An unnamed Intel Core Ultra "Arrow Lake-S" desktop processor engineering sample (ES) made it to the hands of someone willing to post its CPU-Z Bench screenshot. The processor allegedly scores a whopping 1143.2 points in the CPU-Bench single-thread benchmark; and 12922.4 points in the multithreaded benchmark. When compared with the internal Intel Core i9-13900K reference scores of CPU-Z, the single-thread benchmark score is a staggering 26.71% increase over that of the i9-13900K (902 points); while the multithreaded score is 22% lower.

Since we don't know which processor model this "Arrow Lake-S" ES is, we have no way of telling if it is the top SKU with its rumored 8P+16E core configuration, or a mid-tier Core i5 SKU with the expected 6P+8E configuration. The single-threaded test only loads one P-core, and here the IPC of one of the chip's "Lion Cove" P-cores is able to trounce one of the "Raptor Cove" P-cores of the i9-13900K reference score. You also have to understand that the Hyper-Threading plays no role in this thread. Where it could play a role is the multithreaded test. "Lion Cove" lacks HTT support unlike "Raptor Cove," and the i9-13900K is a 24-core/32-thread processor. It's important to note here, that "Arrow Lake" doesn't just have up to 8 "Lion Cove" P-cores, but also up to 16 "Skymont" E-cores that Intel claims to have achieved a massive IPC gain over its predecessor, bringing its IPC in the league of past-generation P-cores such as the "Raptor Cove" or "Golden Cove."

During Computex 2024, Intel announced the next-generation compute platform for the notebook segment in the form of the Core Ultra 200V series, codenamed Lunar Lake. Set for release in September 2024, these processors are generating excitement among tech enthusiasts and industry professionals alike. According to the latest leak by VideoCardz, Intel plans to unveil nine variants of Lunar Lake, including Core Ultra 7 and Core Ultra 5 models, with a single high-end Core Ultra 9 variant. While exact specifications remain under wraps, Intel's focus on artificial intelligence capabilities is clear. The company aims to secure a spot in Microsoft's Copilot+ lineup by integrating its fourth-generation Neural Processing Unit (NPU), boasting up to 48 TOPS of performance. All Lunar Lake variants are expected to feature a hybrid architecture with four Lion Cove performance cores and four Skymont efficiency cores.

This design targets low-power mobile devices, striking a balance between performance and energy efficiency. For graphics, Intel is incorporating its next-generation Arc technology, dubbed Battlemage GPU, which utilizes the Xe2-LPG architecture. The leaked information suggests that Lunar Lake processors will come with either 16 GB or 32 GB of non-upgradable LPDDR5-8533 memory. Graphics configurations are expected to include seven or eight Xe2 GPU cores, depending on the model. At the entry level, the Core Ultra 5 226V is rumored to offer a 17 W base power and 30 W maximum turbo power, with performance cores clocking up to 4.5 GHz. The top-tier Core Ultra 9 288V is expected to push the envelope with a 30 W base power, performance cores boosting to 5.1 GHz, and an NPU capable of 48 TOPS. You can check out the rest of the SKUs in the table below.

As Intel gears for the launch of Lunar Lake and Arrow Lake processors, the company appears to be preparing a new line of high-performance processors for gaming laptops. Recent developments suggest that the company is adapting its desktop-grade Arrow Lake-S chips for use in ultra-high-performance notebooks. The buzz began when X user @InstLatX64 spotted Intel testing a peculiar motherboard labeled "Arrow Lake Client Platform/ARL-S BGA SODIMM 2DPC." This discovery hints at the possibility of Intel packing up to 24 cores into laptop processors, eight more cores compared to the 16 cores expected in standard Arrow Lake-H mobile chips. By utilizing the full potential of Arrow Lake-S silicon in a mobile form factor, Intel aims to deliver desktop-class performance to high-end notebooks in a BGA laptop CPU.

The leaked chip would likely feature eight high-performance Lion Cove P-cores and 16 energy-efficient Skymont E-cores, along with an integrated Xe2 GPU. This configuration could provide the raw power needed for demanding games and professional applications in a portable package. However, implementing such powerful hardware in laptops presents challenges. The processors are expected to have a TDP of 45 W or 55 W, with actual power consumption potentially exceeding these figures to maintain high clock speeds. Success will depend not only on Intel's chip design but also on the cooling solutions and power delivery systems developed by laptop manufacturers. As of now, specific details about clock speeds and performance metrics remain under wraps. The test chip that surfaced showed a base frequency of 3.0 GHz, notably without AVX-512 support.

