XMG introduces the XMG NEO 16, the definite flagship model of their 2024 laptop range in terms of performance and features. Accordingly, the latest model combines Intel's Core i9-14900HX with NVIDIA GeForce graphics cards up to an RTX 4090. The 16.0-inch laptop has been redesigned from the ground up and features a wide range of improvements, including a more compact aluminium chassis, a new cooling system with additional optimizations for the optional XMG OASIS laptop water cooling system, a 500 nits bright 16:10 display, and a revised keyboard layout.

Core i9-14900HX, GeForce RTX Graphics Cards and a New Cooling System
Representing the high-end segment, the XMG NEO 16 (E24) combines Intel's fastest laptop CPU, the Core i9-14900HX, with a choice of mobile NVIDIA graphics cards from the GeForce RTX 4060 to the RTX 4090, which will continue to be the benchmark in 2024, including the maximum specified graphics performance of up to 175 watts (150 watts plus 25 watts Dynamic Boost).

During the CES 2024 show, EK unveiled an exciting new addition to their premium all-in-one (AIO) CPU cooler lineup—the EK-Nucleus AIO CR360 Direct Die D-RGB. As the name suggests, this new 360 mm AIO water cooler is purpose-built for direct die cooling of delidded Intel LGA1700 CPUs. The EK-Nucleus Direct Die stands out with its custom cold plate and mounting mechanism, which are exclusively engineered for exposed CPU dies. The nickel-plated copper base ensures compatibility with liquid metal TIMs like the included Thermal Grizzly Conductonaut, which comes in the package. EK has worked with der8auer to provide delidding service kits and tools to facilitate easy DIY removal of the integrated heat spreader (IHS).

The package also contains a contact frame and protective foam for safe liquid metal application. At the heart of the cooler is a powerful AIO pump EK co-developed with the OEM manufacturer, meaning it is not an off-the-shelf pump found in other AIOs and is capable of up to 500 L/h flow rate. The reinforced, sleeved rubber tubing is fitted with aluminium covers for durability. Integrated omnilink connectors allow daisy chaining of the three included 120 mm D-RGB fans for cable management. The EK-Nucleus Direct Die offers extensive RGB lighting customization with illuminated circle accents on the removable pump top covers. The diamond-cut brushed aluminium side panels and radiator cowl add to the premium aesthetic. The new AIO will be available for the Intel LGA1700 platform, with hopefully more versions later. The EK-Nucleus AIO CR360 Direct Die D-RGB is now available for pre-order at €202.90 MSRP price tag.

SCHENKER's premium ultrabook series VISION upgrades to Intel's Core i7-13700H and also receives a graphics card update. Aside from the VISION 16 Pro with a GeForce RTX 4070 or 4060, the VISION 16 is only available with an Intel Iris Xe GPU. On the other hand, the VISION 14 with a 99 Wh battery and 3K display offers a choice between a model with Iris Xe and GeForce RTX 3050 Refresh. Thus, the slim laptops are among the lightest and thinnest ultrabooks in their respective performance or equipment classes. Nevertheless, the model series is defined by good connectivity as well as plugged-in RAM and SSDs. All laptops are available in black or silver.

Schenker Technologies updates the 16-inch premium ultrabook SCHENKER VISION 16 Pro in the model version M23 (Mid 2023) to the latest level of technology - with a fast Intel Core i7-13700H featuring 6 performance and 8 efficiency cores as well as an NVIDIA GeForce RTX 4070 or 4060 as freely configurable options, each with a GPU performance of up to 95 watts (70 watts plus 25 watts Dynamic Boost 2.0).

A Reddit user has shared their experience of passively cooling an AMD Ryzen 9 7950X, with some modifications to the setup. Using the Streacom DB4 passively cooled case, the user u/AromaticImpress7778 pulled off cooling a processor with 16 cores and 32 threads with a TDP of 170 Watts. Interestingly, the Streacom DB4 case rates CPU support for only 65 Watts, meaning some modifications were in place. To support the high-TDP CPU, the user used two of the one-kilogram copper bars and attached them to the case. Heat is transferred to the two one-kilogram blocks using the case's default plate and an additional 233-gram copper plate for the CPU and motherboard. These big copper blocks are not soldered to the case, but instead, the user puts Thermal Grizzly Conductonaut liquid metal between copper parts and Arctic MX-6 between the case and copper.

