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Intel Releases OpenVINO 2022.1 to Advance AI Inferencing for Developers

Since OpenVINO launched in 2018, Intel has enabled hundreds of thousands of developers to dramatically accelerate AI inferencing performance, starting at the edge and extending to the enterprise and the client. Today, ahead of MWC Barcelona 2022, the company launched a new version of the Intel Distribution of OpenVINO Toolkit. New features are built upon three-and-a-half years of developer feedback and include a greater selection of deep learning models, more device portability choices and higher inferencing performance with fewer code changes.

"The latest release of OpenVINO 2022.1 builds on more than three years of learnings from hundreds of thousands of developers to simplify and automate optimizations. The latest upgrade adds hardware auto-discovery and automatic optimization, so software developers can achieve optimal performance on every platform. This software plus Intel silicon enables a significant AI ROI advantage and is deployed easily into the Intel-based solutions in your network," said Adam Burns, vice president, OpenVINO Developer Tools in the Network and Edge Group.

Comcast Connected Nearly 1 Billion Devices Over WiFi in 2021

The number of devices connected to WiFi has skyrocketed by 12X since 2018 as Xfinity households connected nearly 1 billion devices in 2021. In fact, reliable WiFi has become so critical that nearly half of the country (45 percent) believe it is more important than reliable transportation*. These findings and more highlight Comcast's 2021 WiFi Trends Report, providing insights into how WiFi enabled Americans to pursue what mattered to them most in 2021 based on network trends and consumer insights.

"The ecosystem of connected devices in the home and the applications running on them has exploded over the last few years, driving a shift in consumers perceptions on what truly is important to their connectivity experience," said Sophie Ahmad, Chief Marketing Officer of Xfinity Consumer Service, Comcast Cable. "Unbeatable Internet that provides the best connection, complete security, faster speeds and the best tech is now integral to how Americans work, exercise, parent, and entertain."

GIGABYTE Partners with Canonical to Certify Servers for Ubuntu

GIGABYTE Technology, an industry leader in high-performance servers and workstations, today announced a partnership with Canonical to certify servers for the Ubuntu Server operating system so systems can be quickly and confidently deployed. As part of GIGABYTE's commitment to certifying enterprise solutions and to help customers with rapid deployment, GIGABYTE routinely works with partners to get server qualifications that ensure the software will be compatible with the hardware and the systems will be able to get up and running in no time. Partnering with Canonical further extends the depth of certification that GIGABYTE provides to better support end users with their flavor of OS.

Among the choices of Linux operating systems, Ubuntu has emerged as the most popular choice as users enjoy the long-term support and reliability that come from Canonical. When it comes to the public cloud, Linux desktop or IoT, Ubuntu has a dominant presence. Additionally, developers appreciate the ability to work across platforms (desktop, public/private cloud, edge, IoT) consistently and efficiently particularly on AI, machine learning, and deep learning projects.

Wi-Fi 6/6e Expected to Become Mainstream Technology with Close to 60% Market Share in 2022, Says TrendForce

Exponential demand growth for remote and unmanned terminals in smart home, logistics, manufacturing and other end-user applications has driven iterative updates in Wi-Fi technology. Among the current generations of technologies, Wi-Fi 5 (802.11ac) is mainstream while Wi-Fi 6 and 6E (802.11ax) are at promotional stages, according to TrendForce's investigations. In order to meet the connection requirements of industry concepts such as the Metaverse, many major manufacturers have trained their focus on the faster and more stable next generation 802.11be Wi-Fi standard amendment, commonly known as Wi-Fi 7. Considering technical characteristics, maturity, and product certification status, Wi-Fi 6 and 6E are expected to surpass Wi-Fi 5 to become mainstream technology in 2022, with global market share expected to reach 58%.

AAEON Announces UP Squared 6000 Industrial Maker Board

To expand vertical markets and accelerate AIoT deployments for clients, AAEON announced its introduction of UP Squared 6000, a high-performance industrial computing maker board at small form factor (101.6 mm x 101.6 mm) powered by Intel Atom x6000E/RE, Pentium or Celeron N/J series SoC (formerly Elkhart Lake) to its expanding UP Family. With the next-generation IoT-enhanced processors, UP Squared 6000 delivers upgraded single-thread, multi-thread and graphical performances, and features Intel Programmable Service Engine (PSE) and onboard TPM to accelerate and optimize AIoT vertical applications.

