The global memory provider TEAMGROUP has announced the T-FORCE VULCAN DDR5 GAMING MEMORY. Designed for overclocking, the new RAM takes the design language of the sleek and compact DDR4 series even further. Its aluminium alloy heatspreader comes in a unibody design, created through a sophisticated stamping process. It features a gorgeous streamlined body and multi-angular design, outlining its one-of-a-kind visual aesthetics. With the highest-spec kit providing capacity of 2X32GB for dual channel mode and frequency of up to 5,200 MHz, the T-FORCE VULCAN DDR5 will lead the new generation of overclocking memory with its beauty and performance.

The T-FORCE VULCAN DDR5 GAMING MEMORY, debuted at the recent TEAMGROUP Online Launch Event 2021, has been highly anticipated by both gaming and overclocking enthusiasts worldwide. It uses a special thermal conducting silicone to strengthen the adhesion between the heat sink and memory, enhancing the cooling of the power management IC. The ingenious thermal design quickly dissipates heat from top to bottom, allowing the memory to maintain the optimal working temperature and provide more stable operation. It is available in frequencies of 4,800 MHz and 5,200 MHz and capacity options of single 16 GB and 32 GB sticks and dual-channel 2X16GB and 2X32GB kits, meeting the needs of a wide range of consumers seeking ultra-fast speeds. The VULCAN DDR5 GAMING MEMORY is fully tested for compatibility and reliability and will deliver incredible performance to gamers and overclocking enthusiasts around the world.

ADATA Technology, a manufacturer of high-performance DRAM modules, NAND Flash products, mobile accessories, gaming products, electric power trains, and industrial solutions today announces the ADATA DDR5-4800, a next-generation DDR5 memory module that is capable of reaching frequencies of up to 4800MT/s and comes with up to 32 GB of capacity. In addition, ADATA has worked with six major motherboard brands, including AORUS, ASROCK, ASUS, GIGABYTE, MSI and ROG to ensure optimal performance and compatibility across a wide range of motherboards.

"Through our strong R&D capabilities and close partnerships with the world's leading motherboard makers, we are committed to offering memory modules with next-generation performance, higher capacities, and enhanced stability," said Nick Dai, Senior Manager of DRAM Products at ADATA. "In the coming months, we will continue to launch a diverse array of DDR5 products to meet the different needs of creators, gamers, and other users."

GeIL, is proud to announce the launch of their latest Polaris RGB DDR5 Memory providing high-speed modules ranging from 4800 MHz to 5600 MHz and available in large kit capacities of 16 GB to 64 GB with excellent heatspreader and stunning RGB illumination for gamers and PC enthusiasts. GeIL's next-generation POLARIS RGB DDR5 Memory products do not only represent a fundamental frequency/speed upgrade but are designed to deliver unprecedented performance through the combination of larger capacities, enhanced speeds, and broader bandwidth per processor core.

Increases in system performance and efficiency are the cornerstones of any new memory generation. The new architecture has plenty of features to support that, such as the increased burst length, improved refresh schemes, and the increased bank groups significantly boosting performance. In addition, the introduction of the local voltage regulation based on the PMIC (Power Management IC) provides current monitoring, offers threshold protection, and intelligent voltage and power management for a more comprehensive range of voltage tweaking and adjustment. Finally, a newly added on-die ECC function further improves data integrity and performance enhancements.

Client-segment DDR5 memory is on the anvil, with Intel 12th Gen Core "Alder Lake-S" desktop processors that support them. It should come as little surprise then, that some of the first DDR5 memory kits will be outrageously pricey. One such product, a GeIL Polaris RGB DDR5-4800 2x 16 GB kit, saw an early listing on Newegg for $350. DDR5-4800 can be considered an entry-level memory speed (similar to DDR4-2400, when the DDR4 standard was new). DDR5 heralds 16 GB as the new mainstream module density, with "single rank" (two individual ranks for each of the two 40-bit channels per DIMM) being standard. 32 GB per DIMM will be the new premium density (four ranks, two each for the 40-bit channels per DIMM).

