ASUS today announced that the new BIOS with AMD AGESA 1.0.0.2 update for X570 and B550 series motherboards are now available for download. While the existing BIOS support Ryzen 3000XT processors, the new BIOS optimize the performance of the latest AMD Ryzen 3000XT series processors (Ryzen 9 3900XT, Ryzen 7 3800XT, and Ryzen 5 3600XT). The UEFI BIOS updates are available from the respective motherboard support pages, and can be accessed via the ASUS Support website.

AMD's 7 nm "Renoir" APU silicon, which features eight "Zen 2" CPU cores, has only a quarter of the L3 cache of the 8-core "Zen 2" CCD used in "Matisse," "Rome," and "Castle Peak" processors, with each of its two quad-core compute complexes (CCXs) featuring just 4 MB of it (compared to 16 MB per CCX on the 8-core "Zen 2" CCD). Chinese-language tech publication TecLab pubished a quick review of an alleged Ryzen 7 4700GE socket AM4 processor based on the "Renoir" silicon, and discovered that the chip offers significantly lower memory latencies than "Matisse," posting just 47.6 ns latency when paired with DDR4-4233 dual-channel memory.

In comparison, a Ryzen 9 3900X with these kinds of memory clocks typically posts 60-70 ns latencies, owing to the MCM design of "Matisse," where the CPU cores and memory controllers sit on separate dies, which is one of the key reasons AMD is believed to have doubled the L3 cache amount per CCX compared to previous-generation "Zeppelin" dies. TecLab tested the alleged 4700GE engineering sample on a ROG Crosshair VIII Impact X570 motherboard that has 1 DIMM per channel (the best possible memory topology).

AMD is planning to bundle "Assassin's Creed: Valhalla" will 3rd generation Ryzen desktop processors in a yet-unannounced game bundle likely to go live on July 7, according to a VideoCardz report. Localized to select markets and retailers, the bundle will see AMD giving away coupons for the latest chapter in the Assassin's Creed universe, with retail Ryzen 7 3700X, Ryzen 7 3800X, Ryzen 7 3800XT, Ryzen 9 3900X, Ryzen 9 3900XT, and Ryzen 9 3950X. Interestingly, there's no release date for the game itself, besides a vague "Holiday 2020" as announced by Ubisoft, so it's likely that redeeming the game bundle coupon will simply add ownership of the game to your UPlay account (similar to a pre-order), which you can download/pre-load and play when the game is released.

CORSAIR, a world leader in high-performance gaming peripherals and enthusiast components, today announced the launch of the new CORSAIR ONE a100 Compact Gaming PC, the first system in the award-winning CORSAIR ONE family of small-form-factor desktop PCs to feature a powerful AMD Ryzen 3000 Series processor. With the incredible single-threaded and multi-threaded performance of a 3rd Gen Ryzen CPU, GeForce RTX graphics from NVIDIA, and a wealth of premium CORSAIR components, the CORSAIR ONE a100 delivers outstanding productivity for content creation and an extraordinary gaming experience in a refined chassis that takes up less desk space than a laptop.

The new CORSAIR ONE a100 is available in three configurations, each equipped with a Ryzen 3000 Series processor, ranging from the 12-core, 24-thread AMD Ryzen 9 3900X to the 16-core, 32-thread AMD Ryzen 9 3950X CPU, utilizing Zen 2 architecture to boost performance and efficiency while gaming and running multiple demanding applications. Incredibly lifelike graphics are made possible by the amazing performance and real-time ray-tracing technology of an NVIDIA GeForce RTX graphics card, up to a GeForce RTX 2080 Ti. Each CORSAIR ONE a100 is completed with a host of celebrated CORSAIR components, including 32 GB of VENGEANCE LPX 3,200 MHz DDR4 memory optimized for AMD Ryzen 3000 and a Force MP600 NVMe M.2 SSD taking full advantage of PCIe 4.0 bandwidth. Like all CORSAIR ONE systems, the a100 is able to pack all of this immense power into a chassis that's less than ¼ the volume of a conventional desktop PC, while still keeping temperatures in check, thanks to a patented convection-assisted liquid cooling system.