To drive optimal performances required for today's vertical markets, such as robotics, smart agriculture, retail, and vision-intensive applications, UP Squared 6000, powered by Intel Atom x6000E/RE, Pentium or Celeron N/J series SoC (formerly Elkhart Lake), delivers up to 1.7x single-thread performance, 1.5x multi-thread performance, and 2x graphical processing performance enabled by Intel UHD Graphics (11th Generation GPU). By adopting the next-generation IoT-enhanced processors, UP Squared 6000 brings improved performance and efficiency in artificial intelligence deployments.

OnLogic Unveils Rugged Industrial Computers Powered by 12th Gen Intel Alder Lake

Following the announcement of new 12th Generation Intel Core processors at CES 2022, global industrial computer hardware manufacturer and IoT solution provider, OnLogic, has revealed their upcoming Karbon 800 Series of rugged computers, designed to leverage the advanced features and capabilities of Intel's latest CPUs. The OnLogic Karbon 800 Series has been engineered for machine learning, artificial intelligence (AI), advanced manufacturing, automation, and other Industry 4.0 and Industrial IoT applications, that require powerful computing in commercial and industrial environments.

The Karbon 800 will be available in four models at launch, allowing users to select and customize the system that best fits their particular needs. Each model can be configured with up to a 16-core, Intel Core i9 processor and 64 GB of DDR4 ECC or non-ECC memory. Depending on the model, a wide range of storage and expansion options are available, including optional hot-swap bays as well as single and dual PCIe Gen 4 slots. OnLogic's unique ModBay expansion technology can also be used to add a variety of additional connectivity and storage options, including up to 14x LAN ports and a 6x 2.5" SSD RAID array.

IBM Welcomes LG Electronics to the IBM Quantum Network to Advance Industry Applications of Quantum Computing

IBM today announced that LG Electronics has joined the IBM Quantum Network to advance the industry applications of quantum computing. By joining the IBM Quantum Network, IBM will provide LG Electronics access to IBM's quantum computing systems, as well as to IBM's quantum expertise and Qiskit, IBM's open-source quantum information software development kit.

LG Electronics aims to explore applications of quantum computing in industry to support big data, artificial intelligence, connected cars, digital transformation, IoT, and robotics applications - all of which require processing a large amount of data. With IBM Quantum, LG can leverage quantum computing hardware and software advances and applications as they emerge, in accordance with IBM's quantum roadmap. By leveraging IBM Quantum technology, LG will provide workforce training to its employees, permitting LG to investigate how potential breakthroughs can be applied to its industry.

congatec launches 10 new COM-HPC and COM Express Computer-on-Modules with 12th Gen Intel Core processors

congatec - a leading vendor of embedded and edge computing technology - introduces the 12th Generation Intel Core mobile and desktop processors (formerly code named Alder Lake) on 10 new COM-HPC and COM Express Computer-on-Modules. Featuring the latest high performance cores from Intel, the new modules in COM-HPC Size A and C as well as COM Express Type 6 form factors offer major performance gains and improvements for the world of embedded and edge computing systems. Most impressive is the fact that engineers can now leverage Intel's innovative performance hybrid architecture. Offering of up to 14 cores/20 threads on BGA and 16 cores/24 threads on desktop variants (LGA mounted), 12th Gen Intel Core processors provide a quantum leap [1] in multitasking and scalability levels. Next-gen IoT and edge applications benefit from up to 6 or 8 (BGA/LGA) optimized Performance-cores (P-cores) plus up to 8 low power Efficient-cores (E-cores) and DDR5 memory support to accelerate multithreaded applications and execute background tasks more efficiently.

Leopard Imaging to Showcase at CES 2022 with 3D Depth Cameras Leveraging NVIDIA Jetson Edge AI and Isaac Robotics Platforms

Leopard Imaging Inc. a global leader in high-definition embedded camera design and manufacturing, and an Elite Partner of Nvidia Jetson Platform, is announcing its plans for the Consumer Electronics Show (CES) 2022 from January 5th to 8th showcasing advanced imaging solutions and AI edge computing solutions. The company will exhibit demos of 3D Depth Camera Hawk on the Jetson Edge AI and Isaac Robotics Platforms. As an imaging solution development veteran, Leopard Imaging will exhibit customized cameras for autonomous driving, drones, IoT, robotics, and AI edge computing devices at CES 2022. The company will exchange ideas with its partners, industry experts, and customers to develop more advanced imaging solutions.