Given these, it's conceivable that the first DDR5 memory kits targeting gamers and PC enthusiasts will come with a heavy early-adopter premium. Luckily, the 12th Gen Core processors support both DDR5 and DDR4 memory standards, and there appears to have been a major attempt by Intel to get its motherboard partners to launch motherboards with DDR4 slots across a wide range of price-points, so people can keep using their existing memory, or buy the relatively more affordable memory kits out there. It remains to be seen just how much of a performance penalty using DDR4 attracts on the new processors.

Ahead of its launch, memory clock speeds of the upcoming AMD Radeon RX 6600 graphics card was leaked to the web by someone with access to a sample. GPU-Z detected the memory clocks on this card to be 14 Gbps, which is slower than the 16 Gbps clocks on the RX 6600 XT. This gives the RX 6600 about 12.5% lower memory bandwidth than its sibling (224 GB/s vs. 256 GB/s). Among the other specs detected by GPU-Z are 28 compute units, amounting to 1,792 stream processors (vs. 32 CUs and 2,048 of the RX 6600 XT); the same 8 GB memory amount and 128-bit memory bus width, and almost 2.50 GHz engine boost frequency. VideoCardz claims that in official benchmarks by AMD, the RX 6600 is shown trading blows with the GeForce RTX 3060.

Synopsys, Inc. today announced the industry's first complete HBM3 IP solution, including controller, PHY, and verification IP for 2.5D multi-die package systems. HBM3 technology helps designers meet essential high-bandwidth and low-power memory requirements for system-on-chip (SoC) designs targeting high-performance computing, AI and graphics applications. Synopsys' DesignWare HBM3 Controller and PHY IP, built on silicon-proven HBM2E IP, leverage Synopsys' interposer expertise to provide a low-risk solution that enables high memory bandwidth at up to 921 GB/s.

The Synopsys verification solution, including Verification IP with built-in coverage and verification plans, off-the-shelf HBM3 memory models for ZeBu emulation, and HAPS prototyping system, accelerates verification from HBM3 IP to SoCs. To accelerate development of HBM3 system designs, Synopsys' 3DIC Compiler multi-die design platform provides a fully integrated architectural exploration, implementation and system-level analysis solution.

The latest IRDM modules are designed for gamers and professionals to provide not only an aesthetic experience, but also high performance. Each module is equipped with 8 LEDs and is compatible with RGB lighting control software from leading motherboard manufacturers such as ASUS, MSI, GIGABYTE, and ASRock. This ensures that the lighting effects can be programmed in many different ways, resulting in the ability to synchronize with other RGB devices like the motherboard, computer case, cooling system, keyboard, headphones, or computer mouse. Initially, the modules will be available for sale in the currently most popular kit of 2x 8 GB 3600 MHz, but the manufacturer announces that products with other specifications will soon be added to the series.

IRDM RGB DDR4 modules are built from carefully selected components and Micron memory chips. The 3600 MHz frequency at 18-22-22 timings ensures fast and stable operation of the modules, while the black heatsink built from a combination of aluminium, silicon, and magnesium perfectly dissipates heat, even during intensive use. "We are handing our customers a product that has been long-awaited and desired on the market. We are convinced that the parameters of the new IRDM memory will be appreciated by the most demanding users, especially gamers, case modders, and enthusiasts of computer sets with RGB lighting. We wanted to provide the best product in terms of both technical characteristics and a timeless design", says Wiesław Wilk, the CEO of Wilk Elektronik SA.

Samsung Electronics Co., Ltd., the world leader in advanced memory technology, today introduced the first open-source software solution, the Scalable Memory Development Kit (SMDK), that has been specially designed to support the Compute Express Link (CXL) memory platform. In May, Samsung unveiled the industry's first CXL memory expander that allows memory capacity and bandwidth to scale to levels far exceeding what is possible in today's server systems. Now, the company's CXL platform is being extended beyond hardware to offer easy-to-integrate software tools, making CXL memory much more accessible to data center system developers for emerging artificial intelligence (AI), machine learning (ML) and 5G-edge markets.

