent edge solutions. With form factors that are 70 percent smaller than traditional chip-scale packaging, the new Artix and Zynq UltraScale+ devices can now address a wider range of applications within the industrial, vision, healthcare, broadcast, consumer, automotive, and networking markets.

As the world's only hardware adaptable cost-optimized portfolio based on 16 nanometer technology, Artix and Zynq UltraScale+ devices are available in TSMC's state-of-the-art InFO (Integrated Fan-Out) packaging technology. Using InFO, Artix and Zynq UltraScale+ devices meet the need for intelligent edge applications by delivering high-compute density, performance-per-watt, and scalability in compact packaging options.

Demand in the global foundry market remains strong in 1Q21, according to TrendForce's latest investigations. As various end-products continue to generate high demand for chips, clients of foundries in turn stepped up their procurement activities, which subsequently led to a persistent shortage of production capacities across the foundry industry. TrendForce therefore expects foundries to continue posting strong financial performances in 1Q21, with a 20% YoY growth in the combined revenues of the top 10 foundries, while TSMC, Samsung, and UMC rank as the top three in terms of market share. However, the future reallocation of foundry capacities still remains to be seen, since the industry-wide effort to accelerate the production of automotive chips may indirectly impair the production and lead times of chips for consumer electronics and industrial applications.

TSMC has been maintaining a steady volume of wafer inputs at its 5 nm node, and these wafer inputs are projected to account for 20% of the company's revenue. On the other hand, owing to chip orders from AMD, Nvidia, Qualcomm, and MediaTek, demand for TSMC's 7 nm node is likewise strong and likely to account for 30% of TSMC's revenue, a slight increase from the previous quarter. On the whole, TSMC's revenue is expected to undergo a 25% increase YoY in 1Q21 and set a new high on the back of surging demand for 5G, HPC, and automotive applications.

AAEON, an industry leader in Edge Computing solutions, announces the SRG-3352C Compact Edge IoT Gateway System. The SRG-3352C brings reliable, cost effective gateway operations with expandability and wireless communication support designed to quickly deploy edge networks in a variety of environments.
The SRG-3352C builds upon the features, durability and reliability of the SRG-3352 Edge IoT Gateway System with expanded support for more connections and wireless communications. All of this is packed into a compact form factor that makes deploying the SRG-3352C even easier, powering more flexible edge network deployments.

The SRG-3352C is powered by the Arm Cortex-A8 800 MHz RISC processor. This innovative processor reduces the energy requirements of the system, allowing for a more efficient system to help save electricity costs. While powerful enough to connect edge networks together, the low energy usage can help cities with achieving green energy goals, and even allow the system to operate on solar power or batteries. It also eliminates the need for dedicated heatsinks, allowing the system to operate in wider temperatures, from 0°C up to 60°C without loss in performance.

Qualcomm Technologies, Inc. today announced the Snapdragon X65 5G Modem-RF System, its fourth-generation 5G modem-to-antenna solution. It is the world's first 10 Gigabit 5G and the first 3GPP release 16 modem-RF system, which is currently sampling to OEMs and targeting commercial device launches in 2021. Snapdragon X65 is the Company's biggest leap in 5G solutions since the commercialization of its first modem-RF system. It is designed to support the fastest 5G speeds currently available with fiber-like wireless performance and makes best use of available spectrum for ultimate network flexibility, capacity and coverage. In addition to the Snapdragon X65, Qualcomm Technologies also announced the Snapdragon X62 5G Modem-RF System, a modem-to-antenna solution optimized for mainstream adoption of mobile broadband applications.