ZOTAC launched the ZBOX edge CI342, a compact fanless mini-PC powered by an Intel Pentium N6415 "Elkhart Lake" quad-core processor clocked at speeds of up to 3.00 GHz. The ZBOX measures just 147.2 mm x 147.2 mm x 32.1 mm (WxDxH), with a passive cooling solution for the SoC that has a TDP of just 6.5 W. It offers an impressive set of connectivity options, which include DisplayPort 1.2 and HDMI 2.0b making up the display outputs; three 5 Gbps USB 3.1 ports that include a type-C, a microSD card reader, two 1 GbE wired LAN interfaces, and Wi-Fi 6E + Bluetooth 5.2 WLAN. It's still being sold as a "barebones," meaning that you add your own RAM and storage. Memory options include two DDR4 SODIMM slots (dual-channel), and the only storage interface is an M.2-2280 slot with PCI-Express 3.0 x2 wiring. ZOTAC is also offering a non-barebones complete prebuilt with Windows 11, which includes one 4 GB DDR4-3200 SODIMM stick, and a 128 GB NVMe SSD.

G.SKILL International Enterprise Co., Ltd., the world's leading brand of performance overclock memory and PC components, is excited to announce two new extreme overclocked performance DDR5 memory specifications to its flagship Trident Z5 RGB series: DDR5-6800 CL32-45-45-108 32 GB (2x 16 GB) and DDR5-6400 CL32-39-39-102 64 GB (2x 32 GB). These memory kits come with Intel XMP 3.0 memory overclocking profiles and have been validated on the latest 12th Gen Intel Core desktop processor and Intel Z690 chipset platform.

Dedicated to developing extreme overclock speed memory kits, the G.SKILL Trident Z5 RGB DDR5-6800 CL32-45-45-108 2x 16 GB memory kit is the ideal choice for overclocking enthusiasts to experience extreme DDR5 frequency performance. The screenshot below shows the DDR5-6800 memory kit validated with Intel Core i7-12700K desktop processor and ASUS ROG Maximus Z690 Hero motherboard.

Amid the fog of rapid announcements and AIC graphics card launches, this little, interesting detail might have missed you, but the new GeForce RTX 4080 12 GB graphics card announced yesterday; features a memory bus-width of just 192-bit, which is half that of the RTX 3080 12 GB (384-bit). The card uses 21 Gbps GDDR6X memory, which at 192-bit bus-width, works out to just 504 GB/s bandwidth. In comparison, the RTX 3080 12 GB uses 19 Gbps GDDR6X memory, which at 384-bit bus width, produces 912 GB/s. In fact, even the original RTX 3080 with 10 GB of GDDR6X memory across a 320-bit bus, has 760 GB/s on tap.

The bigger RTX 4080 16 GB variant uses 256-bit memory bus, but faster 23 Gbps GDDR6X memory, producing 736 GB/s of memory bandwidth, which again, is less than that of the original 10 GB RTX 3080. It's only the RTX 4090 that has an unchanged amount of memory bandwidth over the previous generation—1008 GB/s, which is identical to that of the RTX 3090 Ti, and a tad higher than the 936 GB/s of the RTX 3090 (non-Ti). Of course, memory bandwidth is no way to compare the RTX 40-series from its predecessors, there are a dozen other factors that weigh into performance, and what matters is you're getting generationally more memory amounts with the RTX 4080-series. The RTX 4080 12 GB offers 20% more memory than the RTX 3080, and the RTX 4080 16 GB offers 33% more than the RTX 3080 12 GB. NVIDIA tends to deliver significant performance gains with each new generation, and we expect this to hold up.

Kingston FURY, the gaming division of Kingston Technology Company, Inc., a world leader in memory products and technology solutions, announced today it has unleashed a new member of the pack, Kingston FURY Beast DDR4 RGB Special Edition. The white heatspreader with striking RGB lighting makes these modules unique amongst the Kingston FURY line.

