During this year's Flash Memory Summit, Phison, a company known for SSD controllers and now flash drives, demonstrated a system running AMD Ryzen 7000 series processors based on Zen 4 architecture. What is interesting about the shown specification is that the system was running an engineering sample of an upcoming Zen 4-based CPU with the latest storage technologies at impressive speeds. Using a Phison PS5026-E26 SSD controller, also called E26, the PCIe 5.0 SSD is powered by Micron's latest 232-layer TLC NAND flash. This new NAND technology will also bring greater densities to the market by promising higher endurance, higher read/write speeds, and better efficiency.

With AMD's upcoming AM5 platform, support for PCIe 5.0 SSDs is a welcome addition. And we today have some preliminary tests that show just how fast these SSDs can run. In CrystalDiskMark 8.0.4, it achieved over 10 GB/s in both read and write. We know that the E26 controller is capable of 12 GB/s speeds, so more fine-tuning is needed. Being an early sample, we expect final specifications to be better. The system is powered by an engineering sample of a six-core, twelve-threaded Zen 4 CPU running at unknown clocks, codenamed 100-000000593-20_Y. We can expect to see more of this technology once AMD's AM5 platform lands and Phison-powered SSDs hit the shelves in September.

An alleged AMD Ryzen 7000 pre-release sample was shown running DDR5-6400 memory speed, which is already a 23 percent memory overclock on top of the DDR5-5200 native memory clock speed support. We've known since April that the Ryzen 7000 "Zen 4" processors are being designed with a focus on good memory overclocking headroom, and this is the first instance of an enthusiast-class memory speed on this platform. The feat was pulled off by Toppc, a professional overclocker affiliated with MSI.

The most interesting aspect of this feat is the density. The machine is shown featuring 64 GB of memory—something currently only doable with 32 GB quad-rank (double-sided) DIMMs; or by populating all four slots on the motherboard with 16 GB dual-rank (single-sided) DIMMs, or a 2DPC setup, which would make this feat all the more impressive. The CPU-Z screenshot by Toppc reveals a DRAM clock of 3202 MHz (DDR5-6404), and timings of 32-38-38-96. The Socket AM5 Ryzen 7000 desktop processors only support DDR5 memory type (no backwards-compatibility with DDR4), and AMD states that since it is betting solely on DDR5 (with no DDR4 sidewheels), enthusiasts can expect a good memory overclocking experience.

MaxLinear Inc. today announced the availability of Panther III, the latest in the company's Panther series of storage accelerators. The company is showcasing this product at the Flash Memory Summit in Santa Clara, CA, August 2 - 4. Booth 111. Businesses need immediate access to larger and larger amounts of data and, at the same time, are faced with security and CAPEX costs challenges. With its 16 nanometer (nm) DPU architecture, Panther III provides breakthrough data reduction, encryption, deduplication, and data protection and sets a new standard in storage acceleration with a high throughput of 200 Gbps and ultra-low single-pass transformation latency.

Panther III opens new opportunities within the storage market, including all-flash-array and non-volatile memory express (NVMe) systems. As with previous generations of Panther products, Panther III offers powerful data reduction technology that intelligently offloads the CPU to open all tiers of storage to their full bandwidth potential with no CPU or software limitations. These capabilities enable intelligent and faster dataset delivery, high-performance analytics, and improved workload accuracy in fast-growing Edge to disaggregated computing of the public cloud.

Micron Technology, Inc. (NASDAQ: MU) commends and thanks the Biden Administration for their leadership and the bipartisan work of Congress for passing the "Chips and Science" legislation. This is a big step towards securing the future of semiconductor manufacturing in the United States and advancing American innovation and competitiveness for years to come.

This legislation will bring leading-edge semiconductor manufacturing to the U.S., creating tens of thousands of jobs and tens of billions of dollars of new investments - transforming U.S. semiconductor innovation and supply chain resilience.

CORSAIR, a world leader in enthusiast components for gamers, creators, and PC builders, today announced VENGEANCE RGB DDR5 memory, equipping the celebrated VENGEANCE RGB, a top choice for performance enthusiasts, with DDR5 technology. Optimized for the latest gaming PCs and workstations, and available in black or white color options, these modules deliver sensational DDR5 performance with stunning RGB style.

