CoolIT Systems (CoolIT), the world leader in liquid cooling systems for AI and high-performance computing, introduces the CHx1000, the world's highest-density liquid-to-liquid coolant distribution unit (CDU). Designed for mission-critical applications, the CHx1000 is purpose-built to cool the NVIDIA Blackwell platform and other demanding AI workloads where liquid cooling is now necessary.

"CoolIT created the CHx1000 to provide the high capacity and pressure delivery required to direct liquid cool NVIDIA Blackwell and future generations of high-performance AI accelerators," said Patrick McGinn, CoolIT's COO. "Besides exceptional performance, serviceability and reliability are central to the CHx1000's design. The single rack-sized unit is fully front and back serviceable with hot-swappable critical components. Precision coolant controls and multiple levels of redundancy provide for steady, uninterrupted operation."

Today, Hewlett Packard Enterprise announces its new high performance computing (HPC) and artificial intelligence (AI) infrastructure portfolio that includes leadership-class HPE Cray Supercomputing EX solutions and two systems optimized for large language model (LLM) training, natural language processing (NLP) and multi-modal model training. The new supercomputing solutions are designed to help global customers fast-track scientific research and invention.

"Service providers and nations investing in sovereign AI initiatives are increasingly turning to high-performance computing as the critical backbone enabling large-scale AI training that accelerates discovery and innovation," said Trish Damkroger, senior vice president and general manager, HPC & AI Infrastructure Solutions at HPE. "Our customers turn to us to fast-track their AI system deployment to realize value faster and more efficiently by leveraging our world-leading HPC solutions and decades of experience in delivering, deploying and servicing fully-integrated systems."

Corsair today announced an expansion to its popular family of next-generation all-in-one (AIO) CPU coolers, the iCUE LINK TITAN RX LCD. Maintaining the outstanding CPU cooling performance of the TITAN RX RGB products, the TITAN RX LCD features a custom 2.1" IPS LCD screen with 480x480 resolution, ultra-bright 600cd/m² backlight, 30 frames per second, and support for over 16.7 million colors. The screen can be quickly configured and allows users to choose from a predefined set of data displays and backgrounds within the iCUE software.

PERFORMANCE WHERE IT COUNTS
Driving the TITAN RX LCD's phenomenal performance is the new FlowDrive cooling engine, powered by a three-phase motor that offers improved power efficiency, quieter operation, and a higher flow rate than its predecessors. This, combined with a precision-engineered cold plate surface profile that ensures optimal contact with your CPU's integrated heat spreader, results in consistently lower temperatures even under extreme conditions.

Supermicro, Inc., a Total IT Solution Provider for AI, Cloud, Storage, and 5G/Edge, is accelerating the industry's transition to liquid-cooled data centers with the NVIDIA Blackwell platform to deliver a new paradigm of energy-efficiency for the rapidly heightened energy demand of new AI infrastructures. Supermicro's industry-leading end-to-end liquid-cooling solutions are powered by the NVIDIA GB200 NVL72 platform for exascale computing in a single rack and have started sampling to select customers for full-scale production in late Q4. In addition, the recently announced Supermicro X14 and H14 4U liquid-cooled systems and 10U air-cooled systems are production-ready for the NVIDIA HGX B200 8-GPU system.

"We're driving the future of sustainable AI computing, and our liquid-cooled AI solutions are rapidly being adopted by some of the most ambitious AI Infrastructure projects in the world with over 2000 liquid-cooled racks shipped since June 2024," said Charles Liang, president and CEO of Supermicro. "Supermicro's end-to-end liquid-cooling solution, with the NVIDIA Blackwell platform, unlocks the computational power, cost-effectiveness, and energy-efficiency of the next generation of GPUs, such as those that are part of the NVIDIA GB200 NVL72, an exascale computer contained in a single rack. Supermicro's extensive experience in deploying liquid-cooled AI infrastructure, along with comprehensive on-site services, management software, and global manufacturing capacity, provides customers a distinct advantage in transforming data centers with the most powerful and sustainable AI solutions."

Flex today announced new reference platforms for liquid-cooled servers, rack, and power products that will enable customers to sustainably accelerate data center growth. These innovations build on Flex's ability to address technical challenges associated with power, heat generation, and scale to support artificial intelligence (AI) and high-performance computing (HPC) workloads.

