GIGABYTE Technology: Giga Computing, a subsidiary of GIGABYTE and an industry leader in high-performance servers, server motherboards, and workstations, today announced new GIGABYTE enterprise series solutions for the AMD EPYC 8004 Series processors. Giga Computing is committed to reaching all sizes of data centers to deliver the best compelling solution, and now is doing so with new AMD EPYC 8004 CPUs that target edge applications, CSPs, and value enterprises. For these uses, the new R243 and R143 server series are poised alongside ME33 and ME03 motherboard series to deliver cost-optimized performance.

Leveraging the "Zen 4c" core architecture, the AMD EPYC 8004 Series CPUs deliver performance and power efficiency with built-in security capabilities in an optimized single-socket platform. Additionally, the new SP6 socket was designed to enable the power, cost, and form factor requirements for the AMD EPYC 8004 Series CPUs' target markets as well as diverse applications such as intelligent edge computing and telco.

TYAN, an industry-leading server platform design manufacturer and a subsidiary of MiTAC Computing Technology Corporation, today announced availability of new single-socket server platforms supporting AMD EPYC 8004 Series processors. These platforms are purpose built for cloud services and intelligent edge deployments while offering lower operating costs and delivering impressive energy efficiency.

"The AMD EPYC 8004 Series CPUs deliver a great combination of impressive performance and streamlined platform componentry which enables us to develop business-relevant server configurations for our customers," said Eric Kuo, Vice President of the Server Infrastructure Business Unit at MiTAC Computing Technology. "TYAN's innovative server platform, fueled by EPYC 8004 Series CPUs, empowers us to provide our customers with cost-effective solutions while also expanding into new markets."

According to VideoCardz, we can look forward to Intel launching its next gen Core processor in the middle of next month, or at least some of them will launch then. As always when it comes to Intel and product launches, it appears to be a staggered launch, but this time around it's getting a bit strange. We checked with our sources to see if the proposed date by VideoCardz was indeed correct and were told that motherboards should be available later this month, largely due to Intel not offering a new chipset for the 14th Gen Core processors. This means the motherboard makers are free to launch their refreshed board for the the 14th Gen Core processors pretty much as they please.

The first CPUs that should launch are said to be the Core i9-14900K, Core i7-14700K and Core i5-14600K, as well as their KF counterparts. Advertising for these CPUs will kick off on the 16th of October followed by sales and reviews on the 17th of October, according to VideoCardz. The remaining Raptor Lake refresh CPUs are said to launch sometime in early 2024, most likely with a CES announcement followed by availability sometime in the first quarter. However, it appears that Intel will officially announce the Raptor Lake refresh processors during Intel Innovation 2023, which kicks off next week, on the 19th of September. Early performance leaks suggest that those with a recent CPU won't be overly tempted by these new chips from Intel and most consumers are better off waiting for Intel's move to a new socket next year, if they're looking at getting a new Intel based system.

Six Intel 14th Gen Core Raptor Lake-S Refresh SKUs were prematurely listed by an e-tailer late last month, with the already leaked Core i9-14900K CPU model popping up again (a week later) via CPU-Z and Geekbench tests. This higher end K and KF product lineup is expected to launch at some point next month—according to the rumor mill. Team Blue could be preparing cheaper non-K models for an unveiling at CES 2024, but a leaker has decided to spoil the fun way in advance. YuuKi_AnS uploaded an allegedly extremely comprehensive list of 14th Gen SKUs, complete with full specifications to their X/Twitter handle. This grants an early glimpse of lowly Intel 300 and 300T models—both featuring a 2P+0E core configuration—these appear to be modern successors to (now retired) Pentium Gold and Celeron branded budget-friendly processor families.

It should be noted that the leaked slide (dated September 5) states that everything sitting within the table is a qualification sample (QS), therefore these chips are subject to change due to their pre-production nature. Parts of the table look a bit iffy—support for DDR5 memory varies across the range, while EEC memory support is also very inconsistent. Intel seems to be sticking with the usual set of three different die designs for desktop Raptor Lake Refresh CPUs—Tom's Hardware points out that: "the B0 die (8P-16E) powers SKUs from the Core i5-14600 and up, while the C0 (8P+8E) die targets models from Core i5-14400 to Core i5-14500T. On the contrary, the H0 (6P+0E) die, which is the lowest of the trio, will be inside the Intel 300 to Core i3-14100T chips."

