XPG, a fast-growing provider of systems, components, and peripherals for Gamers, Esports Pros, and Tech Enthusiasts, today announces the SPECTRIX D50 ROG-CERTIFIED DDR4 RGB memory module. The Republic of Gamers (ROG) -certified DDR4 RGB memory module is specifically tuned to work with ROG motherboards for uncompromised gaming performance. What's more, it also supports Intel XMP for easy overclocking and features RGB lighting for dazzling gaming flair.

The SPECTRIX D50 ROG-CERTIFIED DDR4 RGB has passed strict ROG overclocking and compatibility tests, ensuring optimal performance with ROG Intel DDR4 motherboards. This means ROG users can enjoy excellent performance of up to 3600 MHz and a 5% clock boost without fretting over compatibility. SPECTRIX D50 ROG-CERTIFIED DDR4 RGB is also compatible with motherboards that support Intel XMP 2.0 for straightforward overclocking without the need to go into BIOS.

Annual shipment of notebook computers and desktop PCs underwent a massive increase in 2020 thanks to the proliferation of the stay-at-home economy brought about by the COVID-19 pandemic last year, according to TrendForce's latest investigations. In particular, notebook shipment increased by a staggering 26% YoY, thereby generating a corresponding demand for DRAM chips. Although the movement of DRAM prices remained stable in 2020, there was a palpable growth in actual DRAM bit demand. Hence, global DRAM module revenue increased by about 5% YoY to US$16.9 billion for 2020.

Looking back at the price trend of DRAM modules for 2020, TrendForce indicates that the market adopted a relative conservative outlook going forward in view of the ongoing pandemic. In turn, various end-products differed wildly in their respective market performances as well. For instance, while demand for notebooks remained strong, smartphone demand was relatively bearish. Server shipment, on the other hand, was at the same time consistent yet indicative of uncertainties, to some degree. In light of the varying performances in the end-markets, PC DRAM prices did not undergo drastic fluctuations throughout the year, and DRAM module suppliers posted earnings performances that were a direct result of their sales strategies, with certain suppliers, including Kimtigo and ADATA, able to raise their revenues by a massive margin.

Corsair has recently launched two new Vengeance RGB DDR4 memory module lineups with updated heatsinks and RGB lighting. The Corsair Vengeance RGB RT modules are available in black or white and feature a new design with 10-zone RGB lighting that can be controlled with the Corsair iCUE software. The Vengeance RGB RS modules will offer a reduced 6-zone RGB lighting setup and will only be available in black. The anodized aluminium heat spreader helps keep the memory modules cool even when overclocked and Corsair has verified that all these new modules support Intel 300 Series, Intel 400 Series, Intel 500 Series, Intel X299, AMD 300 Series, AMD 400 Series, and AMD 500 Series while only the RT modules have been tested with AMD TRX40. The modules are now available to purchase and are offered in capacities of 8 GB, 16 GB, and 32 GB with speeds between 3200 MHz and 4000 MHz.

At this year's Hot chips 33 conference, Samsung has presented its works on the upcoming DDR5 memory standard. The company has managed to achieve a lot of new developments, as the newer standard pairs with new technologies to deliver higher speeds and better capacity. The Korean company designed its DDR5 modules as 8-high (8H) stacked TSV (through silicon via) dies. In the previous DDR4 implementations, Samsung used 4-high (4H) stacked TSV dies, which are actually thicker than the latest 8-high implementations. To achieve the new thin design, Samsung has used thin wafer handling techniques, which resulted in a 40% reduction in gab between stacked dies. The new 8H DDR5 modules are only 1.0 mm thick, compared to the 1.2 mm of the older 4H modules.

When it comes to performance, Samsung expects the new DDR5 modules to deliver big. Running at 7.2 Gbps speeds, the Samsung-made RDIMM/LRDIMM modules can reach up to 512 GB in capacity. This is, of course, limited to the server/enterprise market. Regular consumers/PC users can expect to have UDIMMs with up to 64 GB of capacity. The aforementioned 7.2 Gbps speed is achieved at the specified 1.1 Volts of power, meaning that Samsung's implementation is very efficient. According to some estimations made by the company, the DDR5 crossover for the mainstream market is not expected before 2023/2024, meaning that there is still a lot of time for memory makers to refine their DDR5 products.