"Flex delivers integrated data center IT and power infrastructure solutions that address the growing power and compute demands in the AI era," said Michael Hartung, president and chief commercial officer, Flex. "We are expanding our unique portfolio of advanced manufacturing capabilities, innovative products, and lifecycle services, enabling customers to deploy IT and power infrastructure at scale and drive AI data center expansion."

MSI liquid coolers are fully compatible with Intel's Core Ultra Processors. As Intel's latest CPU approach promises unprecedented power and innovation, we understand that many users are looking into system upgrades. MSI liquid coolers are equipped to support this latest development, ensuring users are prepared for Intel's latest processors without the need for a complete liquid cooler replacement.

If you upgrade to Intel Core Ultra CPUs, consider MSI liquid coolers for a seamless transition. All MSI liquid coolers will support Intel's LGA1851 socket, which will be already prepared in the box.

Supermicro, Inc., a Total IT Solution Provider for Cloud, AI/ML, Storage, and 5G/Edge, is announcing a complete liquid cooling solution that includes powerful Coolant Distribution Units (CDUs), cold plates, Coolant Distribution Manifolds (CDMs), cooling towers and end to end management software. This complete solution reduces ongoing power costs and Day 0 hardware acquisition and data center cooling infrastructure costs. The entire end-to-end data center scale liquid cooling solution is available directly from Supermicro.

"Supermicro continues to innovate, delivering full data center plug-and-play rack scale liquid cooling solutions," said Charles Liang, CEO and president of Supermicro. "Our complete liquid cooling solutions, including SuperCloud Composer for the entire life-cycle management of all components, are now cooling massive, state-of-the-art AI factories, reducing costs and improving performance. The combination of Supermicro deployment experience and delivering innovative technology is resulting in data center operators coming to Supermicro to meet their technical and financial goals for both the construction of greenfield sites and the modernization of existing data centers. Since Supermicro supplies all the components, the time to deployment and online are measured in weeks, not months."

Asetek announce the appointment of Maja Sand-Grimnitz as vice president (VP) Brand and Digital, and Henrik Lindskou-Mouritsen as VP Global Sales. They bring extensive experience from commercialization of gaming hardware and international sales to drive deployment of Asetek's acclaimed sim racing products and build on the leading position within Liquid Cooling.

"I am pleased to have both Henrik and Maja join Asetek, further strengthening our commercial focus and enabling increased efficiencies by consolidating the management team in Denmark," said André Sloth Eriksen the CEO of Asetek. "We are positioning for significant growth within SimSports and a changing Liquid Cooling market with more direct end-user dialogue over time and potential to capture material revenue synergies across our two business segments under a strong Asetek brand."

Supermicro, Inc., a Total IT Solution Provider for AI/ML, HPC, Cloud, Storage, and 5G/Edge is announcing the all-new FlexTwin family of systems which has been designed to address the needs of scientists, researchers, governments, and enterprises undertaking the world's most complex and demanding computing tasks. Featuring flexible support for the latest CPU, memory, storage, power and cooling technologies, FlexTwin is purpose-built to support demanding HPC workloads including financial services, scientific research, and complex modeling. These systems are cost-optimized for performance per dollar and can be customized to suit specific HPC applications and customer requirements thanks to Supermicro's modular Building Block Solutions design.

"Supermicro's FlexTwin servers set a new standard of performance density for rack-scale deployments with up to 96 dual processor compute nodes in a standard 48U rack," said Charles Liang, president and CEO of Supermicro. "At Supermicro, we're able to offer a complete one-stop solution that includes servers, racks, networking, liquid cooling components, and liquid cooling towers, speeding up the time to deployment and resulting in higher quality and reliability across the entire infrastructure, enabling customers faster time to results. Up to 90% of the server generated heat is removed with the liquid cooling solution, saving significant amounts of energy and enabling higher compute performance."

SMART Modular Technologies, Inc. ("SMART"), a division of SGH and a global leader in memory solutions, solid-state drives, and advanced memory, has launched a new line of DDR5 Registered DIMMs (RDIMMs) with conformal coating which are specifically designed for use in liquid immersion servers. This innovative product line combines the superior performance of DDR5 technology with enhanced protection, ensuring reliability and longevity in the most demanding data center environments.