The CXL interconnect is an open, industry-backed standard that enables different types of devices such as accelerators, memory expanders and smart I/O devices to work more efficiently when processing high-performance computational workloads. "In order for data center and enterprise systems to smoothly run next-generation memory solutions like CXL, development of corresponding software is a necessity," said Cheolmin Park, vice president of the Memory Product Planning Team at Samsung Electronics. "Today, Samsung is reinforcing its commitment toward delivering a total memory solution that encompasses hardware and software, so that IT OEMs can incorporate new technologies into their systems much more effectively."

Corsair on Wednesday tweeted the first picture of its production Vengeance DDR5 memory modules. The picture reveals a simple, minimalist design, with a sheet-metal heatspreader design with some printed graphic, and the new Vengeance logo. Unlike the Vengeance DDR4 generation, there don't appear to be false "finnage" toward the top of the module. Since DDR5 will be coexisting with DDR4 to at least the next couple of years as Intel is getting its motherboard partners to come out with a substantive lineup of LGA1700 motherboards with DDR4 memory slots, Corsair made sure to mention "DDR5" right on the module. Corsair also revealed that it is developing the first Dominator-branded DDR5 memory, which will possibly come out with the first Intel 12th Gen Core processors.

ADATA Industrial, a leading manufacturer of high-performance DRAM modules, NAND Flash products, and mobile accessories today announces the launch of a new generation of industrial-grade DDR5 memory modules that offer a major leap forward in performance. They are geared toward assisting the development of 5G, AI, Edge Computing, High-Performance Computing, Automated Vehicles, and Smart Healthcare, to name a few.

According to Yole Developments, DDR5 memory shipments will exceed DDR4 by 2023 and DDR5 sales will account for 90% of the market by 2026. DDR5 will be the undisputed standard of the future and a key component of 5G, AIoT, and other applications. To meet the future demands of its customers, ADATA has unveiled a slew of DDR5 memory modules, including U-DIMM and SO-DIMM variants. The modules utilize select high-quality ICs straight from the manufacturer and will come with capacities of 8 GB and above. Compared with DDR4, DDR5 has twice the bandwidth and offers higher frequencies of up to 4800 MHz. What's more, they operate on just 1.1 V for improved energy efficiency.

ASUS Republic of Gamers (ROG) today announced an all-new gaming peripherals lineup that channels the minimalist feel of monochrome through a striking Moonlight White color scheme. The ROG Strix Scope NX TKL 80%, tenkeyless mechanical RGB gaming keyboard, ROG Strix Impact II ambidextrous gaming mouse, ROG Strix Go Core gaming headset and ROG Cetra II Core in-ear gaming headphones are all now available in North America in this stunning colorway.

ROG has a long history of weaving Aura Sync into a huge ecosystem of devices to let gamers shine a light on their personalities through their gear - but many players also seek a minimalist look. That's why the ROG color palette is expanding to include the Moonlight White series, providing a commanding counterpart to the signature red-and-black color scheme.

Thermaltake released its highest-capacity dual-channel (2-module) DDR4 memory kit, the ToughRAM XG RGB R016R432GX2-3600C18A. This kit uses modules that are a swansong of DDR4 in terms of capacity—32 GB x 2. The 32 GB module is dual-rank, and only compatible with some of the later generations of Intel Core and AMD Ryzen processors that feature memory controllers with support for up to 128 GB of memory in total. On its part, Thermaltake claims that the modules were only tested to be compatible with Intel 10th Gen and 11th Gen Core; and AMD Ryzen 2000 series and above. In terms of performance, the ToughRAM XG RGB R016R432GX2-3600C18 packs an Intel XMP 2.0 profile for DDR4-3600 with 18-22-22-42 + CR2T timings, and 1.35 V module voltage. The module is aesthetically identical to the ToughRAM XG RGB series the company debuted in March 2021.