Launching initially in speeds up to 6,400MT/s and capacities up to 32 GB (2x16 GB), with frequencies up to 6,600 MT/s and 2x 32 GB kits available soon, VENGEANCE RGB DDR5 lights up your system with a modern new design illuminated by brilliant RGB, while delivering the higher frequencies, greater capacities, and faster performance of DDR5.

Sapphire introduced one of the first Radeon RX 6500 XT graphics cards in the retail channel to feature 8 GB of video memory, double that of the 4 GB standard for the SKU. The Sapphire Pulse RX 6500 XT 8 GB resembles the company's standard Pulse RX 6500 XT in design. At this point it's unclear how Sapphire went about deploying 8 GB of memory with the RX 6500 XT, given its narrow 64-bit GDDR6 memory interface.

Sapphire probably used four 16 Gbit memory chips, with two chips piggybacking a 32-bit memory channel. This would finally put the metal backplate to some use, as two of the chips could be located on the reverse side of the PCB. The memory ticks at the same 18 Gbps speed as the standard RX 6500 XT. The card's typical board power is increased to 130 W, up from the 107 W AMD reference. This is probably because the added memory chips, as well as slightly increased clock speeds of 2685 MHz (game clock), vs. 2615 MHz reference. The company didn't announce pricing or availability, but is planning a global launch for this card.

Thermaltake, the leading PC DIY premium brand for Case, Cooling, Gaming peripherals, and enthusiast memory solutions, is delighted to announce a new series of DDR5 RAM, including TOUGHRAM RC DDR5, TOUGHRAM Z-ONE RGB D5, and the latest TOUGHRAM XG RGB D5 in black and white. In order to provide gamers with the most up-to-date tech, our new DDR5 lineups come with higher capacities, faster speeds, and better overall performance compared with the previous generation and will be compatible with mainstream hardware and the latest Intel motherboards. Let's have a look at our latest offerings:

To begin with, we have TOUGHRAM XG RGB D5 in black and white with a frequency of 5600MT/s recently released and are available for purchase. The TOUGHRAM XG RGB D5 series features a Hynix chipset, the built-in PMIC, On-die ECC, and XMP 3.0 one-click overclocking. However, what makes the TOUGHRAM XG series stand out is its 16 ultra-bright addressable LEDs that are fully compatible with TT RGB Plus 2.0 and NeonMaker, enabling users to highlight the aesthetics they pursue without any limitation. The series also features 2oz, 10-layer PCB, and 10μ Gold Finger, further reinforcing not only the overall quality of the product but its enhanced durability, for the package that's pleasing to look at and enjoyable to game on. Moreover, with its doubled bank group architecture, the new TOUGHRAM XG RGB D5 enhances access availability and brings you higher capacities without lag, paving the way for next-gen memory. Aside from that, the latest TOUGHRAM XG RGB D5 is also compatible with TT AI Voice Control and Amazon Alexa, allowing users to freely configure lighting effects through their voice.

Samsung Electronics Co., Ltd., the world leader in advanced memory technology, today announced that it has begun sampling the industry's first 16-gigabit (Gb) Graphics Double Data Rate 6 (GDDR6) DRAM featuring 24-gigabit-per-second (Gbps) processing speeds. Built on Samsung's third-generation 10-nanometer-class (1z) process using extreme ultraviolet (EUV) technology, the new memory is designed to significantly advance the graphics performance for next-generation graphics cards (Video Graphics Arrays), laptops and game consoles, as well as artificial intelligence-based applications and high-performance computing (HPC) systems.

"The explosion of data now being driven by AI and the metaverse is pushing the need for greater graphics capabilities that can process massive data sets simultaneously, at extremely high speeds," said Daniel Lee, executive vice president of the Memory Product Planning Team at Samsung Electronics. "With our industry-first 24 Gbps GDDR6 now sampling, we look forward to validating the graphics DRAM on next-generation GPU platforms to bring it to market in time to meet an onslaught of new demand."

Hyperscalers such as Microsoft, Google, Amazon, etc., all run their cloud divisions with a specific goal. To provide their hardware to someone else in a form called instance and have the user pay for it by the hour. However, instances are usually bound by a specific CPU and memory configuration, which you can not configure yourself. But instead, you can only choose from the few available options that are listed. For example, when selecting one virtual CPU core, you get two GB of RAM and can go as high as you want with CPU cores. However, the available RAM will also double, even though you might not need it. When renting an instance, the allocated CPU cores and memory are yours until the instance is turned off.