Arthur Sainio, DRAM product director for SMART explains the significance of this introduction, "Our new DDR5 RDIMMs with conformal coating represent the perfect fusion of cutting-edge performance and rugged reliability for the next generation of immersion-cooled data centers. By combining the speed and efficiency of DDR5 technology with advanced protective coatings, we're enabling our customers to push the boundaries of computing power while ensuring long-term durability in demanding liquid immersion environments. This product embodies our commitment to innovation and our drive to meet the evolving needs of high-performance computing applications."

With the growing demand for high-speed computing, more effective cooling solutions for AI servers are gaining significant attention. TrendForce's latest report on AI servers reveals that NVIDIA is set to launch its next-generation Blackwell platform by the end of 2024. Major CSPs are expected to start building AI server data centers based on this new platform, potentially driving the penetration rate of liquid cooling solutions to 10%.

Air and liquid cooling systems to meet higher cooling demands
TrendForce reports that the NVIDIA Blackwell platform will officially launch in 2025, replacing the current Hopper platform and becoming the dominant solution for NVIDIA's high-end GPUs, accounting for nearly 83% of all high-end products. High-performance AI server models like the B200 and GB200 are designed for maximum efficiency, with individual GPUs consuming over 1,000 W. HGX models will house 8 GPUs each, while NVL models will support 36 or 72 GPUs per rack, significantly boosting the growth of the liquid cooling supply chain for AI servers.

EK, the leading manufacturer of premium liquid cooling gear, is proud to introduce the EK-Quantum Momentum² ROG Maximus Z790 Extreme D-RGB - Plexi. This top-tier Ultrablock-class product, part of EK's renowned Quantum Line, is engineered for the ASUS ROG Maximus Z790 Extreme motherboard to ensure flawless compatibility.

The EK-Quantum Momentum² ROG Maximus Z790 Extreme D-RGB - Plexi is equipped with the award-winning EK-Quantum Velocity² cooling engine, delivering direct cooling to crucial motherboard components, such as the primary M.2 drive. This monoblock also features:

• Direct connection to Vector² GPU water block and Active Backplate Sets via bypass valves
• Temperature sensors
• Liquid flow meter
• Direct integration with the ROG water-cooling zone
• ILM Replacement Kit

At Computex 2024, GAMDIAS had a booth showcasing their newest cooling solutions. First up, the BOREAS P2-82L Dual-Tower Air Cooler combines high-end cooling performance with a touch of modern flair. Boasting a dual-tower heatsink with eight copper heat pipes and a copper base plate, it ensures efficient heat dissipation from even the most demanding processors. However, what truly sets this cooler apart is its integrated LCD monitor, which allows users to monitor system temperatures and enjoy animated displays, adding a touch of personalization to their setups. Wrapped in a sleek all-black finish, the BOREAS P2-82L is designed for CPUs with high TDPs cooled by air.

Not to be outdone, the GAMDIAS CHIONE M4 ELITE Series LCD Liquid Cooler has also appeared with an exciting design. This liquid cooler is available in 360 mm and 240 mm black/white variants and features an upgraded fluid running system that delivers exceptional thermal performance. Designed with a patented PWM pump and hydraulic PWM fans, the M4 ELITE promises whisper-quiet operational efficiency while maintaining a clean, clutter-free aesthetic thanks to its hidden cable routing. However, the true standout feature is the 3.4-inch LCD on the CPU pump/block combo, which can be customized using the ZEUS CAST software with real-time monitoring data and personalized backgrounds.

GIGABYTE Technology, Giga Computing, a subsidiary of GIGABYTE and an industry leader in servers and industrial motherboards, today launched products supporting Intel Xeon 6 Processor (LGA 4710) with Efficient-cores in a single or dual socket configuration. GIGABYTE's new products span its entire enterprise portfolio from GPU servers to liquid cooling servers to motherboards. With Intel's new processor roadmap addressing a broad range of compute needs in the server market, Efficient-cores (E-cores) and Performance-cores (P-cores) have their unique advantages, and both are supported on this platform. E-cores are available today, with P-core products becoming available in the future. The solutions within have distinct advantages for cloud, networking and media, and data services workloads that value consistent performance, greater energy efficiency, and dense rack and core density.

