Samsung Electronics today introduced Galaxy Book Flex and Galaxy Book Ion at the Samsung Developer Conference 2019 (SDC19), two premium laptops offering ultra-portable and ultra-powerful computing experiences to meet the unique needs of modern professionals for their always on-the-go lifestyles. Today's on-the-go consumers need PCs that deliver maximum productivity, while being mobile enough to take wherever you're going. Galaxy Book Flex and Galaxy Book Ion were built for that and more, offering a seamless continuity across multiple devices.

"Consumers often have to choose between mobility and high-performance hardware when choosing a laptop," said YoungGyoo Choi, Senior Vice President of, Mobile Communications Business at Samsung Electronics. "Galaxy Book Flex and Galaxy Book Ion eliminate the need to compromise by offering powerful performance with unparalleled portability and display innovation."

Intel's Core "Tiger Lake" microarchitecture could be a point of transition between DDR4 and DDR5 for the company. Prototypes of devices based on the ultra-compact "Tiger Lake-Y" SoC were earlier shown featuring LPDDR4X memory, although a new device, possibly a prototyping platform, in the regulatory queue with the Eurasian Economic Commission describes itself as featuring a "Tiger Lake-U" chip meant for thin and light notebooks and convertibles. This device features newer LPDDR5 memory, according to its regulatory filing.

LPDDR5 succeeds LPDDR4X as the industry's next low-power memory standard, offering data-rates of up to 6,400 MT/s (versus up to 4,266 MT/s of LPDDR4X), and consumes up to 30 percent less power. This prototype at the EEC is sure to be using unreleased LPDDR5 memory chips as DRAM majors Samsung and SK Hynix plan to ship their DDR5-based memory solutions only by the end of this year, although mass-production of the chips have already started at Samsung, in PoP form-factors. A successor to the 10th generation Core "Ice Lake," "Tiger Lake" will be Intel's second CPU microarchitecture designed for its 10 nm silicon fabrication node.

Samsung Electronics, a world leader in advanced memory technology, today announced that it has begun mass producing the industry's first 12-gigabyte (GB) low-power double data rate 4X (LPDDR4X) UFS-based multichip package (uMCP). The announcement was made as part of the company's annual Samsung Tech Day at its Device Solutions' America headquarters in San Jose, California.

"Leveraging our leading-edge 24-gigabit (Gb) LPDDR4X chips, we can offer the highest mobile DRAM capacity of 12 GB not only for high-end smartphones but also for mid-range devices," said Sewon Chun, executive vice president of Memory Marketing at Samsung Electronics. "Samsung will continue to support our smartphone-manufacturing customers with on-time development of next-generation mobile memory solutions, bringing enhanced smartphone experiences to many more users around the globe."

Diversity is the name of the game when it comes to the edge Artificial Intelligence (AI) chipset industry. In 2019, the AI industry is witnessing the continual migration of AI workloads, particularly AI inference, to edge devices, including on-premise servers, gateways, and end-devices and sensors. Based on the AI development in 17 vertical markets, ABI Research, a global tech market advisory firm, estimates that the edge AI chipset market will grow from US $2.6 billion in 2019 to US $7.6 billion by 2024, with no vendor commanding more than 40% of the market.

The frontrunner of this market is NVIDIA, with a 39% revenue share in the first half of 2019. The GPU vendor has a strong presence in key AI verticals that are currently leading in AI deployments, such as automotive, camera systems, robotics, and smart manufacturing. "In the face of different use cases, NVIDIA chooses to release GPU chipsets with different computational and power budgets. In combination with its large developer ecosystem and partnerships with academic and research institutions, the chipset vendor has developed a strong foothold in the edge AI industry," said Lian Jye Su, Principal Analyst at ABI Research.