Enhance not just the performance of your system but keep it fresh with the library of preset RGB lighting patterns and effects or personalize the settings to create a look that makes your system truly one of a kind with Kingston FURY CTRL software. Along with the patented Infrared Sync Technology, trust your tailored RGB effects stay aligned.

Intel on Thursday confirmed that there will be only four Arc "Alchemist" desktop graphics card SKUs in the retail channel, and that it will be led by the A770 Limited Edition, which maxes out the DG2-512 silicon, and features 17.5 Gbps memory across its 256-bit wide memory bus, putting 560 GB/s of memory bandwidth at its disposal. The A750 uses 16 Gbps memory data-rates, and has 512 GB/s of bandwidth. It turns out, that the mid-range A580 features a 256-bit wide memory bus, and not the previously-reported 192-bit, which means it has the same 512 GB/s bandwidth as the A750. The A580 and A750 come with 8 GB of memory, while the A770 tops out with 16 GB.

Kingston FURY, the gaming division of Kingston Technology Company, Inc., a world leader in memory products and technology solutions, announced today the addition of AMD EXPO certified DDR5 modules to the Kingston FURY Beast line of memory. Always aiming to provide the latest options to gamers and enthusiasts, these new overclock specs modules and kits are optimized for AMD's upcoming AM5 platform with two factory tuned profiles, plus one user customizable profile.

Qualified by the world's leading motherboard manufacturers, the Kingston FURY Beast line offers aggressive speeds up to 6000MT/s1 with a bold low-profile heatspreader design. Now with AMD EXtended Profile for Overclocking, users can trust that their selected Kingston FURY Beast DDR5 modules and kits are exactly what their AMD AM5 system needs to maximize performance, while also maintaining stability.

As reported by BusinessKorea, Apple, one of the largest companies in the world, will source its 3D NAND from Chinese memory maker Yangtze Memory Technologies Corp (YMTC). Known for supplying 3D NAND to Chinese SSD makers, YTMC's reported contract with Apple will fuel the upcoming iPhone 14 SKU manufacturing. Whether or not this partnership will expand to other products, it is essential to have as many storage sources as possible, as Apple sells millions of devices per year. YTMC is on track to deliver 3D NAND flash with the latest Xstacking 3.0 six-plane architecture that provides triple-level cell storage with I/O speeds of 2400 MT/s.

YTMC has joined the list of 3D NAND flash vendors that Apple works with, including SK Hynix, Samsung, Kioxia, and possibly others. This partnership also highlights that the Chinese memory output is sufficient and significant enough to break into more markets worldwide, not remaining exclusive to domestic use.

Micron Technology, Inc. (NASDAQ: MU), one of the world's largest semiconductor companies and the only U.S.-based manufacturer of memory, today announced plans to invest approximately $15 billion through the end of the decade to construct a new fab for leading-edge memory manufacturing in Boise, Idaho. This will be the first new memory manufacturing fab built in the U.S. in 20 years, ensuring domestic supply of leading-edge memory required for market segments like automotive and data center, fueled by accelerating adoption of artificial intelligence and 5G.

This is the first of Micron's multiple planned U.S. investments following the passage of the CHIPS and Science Act, and represents the largest private investment ever made in Idaho. Co-locating the new manufacturing fab with Micron's R&D center at the company's headquarters will enhance operational efficiency, accelerate technology deployment and improve time to market.

AMD in its Discord AMA confirmed DDR5-6000 to be the "sweetspot" memory overclock for its upcoming Ryzen 7000 "Zen 4" processors. A sweetspot frequency in AMD jargon is an inflection of performance, stability, cost, and ease. For the very first Ryzen, this was DDR4-3200. For Ryzen 2000, it was DDR4-3400. For the Ryzen 3000 "Zen 2," it climbed to DDR4-3800, the Ryzen 5000 "Zen 3" it was DDR4-4000.

