KIOXIA America, Inc. will showcase a prototype broadband SSD with an optical interface for next-generation data centers at the FMS: the Future of Memory and Storage conference, being held in Santa Clara, California from August 6 to August 8. By replacing the electrical wiring interface with an optical interface, this SSD technology allows for greater physical distance between the compute and storage devices, slims down wiring and delivers high flexibility to data center system designs and applications—all while maintaining energy efficiency and high signal quality.

By adopting an optical interface, it becomes possible to aggregate individual components that make up systems, such as SSDs and CPUs, and seamlessly interconnect them. This furthers the evolution of a disaggregated computing system that can efficiently utilize resources according to a specific workload. Additionally, with its high signal integrity, the optical interface may enhance high-performance compute (HPC) environments, such as in supercomputers, cloud based-HPC and even applications in outer space.

SK hynix is reportedly developing 400-layer NAND flash memory, with plans to begin mass production by late 2025. The company is collaborating with supply chain partners to develop the necessary process technologies and equipment for 400-layer and higher NAND chips. This information comes from a recent article by Korean media outlet etnews citing industry sources.

SK hynix intends to use hybrid bonding technology to achieve this, which is expected to bring new packaging materials and components suppliers into the supply chain. The development process involves exploring new bonding materials and various technologies for connecting different wafers, including polishing, etching, deposition, and wiring. SK hynix aims to have the technology and infrastructure ready by the end of next year.

Kioxia Corporation, a world leader in memory solutions, today announced that the building construction of Fab2 (K2) of its industry-leading Kitakami Plant was completed in July. K2 is the second flash memory manufacturing facility at the Kitakami Plant in the Iwate Prefecture of Japan. As demand is recovering, the company will gradually make capital investments while closely monitoring flash memory market trends. Kioxia plans to start operation at K2 in the fall of Calendar Year 2025.

In addition, some administration and engineering departments will move into a new administration building located adjacent to K2 beginning in November 2024 to oversee the operation of K2. A portion of investment for K2 will be subsidized by the Japanese government according to the plan approved in February 2024.

Kioxia Corporation, a world leader in memory solutions, today announced that it started sample shipments of 2 Tb (Tera bit) Quad-Level-Cell (QLC) memory devices with its eighth-generation BiCS FLASH 3D flash memory technology. This 2 Tb QLC device has the highest capacity in the industry, elevating storage devices to a new capacity point that will drive growth in multiple application segments including AI.

With its latest BiCS FLASH technology, Kioxia has achieved both vertical and lateral scaling of memory die through proprietary processes and innovative architectures. In addition, the company has implemented the groundbreaking CBA (CMOS directly Bonded to Array) technology, which enables the creation of higher density devices and an industry-leading interface speed of 3.6 Gbps. Together, these advanced technologies are applied in the creation of 2 Tb QLC, resulting in the industry's highest capacity memory device.

Kioxia presented a technology roadmap at the IWM 2024 conference in Seoul, projecting the development of 1,000-layer 3D NAND by 2027. This ambitious goal is based on extrapolating past trends, which saw NAND layers increase from 24 in 2014 to 238 in 2022. Kioxia's plan involves not only increasing layer count but also shrinking cell size and increasing bit levels from TLC (3 bits per cell) to QLC (4 bits per cell), and possibly even to PLC (5 bits per cell).

However, these advancements come with significant technical challenges. Etching the vertical connecting holes (through-silicon vias or TSVs) are harder to achieve and can lead to higher channel resistance. Kioxia proposes solutions such as using single-crystalline silicon instead of polysilicon and switching from tungsten to molybdenum to reduce resistance. They also suggest moving to multi-lane wordlines to reduce the die area needed for electrical connectivity.