NVIDIA is facing stiff competition from Intel with its comprehensive chipset portfolio, from Xeon CPU to Mobileye and Movidius Myriad. At the same time, FPGA vendors, such as Xilinx, QuickLogic, and Lattice Semiconductor, are creating compelling solutions for industrial AI applications. One missing vertical from NVIDIA's wide footprint is consumer electronics, specifically smartphones. In recent years, AI processing in smartphones has been driven by smartphone chipset manufacturers and smartphone vendors, such as Qualcomm, Huawei, and Apple. In smart home applications, MediaTek and Amlogic are making their presence known through the widespread adoption of voice control front ends and smart appliances.

Samsung Electronics Co., Ltd., a world leader in advanced semiconductor technology, today announced that it has developed the industry's first 12-layer 3D-TSV (Through Silicon Via) technology. Samsung's new innovation is considered one of the most challenging packaging technologies for mass production of high-performance chips, as it requires pinpoint accuracy to vertically interconnect 12 DRAM chips through a three-dimensional configuration of more than 60,000 TSV holes, each of which is one-twentieth the thickness of a single strand of human hair.

The thickness of the package (720 µm) remains the same as current 8-layer High Bandwidth Memory-2 (HBM2) products, which is a substantial advancement in component design. This will help customers release next-generation, high-capacity products with higher performance capacity without having to change their system configuration designs. In addition, the 3D packaging technology also features a shorter data transmission time between chips than the currently existing wire bonding technology, resulting in significantly faster speed and lower power consumption.

According to the sources over at Igor's Lab, NVIDIA could launch its next generation of GPUs, codenamed "Ampere", as soon as first half of the 2020 arrives. Having just recently launched GeForce RTX Super lineup, NVIDIA could surprise us again in the coming months with replacement for it's Turing lineup of graphics cards. Expected to directly replace high-end GPU models that are currently present, like GeForce RTX 2080 Ti and RTX 2080 Super, Ampere should bring many performance and technology advancements a new graphics card generation is usually associated with.

For starters, we could expect a notable die shrink to take place in form of 7 nm node, which will replace the aging 12 nm process that Turing is currently being built on. This alone should bring more than 50% increase in transistor density, resulting in much more performance and lower power consumption compared to previous generation. NVIDIA's foundry of choice is still unknown, however current speculations are predicting that Samsung will manufacture Ampere, possibly due to delivery issues that are taking place at TSMC. Architectural improvements should take place as well. Ray tracing is expected to persist and get enhanced with possibly more hardware allocated for it, along with better software to support the ray tracing ecosystem of applications.

"Moore's Law" is a term coined in 1965 by Gordon Moore, who presented a paper which predicts that semiconductor scaling will allow integrated circuits to feature twice as many transistors present per same area as opposed to a chip manufactured two years ago. That means we could get same performance at half the power than the previous chip, or double the performance at same power/price in only two years time. Today we'll investigate if Moore's Law stayed true to its cause over the years and how much longer can it keep going.

China's semiconductor industry is seeking independence in every sector of its industry, with an emphasis of homemade products for domestic use, especially government facilities, where usage of homegrown products is most desirable. According to the report of China Securities Journal, Chinese firm has started production of DRAM memory.

A company named ChangXin Memory Technology, founded in 2016 to boost domestic silicon production, on Monday started production of DRAM memory, aiming to directly replace the current supply of foreign memory from companies like Micron, SK Hynix and Samsung. Being build using 18 nm technology which ChangXin calls "10-nanometer class" node, this DRAM chip isn't too far behind offers from competitors it tries to replace. Micron, Samsung and SK Hynix use 12, 14, and 16 nm nodes for production of their DRAM chips, so Chinese efforts so far are very good. The company promises to produce around 120.000 wafers per month and plans to deliver first chips by the end of this year.

Samsung Electronics Co., Ltd., the world leader in advanced memory technology, today announced that it has brought the latest software innovations to the company's most cutting-edge PCIe Gen4 solid state drive (SSD) series, opening up a new paradigm in SSD performance.