Lexar, a leading global brand of flash memory solutions, is proud to announce the new HADES product line of Gaming DRAM products. This is our introduction into the gaming DRAM category as Lexar expands its product portfolio. The new Lexar HADES RGB DDR4 3600/3200 Desktop Memory is for gamers looking for next-level performance and an enhanced gaming experience with customizable RGB lighting. The Lexar HADES OC DDR4 3600/3200 Desktop Memory is the perfect upgrade for gamers and content creators who want optimized performance and a next-level gaming experience or for intensive workloads.

The HADES RGB DDR4 overclocked memory allows you to level-up your gaming experience without slow-downs. And with its RGB lighting effects, the HADES RGB DDR4 memory enhances your gameplay with vibrant colors of RGB lighting effects. The RGB customization creates a lively atmosphere rendering your gameplay more realistic, and adds a touch of style to your gaming setups. It also features Lexar RGB Sync, a powerful lighting control software which allows you to customize and synchronize your lighting effects by setting color, intensity, and speed while allowing you to save your lighting effects for later use. The Lexar HADES RGB DDR4 3600/3200 is also compatible with ASUS Aura Sync, GIGABYTE RGB Fusion 2.0, MSI Mystic Light, ASRock Polychrome SYNC.

KIOXIA America, Inc. today announced sampling of its newest generation of 256 and 512 gigabyte (GB) Universal Flash Storage (UFS) Ver. 3.1 embedded flash memory devices. Housed in 0.8 and 1.0 mm-high packages, the new products improve performance by 30% for random read and 40% for random write - making them thinner and faster than their predecessors. The new KIOXIA UFS devices utilize the company's most current, high-performance BiCS FLASH 3D flash memory and are targeted to a variety of mobile applications.

The broad set of power and space conscious applications that utilize embedded flash memory continue to need higher performance and density, and UFS has increasingly been the solution of choice. From a total GB perspective, UFS now accounts for the majority of the demand relative to e-MMC. According to Forward Insights, when combining overall UFS and e-MMC GB demand worldwide, almost 70% of the demand this year is for UFS, and this will continue to grow.

Corsair DIY Marketing Director, George Makris recently confirmed in a recent video that DDR5 memory could "conceivably could run much hotter than DDR4" due to voltage regulation being moved to the memory modules from the motherboard. This was reiterated by Corsair Memory Product Manager, Matt Woithe, who notes that they are prepared to handle this increased heat in Corsair DDR5 modules using their Dual-path Heat Xchange (DHX) technology. The next generation of memory also mandates the inclusion of on-die EEC which while not confirmed by Corsair will also add to the power budget of the modules. Corsair is expecting to release their first DDR5 memory modules towards the end of this year which will coincide with the launch of Intel's 12th Generation Alder Lake processors. AMD fans will need to wait until 2022 with the launch of Zen 4 to take advantage of the new DDR5 memory modules.

Samsung Electronics today reported financial results for the second quarter ended June 30, 2021. Total consolidated revenue was KRW 63.67 trillion, a 20% increase from the previous year and a record for the second quarter. Operating profit increased 34% from the previous quarter to KRW 12.57 trillion as market conditions improved in the memory market, operations normalized at the Austin foundry fab, and as effective global supply chain management (SCM) helped maintain solid profitability for the finished product businesses.

The Semiconductor business saw a significant improvement in earnings as memory shipments exceeded previous guidance and price increases were higher than expected, while the Company strengthened its cost competitiveness. For the Display Panel Business, a one-off gain and an increase in overall prices boosted profits.

The leading global motherboard, manufacturer, ASRock, is proud to announce its Intel C621A powered workstation motherboards, the C621A WS, this motherboard is able to pair with the latest Xeon W-3300 processors, giving ultimate performance for almost every application such as content creating, rendering machine and high-end workstation.

The ASRock C621A WS is a platform solely built for workstation application from ground up, the 4 PCIe 4.0 x16, 3 PCIe 4.0 x8 on this motherboard supports up to 4 dual-slot GPU/FPGA cards, perfect for Deep learning workstation, Visual computing such as 3D design and creation. The motherboard has 8 DIMM slots running at 1 DIMM per channel mode giving ultimate stability and performance, supporting DDR4 RDIMM, LRDIMM, and Intel Optane Persistent Memory in order to maximize the system capability.

Global memory leader TEAMGROUP today announces its distribution agreement with SYNNEX Corporation, a leading provider of distribution, systems design and integration services for the technology industry, to expand its reach through SYNNEX resellers in North America. TEAMGROUP's SSDs, as well as memory solutions from TEAMGROUP's T-FORCE brand, a line dedicated to gaming, will be available immediately to partners.