And it is precisely this that hyperscalers are dealing with. Many instances don't fully utilize their DRAM, making the whole data center usage inefficient. Microsoft Azure, one of the largest cloud providers, measured that 50% of all VMs never touch 50% of their rented memory. This makes memory stranded in a rented VM, making it unusable for anything else.

At Azure, we find that a major contributor to DRAM inefficiency is platform-level memory stranding. Memory stranding occurs when a server's cores are fully rented to virtual machines (VMs), but unrented memory remains. With the cores exhausted, the remaining memory is unrentable on its own, and is thus stranded. Surprisingly, we find that up to 25% of DRAM may become stranded at any given moment.

Netac officially announced its release of Shadow II DDR 5 memory. Since the end of 2021, DDR5-related topics have maintained a high level of popularity. The first reason is that the market has been looking forward to new productivity tools for a long time. Second, compared with the previous generation, DDR5 has a revolutionary improvement in both appearance and performance, such as doubling the frequency and starting at 4800 MHz; Integrated PMIC power management chip, the voltage reduces to 1.1 V, and the power consumption is lower; On-die ECC error correction function is added to make the operation more stable.

Besides the first-line brands, Netac, an established storage manufacturer, is also actively deploying this field. Netac introduces the memory of Shadow II DDR 5 after Shadow RGB DDR5. Like Shadow Series, Shadow II DDR 5 is also positioned in the middle and high end, but without RGB lighting function. In terms of parameters, the frequency specification of 4800 MHz will be launched soon, and 8/16/32 GB*2 high-capacity strap specifications will be available, with a latency of 40-40-77 and a voltage of 1.1 V. Netac said that high-frequency specifications such as 5600 MHz and 6200 MHz will be launched in the future.

In response to the evolution of industrial DDR5 memory platform specifications, global memory brand TEAMGROUP has utilized its outstanding R&D capabilities to develop the first industrial U-DIMM, SO-DIMM, ECC-DIMM, and R-DIMM DDR5 memory modules at 5,600MHz clock speeds and run at 1.1V. They are expected to meet the diverse needs of next-generation platforms, Intel Raptor Lake and AMD Raphael-X, with high-performance specifications in line with JEDEC standards, accelerating the development of high-end industrial applications.

TEAMGROUP has been making strides in the industrial market for years and is focused on DDR5 memory applications. The company previously developed a complete range of DDR5 4,800 MHz modules, and now thanks to its industry-leading R&D, TEAMGROUP has successfully increased the frequencies of its DDR5 product line to 5,600 MHz. For added security in industrial applications, an SPD Write Protection feature was also adopted, which prevents SPD parameter changes caused by abnormal interference. With these enhancements, the risk of shutdown is greatly reduced and the memory is able to operate with substantially improved performance and stability.

To meet the demand for all types of multi-tasking, high-clock-speed experiences, and high-performance computing as well as to provide users with a full range of DDR5 upgrade options, TEAMGROUP, a global memory leader, has announced the release of its newly-updated ELITE SO-DIMM DDR5 and ELITE U-DIMM DDR5 5600 MHz high-speed memory modules. Both models will be available on Amazon in North America in early July, 2022. The high clock speed allows for higher-performance DDR5 memory for both desktop and laptop computers, enhancing user productivity and improving overall operational efficiency and storage performance. Consumers worldwide can also enjoy a more stable and efficient experience with lower power consumption provided by TEAMGROUP's ELITE memory.

In response to the growing demand for high-speed computing and digital technology, TEAMGROUP has introduced the upgraded ELITE SO-DIMM DDR5 5600 MHz and ELITE U-DIMM DDR5 5600 MHz memory modules, which boast higher frequencies and low power consumption. The updated specs of the ELITE memory fully meet the needs of business, learning, and entertainment applications on desktop and laptop computers. With a low operating voltage of 1.1 V, the power consumption of the memory is significantly reduced, extending the life of computers it is installed on. In addition, DDR5's Same-Bank Refresh feature and optimized IC structure can process double the amount of data simultaneously compared to DDR4, which enables computers to operate more smoothly while multi-tasking and significantly improves operating efficiency.

Apple M1 chips are a part of the Apple Silicon family that represents a new transition to Arm-based cores with new power and performance targets for Apple devices. A portion of building a processor is designing its security enclave, and today we have evidence that M1 processors got a new vulnerability. The PACMAN is a hardware attack that can bypass Pointer Authentication (PAC) on M1 processors. Security researchers took an existing concept of Spectre and its application in the x86 realm and now applied it to the Arm-based Apple silicon. PACMAN exploits a current software bug to perform pointer authentication bypass, which may lead to arbitrary code execution.

