Intel plans to go full tilt with gaming graphics, with its newly announced Arc line of graphics processors designed for high-performance gaming. The top Arc "Alchemist" part meets all requirements for DirectX 12 Ultimate logo, including real-time raytracing. The company, during the technology's reveal, earlier this week, also said that it's working on an AI-accelerated supersampling technology. The company is calling it XeSS (Xe SuperSampling). It likely went with Xe in the name, as it possibly plans to extend the technology to even its Xe LP-based iGPUs and the entry-level Iris Xe MAX discrete GPU.

Intel claims that XeSS cuts down 4K frame render-times by half. By all accounts, 1440p appears to be the target use case of the top Arc "Alchemist" SKU. XeSS would make 4K possible (i.e., display resolution set at 4K, rendering at a lower resolution, with AI-accelerated supersampling restoring detail). The company revealed that XeSS will use a neural network-based temporal upscaling technology that incorporates motion vectors. In the rendering pipeline, XeSS sits before most post-processing stages, similar to AMD FSR.

While AMD's FSR technology is purely shader based, the Intel algorithm can either use XMX hardware units (new in Intel Xe HPG), or DP4a instructions (available on nearly all modern AMD and NVIDIA GPUs). XMX stands for Xe Matrix Extensions and is basically Intel's version of NVIDIA's Tensor Cores, to speed up matrix math, which is used in many AI-related tasks. The Intel XeSS SDK will be available this month, in open source, using XMX hardware, the DP4a version will be available "later this year".

Durabook, the global rugged mobile solutions brand owned by Twinhead International Corporation, announced today the introduction of its dramatically upgraded Z14I fully-rugged laptop. The unit includes a slew of remarkable features, including an 11th Gen. Intel Core processor, latest Thunderbolt 4, NVMe PCIe SSD drive, 14" FHD 1,000 nits display with proprietary DynaVue sunlight-readable technology, fanless and hot-swappable battery design, MIL-STD-810H and MIL-STD-461G certifications, and ANSI/ISA 12.12.01-2000, CI/D2 classification. In addition, the newly upgraded Z14I delivers 1.6x faster CPU performance than its predecessor. When combined, its feature package makes the Durabook Z14I the world's toughest fully-rugged laptop.

"Our new advanced Z14I laptop goes above and beyond the standard requirements to elevate the user experience," stated Twinhead CEO Fred Kao. "This fully rugged laptop solution with its endless customization capability through its unique expansion box design fits perfectly in professional services and military/government applications such as mapping/dispatching, recording systems, CAD, assets management, and maintenance diagnostics. Additionally, as strong as they come, the unit is the best laptop in the market for outdoor usage."

Intel Corporation today revealed one of the most detailed process and packaging technology roadmaps the company has ever provided, showcasing a series of foundational innovations that will power products through 2025 and beyond. In addition to announcing RibbonFET, its first new transistor architecture in more than a decade, and PowerVia, an industry-first new backside power delivery method, the company highlighted its planned swift adoption of next-generation extreme ultraviolet lithography (EUV), referred to as High Numerical Aperture (High NA) EUV. Intel is positioned to receive the first High NA EUV production tool in the industry.

"Building on Intel's unquestioned leadership in advanced packaging, we are accelerating our innovation roadmap to ensure we are on a clear path to process performance leadership by 2025," Intel CEO Pat Gelsinger said during the global "Intel Accelerated" webcast. "We are leveraging our unparalleled pipeline of innovation to deliver technology advances from the transistor up to the system level. Until the periodic table is exhausted, we will be relentless in our pursuit of Moore's Law and our path to innovate with the magic of silicon."

On the sidelines of its 2021 International Supercomputing Conference announcements that mostly covered the HPC-relevant portions of the company's Xe scalar compute architecture, the company also put out a couple of nuggets on Xe HPG, the gaming-grade consumer graphics architecture by Intel, which is expected to power graphics cards capable of AAA gaming at high resolutions. Without mentioning dates, the company announced that Xe HPG will see the light of the day soon.

It's a long march for Intel to break into the gaming graphics card business, and Intel is calling this project "Odyssey." A select few (Intel employees, ISVs, hardware partners, etc.,), have access to greater information and merchandise, as they hold the "Odyssey Card." The company called for them to "redeem" this card for the goodies. "We are soon heading toward a milestone moment, the pending release of the Xe HPG microarchitecture from Intel. Some of you received an Odyssey card and were the first to engage with Intel on this journey. Now is the time to redeem this card, which is one in many steps we hope to formally take forward with you. We have a few required fields here to confirm you have received a card from us," stated Intel.

