Leading global memory provider TEAMGROUP has been actively expanding in the industrial control field for many years. With the arrival of the new DDR5 generation, the company today announced the DDR5 ECC DIMM and DDR5 R-DIMM Industrial Server Memory modules. In recent years, there has been a steady growth in AI and HPC data applications, driving memory specifications toward higher capacities and greater performance. To meet this rising demand, TEAMGROUP has created multiple solutions with its latest innovations of DDR5 industrial server memory.

Its next-gen server memory modules can reach speeds of 6,400 MT/s, come with a maximum capacity of up to 128 GB, and operate at 1.1 V, resulting in lower overall power consumption. The memory also features two innovations in its power supply architecture and channel architecture. The new power supply architecture shifts power management from the motherboard to the DIMM itself, enhancing signal integrity and resistance to interference. The channel architecture is updated with two independent sub-channels per memory module (DIMM) to significantly improve memory access efficiency and meet the elevated demands of smart platform applications.

Samsung has started sampling high-speed 24 Gbps-rated GDDR6 memory chips. Just to be clear, these are standard GDDR6 chips built to JEDEC-specifications, and not GDDR6X, a derivative standard co-developed by NVIDIA and Micron leveraging PAM4 signaling. The 24 Gbps chips by Samsung can be used by both NVIDIA and AMD, if their GPU designs can handle the data-rates. The specific part number for the chip is "K4ZAF325BC-SC24." This chip has a density of 16 Gb (2 GB), which means 8 of these make up 16 GB across a 256-bit wide memory bus, and 12 of these make 24 GB across a 384-bit bus.

At 24 Gbps, these chips offer 50% more bandwidth than 16 Gbps, and 71% more than 14 Gbps. A hypothetical 6 nm refresh of the "Navi 21" paired with these chips, would hence have 768 GB/s of memory bandwidth on top of its Infinity Cache bandwidth, compared to 512 GB/s on the current Radeon RX 6800 XT. Since the chip is sampling, it's likely that both AMD and NVIDIA have their hands on it. There's no word on when the chip hits mass-production, but this could definitely happen within 2022.

KINGMAX, has introduced the latest DDR5 4800 MHz 16 GB desktop memory. Fully compatible with Intel's 12th-generation Alder Lake and Z690 platform, it has secured the QVL certification of a good number of main stream motherboard manufacturers, thereby attesting to its platform compatibility essential for this new era for PCs already here.

Compared with its predecessors, DDR5 4800 MHz memory stands out as an utter upgrade in overall performance. In terms of speed, DDR5 starts with a base frequency of 4800 MHz and its bandwidth of 38.4 MB/s is at least 1.5 times faster than the maximum of 25.6 MB/s offered by its DDR4 3200 MHz peers. Coupled with dual sub-channels (32-bit) that run independently, data processing becomes substantially more efficient as the memory controller enjoys a much lower data access latency.

Just yesterday, thanks to the Linux driver update, we found information stating that AMD's upcoming EPYC Genoa processor generation based on Zen 4 core IP will have a 12-channel memory controller. However, we didn't know how AMD engineered the memory controller of this processor generation and some of its maximum capabilities. However, there is an exciting discovery. According to the report from ComputerBase, with information exclusive to them, AMD will enable up to 12 TB of DDR5 memory spread across 12 memory channels. The processor supports DDR5-5200 memory, but when all 24 memory slots (two per channel) are populated, the DDR5 maximum speed drops to 4000 MT/s.

It is unclear why this is the case, and if any difficulties were designing the controller, so the maximum speed drops when every slot is used. One reassuring thing is that the bandwidth created by 12 memory channels should be sufficient to make up for the lost speed of DDR5 memory reduction.

ZADAK, announces the next step forward in gaming DRAM. The newest member of its high-end SPARK lineup is a DDR5 RGB illuminated gaming DRAM module which is available in 16 GB and 32 GB capacities. Gamers who demand the fastest clock speeds will be able to choose from modules ranging from 4800 MHz all the way up to 7200 MHz.

