GeIL, Golden Emperor International Ltd. - one of the world's leading PC components and manufacturers today announced a new member of their award-winning ORION product line, the ORION RGB Gaming Memory. The new ORION RGB Gaming Memory delivers an advanced RGB LED array built on the understated aluminium heat spreader design for an enchanting RGB illumination. It is available in frequencies ranging from 2666 MHz to the high-performance 4400 MHz with larger capacities up to 128 GB (4x 32 GB) as well as racing red and titanium gray spreaders with dual-channel and quad-channel. The new modules are optimized for the latest AMD and Intel platforms offering unparalleled performance to pro-gamers, enthusiastic builders, and video creators.

"Many of our customers have encouraged us to extend an RGB version for the ORION Memory. I'm pleased to announce the availability of the ORION RGB Gaming Memory, and it is designed for the gamers and enthusiast PC users who are looking for new ways to customize the interior of their gaming desktops." said Jennifer Huang, the Vice President of Sales and Marketing at GeIL.

Overclocking is always fun and almost everyone can do it, however, when it comes to extreme overclocking, there are only a handful of persons doing it. Today, a Chinese extreme overclocker "baby-j" has managed to establish a new world record frequency with his Crucial Ballistix Max DDR4-4000 (BLM16G40C18U4B.M8FB1) memory kit. Using liquid nitrogen (LN2) cooling for the DIMMs, the overclocker managed to push the memory kit to an amazing 7004.2 MHz, making it the world's highest frequency hit on DDR4 memory. What is more amazing is the fact that the platform used for the new record-setting overclock, is based on AMD's B550 motherboards running with AMD Ryzen 5 PRO 4650G processor, which seems to have a very good memory controller. The timings were a bit relaxed with them running at 22-26-26-46-127-1 (tCAS-tRC-tRP-tRAS-tCS-tCR) settings.

TEAMGROUP announced the T-FORCE ZEUS DDR4 U-DIMM Gaming Memory and SO-DIMM DDR4 Gaming Laptop Memory. Both possess a visually-striking design and are constructed with carefully selected, high-quality ICs. Each stick has up to 32 GB of memory and multiple frequency options, allowing you to maintain blazing speeds for your conquering foes.

The T-FORCE ZEUS DDR4 U-DIMM Gaming Memory features T-FORCE's iconic logo and a fierce thunderbolt design, symbolizing the awesome power of Zeus backing up the player. Built with a high-end integrated circuit, this memory module comes with up to 32 GB of RAM and frequency options ranging from DDR4 2666 to DDR4 3200. Say goodbye to complicated BIOS configuration as it supports overclock profiles, allowing you to switch speeds at a press of a button. You can also upgrade easily regardless of whether you use Intel or AMD processors.

The Lexar PLAY microSDXC UHS-I Card is designed to keep up with all your content, no matter if they are games, movies, music or books. Avoid slow load times with read speeds of up to 150 MB/s and fast A1 or A2-rated performance, so you can play more of what you love without missing a beat. With large capacities up to 1 TB you can save all your favorite content and is ideal for portable gaming devices, smartphones, and tablets.

Cut down delays with fast transfer speeds of up to 150 MB/s and get A1 or A2-rated performance, so you can load apps faster on your mobile devices and play more of what you love without missing a beat.

HyperX, the gaming division of Kingston Technology, Inc., today announced new single rank 16Gbit1 based HyperX FURY DDR4 RGB memory SKU additions. FURY DDR4 RGB memory delivers a boost of performance and style with sleek heat spreaders and dynamic, synchronized RGB lighting effects using patented HyperX Infrared Sync Technology.

HyperX FURY DDR4 RGB memory offers a Plug N Play feature for automatic overclocking to the highest published frequency within the system speed allowance, eliminating the need for manual tuning. Offering seamless compatibility, FURY DDR4 RGB is certified Ready for AMD Ryzen and Intel XMP-ready. Users can also customize RGB lighting effects using HyperX NGENUITY software.