AMD marshaled its retailer ecosystem to cut the pricing of its 12-core/24-thread Ryzen 9 3900X processor down to USD $410. At this price, the 3900X is poised to threaten both the 10-core/20-thread Core i9-10900K and the 8-core/16-thread Core i7-10700K. Although bearing a $489 MSRP, the i9-10900K is seen going for upwards of $510. The i7-10700K, on the other hand, is being priced around the $410 mark. The iGPU-devoid i9-10900KF is expected to be around $20 cheaper, which should put its retail pricing around $480, while the i7-10700KF could go for around $380.

Pricing of both chips are along expected lines, as retail pre-tax prices typically end up 5% above the 1,000-unit tray pricing Intel announces for its processors. The Hardware Unboxed review of the i9-10900K shows it taking a roughly 7% lead in gaming performance over the 3900X (averaged), while falling 12% behind in multi-threaded compute performance. The i7-10700K is expected to be slightly faster than the i9-9900K. Adding value to the AMD chip is the fact that it includes a cooling solution in the retail package, which Intel doesn't, for the i9-10900K/KF and the i7-10700K/KF. A February 2020 report postulated that AMD has significant headroom to cut prices of its 3rd generation Ryzen processors to maintain competitiveness against Intel, until they are relieved by the "Zen 3" based 4th gen Ryzen "Vermeer" processors in September 2020.

EUROCOM's Nightsky ARX15 Superlaptop offers an extraordinary balance of performance and mobility, skillfully bridging the gap between a lightweight gaming laptop and a powerful mobile working platform for creative professionals. The new Nightsky ARX15 is EUROCOM's first Superlaptop powered by up to the AMD Ryzen 9 series (16cores / 32 threads) desktop processors in a laptop form factor. Paired with NVIDIA's latest generation RTX Graphics, the Nightsky ARX15 delivers power users a new level of incredible performance. Innovation is a key focus at Eurocom. Years of cultivating the research and development process along with working closely with its passionate and knowledgeable followers has culminated in the creation of the most powerful Eurocom system to date.

Introducing the first superlaptop from Eurocom equipped with a desktop AMD Ryzen 3000- series CPU, the new Eurocom Nightsky ARX15 Superlaptop. Weighing just 2.6 kg and equipped with an onboard nVidia GeForce RTX 2070 (8 GB DDR6), the Nightsky ARX15 is the perfect mix of a thin and light, yet astonishingly powerful system. With its CPU-upgradeable, User-upgradeable and modular design, the Eurocom Nightsky ARX15 grants users the power to ascend to brand new threshold of power.

A comprehensive review of the Intel Core i9-10900K 10-core/20-thread processor by Chinese tech publication TecLab leaked to the web on video sharing site bilibili. Its testing data reveals that Intel has a fighting chance against the Ryzen 9 3900X both in gaming- and non-gaming tasks despite a deficit of 2 cores; whereas the much pricier Ryzen 9 3950X only enjoys leads in multi-threaded synthetic- or productivity benchmarks.

Much of Intel's performance leads are attributed to a fairly high core-count, significantly higher clock speeds than the AMD chips, and improved boosting algorithms, such as Thermal Velocity Boost helping the chip out in gaming tests. Where Intel loses hard to AMD is power-draw and energy-efficiency. TecLab tested the three chips with comparable memory- and identical graphics setups.More charts follow.

AMD earlier this week trimmed prices of its retail 3rd generation Ryzen desktop processors in the US, through promotions exclusive to Newegg and Amazon. The company is also including 3-month Xbox Game Pass subscriptions with select models. The discounts see the 12-core/24-thread Ryzen 9 3900X go for $449, $50 lower than its MSRP of $499. The company's fastest 8-core/16-thread part, the Ryzen 7 3800X, is now going for $359, or $40 lower than its $399 MSRP. The popular Ryzen 7 3700X 8-core/16-thread chip is selling for $304, a $25 discount from its $329 MSRP. AMD is applying similar $25 cuts to its 6-core/12-thread parts, with the Ryzen 5 3600X going for $224 compared to its $249 MSRP, and the popular Ryzen 5 3600 priced at $174 compared to its $199 MSRP.

