XPG, a gaming brand of ADATA Technology, a global leader in memory modules and flash memory, is proud to announce its successful collaboration with GIGABYTE Technology. Leveraging the XPG LANCER RGB DDR5 memory and LN2 (Liquid Nitrogen) cooling technology, achieved an astonishing 12,762 MT/s overclocking speed, breaking the DDR5 memory overclocking world record. This remarkable achievement has been verified by the renowned international overclocking scoring platform, HWBOT, reinforcing XPG's leadership in extreme overclocking memory.

A Legendary Overclocking Record By Two Industry Titans
This record-breaking overclocking effort was spearheaded by GIGABYTE's renowned overclocker and engineer, HiCookie. The setup featured the Z890 AORUS TACHYON ICE motherboard, meticulously designed for overclocking, paired with the XPG LANCER RGB DDR5 memory and an Intel Core Ultra 9 285K processor. The XPG LANCER's optimized PCB design, IC tuning capabilities, and integrated circuit technology ensured stable operation even under the extreme LN2 environment, laying a crucial foundation for this world record. The Z890 AORUS TACHYON ICE motherboard, boasting an array of overclocking-centric features, including an OC button and an LN2_SW liquid nitrogen mode switch, further facilitated the CPU's ability to achieve its peak performance under extreme conditions.

Raijintek today introduced the Cyclops Lite line of all-in-one liquid CPU coolers. These come in black and white color trims, and in radiator size variants of 360 mm and 240 mm. These are characterized by a pump-block that features a propeller-like ornament that's illuminated by ARGB LEDs. You get two or three 120 mm fans depending on the variant, these come with easy daisy-chaining to minimize cable clutter around the radiator. The pump-block features a copper cold-plate, and a ceramic axis for the pump bearing, which is rated for 50,000 hours. The radiator channels are made of aluminium.

Each of the included Raijintek Ageras Xtreme 120 mm fan comes with hydraulic bearing, and takes in a 4-pin PWM connection for its main function. It turns at speeds ranging from 800 RPM to 2,200 RPM, pushing up to 67.38 CFM of airflow, at 2.57 mm H₂O static pressure, and a maximum noise output of 33 dBA. The fan bearing is rated for 40,000 hours. The proprietary daisy-chaining connection of these fans combine 4-pin PWM and 3-pin ARGB connections. Among the CPU socket types supported are AM5, AM4, LGA1851, LGA1700, and LGA1200/LGA115x. The company didn't release pricing information.

CoolIT Systems (CoolIT), the world's leader in liquid cooling for computing, will showcase its latest liquid cooling technologies at NVIDIA GTC 2025. In addition to displaying CoolIT's highest-density coolant distribution units (CDUs), CoolIT's booth will feature its innovative cold plate cooling systems for next-generation AI systems.

"At GTC we are excited to reveal our next-generation AI cold plate systems that NVIDIA's server manufacturing partners can leverage to fast-track the development of their direct liquid-cooled servers," said Brandon Peterson, SVP of Business Development.

TRYX, a leading innovator in PC cooling solutions and the PC chassis market, is excited to announce the launch of the new PANORAMA SE.

Building on the success of the TRYX flagship CPU liquid cooler, the PANORAMA, TRYX has been striving to bring its innovative AMOLED curved screen to an even broader audience. Introducing the all-new PANORAMA SE series, equipped with the newly launched ASETEK Adela cooling solution, engineered for reliable and stable performance. Now, PC DIY enthusiasts on a budget can enjoy the flagship PANORAMA experience, complete with a stunning 6.5-inch, 2K, 60 Hz AMOLED display.

Supply chain insiders believe that NVIDIA's "Blackwell Ultra" GB300 AI chip design will get a formal introduction at next week's GTC 2025 conference. Jensen Huang's keynote presentation is scheduled—the company's calendar is marked with a very important date: Tuesday, March 18. Team Green's chief has already revealed a couple of Blackwell B300 series details to investors; a recent earnings call touched upon the subject of a second half (of 2025) launch window. Industry moles have put spotlights on the GB300 GPU's alleged energy hungry nature. According to inside tracks, power consumption has "significantly" increased when compared to a slightly older equivalent; NVIDIA's less refined "Blackwell" GB200 design.

