Intel laid rest to speculation that post 9th generation, it could replace its Core brand with something else. The 10th generation Core processors, built around the 10 nm "Ice Lake" microachitecture, will feature the first noteworthy IPC increments since "Skylake" thanks to their new "Sunny Cove" CPU cores. These will also feature DLBoost, a fixed-function matrix-multiplication hardware that speeds up deep-neural net building and training by 5x, as well as certain AVX-512 instructions. The cores will be optimized to cope with 2.4 Gbps 802.11ax Wi-Fi and faster Ethernet standards. The first of these chips will target mobile computing platforms, and will be quad-core parts like the dies pictured below. To save notebook PCB real-estate, Intel will put the processor and PCH dies into a multi-chip module. It will be quite a wait for the desktop implementation, but at least you know what their case-badges look like.

Intel's semiconductor manufacturing business has had a terrible past 5 years as it struggled to execute its 10 nanometer roadmap forcing the company's processor designers to re-hash the "Skylake" microarchitecture for 5 generations of Core processors, including the upcoming "Comet Lake." Its truly next-generation microarchitecture, codenamed "Ice Lake," which features a new CPU core design called "Sunny Cove," comes out toward the end of 2019, with desktop rollouts expected 2020. It turns out that the 10 nm process it's designed for, will have a rather short reign at Intel's fabs. Speaking at an investor's summit on Wednesday, Intel put out its silicon fabrication roadmap that sees an accelerated roll-out of Intel's own 7 nm process.

When it goes live and fit for mass production some time in 2021, Intel's 7 nm process will be a staggering 3 years behind TSMC, which fired up its 7 nm node in 2018. AMD is already mass-producing CPUs and GPUs on this node. Unlike TSMC, Intel will implement EUV (extreme ultraviolet) lithography straightaway. TSMC began 7 nm with DUV (deep ultraviolet) in 2018, and its EUV node went live in March. Samsung's 7 nm EUV node went up last October. Intel's roadmap doesn't show a leap from its current 10 nm node to 7 nm EUV, though. Intel will refine the 10 nm node to squeeze out energy-efficiency, with a refreshed 10 nm+ node that goes live some time in 2020.

Intel put out interesting details about its upcoming 10 nanometer "Ice Lake" CPU microarchitecture rollout in its recent quarterly financial results call. The company has started qualification of its 10 nm "Ice Lake" processors. This involves sending engineering samples to OEMs, system integrators and other relevant industry partners, and getting the chips approved for their future product designs. The first implementation of "Ice Lake" will not be a desktop processor, but rather a low-power mobile SoC designed for ultraportables, codenamed "Ice Lake-U." This SoC packs a 4-core/8-thread CPU based on the "Sunny Cove" core design, and Gen11 GT2 integrated graphics with 64 execution units and nearly 1 TFLOP/s compute power. This SoC will also support WiFi 6 and LPDDR4X memory.

Intel CEO Bob Swan also remarked that the company has doubled its 10 nm yield expectations. "On the [10 nm] process technology front, our teams executed well in Q1 and our velocity is increasing," he said, adding "We remain on track to have volume client systems on shelves for the holiday selling season. And over the past four months, the organization drove a nearly 2X improvement in the rate at which 10nm products move through our factories." Intel is prioritizing enterprise over desktop, as "Ice Lake-U" will be followed by "Ice Lake-SP" Xeon rollout in 2020. There was no mention of desktop implementations such as "Ice Lake-S." Intel is rumored to be preparing a stopgap microarchitecture for the desktop platform to compete with AMD "Matisse" Zen 2 AM4 processors, codenamed "Comet Lake." This is essentially a Skylake 10-core die fabbed on existing 14 nm++ node. AMD in its CES keynote announced an achievement of per-core performance parity with Intel, so it could be interesting to see how Intel hopes 10 "Skylake" cores match up to 12-16 "Zen 2" cores.