At the architectural-level, it is usually the highest frequency where FClk, UClk, and MClk maintain a 1:1:1 ratio, before having to engage dividers that impact performance, making it a point of diminishing returns for investing in faster memory modules. AMD's Robert Hallock, leading the Discord AMA, recommended that FClk be left untouched at "Auto" for the best results, and overclockers look for an Auto:1:1 ratio for the FClk, UClk, and MClk. As with both AMD and Intel now, the highest frequencies are possible only with one single-rank DIMM per memory channel (1DPC), and memory overclocking yield lower results with dual-rank DIMMs, or two DIMMs per memory channel. Among the AMD EXPO-certified DIMMs announced over the past few days, some do engage memory clocks beyond DDR5-6000. It would be interesting to see how they affect the "golden ratio" for Zen 4.

XPG, a fast-growing provider of systems, components, and peripherals for Gamers, Esports Pros, and Tech Enthusiasts, today announces announced the launch of the new XPG LANCER 5600 DDR5 memory module, its first DDR5 to support AMD EXPO (Extended Profiles for Overclocking); What's more, all ADATA's and XPG's full lineup of DDR5 memory modules are compatible with AMD's latest platforms, ensuring optimal stability and performance.

XPG LANCER DDR5-5600 is capable of delivering performance of up to 5600 MT/s and comes in variants with or without RGB lighting. They also come with two heat sink color options to choose from to meet different preferences, including Midnight Black and Snow White. As AMD Ryzen 7000 series processors have been announced, XPG took the initiative to launch the XPG LANCER DDR5-5600 to allow gamers who are still on the sidelines to upgrade to DDR5 and enjoy the benefits of AMD EXPO for easy overclocking. XPG's full range of DDR5 memory models, including CASTER, LANCER, and HUNTER will all support AMD EXPO and be available globally in October.

G.SKILL International Enterprise Co., Ltd., the world's leading brand of performance overclock memory and PC components, is excited to announce two new DDR5 memory series, the Trident Z5 Neo and Flare X5 series, designed for the new AMD Ryzen 7000 Series processors and 600 series motherboards. The Trident Z5 Neo family offerings include RGB (Trident Z5 Neo RGB) and non-RGB (Trident Z5 Neo) variants. Programmed with AMD EXPO technology and created with hand-screened memory ICs, the Trident Z5 Neo and Flare X5 series allow PC enthusiasts, gamers, and overclockers to experience the performance of the new AMD AM5 platform.

Designed for DDR5 memory-enabled AMD Ryzen 7000 Series desktop processors, the Trident Z5 Neo and Flare X5 series are pre-programmed with the latest AMD EXPO (EXtended Profiles for Overclocking) memory profiles, which allow users to easily overclock the memory kits. By simply enabling the AMD EXPO profile in the BIOS with a compatible motherboard and processor, users can unleash overclocked memory speeds on AMD Ryzen 7000 Series processors.

CORSAIR, a world leader in enthusiast components for gamers, creators, and PC builders, today announced the launch of DOMINATOR PLATINUM RGB DDR5 for AMD, VENGEANCE RGB DDR5 for AMD and VENGEANCE DDR5 for AMD, featuring new AMD EXPO technology and ready to power the next generation of Ryzen 7000-series powered PCs.

Available in frequencies up to a screaming-fast 6,000MT/s, and even higher in the future, all CORSAIR DDR5 for AMD kits offer AMD EXPO (Extended Profiles for Overclocking), allowing these modules to be set to their rated speed and performance in just a few clicks. AMD EXPO technology makes setup simple and ensures users can easily run their memory at the speed it was created to run at.

JEDEC Solid State Technology Association and Compute Express Link (CXL) Consortium today announced the signing of a Memorandum of Understanding (MOU) to formalize collaboration between the two organizations. The agreement outlines the formation of a joint work group to provide a forum that facilitates communication and sharing of information, requirements, recommendations and requests with the intent that this exchange of information will help standards developed by each organization augment one another.

"The MOU between JEDEC and CXL Consortium will establish a framework for ongoing communication to align future efforts between the two organizations. The joint work group will collaborate on useful solutions for form factors, management, security, and DRAM and other memory technologies," said Siamak Tavallaei, CXL Consortium President.

