Intel has officially pulled back the curtain on its 14th Gen Core CPUs, giving gamers, creators, enthusiasts, and everyday users a new tier of processors that elevate everything they do. We've already teased several of our Z790 motherboards purpose-built for the latest Intel Core CPUs, but now we're ready to share all the details. In total, we're releasing seven new Z790 motherboards for your consideration as you hunt for the best motherboard for your 14th Gen Intel CPU. Our cutting-edge ROG Maximus motherboard family is expanding with the ROG Maximus Z790 Dark Hero, the ROG Maximus Z790 Apex Encore, and the ROG Maximus Z790 Formula. For gamers everywhere, we're expanding our ROG Strix lineup with three new models, and fans of our TUF Gaming series will be pleased to see the TUF Gaming Z790-Pro WiFi make its debut. These new motherboards join our existing Z790 and Z690 motherboards, which also support Intel's latest and greatest chips through a simple firmware update.

There's a lot to go over with the new additions to our Z790 motherboard family: they mark the debut of our first WiFi 7 motherboards, for one, and we're increasing the number of models with onboard PCIe 5.0 M.2 slots. They offer our latest game-changing innovations like DIMM Flex, and they make the process of building a PC easier than ever with their DIY-friendly features.

MSI is announcing today the brand-new Intel Core 14th gen processors that will be best paired with our recently launched MSI's Z790 MAX MEG Series, MPG Series, MAG Series, and PRO Series motherboards. MSI's Z790 MAX motherboards paired with Intel Core 14th gen processors are here to succeed with more efficient computing from the last generation of processors. As a world-leading motherboard manufacturer, MSI's Z790 MAX motherboards are to design and provide the very best performance for gamers, creators, and all users.

Intel Core 14th gen processors are still built on their "Intel 7" Hybrid Architecture Process Technology but for the first time on the Intel Core 14th gen processors, the highest performance i9-14900K processors can hit up to 6 GHz thanks to Intel 's Thermal Velocity Boost. This CPU refresh also focuses on the Intel Core i7-14700K as it increases an additional 4 E-Cores that will help increase certain multithread workloads as well as an increase in L3 Cache across all processors. On launch, there will be six models available, which are the Intel Core i9-14900K, i9-14900KF, i7-14700K, i7-14700KF, i5-14600K and i5-14600KF.

GIGABYTE Technology, a leading global powerhouse in motherboards, graphics cards, and cutting-edge hardware solutions, is ready to usher in the era of Intel Core 14th gen processors with a complete lineup of Z790/Z690 series motherboards. Especially, From the flagship Z790 AORUS XTREME X to the versatile Z790 AORUS ELITE X, the X Gen series is engineered to optimize the performance of Intel Core 14th gen processors and drive DDR5 memory faster than ever.

The AORUS Z790 X Gen motherboards, equipped with cutting-edge technologies, deliver best-in-class DDR5 compatibility and leading performance, supporting up to DDR5 XMP-8266 and beyond. The most crucial technology for DDR5's leading performance is the newly introduced Back Drilling Technology, which enhances signal integrity, resulting in improved system performance and heightened reliability.

Qualcomm Technologies, Inc. is ushering in a new era of home connectivity, and new opportunities for service providers, with the introduction of the Qualcomm 10G Fiber Gateway Platform and its signature feature, Qualcomm Service Defined Wi-Fi technology.

The overwhelming majority of subscribers experience their broadband service through Wi-Fi. In today's broadband systems, the access network from the service provider to the home and Wi-Fi within the home are managed separately - with a quality of service which is nearly impossible to maintain across the entire network, given the diversity of devices, applications, connectivity technologies, and the near-constant change across all these elements.

Amazon announced eero Max 7, its first Wi-Fi 7 mesh system and the fastest, most powerful eero yet. eero Max 7 combines the company's patented TrueMesh networking technology with the latest Wi-Fi 7 standard to dramatically increase speeds, avoid interference from neighboring networks, and improve mesh latency-and with 10 Gigabit Ethernet, it's now possible to download a 4K movie in 10 seconds or a 50 gigabyte video game in less than a minute.