"We are combining breakthrough speeds and capacities with revolutionary software solutions as we accelerate expansion in the premium SSD market," said Kye Hyun Kyung, executive vice president of Memory Solution Product & Development at Samsung Electronics. "We plan to introduce additional innovation led by our most advanced (sixth-generation) V-NAND in helping to trigger a lot more growth in the global IT market."

The Wi-Fi CERTIFIED 6 certification program from Wi-Fi Alliance is now available and delivers the best user experience with devices based on IEEE 802.11ax. The certification program brings new features and capabilities that enable substantially greater overall Wi-Fi network performance in challenging environments with many connected devices such as stadiums, airports, and industrial parks. With adoption of the latest Wi-Fi generation increasing, product vendors and service providers can trust Wi-Fi CERTIFIED will distinguish Wi-Fi 6 products and networks that meet the highest standards for security and interoperability. Wi-Fi CERTIFIED 6 provides significant capacity, performance, and latency improvements to the entire Wi-Fi ecosystem, while ensuring products across vendors to work well together to deliver greater innovation and opportunity.

Wi-Fi CERTIFIED 6 supports a more diverse set of devices and applications, from those requiring peak performance in demanding enterprise environments to those requiring low power and low latency in smart homes or industrial IoT scenarios. Wi-Fi CERTIFIED 6 delivers nearly four times the capacity of Wi-Fi 5, and is an evolutionary advancement for Wi-Fi's ability to deliver high-performance infrastructure and optimized connectivity to all devices on a network simultaneously - bringing noticeable improvements in densely connected Wi-Fi environments. Wi-Fi CERTIFIED 6 delivers critical connectivity that supports cellular networks, and leverages high speeds, low latency, power efficiency, greater capacity, and enhanced coverage to deliver many advanced 5G services.

Samsung's B die has been widely known as a good, high performance variant of DRAM memory, loved by overclockers because of its ability to get to a high frequency with relatively low timings. However, B die has been discontinued and now Samsung started offering its replacement in form of the newly developed A die manufactured in 1z nm (1z class) lithography process. Despite the lack of technical details surrounding the new die type, Hardwareluxx has received a tip from its reader about new RAM offering that incorporates A die memory.

The M378A4G43AB2-CVF, as it is called in the listing, is a 32 GB, single dimm DDR4 RAM with operating speed of 2933 MHz and CL21-21-21 timings. This particular offer isn't something to be excited about as the frequency is good, but the timings are quite high for that speed. Given that we don't know where the A die is targeted at, we can speculate that its current aim is at mid-tier systems, where the mediocre performance is okay and the system isn't suffering (performance wise) because of it. Nonetheless this find is quite interesting as it gives first hints at what can we expect in therms of future A die DRAM offerings. Remember, it took some time for B die as well to get to the level of performance we have today, so it is entirely possible that A die will improve and try to aim for greater performance level than it currently has.

G.SKILL International Enterprise Co., Ltd., the world's leading manufacturer of extreme performance memory and gaming peripherals, is excited to announce high-frequency, high-capacity memory kit specifications to the G.SKILL Trident Z Royal series at DDR4-4300 MHz CL19-19-19-39 and DDR4-4000 MHz CL16-18-18-38, both in kit capacity of 64 GB (8x 8 GB) and 32 GB (4x8GB). Once again, these extraordinary G.SKILL Trident Z Royal memory kits are built with high performance Samsung B-die components.

As an excellent choice for tasks that require both high-capacity and extreme speed memory, the high-performance DDR4-4300 MHz CL19-19-19-39 64 GB (8x 8 GB) is shown in the stress test screenshot below, validated on the latest ASUS ROG Rampage VI Extreme Encore motherboard and the Intel Core i9-9820X processor. This is the perfect memory solution for building an all-powerful workstation for various content creation workloads, including 3D rendering and multimedia editing.