Fractal Design partnered with Greg Salazar to bring you a chance to win a pre-built gaming PC inspired by the Lamborghini Aventador. Other prizes include 24-hour exotic car rentals so you can turn heads wherever you go. The star attraction is the Aventador-inspired gaming PC, powered by Fractal Design hardware. Nestled in a custom Fractal Design Meshify C chassis, and powered by a Fractal Design Ion+ 860 W Platinum power-supply, this beast has some serious chops: AMD Ryzen 9 3900X processor, MSI MPG X570 Gaming Pro Carbon motherboard, MSI GeForce RTX 2070 Super Gaming X graphics card, 16 GB G.Skill RipJaws V memory, and Samsung 860 EVO 500 GB storage. The main giveaway hosted on Gleam lets you win the Aventador-inspired gaming PC, while a bonus giveaway form lets you take a crack at the exotic car rentals. Gleam lets you increase your chances of winning by up to 24 times. Open from now, February 4, 01:00 UTC, until February 18, 05:59 UTC, the main giveaway is open worldwide. Good Luck!

For more information, and to participate, visit this page.

One of the first reviews of Intel's new flagship HEDT processor, the Core i9-10980XE, just hit the web. Lab501.ro got their hands on a freshly minted i9-10980XE and put it through their test bench. Based on the "Cascade Lake-X" silicon, the i9-10980XE offers almost identical IPC to "Skylake-X," but succeeds the older generation with AI-accelerating DLBoost instruction-set, an improved multi-core boosting algorithm, higher clock speeds, and most importantly, a doubling in price-performance achieved by cutting the cores-per-Dollar metric by half, across the board.

Armed with 18 cores, the i9-10980XE is ahead of the 12-core Ryzen 9 3900X in rendering and simulation tests, although not by much (for a chip that has 50% more cores). This is probably attributed to the competing AMD chip being able to sustain higher all-core boost clock speeds. In tests that not only scale with cores, but are also hungry for memory bandwidth, such as 7-zip and Media, Intel extends its lead thanks to its quad-channel memory interface that's able to feed its cores with datasets faster.

G.SKILL International Enterprise Co., Ltd., the world's leading manufacturer of extreme performance memory and gaming peripherals, is delighted to announce an extreme low-latency, high-speed DDR4 memory kit at DDR4-4000 CL15-16-16-36 in a 32 GB (8 GB x4) capacity configuration under the classic Trident Z and the RGB-enabled Trident Z Royal memory series. Once again, these extraordinary memory kits are manufactured using high-performance Samsung B-die ICs to achieve the world's lowest latency of CL15 at DDR4-4000.

At G.SKILL, we are always searching for the ultimate memory kit, tuned not only for speed, but also for efficiency. This means pushing for lower latency timings. Previously, the best CAS latency that memory kits at the DDR4-4000 level could achieve was at CL17. This is surpassed by the new DDR4-4000 CL15-16-16-36 32 GB (8 GB x4) memory kit running under 1.5 V, shown validated on the MSI MEG Z390 ACE motherboard and Intel Core i7-9700K processor in the screenshot below.

G.SKILL International Enterprise Co., Ltd., the world's leading manufacturer of extreme performance memory and gaming peripherals, is announcing new high-capacity, high-performance memory kit specifications based on 32 GB modules across several memory series, including Trident Z Royal DDR4-3200 CL16 256 GB (32 GB x8), Trident Z Royal DDR4-4000 CL18 128 GB (32 GB x4), Trident Z Neo DDR4-3600 CL18 128 GB (32 GB x4), and Trident Z Neo DDR4-3800 C18 64 GB (32 GB x2). Built with the latest high-density 16Gb components, these DDR4 memory kits are the perfect choice for pushing the performance limits of high memory capacity.

With the availability of higher density memory at the consumer level, G.SKILL memory is pushing the performance boundary to DDR4-3200 on current HEDT platforms with up to 8 modules of 32 GB for a total of 256 GB. As shown in the screenshot below, the Trident Z Royal DDR4-3200 CL16 256 GB (32GBx8) is validated on the latest X299-based ASUS ROG Rampage VI Extreme Encore motherboard and the Intel Core i9-9820X processor. Such extremely high-capacity memory kits are the ideal choice for powerful workstations or for systems running multiple virtual machines.

As AMD launched the 3rd Gen Ryzen processors and immediately gained lots of attention recently, MSI also released a bunch of motherboards for various use. To fulfill different gamers offer diversified options, MSI is pleased to introduce our new MEG X570 UNIFY motherboard into gaming market. Belonging to the top gaming segment MEG series, MEG X570 UNIFY is our brand new premium product with modest and pure black design, emphasizing on the true value of the motherboard instead of fancy LED decoration.