XPG, a fast-growing provider of systems, components, and peripherals for Gamers, Esports Pros, and Tech Enthusiasts, today announces the SPECTRIX D50 ROG-CERTIFIED DDR4 RGB memory module. The Republic of Gamers (ROG) -certified DDR4 RGB memory module is specifically tuned to work with ROG motherboards for uncompromised gaming performance. What's more, it also supports Intel XMP for easy overclocking and features RGB lighting for dazzling gaming flair.

The SPECTRIX D50 ROG-CERTIFIED DDR4 RGB has passed strict ROG overclocking and compatibility tests, ensuring optimal performance with ROG Intel DDR4 motherboards. This means ROG users can enjoy excellent performance of up to 3600 MHz and a 5% clock boost without fretting over compatibility. SPECTRIX D50 ROG-CERTIFIED DDR4 RGB is also compatible with motherboards that support Intel XMP 2.0 for straightforward overclocking without the need to go into BIOS.

Annual shipment of notebook computers and desktop PCs underwent a massive increase in 2020 thanks to the proliferation of the stay-at-home economy brought about by the COVID-19 pandemic last year, according to TrendForce's latest investigations. In particular, notebook shipment increased by a staggering 26% YoY, thereby generating a corresponding demand for DRAM chips. Although the movement of DRAM prices remained stable in 2020, there was a palpable growth in actual DRAM bit demand. Hence, global DRAM module revenue increased by about 5% YoY to US$16.9 billion for 2020.

Looking back at the price trend of DRAM modules for 2020, TrendForce indicates that the market adopted a relative conservative outlook going forward in view of the ongoing pandemic. In turn, various end-products differed wildly in their respective market performances as well. For instance, while demand for notebooks remained strong, smartphone demand was relatively bearish. Server shipment, on the other hand, was at the same time consistent yet indicative of uncertainties, to some degree. In light of the varying performances in the end-markets, PC DRAM prices did not undergo drastic fluctuations throughout the year, and DRAM module suppliers posted earnings performances that were a direct result of their sales strategies, with certain suppliers, including Kimtigo and ADATA, able to raise their revenues by a massive margin.

Corsair has recently launched two new Vengeance RGB DDR4 memory module lineups with updated heatsinks and RGB lighting. The Corsair Vengeance RGB RT modules are available in black or white and feature a new design with 10-zone RGB lighting that can be controlled with the Corsair iCUE software. The Vengeance RGB RS modules will offer a reduced 6-zone RGB lighting setup and will only be available in black. The anodized aluminium heat spreader helps keep the memory modules cool even when overclocked and Corsair has verified that all these new modules support Intel 300 Series, Intel 400 Series, Intel 500 Series, Intel X299, AMD 300 Series, AMD 400 Series, and AMD 500 Series while only the RT modules have been tested with AMD TRX40. The modules are now available to purchase and are offered in capacities of 8 GB, 16 GB, and 32 GB with speeds between 3200 MHz and 4000 MHz.

At this year's Hot chips 33 conference, Samsung has presented its works on the upcoming DDR5 memory standard. The company has managed to achieve a lot of new developments, as the newer standard pairs with new technologies to deliver higher speeds and better capacity. The Korean company designed its DDR5 modules as 8-high (8H) stacked TSV (through silicon via) dies. In the previous DDR4 implementations, Samsung used 4-high (4H) stacked TSV dies, which are actually thicker than the latest 8-high implementations. To achieve the new thin design, Samsung has used thin wafer handling techniques, which resulted in a 40% reduction in gab between stacked dies. The new 8H DDR5 modules are only 1.0 mm thick, compared to the 1.2 mm of the older 4H modules.

When it comes to performance, Samsung expects the new DDR5 modules to deliver big. Running at 7.2 Gbps speeds, the Samsung-made RDIMM/LRDIMM modules can reach up to 512 GB in capacity. This is, of course, limited to the server/enterprise market. Regular consumers/PC users can expect to have UDIMMs with up to 64 GB of capacity. The aforementioned 7.2 Gbps speed is achieved at the specified 1.1 Volts of power, meaning that Samsung's implementation is very efficient. According to some estimations made by the company, the DDR5 crossover for the mainstream market is not expected before 2023/2024, meaning that there is still a lot of time for memory makers to refine their DDR5 products.