MSI today rolled out the MAG Optix G27C4 27-inch curved gaming monitor. With a more acute curvature of 1500R (compared to the prevelant 1800R monitors), the Optix G27C4 boasts of 165 Hz refresh-rate and support for AMD FreeSync. The Samsung-sourced VA panel offers Full HD (1920 x 1080) resolution, 1 ms response-times, 178°/178° viewing-angles, and an anti-glare surface treatment. Display inputs include DisplayPort 1.2a (needed for FreeSync), and two HDMI 1.4a ports. The panel also offers blue-light reduction, and flicker-free LED backlighting. Measuring 611.5 mm × 225.4 mm × 457.9 mm (WxDxH), the monitor weighs around 5.4 kg. The company didn't reveal pricing.

PC builder Falcon Northwest today announced their new mid-sized tower PC, the Talon 20th Anniversary Edition. The culmination of a 2-year in-house case design project, Talon takes aim at winning over the Mac-using creator crowd with top-end components, careful thermal management and high-end metal exterior. It's also targeted at Falcon's game-playing clientele with options for glass sides, custom paintwork, and embracing the gaming trend Falcon has mostly resisted: RGB LED lighting.

"It's amazing!" said Chris Roberts, CEO of Roberts Space Industries and the creative genius behind Star Citizen and the Wing Commander game series. Chris was the recipient of the very first 20th Anniversary Talon. "It's butter smooth and super quiet. I love the beautiful artwork and that I can easily open up the sides to see the immaculate components, cabling and lighting."

Intel announced that laptops verified through its innovation program, code-named "Project Athena," will feature the visual identifier "Engineered for Mobile Performance." PC manufacturers and retailers can use the identifier across promotional activities and in-store and online retail environments to draw consumers to the laptops that meet the high standards of the program's target specification and key experience indicators (KEI).

The new identifier can be found for the first time today with the new Dell XPS 13 2-in-1, one of the initial systems verified through Project Athena and now available for U.S. customers to purchase from Dell.com. Over the coming weeks, the identifier will also be visible in marketing efforts for the HP Elitebook 1040 and HP Elitebook 830, which are also among the initial laptops verified through the program. Additional laptops are expected from Acer, ASUS, Dell, HP, Lenovo and Samsung for the holiday season.

Samsung Electronics Co., Ltd. today introduced Galaxy Book S, a game-changing mobile computing device built for high-performing users who don't want to be weighed down by excessive size and features of traditional laptops. Built for the new achievers - the innovators, the go-getters, those who do things differently to push themselves forward - Galaxy Book S empowers the next generation of mobile moguls.

With Galaxy Book S, Samsung ushers in a new era of mobile computing with a device that harnesses the mobility and connectivity of a smartphone and the powerful productivity of a PC. Developed in collaboration with leading technology companies, Galaxy Book S takes Samsung's position as a mobile leader and unites it with the best-in-class workforce platform powered by Microsoft and industry-leading mobile performance from Qualcomm. This new category device offers Gigabit LTE connectivity, instant-on capabilities and a premium design, powered by Windows 10 and the cutting-edge Qualcomm Snapdragon 8cx compute platform. With Galaxy Book S, experience the freedom of a new type of mobile device that lets you work anywhere and everywhere, without tethering you to your desk or couch.

G.SKILL International Enterprise Co., Ltd., the world's leading manufacturer of extreme performance memory and gaming peripherals, is releasing a highly optimized, extremely low latency Trident Z Neo series DDR4-3800MHz CL14 RGB memory kit in 16 GB (8 GB x2) and 32 GB (8 GB x4) capacities for the AMD Ryzen 3000 series CPU and X570 chipset platform. Built with the powerful Samsung B-die component, this is the perfect DDR4 memory kit for those looking to push the limits of memory bandwidth on your new AMD Ryzen 3000 platform.