We have been receiving several leaks for Intel's upcoming DG2 GPUs with a 256 Execution Unit model recently appearing on Geekbench paired with a 14-core Alder Lake mobile CPU. The Alder Lake mobile processor featured an integrated Xe GPU with 96 Execution Units which were also benchmarked. The 256 Execution Unit graphics card tested is likely derived from the mid-range DG2-384 GPU. The 96 EU DG2 iGPU featured a maximum frequency of 1.2 GHz while the 256 EU variant increased that to 1.4 GHz. The DG2-256 scored an OpenCL score of 18,450 points in the Geekbench 5 benchmark which places it at GTX 1050 performance level. The DG2-96 integrated GPU scored 6,500 points which is comparable to a GTX 460. While these performance numbers are low it is important to keep in mind that these are just early results from a mid-range mobile offering and Intel is planning to release cards with 512 Execution Units which should compete with the RTX 3070 Ti and 6700 XT.

Intel CEO Pat Gelsinger announced the addition of two new technology leaders to its executive leadership team, as well as several changes to Intel business units. Current Intel executives Sandra Rivera and Raja Koduri will each take on new senior leadership roles, and technology industry veterans Nick McKeown and Greg Lavender will join the company.

"Since re-joining Intel, I have been impressed with the depth of talent and incredible innovation throughout the company, but we must move faster to fulfill our ambitions," said Gelsinger. "By putting Sandra, Raja, Nick and Greg - with their decades of technology expertise - at the forefront of some of our most essential work, we will sharpen our focus and execution, accelerate innovation, and unleash the deep well of talent across the company."

Intel's foray into the discrete GPU market is inching ever closer, and with that diminishing time to market, leaks are getting more common. Renowned leaker TUM_APISAK has shared some performance numbers for Intel's upcoming DG2 graphics card, part of the company's Xe HPG (High Performance Gaming) architecture. In the leak, he also confirmed that Intel is working on a cut-down version of their top offering (which features 4,096 shading units spread across 512 EUs) in the form of a new SKU that offers 448 EUs and 3584 shading units running at 1.8 GHz. That is the actual chip whose relative performance was shared.

According to TUM_APISAK, users should expect the Intel DG2 448 EU graphics card to offer performance that's around the NVIDIA RTX 3070 (5% lower performance for the Intel part) and AMD's RX 6700 XT (8% lower performance for the Intel part). As for the performance of the full-fat 512 EU chip, another leaker, Moore's Law is Dead, expects its performance to fall very slightly lower than the performance offered by NVIDIA's RTX 3080 and AMD's RX 6800/6800 XT. The 512-EU DG2 should also feature higher Boost clocks up to 2.2 GHz. Intel's launch of their Xe HPG graphics architecture is expected to occur before the end of the year, likely starting with the highest performance/highest margin parts, trickling down the product stack through the beginning of 2022. Intel's launch should help in alleviating the lack of available graphics cards, whilst simultaneously breaking a duopoly market.

Dynabook Americas, Inc., formerly the Toshiba PC Company, today announced the next-generation of its Tecra A Series laptops with the 14-inch Tecra A40-J and 15-inch Tecra A50-J. Dynabook completely redesigned these new professional grade laptops to address the needs of the modern, flexible worker while reducing the strain on IT managers. Reliable, secure, and easy to manage, this lightweight and stylish duo are the latest additions to Dynabook's well-established Tecra product line.

"The new modern designs of the Tecra A40 and A50 truly stand out from the crowd," said Philip Osako, vice president, marketing and engineering, Dynabook Americas, Inc. "These new laptops incorporate the power and performance of a professional-grade laptop with a premium style that looks great in any work environment."

Intel's upcoming Ponte Vecchio graphics card is set to be the company's most powerful processor ever designed, and the chip is indeed looking like an engineering marvel. From Intel's previous teasers, we have learned that Ponte Vecchio is built using 47 "magical tiles" or 47 dies which are responsible either for computing elements, Rambo Cache, Xe links, or something else. Today, we are getting a new piece of information coming from Igor's LAB, regarding the Ponte Vecchio and some of its design choices. For starters, the GPU will be a heterogeneous design that consists out of many different nodes. Some parts of the GPU will be manufactured on Intel's 10 nm SuperFin and 7 nm technologies, while others will use TSMC's 7 nm and 5 nm nodes. The smaller and more efficient nodes will probably be used for computing elements. Everything will be held together by Intel's EMIB and Foveros 3D packaging.