Kioxia Corporation, a world leader in memory solutions, today announced that KIOXIA PCIe 5.0 NVMe SSDs have been successfully tested for compatibility and interoperability with the Xinnor, Ltd. ("Xinnor") RAID solution and achieved up to 25x higher performance running PostgreSQL than software RAID solutions with the same hardware configuration. This solution will be demonstrated in the KIOXIA booth at COMPUTEX TAIPEI, which is being held from June 4 to June 7. PostgreSQL (with the pgvector extension) and vector databases are becoming more important for generative AI and RAG (Retrieval Augmented Generation) systems than before, and these results demonstrate the performance gains utilizing Xinnor's xiRAID Opus and KIOXIA PCIe 5.0 NVMe SSDs solution for a generative AI and RAG application.

New servers with the PCIe 5.0 interface and corresponding high-speed SSDs are in demand for high performance applications, such as generative AI, and the importance of PCIe 5.0-compatible SSDs to support this demand is increasing. The Kioxia and Xinnor high performance software RAID solution maximizes the performance of PCIe 5.0 SSDs for AI, Machine Learning (ML), and data analytics applications in on-premises enterprise data centers. KIOXIA CM7 Series SSDs successfully completed compatibility testing performed by both parties.

MSI also brought plenty of SSD products to the Computex 2024 show, including the new SPATIUM M560 PCIe 5.0 NVMe M.2 SSD based on the Phison E31T controller and Kioxia's 218-layer BiCS 3D TLC NAND, the new SPATIUM non-metal Vapor Chamber SSD Thermal Solution, and a couple of SSD accessories, including the DATAMAG Magnetic Portable SSD and the DATAVAULT SSD Enclosure.

As said, the new SPATIUM M560 PCIe 5.0 NVMe M.2 SSD will use the Phison 7 nm E31T controller paired up with Kioxia 8th generation 218-layer BiCS 3D TLC NAND and offer transfer rates of up to 10,000 MB/s. The controller, according to MSI, should bring up to a 15 percent reduction in power consumption as well as "maximize bandwidths and link efficiency". It will be available in 1 TB, and 2 TB capacities, and MSI will probably have a version that will include the new SPATIUM non-metal Vapor Chamber SSD Thermal Solution which has been also showcased at the Computex 2024 show. MSI says that this is yet another world's first, which uses "a two-phase flow transition of gas and liquid with minimal signal interference, ensuring rapid and silent heat exchange." According to MSI, the new SPATIUM non-metal Vapor Chamber SSD Thermal Solution should provide up to 11 degrees lower temperature compared to a standard aluminium heatsink.

TrendForce reports that a reduction in supplier production has led to unmet demand for high-capacity orders since 4Q23. Combined with procurement strategies aimed at building low-cost inventory, this has driven orders and significantly boosted enterprise SSD revenue, which reached US$3.758 billion in 1Q24—a staggering 62.9% QoQ increase.

TrendForce further highlights that demand for high-capacity, driven by AI servers, has surged. North American clients increasingly adopt high-capacity QLC SSDs to replace HDDs, leading to over 20% growth in Q2 enterprise SSD bit procurement. This has also driven up Q2 enterprise SSD contract prices by more than 20%, with revenue expected to grow by another 20%.

TrendForce reports that adoption of enterprise SSDs by AI servers began in February, which subsequently led to large orders. Additionally, PC and smartphone customers have been increasing their inventory levels to manage rising prices. This trend drove up NAND Flash prices and shipment levels in 1Q24 and boosted quarterly revenue by 28.1% to US$14.71 billion.

There were significant changes in market rankings this quarter, with Micron overtaking Western Digital to claim the fourth spot. Micron benefited from slightly lower prices and shipments than its competitors in 4Q23, resulting in a 51.2% QoQ revenue growth to $1.72 billion in 1Q24—the highest among its peers.

Sabrent today debuted the Rocket 4 line of DRAMless M.2 NVMe Gen 4 SSDs. Built in the M.2-2280 form-factor, these drives take advantage of the PCI-Express 4.0 x4 host interface, and provide sequential transfer speeds of up to 7.4 GB/s reads, with up to 6.4 GB/s writes. The drives also offer 4K random access performance of up to 1 million IOPS reads, and 0.95 million IOPS writes. For now, Sabrent is launching 1 TB and 2 TB capacity variants of the Rocket 4, but the company is preparing to launch a larger 4 TB variant soon.