DDR5 also features another important upgrade: power management is no longer handled by the motherboard, but by a PMIC (power management integrated circuit) on the module itself. While DDR4 modules consume 1.2V, DDR5 modules only require 1.1V. It sounds like a small difference, but over hours and days of gaming, it adds up to significant power savings. The PMIC also gives overclockers more options when it comes to tweaking settings.

VIPER, a trademarked brand of PATRIOT, is excited to announce the availability of the new VIPER VENOM RGB and non-RGB DDR5 high-performance DRAM modules which will be available in Q1 2022. The VIPER VENOM DDR5 memory modules provide enhanced speeds ranging from 4800 MHz to 6200 MHz with kit capacities of 16 GB to 32 GB equipped with the exclusive VENOM heatspreader design with an option for RGB illumination catering to both PC hardware enthusiasts and hardcore gamers.

VIPER VENOM RGB DDR5 modules come with the stylish VENOM heatshield design with a new design to combine the LED light bar and the heatshield. The RGB light bar is an entirely new design with updated synchronization software and illumination patterns. The unique architecture of DDR5 has localized voltage adjustments based on a locked/unlocked PMIC (power management integrated circuit) and SPD HUB (serial presence detection), which provides simultaneous monitoring, threshold protection, intelligent voltage control, and power management to achieve more comprehensive voltage control.

Thermaltake, the leading PC DIY premium brand for Cooling, Gaming Gear, and Enthusiast Memory solutions, is elated to announce the launch of TOUGHRAM XG RGB - White DDR4 Memory, a new edition of the high-end TOUGHRAM XG RGB series. The new white series comes with frequencies up to 3600 MHz, 4000 MHz, 4400 MHz and 4600 MHz and capacities up to 16 GB (8 GB x2), 32 GB (16 GB x2) and 64 GB (32 GB x2), giving users a wide range of selections. Now users can match up the same white-colored chassis and cooling components to create their own style and to form the ideal PC build, especially for those who are seeking an all-white theme, the White TOUGHRAM XG RGB DDR4 series can help you to achieve a more comprehensive all-white setup.

Being compatible with the latest AMD and Intel motherboards, the White TOUGHRAM XG RGB series has been through rigorous tests to select tightly-screened ICs, designed with a ten-layer PCB, constructed with 10μ gold fingers and 2oz copper inner layers to ensure high and stable performance. The White TOUGHRAM XG RGB series also carries an exclusive style from its appearance thanks to its special design, there are 2 different colors, detailing an aluminium trim with a chrome stripe in the middle which makes the TOUGHRAM XG RGB series stand out from your everyday RAM modules.

Micron Technology, one of the world's largest semiconductor manufacturers and the only U.S.-based manufacturer of memory, today announced plans for its new memory design center in Midtown Atlanta, expanding the company's reach into the Southeast. The new site, which will open its doors for business in January 2022, enables Micron to increase its access to Atlanta's rich pool of technical talent to further advance its memory design and engineering leadership, while also driving a positive impact in the community. Micron aims to build strong partnerships with many institutions in the region including Emory University, Georgia Tech, Morehouse College, Spelman College and University of Georgia.

Headquartered in Boise, Idaho, Micron maintains U.S. offices in California, Colorado, Minnesota, Texas and Virginia and has a global manufacturing and research and development (R&D) network that spans 17 countries. Memory is at the leading edge of semiconductor manufacturing, requiring production of advanced technologies that are pushing the laws of physics. R&D investments in the field are critical for advancing DRAM innovation. Micron's Atlanta Design Center expansion will create up to 500 jobs across various STEM disciplines including computer hardware and electrical and electronic engineering.