For years, TEAMGROUP has established a strong presence in North America. Starting with extensive development in EC channels since 2015, TEAMGROUP has secured a leading place in gaming and SI markets as the global trend of e-sports first emerged. In recent years, TEAMGROUP's revenue and sales in B2B markets have had annual growths of over 50% on average, and the company has been expanding its presence in B2B and B2C markets. With the prevalence of working remotely and online learning, TEAMGROUP's sales performance in the North American area has been taken to new heights. This agreement between TEAMGROUP and SYNNEX begins with gaming memory solutions from TEAMGROUP's T-FORCE, the gaming brand well-loved among gamers all over the world, as well as TEAM SSDs, a top choice for computer upgrades.

Regardless the hype surrounding the impending DDR5 memory and boards, Neo Forza (the gaming arm and brand of Goldkey Technology Corporation, TAIWAN) firmly believes DDR4 systems to still be the de-facto choice for the gaming community for some time to come, due primarily to both budget considerations and the large pool of DDR4 community forums. Would not be surprised for DDR4 versions of Alder Lake boards and Zen 4 boards to appear in the near horizon.

Entrenched in this belief, Neo Forza proudly announces release of readily available DDR4-5000 and DDR4-4600 memory. Neo Forza's frequency segmentation; 3000-3600 MHz | 3600-4400 MHz | 4400-5000 MHz is acknowledgement of bulk of PC gamers and enthusiasts to having systems one to two generations behind very latest CPU and mainboard offerings. Neo Forza's frequency segmentation practically matches DDR4 motherboard chipset tiers and CPU configurations, thereby eking out every last drop of performance from the system, maximizing budgets across all tiers of enthusiasts.

We have open positions on our team for 1) a motherboard reviewer, and 2) a memory reviewer. TechPowerUp Reviews are renowned for their in-depth focus on technical and performance aspects, and are supported by a large selection of tests. We are looking for someone with experience tweaking hardware in general—and memory in particular—ideally with some overclocking experience. As a motherboard reviewer you should be able to identify the various components of a motherboard PCB, discuss their quality aspects, test relevant onboard devices, provide technical photography, and put the motherboard through a selection of tests that will evolve with your feedback and community interest. Likewise for memory, we'll need you to be able to push the memory module to its limits, to detail its OC tuning potential and stability (we're not expecting you to do LN2). You should also be able to understand DRAM IC choices, memory timings and their effects, and how everything comes together for the big picture.

To meet the market demand for large-capacity data storage, TEAMGROUP today announced two high-performance, huge-capacity storage products: the TEAMGROUP MP34Q M.2 PCIe SSD, which utilizes QLC Flash and the PCIe Gen3x4 interface and comes with capacities up to 8 TB; and the HIGH ENDURANCE CARD designed for high-resolution surveillance systems. Whether it is for computer equipment or security systems used at home or a business, TEAMGROUP provides reliable upgrade solutions for those who seek the best performance and stability.

Today the company announced the TEAMGROUP MP34Q M.2 PCIe SSD, which utilizes QLC Flash and the PCIe Gen3x4 interface. It also supports NVMe 1.3 and the Dual Cache technologies: SLC Caching and DRAM Cache Buffer. The MP34Q M.2 PCIe SSD offers a massive capacity of up to 8 TB, excellent read/write speeds of up to 3,400/3,000 MB/s, and an official five-year warranty with purchase, so consumers can buy and upgrade with confidence.

Thermaltake today introduced new Turquoise color variants of its ToughRAM RGB DDR4 memory series. These are, quite simply, a turquoise anodized paint-job on the 1.8 mm-thick aluminium heatspreaders of the memory modules; and join other color variants that include Black (default), Metallic Gold, Racing Green, Racing Red, and White. The modules are still crowned by a white silicone diffuser for the addressable RGB LEDs. The ToughRAM RGB DDR4 series comes in a number of speed-based variants, ranging from DDR4-3600 to DDR4-4400. The company didn't reveal pricing.

For gamers who are ready to go to the next level, ZADAK, a leading provider of enthusiast PC gaming components and innovative water cooling solutions under Apacer Technology announces the next step forward in gaming DRAM. The newest member of its high end SPARK lineup is a DDR5 RGB illuminated gaming DRAM module which is available in 16 GB and 32 GB capacities. Gamers who demand t he fastest clock speeds will be able to choose from modules ranging from 4800 MHz all the way up to 7200 MHz.