TSMC has commenced mass-production of chips for Intel on its 3 nm EUV FinFET foundry node, according to a report by Taiwan industry observer DigiTimes. Intel is using the TSMC 3 nm node for the compute tile of its upcoming Core Ultra 300 "Lunar Lake" processor. The company went into depth about "Lunar Lake" in its Computex 2024 presentation. While a disaggregated chiplet-based processor like "Meteor Lake," the new "Lunar Lake" chip sees the CPU cores, iGPU, NPU, and memory controllers sit on a single chiplet called the compute tile, built on the 3 nm node; while the SoC and I/O components are disaggregated the chip's only other chiplet, the SoC tile, which is built on the TSMC 6 nm node.

Intel hasn't gone into the nuts and bolts of "Arrow Lake," besides mentioning that the processor will feature the same "Lion Cove" P-cores and "Skymont" E-cores as "Lunar Lake," albeit arranged in a more familiar ringbus configuration, where the E-core clusters share L3 cache with the P-cores (something that doesn't happen on "Lunar Lake"). "Arrow Lake" also features a iGPU based on the same Xe2 graphics architecture as "Lunar Lake," and will feature an NPU that meets Microsoft Copilot+ AI PC requirements. What remains a mystery about "Arrow Lake" is the way Intel will go about organizing the various chiplets or tiles. Reports from February 2024 mentioned Intel tapping into TSMC 3 nm for just the disaggregated graphics tile of "Arrow Lake," but we now know from "Lunar Lake" that Intel doesn't shy away from letting TSMC fabricate its CPU cores. The first notebooks powered by "Lunar Lake" are expected to hit shelves within Q3-2024, with "Arrow Lake" following on in Q4.

Intel Socket LGA1851 will be the new infrastructure driving at least the next two generations of Intel desktop processors, and the new Core Ultra "Arrow Lake-S" will be the first processor generation to use it. These chips pack new "Lion Cove" P-cores, "Skymont" E-cores, an updated PCIe Gen 5 I/O, and new Xe2 "Battlemage" integrated graphics; with generational performance leaps to be had. At the ASUS Computex 2024 booth, we spotted some of the company's first high-end gaming PC motherboards for the platform, based on what could be the Intel Z890 chipset.

Our first find is the ROG Maximus Z890 Hero, or at least a variant of it featuring the ASUS BTF backside I/O connectivity. There will be a regular variant with conventional front-facing I/O, too. The LGA1851 socket looks almost identical to the LGA1700. In fact the two have the same physical dimensions, and are cooler compatible—your LGA1700-compatible coolers will work on LGA1851 motherboards. Intel added to the pin-count by tweaking the pin pitch, and reducing the size of the "courtyard" (the central void in the land grid meant for SMDs). LGA1851 is a pure-DDR5 platform, and has more PCIe Gen 5 connectivity than LGA1700, such as CPU-attached Gen 5 NVMe slots that don't subtract lanes from the x16 PEG slot. The ROG Maximus Hero appears to be a feature-packed motherboard geared for CPU overclocking, as well as connectivity galore. It also comes with Thunderbolt 4, Wi-Fi 7, USB4, 5 GbE, and next-generation SupremeFX onboard audio.

Amid all the attention the next-generation "Lion Cove" P-cores powering the upcoming "Lunar Lake" and "Arrow Lake" microarchitectures get as they compete with AMD's "Zen 5," it's easy to lose sight of the next-generation "Skymont" E-cores that will feature in both the upcoming Intel microarchitectures, and as standalone cores in the "Twin Lake" low-power processor. Pictures from an Intel presentation, possibly to PC OEMs, got leaked to the web. These are just thumbnails, we can't see the whole slides, but the person who took the pictures captioned them in a now-deleted social media post on the Chinese microblogging platform Weibo.

And now, the big reveal—the "Skymont" E-core is said to offer a double-digit IPC gain over the "Crestmont" E-core powering the current "Meteor Lake" processor, which in itself posted a roughly 4% IPC gain over the "Gracemont" E-cores found in the "Raptor Lake" and "Alder Lake" microarchitectures. Such an IPC gain over "Gracemont" should make the "Skymont" E-core match the IPC of the "Sunny Cove" or "Willow Cove" P-cores powering the "Ice Lake" and "Tiger Lake" microarchitectures, respectively, which were both within the 90th percentile of the AMD "Zen 3" core in IPC.