A Taiwan Economic Daily news article predicts an upcoming "second cooling revolution," due to reports of "Blackwell Ultra" parts demanding greater heat dissipation solutions. Supply chain leakers have suggested effective countermeasures—in the form of fully liquid-cooled systems: "not only will more water cooling plates be introduced, but the use of water cooling quick connectors will increase four times compared to GB200." The pre-Christmas 2024 news cycle proposed a 1400 W TDP rating. Involved "Taiwanese cooling giants" are expected to pull in tidy sums of money from the supply of optimal heat dissipating gear, with local "water-cooling quick-connector" manufacturers also tipped to benefit greatly. The UDN report pulled quotes from a variety of regional cooling specialists; the consensus being that involved partners are struggling to keep up with demand across GB200 and GB300 product lines.

be quiet!, the German manufacturer for premium PC components, is proud to introduce Silent Loop 3. This all-in-one water-cooling series represents its passion for technological innovations, all packed up in one AiO. With a powerful pump to ensure an immensely high cooling performance, Silent Wings 4 fans with closed fan frames to maximize air-pressure, an iconic cooling block design with ARGB LEDs, radiator sizes up to 420 mm, and an easy-to-access refill port, Silent Loop 3 can be considered a love letter to German engineering.

Silent Loop 3 lives up to the "be quiet!" brand name: a powerful 6-pole, 3-phase PWM pump with 3-chamber design ensures high-performance at whisper-quite noise levels. The second of the three chambers acts as a reservoir and offers space for the coolant to spread out, thus reducing turbulences before the liquid leaves the pump unit. And it's not just the pump that's silent: the radiator features up to three Silent Wings 4 PWM high-speed fans with silence-optimized fan blades and a funnel-shaped air outlet. The corners of the fan frame are designed to minimize air leakage, resulting in a perfect balance between quiet operation and the highest performance.

Cooler Master, a leading provider of PC components, gaming peripherals, and tech lifestyle solutions, today announced the MasterLiquid Core II, a next level liquid cooler that comes in both 240 mm and 360 mm sizes. This latest version of Cooler Master's MasterLiquid series builds on the excellence of that renowned series of liquid coolers while bringing an array of new features to the table. With a refined G9R dual chamber pump, updated CPU compatibility, and more, the MasterLiquid Core II is an upgrade fit for the next generation.

Features

• Dual chamber pump: Upgraded design resulting in a compact cooler with superior performance.
• Updated CPU compatibility: The Core II is compatible with all the latest AMD and Intel CPUs.
• Innovative design: An infinity mirror pump cover gives the Core a stellar aesthetic.
• Revamped fans: Brand-new fan blades and revamped visuals deliver outstanding performance with a fresh look.
• Easy installation: Now includes a quick-mount kit compatible with all mainstream processor sockets, along with pre-installed fans.
• Optimum tubing length: 400 mm of tubing enables effortless mounting in any orientation.

Cooler Master, a leading provider of PC components, gaming peripherals, and tech lifestyle solutions, today announced the MasterLiquid 360 Atmos Stealth, a brand-new, all-black, non-LED version of the high power MasterLiquid 360 Atmos AIO cooler. The Atmos series is known for its signature engineering seen in features such as the dual chamber design and customizable pump top cover. Now all those features come packaged in a sleek and stealthy aesthetic.

Features

• Refined dual chamber design: Our signature dual chamber pump has been refined for enhanced cooling synergy.
• Customizable pump top cover: Removable pump top cover, customizable with your own 3D-printed designs.
• Eco-friendly pump cover: The entire pump cover is manufactured with eco-friendly recycled plastics, putting our environment first.
• Mobius 120 black fans: Pre-installed Mobius 120 mm, 2400 rpm fans further improve cooling performance and simplify user installation.
• Daisy-chaining fan connections: Reduces the number of cables needed, leading to a cleaner and more organized system.
• Updated CPU compatibility: The Atmos Stealth is compatible with all of the latest AMD and Intel CPUs.