Intel late Tuesday made a boat-load of enterprise-relevant product announcements, including the all important update to its Xeon Scalable enterprise processor product-stack, with the addition of the new 56-core Xeon Scalable "Cascade Lake" processor. This chip is believed to be Intel's first response to the upcoming AMD 7 nm EPYC "Rome" processor with 64 cores and a monolithic memory interface. The 56-core "Cascade Lake" is a multi-chip module (MCM) of two 28-core dies, each with a 6-channel DDR4 memory interface, totaling 12-channel for the package. Each of the two 28-core dies are built on the existing 14 nm++ silicon fabrication process, and the IPC of each of the 56 cores are largely unchanged since "Skylake." Intel however, has added several HPC and AI-relevant instruction-sets.

To begin with, Intel introduced DL Boost, which could be a fixed-function hardware matrix multiplier that accelerates building and training of AI deep-learning neural networks. Next up, are hardware mitigation against several speculative execution CPU security vulnerabilities that haunted the computing world since early-2018, including certain variants of "Spectre" and "Meltdown." A hardware fix presents lesser performance impact compared to a software fix in the form of a firmware patch. Intel has added support for Optane Persistent Memory, which is the company's grand vision for what succeeds volatile primary memory such as DRAM. Currently slower than DRAM but faster than SSDs, Optane Persistent Memory is non-volatile, and its contents can be made to survive power-outages. This allows sysadmins to power-down entire servers to scale down with workloads, without worrying about long wait times to restore uptime when waking up those servers. Among the CPU instruction-sets added include AVX-512 and AES-NI.

Intel posted an open-source video encoder for the new AV1 video format, targeted at online streaming servers that process large amounts of online videos for streaming. The new SVT-AV1 (Scalable Video Technology-AV1), is an BSD-2-Clause-Patent licensed video encoder that supports Linux, Windows, and MacOS operating systems, optimized for Intel Xeon Scalable processors based on the "Skylake" microarchitecture and older, as it probably leverages the AVX-512 instruction-set. It has some pretty steep hardware requirements from a client viewpoint, but nothing big video stream service providers can't afford: 48 GB of minimum RAM for a 10 bpc 4K stream, or 16 GB for a Full-HD stream. The encoder can scale up to 112 logical processors. Intel earlier offered a similar encoder for the proprietary H.265/HEVC format, with SVT-HEVC. You can inspect and grab SVT-AV1 from Intel's Git.

Microsoft earlier this week released Windows 10 October 2018 (version 1809) update. You can either get it through Windows Update, and install it leaving your personal files and settings largely unchanged, or perform a clean install by making yourself an install media using Microsoft's Media Creation Tool. PC Watch noticed something curious about getting the new Windows version through Windows Update on their notebook. The process was sapping too much power from the battery, and the update process is interrupted by an incompatible driver dialog (screenshot below).

Intel processors running with Gen 9.5 iGPUs enabled (that's 6th generation "Skylake" or later), expose an integrated audio controller to the operating system. This controller is responsible for digital audio output through the iGPU's HDMI and DisplayPort connectors, and is similar to the one NVIDIA and AMD integrate with their discrete GPUs. Users with driver version 10.25.0.3 or older for this controller, could run into problems when Windows Update is re-loading the drivers as part of the upgrade process. Intel has since released driver version 10.25.0.10 part of the latest Graphics Drivers 25.20.100.6323. If you're still on Windows 10 version 1803 and use your iGPU, it's recommended that you update your Intel graphics drivers before initiating Windows Update to version 1809.

Intel "Whiskey Lake" CPU microarchitecture recently made its debut with "Whiskey Lake-U," an SoC designed for Ultrabooks and 2-in-1 laptops. Since it's the 4th refinement of Intel's 2015 "Skylake" architecture, we wondered what set a "Whiskey Lake" core apart from "Coffee Lake." Silicon fabrication node seemed like the first place to start, with rumors of a "14 nm+++" node for this architecture, which should help it feed up to 8 cores better in a compact LGA115x MSDT environment. Turns out, the process hasn't changed, and that "Whiskey Lake" is being built on the same 14 nm++ node as "Coffee Lake."