GIGABYTE's enterprise portfolio for the Intel Xeon 6 processor spans GPU servers, direct liquid cooling (DLC) servers, multi-node servers, general purpose motherboards and servers, and edge servers. By releasing a wide range of servers, data centers can quickly integrate it to achieve dynamic goals such as in GIGA POD, a rack-scale supercomputing AI infrastructure by GIGABYTE. The new Xeon based servers by GIGABYTE are also highly compatible with cloud-native software stacks for portability and consistency in containerized applications in distributed systems.

Corsair today announced the launch of its first 30 mm-thick PC cooling fans, the RS MAX Series. By combining extremely durable Liquid Crystal Polymer material with a larger fan blade bolstered by AirGuide technology, Corsair's expert engineers have created its best performing fan with zero compromises. The RS MAX Series connects with a simple 4-pin PWM header, enabling precise adjustment over fan speeds without the need for a separate controller.

With a 20% increase in thickness over standard fans, the RS MAX Series can spin at a lower speed to generate the same airflow as its thinner counterparts - translating into lower overall fan noise. For enthusiasts who push their systems to the limit, the high static pressure created by the RS MAX's larger fan blade helps power airflow through obstructions and dense radiators, making it an ideal choice for high-performance liquid cooling setups.

Alphacool is at CloudFest—the world's largest event for cloud, hosting and internet infrastructure! The Alphacool team awaits all interested parties at booth #G10 and #G11. CloudFest, taking place from March 18-21, 2024 at Europa-Park (Rust, Germany), is the go-to venue for professionals to meet, network and explore new partnership opportunities. With so many captivating presentations, important workshops and exciting networking events, this festival can be the kind of experience that can transform businesses in a meaningful way.

An Alphacool highlight is the prototype of a CDU (Coolant Distribution Unit) for servers. With this first model, Alphacool presents a highly effective way of cooling servers on a large scale. The Alphacool 2U 19" Coolant Distribution Unit paired with the Alphacool 4U 19" Radiator Unit has a cooling capacity of up to 8000 watts in its current state of development. This is enough cooling for 40 1U servers, for example. External management is supplemented with in-house software.

During the 2024 SIEPR Economic Summit, NVIDIA CEO Jensen Huang acknowledged that the company's next-generation DGX systems, designed for AI and high-performance computing workloads, will require liquid cooling due to their immense power consumption. Huang also hinted that these new systems are set to be released in the near future. The revelation comes as no surprise, given the increasing power of GPUs needed to satisfy AI and machine learning applications. As computational requirements continue to grow, so does the need for more powerful hardware. However, with great power comes great heat generation, necessitating advanced cooling solutions to maintain optimal performance and system stability. Liquid cooling has long been a staple in high-end computing systems, offering superior thermal management compared to traditional air cooling methods.

By implementing liquid cooling in the upcoming DGX systems, NVIDIA aims to push the boundaries of performance while ensuring the hardware remains reliable and efficient. Although Huang did not provide a specific release date for the new DGX systems, his statement suggests that they are on the horizon. Whether the next generation of DGX systems uses the current NVIDIA H200 or the upcoming Blackwell B100 GPU as their primary accelerator, the performance will undoubtedly be delivered. As the AI and high-performance computing landscape continues to evolve, NVIDIA's position continues to strengthen, and liquid-cooled systems will certainly play a crucial role in shaping the future of these industries.

Thermaltake, a leading PC DIY brand for premium hardware solutions, is excited to announce that the Pacific SR Radiator and the new-colored Pacific SF Fittings are ready for purchase. A high-quality water cooling system should include components with maximum modification capability and visual attractiveness. The Pacific SR Radiator features detachable side panels for you to customize painting more easily, and the Pacific SF Fittings now come in three colors - silver black, matte black, and white, ensuring a comprehensive selection to meet all your needs.