Colorful, a Chinese manufacturer of PC components known for its graphics cards, is apparently preparing a special RAM version for AMD's Ryzen 5000 series CPUs. The new arrival is part of the iGame series that Colorful offers. Thanks to SMZDM forums, we have specifications of the upcoming iGame RAM tuned specifically for Ryzen 5000 series processors. Coming in with all white PCB without a heat spreader, the new Colorful iGame memory features Samsung's B-dies designed for maximum speed and performance. The dies are running at 4000 MT/s with some very strict timings. The memory features C14 (14-14-14-35) timings that are supposed to bring the system latency down and improve performance even further. It is estimated that such a configuration will require 1.5 Volts to power it. While the exact name, launch date, and pricing is unknown, we can only wait and see how Colorful plays it out.

AMD's Smart Access Memory (SAM) is a new technology that AMD decided to launch with its Ryzen 5000 series CPUs and Radeon RX 6000 series GPUs. The technology aims to solve the problem where a CPU can only access a fraction of GPU VRAM at once, making some bottlenecks in the system. By utilizing the bandwidth of PCIe, the SAM expands its data channels and uses all the speed that the PCIe connection offers. However, it appears that AMD might not be the only company offering such technology. Thanks to Gamer's Nexus, they got a reply from NVIDIA regarding a technology similar to AMD's SAM.

NVIDIA responded that: "The capability for resizable BAR is part of the PCI Express spec. NVIDIA hardware supports this functionality and will enable it on Ampere GPUs through future software updates. We have it working internally and are seeing similar performance results." And indeed, it has been a part of the PCIe specification since 2008. This document dating to 2008 says that "This optional ECN adds a capability for Functions with BARs to report various options for sizes of their memory mapped resources that will operate properly. Also added is an ability for software to program the size to configure the BAR to." Every PCIe compatible device can enable it with the driver update through the software.

KIOXIA America, Inc. (formerly Toshiba Memory America, Inc.) today unveiled the PC OEM focused KIOXIA XG7/XG7-P Series, the company's first PCIe 4.0 client solid-state drive (SSD) series for notebooks, desktops, and workstations with qualification samples currently shipping to customers. Now spanning enterprise, data center, and client segments, KIOXIA's comprehensive PCIe 4.0 SSD portfolio addresses a wide array of applications, optimizing tomorrow's data, service and content-driven world.

Built for demanding PC environments, the XG7/XG7-P Series offers 2x the sequential read speed and approximately 1.6x the sequential write speed of the PCIe Gen3 based XG6 Series1, delivering a high performance, feature-rich storage experience for content creators, gamers and professionals. With leading capacity support up to 4096 gigabytes (GBs), the XG7-P Series SSDs enable power users to take advantage of PCIe Gen4 x4 lane bandwidth and ample storage space. Furthermore, this series deploys an all-new in-house controller vertically integrated with KIOXIA's BiCS FLASH 3D flash memory, ensuring next generation feature support such as the NVMe 1.4 specification and System Management Bus (SMBus) for improved system thermal management through a sideband channel.

G.SKILL International Enterprise Co., Ltd., the world's leading manufacturer of extreme performance memory and gaming peripherals, is delighted to announce extreme low-latency with high-capacity DDR4 memory kits at DDR4-3600 CL14-15-15-35 in 64 GB (16GBx4) and 32 GB (16GBx2) configurations under the Trident Z Neo, Trident Z Royal, Trident Z RGB, and Ripjaws V series. Once again, these extraordinary memory kits are manufactured using high-performance Samsung B-die ICs to achieve the low latency of CL14 at DDR4-3600.

At G.SKILL, we are always searching for the ultimate memory kit, tuned not only for speed, but also for efficiency. And to achieve high efficiency, this means lower latency timings. As the market demand for higher capacity increases, G.SKILL has risen to the challenge, and is introducing the DDR4-3600 CL14-15-15-35 64 GB (16 GB x4) memory kit specification, shown validated on the Intel-based ASUS ROG MAXIMUS XII HERO (WI-FI) Z490 and MSI MEG Z490 GODLIKE motherboards, as well as the AMD-based ASUS PRIME X570-P motherboard.