Fujitsu Semiconductor Memory Solution Limited has launched new 8 Mbit FRAM MB85R8M2TA with parallel interface, which is the first product to guarantee 100 trillion read/write cycle times in Fujitsu's FRAM product family. Evaluation samples are currently available. The new product achieves both high-speed operations, approximately 30% faster access speed, and low power consumption, 10% less operating current, compared to Fujitsu's conventional products. This memory IC is an ideal replacement of SRAM in the industrial machines that require high-speed operation.

FRAM is a non-volatile memory product with superior features of high read/write endurance, fast writing speed operation and low power consumption, and it has been mass-produced for over 20 years. Fujitsu has been providing 8 Mbit FRAM MB85R8M2T with parallel interface since June 2018. While promoting the product, the company heard voices of customer requirements such as guaranteed writing endurance of more than 10 trillion times, operation as fast as SRAM and TSOP package compatibility to SRAM. Fujitsu is now pleased to introduce its new 8 Mbit FRAM product satisfying these requirements, maintaining FRAM's unique feature of lower power consumption.

During the Supercomputing (SC) 21 event, Intel has disclosed additional information regarding the company's upcoming Xeon server processor lineup, codenamed Sapphire Rapids. One of the central areas of improvement for the new processor generation is the core architecture based on Golden Cove, the same core found in Alder Lake processors for consumers. However, the only difference between the Golden Cove variant found in Alder Lake and Sapphire Rapids is the amount of L2 (level two) cache. With Alder Lake, Intel equipped each core with 1.25 MB of its L2 cache. However, with Sapphire Rapids, each core receives a 2 MB bank.

One of the most exciting things about the processors, confirmed by Intel today, is the inclusion of High-Bandwidth Memory (HBM). These processors operate with eight memory channels carrying DDR5 memory and offer PCIe Gen5 IO expansion. Intel has confirmed that Sapphire Rapids Xeons will feature up to 64 GB of HBM2E memory, including a few operating modes. The first is a simple HBM caching mode, where the HBM memory acts as a buffer for the installed DDR5. This method is transparent to software and allows easy usage. The second method is Flat Mode, which means that both DDR5 and HBM are used as contiguous address spaces. And finally, there exists an HBM-only mode that utilizes the HBM2E modules as the only system memory, and applications fit inside it. This has numerous benefits, primarily drawn from HBM's performance and reduced latency.

KLEVV, an emerging memory brand introduced by Essencore, today announced the latest addition to its lineup of computer memory upgrades with new DDR5 memory series, including DDR5 standard memory and signature DDR5 series of overclocking/gaming RGB memory. KLEVV DDR5 memory offers assurance of QVL testing with major motherboard brands' Z690 platforms that support the latest Intel 12th Generation 'Alder Lake' Core Processors.

KLEVV DDR5 standard desktop memory (U-DIMM) will adopt SK Hynix chips and will first launch in a 16 GB capacity with JEDEC standard frequencies of 4,800 MHz CL40-40-40 at a power-efficient 1.1 V. KLEVV DDR5 standard desktop memory kits have passed QVL testing with Z690 motherboards from leading partners including ASRock, ASUS, Gigabyte, and MSI, assuring outstanding compatibility for PC builders. Larger capacity 32 GB modules and standard memory for laptops (SO-DIMM) will follow soon.

In order to offer even more options for industrial hardware users, IoT hardware manufacturer and solution provider, OnLogic (onlogic.com), has announced two new additions to their popular ML100 Series of compact fanless computers. The ML100G-53 and ML100G-41 are powered by embedded processing platforms from Intel and AMD. The new devices build on the company's experience in highly-reliable, passively cooled computers for industrial, IoT, and edge computing applications.

"The amount of performance we're able to offer through integrating the latest processing platforms in the NUC and mini-PC footprints is astounding," said Mike Walsh, OnLogic Industrial Product Line Manager. "The ML100 Series has been, quite literally, a great fit for our customers looking to integrate powerful computing in space constrained industrial environments. Paired with our Hardshell fanless technology for thermal management and reliability, the newest additions to our ML100 Series will offer the kind of flexibility our customers and integrators demand, while letting them choose the ideal processing option for their particular application."