NVIDIA's upcoming GeForce RTX 40 series graphics cards are less than two months from the official launch. As we near the final specification draft, we are constantly getting updates from hardware leakers claiming that the specification is ever-changing. Today, @kopite7kimi has updated his GeForce RTX 4080 GPU predictions with some exciting changes. First off, the GPU memory will get an upgrade over the previously believed specification. Before, we thought that the SKU used GDDR6X running at 21 Gbps; however, now, it is assumed that it uses a 23 Gbps variant. Faster memory will definitely result in better overall performance, and we are yet to see what it can achieve with overclocking.

Next, another update for NVIDIA GeForce RTX 4080 comes with the SKU's total board power (TBP). Previously we believed it came with a 420 Watt TBP; however, the sources of kopite7kimi claim that it has a 340 Watt TBP. This 60 Watt reduction is rather significant and could be attributed to NVIDIA's optimization to have the most efficient design possible.

JEDEC Solid State Technology Association, the global leader in the development of standards for the microelectronics industry, today announced the publication of JESD220F: Universal Flash Storage 4.0. In addition, an update to the complementary JESD223E UFSHCI 4.0 standard, and a new companion standard for UFS version 3.1 and above, JESD231 File Based Optimization, have also been published. Developed for mobile applications and computing systems requiring high performance with low power consumption, UFS 4.0 introduces significant bandwidth and data protection improvements over the earlier version of the standard. All three standards are available for download from the JEDEC website.

If you remember, there were quite a lot of discussions about memory speed "sweet spots" for both the Ryzen 3000- and Ryzen 5000-series, with the user experience not always meeting AMD's sweet spot for memory clocks. Now details of the Ryzen 7000-series memory sweet spot has arrived courtesy of Wccftech and the speed is said to be DDR5-6000. This is 400 MHz higher than the apparent official maximum memory clock speed of DDR5-5600, but as we know, the manufacturer's max memory clock is rarely the actual max. In AMD's case, things obviously work a bit differently, as the Infinity Fabric clock should ideally run at a 1:1 ratio with the memory in the case of the AM4 platform, to deliver best possible system performance and memory latencies.

That said, as we're using DDR memory, the actual clocks are only half of the memory speeds, so the IF clock is operating at no more than 2000 MHz if the memory is DDR4-4000. However, if the same applies to the Ryzen 7000-series, it appears that AMD has managed to bump the IF clocks by a not insignificant 1000 MHz, as the IF fabric would now be operating at up to 3000 MHz. This could see the Ryzen 7000-series offering better memory latencies than Intel's Alder Lake and upcoming Raptor Lake CPUs, as Intel is running DDR5 memory at a 2:1 ratio or a 4:1 ratio. AMD is said to still have a 2:1 ratio as well, but as with the AM4 CPUs, this offers worse overall performance.

Update 11:49 UTC: Yuri Bubliy aka @1usmus has confirmed on Twitter that the max IF frequency of 3000 MHz and it seems like AMD has added a range of new memory and bus related features to the AM5 platform, going by the additional features he posted.

Micron Technology, Inc., one of the world's largest semiconductor companies and the only U.S.-based manufacturer of memory, today announced its plans to invest $40 billion through the end of the decade to build leading-edge memory manufacturing in multiple phases in the U.S. With the anticipated grants and credits made possible by the CHIPS and Science Act, this investment will enable the world's most advanced memory manufacturing in America. Micron expects to begin production in the second half of the decade, ramping overall supply in line with industry demand trends.

Micron's planned investment, the largest in memory manufacturing in U.S. history, will ultimately create up to 40,000 new American jobs including approximately 5,000 highly paid technical and operational roles at Micron. The Micron investment will also enrich surrounding communities by bolstering education, workforce training, transportation and several other services. Micron is finalizing its specific U.S. expansion plans and will share additional details in the coming weeks.