MIPS, a leading developer of high- performance RISC-V compute IP, has announced embedded systems industry veteran Sameer Wasson as the company's new CEO. Before joining MIPS, Wasson spent 18 years at Texas Instruments (TI), most recently as Vice President, Business Unit (BU) Manager, Processors, where he was responsible for the company's Processor businesses. In that role, Wasson re-established TI as a mainstream microprocessor (MPU) and microcontroller (MCU) supplier for high growth automotive and industrial markets, and established the company's footprint in embedded AI, software defined vehicles, and electrification.

As the new CEO of MIPS, Wasson will further accelerate the company's leadership in the High-Performance RISC-V market as it continues to expand its footprint in Automotive and Enterprise markets.

TrendForce reports an interesting shift in the electronics landscape: dwindling inventories for TV components, along with a surging mobile repair market that's been driving TDDI demand, have sparked a smattering of urgent orders in the Q2 supply chain. These last-minute orders have served as pivotal lifelines, propping up Q2 capacity utilization and revenue for semiconductor foundries. However, the adrenaline rush from these stop-gap orders may be a short-lived phenomenon and is unlikely to be carried over into the third quarter.

On the other hand, demand for staple consumer products like smartphones, PCs, and notebooks remains sluggish, perpetuating a slump in the use of expensive, cutting-edge manufacturing processes. At the same time, traditionally stable sectors—automotive, industrial control, and servers—are undergoing inventory correction. The confluence of these trends has resulted in a sustained contraction for the world's top ten semiconductor foundries. Their global revenue declined by approximately 1.1% for the quarter, amounting to a staggering US$26.2 billion.

IBASE Technology Inc. (TPEx: 8050), a leading provider of embedded computing solutions, introduces the IB837 3.5" single board computer that is designed for a wide range of IoT applications, including industrial automation, smart retail, healthcare, smart city and edge AI solutions, combining powerful processing capabilities with extensive connectivity options.

At the heart of the IB837 is the onboard Intel Celeron N & J series (formerly Elkhart Lake) processor, offering a good balance of performance and power efficiency. With support for up to 16 GB of DDR4-3200 SO-DIMM memory, the SBC ensures smooth multitasking and efficient operation, delivering exceptional performance while consuming minimal power for applications requiring a compact form factor.

Today, AMD announced that SAP has chosen AMD EPYC processor-powered Google Cloud N2D virtual machines (VMs) to run its cloud ERP delivery operations for RISE with SAP; further increasing adoption of AMD EPYC for cloud-based workloads. As enterprises look toward digital modernization, many are adopting cloud-first architectures to complement their on-premises data centers. AMD, Google Cloud and SAP can help customers achieve their most stringent performance goals while delivering on energy efficiency, scalability and resource utilization needs.

AMD EPYC processors offer exceptional performance as well as robust security features, and energy efficient solutions for enterprise workloads in the cloud. RISE with SAP helps maximize customer investments in cloud infrastructure and, paired with AMD EPYC processors and Google Cloud N2D VMs, aims to modernize customer data centers and transform data into actionable insights, faster. "AMD powers some of the most performant and energy efficient cloud instances available in the world today," said Dan McNamara, senior vice president and general manager, Server Business Unit, AMD. "As part of our engagement with Google Cloud and SAP, SAP has selected AMD EPYC CPU-powered N2D instances to host its Business Suite enterprise software workloads. This decision by SAP delivers the performance and performance-per-dollar of EPYC processors to customers looking to modernize their data centers and streamline IT spending by accelerating time to value on their enterprise applications."

Gamers Nexus recently visited AMD's headquarters in Austin, Texas—a previous video documented company employees discussing the history of Zen CPUs, and the showcasing of historical prototypes including (unreleased) Ryzen 9 5950X3D and 5900X3D models. The YouTube channel promised that more AMD HQ tour footage would be shared over the next couple of weeks—their latest upload has (host) Steve Burke talking to representatives from various internal labs.

A notable detail extracted from Team Red's thermal laboratory was an old heat spreader concept for Zen 4 processors—the team evaluated whether a concealed vapor chamber would offer improved cooling performance versus conventional metal solutions. Their tests determined that the extra cost (not disclosed) required to integrate a vapor chamber was not worth the resultant 1°C temperature difference, when lined up against a traditional metal design IHS. AMD confirmed that the concept was not developed further since prototype chips were also found to generate heat exceeding expected normal levels, under continuous long-term workload conditions.