Kioxia Corporation, the world leader in memory solutions, today announced it will begin construction of a state-of-the-art fabrication facility (Fab7) at Yokkaichi Plant in Mie Prefecture, Japan to expand production of its proprietary 3D Flash memory BiCS FLASH. The construction of Kioxia Corporation's Fab7 facility is expected to commence in the spring of 2021.

Due to technological innovation, the amount of data being generated, stored and used around the world has increased exponentially. Furthermore, the flash memory market expects further growth driven by cloud services, 5G, IoT, AI and automated driving. As a result, the production of cutting-edge products in Kioxia Corporation's Fab7 facility will continue to meet the increasing demand for memory around the world.

The Fab7 facility will be built on the north side of Yokkaichi Plant, where land development is underway. In order to secure optimal production of advanced flash memory products, the construction of Fab7 will be divided into two phases, with the first phase of construction scheduled to be completed by the spring of 2022. Kioxia plans to fund the capital investments for the construction of Fab7 from its operating cash flow.

PNY Announced today the addition of the new XLR8 Gaming EPIC-X RGB DDR4 3600 MHz Desktop Memory to the Company's assortment that will deliver the overclocked performance demanded today combined with the brilliance of RGB lighting and unmatched style. Life today demands speed and performance in everything that we do. Whether for work, content creation, learning, or gaming - and we do game - the demand for speed and performance has never been greater and as such, to count on components that deliver this speed and performance is not a luxury but a must. Consider it delivered.

Winning in extreme game titles demands higher framerates allowing for faster on-screen loading letting gamers perform at their best. Faster memory means less bottlenecking for modern CPUs and GPUs that thrive off high speed RAM. The PNY XLR8 Gaming EPIC-X RGB DDR4 3600 MHz Desktop Memory delivers the required Overclocked Performance and supports XMP 2.0 technology to provide a superior gaming experience.

AMD is preparing to launch its Radeon RX 6000 series of graphics cards codenamed "Big Navi", and it seems like we are getting more and more leaks about the upcoming cards. Set for October 28th launch, the Big Navi GPU is based on Navi 21 revision, which comes in two variants. Thanks to the sources over at Igor's Lab, Igor Wallossek has published a handful of information regarding the upcoming graphics cards release. More specifically, there are more details about the Total Graphics Power (TGP) of the cards and how it is used across the board (pun intended). To clarify, TDP (Thermal Design Power) is a measurement only used to the chip, or die of the GPU and how much thermal headroom it has, it doesn't measure the whole GPU power as there are more heat-producing components.

So the break down of the Navi 21 XT graphics card goes as follows: 235 Watts for the GPU alone, 20 Watts for Samsung's 16 Gbps GDDR6 memory, 35 Watts for voltage regulation (MOSFETs, Inductors, Caps), 15 Watts for Fans and other stuff, and 15 Watts that are used up by PCB and the losses found there. This puts the combined TGP to 320 Watts, showing just how much power is used by the non-GPU element. For custom OC AIB cards, the TGP is boosted to 355 Watts, as the GPU alone is using 270 Watts. When it comes to the Navi 21 XL GPU variant, the cards based on it are using 290 Watts of TGP, as the GPU sees a reduction to 203 Watts, and GDDR6 memory uses 17 Watts. The non-GPU components found on the board use the same amount of power.

Intel today unveiled the suite of new security features for the upcoming 3rd generation Intel Xeon Scalable platform, code-named "Ice Lake." Intel is doubling down on its Security First Pledge, bringing its pioneering and proven Intel Software Guard Extension (Intel SGX) to the full spectrum of Ice Lake platforms, along with new features that include Intel Total Memory Encryption (Intel TME), Intel Platform Firmware Resilience (Intel PFR) and new cryptographic accelerators to strengthen the platform and improve the overall confidentiality and integrity of data.