"Connectivity is core to our everyday lives—we stream movies and TV, take video calls for work, play online games with our friends, and use an ever increasing number of connected devices," said Nick Weaver, co-founder and CEO of eero. "With tens of millions of eero devices around the world, we know customers notice even a millisecond delay when streaming a movie or gaming, want reliable connectivity in every corner of the home, and always look for faster speeds. eero Max 7 is the culmination of everything we've learned—this is an entirely new class of eero, built without compromise."

MSI is excited to announce today the brand-new MAX Series Motherboards for the Z790 chipset and Micro-ATX motherboards for the B760 chipset, which includes the MEG Series, MPG Series, MAG Series, and PRO Series. MSI's Z790 and B760 motherboards paired with Intel Core Next-gen, 13th Gen, and 12th Gen Processors are here to bring even more performance and fine-tuning on the success of the last generation of Processors. As a world-leading motherboard brand, MSI's Z790 MAX Series motherboards are designed to provide the very best performance for gamers and creators.

MSI Z790 MAX Series motherboards have a strong lineup of power phase design boards across every model ranging from our flagship MEG Z790 GODLIKE MAX that has 26 Duet Rail Power System CPU power phases with 105 A SPS to even our entry-level PRO Series motherboard that has increased up to 16 DRPS CPU power phases with 80 A SPS.

NETGEAR, Inc., the leading provider of award-winning connected products designed to simplify and improve people's lives, today took its award-winning Orbi line to new heights with a powerful new antenna design and exclusive, patented technology that enhance the benefits of WiFi 7. Born of over 25 years of NETGEAR pioneering WiFi expertise, the Orbi 970 Series delivers unparalleled performance, speeds of up to 27 Gbps, a slim, elegant design and high-performance antennas for 360-degree coverage across just about any home, no matter the layout.

With the rise of faster multi-gig internet speeds now available to more households, the growing number of connected devices per family and the ever-increasing growth of bandwidth-intensive applications such as 4K/8K video streaming, HD Zoom calls, graphics-focused work, highly interactive real-time gaming and immersive AR/VR entertainment, the need for faster WiFi speeds, lower latency and more capacity becomes imperative. Enter WiFi 7. While WiFi 6E opened the 6 GHz band as a superhighway for the latest, fastest devices, WiFi 7 builds on that promise by expanding the channels to 320 MHz and unleashing unprecedented speeds and performance. The Orbi 970 Series maximizes the potential of the new standard with innovative, new technology that ensures the benefits are delivered throughout the home, from the front door to the backyard, across all devices simultaneously.

Intel today updated its ARK listings with two new networking chipsets: Wi-Fi 7 BE200 and Wi-Fi 7 BE202. The company unveiled IEEE 802.11be (Wi-Fi 7) specification-based chipsets despite the standard still needing final ratification. The Wi-Fi 7 standard promises data rates as high as 40 Gbit/s, with Intel's BE200 chipset using 2x2 TX/RX streams with 2.4 GHz, 5 GHz, and 6 GHz bands. However, as demonstrated by the adapter's maximum speed of 5 Gbit/s, real-world implementations might not initially reach the theoretical maximum speed. Various motherboards, like the upcoming Gigabyte Aorus Z790 Master X, are already planning to integrate this technology, showing that the industry is getting ready for a Wi-Fi 7 world.

What makes Wi-Fi 7 especially interesting is its raw speed and underlying technology designed to improve efficiency and capacity. Features like Multi-User Multiple-Input Multiple-Output (MU-MIMO) and Orthogonal Frequency-Division Multiple Access (OFDMA), which were introduced in Wi-Fi 6 and 6E, are mandatory in Wi-Fi 7. These technologies aim to optimize the overall performance of wireless networks, making them more suitable for bandwidth-intensive tasks like AR and VR. While full certification for Wi-Fi 7 is not expected until 2024, with widespread adoption to follow, the technology looks poised to become a significant aspect of our wireless future.