G.SKILL International Enterprise Co., Ltd., the world's leading manufacturer of extreme performance memory and gaming peripherals, is thrilled to announce the achievement of DDR5-7000 CL40-40-40-76 32 GB (2x16 GB) extreme speed, passing the Memtest stability test. 7000MT/s memory speed is an exciting milestone, as it was only seen under liquid nitrogen sub-zero temperature cooling not long ago in overclocking records. Accomplished with high-performance Samsung DDR5 components, this extreme speed memory is truly worthy of the G.SKILL flagship Trident Z5 family classification.

G.SKILL has been dedicated to develop the fastest possible DDR5 memory on the latest 12th Gen Intel Core desktop processors and Intel Z690 chipset motherboards. Today, G.SKILL is proud to announce the feat of reaching DDR5-7000 extreme speed, while maintaining an ultra-low CAS latency timing of CL40-40-40-76. The memory modules that reached this monumental achievement is built with high-performance Samsung DDR5 components, and has shown to be stable under Memtest. Please refer to the screenshot below.

XPG, a fast-growing provider of systems, components, and peripherals for Gamers, Esports Pros, and Tech Enthusiasts, today announces XPG, a fast-growing provider of systems, components, and Peripherals for Gamers, Esports Pros, and Tech Enthusiasts, today announces a new series of solid state drives (SSD), the XPG ATOM series, geared toward creators of different needs and budgets. They include the XPG ATOM 30, 40, and 50.

The ATOM 30 and 40 utilize PCIe Gen3x4 and NVMe 1.3 to deliver sequential read and write speeds of up to 2,500/2,000 and 3,500/3,000 MB per second, respectively, to give creators the performance they need to create without limitations. Their M.2 2280 specifications support the latest Intel and AMD platforms for creating on the latest PCs, including desktop and laptops. For users seeking a further boost, the ATOM 50 takes advantage of PCIe Gen4 x4 and NVMe 1.4 to offer read and write speeds of up to 5, 000/4,500 MB per second.

ADATA Technology, a manufacturer of high-performance DRAM modules, NAND Flash products, mobile accessories, gaming products, electric power trains, and industrial solutions today announces a new series of solid state drives (SSD), the ADATA LEGEND series, geared toward creators of different needs and budgets. They include the ADATA LEGEND 740, 750, and 840.

The LEGEND 740 and 750 utilize PCIe Gen3 x4 and NVMe 1.3 to deliver sequential read and write speeds of up to 2,500/2,000 and 3,500/3,000 MB per second, respectively, to give creators the performance they need to create without limitations. Their M.2 2280 specifications support the latest Intel and AMD platforms for creating on the latest PCs, including desktop and laptops. For users seeking a further boost, the LEGEND 840 takes advantage of PCIe Gen4 x4 and NVMe 1.4 to offer read and write speeds of up to 5,000/4,500 MB per second.

PATRIOT, a global leader in performance memory, SSDs, gaming peripherals, and flash storage solutions, today is proud to announce their first DDR5 high-performance memory will be available in the market in November 2021. The Signature DDR5 memory is approximately 75% faster performance over similar high-end and overclocked DDR4 memory right out of the gate. The memory kit provides high-speed frequencies up to 4800 MHz, with future versions ranging up to 8400 MHz. The single modules are available in various capacities, from 8 GB to 64 GB, and the perfect choice for system integrators and those looking to expand their DDR5 system memory.

"We've been working jointly with motherboard makers to ensure our DDR5 memory product line has excellent stability and compatibility with INTEL's latest ALDER LAKE desktop processor and Z690 platforms," said Roger Shinmoto, the VP of PATRIOT Memory. PATRIOT Signature DDR5 memory is designed to deliver a significant performance improvement. Only requiring 1.1 V of power, Signature DDR5 offers lower power consumption and produces less heat despite the higher frequency of 4800 MHz. Further power improvements include an onboard Power Management IC (PMIC), which provides better control of local voltage regulation while offering increased threshold protection, simultaneous monitoring, INTELligent voltage, and power management supporting increased voltage tweaking and more comprehensive adjustment ranges.