Pacific SR280/360/420 Radiator - Black/Snow Edition
The Pacific SR Radiator is a slim radiator with 28 mm thickness, and its compact size can offer enormous placement flexibility. This series has 3 models: the Pacific SR360 that fits 120 mm fans, and the Pacific SR280 and Pacific SR420 that fit 140 mm fans. The Pacific SR Radiator has black and snow editions to choose; contributing to the modular design, you can take off the detachable side panels of the radiator and paint them in any color you like. Furthermore, this radiator is crafted with flat tubes and 17 FPI fin density, paired with high-static pressure fans can offer an exceptional cooling solution.

Researchers from Tsinghua University in Beijing have developed FlexRAM, the first fully flexible resistive RAM memory built using liquid metal. The innovative approach suspends droplets of gallium-based liquid metal in a soft biopolymer material. Applying voltage pulses oxidizes or reduces the metal, mimicking neuron polarization. This allows the reversible switching between high and low resistance states corresponding to bit 1s and 0s for data storage. Even when powered off, data persists in the inert liquid for 43,200 seconds (or 12 hours). The current FlexRAM prototype consists of 8 independent 1-bit memory units, storing a total of 1 byte. It has demonstrated over 3,500 write cycles, though further endurance improvements are needed for practical use. Commercial RAM is rated for millions of read/write cycles. The millimeter-scale metal droplets could eventually reach nanometer sizes, dramatically increasing memory density.

FlexRAM represents a breakthrough in circuits and electronics that can freely bend and flex. The researchers envision applications from soft robotics, medical implants, and flexible wearable devices. Compatibility with stretchable substrates unlocks enormous potential for emerging technologies. While still in the early conceptual stages, FlexRAM proves that computing and memory innovations that were once thought impossible or fanciful can become real through relentless scientific creativity. It joins a wave of pioneering flexible electronics research attaining more flexibility than rigid silicon allows. There are still challenges to solve before FlexRAM and liquid electronics can transform computing. But by proving a fluid-state memory device possible, the technology flows toward a radically different future for electronics and computation. Below, you can see the liquid metal droplet that is the FlexRAM breakthrough.

At the CES 2024 international show, Taiwanese company ENERMAX unveiled new all-in-one (AIO) CPU liquid coolers targeting both mainstream and high-end markets. First in line is the AQUAFLO LCD, which features a removable 5-inch 800x480 resolution magnetic LCD display, allowing monitoring of temperatures, fan speeds, and pump RPM, with the ability to stick on cases or use it as a desktop display. Supporting up to 400 Watt TDPs, the dual-chamber pump design provides flow rates up to 450 liters per hour. The 240 mm and 360 mm radiators use flat 20 mm-thick cooling tubes and ENERMAX Shunt Channel cooling technology for efficient heat transfer. This enables handling the latest overclocked gaming CPUs.

For professional workstations and servers, the LIQTECH XTR 280 and 360 models offer full coverage and 500 Watt+ TDP capacity for the latest AMD Threadripper Pro and Intel Xeon CPUs using larger CPU sockets. An integrated 2.4-inch digital OLED screen directly on the block reports real-time core temperature readings and warnings. A ceramic bearing pump design also pushes 450 liters per hour for cooling under heavy rendering or data center workloads. The LIQTECH XTR ensures professionals can rely on enhanced durability for mission-critical hardware. The new AIO coolers will be available in Q2 2024 through major retailers.

In the era of high-tech development and the ever-increasing demand for data processing power, data centers are consuming more energy and generating excess heat. As a global leader in thermal solutions, SUNON is at the forefront, offering a diverse range of cutting-edge liquid cooling solutions tailored to advanced data centers equipped with high-capacity CPU and GPU computing for AI, edge, and cloud servers.

SUNON's liquid cooling design services are ideally suited for modern data centers, generative AI computing, and high-performance computing (HPC) applications. These solutions are meticulously customized to fit the cooling space and server density of each data center. With their compact yet comprehensive design, they guarantee exceptional cooling efficiency and reliability, ultimately contributing to a significant reduction in a client's total cost of ownership (TCO) in the long term. In the pursuit of net-zero emissions standards, SUNON's liquid cooling solutions play a pivotal role in enhancing corporate sustainability. They o ff er a win-win scenario for clients seeking to transition toward greener and more digitalized operations.