Lexar, a leading global brand of flash memory solutions, is proud to announce the new HADES product line of Gaming DRAM products. This is our introduction into the gaming DRAM category as Lexar expands its product portfolio. The new Lexar HADES RGB DDR4 3600/3200 Desktop Memory is for gamers looking for next-level performance and an enhanced gaming experience with customizable RGB lighting. The Lexar HADES OC DDR4 3600/3200 Desktop Memory is the perfect upgrade for gamers and content creators who want optimized performance and a next-level gaming experience or for intensive workloads.

The HADES RGB DDR4 overclocked memory allows you to level-up your gaming experience without slow-downs. And with its RGB lighting effects, the HADES RGB DDR4 memory enhances your gameplay with vibrant colors of RGB lighting effects. The RGB customization creates a lively atmosphere rendering your gameplay more realistic, and adds a touch of style to your gaming setups. It also features Lexar RGB Sync, a powerful lighting control software which allows you to customize and synchronize your lighting effects by setting color, intensity, and speed while allowing you to save your lighting effects for later use. The Lexar HADES RGB DDR4 3600/3200 is also compatible with ASUS Aura Sync, GIGABYTE RGB Fusion 2.0, MSI Mystic Light, ASRock Polychrome SYNC.

KIOXIA America, Inc. today announced sampling of its newest generation of 256 and 512 gigabyte (GB) Universal Flash Storage (UFS) Ver. 3.1 embedded flash memory devices. Housed in 0.8 and 1.0 mm-high packages, the new products improve performance by 30% for random read and 40% for random write - making them thinner and faster than their predecessors. The new KIOXIA UFS devices utilize the company's most current, high-performance BiCS FLASH 3D flash memory and are targeted to a variety of mobile applications.

The broad set of power and space conscious applications that utilize embedded flash memory continue to need higher performance and density, and UFS has increasingly been the solution of choice. From a total GB perspective, UFS now accounts for the majority of the demand relative to e-MMC. According to Forward Insights, when combining overall UFS and e-MMC GB demand worldwide, almost 70% of the demand this year is for UFS, and this will continue to grow.

Corsair DIY Marketing Director, George Makris recently confirmed in a recent video that DDR5 memory could "conceivably could run much hotter than DDR4" due to voltage regulation being moved to the memory modules from the motherboard. This was reiterated by Corsair Memory Product Manager, Matt Woithe, who notes that they are prepared to handle this increased heat in Corsair DDR5 modules using their Dual-path Heat Xchange (DHX) technology. The next generation of memory also mandates the inclusion of on-die EEC which while not confirmed by Corsair will also add to the power budget of the modules. Corsair is expecting to release their first DDR5 memory modules towards the end of this year which will coincide with the launch of Intel's 12th Generation Alder Lake processors. AMD fans will need to wait until 2022 with the launch of Zen 4 to take advantage of the new DDR5 memory modules.

Samsung Electronics today reported financial results for the second quarter ended June 30, 2021. Total consolidated revenue was KRW 63.67 trillion, a 20% increase from the previous year and a record for the second quarter. Operating profit increased 34% from the previous quarter to KRW 12.57 trillion as market conditions improved in the memory market, operations normalized at the Austin foundry fab, and as effective global supply chain management (SCM) helped maintain solid profitability for the finished product businesses.

The Semiconductor business saw a significant improvement in earnings as memory shipments exceeded previous guidance and price increases were higher than expected, while the Company strengthened its cost competitiveness. For the Display Panel Business, a one-off gain and an increase in overall prices boosted profits.

The leading global motherboard, manufacturer, ASRock, is proud to announce its Intel C621A powered workstation motherboards, the C621A WS, this motherboard is able to pair with the latest Xeon W-3300 processors, giving ultimate performance for almost every application such as content creating, rendering machine and high-end workstation.