Chinese tech tipster Enthusiast Citizen (ECSM) has once again posted about upcoming Intel CPU product launches—according to an inside info post (published via Bilibili), Team Blue has possibly scheduled their Raptor Lake Refresh/14th Gen Core K-series for a release window around the 42nd week of 2023 (October 17 - 23). ECSM posits that non-K models will arrive during the first week of 2024, coinciding with January's CES trade event. The Core i7-14700K model is said to feature a new configuration of 8 Performance and 12 Efficiency cores, and current LGA1700 motherboards will most likely require a firmware upgrade to run this specific SKU.

ECSM also seems to have insider information regarding motherboard chipsets for desktop Arrow Lake/15th Gen Core, although they cannot determine an accurate time frame for the (fully new) product launch. Intel Z890, B860 and H810 chipsets are named as possible upcoming candidates for proper next generation CPUs, with H870 allegedly dropped from development. ECSM claims that a competing AMD Zen 5 lineup is not arriving this year—prior insider information was perhaps fabricated. They believe that Storm Peak (Zen 4 Threadripper) is scheduled for Q4 2023, with two unnamed chipsets lined up to accompany this next-gen HEDT platform.

Intel's Xeon Sapphire Rapids CPU series has had a bumpy ride so far, with the discovery of bugs resulting in delays pushing proceedings back by more than two years. Units have been shipping out for the past couple of months, but Team Blue ran into more issues in late June—a subset of fourth Generation Intel Xeon Medium Core Count Processors (SPR-MCC) could interrupt normal system operation under certain conditions. Intel confirmed to Tom's Hardware that they were actively investigating the latest bugs, and had paused shipment of affected MCC die-based models (featuring up to 32 cores).

The publication has very recently received an update from their contact at Intel. A company spokesperson stated: "Last week, we informed you (Tom's Hardware) of an issue on a subset of 4th Generation Intel Xeon Medium Core Count Processors (SPR-MCC) that could interrupt system operation under certain conditions. Out of an abundance of caution, we temporarily paused some SPR-MCC shipments while we thoroughly evaluated a firmware mitigation. We are now confident the firmware mitigation addresses the issue. We have resumed shipping all versions of SPR-MCC and are working with customers to deploy the firmware as needed." Specifics about the latest mitigations efforts have not been divulged, but Intel is confident that these fixes will not impact processor performance.

According to the Linux Kernel Mailing List, AMD started to enable next-generation processors by submitting patches to the Linux kernel. Codenamed Family 1Ah or Family 26 in decimal notation, the set of patches corresponds to the upcoming AMD Zen 5 core, which is the backbone of the upcoming Ryzen 8000 series processors. The patches have a few interesting notes, namely few of them being: added support for the amd64_edac (Error Detection and Correction) module and temperature monitoring; added PCI IDs for these models covering 00h-1Fh and 20h; added required support in k10temp driver.

The AMD EDAC driver also points out that the Zen 5 server CPUs will max out with 12-channel memory. Codenames 0-31 correspond to next-generation EPYC, while 40 to 79 are desktop and laptop SKUS. Interestingly, these patches are just the start, as adding PCI IDs and temperature drivers are basic enablement. With the 2024 launch date nearing, we expect to see more Linux kernel enablement efforts, especially with more complicated parts of the kernel.

ASRock Industrial is introducing new choices in industrial motherboards powered by 13th Gen Intel Core Processors (Raptor Lake-S) with up to 24 cores and 32 threads that boost computer-intensive edge performance. They come equipped with Intel W680, Q670, and H610 chipsets, and offer support for up to DDR5-5600 memory modules and PCIe Gen 5, allowing expanded possibilities and seamless integration within industry-specific applications.

By harnessing the power of the 13th Gen Intel Core Processors, they leap up to 1.04x/1.34x/1.25x faster in single-thread, multi-thread, and CPU image classification inference performance, respectively, compared to the preceding 12th Gen Intel Core processors. The new 13th Gen Intel CPU motherboards with DDR5 support, available in Mini-ITX, Micro-ATX, and ATX form factors, have been specifically designed to cater to the unique requirements of the Edge AIoT applications in commerce, automation, robot, entertainment, and security industries.