By eliminating all the redundant RGB LED from the motherboard and adopting the UV black printing, the heatsink shows the gleam and the shining reflection of the dragon to symbolize a mysterious and high quality image. For MEG X570 UNIFY motherboard, MSI put great efforts on those essential parts concerned by those enthusiast gamers, enhancing not only the thermal but also power solution to run with the AMD 3rd Gen Ryzen processors. Emphasizing the ultimate performance, MEG X570 UNIFY also brings astonishing overclocking records to enthusiast gamers. With AMD Ryzen 9 3900X processor, it is an incredible result to push CPU frequency to 5857 MHz, which is by far the top 1 of all records.

AMD released their Zen 2-based Ryzen 3000 processors in July this year, and they instantly became a smash hit with gamers, due to their solid performance, and good pricing. The company's flagship processor at this time is the Ryzen 9 3900X, priced at $500, featuring 12-cores/24-threads, with clocks reaching up to 4.6 GHz. Now BIOSTAR has posted an update to their motherboard CPU support list, which mentions a previously unannounced "Ryzen 9 3900", without the "X", running at 3.1 GHz base clock and having a TDP of 65 W (the 3900X has 105 W TDP).

It looks like the Ryzen 9 3900 non-X is a more power-efficient version of the 3900X with lower clocks. It's possible that it is made from chips that failed the clock-frequency certification for the 4.6 GHz boost clock of the 3900X, but that work fine otherwise. By dialing down the TDP of their chip, AMD could also build an interesting SKU for OEMs, that want to market the high core counts, but aren't willing to drive up the cost of their power and cooling setup.

AMD is giving final touches to an AGESA microcode update that fixes the issue of underwhelming Precision Boost behavior on its 3rd generation Ryzen processors. Version ComboAM4 1.0.0.3ABBA is being pushed to motherboard manufacturers to integrate with their UEFI firmware, and one such dispatch to MSI got leaked to the web on ChipHell. Tom's Hardware grabbed the BIOS as it was compatible with the MEG X570 Creator motherboard they have, and tested the Ryzen 9 3900X and Ryzen 7 3700X with it.

In its testing, posted in a mini-review article, Tom's Hardware observed that with AGESA 1.0.0.3ABBA, their 3700X sample was correctly hitting 4.40 GHz across the board at stock settings. With the older 1.0.0.3AB, it would touch 4.375 GHz. The Ryzen 9 3900X behaves slightly differently with this microcode. Tom's Hardware was able to raise its peak boost frequency from 4.575 GHz to 4.625 GHz (above the 4.60 GHz specification), but in certain tests such as POV-Ray and Cinebench, its boost frequency decays down to 4.250 GHz. Overall, the reviewer tabulated improved performance on the chips with the new microcode. The new microcode also apparently changes the processor's thermal thresholds.Update (10/9) AMD posted an elaborate release detailing the AGESA 1.0.0.3ABBA update.

G.SKILL International Enterprise Co., Ltd., the world's leading manufacturer of extreme performance memory and gaming peripherals, is releasing a highly optimized, extremely low latency Trident Z Neo series DDR4-3800MHz CL14 RGB memory kit in 16 GB (8 GB x2) and 32 GB (8 GB x4) capacities for the AMD Ryzen 3000 series CPU and X570 chipset platform. Built with the powerful Samsung B-die component, this is the perfect DDR4 memory kit for those looking to push the limits of memory bandwidth on your new AMD Ryzen 3000 platform.

At this point, it's well-known that memory performance with the new AMD Ryzen 3000 processor series is best when Infinity Fabric being tied to the memory clock at a 1:1 ratio. The G.SKILL R&D team is dedicated to push the performance boundaries even further and developed a high-frequency, low-latency memory kit at DDR4-3800 CL14-16-16-36 in capacity configurations of 8GBx2 and 8GBx4, reaching a superb memory bandwidth performance under the optimal 1:1 ratio.

Silicon Lottery, a company specializing in the process called binning which involves testing of CPUs for particular features (overclocking potential in this case), has released its portfolio of 3rd generation of Ryzen CPUs. As of now, they are offering only Ryzen 7 and Ryzen 9 models, covering Ryzen 7 3700X, 3800X and Ryzen 9 3900X. Ryzen 9 3950X is said to be introduced in September and that is the date Silicon Lottery will reveal the information about overclocking potential of that model and frequencies they have achieved. Mid range Ryzen 5 models should be added at later date as well.