Today Lenovo is announcing its top-of-the-line Lenovo Legion 9i (16", 8), the first 16-inch gaming laptop in Lenovo Legion's ecosystem—and in the world—with a self-contained liquid-cooling system, designed for gamers and creators with heavy graphic workflow requirements who need a full development studio in their bag. The Lenovo Legion 9i caps out the Lenovo Legion lineup that also includes the Lenovo Legion Pro series for competitive gamers and the Lenovo Legion Slim series for gamers who value agility, as well as Lenovo Legion displays and peripherals. Also announced today are the Lenovo Legion 16" Gaming Backpack GB700 and GB400, two backpack options that give gamers a choice between slim and lightweight agility or extra storage without sacrificing protection for their Lenovo Legion 9i (16", 8) or any other laptops and accessories.

"The introduction of the Lenovo Legion 9i (16", 8) marks the latest pinnacle of Lenovo Legion's gaming laptop innovation. The Lenovo Legion 9i is first laptop in the Lenovo Legion ecosystem with an integrated liquid-cooling system and hardware AI chip tuning. The forged carbon A-cover, which in addition to its 'unique-to-each-laptop aesthetics' means a lighter laptop for gamers and creators who demand nothing but the best." said Jun Ouyang, Lenovo's vice president and general manager of the Consumer Business Segment, Intelligent Devices Group. "We are constantly challenging ourselves to push the limits when designing gaming solutions. The Lenovo Legion 9i (16", 8) has set a new benchmark for us that we are excited to meet—and exceed—in the future."

Qualcomm Technologies, Inc. announced the all-new Snapdragon G Series handheld gaming portfolio, built to meet the unique performance and feature demands of dedicated gaming devices. The new Snapdragon G Series unlocks a range of options for playing the most sought-after games, offering boundless ways to play virtually any game, anywhere.

"Dedicated handheld gaming devices are the best way to experience mobile games. But gamers want to be able to play all their favorite games across devices and ecosystems, be it their console, PC, or on a cloud service" said Mithun Chandrasekhar, senior director of product management, Qualcomm Technologies, Inc. "The new generation of Snapdragon G Series powered devices will be the best place for gamers to play their favorite titles, offering them the ability to choose from the cloud, console, Android, or PC while on-the-go."

Broadcom Inc. today announced sample availability of its second generation of wireless connectivity chipset solutions for the Wi-Fi 7 ecosystem, spanning Wi-Fi routers, residential gateways, enterprise access points, and client devices. The new chips build on the ecosystem of products with Broadcom's first-generation Wi-Fi 7 chips while delivering additional functionality to a wider market.

The first chip, the BCM6765, is a highly-optimized residential access point chip that supports 320 MHz 2-stream Wi-Fi operation. This new platform system-on-chip (SoC) allows the productization of Wi-Fi 7 mass-market access points and smart repeater solutions which span the spectrum of cost, form factor, and performance. The second chip, the BCM47722, is an enterprise access point chip that also supports 320 MHz 2-stream operation along with dual IoT radios that support simultaneous operation for Bluetooth Low Energy (BLE), Zigbee, Thread, and Matter protocols. This SoC addresses the growing needs of Internet of things (IoT) applications in the enterprise Wi-Fi market. The third chip, the BCM4390, is a low-power Wi-Fi, Bluetooth, and 802.15.4 combo chip designed for use in mobile devices such as handsets and tablets. It supports 160 MHz 2-stream Wi-Fi operation, dual Bluetooth, and Zigbee, Thread, and Matter protocols to service a broad set of mobile markets.

ASUS Republic of Gamers (ROG) today announced the all-new ROG Phone 7 series of gaming smartphones at its For Those Who Dare virtual launch event. The ROG Phone 7 series includes the ROG Phone 7 and ROG Phone 7 Ultimate models and is the latest step in the high-performance evolution of the world's greatest gaming phone. This futuristically-styled phone—which sports a new two-tone design—combines the game-winning power of the flagship Snapdragon 8 Gen 2 Mobile Platform with the advanced GameCool 7 thermal system and special ROG tuning to deliver a truly breathtaking mobile gaming experience—and impressively low power consumption. The key to this power efficiency is the revolutionary new rapid-cycle vapor chamber design, which increases heat dissipation efficiency by up to 168%, allowing the ROG Phone 7 series to run games at full speed while maintaining low temperatures.