To cool the AMD Ryzen 9 7950X and MSI B650I board, accompanied by HDPlex GaN 250 W and 64 GB of memory, the system did well enough for a passive build. After running the system at full load, the CPU reached 95 degrees Celsius for CCD1 and 95 degrees Celsius for CCD2. The external panels of the Streacom DB4 case were getting 50C to 60C of heat. Additionally, the user noted that the usage of this system will be more relaxed, as it will not run under full load for a prolonged period. Regarding the system's total weight, the entire build weighs around 13 KG, with 4.4 KG of that being only copper. The case weighs 7.5 KG, and the other parts weigh about one kilogram.

EK, the premium liquid cooling hardware manufacturer, is launching the Direct Die product series aimed at delidding and achieving the ultimate cooling of the LGA 1700 socket-based Intel CPUs from the 12th generation Alder Lake and 13th gen Raptor Lake families. Kitguru teamed up with EK to investigate the potential benefits of direct die cooling for Intel's Alder Lake CPUs to achieve the best possible thermal performance on a daily basis. After publishing the first video announcing this collaboration, EK was overwhelmed by the response from Kitguru's audience. In order to bring these products to market, EK reached out to Der8auer, a renowned expert in delidding and direct die applications.

EK has prepared a total of four products to start this Direct Die series: two CPU water blocks (one Limited Edition), a delidding tool, and an upgrade kit for existing EK-Quantum Vector² LGA1700 water blocks. So far, these products are aimed at Intel's LGA1700 socket and 12th and 13th-generation Intel Core CPUs. Delidding is the process of removing the integrated heatspreader (IHS) to reduce the distance between the CPU core die and the coldplate of the CPU cooler. Another benefit involves the removal of an entire layer of thermal transfer from the CPU die to the IHS. The delidding process enables a direct heat transfer from the CPU core to the water block. All this results in a significant reduction in overall thermals and less thermal difference between CPU cores. The procedure is typically performed by experienced enthusiasts because it involves a physical modification of the product that voids the CPU warranty. For a more in-depth explanation, please refer to this EK's blog post on delidding.

ASUS has switched to a new liquid metal thermal compound for its entire 2020 ROG gaming laptop range, liquid metal has long been used in the enthusiast overclocking scene but this is the first time we've seen its widespread use in a mainstream laptop. ASUS had to develop new machinery to facilitate the application of the liquid metal thermal compound as traditionally it had only been applied manually which was not feasible in this case.

ASUS is utilizing the highly respected Conductonaut from Thermal Grizzly for the job to ensure the 10th Gen Intel Core processors powering the lineup stay cool, laptops featuring this new combination will be available from Q2. This press release from ASUS details their process in bringing liquid metal thermal compound to the gaming laptop market.

We kept seeing hints regarding Intel's 9000-series processors running hot, including from their own board partners. As it turned out, the actual results are a mixed bag with some running very hot and most others ending up being power-limited more so than temperature-limited. Our own review sample showed overall better load temperatures relative to the predecessor 8000-series processors thanks to the soldered TIM (sTIM) used here, to give you some context. But that did not stop overclocker extraordinaire Roman "Der8auer" Hartung from de-lidding the processor to see why they were not generally better as expected.

As it turns out, there are a few things involved here. For one, replacing sTIM with Thermal Grizzly Conductonaut (Der8auer has a financial interest in the company, but he does disclose it publicly) alone improves p95 average load temperatures across all eight cores by ~9 °C. This is to be expected given that the liquid metal has a vastly higher thermal conductivity than the various sTIM compositions used in the industry. Of more interest, however, is that both the PCB and the die are thicker with the Core i9-9900K compared to the Core i7-8700K, and lapping the die to reduce thickness by a few microns also does a lot to lower the CPU temperatures relatively. Overall, Intel have still done a good job using sTIM- especially compared to how it was before- but the current state of things means that we have a slightly better stock product with little scope for improvement within easy means to the consumer.

For those users who thought they'd like some silver with their Intel, german webshop Caseking has a product for you. The company has taken the binning concept that we've already seen with other webshops, which pass the onus of the silicon lottery towards themselves, and taken it to the next level. Caseking will offer Core i7 8700K products that have not only been binned towards achieving guaranteed speeds of 5 GHz, 5.1 GHz and 5.2 GHz, but they're also retrofitting these binned 8700K processors with a 99.9% purity silver heatspreader to improve operating temperatures for these guaranteed-overclocking processors.