Intel China has taken to Weibo and Bilibili in a new effort to explain how things will pan out for 14th generation CPU lineups, with emphasis on its new branding and naming conventions for 2023 and beyond. These announcements contain the company's first official acknowledgement of Raptor Lake-U, Raptor Lake-S and Raptor Lake-HX SKUs getting a refresh. Team Blue's branding scheme is set to become even more convoluted with Meteor Lake premiering with "Core Ultra" instead of the old "i" labelling system. The China office's product rundowns indicate that the Raptor Lake Refresh series will be split into Core # and Core i# families, which complicates matters further.

It seems that Raptor Lake-U & H Refresh (mobile) and the entire Meteor Lake lineup will be assuming the new Core # branding scheme, but the latter series will be more performant—hence the adding of Ultra (e.g Ultra Core 5/7/9), so customers can tell the difference between product lines lumped into the same generation! Desktop Raptor Lake-S Refresh and high-end mobile Raptor Lake-HX Refresh processors will retain the company's traditional "Core i" naming convention, this will eventually be retired with the 14th gen family.

Supermicro, Inc., a Total IT Solution Provider for Cloud, AI/ML, Storage, and 5G/Edge, is announcing that its entire line of H13 AMD based-systems is now available with support for 4th Gen AMD EPYC processors, based on "Zen 4c" architecture, and 4th Gen AMD EPYC processors with AMD 3D V-Cache technology. Supermicro servers powered by 4th Gen AMD EPYC processors for cloud-native computing, with leading thread density and 128 cores per socket, deliver impressive rack density and scalable performance with energy efficiency to deploy cloud native workloads in more consolidated infrastructure. These systems are targeted for cloud operators to meet the ever-growing demands of user sessions and deliver AI-enabled new services. Servers featuring AMD 3D V-Cache technology excel in running technical applications in FEA, CFD, and EDA. The large Level 3 cache enables these types of applications to run faster than ever before. Over 50 world record benchmarks have been set with AMD EPYC processors over the past few years.

"Supermicro continues to push the boundary of our product lines to meet customers' requirements. We design and deliver resource-saving, application-optimized servers with rack scale integration for rapid deployments," said Charles Liang, president, and CEO of Supermicro. "With our growing broad portfolio of systems fully optimized for the latest 4th Gen AMD EPYC processors, cloud operators can now achieve extreme density and efficiency for numerous users and cloud-native services even in space-constrained data centers. In addition, our enhanced high performance, multi-socket, multi-node systems address a wide range of technical computing workloads and dramatically reduce time-to-market for manufacturing companies to design, develop, and validate new products leveraging the accelerated performance of memory intensive applications."

AAEON's UP brand, known for its sophisticated developer board range, have announced the release of the UP Squared i12, the smallest developer board with 12th Generation Intel Core /Celeron Processor 7000 Series Processors. The 85.6 mm x 90 mm form factor is the latest to move into its third generation, and much like recent releases from the brand's UP Xtreme and UP Squared Pro collections, the UP Squared i12 displays a number of distinct upgrades on its predecessor.

With 12th Generation Intel Core processors and onboard LPDDR5 on such a tiny board, the UP Squared i12 targets a number of key markets with its potential to be deployed as a low-cost, space-efficient, and high-performance foundation for developers to work with. AAEON believe the greater bandwidth speed offered by the board's LPDDR5 will be beneficial to projects in the smart retail space, being particularly suited to applications such as frictionless shopping and intelligent vending machines.

TYAN, an industry-leading server platform design manufacturer and a subsidiary of MiTAC Computing Technology Corporation, will be showcasing its latest HPC, cloud and storage platforms at Computex 2023, Booth #M0701a in Taipei, Taiwan from May 30 to June 2. These platforms are powered by AMD EPYC 9004 Series processors, which offer superior energy efficiency and are designed to enhance data center computing performance.

"As businesses increasingly prioritize sustainability in their operations, data centers - which serve as the computational core of an organization - offer a significant opportunity to improve efficiency and support ambitious sustainability targets," said Eric Kuo, Vice President of the Server Infrastructure Business Unit at MiTAC Computing Technology Corporation. "TYAN's server platforms powered by 4th Gen AMD EPYC processor enable IT organizations to achieve high performance while remaining cost-effective and contributing to environmental sustainability."