SMART Modular Technologies, Inc. ("SMART"), a division of SGH and a global leader in memory solutions, solid-state drives, and hybrid storage products announces its SMART Zefr Memory, a proprietary process that eliminates more than 90% of memory reliability failures and optimizes memory subsystems for maximum uptime. System start-up delays are frequently attributed to memory errors. These failures reduce system efficiency and may also lead to higher maintenance costs and lower system yield rates. These failures reduce system efficiency and may also lead to higher maintenance costs and lower system yield rates. SMART Zefr Memory has been tested under real-world conditions to identify and filter out marginal components that may undermine memory reliability.

SMART Zefr Memory uses a proprietary screening process developed by SMART that when performed on memory modules ensures the industry's highest levels of uptime and reliability. SMART Zefr Memory is ideally suited for data centers, hyperscalers, high performance computing (HPC) platforms, and other environments that run large memory applications and depend on uptime for customers.

As the world dives further into the high-speed DDR5 generation, DDR5 technologies are urged to meet the demands for more reliable and durable products. Team Group, a world-leading memory manufacturer, continues to pursue advancement and is dedicated to providing an upgraded DDR5 solution to offer higher frequencies to users around the world. Today, Team Group launches ELITE PLUS DDR5 Desktop Memory with a brand new heat sink design to effectively increase reliability. Furthermore, Team Group announces a new frequency of 6,000 MHz for ELITE DDR5 to further increase operating performance and deliver an ultra-smooth user experience. The ELITE PLUS DDR5 and ELITE DDR5 6,000 MHz Desktop Memory will be available to global users via Amazon and Newegg in North America soon.

ELITE PLUS DDR5 Desktop Memory is equipped with a sleek, simple, and asymmetric aluminium heat sink that has been specially designed to be non-conductive and to protect against scratches, acids, rusting and rotting to provide full protection for the DDR5 module. ELITE PLUS DDR5 Desktop Memory is also equipped with a 1.1 V standard working voltage which further reduces energy consumption for each unit of bandwidth comparing to the 1.2 V in DDR4, providing a more efficient power usage. The DDR5 module is equipped with PMICs for effective power distribution, reliable power supply, and minimal noise interference. The IC supports on-die ECC, a feature that self-corrects DRAM cells for enhanced stability and reliability by reducing risks of information errors.

Memory giant Micron Technology has commenced mass-production of 21 Gbps and 24 Gbps-rated GDDR6X memory chips that will be exclusively used by NVIDIA in its next-generation RTX 40-series "Ada" graphics cards. GDDR6X is a derivative of GDDR6 co-developed by NVIDIA and Micron, which leverages PAM4 signaling to increase data-rates. Depending on the graphics card model, NVIDIA will use 8 Gbit (1 GB) or 16 Gbit (2 GB) density memory chips. We're hearing that 21 Gbps will be the standard data-rate used by SKUs that succeed the RTX 3080 and RTX 3080 Ti; while 24 Gbps will be used by the faster RTX 3090/Ti successors. The part numbers of these memory chips are listed below.

ADATA, today unveils its latest series of memory modules for creators, the ADATA ACE series. Creators can choose from two models depending on their budget and performance requirements, namely the ADATA ACE 6400 DDR5 and ACE 3600 DDR4. The series also includes a limited-edition ACE 6500 DDR5 module that features a one-of-a-kind pattern design created in conjunction with a designer from Germany. All three modules support Intel XMP for hassle-free overclocking, are built with high-quality, low-latency chips, and are compatible with the latest Intel and AMD platforms.

As a creator, it is often necessary to switch between different applications to perform multiple tasks such as loading files, editing, rendering, or transferring files. What's more, frequent software updates take up valuable memory resources and thus impact memory performance. ADATA understands that creativity should never be restricted and therefore developed the ADATA ACE series memory. With ACE series memory modules, creators will enjoy enhanced performance that will allow them to be more productive and creative. Supporting Intel XMP, the modules can overclock for blazing-fast performance, whether for graphic design, video editing, or even more demanding 3D computing needs. The ADATA ACE DDR4 3600 and DDR5 6400 come in a 16 GB dual-kit.