Netac DDR5 memory will be officially launched for gamers after the release of the 12th generation processor supporting for PCIe Gen5 and DDR5 memories with the introduction of big. LITTLE mixed architecture on the desktop platform and the first 10 nm Enhanced SuperFin process. The DDR5 memory launched this time is one of the Basic Series products, which is designed with the concept -- the first memory for every ordinary dream chaser. Netac hopes to bring a purer and broader world to every user with its excellent performance.

Currently, DDR4 has the initial capacity of 4 GB, while that of the Netac Basic Series DDR5 is 16 GB with the maximum capacity of 128 GB. As for frequency, the supported range is 4800 MHz to 8400 MHz. In addition, the operating voltage is lowered to 1.1 V, ensuring better power efficiency with high performance.

CORSAIR, a world leader in enthusiast components for gamers, creators, and PC builders, today kicked off the DDR5 era with the launch of DOMINATOR PLATINUM RGB DDR5 and VENGEANCE DDR5. Leveraging more than 25 years of experience crafting premium, high-performance memory, these new modules open the way to far higher frequencies, greater capacities, and faster performance. Launching initially at speeds of up to 5,200 MHz and capacities of up to 32 GB per module, DDR5 pushes the performance limit further than ever before alongside next-generation platforms, starting with 12th Generation Intel Core Processors and Z690 motherboards. With your choice between the iconic styling and stunning lighting of DOMINATOR PLATINUM RGB DDR5 or the compact, minimalist profile of VENGEANCE DDR5 in kits of 32 GB - 64 GB, CORSAIR has the options to equip your new cutting-edge PC with the unprecedented performance of DDR5.

As the performance and capabilities of modern CPUs continue to increase, your system needs upgraded memory to keep up and make the most of its potential. DDR5 ensures that today's high-end CPUs receive data as quickly as possible, and take system performance to the next level. While previous generations of DRAM were limited to less precise motherboard-based control for voltage regulation, DDR5 modules are the first equipped with onboard voltage regulation now conveniently controlled through CORSAIR iCUE software, resulting in more finely tuned and stable overclocking. iCUE also enables you to customize and save your own Intel XMP 3.0 profiles with ease, to tailor performance by app or task.

JEDEC Solid State Technology Association, the global leader in standards development for the microelectronics industry, today announced publication of the JESD79-5A DDR5 SDRAM standard. This update to the JEDEC DDR5 SDRAM standard includes features designed to enhance reliability and performance in a wide range of applications involving client systems and high-performance servers. JESD79-5A is now available for download from the JEDEC website.

Added features designed to meet industry demand for improved system reliability include bounded fault error-correction support, Soft Post-Package Repair (sPPR) undo and lock, Memory Built-In Self-Test Post Package Repair (MBIST and mPPR), Adaptive RFM, and an MR4 extension. JESD79-5A expands the timing definition and transfer speed of DDR5 up to 6400 MT/s for DRAM core timings and 5600 MT/s for IO AC timings to enable the industry to build an ecosystem up to 5600 MT/s. The nomenclature for core timing parameters and their respective definitions has been revamped to closely align with the upcoming JEDEC JESD400-5 DDR5 Serial Presence Detect (SPD) Contents V1.0 standard. The document can be accessed here.

GIGABYTE is ready with its first AORUS-branded DDR5 memory kits. Pictured below is the first of its kind, which should give you an idea of the design for the series. The one pictured below is a DDR5-5200 two-module kit with 16 GB DIMMs, making up 32 GB, which is this generation's mainstream memory amount, as 16 GB (2x 8 GB) was for DDR4, and 8 GB for DDR3 (2x 4 GB). It features XMP 3.0, letting you effortlessly enable the advertised frequencies on a Z690 chipset motherboard. It's likely that the company designs other models with 8 GB DIMMs that have higher frequencies, or even 64 GB kits using "dual-rank" 32 GB DIMMs.