The vulnerability is a hardware/software co-design that exploits microarchitectural construction to execute arbitrary codes. PACMAN creates a PAC Oracle to check if a specific pointer matches its authentication. It must never crash if an incorrect guess is supplied and the attack brute-forces all the possible PAC values using the PAC Oracle. To suppress crashes, PAC Oracles are delivered speculatively. And to learn if the PAC value was correct, researchers used uArch side channeling. In the CPU resides translation lookaside buffers (TLBs), where PACMAN tries to load the pointer speculatively and verify success using the prime+probe technique. TLBs are filled with minimal addresses required to supply a particular TLB section. If any address is evicted from the TLB, it is likely a load success, and the bug can take over with a falsely authenticated memory address.

Silicon Power (SP) releases its first line of memory modules featuring the all-new, next-gen DDR5 technology. Designed for gaming, the XPOWER Zenith DDR5 UDIMM module is available in both RGB and non-RGB forms. Experience even faster frequencies, greater capacities, and lower voltages with the latest release in our Zenith Series, the XPOWER Zenith DDR5 UDIMM module. Take your gaming abilities to new high scores with turbo speeds ranging from 5200 MHz to 6000 MHz. It's available in 8 GB, 16 GB, and 32 GB module densities with double the banks and double the burst length compared to DDR4 to give hardcore gamers and overclockers the power to harness DDR5's game-changing performance.

To usher in the new era of DDR5 and satisfy the demands for precise, high-performance, real-time computing, and computer multi-tasking in servers, data centers, and industrial computers, the world-leading memory brand TEAMGROUP is officially announcing today that TEAMGROUP's DDR5 Industrial Server Memory is now in mass production. The DDR5 Industrial Server Memory targets applications in high-end servers and large databases and is integrated with TEAMGROUP's patented technology, welcoming a total upgrade for next-generational servers such as Intel Eagle Stream and AMD Zen 4 Genoa.

TEAMGROUP's DDR5 ECC DIMM and DDR5 R-DIMM Industrial Server Memory modules can reach speeds of up to 6400MT/s and storage capacities of up to 128 GB, with total energy consumption reduced to 1.1 V. TEAMGROUP has also introduced Row Hammer Protection Technology to support the DFE (Decision Feedback Equalization) function to offer robust support for data storage. The memory is equipped with TEAMGROUP's patented "TRUST technology", which stands for Temperature, Robust, Unique, S.M.A.R.T. technology, and Trusty. With the TRUST technology, the industrial server memory can ensure reliable performance under harsh environments of high temperatures, high humidity, sulfurization, vibration, and shock as well as improving the overall reliability and durability of the product to guarantee that the memory can satisfy the diversified demands of next-gen servers. In addition, the DDR5 Industrial Server Memory has adopted a brand new framework. The greatest difference between the DDR5 and DDR4 server memories is that the power management is now transferred onto the DIMM, in other words, TEAMGROUP has optimized redundant circuit designs on the server, providing its DDR5 products a greater system stability, lower power consumption, better performances, larger capacities, and more stable signals.

Samsung Electronics and Red Hat today announced a broad collaboration on software technologies for next-generation memory solutions. The partnership will focus on the development and validation of open source software for existing and emerging memory and storage products, including NVMe SSDs; CXL memory; computational memory/storage (HBM-PIM, Smart SSDs) and fabrics — in building an expansive ecosystem for closely integrated memory hardware and software. The exponential growth of data driven by AI, AR and the fast-approaching metaverse is bringing disruptive changes to memory designs, requiring more sophisticated software technologies that better link with the latest hardware advancements.

"Samsung and Red Hat will make a concerted effort to define and standardize memory software solutions that embrace evolving server and memory hardware, while building a more robust memory ecosystem," said Yongcheol Bae, Executive Vice President and Head of the Memory Application Engineering Team at Samsung Electronics. "We will invite partners from across the IT industry to join us in expanding the software-hardware memory ecosystem to create greater customer value."

Kingston FURY, the gaming division of Kingston Technology Company, Inc., a world leader in memory products and technology solutions, announced today the release of Kingston FURY Beast DDR5 RGB memory. The Kingston FURY Beast family boasts the first DDR5 module used to break 10,000MT/s, this latest addition to the portfolio features enhanced RGB lighting effects with a new heatspreader design that provides bright and smooth illumination.