During this year's Flash Memory Summit, Phison, a company known for SSD controllers and now flash drives, demonstrated a system running AMD Ryzen 7000 series processors based on Zen 4 architecture. What is interesting about the shown specification is that the system was running an engineering sample of an upcoming Zen 4-based CPU with the latest storage technologies at impressive speeds. Using a Phison PS5026-E26 SSD controller, also called E26, the PCIe 5.0 SSD is powered by Micron's latest 232-layer TLC NAND flash. This new NAND technology will also bring greater densities to the market by promising higher endurance, higher read/write speeds, and better efficiency.

With AMD's upcoming AM5 platform, support for PCIe 5.0 SSDs is a welcome addition. And we today have some preliminary tests that show just how fast these SSDs can run. In CrystalDiskMark 8.0.4, it achieved over 10 GB/s in both read and write. We know that the E26 controller is capable of 12 GB/s speeds, so more fine-tuning is needed. Being an early sample, we expect final specifications to be better. The system is powered by an engineering sample of a six-core, twelve-threaded Zen 4 CPU running at unknown clocks, codenamed 100-000000593-20_Y. We can expect to see more of this technology once AMD's AM5 platform lands and Phison-powered SSDs hit the shelves in September.

An alleged AMD Ryzen 7000 pre-release sample was shown running DDR5-6400 memory speed, which is already a 23 percent memory overclock on top of the DDR5-5200 native memory clock speed support. We've known since April that the Ryzen 7000 "Zen 4" processors are being designed with a focus on good memory overclocking headroom, and this is the first instance of an enthusiast-class memory speed on this platform. The feat was pulled off by Toppc, a professional overclocker affiliated with MSI.

The most interesting aspect of this feat is the density. The machine is shown featuring 64 GB of memory—something currently only doable with 32 GB quad-rank (double-sided) DIMMs; or by populating all four slots on the motherboard with 16 GB dual-rank (single-sided) DIMMs, or a 2DPC setup, which would make this feat all the more impressive. The CPU-Z screenshot by Toppc reveals a DRAM clock of 3202 MHz (DDR5-6404), and timings of 32-38-38-96. The Socket AM5 Ryzen 7000 desktop processors only support DDR5 memory type (no backwards-compatibility with DDR4), and AMD states that since it is betting solely on DDR5 (with no DDR4 sidewheels), enthusiasts can expect a good memory overclocking experience.

MaxLinear Inc. today announced the availability of Panther III, the latest in the company's Panther series of storage accelerators. The company is showcasing this product at the Flash Memory Summit in Santa Clara, CA, August 2 - 4. Booth 111. Businesses need immediate access to larger and larger amounts of data and, at the same time, are faced with security and CAPEX costs challenges. With its 16 nanometer (nm) DPU architecture, Panther III provides breakthrough data reduction, encryption, deduplication, and data protection and sets a new standard in storage acceleration with a high throughput of 200 Gbps and ultra-low single-pass transformation latency.

Panther III opens new opportunities within the storage market, including all-flash-array and non-volatile memory express (NVMe) systems. As with previous generations of Panther products, Panther III offers powerful data reduction technology that intelligently offloads the CPU to open all tiers of storage to their full bandwidth potential with no CPU or software limitations. These capabilities enable intelligent and faster dataset delivery, high-performance analytics, and improved workload accuracy in fast-growing Edge to disaggregated computing of the public cloud.

Micron Technology, Inc. (NASDAQ: MU) commends and thanks the Biden Administration for their leadership and the bipartisan work of Congress for passing the "Chips and Science" legislation. This is a big step towards securing the future of semiconductor manufacturing in the United States and advancing American innovation and competitiveness for years to come.

This legislation will bring leading-edge semiconductor manufacturing to the U.S., creating tens of thousands of jobs and tens of billions of dollars of new investments - transforming U.S. semiconductor innovation and supply chain resilience.