Next up, we have information that this massive Intel processor will be accountable for around 600 Watts of heat output, which is a lot to cool. That is why in the leaked renders, we see that Intel envisioned these processors to be liquid-cooled, which would make the cooling much easier and much more efficient compared to air cooling of such a high heat output. Another interesting thing is that the Ponte Vecchio is designed to fit inside OAM (OCP Accelerator Module) form factor, an alternative to the regular PCIe-based accelerators in data centers. OAM is used primarily by hyper scalers like Facebook, Amazon, Google, etc., so we imagine that Intel already knows its customers before the product even hits the market.

Today at Computex 2021, Intel announced two new additions to the lineup of 11th Gen Intel Core processors. These new processors, combined with Intel's co-engineering work with independent software vendors (ISVs) and original equipment manufacturers (OEMs), continue Intel's leadership in mobile compute—delivering the world's best processors for thin-and-light Windows-based laptops. Intel also introduced its first 5G product for the next generation of PC experiences, Intel 5G Solution 5000, following the previously announced collaboration with MediaTek and Fibocom.

"We've taken the world's best processor for thin-and-light Windows laptops and made the experience even better with the addition of our two new 11th Gen Intel Core processors with Intel Iris Xe graphics. In addition, we know real-world performance and connectivity are vital to our partners and the people who rely on PCs every day, so we're continuing that momentum with more platform capabilities and choice in the market with the launch of our first 5G product for PCs: the Intel 5G Solution 5000," said Chris Walker, Intel corporate vice president and general manager of Mobility Client Platforms.

Marvell today announced its new Bravera SC5 controller family, bringing unprecedented performance, best-in-class efficiency, and leading security features to address ever-expanding workloads in the cloud. The massive amount of data to be processed in cloud data centers is driving demand for faster and higher bandwidth storage in these environments. Marvell's Bravera SC5 SSD controllers address the critical requirements for scalable, containerized cloud storage infrastructure. By enabling the highest performing flash storage solutions, Marvell's controllers are poised to be the foundation for data centers that offer ultra-low latency, real-time applications while also providing cost-optimized, cloud-scale capacity.

As the industry's first SSD controllers to support PCIe 5.0 and NVMe 1.4b, Marvell's Bravera SC5 doubles the performance compared to PCIe 4.0 SSDs. This contributes to accelerated workloads and reduced latency, dramatically improving the user experience. In order to meet cloud service providers' stringent security requirements to ensure users' data is safe and protected, the controllers offer FIPS-compliant root of trust (RoT), AES 256-bit encryption and multi-key revocation. The new controllers are the first with a hardware-based Elastic SLA Enforcer to assure quality of service (QoS) and provide metering capabilities per customer to increase overall storage efficiency and utilization while lowering total cost of ownership (TCO).

MAINGEAR—an award-winning PC system integrator of custom gaming desktops, notebooks, and workstations—today launched the MAINGEAR ELEMENT Lite, a 15" ultra-premium notebook designed in collaboration with Intel. Featuring Intel Iris Xe Graphics and up to an 11th Gen Intel Core i7 processor, the MAINGEAR ELEMENT Lite pairs next-generation hardware with a sleek and minimal machined aluminium alloy chassis for maximum power, speed, and portability. The new MAINGEAR ELEMENT Lite is the perfect Windows laptop for work and play on the go.

Custom designed and engineered in collaboration with Intel, this uncompromising notebook PC comes equipped with up to an Intel Core i7-1165G7 Processor running at 2.8 GHz with a Max Turbo Frequency of 4.7 GHz on 4 cores / 8 threads. Integrated Intel Iris Xe Graphics make multimedia viewing, content creation, and even light gaming a breeze. ELEMENT Lite systems can be equipped with 16 GB of DDR4 memory and up to 2 TB of user-replaceable PCI-E Gen4 M.2 NVMe SSD storage. MAINGEAR optimized the ELEMENT Lite to pack exceptional performance and cooling into its frame without sacrificing on battery life or upgradeability. It weighs in at just 3.64 lbs (1.65 kg) and is 14.9 mm thin—making it the thinnest notebook that MAINGEAR has ever offered.