Supermicro, Inc. a Total IT Solution Provider for AI/ML, HPC, Cloud, Storage, and 5G/Edge is commencing shipments of max-performance servers featuring Intel Xeon 6900 series processors with P-cores. The new systems feature a range of new and upgraded technologies with new architectures optimized for the most demanding high-performance workloads including large-scale AI, cluster-scale HPC, and environments where a maximum number of GPUs are needed, such as collaborative design and media distribution.

"The systems now shipping in volume promise to unlock new capabilities and levels of performance for our customers around the world, featuring low latency, maximum I/O expansion providing high throughput with 256 performance cores per system, 12 memory channels per CPU with MRDIMM support, and high performance EDSFF storage options," said Charles Liang, president and CEO of Supermicro. "We are able to ship our complete range of servers with these new application-optimized technologies thanks to our Server Building Block Solutions design methodology. With our global capacity to ship solutions at any scale, and in-house developed liquid cooling solutions providing unrivaled cooling efficiency, Supermicro is leading the industry into a new era of maximum performance computing."

TCOMAS brought a slick lineup of air and liquid CPU coolers to the 2025 International CES. We begin our tour with the AF640, a premium aluminium dual fin-stack CPU cooler. Its most striking feature is its top-plate, which has an LED segment display that talks to software over a USB 2.0 header, and puts out system monitoring info from the ACPI—CPU temperature, fan speed, CPU power draw, clock speed, etc. The cooler includes a pair of pre-installed fans with custom frames. The external "push" fan is 92 mm, with a frame size of 108 mm x 125 mm x 30 mm; while the inner "pull" fan located between the two fin-stacks is a 120 mm, with a 125 mm x 125 mm x 30 mm frame. The two fans slide out from the sides. The cooler comes in black and white trims.

Next up, are the company's stackable fans. The F700 comes in packs of 3, and features a mechanical interlock that lets you stack these up on a radiator with cabling for just one fan. There are physical control buttons on each fan to control their spin direction. Illumination is care of a Gen 2 ARGB LED setup. Each fan features a double ball-bearing. It turns at speeds between 600 and 2,000 RPM. In its conventional direction, the fan pushes up to 67.5 CFM of airflow, at 3.42 mm H₂O static pressure, and up to 38 dBA of noise output. In the reverse setting, it does up to 70.33 CFM of airflow, at 3.53 mm H₂O static pressure, and 40.3 dBA of noise output.

In Win Development Inc. (InWin), a leading innovator in PC enthusiast and gaming hardware, had introduced its new AR36 (360 mm) AIO liquid cooler featuring an "infinity Mirror" design, compatible with both AMD and Intel platforms.

Infinity Mirror Block
The ARGB-infused CPU block features an infinity mirror design on the front, showcasing radiant light reflections that create an infinite, vibrant, and colorful glow from every angle. Inside, high-density microchannel fins in the copper baseplate efficiently draw heat away from even the hottest processors, minimizing the temperature delta to unlock maximum headroom for sustained thermal boost clock speeds. The pump is equipped with a three-phase, six-pole motor, ensuring consistently high performance with reduced noise during operation.

CoolIT Systems (CoolIT), the world leader in liquid cooling systems for AI and high-performance computing, introduces the CHx1000, the world's highest-density liquid-to-liquid coolant distribution unit (CDU). Designed for mission-critical applications, the CHx1000 is purpose-built to cool the NVIDIA Blackwell platform and other demanding AI workloads where liquid cooling is now necessary.

"CoolIT created the CHx1000 to provide the high capacity and pressure delivery required to direct liquid cool NVIDIA Blackwell and future generations of high-performance AI accelerators," said Patrick McGinn, CoolIT's COO. "Besides exceptional performance, serviceability and reliability are central to the CHx1000's design. The single rack-sized unit is fully front and back serviceable with hot-swappable critical components. Precision coolant controls and multiple levels of redundancy provide for steady, uninterrupted operation."