In a statement to AnandTech, Intel explained that the key difference between "Whiskey Lake" and "Coffee Lake" is silicon-level hardening against "Meltdown" variants 3 and 5. This isn't just a software-level mitigation part of the microcode, but a hardware fix that reduces the performance impact of the mitigation, compared to a software fix implemented via patched microcode. "Cascade Lake" will pack the most important hardware-level fixes, including "Spectre" variant 2 (aka branch target injection). Software-level fixes reduce performance by 3-10 percent, but a hardware-level fix is expected to impact performance "a lot less."

This Tuesday at its Computex presser, Intel unveiled an unnamed 28-core/56-thread HEDT (client-segment) processor that's capable of being bench-stable at 5.00 GHz. The chip is a client-segment implementation of the Skylake XCC (extreme core count) silicon, which features 30 Mesh Interconnect "tiles," of which 28 are cores and two integrated memory controllers. The XCC silicon features a 384-bit wide (6-channel) DDR4 memory interface, and it turns out that whatever SKU Intel is planning, will require a different motherboard from your X299 board that can handle up to 18 cores and 4-channel memory. It will require a client-segment variant of the LGA3647 enterprise socket from the Purley platform. One of the first of these is the ASUS Republic of Gamers (ROG) Dominus.

Clearly bigger than ATX, in being either E-ATX or SSI form-factor, this board draws power from two 24-pin ATX, two 8-pin EPS, and three 6-pin PCIe, and has a gargantuan 16-phase VRM with two fan-heatsink blocks. Six DDR4 DIMM slots flank the socket, three on either side, each with its dedicated 64-bit wide path to the socket. The XCC silicon features a 48-lane PCI-Express gen 3.0 root complex, and so the board could feature at least two PCI-Express 3.0 x16 capable of full bandwidth, among a boat load of PCIe based storage connectivity, and onboard devices.Update: This motherboard may have been a quick modification of the WS C621E SAGE, by removing one of its sockets, and modifying the rest of the board accordingly. Prototyping a board like that, for a company with ASUS' resources, would barely take 2-3 weeks by our estimate.

EK Water Blocks, the Slovenia-based premium computer liquid cooling gear manufacturer is announcing a dedicated EK-Annihilator EX/EP water block that is specifically developed for LGA 3647 (Socket P) Intel processors. The entire CPU block was designed from the ground up to fit the requirements of the new socket and to integrate multiple connectivity options for server rack requirements. With that said, the new server-grade CPU block is 1U chassis type compatible for use server and workstation type motherboards.

EK-Annihilator EX/EP
With Intel releasing the future generation of Skylake-based Xeon and Skylake-E HEDT CPUs with a larger LGA 3647 socket, came the need for a water block with a larger cold plate contact surface. The goal in designing of the new EK-Annihilator EX/EP CPU water block was to cover the entire IHS of Intel HEDT processors. An additional task was to make the new CPU block server ready with multiple connectivity options. The EK-Annihilator EX/EP water block features a total of 6 ports, which allow for versatile connectivity options. Two top ports are standard G1/4" threaded, while the side ports are G3/8" threaded.

Biostar introduced the TB250-BTC D+ motherboard for crypto-mining builds. This board appears to be a re-brand of Colorful C.B250A-BTC PLUS V20. This is probably a case of Colorful piggybacking Biostar to reach markets it cannot (yet). The socket LGA1151 motherboard supports 6th and 7th generation Core "Skylake" and "Kaby Lake" processors, with basic I/O connectivity, and a single DDR4 SO-DIMM slot. The star attraction here are eight PCI-Express x16 slots with 2U spacing between them. One of these slots is electrically x16, the other are x1 (you only need x1 for mining). There are also eight 6-pin PCI-Express I/O ports, so the x16 slots are powered. The board is 195 mm wide, and 485 mm long, designed for mining cases, or something miners put together themselves. It is expected to be priced around $150.