GAMDIAS Technology, a leading brand for high-performance PC gaming hardware and peripherals, launched its innovative and customizable CHIONE M4 LCD display liquid cooler. The CHIONE M4 delivers powerful cooling for your CPU through its patented in-line PWM pump, a 32 mm thick radiator, and hydraulic ARGB fans to reach an advanced level of coolness. It also features a 2.1" LCD screen on the water block that displays CPU temperature, fan speed, and pump speed stats in real-time.

CHIONE M4 AIO comes with a 2.1" LCD screen on the water block that displays the CPU temperature, fan speed and pump speed scales to enable users to monitor essential system status in real time. The CHIONE CAST LITE software allows full customization of charts and temperature unit displays (°C/°F). The patented in-line pump is designed with PWM control, stable and powerful liquid circulation which can cool down the CPU temperature efficiently while minimizing the vibrations to ensure a silent and steady operation. The 32 mm thick radiator features much denser radiator fins for improved cooling performance, the increase in dissipation surface allows the radiator to provide excellent performance.

According to @momomo_us, Intel has discontinued its Cryo Cooling Technology as of July 1, 2023, marking the end of one of the tech industry's few sub-ambient cooling options. The technology, which could chill CPUs to 0 degrees Celsius to enhance performance, accompanied Intel's processors from the 10th-generation Comet Lake to the 13th-generation Raptor Lake. Despite its innovative approach to boosting CPU performance, the cooling solution was not widely embraced. The discontinuation comes just before the arrival of the 14th Generation Raptor Lake Refresh, which will not support the Cryo Cooling tech. Intel plans to maintain updates for the existing Cryo Cooling hardware until December 31, 2023.

This specialized cooling method did see some use in products like the Cooler Master MasterLiquid ML360 Sub-Zero and the EKWB EK-QuantumX Delta TEC waterblocks. Interestingly, the technology has managed to work even with non-Intel CPUs, which famous overclocker der8auer managed to get up and running on AMD's Ryzen 9 5950X. Some modifications were in place, but it was possible to do so. The likely reason for shutting down the cryo cooling project is the need for more financial sense to continue to pursue this technology and the effort to keep the cost of R&D down and make funds available for other projects at Intel's laboratories.

GIGABYTE Technology, Giga Computing, a subsidiary of GIGABYTE and an industry leader in high-performance servers, server motherboards, and workstations, today announced direct liquid cooling (DLC) multi-node servers for NVIDIA Grace CPU & NVIDIA Grace Hopper Superchip. In addition, a DLC ready Intel-based server for the NVIDIA HGX H100 8-GPU platform and a high-density server for AMD EPYC 9004 processors. For the ultimate in efficiency, is also a new 12U single-phase immersion tank. All these mentioned products will be at GIGABYTE booth #355 at SC23.

Just announced high-density CPU servers include Intel Xeon-based H263-S63-LAN1 and AMD EPYC-based H273-Z80-LAN1. These 2U 4 node servers employ DLC for all eight CPUs, and although it is dense computing CPU performance achieves its full potential. In August, GIGABYTE announced new servers for NVIDIA HGX H100 GPU, and now adds the DLC version to the G593 series, G593-SD0-LAX1, for NVIDIA HGX H100 8-GPU.

EK, the leading premium liquid cooling gear manufacturer, will soon provide a one-stop-shop purchasing option where System Integrators, Data Centers, AI/ML-focused companies, and similar customers can get full enterprise-grade custom liquid-cooling loops for their systems. The products belong to the EK-Pro line of professional liquid cooling solutions tailor-made for HPC systems and high-compute density applications. This means that System Integrators and Data Centers will be able to purchase full liquid cooling loops for their HPC servers and workstations and enjoy all the benefits that water-cooled HPC systems can provide.

The Advantages of Liquid Cooling for HPC Systems
High Performance Computing facilities use servers and workstations that leverage powerful GPUs, multithreaded CPUs, petabytes of RAM, and extensive storage space. All this computing power, despite modern advancements in manufacturing and power efficiency, generates tremendous amounts of heat. In fact, it is estimated that up to 40% of the total energy requirements of these facilities is spent on keeping the IT equipment within acceptable operating temperatures. Plus, the components that use conventional air cooling tend to underperform and have shorter lifespans.