Data is a critical asset both in terms of the business value it may yield and the personal information that must be protected, so cybersecurity is a top concern. The security features in Ice Lake enable Intel's customers to develop solutions that help improve their security posture and reduce risks related to privacy and compliance, such as regulated data in financial services and healthcare.

Colorful Technology Company Limited, professional manufacturer of graphics cards, motherboards, all-in-one gaming and multimedia solutions and high-performance storage, launches the CVN Guardian RGB DDR4 gaming memory for the latest AMD platforms and the WARHALBERD DDR4 memory for the 3rd generation AMD Ryzen platform and Intel desktop platforms. The COLORFUL CVN Guardian RGB Gaming Memory sports an eye-catching heat sink with an RGB lightbar that supports motherboard RGB sync. On the other hand, the WARHALBERD is a value-oriented DDR4 memory featuring CXMT memory modules for a wide application from gaming to office PCs.

The CVN Guardian RGB DDR4 gaming memory is the latest addition to the CVN family. Designed for gamers, the CVN Guardian sports a futuristic high-performance heat spreader with superb heat dissipation to ensure stable gaming performance. COLORFUL uses specially selected Hynix CJR memory modules that offer stable performance and excellent overclocking capabilities. The CVN Guardian Gaming Memory supports XMP 2.0 automatic overclocking function for a quick performance boost.

Editor's Note: This is written by Arm vice president and general manager Paul Williamson.

Over the last year, I have been inspired by the innovators who are dreaming up solutions to improve and enrich our daily lives. Tomorrow's mobile applications will be even more imaginative, immersive, and intelligent. To that point, the industry has come such a long way in making this happen. Take app stores for instance - we had the choice of roughly 500 apps when smartphones first began shipping in volume in 2007 and today there are 8.9 million apps available to choose from.

Mobile has transformed from a simple utility to the most powerful, pervasive device we engage with daily, much like Arm-based chips have progressed to more powerful but still energy-efficient SoCs. Although the chip-level innovation has already evolved significantly, more is still required as use cases become more complex, with more AI and ML workloads being processed locally on our devices.

NZXT, a leading designer of computer hardware, software, and services for the PC gaming community, today announces the NZXT N7 Z490, its newest motherboard specially designed around Intel's 10th generation Z490 chipset. The NZXT N7 Z490 ATX motherboard focuses on providing builders with the tools to get the most out of their gaming PCs. Starting from the building process, the board layout of the N7 Z490 places the ports in an optimal location for an easy building experience.

When the build is completed, users can use NZXT CAM to easily tune their system by setting their fan curves and RGB lighting. Each board was manufactured in collaboration with ASRock, ensuring that each motherboard takes advantage of Intel's Z490 chipset and strong BIOS support. The N7 Z490 has WiFi 6 and Bluetooth V5.1 built-in so users have the newest wireless connectivity standard. Finally, the metal cover enhances the aesthetics of each build and seamlessly blends into the background of an NZXT H series case.

ADATA XPG, a provider of systems, components, and peripherals for Gamers, Esports Pros, and Tech Enthusiasts, today announces the XPG GAMMIX D20 DDR4 memory module. Sporting a dark and edgy design and operating frequencies of up to 4133 MHz, the GAMMIX D20 will help users up to their game in style.


The GAMMIX D20 sports an intimidating yet understated black or grey heatsink that discerning gamers and PC enthusiasts will find agreeable. Its sleek anodized metal surface and x-shaped design evoke an armor-like quality that screams power and stealth. Users looking for an alternative to flashier RGB modules will appreciate the GAMMIX D20. Not only does it have the look of a serious gaming DDR4, but it also has the performance of one, operating at frequencies of up to 4133 MHz. Users can also choose models that operate at 3200 MHz and 3600 MHz.