Today, Hewlett Packard Enterprise announces its new high performance computing (HPC) and artificial intelligence (AI) infrastructure portfolio that includes leadership-class HPE Cray Supercomputing EX solutions and two systems optimized for large language model (LLM) training, natural language processing (NLP) and multi-modal model training. The new supercomputing solutions are designed to help global customers fast-track scientific research and invention.

"Service providers and nations investing in sovereign AI initiatives are increasingly turning to high-performance computing as the critical backbone enabling large-scale AI training that accelerates discovery and innovation," said Trish Damkroger, senior vice president and general manager, HPC & AI Infrastructure Solutions at HPE. "Our customers turn to us to fast-track their AI system deployment to realize value faster and more efficiently by leveraging our world-leading HPC solutions and decades of experience in delivering, deploying and servicing fully-integrated systems."

Corsair today announced an expansion to its popular family of next-generation all-in-one (AIO) CPU coolers, the iCUE LINK TITAN RX LCD. Maintaining the outstanding CPU cooling performance of the TITAN RX RGB products, the TITAN RX LCD features a custom 2.1" IPS LCD screen with 480x480 resolution, ultra-bright 600cd/m² backlight, 30 frames per second, and support for over 16.7 million colors. The screen can be quickly configured and allows users to choose from a predefined set of data displays and backgrounds within the iCUE software.

PERFORMANCE WHERE IT COUNTS
Driving the TITAN RX LCD's phenomenal performance is the new FlowDrive cooling engine, powered by a three-phase motor that offers improved power efficiency, quieter operation, and a higher flow rate than its predecessors. This, combined with a precision-engineered cold plate surface profile that ensures optimal contact with your CPU's integrated heat spreader, results in consistently lower temperatures even under extreme conditions.

Supermicro, Inc., a Total IT Solution Provider for AI, Cloud, Storage, and 5G/Edge, is accelerating the industry's transition to liquid-cooled data centers with the NVIDIA Blackwell platform to deliver a new paradigm of energy-efficiency for the rapidly heightened energy demand of new AI infrastructures. Supermicro's industry-leading end-to-end liquid-cooling solutions are powered by the NVIDIA GB200 NVL72 platform for exascale computing in a single rack and have started sampling to select customers for full-scale production in late Q4. In addition, the recently announced Supermicro X14 and H14 4U liquid-cooled systems and 10U air-cooled systems are production-ready for the NVIDIA HGX B200 8-GPU system.

"We're driving the future of sustainable AI computing, and our liquid-cooled AI solutions are rapidly being adopted by some of the most ambitious AI Infrastructure projects in the world with over 2000 liquid-cooled racks shipped since June 2024," said Charles Liang, president and CEO of Supermicro. "Supermicro's end-to-end liquid-cooling solution, with the NVIDIA Blackwell platform, unlocks the computational power, cost-effectiveness, and energy-efficiency of the next generation of GPUs, such as those that are part of the NVIDIA GB200 NVL72, an exascale computer contained in a single rack. Supermicro's extensive experience in deploying liquid-cooled AI infrastructure, along with comprehensive on-site services, management software, and global manufacturing capacity, provides customers a distinct advantage in transforming data centers with the most powerful and sustainable AI solutions."

Flex today announced new reference platforms for liquid-cooled servers, rack, and power products that will enable customers to sustainably accelerate data center growth. These innovations build on Flex's ability to address technical challenges associated with power, heat generation, and scale to support artificial intelligence (AI) and high-performance computing (HPC) workloads.

"Flex delivers integrated data center IT and power infrastructure solutions that address the growing power and compute demands in the AI era," said Michael Hartung, president and chief commercial officer, Flex. "We are expanding our unique portfolio of advanced manufacturing capabilities, innovative products, and lifecycle services, enabling customers to deploy IT and power infrastructure at scale and drive AI data center expansion."

MSI liquid coolers are fully compatible with Intel's Core Ultra Processors. As Intel's latest CPU approach promises unprecedented power and innovation, we understand that many users are looking into system upgrades. MSI liquid coolers are equipped to support this latest development, ensuring users are prepared for Intel's latest processors without the need for a complete liquid cooler replacement.

If you upgrade to Intel Core Ultra CPUs, consider MSI liquid coolers for a seamless transition. All MSI liquid coolers will support Intel's LGA1851 socket, which will be already prepared in the box.