Intel's upcoming Xeon "Sapphire Rapids" processors which debut in the second half of 2021, will feature up to 80 "Golden Cove" CPU cores, and not the previously rumored "Willow Cove." This was clarified by an Intel developer in a Linux Kernel code e-mail chain. "Golden Cove" CPU cores are more advanced than the "Willow Cove" cores found in current-generation Intel products, such as the client "Tiger Lake" processors. Intel stated that "Golden Cove" introduces an IPC gain over "Willow Cove" (expressed as "ST perf"), increased AI inference performance from an updated GNI component, "network and 5G perf," which is possibly some form of network stack acceleration, and additional security features.

Over in the client segment, the 12th Gen Core "Alder Lake" processor debuts a client variant of "Golden Cove." The "Alder Lake-S" silicon features eight "Golden Cove" cores serving as the "big" performance cores, next to eight "little" low-power "Gracemont" cores. The client- and server implementations of "Golden Cove" could differ mainly in the ISA, with the client chip receiving a slightly skimmed AVX-512 and DLBoost instruction-sets, with only client-relevant instructions. The server variant, in addition being optimized for a high core-count multi-core topology; could feature a more substantial AVX-512 and DLBoost implementation relevant for HPC use-cases.

EliteMini TL50 is an ultra-compact and high-performance mini PC specially designed for home and office use. Equipped with Intel 11th generation CPU and Intel Iris Xe graphics. Intel Wi-Fi 6 & triple output, upgrade-friendly & windows 10 pro pre-installed.

TL50 comes with Intel Core i5-1135G7 processor (Tiger Lake), 4 cores/8 threads, backed up by Intel Iris Xe graphics, with 8M Cache, max turbo frequency up to 4.20 GHz. It is 20% faster than its predecessor with more cache memory, DDR4-3200 memory and PCIe 4.0 support. Not only ordinary work but also a little heavy games and video editing can be done comfortably.

The discrete GPU market has been a duopoly for quite some time, and when Intel announced that the company is rebooting plans for its discrete GPU lineup, another player was about to break that duopoly. Today, that has been changed forever and Intel has officially become the third manufacturer of discrete GPUs, as we can see on the online listing. On BestBuy, CyberPowerPC has listed "Gamer Xtreme Gaming Desktop" powered exclusively by Intel components. When it comes to the CPU choice, Intel's 6C/12T Core i5-11400F CPU model is present without iGPU. Now comes the interesting part. The GPU powering the system is Intel Iris Xe discrete graphics card, which is a DG1 GPU based on Xe-LP SKU.

This model features 80 EUs, resulting in 640 shading units. While this is not any gaming beast, casual 1080p gaming should be just fine on this configuration. The system is listed for 750 US Dollars, and it is sold out, as of the time of writing this. While the performance of this configuration may not be something monumental, it is an important step towards Intel's inclusion in the discrete GPU market. By using OEMs, the GPU will reach a very large market without any major problems. We are waiting to see the first reviews of the system, which will surely take a good look at the card and examine its performance.

Intel has been extensively teasing its Xe HP scalable compute architecture for some time now, and Igor's Lab has an exclusive look at GPU compute cards based on the Xe HP silicon. We know from older reports that Intel's Xe HP compute accelerator packages come in three essential variants—1 tile, 2 tiles, and 4 tiles. A "tile" here is an independent GPU accelerator die. Each of these tiles has 512 execution units, which convert to 4,096 programmable shaders. The single-tile card is a compact, half-height card capable of 1U and 2U chassis. According to Igor's Lab, it comes with 16 GB of HBM2E memory with 716 GB/s memory bandwidth, and the single tile has 384 out of 512 EUs enabled (3,072 shaders). The card also has a typical board power of just 150 W.

The Arctic Sound 2T card is an interesting contraption. A much larger 2-slot card of length easily above 28 cm, and a workstation spacer, the 2T card uses a 2-tile variant of the Xe HP package, but each of the two tiles only has 480 out of 512 EUs enabled. This works out to 7,680 shaders. The dual-chiplet MCM uses 32 GB of HBM2E memory (16 GB per tile), and a typical board power of 300 W. A single 4+4 pin EPS connector, capable of up to 225 W, is used to power the card.

A fresh rumor straight from the rumor mill paints AMD's next APU iterations as being updated to the latest and greatest architectures the company has to offer. The rumor comes from ExecutableFix via Twitter, a leaker who has a relatively proven track record on being right regarding upcoming hardware releases. This rumor can lay some credence to others, painting AMD's Ryzen 7000 series as being the first AMD APU-only release since they began their journey with the Zen architecture - it makes sense for the company to integrate their latest architectures in the mobile-geared Rembrandt first, working out some possible interaction quirks that might arise between the two architectures when deployed in the same package.