SK hynix Inc. announced to launch world's first DDR5 DRAM. It is a high-speed and high-density product optimized for Big Data, Artificial Intelligence (AI), and machine learning (ML) as a next generation standard of DRAM. Since SK hynix announced the development of World's First 16 Gigabit (Gb) DDR5 DRAM on November 2018, the Company has provided its major partners including Intel with sample products, and has completed various tests and verification of its functions and compatibility. This will allow SK hynix to provide its customers with the products once the DDR5 market becomes active.

In the meantime, SK hynix has conducted joint-operation of on-site lab, system-level test, and simulation with System-on-Chip) (SoC) manufacturers to verify the functions of DDR5. Also, the Company validated compatibility of its DDR5 and the major components on DRAM module including register clock driver) (RCD), which affect DRAM performance, and power management integrated circuit) (PMIC). Through these verifications, SK hynix has been collaborating closely with its global partners.

Today Arm announced the spin-out of Cerfe Labs to develop and license new types of non-volatile memories based on correlated electron materials (CeRAM) and ferroelectric transistors (FeFETs). Arm CeRAM researchers will join Cerfe Labs and assume ownership of the Arm joint development project with Symetrix Corporation.

As part of the spin-out, Arm will transfer its full CeRAM IP portfolio of more than 150 patent families to Cerfe Labs that will be the foundation for a roadmap of related CeRAM technologies. Cerfe Labs initial focus will be on producing meaningful prototypes which will be licensed to partners with a goal of accelerating timing of enabling these novel non-volatile materials for systems.

G.Skill Memory unveiled new variants of its SniperX line of DDR4 memory co-branded with the ASRock Steel Legend brand. This purely cosmetic collaboration sees the memory module receive stainless steel-finish aluminium heatspreaders with white urban camo heatspreader crown that blends into the design scheme of ASRock's Steel Legend motherboard design scheme. You also get prominent Steel Legend branding on the heatspreaders. The first such kit is the F4-3600C18D-32GSXAS, a 32 GB (2x 16 GB) kit with modules that tick at DDR4-3600 with 18-22-22-42, at 1.35 V. Since Steel Legend is mainly a middle-of-the-market brand by ASRock, one can expect other kits in the series, particularly 16 GB (2x 8 GB), with mid-range frequencies (ranging between DDR4-3200 to DDR4-4000). G.Skill also collaborated with ASUS TUF Gaming for special edition SniperX kits.

GeIL, Golden Emperor International Ltd. - one of the world's leading PC components & manufacturers today is proud to announce the partnership with the motherboard leader, ASRock, in expanding Phantom Gaming product line and launching the co-branded ORION Phantom Gaming Edition DDR4 Desktop Memory. This new product provides frequencies from 2666 MHz to 3600 MHz with higher capacities up to 64 GB (2x 32 GB) to deliver better performance to hardcore gamers, video content creators, and PC builders.

Since the successful collaboration on the EVO SPEAR Phantom Gaming Edition Memory in 2019, the next chapter is the ORION Phantom Gaming Edition Memory. This new product comes with Intel and AMD package versions, as well as tested and optimized on the latest AMD and Intel platforms separately to ensure optimal performance. Per a strict validation process, ORION Phantom Gaming Edition Memory is fully compatible with the ASRock Phantom Gaming series motherboard, including the latest high-end B550 PG Velocita, Z490 PG Velocita, Z490 Phantom Gaming-ITX/TB3 and more.

When NVIDIA announced its next-generation GeForce RTX 3080 and 3090 Ampere GPUs, it specified that the memory found in the new GPUs will be Micron's GDDR6X variant with 19 Gbps speed. However, being that there are faster GDDR6X modules already available in a 21 Gbps variant, everyone was left wondering why NVIDIA didn't just use the faster memory from Micron. That is exactly what Igor's Lab, a technology website, has been wondering as well. They have decided to conduct testing with an infrared camera that measures the heat produced. To check out the full testing setup and how they tested everything, you can go here and read it, including watching the video embedded.

