ASUS today announced Blue Cave, a stunningly designed high-performance AC2600 Wi-Fi router based on Intel's connected home technology that's built to meet the demanding needs of modern smart homes. Winner of a 2017 Computex Best Choice Golden Award, Blue Cave is an easy-to-use, innovatively designed router with stylish good looks and family-friendly features. It's built to cope easily with the increasingly complex and bandwidth-heavy demands of smart home networks, offering superb multi-device performance powered by the Intel Home Wi-Fi chipset, comprehensive commercial-grade security with ASUS AiProtection, and out-of-the-box IoT integration with Amazon Alexa and IFTTT.

"Combining years of ASUS experience in wireless innovation and Intel's connected home technology, Blue Cave delivers ultrafast Wi-Fi speeds throughout the home," said Tenlong Deng, General Manager, ASUS Networking and Wireless Devices Business Unit. "Not only powerful, its eye-catching design with no external antennas blends perfectly with any décor."

SolidRun, a leading developer and manufacturer of high-performance embedded solutions, and edge computing platforms, today announced support for the public beta of Google Cloud IoT Core, a fully managed service on Google Cloud Platform (GCP) to securely connect and manage IoT devices at scale. Cloud IoT Core is now publicly available to all users in beta, including new features and pricing plan. With Cloud IoT Core, businesses can easily connect and centrally manage millions of globally dispersed IoT devices. When used as part of the broader Google Cloud IoT solution, it can ingest all IoT data and connect to Google Cloud's state of the art analytics services including Cloud Pub/Sub, Dataflow, Bigtable, BigQuery, and Machine Learning.

The MACCHIATObin ClearCloud 8K, is based on a Marvell ARMADA A8040 SoC, and features a quad core Arm Cortex A-72 1.6GHz processor, including 4GB DDR4 DIMM memory (16GB optional), dual 10GbE, microSD connectors, 3 x SATA 3.0, USB 3.0 and PCIe x4 3.0 slot. SolidRun's MACCHIATObin ClearCloud 8K with Google's Cloud IoT Core allows users to easily and securely connect to GCP. The solution has been developed in collaboration with Sartura Ltd., a leading specialized open source developer and integrator for embedded applications, in conjunction with Marvell.

Energous Corporation, the developer of WattUp, a revolutionary wire-free, power-at-a-distance charging technology, today announced Federal Communications Commission (FCC) certification of its first-generation WattUp Mid Field transmitter, which sends focused, RF-based power to devices at a distance. As the first FCC certification for power-at-a-distance wireless charging under Part 18 of the FCC's rules, this development represents a new era of wireless charging, and opens up a tremendous opportunity for the electronics industry.

Energous' WattUp Mid Field transmitter underwent rigorous, multi-month testing to verify it met consumer safety and regulatory requirements. As the first Part 18 FCC approved power-at-a-distance wireless charging transmitter, the certification marks a significant milestone for the consumer electronics industry and paves the way for future wireless charging ubiquity for nearly any small electronic device, including smartphones, tablets, fitness trackers, smart watches, earbuds, wireless keyboards and mice, smart speakers and more.

Samsung Electronics Co. Ltd. today announced Open Connectivity Foundation (OCF) 1.3 certification for the Samsung ARTIK 05x series of modules, the first system-on-module family to be certified using new OCF standards for trust and connectivity for IoT. With the ARTIK 05x series, companies can quickly build Wi-Fi enabled edge products that meet OCF standards for interoperability, and take advantage of the ARTIK platform's built-in hardware and software solutions to ensure reliability, safety and privacy for connected products.

The OCF certification program ensures companies can create products that work seamlessly with other OCF certified IoT devices regardless of their form factor, operating system or service providers. OCF 1.3 certification assures interoperability with OCF specific testing and certification, improving time-to-market, and enhancing the customer experience.

Toshiba Corporation, Toshiba Memory Corporation, and Western Digital Corporation have entered into a global settlement agreement to resolve their ongoing disputes in litigation and arbitration, strengthen and extend their relationship, and enhance the mutual commitment to their ongoing flash memory collaboration.

As part of this agreement, TMC and Western Digital will participate jointly in future rounds of investment in Fab 6, the state-of-the-art memory fabrication facility now under construction at Yokkaichi, including the upcoming investment round announced by Toshiba in October 2017. Fab 6 will be entirely devoted to the mass production of BiCS FLASH, the next-generation of 3D flash memory, starting next year. TMC and Western Digital similarly intend to enter into definitive agreements in due course under which Western Digital will participate in the new flash wafer fabrication facility which will be constructed in Iwate, Japan.

The parties will strengthen their flash memory collaboration by extending the terms of their joint ventures. Flash Alliance will be extended to December 31, 2029 and Flash Forward to December 31, 2027. Flash Partners was previously extended to December 31, 2029.