The leaker further affirms that the Rembrandt APUs will feature up to 12 RDNA2 CUs, which would amount to 768 stream processors on-chip - a marked increase from the current-generation 8 CUs based on the Vega architecture on their Ryzen 4000 mobile series. The leaker also discloses that AMD's Warhol seems to be MIA in recent AMD documentation and planning when it comes to the deployment of Zen3+, and that Rembrandt should be the one to carry that particular architecture refinement through to the 6 nm process. It would seem that AMD's Vega would "finally" see its demise, bringing about some much-needed performance improvements to counter Intel's investments in GPU performance with Xe.

A senior game developer relations engineer at Intel, Pete Brubaker, Tweeted late Wednesday that the company's DG2 discrete graphics card is "right around the corner," and that "it's about to get exciting." Brubaker's Tweet comes as the company is looking to recruit more engineers to work with its developer relations, the team that interfaces with game devs to optimize their engines and games for Intel's graphics architectures.

While the DG1, which was productized as the Iris Xe MAX graphics card, was essentially an iGPU-on-a-stick, the DG2 should spark a lot more interest. Based on a third-party foundry process, the DG2 is the first client graphics product based on the Xe HPG (high performance gaming) graphics architecture, and allegedly crams up to 512 execution units or 4,096 unified shaders—a 4.3x gain over the Iris Xe MAX. It's also rumored to ship with up to 16 GB of GDDR6 memory across a 256-bit wide memory bus. Whether it features DirectX 12 Ultimate features or not, remains to be seen, but it's becoming clear that Intel wants a crack at the high-volume e-sports market, with a product that's fast enough for competitive e-sports gaming, and capable of AAA.

IBASE Technology Inc. (TPEx: 8050), IBASE, a leading provider of industrial motherboards and embedded systems, launches its latest 3.5" SBC IB953 powered by 11th Gen Intel Core processors (codenamed Tiger Lake). Measuring 146 x 102 mm in a compact footprint, the single board computer offers impressive I/O and computing performance, making it an ideal platform for a broad range of demanding applications in factory automation, machine vision, healthcare, as well as retail environments.

The IB953 features a 5G compatible M.2 3052 socket and the latest 11th Gen. Intel Core and Celeron processors built on 10 nm SuperFin process, delivering up to 25% faster performance and greater AI acceleration. With the Intel Core i7-1185G7 (IBASE model IB953AF-I7) comes the new Iris Xe (Xe-LP) graphics architecture supporting 96 EUs (Execution Units) which equals 768 cores and runs at 1.35 GHz, an increase of 250 MHz over the previous 11-gen graphics to provide up to twice the performance and improved power efficiency. The graphics engine's hardware acceleration can drive up to four simultaneous 4K HDR displays (via 2x DisplayPort + eDP and LVDS).

Intel has just launched its Ice Lake-SP lineup of Xeon Scalable processors, featuring the new Sunny Cove CPU core design. Built on the 10 nm node, these processors represent Intel's first 10 nm shipping product designed for enterprise. However, there is another 10 nm product going to be released for enterprise users. Intel is already preparing the Sapphire Rapids generation of Xeon processors and today we get to see more details about it. Thanks to the anonymous tip that VideoCardz received, we have a bit more details like core count, memory configurations, and connectivity options. And Sapphire Rapids is shaping up to be a very competitive platform. Do note that the slide is a bit older, however, it contains useful information.

The lineup will top at 56 cores with 112 threads, where this processor will carry a TDP of 350 Watts, notably higher than its predecessors. Perhaps one of the most interesting notes from the slide is the department of memory. The new platform will make a debut of DDR5 standard and bring higher capacities with higher speeds. Along with the new protocol, the chiplet design of Sapphire Rapids will bring HBM2E memory to CPUs, with up to 64 GBs of it per socket/processor. The PCIe 5.0 standard will also be present with 80 lanes, accompanying four Intel UPI 2.0 links. Intel is also supposed to extend the x86_64 configuration here with AMX/TMUL extensions for better INT8 and BFloat16 processing.