In the age of cyber-security vulnerabilities being named by their discoverers, much like incoming tropical storms, the latest, which exploits speculative execution of modern processors, is named "BranchScope," discovered by academics from four US universities, Dmitry Evtyushkin, Ryan Riley, Nael Abu-Ghazaleh, and Dmitry Ponomarev. The vulnerability has been successfully tested on Intel "Sandy Bridge," "Haswell," and "Skylake" micro-architectures, and remains to be tested on AMD processors. It bears similarities to "Spectre" variant 2, in that it is an exploit of the branch prediction features of modern CPUs.

BranchScope differs from Spectre variant 2, in that while the latter exploits the branch target buffer, BranchScope goes after the directional branch predictor, a component that decides which speculative operations to execute. By misdirecting it, attackers can make the CPU read and spit out data from the memory previously inaccessible. The worst part? You don't need administrative privileges to run the exploit, it can be run from the user-space. Unlike CTS-Labs, the people behind the BranchScope discovery appear to have alerted hardware manufacturers significantly in advance, before publishing their paper (all of it, including technicals). They will present their work at the 23rd ACM International Conference on Architectural Support for Programming Languages and Operating Systems (ASPLOS 2018), later today.

Intel today shared in a blog post that they are deploying microcode solutions that have been developed and validated over the last several weeks. These updates aim to patch security vulnerabilities recently found in Intel processors, and will be distributed, mostly, via OEM firmware updates - users who want to have their system hardened against Spectre and Meltdown exploits will have to ensure that their system manufacturer of choice makes these microcode updates available. If they don't do it in a timely fashion, users have no choice but to be vocal about that issue - Intel has now done its part in this matter.

This is the second wave of Intel's patches to mitigate the Spectre and Meltdown vulnerabilities, after the first, hasty patch sent users on towards unstable, crashing systems and the inevitable update rollback. Security had already been reinstated, of sorts, for Intel's Skylake processors, but left users of any other affected Intel CPU family out in the cold. Here's hoping this is the one update that actually sticks after thorough testing and validation.

BIOSTAR presents another entry-level micro-ATX form factor motherboard - the BIOSTAR H110MDE. This motherboard sports the entry-level Intel H110 chipset that supports the Socket LGA 1151 7th and 6th generation Intel Core processors. The BIOSTAR H110MDE is the perfect solution for desktop users on a tight budget by opting for Kaby Lake and Skylake processors. The compact micro-ATX form factor ensures high compatibility with most desktop cases in the market today. It also comes bundled with a free BullGuard Antivirus Software, another instant saving for builders.

The BIOSTAR H110MDE features the entry-level Intel H110 chipset for the 7th and 6th generation Intel Core processors offering builders instant savings by opting for the previous generation Intel processors. Still, the H110MDE offers the essential features and performance you need for daily computing with its dual DIMM slots supporting up to 32GB of 2400MHz DDR4 memory and a single PCI-E 3.0 x16 slot that supports high-end graphics card and NVMe solid-state drives if desired. As for connectivity, the H110MDE packs a Realtek RTL8111G offering up to 100 MB/s Ethernet connectivity along with two USB 3.1 Gen1 ports and a USB 3.1 Gen1 header offering high-speed data transfers for portable storage drives.

Eni has launched its new HPC4 supercomputer, at its Green Data Center in Ferrera Erbognone, 60 km away from Milan. HPC4 quadruples the Company's computing power and makes it the world's most powerful industrial system. HPC4 has a peak performance of 18.6 Petaflops which, combined with the supercomputing system already in operation (HPC3), increases Eni's computational peak capacity to 22.4 Petaflops.