In November, Leopard Imaging collaborated with NVIDIA launching Hawk 3D Depth stereo camera LI-AR0234CS-STEREO-GMSL2, supporting NVIDIA Isaac Robotics platform and NVIDIA Jetson platform, and taking camera solutions to the next level. Leopard Imaging empowers the imaging quality with Active Alignment (AA) technology through its powerful manufacturing capabilities. Its full integration services will help customers incorporate this camera with different robotic projects.

AAEON Introduces the UP Squared 6000 Embedded Computing Platform

UP Bridge the Gap, a brand belonging to AAEON, a leading manufacturer of AI Edge hardware solutions, is excited to announce the new UP Squared 6000 is available for pre-order and will start shipping in February 2022. UP Squared 6000 is the newest addition to the extensive UP Squared lineup. It brings greater expandability and performance over previous generations and is available as both a board and compact edge system.

Based on the latest Intel Atom x6000E Series and Intel Pentium and Intel Celeron N and J Series processors (formerly Elkhart Lake), UP Squared 6000 offers up to 1.7x better compute performance and twice the performance for 3D graphics compared with the previous generation. With a flexible I/O loadout and powerful computing capabilities, the UP Squared 6000 is an astonishingly power-efficient platform.

Cincoze Introduces Wide-Angle FHD Sunlight-Readable Display Modules

Rugged embedded computer brand Cincoze announces the launch of three new 16:9 widescreen sunlight-readable display modules in 15", 21", and 24" to extend the CRYSTAL product line of industrial PCs and monitors. The 16:9 widescreen sunlight-readable display modules boast vivid colors, high brightness, responsive touch, and industrial-grade rugged design. The modules are ideal for IoT and smart cities, and they are the first choice for HMI applications such as vehicle charging piles, outdoor kiosks, and self-service platforms.

The Cincoze sunlight-readable display module lineup currently includes 8" to 19" 4:3 modules, and the newly added 15", 21", and 24" 16:9 modules provide a more comprehensive range of size options. The new modules inherit the design concepts of the CRYSTAL series, including the patented convertible display system (CDS) modular system. CDS enables the addition of a P2000/P1000 series embedded system module to create a sunlight-readable panel PC or the addition of the M1000 series display module to create a sunlight-readable industrial monitor. Multiple and flexible solutions to facilitate future upgrades and maintenance.

ASUS Enters the Kitchen Gadget Space With the PureGo PD100

Normally we wouldn't really cover kitchen gadgets, but Asus has just launched its PureGo PD100 in the US market and it's the company's first entry in this market space. However, it's also an "IoT" gadget, as it features Bluetooth connectivity and an app, as well as wireless charging.

At this point, you're probably wondering what the heck it is though, well, ASUS calls it a "Fruit and Vegetable Cleanliness Detector". In reality, it appears to be a sensor that detects pesticides and other "harmful" pollutants in water. In other words, you have to fill up your sink, wash your fruit or vegetables, then plop the PD100 in the water to tell you how dirty the water is. The idea is that you replace the dirty water with clean water until the device tells you that there's no more pollutants in the water. At $199.99 it's hard to see how this is going to be a big seller for ASUS, but maybe it'll be this year's gift from tech people to their loved ones.

Global OSAT Revenue for 3Q21 Reaches US$8.89 Billion Thanks to Peak Season Demand, Says TrendForce

As the global vaccination rate rose, and border restrictions in Europe and North America eased, social activities also began to enter a period of recovery, with the consumer electronics market seemingly ready for the arrival of the traditional peak season in 2H21, according to TrendForce's latest investigations. At the same time, however, the global supply chain was affected by delays in maritime transport, skyrocketing shipping costs, and component shortages, in addition to already-prohibitive price hikes for certain components in 1H21. Given the parallel rise in both material and manufacturing costs, the market for end products has not undergone the expected cyclical upturn in 2H21. Even so, the overall demand for and shipment of smartphones, notebook computers, and monitors experienced QoQ increases in 3Q21, thereby driving up businesses for major OSAT (outsourced semiconductor assembly and test) companies. For 3Q21, the revenues of the top 10 OSAT companies reached US$8.89 billion, a 31.6% YoY increase.