DDR5 also features another important upgrade: power management is no longer handled by the motherboard, but by a PMIC (power management integrated circuit) on the module itself. While DDR4 modules consume 1.2 V, DDR5 modules only require 1.1 V. It sounds like a small difference, but over hours and days of gaming, it adds up to significant power savings. The PMIC also gives overclockers more options when it comes to tweaking settings. ns when it comes to tweaking settings.

Intel's Lisa Spelman, corporate vice president and general manager of the Xeon and Memory Group at Intel Corporation, has yesterday published a blog post talking about Intel's next-generation server platform codenamed Sapphire Rapids. The SPR platform is Intel's biggest step-up in the server processor space, and it is the exact CPU that will power the Aurora exascale supercomputer. Besides improvements to the CPU microarchitecture, the platform itself is bringing many benefits with it as well. It will use the latest industry protocols like DDR5 and PCIe 5.0. This is making a strong combination designed even for exascale supercomputers to be powered by this processor. However, the availability of this CPU was a bit of a mystery until yesterday. Below, you can see the quote from Ms. Lisa Spelman about the availability of said processors.

Lisa SpelmanDemand for Sapphire Rapids continues to grow as customers learn more about the benefits of the platform. Given the breadth of enhancements in Sapphire Rapids, we are incorporating additional validation time prior to the production release, which will streamline the deployment process for our customers and partners. Based on this, we now expect Sapphire Rapids to be in production in the first quarter of 2022, with ramp beginning in the second quarter of 2022.

The latest Status of the Memory Industry report from June 2021 published by Yole Developments shows the memory market continues to grow and is expected to exceed 200 billion USD in 2026. The introduction of DDR5 memory will be extremely quick with shipments expected to exceed that of DDR4 in 2023 and will account for over 90% of bits shipped by 2026. The major DRAM manufacturers have all finalized their mainstream DDR5 designs with shipments from several having already started. The report also predicts an increase in the amount of DRAM used in all product categories which will contribute to strong revenue growth for memory manufacturers.

SK Hynix is at the forefront of developing the next generation of stacked high-bandwidth memory, the HBM3 standard. Succeeding the current HBM2e standard, HBM3 will power next-generation HPC and AI processors in high-density multi-chip modules. A Tom's Hardware report citing information from SK Hynix reveals two key details about the new standard. For starters, it could offer per-pin data-rates of 5.2 Gbps, a 44% increase over the 3.6 Gbps that HBM2e caps out at. This results in a per-stack bandwidth of 665 GB/s, compared to 480 GB/s for the HBM2e. A processor with four such stacks (over a 4096-bit wide bus), would hence enjoy 2.66 TB/s of memory bandwidth. It's likely that HBM3 stacks from SK Hynix could implement the DBI Ultra 2.5D/3D hybrid bonding interconnect technology licensed from Xperi Corp.

Thermaltake, the leading PC DIY premium brand for Cooling, Gaming Gear, and Enthusiast Memory solutions, is delighted to announce the launch of new capacities for TOUGHRAM XG RGB DDR4 Memory Kits, aiming to meet the toughest needs of creators while producing video, animation or exporting large files.

The memory kits are forged with frequencies up to 3600 and 4000 MHz and capacities up to 32 GB (16 GB x2) and 64 GB (32 GB x2). The TOUGHRAM XG RGB series inherits the same craftsmanship and quality expected from the TOUGHRAM name; they are compatible with the latest AMD and Intel motherboards and they have been through rigorous tests to select tightly-screened ICs, designed with a with a ten-layer PCB, constructed with 10μ gold fingers and 2oz copper inner layers to ensure high and stable performance. Designed with 2 different colors of aluminium and trimmed with a chrome stripe in the middle, the TOUGHRAM XG RGB is ambitioned at providing an exclusive style for users standing out from the normal.

VIPER, a trademarked gaming brand of PATRIOT and a global leader in performance memory, solid-state drives and flash storage solutions, today is proud to announce the market launch of their VIPER ELITE II DDR4 PERFORMANCE MEMORY. The VIPER ELITE II inherits its successful design from the award-winning ELITE PERFORMANCE MEMORY series and continues to deliver unparalleled stability and overclocking potential to hardware enthusiasts and hardcore gamers. It is customized for the PC builder looking for an RGB-free performance-centric memory solution with a wide range of speeds and capacities.