The ASRock C621A WS is a platform solely built for workstation application from ground up, the 4 PCIe 4.0 x16, 3 PCIe 4.0 x8 on this motherboard supports up to 4 dual-slot GPU/FPGA cards, perfect for Deep learning workstation, Visual computing such as 3D design and creation. The motherboard has 8 DIMM slots running at 1 DIMM per channel mode giving ultimate stability and performance, supporting DDR4 RDIMM, LRDIMM, and Intel Optane Persistent Memory in order to maximize the system capability.

Global memory leader TEAMGROUP today announces its distribution agreement with SYNNEX Corporation, a leading provider of distribution, systems design and integration services for the technology industry, to expand its reach through SYNNEX resellers in North America. TEAMGROUP's SSDs, as well as memory solutions from TEAMGROUP's T-FORCE brand, a line dedicated to gaming, will be available immediately to partners.

For years, TEAMGROUP has established a strong presence in North America. Starting with extensive development in EC channels since 2015, TEAMGROUP has secured a leading place in gaming and SI markets as the global trend of e-sports first emerged. In recent years, TEAMGROUP's revenue and sales in B2B markets have had annual growths of over 50% on average, and the company has been expanding its presence in B2B and B2C markets. With the prevalence of working remotely and online learning, TEAMGROUP's sales performance in the North American area has been taken to new heights. This agreement between TEAMGROUP and SYNNEX begins with gaming memory solutions from TEAMGROUP's T-FORCE, the gaming brand well-loved among gamers all over the world, as well as TEAM SSDs, a top choice for computer upgrades.

Regardless the hype surrounding the impending DDR5 memory and boards, Neo Forza (the gaming arm and brand of Goldkey Technology Corporation, TAIWAN) firmly believes DDR4 systems to still be the de-facto choice for the gaming community for some time to come, due primarily to both budget considerations and the large pool of DDR4 community forums. Would not be surprised for DDR4 versions of Alder Lake boards and Zen 4 boards to appear in the near horizon.

Entrenched in this belief, Neo Forza proudly announces release of readily available DDR4-5000 and DDR4-4600 memory. Neo Forza's frequency segmentation; 3000-3600 MHz | 3600-4400 MHz | 4400-5000 MHz is acknowledgement of bulk of PC gamers and enthusiasts to having systems one to two generations behind very latest CPU and mainboard offerings. Neo Forza's frequency segmentation practically matches DDR4 motherboard chipset tiers and CPU configurations, thereby eking out every last drop of performance from the system, maximizing budgets across all tiers of enthusiasts.

We have open positions on our team for 1) a motherboard reviewer, and 2) a memory reviewer. TechPowerUp Reviews are renowned for their in-depth focus on technical and performance aspects, and are supported by a large selection of tests. We are looking for someone with experience tweaking hardware in general—and memory in particular—ideally with some overclocking experience. As a motherboard reviewer you should be able to identify the various components of a motherboard PCB, discuss their quality aspects, test relevant onboard devices, provide technical photography, and put the motherboard through a selection of tests that will evolve with your feedback and community interest. Likewise for memory, we'll need you to be able to push the memory module to its limits, to detail its OC tuning potential and stability (we're not expecting you to do LN2). You should also be able to understand DRAM IC choices, memory timings and their effects, and how everything comes together for the big picture.

To meet the market demand for large-capacity data storage, TEAMGROUP today announced two high-performance, huge-capacity storage products: the TEAMGROUP MP34Q M.2 PCIe SSD, which utilizes QLC Flash and the PCIe Gen3x4 interface and comes with capacities up to 8 TB; and the HIGH ENDURANCE CARD designed for high-resolution surveillance systems. Whether it is for computer equipment or security systems used at home or a business, TEAMGROUP provides reliable upgrade solutions for those who seek the best performance and stability.

Today the company announced the TEAMGROUP MP34Q M.2 PCIe SSD, which utilizes QLC Flash and the PCIe Gen3x4 interface. It also supports NVMe 1.3 and the Dual Cache technologies: SLC Caching and DRAM Cache Buffer. The MP34Q M.2 PCIe SSD offers a massive capacity of up to 8 TB, excellent read/write speeds of up to 3,400/3,000 MB/s, and an official five-year warranty with purchase, so consumers can buy and upgrade with confidence.