According to the latest official Top 500 supercomputers list published last November (the next list is due to be published in June 2018), Eni's HPC4 is the only non-governmental and non-institutional system ranking among the top ten most powerful systems in the world. Eni's Green Data Center has been designed as a single IT Infrastructure to host all of HPC's architecture and all the other Business applications.

By the time Intel launched its 8th generation Core "Coffee Lake" desktop processor family (September 25, 2017, with October 5 availability), the company was fully aware that the product it is releasing was vulnerable to the three vulnerabilities plaguing its processors today, the two more publicized of which, are "Spectre" and "Meltdown." Google Project Zero teams published their findings on three key vulnerabilities, Spectre (CVE-2017-5753 and CVE-2017-5715); and Meltdown (CVE-2017-5754) in mid-2017, shared with hardware manufacturers under embargo; well before Intel launched "Coffee Lake." Their findings were made public on January 3, 2018.

Intel's engineers would have had sufficient time to understand the severity of the vulnerability, as "Coffee Lake" is essentially the same micro-architecture as "Kaby Lake" and "Skylake." As one security researcher puts it, this could affect Intel's liability when 8th generation Core processor customers decide on a class-action lawsuit. As if that wasn't worse, "Skylake" and later micro-architectures could require micro-code updates in addition to OS kernel patches to work around the vulnerabilities. The three micro-architectures are expected to face a performance-hit, despite Intel extracting colorful statements from its main cloud-computing customers that performance isn't affected "in the real-world." The company was also well aware of Spectre and Meltdown before its CEO dumped $22 million in company stock and options (while investors and the SEC were unaware of the vulnerabilities).

Shuttle Computer Group, Inc., one of the world's leading designers of small form computers, announces a new and powerful cube-sized computer, its SZ270R9, designed for advanced home and portable gaming, along with virtual reality applications. Unlike other PCs, once set, users can overclock with the Turbo button for the quickest, most realistic action. In spite of its small size, it has an impressive expansion capability and storage capacity. With lots of interior space, the SZ270R9 supports large-format dual-slot graphics cards; users can install up to four 2.5" or 3.5" hard drives and two m.2 bays. It also supports Intel's new Optane Memory to improve data processing and system speed.

"This is the ultimate gaming PC, power packed with an external design that looks like you're ready for battle," said Robert Garcia, channel manager, Shuttle Computer Group. "And when you press the overclock button, watch out! You'll be the winner for sure."

The latest version of Intel's desktop client-platform roadmap has been leaked to the web, which reveals timelines and names of the company's upcoming product lines. To begin with, it states that Intel will upgrade its Core X high-end desktop (HEDT) product line only in Q4-2018. The new Core X HEDT processors will be based on the "Cascade Lake-X" silicon. This is the first appearance of the "Cascade Lake" micro-architecture. Intel is probably looking to differentiate its Ringbus-based multi-core processors (eg: "Coffee Lake," "Kaby Lake") from ones that use Mesh Interconnect (eg: "Skylake-X"), so people don't compare the single-threaded / less-parallized application performance between the two blindly.

Next up, Intel is poised to launch its second wave of 6-core, 4-core, and 2-core "Coffee Lake" processors in Q1-2018, with no mentions of an 8-core mainstream-desktop processor joining the lineup any time in 2018. These processors will be accompanied by more 300-series chipsets, namely the H370 Express, B360 Express, and H310 Express. Q1-2018 also sees Intel update its low-power processor lineup, with the introduction of the new "Gemini Lake" silicon, with 4-core and 2-core SoCs under the Pentium Silver and Celeron brands.

ASUS expanded its socket LGA2066 workstation-class motherboard lineup with the WS C422 Pro SE. The board is physically identical to the WS X299 Pro SE, but is based on the Intel C422 chipset. Designed for single-socket Intel Xeon W ("Skylake-W") processors, this board is targeted at workstation builders who require ECC memory support.