We have recently received pictures of any early engineering sample of Intel's upcoming DG2 GPU from YouTuber Moore's Law is Dead. The card features 512 Execution Units and will be the flagship model for Intel's upcoming Xe-HPG lineup reportedly targeting performance between the RTX 3070 and RTX 3080. The final product is rumored to feature a base clock of 2.2 GHz along with 16 GB GDDR6 memory and a 256-bit bus. The sample has a TDP of 275 W with 8 + 6 pin power connectors up from original targets of 225 W - 250 W.

The report also notes that Intel is still deciding between three cooler designs with the finished card potentially featuring a white shroud. Intel also appears to be working on a NVIDIA DLSS/AMD FidelityFX Super Resolution competitor codenamed XeSS which confirms support for hardware-accelerated raytracing and resolution upscaling tech. The card is unlikely to launch until Q4 2021 with wider availability in 2022, lower end 128 EU, and 256 EU cards will follow shortly afterward. The full report can be viewed below.

Intel today launched its most advanced, highest performance data center platform optimized to power the industry's broadest range of workloads—from the cloud to the network to the intelligent edge. New 3rd Gen Intel Xeon Scalable processors (code-named "Ice Lake") are the foundation of Intel's data center platform, enabling customers to capitalize on some of the most significant business opportunities today by leveraging the power of AI.

New 3rd Gen Intel Xeon Scalable processors deliver a significant performance increase compared with the prior generation, with an average 46% improvement on popular data center workloads. The processors also add new and enhanced platform capabilities including Intel SGX for built-in security, and Intel Crypto Acceleration and Intel DL Boost for AI acceleration. These new capabilities, combined with Intel's broad portfolio of Intel Select Solutions and Intel Market Ready Solutions, enable customers to accelerate deployments across cloud, AI, enterprise, HPC, networking, security and edge applications.

MSI first Summit laptops have been well-acclaimed by business users. Now the new members are introduced! Surrounded by the captivating golden ratio spiral special effect, MSI grandly unveiled the "MSIology: Determined to Succeed 2021" virtual event. Exemplifying the perfection of the golden ratio, MSI launched the Summit series, including the honorees of "CES Innovation Awards" MSI Summit E16 Flip and MSI Pen, "Best of the CES 2021" winner Summit E13 Flip Evo, and the MSI USB-C Docking Station Gen 2. During the virtual event, MSI showcased the versatile work styles and displayed how the MSI Summit series can unleash users' potential to boost business and productivity.

"As the famous author Arthur C. Clarke once said, any sufficiently advanced technology is equivalent to magic. Today, we are here to witness the magic of the new MSI Summit.", Iris Chuang, Product Management Director of MSI Notebook, proudly announced in the opening of the new product launch. A symbol of aesthetics, a giant golden ratio spiral outlined the spirit of MSIology, which is to design impeccable laptops for perfectionists who are determined to succeed.

XPG, a fast growing provider of systems, components, and peripherals for Gamers, E-sports Pros, and Tech Enthusiasts,is pleased to announce a new Intel collaboration for a 15.6"performance EVO certified ultrabook with thin and light form factor, the XPG XENIA Xe.

With a sleek and modem design, XPG XENIA Xe is built with a premium CNC anodized aluminium chassis with an overall thickness of only 14.9 mm (0.58 in) and weight of 1.65 kg (3.6 lbs). The ultrabook sports an Intel 11th Gen Core i5-1135G7 or i7-1165G7 processor, Intel Iris Xe graphics, a low power, high brightness 1080P Full HD IPS 15.6" display with capacitive touch, as well as XPG's very own PCIe Gen 4 high speed M.2 solid state drive (SSD).

The 11th Gen Intel Core S-series desktop processors (code-named "Rocket Lake-S") launched worldwide today, led by the flagship Intel Core i9-11900K. Reaching speeds of up to 5.3 GHz with Intel Thermal Velocity Boost, the Intel Core i9-11900K delivers even more performance to gamers and PC enthusiasts.

Engineered on the new Cypress Cove architecture, 11th Gen Intel Core S-series desktop processors are designed to transform hardware and software efficiency and increase raw gaming performance. The new architecture brings up to 19% gen-over-gen instructions per cycle (IPC) improvement for the highest frequency cores and adds Intel UHD graphics featuring the Intel Xe graphics architecture for rich media and intelligent graphics capabilities. That matters because games and most applications continue to depend on high-frequency cores to drive high frame rates and low latency. Designed to Game: With its new 11th Gen desktop processors, Intel continues to push desktop gaming performance to the limits and deliver the most amazing immersive experiences for players everywhere.Read the TechPowerUp Reviews of the Core i9-11900K and Core i5-11600K.