Axiomtek, one of the world's leading design and manufacturing companies of innovative, high performance and reliable PC-based industrial computer products, is proud to announce the launch of the eBOX560-512-FL, an embedded system powered by Intel Core i5-7300U or Celeron 3965U processors. The ultra-compact computer is packed with features in its small IP40 aluminum and steel enclosure. It offers scalable computing performance; rich graphical capabilities that support dual independent display of up to 4K resolution; flexible communication options; and thoughtful design that offers versatility and values for Industrial Internet of Things use. The system is made for smart factory automation, digital signage and smart retail applications or any applications that require a good balance of a high performance industrial-grade computer and a good price point - with space-serving design and rich features.

The eBOX560-512-FL comes with many communications options such as four USB 3.0 ports, two RS-232/422/485 ports, two Gigabit Ethernet ports, one PCI Express Mini Card slot and two antenna. This tiny embedded PC offers two HDMI ports, a lockable 12 VDC power input with power protection feature and a user-friendly AT/ATX DIP switch for adjustments between automatic and manual operation control. The eBOX560-512-FL has 2.5" SATA HDD and one mSATA for data storage, and one 260-pin DDR4-2133 SO-DIMM socket with up to 16 GB system memory. It is compatible with Windows 10 IoT and supports Axiomtek's exclusive AXView 2.0 software for smart device monitoring and remote management for IoT applications. For flexible mounting options, this fanless rugged embedded platform is compatible with a wall mount, a VESA mount and a DIN-rail mount.

VIA Technologies, Inc., today announced the launch of the VIA ARTiGO A630, an ultra-slim fanless gateway system with flexible customization options for a broad spectrum of commercial M2M and IoT applications. Featuring a high-performance 1.0GHz VIA Cortex-A9 dual-core SoC, multiple network connectivity options, and a rich combination of I/O, the VIA ARTiGO A630 adds a cost-effective solution to the growing range of VIA Enterprise IoT gateway devices designed to manage the connection and control for a wide spectrum of connected HMI and automation applications.

"The VIA ARTiGO A630 bolsters our already diverse range of ARTiGO Series M2M and IoT gateway systems," said Richard Brown, VP International Marketing, VIA Technologies, Inc. "Providing a rich mix of connectivity and performance in an ultra-compact design that can be rapidly customized, will help customers speed time-to-market and unlock the full potential of their IoT deployments."

QNAP today launched the all-new QBoat Sunny, a small and powerful single-board Internet of Things (IoT) mini server for IoT developers. QBoat Sunny can connect to versatile IoT development boards, devices and applications, and be used as a server for small-scale/private IoT applications, or a fog computing node/gateway in large-scale/public IoT environments. The high-performance QBoat Sunny can save significant bandwidth fees and cloud computing costs for developers, and integrate into various usage scenarios.

QBoat Sunny provides unprecedented processing and storage performance with its Annapurna Labs AL-314 processor, 2 GB RAM and two M.2 SATA SSD slots (2260 and 2280 lengths). In addition, QBoat Sunny is equipped with three 1000BASE-T ports, two USB 3.1 Gen 1 Type A ports, and a M.2 slot for wireless module installation (2230 length). QBoat Sunny utilizes QTS Lite, a lightweight version of QNAP's award-winning QTS operating system. QTS Lite not only preserves core functionality of QTS (including File Station, Storage Manager, Network & Virtual Switch and App Center) but also provides Container Station and QIoT Suite Lite for IoT developers. QBoat Sunny offers great hardware/software performance and expandability for building versatile IoT scenarios to streamline development and make IoT more accessible and fun for everyone.

Today TDK Corporation (President: Shigenao Ishiguro) announced the gradual launch of SD Memory cards (MMRD4 series) and microSD Memory cards (MURD4 series) from January 2018. Both series support UHS-I for industrial application. The rapid progression of IoT has increased demand for smaller SD/microSD Memory cards with low power consumption for the storage of sensor information. However, as SD/microSD Memory cards for general use adopt TLC and MLC type flash memory to reduce costs, they are largely unsuitable for industrial application in terms of durability and reliability.

The MMRD4 and MURD4 series consist of highly reliable SD/microSD Memory cards equipped with very durable SLC/pSLC flash memory as well as the newly developed SD controller, TDK GBDriverRD4. In addition to data retention capacity and durability, the cards feature robust data security in the event of power interruption, ensuring safe usage in IoT devices that are often turned off to conserve power.

Compulab announces immediate availability of fitlet2. Based on Intel Atom x7-E3950 Processor (Apollo-Lake) with up to 16 GB RAM and storage options ranging from eMMC to 2.5" SSD, fitlet2 is one of the most versatile miniature PCs for IoT. fitlet2 functionality can be further extended with Compulab 2nd generation Function and Connectivity Extension T-Cards (FACET Cards). Like all other Compulab mini-PCs, fitlet2 is completely fanless, available at wide temperature range and is sold with 5 year warranty.

Miniature fanless design
fitlet2 measures only 112 mm by 84 mm, making it one of the smallest full-featured PCs on the market. An all-metal die-cast housing is used for fanless passive heat dissipation. There are several optional versions of the housing including low-profile 25mm and an industrial top cover for direct-mounting.