The Sabrent Rocket 4 combines a Phison E27T series DRAMless controller with Kioxia 162-layer 3D TLC NAND flash memory (also known as the BiCS 6). There's just a copper foil heat spreader to keep things cool. The 12 nm E27T doesn't run anywhere near as hot as the E18, so you can make do with the heatsink your motherboard includes, or run it the way it is. The 1 TB variant is priced at $99.99, and the 2 TB variant at $199.99. The company didn't reveal pricing of the unreleased 4 TB variant.

TrendForce reports that anticipation of NAND Flash price hikes into Q2 has motivated certain suppliers to minimize losses and lower costs in hopes of returning to profitability this year. Kioxia and WD led the charge from March, boosting their capacity utilization rates to nearly 90%—a move not widely adopted by their competitors.

TrendForce points out that to meet the demand surge in the second half of the year, especially given Kioxia and Western Digital's currently low inventory, the production increase is mainly targeting 112-layer and select 2D products. This strategy is expected not only to secure profitability within the year but also to contribute to a projected 10.9% rise in the annual NAND Flash industry supply bit growth rate for 2024.

With the effective reduction of production by suppliers, the price of memory is rebounding, and the semiconductor memory market finally shows signs of recovery. From the perspective of market dynamics and demand changes, NAND Flash, as one of the two major memory products, is experiencing a new round of changes. Since 3Q23, NAND Flash chip prices have been on the rise for several consecutive months. TrendForce believes that, under the precondition of a conservative market demand prospect for 2024, chip price trends will depend on suppliers' production capacity utilization.

There have been frequent developments in the NAND flash memory industry chain, with some manufacturers indicating a willingness to raise prices or increase production capacity utilization. Wallace C. Kou, General Manager of NAND Flash Supplier SIMO, stated that prices for the second quarter of NAND Flash have already been settled down, which will increase by 20%; some suppliers have started to make profits in the first quarter, and most suppliers will earn money after the second quarter.

Intel Corporation today announced that Stacy Smith, executive chairman of Kioxia Corporation, formerly Toshiba Memory Corporation, and chair of Autodesk Inc., was appointed to Intel's board of directors, effective immediately. Smith will serve as an independent director and join the board's Audit & Finance Committee.
"Stacy's deep understanding of the semiconductor industry, along with Intel's history and strategy, will be a significant asset to the board as it guides the company's transformation journey," said Frank D. Yeary, chairman of the Intel board. "In particular, Stacy's expertise in finance and leading capital allocation strategies in the capital-intensive semiconductor industry will be additive to Intel's board as the company continues its efforts to create a globally resilient semiconductor supply chain."

Smith, 61, spent nearly 30 years at Intel, serving in a variety of leadership roles. Prior to his retirement in 2018, he served as the group president of manufacturing, operations and sales, leading the company's global Technology and Manufacturing Group and its worldwide sales organization. Prior to this, he spent more than a decade in finance leadership roles, including as chief financial officer. In addition, Smith held the role of chief information officer and, before that, was general manager of Intel Europe, Middle East and Africa (EMEA), where he was responsible for Intel sales and marketing for the EMEA region.

The third quarter of 2023 witnessed suppliers dramatically cutting production, which underpinned enterprise SSD prices. The fourth quarter saw a resurgence in contract prices, driven by robust buying activity and heightened demand from server brands and buoyed by optimistic capital expenditure forecasts for 2024. This, combined with increased demand from various end products entering their peak sales period and ongoing reductions in OEM NAND Flash inventories, resulted in some capacity shortages. Consequently, fourth-quarter enterprise SSD prices surged by over 15%. TrendForce highlights that this surge in demand and prices led to a 47.6% QoQ increase in enterprise SSD industry revenues in 4Q23, reaching approximately $23.1 billion.

The stage is set for continued fervor as we settle into the new year and momentum from server brand orders continues to heat up—particularly from Chinese clients. On the supply side, falling inventory levels and efforts to exit loss-making positions have prompted enterprise SSD prices to climb, with contract prices expected to increase by over 25%. This is anticipated to fuel a 20% revenue growth in Q1.