To make ROG Phone 7 a powerful and portable theater, we've increased the effective volume of the ROG Phone 7 series' speakers by 50% and tuned the system in cooperation with audio specialists Dirac. ROG Phone 7 series now delivers amazing 2.1-channel sound when the new AeroActive Cooler 7 accessory—which houses a powerful subwoofer—is attached.

Today, Lenovo announced the latest 8th generation of Lenovo Legion Slim laptops, allowing gamers to harness the freedom that the newest series has to offer. The Lenovo Legion Slim series is all about empowering players to crush their gaming goals while also pursuing their creative passions, and there are more options than ever among the new Lenovo Legion Slim 7i and 7 (16", 8), Lenovo Legion Slim 5i and 5 (16", 8), and—an all-new size for this year—the Lenovo Legion Slim 5 (14", 8), which elevates laptop power and portability to a whole new level. This newest generation of the series is also the first to sport the Lenovo Artificial Intelligence (LA) family of chips. These are onboard physical AI chips that power Lenovo AI Engine+, which dynamically adjusts the Lenovo Legion ColdFront 5.0 thermals to optimize cooling on the fly and maintain maximum output with minimal noise.

Lenovo Legion Slim series laptops are designed to meet the multi-faceted needs of gamers, with an SD slot, rapid charging battery technology Windows 11, three months of free Xbox Game Pass Ultimate, as well as access to Nahimic by SteelSeries 3D immersive audio, and Lenovo Vantage helping users get the most out of their machines. Offering peace of mind, Lenovo's Legion Ultimate Support service is available with round-the-clock tech support, guidance and assistance so gamers don't have to miss a beat, and with Legion Arena, users can create their ultimate gaming hub with all their titles accessible in one place rather than having to switch between apps. Additionally, gamers looking to expand their horizons—literally—can look forward to the new Lenovo Legion R45w-30 44.5" 32:9 ultrawide curved display and the new Lenovo Legion Y34wz-30 Gaming Monitor that delivers extreme clarity and vivid color with its 34-inch mini-LED backlit panel.

An entity calling themselves "TP-Link ASIC" recently announced a Wi-Fi 7 capable ASIC cryptocurrency miner with claims of hashing rates above even the mighty RTX 4090... In one specific ASIC friendly algorithm. If the concept of a router that mines crypto sounds strange, deranged, or downright questionable to you, you're not alone. The consumer market for crypto mining has waned heavily in the last handful of months due in no small part to Ethereum switching to Proof of Stake last September, which led to GPUs being ineffectual for mining the previously profitable coin. However, ASIC mining does remain prevalent across the sea of various algorithms and alt-coins that exist. One such alt-coin is Kadena, a smaller Proof of Work cryptocurrency that appears to flutter around the $1USD range. This is where "TP-Link ASIC" has placed their engineering efforts with the, "TP-Link NX31 31.2 THS Router Miner," which, as the name implies, offers 31.2 TH/s of Kadena hashing power at a cool $1,990 USD (previously $1,440).

If you've been around long enough to remember the Butterfly Labs fiasco and fallout, you're probably already groaning and holding your head in your hands. Buying ASICs from new and unproven vendors promising the moon is never a good idea. But TP-Link isn't an unproven company, they have a successful business and sell legitimate products. Surely this would be handled properly since this is a well established brand, right? Well, here's the twist; "TP-Link ASIC" is NOT TP-Link. When questioned about this new launch by Tom's Hardware a TP-Link representative responded that "TP-Link ASIC" has no affiliation with TP-Link, nor does their NX31 mining router.