With AMD's 3rd generation Ryzen processors finally falling into the hands of PC enthusiasts, many early-adopters are taking to tech communities such as ours, to share their experiences with others. A trend appears to be emerging of users reporting higher-than-usual voltages for these processors when idling. AMD investigated this phenomenon, and declared this to be a non-issue. Apparently, most modern CPU monitoring utilities cause what is known as "the observer effect:" the process of measuring the processor's load itself causes load on the processor.

In case of the Ryzen "Matisse" processors, monitoring software appear to be polling each processor core for load by sending it instruction at a high rate of speed - sending them a workload of 20 ms every 200 ms. This causes the processor's embedded firmware to think that the cores are being subjected to workload, and it responds by increasing the clock-speeds, and proportionately voltages of all CPU cores. Monitoring software poll each CPU core, and so core voltages are raised across the chip.

AMD's 3rd generation Ryzen desktop processors were rumored to open to pre-orders today, so you could have your swanky new CPU upgrade in place by 7/7. It turns out, that's not the case. AMD in a statement to TechPowerUp, confirmed that there won't be any pre-orders opened by retailers today (1st July), and there is no information of any such pre-orders date. Customers will likely have to wait until the 7th to pick their PIB form their friendly neighbourhood PC hardware store, or order one online. The statement from AMD in German language translates as follows:

We haven't announced any pre-order plans - global launch is on 7/7.

AMD is launching five new processor SKUs this July, including the 12-core/24-thread Ryzen 9 3900X, the 8-core/16-thread Ryzen 7 3800X and 3700X, and the 6-core/12-thread Ryzen 5 3600X and 3600. Prices over previous-generation products remain flat wherever applicable. The 3700X is being launched at the same $329.99 MSRP as the 2700X, the 3600X at a slightly higher $249.99 compared to the $239.99 the 2600X launched at; and the 3600 aims to be the sub-$200 king at the same $199.99 price as the 2600. The 3800X is being launched as a premium 8-core option at $399.99, and the 3900X can be yours for $499.99. We expect most online retailers to mark these prices up by 5-10 percent as they normally do.

AMD will differentiate its high-end Ryzen 9 desktop processor PIB (processor-in-a-box) retail package from that of the Ryzen 7 series with a more premium-looking box. Retailer PC Part Picker put up this picture of the Ryzen 9 box up-close, which also surfaced in E3-2019 presentations by AMD. The box is made of a thicker paperboard than the one the Ryzen 7 ships in, and features a 2-piece clamshell design, in which the upper part slides off. A faux carbon fiber texture dominates four faces of the top half, while the orange bottom one features a chrome insert with the "9" brand extension. The chip's PCI-Express gen 4.0 support earns prominent mention on the front face. The box contains the processor, an AMD Wraith Prism RGB cooling solution that's capable of handling thermal loads of up to 140W, aRGB cables for the cooler, a case badge, and some documentation. AMD will use this package for both the Ryzen 9 3900X and the flagship Ryzen 9 3950X.

The Ryzen 9 3900X will launch on 7th July, and will be AMD's top-dog until the 3950X comes along some time in September. The 3900X is a 12-core/24-thread processor clocked at 3.80 GHz with 4.60 GHz boost, designed to compete with the Core i9-9900K, and priced at USD $499. The 3950X is a 16-core/32-thread part that occupies a price-point way above, at USD $749. This chip ticks at 3.50 GHz with 4.70 GHz boost, despite its high core-count. Both chips have their TDP rated at 105W and include a Wraith Prism RGB cooling solution.

AMD is on the verge of launching its 3rd generation Ryzen "Matisse" processors that are widely expected to take the performance crown from Intel. At its Computex 2019 reveal, AMD CEO Dr Lisa Su claimed that these processors beat the competition in all areas, including gaming. Motherboard manufacturers threw their weight behind AMD by pulling out their most premium brands for the AMD "Valhalla" desktop platform that consists of these processors, mated with an AMD X570 chipset motherboard. Ahead of its E3 2019 keynote Monday afternoon, Intel has come out with a challenge. Chipzilla dares AMD to beat it in "real-world gaming."