TrendForce reports a substantial 24.5% QoQ increase in NAND Flash industry revenue, hitting US$11.49 billion in 4Q23. This surge is attributed to a stabilization in end-demand spurred by year-end promotions, along with an expansion in component market orders driven by price chasing, leading to robust bit shipments compared to the same period last year. Additionally, the corporate sector's continued positive outlook for 2024 demand—compared to 2023—and strategic stockpiling have further fueled this growth.

Looking ahead to 1Q24, despite it traditionally being an off-season, the NAND Flash industry is expected to see a continued increase in revenue by another 20%. This anticipation is underpinned by significant improvements in supply chain inventory levels and ongoing price rises, with clients ramping up their orders to sidestep potential supply shortages and escalating costs. The ongoing expansion of order sizes is expected to drive NAND Flash contract prices up by an average of 25%.

Japan's Jiji news agency has cottoned onto a major computer memory industry rumble—a Friday Reuters report suggests that Kioxia has offered an olive branch to SK Hynix, perhaps in a renewed push to get its proposed (and once rejected) merger with Western Digital over the finishing line. The South Korean memory manufacturing juggernaut took great issue with the suggested formation of a mighty Japanese-American 3D NAND memory chip conglomerate—SK Hynix's opposition reportedly placed great pressure on Western Digital (WD), and discussions with Kioxia ended last October.

Kioxia is seemingly eager to resume talks with WD, but requires a thumbs up from SK Hynix—according to Jiji's insider source(s), the Tokyo-headquartered manufacturer is prepared to offer its South Korean rival a nice non-volatile memory production deal. Kioxia's best Japanese 3D NAND fabrication facilities could play host to SK Hynix designs, although it is too early to tell whether this bid has been accepted. The Yokkaichi and Kitakami plants are set to receive a 150 billion yen Government subsidy—Kioxia and WD's joint venture is expected to move into cutting-edge semiconductor production. The Japanese government is hoping to secure its native operations in times of industry flux.

Kioxia Corporation and Western Digital Corporation announced today that their joint venture manufacturing facilities at Yokkaichi and Kitakami plants have been approved to receive an up to 150 billion yen subsidy, including facilities that will produce its latest generation of 3D flash memory based on the innovative wafer bonding technology and future generation advanced nodes. The subsidy will be granted under a designated government program aimed at facilitating corporate investment in cutting-edge semiconductor production facilities and securing stable production of semiconductors in Japan. This marks the second time that Kioxia's and Western Digital's joint venture manufacturing facilities are receiving this subsidy from the Japanese government. Previously, the joint venture manufacturing facility at Yokkaichi was approved to receive up to 92.9 billion yen subsidy from the Japanese government in 2022.

Leveraging an over 20-year joint venture partnership, Kioxia and Western Digital will continue to enhance the development and production capabilities of cutting-edge flash memory at the Yokkaichi and Kitakami plants in Japan. In addition, the two companies will contribute to the development of semiconductor-related industries and talent.

Today, KIOXIA SSDs took flight with the launch of the NG-20 mission rocket, which is delivering an updated HPE Spaceborne Computer-2, based on HPE EdgeLine and ProLiant servers from Hewlett Packard Enterprise (HPE), to the International Space Station (ISS). KIOXIA SSDs provide robust flash storage in HPE Spaceborne Computer-2 to conduct scientific experiments aboard the space station.

HPE Spaceborne Computer-2, based on commercial off-the-shelf technology, provides edge computing and AI capabilities on board the research outpost as part of a greater mission to significantly advance computing power in space and reduce dependency on communications as space exploration continues to expand. Designed to perform various high-performance computing (HPC) workloads in space, including real-time image processing, deep learning, and scientific simulations, HPE Spaceborne Computer-2 can be used to compute a number of experiment types including healthcare, natural disaster recovery, 3D printing, 5G, AI, and more.