Intel has prepared the Core Ultra 5-238V, a Lunar Lake-MX CPU that integrates 32 GB of LPDDR5X memory into the CPU package. This new design represents a significant departure from the traditional approach of using separate memory modules, promising enhanced performance and efficiency, similar to what Apple is doing with its M series of processors. The Core Ultra 5-238V is the first of its kind for Intel to hit mass consumers. Previous attempt was with Lakefield, which didn't take off, but had advanced 3D stacked Foveros packaging. With 32 GB of high-bandwidth, low-power LPDDR5X memory directly integrated into the CPU package, the Core Ultra 5-238V eliminates the need for separate memory modules, reducing latency and improving overall system responsiveness. This seamless integration results in faster data transfer rates and lower power consumption with LPDDR5X memory running at 8533 MT.

Applications that demand intensive memory usage, such as video editing, 3D rendering, and high-end gaming, will be the first to experience performance gains. Users can expect smoother multitasking, quicker load times, and more efficient handling of memory-intensive tasks. The Core Ultra 5-238V is equipped with four big Lion Cove and four little Skymont cores, in combination with seven Xe2-LPG cores based on Battlemage GPU microarchitecture. The bigger siblings to Core Ultra 5, the Core Ultra 7 series, will feature eight Xe2-LPG cores instead of seven, with the same CPU core count, while all of them will run the fourth generation NPU.

Intel is readying the new N250 "Twin Lake" line of low-power processors that succeed the N200 series "Alder Lake-N" series. These are chips built on the latest process node Intel is using for its Core and Xeon processors, but only features E-cores (efficiency codes) from the latest microarchitecture. Chips from the N200 series are popular with low-cost notebooks, thin-clients, embedded systems, kiosks and point-of-sale terminals, NAS, and consumer electronics. "Twin Lake" is codename for the new processor series, these are likely monolithic processor dies that use a client ringbus layout, and one E-core cluster that makes up the compute muscle.

While "Alder Lake-N" is powered by "Gracemont" E-cores, the new "Twin Lake" chips are expected to feature "Skymont" E-core clusters. Intel is expected to debut "Skymont" E-cores with its upcoming Core Ultra 200V series "Lunar Lake-MX" mobile processors. "Skymont" is technically two generations ahead of "Gracemont," as Intel introduced the "Crestmont" cores with its current Core Ultra 100 "Meteor Lake" processor family. Not a lot is known about "Skymont" at this point, except that it's expected to feature IPC increases, and perform close to Intel's P-cores from 3-4 generations ago, such as the "Willow Cove" cores powering the 11th Gen Core "Tiger Lake" processors, looking at past trends of the "Gracemont" core performing similar to a "Skylake" core with HTT disabled.

Intel is giving its next-generation desktop processor lineup the Core Ultra 200 series processor model numbering. We detailed the processor numbering in our older report. The Core Ultra 200 series would be the company's first desktop processors with AI capabilities thanks to an integrated 50 TOPS-class NPU. At the heart of these processors is the "Arrow Lake" microarchitecture. Its development is the reason the company had to refresh "Raptor Lake" to cover its 2023-24 processor lineup. The company's "Meteor Lake" microarchitecture topped off at CPU core counts of 6P+8E, which would have proven to be a generational regression in multithreaded application performance over "Raptor Lake." The new "Arrow Lake-S" desktop processor has a maximum CPU core configuration of 8P+16E, which means consumers can expect at least the same core-counts at given price-points to carry over.

According to a report by Chinese tech publication Benchlife.info, the introduction of "Arrow Lake" would see Intel's desktop processor model numbering align with that of its mobile processor numbering, and incorporate the Core Ultra brand to denote the latest microarchitecture for a given processor generation. Since "Arrow Lake" is a generation ahead of "Meteor Lake," processor models in the series get numbered under Core Ultra 200 series.

Intel Core Ultra "Lunar Lake-MX" will be the company's bulwark against Apple's M-series Pro and Max chips, designed to power the next crop of performance ultraportables. The MX codename extension denotes MoP (memory-on-package), which sees stacked LPDDR5X memory chips share the package's fiberglass substrate with the chip, to conserve PCB footprint, and give Intel greater control over the right kind of memory speed, timings, and power-management features suited to its microarchitecture. This is essentially what Apple does with its M-series SoCs powering its MacBooks and iPad Pros. Igor's Lab scored the motherlode on the way Intel has restructured the various components across its chiplets, and the various I/O wired to the package.