Supermicro, Inc., a Total IT Solution Provider for Cloud, AI/ML, Storage, and 5G/Edge, is announcing a complete liquid cooling solution that includes powerful Coolant Distribution Units (CDUs), cold plates, Coolant Distribution Manifolds (CDMs), cooling towers and end to end management software. This complete solution reduces ongoing power costs and Day 0 hardware acquisition and data center cooling infrastructure costs. The entire end-to-end data center scale liquid cooling solution is available directly from Supermicro.

"Supermicro continues to innovate, delivering full data center plug-and-play rack scale liquid cooling solutions," said Charles Liang, CEO and president of Supermicro. "Our complete liquid cooling solutions, including SuperCloud Composer for the entire life-cycle management of all components, are now cooling massive, state-of-the-art AI factories, reducing costs and improving performance. The combination of Supermicro deployment experience and delivering innovative technology is resulting in data center operators coming to Supermicro to meet their technical and financial goals for both the construction of greenfield sites and the modernization of existing data centers. Since Supermicro supplies all the components, the time to deployment and online are measured in weeks, not months."

Asetek announce the appointment of Maja Sand-Grimnitz as vice president (VP) Brand and Digital, and Henrik Lindskou-Mouritsen as VP Global Sales. They bring extensive experience from commercialization of gaming hardware and international sales to drive deployment of Asetek's acclaimed sim racing products and build on the leading position within Liquid Cooling.

"I am pleased to have both Henrik and Maja join Asetek, further strengthening our commercial focus and enabling increased efficiencies by consolidating the management team in Denmark," said André Sloth Eriksen the CEO of Asetek. "We are positioning for significant growth within SimSports and a changing Liquid Cooling market with more direct end-user dialogue over time and potential to capture material revenue synergies across our two business segments under a strong Asetek brand."

Supermicro, Inc., a Total IT Solution Provider for AI/ML, HPC, Cloud, Storage, and 5G/Edge is announcing the all-new FlexTwin family of systems which has been designed to address the needs of scientists, researchers, governments, and enterprises undertaking the world's most complex and demanding computing tasks. Featuring flexible support for the latest CPU, memory, storage, power and cooling technologies, FlexTwin is purpose-built to support demanding HPC workloads including financial services, scientific research, and complex modeling. These systems are cost-optimized for performance per dollar and can be customized to suit specific HPC applications and customer requirements thanks to Supermicro's modular Building Block Solutions design.

"Supermicro's FlexTwin servers set a new standard of performance density for rack-scale deployments with up to 96 dual processor compute nodes in a standard 48U rack," said Charles Liang, president and CEO of Supermicro. "At Supermicro, we're able to offer a complete one-stop solution that includes servers, racks, networking, liquid cooling components, and liquid cooling towers, speeding up the time to deployment and resulting in higher quality and reliability across the entire infrastructure, enabling customers faster time to results. Up to 90% of the server generated heat is removed with the liquid cooling solution, saving significant amounts of energy and enabling higher compute performance."

SMART Modular Technologies, Inc. ("SMART"), a division of SGH and a global leader in memory solutions, solid-state drives, and advanced memory, has launched a new line of DDR5 Registered DIMMs (RDIMMs) with conformal coating which are specifically designed for use in liquid immersion servers. This innovative product line combines the superior performance of DDR5 technology with enhanced protection, ensuring reliability and longevity in the most demanding data center environments.

Arthur Sainio, DRAM product director for SMART explains the significance of this introduction, "Our new DDR5 RDIMMs with conformal coating represent the perfect fusion of cutting-edge performance and rugged reliability for the next generation of immersion-cooled data centers. By combining the speed and efficiency of DDR5 technology with advanced protective coatings, we're enabling our customers to push the boundaries of computing power while ensuring long-term durability in demanding liquid immersion environments. This product embodies our commitment to innovation and our drive to meet the evolving needs of high-performance computing applications."