At this point, it's well-known that memory performance with the new AMD Ryzen 3000 processor series is best when Infinity Fabric being tied to the memory clock at a 1:1 ratio. The G.SKILL R&D team is dedicated to push the performance boundaries even further and developed a high-frequency, low-latency memory kit at DDR4-3800 CL14-16-16-36 in capacity configurations of 8GBx2 and 8GBx4, reaching a superb memory bandwidth performance under the optimal 1:1 ratio.

AMD (NASDAQ:AMD) today announced revenue for the second quarter of 2019 of $1.53 billion, operating income of $59 million, net income of $35 million and diluted earnings per share of $0.03. On a non-GAAP basis, operating income was $111 million, net income was $92 million and diluted earnings per share was $0.08.

"I am pleased with our financial performance and execution in the quarter as we ramped production of three leadership 7nm product families," said Dr. Lisa Su, AMD president and CEO. "We have reached a significant inflection point for the company as our new Ryzen, Radeon and EPYC processors form the most competitive product portfolio in our history and are well positioned to drive significant growth in the second half of the year."

Prices of DRAM shot up by 20 percent as Japan put in place export curbs that restrict high-technology exports to South Korea, and as Toshiba recovers from a power blackout that temporarily halted production. This could impact prices of end-user products such as PC memory modules, or consumer electronics, such as smartphones, in the coming weeks, as inventories either dry up, or are marked-up at various stages of the supply-chain. The memory industry is inter-dependent between fabrication and packaging units spread across South Korea, Japan, and Taiwan.

Memory and flash industry observer DRAMeXchange reported that spot-pricing of 8-gigabit DDR4 DRAM chips, which is used as a benchmark for DRAM pricing as a whole, closed at USD $3.74 at the end of trading on Friday (19/07). It's up 14.6 percent week-over-week, and 23 percent up pricing as on 5th July. An industry observer who spoke with KBS World notes that the recent hikes are not directly infuenced by the trade-spat between Japan and Korea, but rather a power blackout experienced at a Toshiba DRAM manufacturing facility last month. The observer noted that if the trade-spat affects production at Samsung Electronics or SK Hynix, DRAM prices could "skyrocket."

Samsung Electronics, the world leader in advanced memory technology, today announced that it has begun mass producing the industry's first 12-gigabit ( Gb) LPDDR5 mobile DRAM, which has been optimized for enabling 5G and AI features in future smartphones. The new mobile memory comes just five months after announcing mass production of the 12 GB LPDDR4X, further reinforcing the company's premium memory lineup. Samsung also plans to start mass producing 12-gigabyte (GB) LPDDR5 packages later this month, each combining eight of the 12 Gb chips, in line with growing demand for higher smartphone performance and capacity from premium smartphone manufacturers.

"With mass production of the 12 Gb LPDDR5 built on Samsung's latest second-generation 10-nanometer (nm) class process, we are thrilled to be supporting the timely launch of 5G flagship smartphones for our customers worldwide," said Jung-bae Lee, executive vice president of DRAM Product & Technology, Samsung Electronics. "Samsung remains committed to rapidly introducing next-generation mobile memory technologies that deliver greater performance and higher capacity, as we continue to aggressively drive growth of the premium memory market."

During our disassembly of the GeForce RTX 2060 Super, we noticed a shocking detail. The 12 nm "TU106" GPU on which it is based, has the marking "Korea." We know for a fact that TSMC does not have any fabs there. The only Korean semiconductor manufacturer capable of contract-manufacturing a piece of silicon as complex as a GPU, for a designer with the energy-efficiency OCD as NVIDIA, is Samsung.

What makes this interesting is that Samsung does not officially have a 12 nm FinFET process. It has 14 nm, and the 11LPP, a 11 nm nodelet, which the company designed to compete with TSMC 12 nm. It would hence be really interesting to hear from NVIDIA on whether they've scaled out the "TU106" to 14LPP, or down to 11LPP at Samsung. It's interesting to note that the shrink in transistor sizes in these nodelets doesn't affect die-sizes. We hence see no die-size difference between these Korea-marked chips, and those marked "Taiwan." We've reached out to NVIDIA for comment.