MaxLinear, Inc., a leader in home gateway solutions that unlock multi-gig home connectivity, today announced that its highly-integrated AnyWAN home gateway SoC has been certified for XGS-PON and G-PON as part of the Broadband Forum BBF.247 Optical Network Unit (ONU) Certification Program. scalable quad-core CPU, packet routing accelerator for up to 30 million packets per second, and all required high-speed interfaces for home gateways and home routers. The platform supports important WAN access technologies required by telco service providers and cable MSOs, making it one of the most scalable home gateway solutions on the market. With its XFI and PCIe gen4 interfaces and the embedded 2.5GE PHYs, AnyWAN is an ideal SoC for the next generation of fixed-wireless-access gateways with 5G WAN and Wi-Fi 7.

AnyWAN SoC variants with embedded 10G PON MAC support most 10G PON standards, including XGS-PON, G-PON, and NG-PON2. The chips are well suited for next-gen Wi-Fi 7 multi-gig fiber home gateways units (HGU). "Our innovation and investment in bringing AnyWAN to market provides all service providers and cable MSOs with a cost-efficient, quicker time-to-market choice when transitioning to 10G PON networks," said Will Torgerson, Vice President and General Manager, Broadband Group for MaxLinear. "While G-PON is the fiber technology with the largest installed based today, many customers are looking to XGS-PON as a technology option."

Late last year, it was reported that Intel is skipping its upcoming "Meteor Lake" microarchitecture for the desktop platform, giving it a mobile-platform debut in late-2023, with "Arrow Lake" following on in 2024, which would address both platforms. In the interim, Intel was expected to release a "Raptor Lake Refresh" architecture for desktop in 2023. It turns out now, that both the "Raptor Lake Refresh" and "Meteor Lake" architectures are coming to desktop—we just don't know when.

Apparently, Intel will brazen it out against AMD with a maximum CPU core-count of just 6 performance cores and 16 efficiency cores possible for "Meteor Lake." It's just that both the P-cores and a E-cores get an IPC uplift with "Meteor Lake." The processor features up to six "Redwood Cove" P-cores with an IPC uplift over the current "Raptor Cove" cores; and introduce the new "Crestmont" E-cores. A lot will depend on the IPC uplift of the latter. Leaf_hobby, a reliable source with Intel leaks on social media, has some interesting details on the I/O capabilities of "Meteor Lake" on the desktop platform.

Qualcomm Technologies' 6th generation modem-to-antenna solution is the first ready to support 5G Advanced, the next phase of 5G. It introduces a new architecture, a new software suite and includes numerous world's first features to push the boundaries of connectivity including coverage, latency, power efficiency and mobility. Snapdragon X75 technologies and innovations empower OEMs to create next generation experiences across segments including smartphones, mobile broadband, automotive, compute, industrial IoT, fixed wireless access and 5G private networks.

Snapdragon X75 is the first Modem-RF System with a dedicated hardware tensor accelerator, Qualcomm 5G AI Processor Gen 2, enabling over 2.5 times better AI performance compared to Gen 1 and introduces Qualcomm 5G AI Suite Gen 2 with new AI-powered optimizations to achieve better speeds, coverage, mobility, link robustness and location accuracy. The Qualcomm 5G AI Suite features advanced AI-based capabilities including world's first sensor-assisted mmWave beam management and AI-enhanced GNSS Location Gen 2, which uniquely optimize Snapdragon X75 for superior 5G performance.

CommScope, a global leader in home networks, today announced its entry into the Wi-Fi 7 retail market with the launch of the SURFboard G54 DOCSIS 3.1 quad-band Wi-Fi 7 cable modem. The flagship SURFboard G54 provides significant performance enhancements, including the latest Wi-Fi 7 technology, and supports multi-gigabit Internet plans. The SURFboard G54 is designed to include other advanced features, including DOCSIS 3.1, quad-band Wi-Fi 7 (BE17880, or the total speed the system can support), a 10 Gbps Ethernet port, and four 1 Gbps LAN ports.