With the growing demand for high-speed computing, more effective cooling solutions for AI servers are gaining significant attention. TrendForce's latest report on AI servers reveals that NVIDIA is set to launch its next-generation Blackwell platform by the end of 2024. Major CSPs are expected to start building AI server data centers based on this new platform, potentially driving the penetration rate of liquid cooling solutions to 10%.

Air and liquid cooling systems to meet higher cooling demands
TrendForce reports that the NVIDIA Blackwell platform will officially launch in 2025, replacing the current Hopper platform and becoming the dominant solution for NVIDIA's high-end GPUs, accounting for nearly 83% of all high-end products. High-performance AI server models like the B200 and GB200 are designed for maximum efficiency, with individual GPUs consuming over 1,000 W. HGX models will house 8 GPUs each, while NVL models will support 36 or 72 GPUs per rack, significantly boosting the growth of the liquid cooling supply chain for AI servers.

EK, the leading manufacturer of premium liquid cooling gear, is proud to introduce the EK-Quantum Momentum² ROG Maximus Z790 Extreme D-RGB - Plexi. This top-tier Ultrablock-class product, part of EK's renowned Quantum Line, is engineered for the ASUS ROG Maximus Z790 Extreme motherboard to ensure flawless compatibility.

The EK-Quantum Momentum² ROG Maximus Z790 Extreme D-RGB - Plexi is equipped with the award-winning EK-Quantum Velocity² cooling engine, delivering direct cooling to crucial motherboard components, such as the primary M.2 drive. This monoblock also features:

• Direct connection to Vector² GPU water block and Active Backplate Sets via bypass valves
• Temperature sensors
• Liquid flow meter
• Direct integration with the ROG water-cooling zone
• ILM Replacement Kit

At Computex 2024, GAMDIAS had a booth showcasing their newest cooling solutions. First up, the BOREAS P2-82L Dual-Tower Air Cooler combines high-end cooling performance with a touch of modern flair. Boasting a dual-tower heatsink with eight copper heat pipes and a copper base plate, it ensures efficient heat dissipation from even the most demanding processors. However, what truly sets this cooler apart is its integrated LCD monitor, which allows users to monitor system temperatures and enjoy animated displays, adding a touch of personalization to their setups. Wrapped in a sleek all-black finish, the BOREAS P2-82L is designed for CPUs with high TDPs cooled by air.

Not to be outdone, the GAMDIAS CHIONE M4 ELITE Series LCD Liquid Cooler has also appeared with an exciting design. This liquid cooler is available in 360 mm and 240 mm black/white variants and features an upgraded fluid running system that delivers exceptional thermal performance. Designed with a patented PWM pump and hydraulic PWM fans, the M4 ELITE promises whisper-quiet operational efficiency while maintaining a clean, clutter-free aesthetic thanks to its hidden cable routing. However, the true standout feature is the 3.4-inch LCD on the CPU pump/block combo, which can be customized using the ZEUS CAST software with real-time monitoring data and personalized backgrounds.

GIGABYTE Technology, Giga Computing, a subsidiary of GIGABYTE and an industry leader in servers and industrial motherboards, today launched products supporting Intel Xeon 6 Processor (LGA 4710) with Efficient-cores in a single or dual socket configuration. GIGABYTE's new products span its entire enterprise portfolio from GPU servers to liquid cooling servers to motherboards. With Intel's new processor roadmap addressing a broad range of compute needs in the server market, Efficient-cores (E-cores) and Performance-cores (P-cores) have their unique advantages, and both are supported on this platform. E-cores are available today, with P-core products becoming available in the future. The solutions within have distinct advantages for cloud, networking and media, and data services workloads that value consistent performance, greater energy efficiency, and dense rack and core density.

GIGABYTE's enterprise portfolio for the Intel Xeon 6 processor spans GPU servers, direct liquid cooling (DLC) servers, multi-node servers, general purpose motherboards and servers, and edge servers. By releasing a wide range of servers, data centers can quickly integrate it to achieve dynamic goals such as in GIGA POD, a rack-scale supercomputing AI infrastructure by GIGABYTE. The new Xeon based servers by GIGABYTE are also highly compatible with cloud-native software stacks for portability and consistency in containerized applications in distributed systems.