Russian business news outlet Kommersant has learned from industry figures that prices of natively-designed computer processors have been on the rise since the beginning of 2023. Domestic manufacturers of PC, server and storage systems are requiring greater supplies of CPUs designed by Baikal Electronics and MCST - the publication posits that growing demand and logistical issues have become the root cause of recent climbs in cost - individuals involved in the computer hardware supply chain have suggested that some processor models have doubled in price. Sergey Ovchinnikov, the chief executive of Norsi-Trans (a server and data storage firm) provided comment: "Production of Russian chips at foreign fabs has become more complex, leading to extended logistics chains and, consequently, an increase in the cost of the final component." International trade sanctions have not prevented the arrival of fresh silicon into the region - Ovchinnikov claims that an unnamed foundry is able to supply (likely via proxy) Russian developers with computer processors.

Kommersant's investigation found out that Baikal's BE-T1000 CPU is now sold for roughly $110 (8900 Rubles) at a popular computer hardware e-tailer (ChipDip) in the region. The very basic dual core MIPS32r5 (28 nm) processor was readily available for $50 (3990 rubles) back in 2018, so its price has risen by 220% in recent times. TSMC was contracted as the manufacturer of Baikal's BE-T1000 CPU, and the Taiwanese foundry started producing these SoCs in 2016. A Baikal Electronics representative has denied any involvement in driving up MSRP, and states that it is up to distributors and retail outfits to determine prices. The company suspects that very old stock is being sold at inflated rates - Kommersant was unable to contact anyone at ChipDip for a statement.

Ampere Computing today announced a new AmpereOne Family of processors with up to 192 single threaded Ampere cores - the highest core count in the industry. This is the first product from Ampere based on the company's new custom core, built from the ground up and leveraging the company's internal IP. CEO Renée James, who founded Ampere Computing to offer a modern alternative to the industry with processors designed specifically for both efficiency and performance in the Cloud, said there was a fundamental shift happening that required a new approach.

"Every few decades of compute there has emerged a driving application or use of performance that sets a new bar of what is required of performance," James said. "The current driving uses are AI and connected everything combined with our continued use and desire for streaming media. We cannot continue to use power as a proxy for performance in the data center. At Ampere, we design our products to maximize performance at a sustainable power, so we can continue to drive the future of the industry."

Researchers at the Technical University of Berlin have published a paper called "faulTPM: Exposing AMD fTPMs' Deepest Secrets," highlighting AMD's firmware-based Trusted Platform Module (TPM) is susceptible to the new exploit targeting Zen 2 and Zen 3 processors. The faulTPM attack against AMD fTPMs involves utilizing the AMD secure processor's (SP) vulnerability to voltage fault injection attacks. This allows the attacker to extract a chip-unique secret from the targeted CPU, which is then used to derive the storage and integrity keys protecting the fTPM's non-volatile data stored on the BIOS flash chip. The attack consists of a manual parameter determination phase and a brute-force search for a final delay parameter. The first step requires around 30 minutes of manual attention, but it can potentially be automated. The second phase consists of repeated attack attempts to search for the last-to-be-determined parameter and execute the attack's payload.

Once these steps are completed, the attacker can extract any cryptographic material stored or sealed by the fTPM regardless of authentication mechanisms, such as Platform Configuration Register (PCR) validation or passphrases with anti-hammering protection. Interestingly, BitLocker uses TPM as a security measure, and faulTPM compromises the system. Researchers suggested that Zen 2 and Zen 3 CPUs are vulnerable, while Zen 4 wasn't mentioned. The attack requires several hours of physical access, so remote vulnerabilities are not a problem. Below, you can see the $200 system used for this attack and an illustration of the physical connections necessary.

Today, AMD introduced the new Ryzen Z1 Series processors, the ultimate high-performance processor for handheld PC gaming consoles. The Ryzen Z1 Series features two high performance processors, the Ryzen Z1 and Ryzen Z1 Extreme, both offering industry-leading gaming experiences, uncompromising battery life, and featuring AMD RDNA 3 architecture-based graphics. AMD is partnering with Asus to launch the first Ryzen Z1 Series device with the Asus ROG Ally, a premium handheld PC console, featuring up to a Ryzen Z1 Extreme processor.

"At AMD, we're continually advancing the next generation of gaming experiences, from consoles to desktops to on-the-go handheld devices," said Jason Banta, corporate vice president and general manager, Client OEM at AMD. "Ryzen Z1 processors deliver gamers an elite gaming experience and extreme portability in exciting gaming form factors."