As the journey to the multi-gigabit network of the future continues, consumers can be ready to support next generation, higher speed internet plans with the SURFboard G54. Coupling the latest DOCSIS 3.1 technology with new Wi-Fi 7 capabilities, the SURFboard G54 provides multi-gigabit speeds (dependent upon service provider plan) throughout the home. In addition, a 10 Gbps Ethernet port ensures the home network can support additional Gigabit services directly to the Ethernet connection.

MediaTek, one of the first adopters of Wi-Fi 7 technology, will be demonstrating a full ecosystem of production-ready devices featuring the next generation of wireless connectivity for the first time at CES 2023. These products are the culmination of MediaTek's investment in Wi-Fi 7 technology, focusing on reliable and always-on connected experiences on a wide variety of devices in several product categories, including residential gateways, mesh routers, televisions, streaming devices, smartphones, tablets, laptops, and more.

As the most current and powerful Wi-Fi standard, Wi-Fi 7 utilizes record-breaking 320 MHz channel bandwidth and 4096-QAM modulation to greatly improve overall user experience. Multi-Link Operation (MLO) also enables the Wi-Fi connection to aggregate channel speeds and alleviate link interruption in congested environment for time-demanding applications.

During Snapdragon Summit 2022, Qualcomm Technologies, Inc. revealed the Snapdragon AR2 Gen 1 Platform, which delivers groundbreaking AR technology that will unlock a new generation of sleek, highly capable glasses. The Company built Snapdragon AR2 from the ground up to revolutionize the headworn glass form factor and usher in a new era of spatial computing experiences for the real-world/metaverse mix.

Purpose-built for AR: To help create the thinnest possible, high-performance AR glass, we have built a multi-chip distributed processing architecture combined with customized IP blocks. The main processor occupies a 40% smaller PCB area on glass and the overall platform delivers 2.5x better AI performance while consuming 50% less power to help achieve AR glasses that consume <1 W power. This enables rich AR experiences on glasses that can be comfortably worn for extended periods of time and meet the demands of both consumers and enterprise use cases.

During the Snapdragon Summit 2022, Qualcomm Technologies, Inc. introduced its latest premium mobile platform, Snapdragon 8 Gen 2. The Snapdragon 8 Gen 2 Mobile Platform will define a new standard for connected computing, intelligently engineered with groundbreaking AI across the board to enable extraordinary experiences. This new mobile platform will be adopted by global OEMs and brands including ASUS Republic of Gamers, HONOR, iQOO, Motorola, nubia, OnePlus, OPPO, REDMAGIC, Redmi, SHARP, Sony Corporation, vivo, Xiaomi, XINGJI/MEIZU, and ZTE, with the first commercial devices expected by the end of 2022.

"We are passionate about enabling people to do more, so we design Snapdragon with the user at the center. Snapdragon 8 Gen 2, will revolutionize the landscape of flagship smartphones in 2023," said Chris Patrick, senior vice president and general manager of mobile handsets, Qualcomm Technologies, Inc. "Snapdragon 8 Gen 2 delivers groundbreaking AI, unparalleled connectivity, and champion-level gameplay, enabling consumers to enhance every experience on their most trusted device."

MediaTek today launched the Dimensity 9200, its latest 5G chipset powering the next era of flagship smartphones. Boasting extreme performance and intelligent power efficiency, the new SoC brings immersive all-day gaming experiences, ultra-sharp image capturing and support for both mmWave 5G and sub-6 GHz connectivity to consumers around the globe.

"MediaTek's Dimensity 9200 combines ultimate performance with significant power savings, extending battery life and keeping smartphones cool," said JC Hsu, Corporate Vice President and General Manager of MediaTek's wireless communications business unit at MediaTek. "With notably brighter image capturing and improved gaming speeds, along with the latest display enhancements, the Dimensity 9200 will bring new possibilities for next-gen smartphones that come in a variety of stylish and foldable form factors."

Today, Intel Corporation and Broadcom Inc. showcased the industry's first cross-vendor Wi-Fi 7 demonstration, with over-the-air speeds greater than 5 gigabits per second. The trial used an Intel Core processor-based laptop with a Wi-Fi 7 solution connected to a Broadcom Wi-Fi 7 access point.