"The VIPER ELITE II is a sensible upgrade to our popular and award-winning VIPER ELITE series, and with it, we take everything back to the basics and essentials to how an excellent DRAM module should be built. For the VIPER ELITE II, we have focused on speed, capacity, and stability," said Roger Shinmoto, the Vice President of VIPER. "These memory kits offer many options for gamers or content creators who are looking to escalate their system performance to the next level and still maintain a stealthy look inside their PCs."

addlink has just announced three of their upcoming addGame products, which are the X95 M.2 PCIe 4.0 SSD, SPIDER 4 and SPIDER X4 DDR4 memory at Computex 2021. addlink showcased the full range of addlink's M.2 NVMe SSD product line and has brought these products to the forefront for attendees to experience virtually.

Building on the success of addGame X70 SSD, addGame now presents high-performance M.2 PCIe 4.0 - X95 SSD, overclocking DDR4 memory - SPIDER 4 and SPIDER X4. All three of the products not only featured high-quality aluminium but also tightly screened ICs that optimized stability and compatibility when dealing with heavy workload or high-definition games.

XPG, a fast-growing provider of systems, components, and peripherals for Gamers, Esports Pros, and Tech Enthusiasts, today announces that it will launch its new DDR5 gaming memory modules in Q3 2021. The new product series will be known as the CASTER series. The modules will deliever frequencies ranging from 6000 to 7400 MHz and come with capacities of 8, 16, or 32 GB. XPG has been working closely with its motherboard partners, including GIGABYTE, MSI, ASUS, and ASRock, to ensure the highest level of compatibility and ability to realize extreme overclocking performance.

The new DDR5 modules will come in two variants, with and without RGB. Despite this difference, they share a cohesive industrial design. The products' designs convey an understated sense of depth and textural contrast with the use of two surface treatments, one glossy and one matte. For added depth, the matte surface of the modules are beveled for an additional textural element and futuristic look. To communicate the XPG brand, the modules sport diagonal intersecting lines and grooves that form geometric forms and X shapes that play off the XPG brand name and visual identity.

BIOSTAR, a leading manufacturer of motherboards, graphics cards, and storage devices today, announces the new DDR4 RGB Gaming X series RAM modules. Enjoy blazing fast speeds with BIOSTAR's latest DDR4 RGB Gaming X series RAMs. Highly optimized for gaming and content creation, the new RAM modules are the best in business with extreme performance and reliability.

The latest DDR4 RGB Gaming X series RAMs enter the market in single and dual-stick Kits, with a single stick carrying 8 GB of memory capacity. Users can pick up between clock speeds of 3200 MHz and 3600 MHz and can overclock the modules up to 4000 MHz with ease. These RAMs are great for either Intel or AMD systems and carry BIOSTAR certified DDR4 OC memory chips that perform faster and more reliably than anything else in the market.

GeIL, Golden Emperor International Ltd. - one of the world's leading PC component manufacturers, is proud to announce the next-generation DDR5 RGB high-performance gaming memory, Polaris RGB, is ready for the upcoming DDR5 platform. The GeIL Polaris RGB Gaming Memory will be available in Q4, 2021, with capacities ranging from 16 GB (16 GB x1) up to 128 GB (32 GB x4).

It has been seven years since DDR4 launched into the market, and GeIL has put countless hours into developing the new DDR5 memory modules. And in doing so, GeIL has designed the Polaris RGB to provide RGB illuminated high-performance DDR5 gaming memory and has been working closely with motherboard makers to guarantee the best compatibility and reliability among the latest Intel and AMD motherboards.

The fifth iteration of DDR technology, called DDR5, is set to arrive later this year. Many makers of DDR4 technology are announcing their plans to switch to the new standard, and CORSAIR is no exception. Known as the maker of high-quality products, CORSAIR has today posted a blog post teasing company's upcoming DDR5 products, and what they will be bringing to the table. For starters, the company has posted data about DDR5 modules that run at 6400 MHz speed, which is assumed to be the speed of the CORSAIR DDR5 modules when they arrive. At such speed, the memory can achieve a bandwidth of 51 GB/s, which is almost double the 26 GB/s that DDR4-3200 MHz memory achieves.

Another point CORSAIR wrote about is the capacity of a single DIMM. With DDR4, the company has made DIMMs that are only up to 32 GB in capacity. However, with DDR5, CORSAIR plans to quadruple that and build a single DDR5 DIMM that has up to 128 GB of memory on it. Another big point was the power required to run the new technology. The DDR4 standard required 1.2 Volts for operation, while the JEDEC specification says that DDR5 needs just 1.1 Volts to run. This will result in a cooler operation of memory modules.