Kingston FURY Beast DDR5 RGB is the perfect solution to customise the style of next-generation DDR5 systems. Intel XMP 3.0-Ready and Certified, and qualified by the world's leading motherboard manufacturers, Kingston FURY Beast DDR5 RGB lets users build with confidence. With Kingston FURY CTRL2 software, users can choose from a library of preset patterns and effects. Alternatively, users can customise the smooth and vibrant RGB effects to make their system completely unique. All Kingston FURY Beast DDR5 RGB modules feature the patented Kingston FURY Infrared Sync Technology, which keeps the lighting effects in perfect lockstep.

Thanks to the excellent R&D capabilities of T-FORCE LAB, global memory leader TEAMGROUP is proud to announce the release of two new specification upgrades of T-FORCE DELTA RGB DDR5 Gaming Memory. The overclocking RAM comes in a high-speed variant clocking in at 6,600 MHz and a low-latency variant rated at 6,000 MHz CL30. Samples have been sent to major motherboard manufacturers for verification testing. Through continuous improvements in product design and R&D capabilities, TEAMGROUP is able to deliver the ultimate high-performance experience to gamers and overclocking enthusiasts around the world pursuing the best of the best.

With the maturation of DDR5 platform development, the T-FORCE DELTA RGB DDR5 Gaming Memory has undergone a revolutionary upgrade. DELTA RGB DDR5 offers two additional spec options: a DDR5-6600 CL34 2X16GB kit and a DDR5-6000 CL30 2X16GB kit. Each module is equipped with a power management chip and carefully selected high-quality ICs to provide superior system performance and stable computing. It'll fully satisfy any gamer seeking top-notch overclocking performance and buttery-smooth gaming experiences. The DELTA RGB DDR5 features the iconic 120°wide-angle RGB heatspreader with smart RGB control support. The DDR5's exclusive thermal module is combined with dazzling aluminium alloy heat sinks and a special cooling silicone, giving gamers and overclockers unparalleled thermal performance and stability as well as a visually-pleasing environment while gaming.

Amazon's AWS division has been making Graviton processors for a few years now, and the company recently announced its Graviton3 design will soon to available in the cloud. Today, we are witnessing a full launch of the Graviton3 CPUs with the first instances available in the AWS Cloud. In theC7g instances, AWS customers can now scale their workloads across 1-64 vCPU instance variants. Graviton3's 64 cores run at 2.6 GHz clock speed, 300 GB/sec maximum memory bandwidth, DDR5 memory controller, 64 cores, seven silicon die chiplet-based design, 256-bit SVE (Scalable Vector Extension), all across 55 billion transistors. Paired with up to 128 GiB of DDR5 memory, these processors are compute-intensive solutions. AWS noted that the company used a monolithic computing and memory controller logic design to reduce latency and improve performance.

One interesting thing to note is the motherboard that AWS hosts Graviton3 processors in. Usually, server motherboards can be single, dual, or quad-socket solutions. However, AWS decided to implement a unique solution with three sockets. This tri-socket setup is designed to see each CPU as an independent processor, managed by a Nitro Card, which can handle exactly three CPUs. The company notes that the CPU is now in general availability with C7g instances and you can see it below.

GeIL, is excited to announce the market launch of its EVO V DDR5 RGB Hardcore Gaming Memory kits providing high-frequency modules ranging from 4800 MHz to 6600 MHz and available in large kit capacities of 32 GB to 64 GB. The unique heatspreader design features active cooling and fascinating RGB lighting effects and is available in titanium gray or glacier white color themes.

GeIL EVO V DDR5 RGB Hardcore Gaming Memory offers unparalleled memory performance and stability to meet the intensive demand of hardcore gamers and overclockers across Intel's latest platforms. GeIL has crafted a break-through cooling solution for EVO V modules that integrates a stunning RGB light bar and two micro cooling fans into a single molded aluminium heatshield. Most importantly, the physical height of the heatspreader allows it to be compatible with most CPU coolers on the market without any mechanical interference.

Lexar, is excited to announce the launch of the new Lexar ARES DDR5 OC Desktop Memory and ARES DDR4 RGB Desktop Memory. ARES DDR5 OC Memory is designed for PC enthusiasts, gamers, overclockers and creatives while optimized on the latest Intel Core processor. ARES DDR4 RGB Memory enhances your PC with vibrant RGB lighting and blazing-fast DDR4 overclocked performance for an elevated gaming experience.