ADATA XPG, a fast-growing provider of systems, components, and peripherals for Gamers, E-sports Pros, and Tech Enthusiasts, today announces that the XPG HEADSHOT gaming mouse and GENESIS DDR5 memory module have been recognized for design excellence with 2021 Good Design Awards.

The XPG HEADSHOT gaming mouse is a one-of-a-kind gaming mouse manufactured via 4D printing and AI technology. 4D printing is used to create a mechanical structure with a lattice mesh exterior that provides for an incredibly sturdy yet lightweight mouse. Thanks to 4D printing, the HEADSHOT can be custom-made to match the shape of an individual's hands for personalized ergonomics. Its design process was started with three key aspects, light weight, incomparable ergonomics and stylish design. XPG HEADSHOT also recently won Taiwan's most influential design award, the Golden Pin Design Award.

Today, ASML Holding NV (ASML) has published its 2021 third-quarter results. "Our third-quarter net sales came in at €5.2 billion with a gross margin of 51.7%, both within our guidance. Our third-quarter net bookings came in at €6.2 billion, including €2.9 billion from EUV systems. The demand continues to be high. The ongoing digital transformation and current chip shortage fuel the need to increase our capacity to meet the current and expected future demand for Memory and for all Logic nodes. ASML expects fourth-quarter net sales between €4.9 billion and €5.2 billion with a gross margin between 51% and 52%. ASML expects R&D costs of around €670 million and SG&A costs of around €195 million. For the full year, we are on track to achieving growth approaching 35%," said ASML President and Chief Executive Officer Peter Wennink.

Micron Technology, Inc. (Nasdaq: MU), the only U.S.-based manufacturer of memory and one of the world's largest semiconductor manufacturers, today announced that it intends to invest more than $150 billion globally over the next decade in leading-edge memory manufacturing and research and development (R&D), including potential U.S. fab expansion. Micron's investment will address increasing demand for memory that is essential to all computing.

Memory and storage are a growing portion of the global semiconductor industry, and today represent approximately 30% of the semiconductor market. Secular growth drivers like 5G and AI will expand usage of memory and storage across the data center and the intelligent edge, and in areas like automotive and a diversity of user devices.

G.SKILL International Enterprise Co., Ltd., the world's leading manufacturer of extreme performance memory and gaming peripherals, is thrilled to announce the world's fastest DDR5 memory kit at an extreme speed and low latency of DDR5-6600 CL36-36-36-76 32 GB (2x 16 GB). This is the world's first DDR5 memory kit to reach such high level of frequency speed and extremely efficient low timings, achieved with high-performance Samsung DDR5 ICs.

In the never-ending quest for memory performance, G.SKILL is proud to reveal the latest addition of ultra-high DDR5 frequency to the flagship Trident Z5 family. While reaching an extreme frequency speed of DDR5-6600, this memory kit specification is also created with an ultra-low timing at CL36-36-36, compared to the typical CL40-40-40 timing of DDR5, making this the ultimate performance choice for gamers, enthusiasts, and overclockers. The screenshot below shows a G.SKILL memory kit validated with the use of high performance Samsung DDR5 ICs.

SK hynix Inc. announced that it has become the first in the industry to successfully develop the High Bandwidth Memory 3, the world's best-performing DRAM. HBM3, the fourth generation of the HBM technology with a combination of multiple DRAM chips vertically connected, is a high value product that innovatively raises the data processing rate.

The latest development, which follows the start of mass production of HBM2E in July last year, is expected to help consolidate the company's leadership in the market. SK hynix was also the first in the industry to start mass production of HBM2E. SK hynix's HBM3 is not only the fastest DRAM in the world, but also comes with the biggest capacity and significantly improved level of quality.