"Skylake-W" is an enterprise variant of the "Skylake-X" silicon, with support for up to 512 GB of ECC quad-channel DDR4 memory. It features up to 18 CPU cores, and is different from the Xeon Scalable "Skylake-SP" silicon. The board supports up to 512 GB of quad-channel DDR4 memory with support for ECC, over its eight memory slots. The rest of its feature-set is identical to that of the WS X299 Pro SE.

Security researchers have found glaring security flaws with Intel Management Engine, the on-chip micro SoC that, besides governing the functionality of the processor, provides on-chip management and security features. These security flaws render "potentially millions" of PCs and notebooks, based on Intel processors, according to the researchers. Intel on Monday released a Detection Tool application that lets you identify vulnerabilities in the Management Engine of your Intel processor-powered PC, and suggests updates to Intel Management Engine drivers, or points to BIOS updates from your PC manufacturer.

Updates to Intel ME are specific to TXE 3.0 (trusted execution engine version 3.0), which is featured on processors based on "Skylake," "Kaby Lake," and "Coffee Lake" micro-architectures, across client- and enterprise market segments, and Atom processors released in the past three years. Intel chronicled this security flaw further under Security Advisory 86, and released the SA-00086 Detection Tool.

IBASE, a global leader in the manufacture of embedded computing and IIoT solutions, launches its new IB990 PICMG 1.3 full-size CPU card. The board supports the latest 7th/6th Generation Intel Xeon/Core i7/i5/i3 processors with speeds up to 4.0GHz. Based on the chipset family formerly known as Skylake, Intel C236 and Q170 Express chipsets, the high-performance IB990 SBC is built with two DIMM sockets to support DDR4 2133 MHz memory modules with up to 32GB in total and six superfast SATA III ports featuring RAID 0/1/5/10 and 6 Gb/s speed.

As a perfect solution for control systems in factory automation and other industrial applications, IB990 is designed for compute, data and graphics intensive applications and enables up to three independent displays via DVI-I, VGA and DVI-D interface. This long-life single board computer incorporates a rich set of I/O connectivity including two Gigabit Ethernet, four COM, two USB 2.0 and three USB 3.0 ports, plus a Mini PCI-E expansion socket for optional wireless modules. Additionally, the IB990 takes advantage of Intel AMT 11.0 for remote management and powering-on functionalities.

The upcoming Intel 300-series chipset, and LGA1151 socket continues to be a source of chaos for PC builders. While the 100-series and 200-series chipset based motherboards support both 6th generation Core "Skylake," and 7th generation Core "Kaby Lake" processors, they will not support the upcoming 8th generation Core "Coffee Lake" chips. What's more, the upcoming 300-series chipset motherboards, which were earlier believed to feature backwards-compatibility for "Skylake" and "Kaby Lake" chips, will not support them, according to a Hardware.info report.

The LGA1151 socket between the two platforms remains unchanged, down to the package notches, which are designed to prevent you from installing a processor on an incompatible motherboard (eg: LGA1150 processors on LGA1151 motherboards). This isn't even a case like the incompatibility between LGA2011 and LGA2011v3, where the latter features DDR4 memory I/O, compared to the former's DDR3. Platform segmentation, and synthetically keeping up with a product development cycle, by forcing people to upgrade motherboards every two generations, appears to be Intel's primary motivation. The Hardware.info report, however, doesn't rule out the possibility of 300-series chipset motherboards getting support for older LGA1151 processors in the future, through BIOS updates.

Intel's Skylake architecture, which christened the 6000 series of CPUs, has had its time in the sun, there's no denying that. However, as has been the case with Intel, who usually don't keep more than two architectures in the market at any given time, the Skylake series of processors have seen the end of their days. This is the announced death of an architecture that was competent in offering a token improvement for Intel's Core performance. Yet despite that, it certainly didn't set the world on fire with anticipation and acclaim. It was a sound business decision for Intel, however, allowing the company to maximize profits and capitalizing on a virtually outclassed competitor, which offered, at the time, the ill-spoken Bulldozer architecture and derivatives.