Micron chips like GDDR5, GDDR5X, and GDDR6 are rated for the maximum junction temperature (TJ Max) of 100 degrees Celsius. It is recommended that these chips should run anywhere from 0C to 95C for the best results. However, when it comes to the new GDDR6X modules found in the new graphics cards, they are not yet any official specifications available to the public. Igor's Lab estimates that they can reach 120C before they become damaged, meaning that TJ Max should be 110C or 105C. When measuring the temperature of GDDR6X modules, Igor found out that the hottest chip ran at 104C, meaning that the chips are running pretty close to the TJ Max they are (supposedly) specified. It is NVIDIA's PCB design decisions that are leading up to this, as the hottest chips are running next to voltage regulators, which can get pretty hot on their own.

XPG, a provider of systems, components, and peripherals for gamers, eSports pros, and tech enthusiasts, today announces the XPG SPECTRIX D50 Xtreme DDR4 RGB memory module. Delivering speeds of up to 5000Hz, the XPG SPECTRIX D50 Xtreme isn't just about performance but also form with its solidly constructed heat sink with gorgeous geometric lines, dazzling RGB lighting, and a stunning reflective surface.

Manufactured with only the highest quality chips and PCBs, the SPECTRIX D50 Xtreme offers the pinnacle in stability, reliability, as well as speeds of up to 5000 MHz. What's more, it supports the latest Intel and AMD platforms. The SPECTRIX D50 Xtreme is a looker too with the combination of its indented geometric lines, triangular RGB light bar, and a polished and electroplated surface with a mirror-like sheen. The SPECTRIX D50 Xtreme comes as a dual kit with a capacity of 8 GB per module and in two performance variants, 4800 MHz and 5000 MHz.

Thermaltake, the leading PC DIY premium brand for Cooling, Gaming Gear, and Enthusiast Memory solutions is thrilled to introduce four budget-friendly chassis, the Versa T25 TG/ T35 TG RGB & H330 TG/ H350 TG RGB Mid-Tower Chassis. The overall designs allow users to display their interior designs clearly, the new Versa T25 TG and Versa T35 TG RGB Chassis comes with two tempered glass panels at the front and on the left site. While Versa T25 TG has a plain full-size tempered glass front panel, and the Versa T35 TG RGB has an RGB belt across the front panel that can be controlled by the RGB button on the IO-port; exhibiting two RGB stripes and some angles that bring some twist to the Versa series.

Being one of the two RGB enclosures the H350 TG RGB Mid-Tower Chassis inherits the consistent RGB lighting design while bringing in some new elements into the H series. The H350 TG RGB also has an RGB button along with a controllable RGB stripe which slashes through the matte front panel, distinguishing it from the previous version. The H330 TG, however, has a trapezoid-shaped solid panel while leaving the rest of the front panel with a meshed filtered design. Both H330 TG and H350 TG RGB enclosures have a tempered glass side panel for users to show off their design as well. These entry-level chassis all have inlets on the front panel to maximize air intake, and each comes with a preinstalled 120 mm fan at the rear. These four enclosures not only do they bring a new appearance to the Thermaltake chassis family, but ensure excellent ventilation.

Rambus Inc. (NASDAQ: RMBS), a premier silicon IP and chip provider making data faster and safer, today announced it has achieved a record 4 Gbps performance with the Rambus HBM2E memory interface solution consisting of a fully-integrated PHY and controller. Paired with the industry's fastest HBM2E DRAM from SK hynix operating at 3.6 Gbps, the solution can deliver 460 GB/s of bandwidth from a single HBM2E device. This performance meets the terabyte-scale bandwidth needs of accelerators targeting the most demanding AI/ML training and high-performance computing (HPC) applications.

"With this achievement by Rambus, designers of AI and HPC systems can now implement systems using the world's fastest HBM2E DRAM running at 3.6 Gbps from SK hynix," said Uksong Kang, vice president of product planning at SK hynix. "In July, we announced full-scale mass-production of HBM2E for state-of-the-art computing applications demanding the highest bandwidth available."