At its "gaming performance for the real world" address in Los Angeles Jon Carvill, VP of marketing, challenged AMD to beat it in real world gaming with its upcoming processors. "So you're going to hear a lot about gaming CPUs this week," he began. "They may or may not come from certain three letter acronyms. That said, here's what I want to challenge you. I want to challenge you to challenge them. If they want this crown come beat us in in real world gaming, real world gaming should be the defining criteria that we use to assess the world's best gaming CPU. I challenge you to challenge anyone that wants to compete for this crown to come meet us in real world gaming. That's the measure that we're going to stand by."

We were pleasantly mistaken when we thought ASRock would stop at the X570 Phantom Gaming X or the X570 Taichi for AMD's new "Valhalla" enthusiast desktop platform. It turns out that they have a roughly-$1,000 monster motherboard in the pipes, called the X570 Aqua. Pictured below, the board is based on a slight variation of the X570 Phantom Gaming X PCB. The biggest change of course is the aluminium shroud that covers most of the board's front side. There's also a metal back-plate.

Beneath the metal shroud is what gives the board its name: a massive liquid-cooling monoblock that cools not just your processor (including heavyweights such as overclocked Ryzen 9 3900X chips), but also the CPU VRM, and the feisty AMD X570 chipset. The coolant channel first goes over the CPU through a large micro-fin lattice, then onto the X570 chipset, and finally over the CPU VRM on its way out. Much like the Phantom Gaming X, this board features daisy-chained dual-channel DDR4 memory slots designed to make the most OC out of 2-module setups.

ASUS at a private pre-Computex event gave us a closer look at a treasure of upcoming products. The star-attractions, however, were its AMD X570 motherboard family that's spread across nearly every brand: ROG Crosshair, ROG Strix, TUF Gaming, Prime, and for the very first time for the AM4 platform, the WS series. The crown jewel of course is the mini-ITX form-factor product, the ROG Strix X570-I Gaming. This board is quite an engineering feat considering the ≥15 Watts TDP of the X570 chipset, which requires active cooling in most cases. An intricate network of heatsinks suspended along heat-pipes leading up to a dense aluminium fin-stack ventilated by a 30 mm fan, cools both the chipset and CPU VRM. ASUS designed this board to handle even the 12-core Ryzen 9 3900X, but we don't expect too much overclocking headroom.

AMD CEO Dr. Lisa Su at her 2019 Computex keynote address announced the 3rd generation Ryzen desktop processor family, which leverages the company's Zen 2 microarchitecture, and are built on the 7 nm silicon fabrication process at TSMC. Designed for the AM4 CPU socket, with backwards compatibility for older AMD 300-series and 400-series chipset motherboards, these processors are multi-chip modules of up to two 8-core "Zen 2" CPU chiplets, and a 14 nm I/O controller die that packs the dual-channel DDR4 memory controller and PCI-Express gen 4.0 root complex, along with some SoC connectivity. AMD claims an IPC increase of 15 percent over Zen 1, and higher clock speeds leveraging 7 nm, which add up to significantly higher performance over the current generation. AMD bolstered the core's FPU (floating-point unit), and doubled the cache sizes.

AMD unveiled three high-end SKUs for now, the $329 Ryzen 7 3700X, the $399 Ryzen 7 3800X, and the $499 Ryzen 9 3900X. The 3700X and 3800X are 8-core/16-thread parts with a single CPU chiplet. The 3700X is clocked at 3.60 GHz with 4.40 GHz maximum boost frequency, just 65 Watts TDP and will be beat Intel's Core i7-9700K both at gaming and productivity. The 3800X tops that with 3.90 GHz nominal, 4.50 GHz boost, 105W TDP, and beat the Core i9-9900K at gaming and productivity. AMD went a step further at launched the new Ryzen 9 brand with the 3900X, which is a 12-core/24-thread processor clocked at 3.80 GHz, which 4.60 boost, 72 MB of total cache, 105W TDP, and performance that not only beats the i9-9900K, but also the i9-9920X 12-core/24-thread HEDT processor despite two fewer memory channels. AMD focused on gaming performance with Zen 2, with wider FPU, improved branch prediction, and several micro-architectural improvements contributing to a per-core performance that's higher than Intel's. The processors go on sale on 7/7/2019.