Kioxia Corporation, a world leader in memory solutions, today announced sampling of the industry's first Universal Flash Storage (UFS) Ver. 4.0 embedded flash memory devices designed for automotive applications. These new, higher performing devices deliver fast embedded storage transfer speeds in a small package size and are targeted to a variety of next-generation automotive applications, including telematics, infotainment systems and ADAS. The improved performance] of UFS products from Kioxia - including approximately +100% for sequential read speed and approximately +40% for sequential write speed - enables these applications to take advantage of 5G's connectivity benefits, leading to faster system startup times and a better user experience.

The first to introduce UFS technology, Kioxia continues to move the technology forward. Its new UFS Ver. 4.0 devices integrate the company's innovative BiCS FLASH 3D flash memory and a controller in a JEDEC-standard package. UFS 4.0 incorporates MIPI M-PHY 5.0 and UniPro 2.0 and supports theoretical interface speeds of up to 23.2 Gbps per lane or 46.4 Gbps per device. UFS 4.0 is backward compatible with UFS 3.1.

The PC master race has yielded many interesting activities for enthusiasts alike, with perhaps the pinnacle of activities being overclocking. Usually, subjects for overclocking include CPUs, GPUs, and RAM, with other components not actually being capable of overclocking. However, the enthusiast force never seems to settle, and today, we have proof of overclocking an off-the-shelf 2.5-inch SATA III NAND Flash SSD thanks to Gabriel Ferraz, a Computer Engineering graduate, and TechPowerUp's SSD database maintainer. He uses the RZX Pro 256 GB SSD in the video, a generic NAND Flash drive. The RZX Pro uses the Silicon Motion SM2259XT2 single-core, 32-bit ARC CPU running up to 550 MHz. It has two channels at 400 MHz, each with eight chip enable interconnects, allowing up to 16 NAND Flash dies to operate. The SSD doesn't feature a DRAM cache or support a host memory buffer. It has only one NAND Flash memory chip from Kioxia, uses BiCS FLASH 4 architecture, has 96 layers, and has 256 GB capacity.

While this NAND Flash die is rated for up to 400 MHz or 800 MT/s, it only ran at less than half the speed at 193.75 MHz or 387.5 MT/s at default settings. Gabriel acquired a SATA III to USB 3.0 adapter with a JMS578 bridge chip to perform the overclock. This adapter allows hot swapping of SSDs without the need to turn off the PC. He shorted two terminals in the drive's PCB to get the SSD to operate without its default safe mode. Mass Production Tools (MPTools), which OEMs use to flash SSDs, were used to change the firmware settings. Each NAND Flash architecture has its own special version of MPTools. The software directly shows control of the Flash clock, CPU clock, and output driving. However, additional tweaks like Flash IO driving with subdivisions need modifications. Control and Flash On-Die Termination (ODT) and Schmitt window trigger (referring to the Schmitt trigger comparator circuit) also needed a few modifications to make it work.

KIOXIA brought a handful of its latest data center SSDs to the 2024 International CES. The lineup begins with the CD8P series designed for a balance in data-heat (frequency of access) and capacity, with applications that include CDN, compute, read-intensive use-cases, and data streaming. The drive comes in the 2.5-inch 18 mm U.2 and EDSFF E3.8 form-factors. The CD8P features a PCI-Express 5.0 x4 host interface, and comes in capacities ranging between 1.92 TB, going all the way up to 15.36 TB. Write endurance recommended is between 1 DWPD to 3 DWPD, so this really isn't a major write-intensive drive, for that, you'll need to pay attention to our next drive, the KIOXIA FL6.

The FL6 from KIOXIA is a scribe par none. It's aimed at write heavy applications such as server caching, and the hottest tiers in tiered storage; and Big Iron database machines. The FL6 comes in capacities of up to 3.2 TB, but offers a mammoth 60 DWPD write endurance. It comes in the 2.5-inch 18 mm form factor with PCI-Express 3.0 x4 interface. Security features include SIE, SED, and FIPS 140-2.