Not entirely unexpected, Intel has started to discontinue its 11th Gen Core processors, also known as Tiger Lake. In a product change notification (PCN) the company has listed no less than five mobile and four desktop parts that the company will stop letting its customers order from the end of June this year, with the last shipment taking place at the end of January 2024.

The discontinued range covers everything from Core i3 to Core i9 models and the full range of discontinued models can be found in the screenshot below. It should be noted that the desktop parts are the B SKU parts that were for example found in Intel's NUC 11 Extreme and are 65 W TDP parts. Most of the mobile parts are still available in products being sold, albeit, most of those products being older SKUs that have been replaced by 12th and 13th Gen Core processors by now. None of the products in the PCN were available directly to end consumers to purchase as far as TPU is aware.

Following its successful demonstration of a MIPI camera solution using the UP Squared Pro 7000 at Embedded World, AAEON have announced a MIPI Expansion Kit for the newly released third generation board. Equipped with the Intel Atom Processors x7000E Series, Intel Core i3-N305 Processor and Intel Processor N Series (formerly Alder Lake-N) and an FPC port supporting MIPI-CSI interface, the UP Squared Pro 7000 emphasizes AAEON's continued dedication to bringing the latest Intel technologies to a wider variety of platforms. One such platform is the LI-ADL-ADP-IMX415-MIPI-081H, a 4K MIPI Camera Module from leading intelligent embedded camera creator, Leopard Imaging Inc.

The company recently announced that the camera has been designed with full-function drivers to support the Intel Atom Processors x7000E Series, Intel Core i3-N305 Processor, and Intel Processor N Series (formerly Alder Lake-N), allowing users to take advantage of the peripheral Intel technologies that come with the processor platform, such as Intel UHD Graphics on a Windows 10 IoT Enterprise OS.

Intel today expanded its 13th Gen Core "Raptor Lake" client processor family into the commercial segment. Devices in this segment are bought in bulk by large businesses and enterprises; the processors powering them have certain in-built device security and remote management features that enforce company policy regardless of where the employees take the devices. Intel has been pioneering hardware-level remote-management and device security features for close to two decades now, with its vPro feature-set (originally launched as Centrino vPro in the 2000s. The new 13th Gen Core vPro lineup covers popular processor models across various device form-factor classes, spanning ultraportables (15 W or below), thin-and-light commercial notebooks (28 W to 35 W segment); mainstream commercial notebooks (45 W to 55 W); and commercial desktops (65 W).

The 13th Gen vPro series have a lot in common with the 12th Gen Core vPro series, At a hardware-level, these are processors based on the same "Raptor Lake" silicon as the mainstream-client 13th Gen Core processors, but with the enhanced vPro Management Engine that interacts with a compatible operating system to offer endpoint remote manageability for administrators. The desktop versions of these chips have identical SKU differentiation to 65 W 13th Gen Core processors already launched, but with either vPro or vPro Essentials feature-sets. Something similar applies to the 15 W U-segment, 28 W P-segment, and 35-45 W H-segment Core vPro processors. Along with these processors, Intel is debuting Q700-series chipsets specific to the form-factor. For U- and P-segment mobile processor SKUs, the core-logic is part of the processor package; while the H-segment and S-segment (desktop) processors come with discrete chipsets. With the 13th Gen, Intel is also standardizing a new WiFi 6E (Gig+) WLAN chipset with vPro features.

AIC today announced its EB202-CP is ready to support newly launched 4th Gen AMD EPYC Embedded 9004 processors. By leveraging the five-year product longevity supported by AMD EPYC Embedded processors, EB202-CP provides customers with stable and long-term support. AIC and AMD will join forces to showcase EB202-CP at Embedded World in AMD stand No. 2-411 from 14th to 16th March, 2023 in Nuremberg, Germany.

AIC EB202-CP, a 2U rackmount server designed for AI and edge appliances, is powered by the newly released 4th Gen AMD EPYC Embedded processors. Featuring the world's highest-performing x86 processor and PCIe 5.0 ready, the 4th Gen AMD EPYC Embedded processors enable low TCO and delivers leadership energy efficiency as well as state-of-the-art security, optimized for workloads across enterprise and edge. EB202-CP, with 22 inch in depth, supports eight front-serviceable and hot-swappable E1.S/ E3.S and four U.2 SSDs. By leveraging the features of the 4th Gen AMD Embedded EPYC processors, EB202-CP is well suited for broadcasting, edge and AI applications, which require greater processing performance and within the most efficient, space-saving format.