Update July 3rd: NVIDIA got back to us

NVIDIAThe answer is really simple and these markings are not new. Other Turing GPUs have had these markings in the past. The chip is made at TSMC, but packaged in various locations. This one was done in Korea, hence why his says "Korea".

On an unrelated note: We already use both TSMC and Samsung, and qualify each of them for every process node. We can't comment in any further detail on future plans, but both remain terrific partners.

Intel has seemingly partnered with Samsung, one of the largest manufacturers of Integrated Circuits, in order to help reduce the CPU shortage currently affecting the PC market. It is the first time ever that Intel turned to Samsung for it's CPU manufacturing given that, historically, Intel's Client Computing Group (CCG) has always relied on Intel's internal fab to manufacture all of its components. But as resources in those fabs became constrained, Intel CCG started looking at other resources, such as TSMC, to manufacture the chipsets used in Intel-based motherboards.

In a report prepared by Sedialy, a South Korean news media, Intel turned to Samsung specifically to meet demand on its 14 nm products. This unexpected move came after negotiations which, if you believe the rumors before the news, were in progress for quite some time already. Samsung has formally agreed to manufacture Intel's CPUs of the microarchitecture code-named 'Rocket Lake', which will serve as processors for mini PCs, planned to be released in 2021.

Samsung at E3 2019 announced their latest high-refresh ration monitor, the CRG5. Based on a 27" VA panel, the display supports only up to 1080p resolution - a limitation that helps it become the fastest refresh-rate monitor in Samsung's lineup with its 240 Hz frequency. These 240 Hz come with the help of support for NVIDIA's G-Sync adaptive sync technology (there's no G-Sync ultimate chip inside, though).

The monitor also offers a 3000:1 contrast ratio, 178º viewing angles, and a peak brightness set at 300 nits - nothing to write home about. It also includes software modes specific for FPS, RTS, and RPG content, and keeps connectivity at a relative minimum with 1x DisplayPort 1.2, 2x HDMI 2.0, and 1x headphone jack. The Samsung CRG5 will be available starting this July for $399.

AMD and Samsung today announced a key strategic partnership in high performance graphics technologies for the mobile space. The agreement means that Samsung will license AMD's Radeon graphics IP in its latest RDNA iteration, no less, for integration on smartphone graphics processing. Let me stress how impressive this can be: that AMD developed a graphics architecture that can scale from a high-performance GPU down to a nimble, fast, power-sipping module for mobile graphics processing.

This is a huge strategic win for AMD, in that more and more products will be infused with their technology. As Lisa Su puts it, the Radeon user base and development ecosystem will be greatly increased with this Samsung integration - as will AMD's revenue, for sure. Perhaps we'll see a "Powered by AMD Radeon" sticker or engraving in our future Samsung smartphones, as we do with Leica partnerships, for example.)

G.SKILL International Enterprise Co., Ltd., the world's leading manufacturer of extreme performance memory and gaming peripherals, is showcasing several ultra-high speed and low latency DDR4 memory kits on Intel and AMD platforms at Computex 2019. These live demo systems feature motherboards from ASUS, ASRock, EVGA, Gigabyte, and MSI, as well as multiple memory kits made with Samsung B-die ICs.

DDR4-4000 384GB (32GBx12) - Massive Capacity DDR4 Beast of a Kit

Any experienced overclocker knows two factors that make achieving high-speed RAM more difficult - high module capacity and increased module count. This mystical beast of a memory kit runs at DDR4-4000MHz with an enormously massive total capacity of 384GB with 12 modules of 32GB each. While earlier 32GB modules were constructed with 8Gb components, these modules use higher density 16Gb ICs. This extremely high-capacity, high-performance live demo system is built with the Intel Xeon W-3175X processor and ASUS ROG Dominus Extreme motherboard.