This comes mere months before Intel ships out their 8000 series CPUs on the Coffee Lake microarchitecture. This one is the most interesting from the blue giant in years, seeing a core count democratization towards the masses and the virtual elimination of dual-core CPUs, which have been overstaying their welcome for some time now. Expect decreasing availability in the following moths as retailers work through their available inventories. According to Intel, Skylake processors can be ordered until March 2018, with deliveries finalizing by September 2018. This applies particularly to the (arguably) most interesting models in the lineup, in the form of the Core i7-6700K, Core i5-6600K, and the Core i5-6402P and Core i3-6098P models which shipped with less powerful HD510 iGPUs. I say arguably, because for this editor, an i5-6400 which was overclockable through BIOS settings was the price-performance champion of this generation.

Ahead of their launch later this quarter, SiSoft SANDRA benchmarks of Intel 8th generation Core i7-8700K and Core i5-8400 six-core processors surfaced in benchmark databases, which were promptly compared to their predecessors by HotHardware. The results put to the test Intel's claims of "over 40 percent more performance" compared to the 7th generation Core processors, which the company made in its 8th Generation Core Launch Event presentation. A bulk of these performance increases are attributed to the increasing core-count over generation, which directly yields higher multi-threaded performance; while a small but significant portion of it is attributed to increases in single-threaded performance. Since the "Coffee Lake" micro-architecture is essentially a refresh of the "Skylake" architecture, single-threaded performance increases could be attributed to higher clock speeds.

The Core i7-8700K is the top-dog of the 8th generation Core mainstream-desktop processor family. This six-core chip was compared to the product it succeeds in Intel's MSDT product-stack, the quad-core Core i7-7700K. There is a 45 percent increase in performance, in the "processor arithmetic" test; and a 47 percent increase in the "processor multimedia" test. These two test-suites are multi-threaded, and hence benefit from the two added cores, which in turn add four additional logical CPUs, thanks to HyperThreading. "Processor cryptography" sees a 12 percent increase. The single-precision and double-precision "Scientific Analysis" tests, which again are multi-threaded, see 26 percent and 32 percent performance gains over the i7-7700K, respectively.

GIGABYTE is gearing up for the release of the first GPU-supporting server based on Intel's Skylake Purley architecture. Leveraging the latter's scalability - which can be applied across compute, network and storage applications - GIGABYTE has committed its design expertise to a high-performance system with GPU-focused, OCP-based and other add-on functionality. This server adopts Intel's new product family - officially named the 'Intel Xeon Scalable' and its increased I/O options to deliver a truly high-performance, flexible system.

GIGABYTE's new system takes advantage of the performance benefits that Intel has built in to target a range of segments and created a system that meets HPC needs.

Intel 8th generation Core "Coffee Lake" mainstream desktop processors could work on older socket LGA1151 motherboards based on Intel 200-series chipset, after all. A recent motherboard BIOS update by ASUS alters the name-string of a system device to read "Intel Kaby Lake/Coffee Lake-S Host Bridge/DRAM Controller," reinforcing the theory that Coffee Lake and its companion 300-series chipset make up the Kaby Lake "Refresh" platform.

Responding to a customer question, motherboard maker ASRock had recently commented that "Coffee Lake" processors won't be supported by current motherboards based on the 200-series chipset, dashing hopes of current platform users to upgrade to newer 6-core processors without having to unnecessarily buy a new motherboard and reinstall software. This development shouldn't necessarily raise hopes. Although Kaby Lake and Coffee Lake have a lot of architectural similarities, particularly with their uncore components, revised electrical requirements of the new chips could be behind the lack of backwards platform-compatibility. It remains to be seen if you can use your current "Skylake" and "Kaby Lake" processors on upcoming 300-series chipset motherboards.