ADATA Industrial Unveils New Upgraded IM2P33E8 PLP PCIe Gen3x4 M.2 2280 Solid State Drive

ADATA Technology, a leading manufacturer of high-performance DRAM modules, NAND Flash products, and mobile accessories today announces the new upgraded ADATA IM2P33E8 PLP PCIe Gen3x4 M.2 2280 solid state drive (SSD) with Power Loss Protection (PLP) technology. Since its launch in 2019, the IM2P33E8 has been recognized by industry insiders and customers involved in 5G, IoT, cloud, AI and other industrial applications for its excellent performance, high capacities, and comprehensive data security mechanism.

In order to meet the requirements of industrial applications in the era of 5G, IoT, Cloud, AI, and big data analytics, ADATA is offering an SSD that is able to operate for longer after power outages and reduce the misidentification of bad blocks. This was achieved by the inclusion of tantalum polymer capacitors to the IM2P33E8 PLP. Tantalum polymer capacitors have the ability to reduce the detriment caused by power outages, most notably data loss.

NFC Forum Releases Wireless Charging Specification 2.0

The NFC Forum, the global standards and advocacy association for Near Field Communication (NFC) technology, announced today that its Board of Directors approved and adopted the Wireless Charging Specification (WLC) 2.0. The WLC 2.0 makes it easier and more convenient to charge low-power devices such as wireless earbuds, smart watches, digital stylus pens, headsets, fitness trackers and other consumer products using smartphones and other NFC-enabled devices at a power transfer rate of up to one watt. It allows for wireless charging by enabling a single antenna in an NFC-enabled device to manage both communications and charging.

What's new with WLC 2.0 is that it supports even smaller antenna sizes expanding the range of small, battery-powered consumer and IoT devices that can be wirelessly charged using smartphones and other NFC-enabled devices. This is transformative for device manufacturers and solution providers because it allows for the design of smaller, lighter and more affordable wireless products. In addition, the NFC Forum estimates that the majority of mobile phones are interoperable with the extra small antennas covered in WLC 2.0.

ADATA Industrial Launches Industrial-Grade DDR5 Memory

ADATA Industrial, a leading manufacturer of high-performance DRAM modules, NAND Flash products, and mobile accessories today announces the launch of a new generation of industrial-grade DDR5 memory modules that offer a major leap forward in performance. They are geared toward assisting the development of 5G, AI, Edge Computing, High-Performance Computing, Automated Vehicles, and Smart Healthcare, to name a few.

According to Yole Developments, DDR5 memory shipments will exceed DDR4 by 2023 and DDR5 sales will account for 90% of the market by 2026. DDR5 will be the undisputed standard of the future and a key component of 5G, AIoT, and other applications. To meet the future demands of its customers, ADATA has unveiled a slew of DDR5 memory modules, including U-DIMM and SO-DIMM variants. The modules utilize select high-quality ICs straight from the manufacturer and will come with capacities of 8 GB and above. Compared with DDR4, DDR5 has twice the bandwidth and offers higher frequencies of up to 4800 MHz. What's more, they operate on just 1.1 V for improved energy efficiency.

Innodisk Announces Industrial-Grade PCIe 4.0 SSDs for 5G and AIoT Infrastructure

5G and AIoT need more speed and more capacity. And PCIe 4.0 delivers, doubling the speed of PCIe 3.0 and providing the much-needed performance boost to keep pace with innovation and industry trends. Not only speed and capacity, but tolerance of wide-range temperature is also crucial. Consumer-grade products aren't tough enough to withstand the high temperatures of outdoor and industrial settings, so Innodisk is introducing the first industrial-grade PCIe 4.0 SSDs built to handle those challenging conditions.

PCIe 4.0 increases the maximum capacity to 4 TB, doubles the bandwidth, and raises the speed to 16 GT/s which is twice that of PCIe Gen3. Although third-generation PCIe offered only modest speed increases over the popular SATA III for storage applications, it did provide the much sought-after advantages of full forward and backward compatibility. PCIe 4.0 retains that coveted compatibility while also adding noticeable speed increases.