Next week at CES 2024, KIOXIA, the inventors of NAND flash, will highlight its extensive portfolio of solid state drives (SSDs) and memory solutions. This diverse lineup - one of the broadest range of flash solutions in the industry - is well-suited to virtually any solution that uses flash and includes new products, form factors and standards designed for upcoming IT requirements.

In today's dynamic technological landscape, where evolving standards push performance boundaries higher and end user expectations continue to climb, KIOXIA stands poised for the future by making the memory to process, manage and store the world's data. "Whether it's designing ultra-thin consumer PCs, enabling the automotive in-vehicle experience or streamlining professional photography - we make flash memory that brings applications to life and enhances user experiences," said Alex Mei, vice president of corporate marketing for KIOXIA America, Inc. "Countless consumer devices and applications rely on KIOXIA technology solutions to enrich lives and make new memories. CES gives us an opportunity to explore new possibilities and showcase the depth and breadth of our solutions."

Plextor, one of the most iconic names in PC storage once known for high performance and quality, has announced it will cease operations. Parent company Kioxia has decided to retire the Plextor brand name for solid state drives (SSDs). Instead, it will market products under its Solid State Storage Technology Corporation (SSSTC) brand going forward. The move comes after Kioxia acquired Plextor and its parent company Lite-On's SSD business back in 2019. Since then, Plextor has struggled to keep pace with new storage technologies. With PCIe Gen 4 and PCIe Gen 5 SSD controllers coming to market, Plextor failed to adopt the new Phison and InnoGrit platforms, instead sticking with Marvell controllers, lagging behind at that time.

Now, SSSTC and Kioxia will strictly focus SSD sales on the enterprise, data center, and industrial segments rather than the consumer market. The Plextor website is already redirecting to SSSTC.com, which no longer lists any drives for client PCs. While current Plextor SSD owners will continue to receive warranty support and RMA services, no new Plextor drives are expected to be released. The company had a history stretching back over 30 years of making top-performing optical disk drives and SSDs. Similarly to OCZ after its acquisition by Toshiba, the Plextor name will now fade into history. But in the fast-moving storage business, companies live and die by their ability to adopt cutting-edge technologies. Hence, companies are always on the edge of their seats, trying to survive.

KIOXIA today released the maximum possible storage capacity for the microSDXC standard of 2 TB, with the release of the Exceria Plus G2 microSDXC 2 TB model. It is also the highest data storage density among any storage device by physical volume. To pull this off, KIOXIA innovated a NAND flash device that stacks sixteen 1 terabit (128 GB) layers, with a Z-height for the package being just 0.8 mm. The card meets UHS Class 3. application class A1, and video class V30, which means an assured write speed of at least 30 MB/s. The company claims maximum sequential read speeds of 100 MB/s, with 90 MB/s maximum write speeds. KIOXIA has initially released the card in its home market of Japan, and hopes to release it in other markets soon.

KIOXIA America, Inc. today announced that its CM7 Series and CD8P Series NVM Express (NVMe) SSDs have passed certification testing for PCI Express (PCIe) 5.0 specification and NVMe 2.0 specification compliance. Developed by PCI-SIG, the PCIe 5.0 interface specification is an upgrade that enables twice the data transfer speed and bandwidth versus the PCIe 4.0 specification - up to 14,000 Megabyte/s read throughput for a x4 lane SSD. PCIe 5.0 tests were conducted at PCI-SIG compliance workshops against PCI-SIG maintained systems, along with other leading manufacturers of PCIe products.

KIOXIA CM7 Series and CD8P Series drives can now be found on the PCI-SIG Integrator's List. Achieving compliance certification during these workshops assures users that KIOXIA drives meet the rigorous PCIe 5.0 specification requirements. KIOXIA CM7 Series and CD8P Series drives have been added to The University of New Hampshire InterOperability Laboratory's (UNH-IOL) official Integrator's List. In order to be considered for inclusion on the list, technologies must undergo conformance testing performed by the UNH-IOL through laboratory tests or during an NVMe plugfest. Successful completion of this testing provides a level of assurance that the product being tested will function properly in NVMe enabled systems and NVM Express over Fabrics (NVMe-oF) environments.