When compared to "Meteor Lake," the "Lunar Lake" microarchitecture sees a small amount of "re-aggregation" of the various logic-heavy components of the processor. On "Meteor Lake," the CPU cores and the iGPU sat on separate tiles—Compute tile and Graphics tile, respectively, with a large SoC tile sitting between them, and a smaller I/O tile that serves as an extension of the SoC tile. All four tiles sat on top of a Foveros base tile, which is essentially an interposer—a silicon die that facilitates high-density microscopic wiring between the various tiles that are placed on top of it. With "Lunar Lake," there are only two tiles—the Compute tile, and the SoC tile.

There is some confidence behind removing HTT (Hyper-Threading technology) for the P-cores of its upcoming processor generations. Apparently "Lunar Lake" 17 W U-segment processors offer a substantial multithreaded performance gain of almost 50% over the current-generation "Meteor Lake," enabling Intel to do away with the power- or cache overheads that come with HTT. "Lunar Lake" will be Intel's third microarchitecture powering mobile processors under the Core Ultra brand; and its U-segment SKUs meant for ultraportables will come with processor base power values of 17 W. Intel will probably revise its platform specifications for the U-segment to denote 17 W, up from the current 15 W. Bionic Squash, a reliable source with Intel leaks, suggests so. The processors will come with a configurable base power of up to 30 W.

Intel "Lunar Lake" microarchitecture has a lot in common with the upcoming "Arrow Lake." For starters, both microarchitectures use the same combination of "Lion Cove" P-core architecture, and "Skymont" E-core architecture; however "Lunar Lake" comes with changes in the core-configuration, and the use of more advanced foundry nodes for some of its tiles. "Lunar Lake," much like "Meteor Lake," comes with a design priority for mobile platforms, which is why Intel is planning to launch this shortly after "Arrow Lake," with some reports even speaking of a late-2024 debut for the U-segment.

Intel is rumored to be preparing to tease its Core Ultra 2-series "Arrow Lake" processor at the 2024 Computex, which gets underway this June. The series itself isn't expected to launch before Q4-2024, but Computex is the only major global event between June and January for Intel to unveil or tease its next-generation processor, so here we are. At this point we don't know which exact platform of "Arrow Lake" Intel is planning to tease—whether these are the mobile variants, or the Socket LGA1851 desktop "Arrow Lake-S." An unveiling of the latter would almost definitely entail PC motherboard vendors being allowed to show off their first compatible motherboards at Computex—the perfect platform for them to do so.

The Core Ultra "Arrow Lake" retains a Foveros Tiled (chiplet) construction of "Meteor Lake," but with advancements to the chip's Compute tile, which is built on the Intel 20A foundry node, and rocks new "Lion Cove" P-cores and "Skymont" E-cores; an updated I/O tile, and an iGPU based on the updated Xe-LPG+ graphics architecture. Since the processor now serves practically all PCH functions, the mobile "Arrow Lake" is a single-chip solution, whereas the desktop "Arrow Lake-S" is expected to remain 2-chip. There will be more I/O from the CPU, though, which is why the socket has 151 more pins than the LGA1700.

Over the weekend, there have been a series of leaks from sources such as Golden Pig Upgrade, and High Yield YT, surrounding Intel's next-generation desktop processor, the Core Ultra 2-series "Arrow Lake-S." The lineup is likely to continue the new client processor naming scheme Intel introduced with the Core Ultra 1-series "Meteor Lake" on the mobile platform. "Arrow Lake-S" is rumored to debut the new Socket LGA1851, which retains cooler-compatibility with LGA1700. Although Intel has nucleated all I/O functions of the traditional PCH to "Meteor Lake," making it a single-chip solution on the mobile platform; and although the mobile "Arrow Lake" will continue to be single-chip; the desktop "Arrow Lake-S" will be a 2-chip solution. This is mainly because the desktop platform demands a lot more PCIe lanes, for a larger number of NVMe storage devices, or high bandwidth devices such as Thunderbolt and USB4 hubs, etc.

Another key finding in this latest series of leaks, is that unlike "Meteor Lake," the desktop "Arrow Lake-S" will do away with low-power island E-cores located in the SoC tile of the processor. All CPU cores are located in the Compute tile, which is expected to be built in the Intel 20A foundry node—the company's first node to implement GAAFETs (nanosheets), with backside power delivery; as well as an advanced 2nd generation EUV lithography. Intel's 1st Gen EUV is used on the current FinFET-based Intel 4 and Intel 3 foundry nodes.