TEAMGROUP Releases Innovative Technology Solutions for Industrial Control to Meet Demands of High-Speed Computing

Leading global memory brand TEAMGROUP has been expanding in the industrial field for many years. Today, the company launched multiple industrial-grade innovative technology solutions, including the M.2 SATA SSD S750-M80, the mSATA SSD S750-3A, and the DDR4 WT DIMM product series. They feature a graphene cooling solution patented in the U.S. (Patent No. US 11,051,392 B2) and Taiwan (Patent No. I703921) to deliver the industry's best performance and heat dissipation technology. Utilizing this novel technology, TEAMGROUP is doubling down on high-speed 5G computing, on-board computing, AIoT, and edge computing applications. Every industrial product from TEAMGROUP has passed military-grade testing standards for shock (MIL-STD-202G and MIL-STD-883K) and vibration resistance (MIL-STD-810G), guaranteeing stability and durability to overcome the extreme conditions of industrial applications.

Revenue of Top 10 IC Design (Fabless) Companies Reaches US$29.8 Billion for 2Q21, Though Growth May Potentially Slow in 2H21, Says TrendForce

In view of the ongoing production capacity shortage in the semiconductor industry and the resultant price hike of chips, revenue of the top 10 IC design companies for 2Q21 reached US$29.8 billion, a 60.8% YoY increase, according to TrendForce's latest investigations. In particular, Taiwanese companies put up remarkable performances during this period, with both MediaTek and Novatek posting YoY growths of more than 95%. AMD, on the other hand, experienced a nearly 100% YoY revenue growth, the highest among the top 10.

TrendForce indicates that the ranking of the top five companies for 2Q21 remained unchanged from the previous quarter, although there were major changes in the 6th to 10th spots. More specifically, after finalizing its acquisition of Inphi, Marvell experienced a major revenue growth and leapfrogged Xilinx and Realtek in the rankings from 9th place in 1Q21 to 7th place in 2Q21.

Western Digital Reimagines The Hard Drive with OptiNAND Technology

At the company's HDD Reimagine event today, Western Digital Corp. (NASDAQ: WDC) introduced a new flash-enhanced drive architecture that breaks traditional boundaries of storage. Building on the company's unique ability to innovate with HDD and flash, the new storage architecture with OptiNAND technology optimizes and integrates HDDs with iNAND embedded flash drives. This gives customers - like hyperscale cloud, CSPs, enterprises, smart video surveillance partners, NAS suppliers and more - a solution to meet the exponential growth in data creation by delivering the capacity, performance and reliability needed to store vast amounts of data today and well into the future.

Leveraging industry-first technologies including triple-stage actuator (TSA) and HelioSeal technology, the first products featuring the new drive architecture will deliver an unsurpassed 2.2 TB per platter, extending capacities gains on proven ePMR technology. Setting a new industry milestone, Western Digital has shipped samples of new nine-disk, 20 TB ePMR flash-enhanced drives with OptiNAND technology to select customers.

Tachyum Boots Linux on Prodigy FPGA

Tachyum Inc. today announced that it has successfully executed the Linux boot process on the field-programmable gate array (FPGA) prototype of its Prodigy Universal Processor, in 2 months after taking delivery of the IO motherboard from manufacturing. This achievement proves the stability of the Prodigy emulation system and allows the company to move forward with additional testing before advancing to tape out.

Tachyum engineers were able to perform the Linux boot, execute a short user-mode program and shutdown the system on the fully functional FPGA emulation system. Not only does this successful test prove that the basic processor is stable, but interrupts, exceptions, timing, and system-mode transitions are, as well. This is a key milestone, which dramatically reduces risk, as booting and running large and complex pieces of software like Linux reliably on the Tachyum FPGA processor prototype shows that verification and hardware stability are past the most difficult turning point, and it is now obvious that verification and testing should successfully complete in the coming months. Designers are now shifting their attention to debug and verification processes, running hundreds of trillions of test cycles over the next few months, and running large scale user mode applications with compatibility testing to get the processor to production quality.