The Lexar ARES DDR5 OC Desktop Memory leverages next-gen DDR5 technology designed for the latest Intel Core processors platform and supports Intel XMP 3.02. With speeds of 5200, it provides more than 1.6x the bandwidth than that of DDR4. So whether you're operating speed-demanding video games, video editing software, or processing intensive workloads, the Lexar ARES DDR5 OC Memory enables you to experience superior DDR5 performance.

Sabrent Rocket 8 GB, 16 GB, and 32 GB DDR5-UDIMM's 4800 MHz Memory Modules for PC's. It seems like DDR4 has ruled the roost forever. Finally, new motherboards and architectures have allowed memory to grow wings with the advent of DDR5. Improved clock speeds promise up to twice the bandwidth of DDR4, all with lower voltage for better efficiency. To further help with that last bit, DDR5 has on-board power management to reduce motherboard cost and complexity. Sabrent's new DDR5 kits simply plug and play, install your memory kits of choice, enter the BIOS and hit AUTO, and reboot. For those that want to OC these kits, there is plenty of headroom to advance speeds if you want.

Reliability has also been improved by the introduction of on-die error-correction technology. Memory availability is improved by splitting the internal 64-bit (72-bit with ECC) channel into two independent, 32-bit channels (40-bit with ECC) and the addition of the same bank refresh. Combined with other features, including those that allow for up to four times the module capacity with consumer DRAM, DDR5 ensures your multi-core CPU won't be memory starved.

According to TrendForce research, looking at NAND Flash wafers, the pricing of which more sensitively reflects the market, suppliers are increasingly motivated to cut prices in exchange for sales due to weak retail demand since March and a more conservative outlook for shipments of other end products. The price of NAND Flash wafers is expected to begin falling in May and the supply of NAND Flash will gradually overtake demand in 2H22. The price decline of NAND Flash wafers in 3Q22 may reach 5~10%.

At the same time, TrendForce indicates that February's contamination incident at Kioxia was expected to tighten the market in 2Q22 and 3Q22. However, as a consequence of rising inflation and the war between Russia and Ukraine, market demand for consumer products in the traditional peak season of the second half of the year is trending conservative and the prices of client SSD, eMMC, and UFS in 3Q22 will be flat compared to 2Q22, breaking from the original expectation that prices may rise. In terms of enterprise SSDs, as demand for data centers remains strong, no significant correction in demand has yet been observed. However, as the overall NAND Flash market gradually moves into oversupply, prices will only grow slightly by approximately 0~5% in 3Q22.

Samsung Electronics, the world leader in advanced memory technology, today announced its development of the industry's first 512-gigabyte (GB) Compute Express Link (CXL) DRAM, taking an important step toward the commercialization of CXL which will enable extremely high memory capacity with low latency in IT systems. Since introducing the industry's first CXL DRAM prototype with a field-programmable gate array (FPGA) controller in May 2021, Samsung has been working closely with data center, enterprise server and chipset companies to develop an improved, customizable CXL device.

The new CXL DRAM is built with an application-specific integrated circuit (ASIC) CXL controller and is the first to pack 512 GB of DDR5 DRAM, featuring four times the memory capacity and one-fifth the system latency over the previous Samsung CXL offering. "CXL DRAM will become a critical turning point for future computing structures by substantially advancing artificial intelligence (AI) and big data services, as we aggressively expand its usage in next-generation memory architectures including software-defined memory (SDM)," said Cheolmin Park, Vice President of Memory Global Sales & Marketing at Samsung Electronics, and Director of the CXL Consortium. "Samsung will continue to collaborate across the industry to develop and standardize CXL memory solutions, while fostering an increasingly solid ecosystem."

PNY released the top-spec model of the XLR8 MAKO RGB series, with the XLR8 DDR5-6000 MAKO RGB. Designed for enthusiast PC builds, the memory modules are characterized by an aluminium heatspreader crowned by a frost-white lighting diffuser with addressable-RGB LEDs underneath, dubbed EPIC-X RGB lighting. Available in 16 GB single-module and 32 GB two-module kits, these sticks pack an Intel XMP 3.0 profile that runs them at DDR5-6000 (PC5-48000) with CL38 latency, and 1.3 V module voltage. The company didn't reveal pricing.