"We are proud to highlight how next-generation Wi-Fi 7 can make new mobile PC experiences possible. Industry collaboration is essential to ensure we deliver on the promises of this new wireless technology. We would like to thank our colleagues at Broadcom for their great technical cooperation, which helped enable this unprecedented, first-of-its-kind demonstration of ultra-high speed and ultra-low latency Wi-Fi 7," said Carlos Cordeiro, Intel Fellow and Wireless CTO, Client Computing Group, Intel.

Vijay Nagarajan, vice president, Wireless Connectivity Division, Broadcom, said, "Today's milestone sends a clear message: the ecosystem is ready and Wi-Fi 7 is here to deliver extraordinary capacity and blazing fast speeds to extend gigabit broadband. The reliable, low latency communication provided by Wi-Fi 7 is a key element of Broadcom's vision for connecting everything as the Internet evolves to its next iteration replete with immersive experiences. Industry collaboration is key to making this unprecedented connectivity a reality and we were delighted to work with Intel to achieve another industry first."

MediaTek today announced the Filogic 880 and Filogic 380 Wi-Fi 7 platform solutions for high-bandwidth applications in the operator, retail, enterprise and consumer electronics markets. This pair of chips will be among the first Wi-Fi 7 solutions to hit the market, allowing device makers to deliver cutting-edge products with the latest connectivity technology. Filogic 880 is a complete platform that combines a Wi-Fi 7 access point with a new advanced host processor solution to provide the industry's best router and gateway solution for operator, retail and enterprise markets. It offers a scalable architecture that can support up to penta-band 4x4 with a maximum speed of 36 Gbps. Filogic 380 is designed to bring Wi-Fi 7 connectivity to all client devices, including smartphone, tablet, TVs, notebooks, set-top boxes and OTT streaming devices. The chip's dual concurrent 2x2 capability will be optimized "out-of-the-box" for these devices as MediaTek also supplies the corresponding platform solutions. This helps to streamline the design process, maximize performance and accelerate time-to-market.

"Our wireless connectivity solutions are designed to deliver the fastest performance using the most advanced technologies, and represent MediaTek's commitment to drive Wi-Fi 7 adoption in a large number of new markets," said Alan Hsu, corporate vice president and general manager of the Intelligent Connectivity business at MediaTek. "With Filogic 880 and Filogic 380, our customers can deliver fast, reliable and always-on connected experiences to meet the industry's growing connectivity demands." MediaTek's Filogic 880 combines a Wi-Fi 7 access point with a powerful application processor and network processing unit (NPU) to support maximum Wi-Fi, Ethernet and packet processing performance. The chip offers a wide range of interfaces and peripherals, making it easy to customize designs for various end products and applications.

Qualcomm Technologies, Inc. today announced its Wi-Fi 7 capable Qualcomm Networking Pro Series Gen 3 family of platforms. Now sampling and available to global development partners, the Qualcomm Networking Pro Series, Gen3 is the world's highest performance Wi-Fi 7 network infrastructure platform portfolio commercially available. Building upon the multi-generation legacy of the Qualcomm Networking Pro Series platforms, the products combine Wi-Fi 7 features with Qualcomm Technologies' intelligent multi-channel management technologies to improve speeds, lower latency, and enhance network utilization for users of Wi-Fi 6/6E devices while offering game-changing throughput and incredibly low latency for the next generation of Wi-Fi 7 client devices.

"Qualcomm Technologies has enabled the era of 10 Gbps Wi-Fi with our first customer deliveries of the Wi-Fi 7 Networking Pro Series," said Nick Kucharewski, senior vice president and general manager, Wireless Infrastructure and Networking, Qualcomm Technologies, Inc. "Combining support for the latest Wi-Fi 7 innovations with our unique product architecture, the platform enables solutions ranging from whole-home mesh to connectivity networks for large public venues. With this product line, we anticipate a new class of customer systems for both today's applications and the emerging Wi-Fi 7 ecosystem."