All Team Group Industrial Products Pass Military-Grade Certification

Leading memory provider TEAMGROUP today announced that all of its industrial storage products have passed military standards testing for shock and vibration resistance. The company's unique graphene-coated copper heatsink was also awarded a U.S. utility patent and is the world's first heat sink to be used for industrial SSDs. In response to the growing Artificial Intelligence of Things (AIoT) and edge computing trends, TEAMGROUP continues to improve the durability, reliability, and safety of its industrial products, striving to create innovative solutions in the field of industrial control.

TEAMGROUP's industrial product series, including industrial memory modules, SSDs and memory cards, have all been tested and certified to meet military shock (MIL-STD-202G and MIL-STD-883K) and vibration (MIL-STD-810G) standards. Whether focused on edge computing or 5G related applications, these products are guaranteed to handle high-speed data processing and computing for long periods of continuous operation. TEAMGROUP has once again proven the stability and durability of its industrial products, which meet the demanding needs for data security and industrial control in extreme conditions.

Zyxel Communications Unveils New WiFi 6 Mesh Product Line

Zyxel Communications today announced the upcoming launch of a new WiFi 6 series, the DX3300, DX3301, EX3300, EX3301 and WX3100. The series includes a complete portfolio of DSL/Ethernet Gateways/IADs along with an extender. This new offering will be one of Zyxel's most cost-competitive product series for migration to WiFi 6 Mesh and is a great choice for service providers who want to offer these capabilities under an existing copper or fiber infrastructure.

"With the steady growth of IoT applications and connected appliances in households, customer demand for super-fast and reliable WiFi is immense," said James Harris, Senior Product Director for Zyxel Communications in EMEA. "This WiFi 6 Mesh series is giving service providers the opportunity to provide their customers with superior WiFi service on all their devices - anywhere in their home."

HiSilicon Develops RISC-V Processor to Move Away from Arm Restrictions

Huawei's HiSilicon subsidiary, which specialized in the design and development of semiconductor devices like processors, has made a big announcement today. A while back, the US government has blacklisted Huawei from using any US-made technology. This has rendered HiSilicon's efforts of building processors based on Arm architecture (ISA) practically useless, as the US sanctions applied to that as well. So, the company had to turn to alternative technologies. Today, HiSilicon has announced the new HiSilicon Hi3861 development board, based on RISC-V architecture. This represents an important step to Huawei's silicon independence, as RISC-V is a free and open-source ISA designed for all kinds of workloads.

While the HiSilicon Hi3861 development board features a low-power Hi3861 chip, it is the company's first attempt at building a RISC-V design. It features a "high-performance 32-bit microprocessor with a maximum operating frequency of 160 MHz". While this may sound very pale in comparison to the traditional HiSilicon products, this chip is used for IoT applications, which don't require much processing power. For tasks that need better processing, HiSilicon will surely develop more powerful designs. This just represents an important starting point, where Huawei's HiSilicon moves away from Arm ISA, and steps into another ISA design and development. This time, with RISC-V, the US government has no control over the ISA, as it is free to use by anyone who pleases, with added benefits of no licensing costs. It is interesting to see where this will lead HiSilicon and what products the company plans to release on the new ISA.

Think Silicon and Ambiq Enable Ultra-Low Power IoT Devices with Smartphone-Class, 3D-Like Graphics

Think Silicon S.A., the leading provider of ultra-low power GPU IP for embedded systems, and Ambiq, a technology leader recognized in ultra-low power microcontrollers (MCU), System-on-Chips (SoC) and Real-time Clocks (RTC), today announced the companies are working together to bring high-end graphics capabilities to designers of everyday wearable devices.

To provide high-performance, low-power graphics, Ambiq's newest Apollo4 SoC family now incorporates Think Silicon's NEMA |pico GPU and NEMA |dc display controller IP. The Apollo4 SoC family is the fourth-generation processor solution built upon Ambiq's proprietary Subthreshold Power-Optimized Technology (SPOT ) platform. The Apollo4's complete hardware and software solution enables the battery-powered endpoint devices of tomorrow to achieve a higher level of intelligence without sacrificing battery life. The Apollo4 is purpose-built to serve as both an application processor and a coprocessor for battery-powered endpoint devices, including smartwatches, children's watches, fitness bands, animal trackers, far-field voice remotes, predictive health and maintenance devices, smart security devices, and smart home devices.
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