AMD on Tuesday released its flagship FPGA series, and possibly its most important product launch after the company's Xilinx acquisition, the Versal Premium Series Gen 2 SoC. It's hard to call this an FPGA, much in the same way as it's hard to call a modern processor "a CPU," there are many integrated devices, platform interfaces, and application-specific accelerators, and much in the same way, the Versal Premium Series Gen 2 is marketed as an "adaptive SoC," rather than a really powerful FPGA. Speaking of I/O, this is AMD's first product to implement PCI-Express Gen 6 and CXL 3.1.

There's no host platform that currently support these standards—neither EPYC "Turin" nor Xeon 6 "Granite Rapids," but it goes to show that the chip is future-ready and can put the new I/O standards to use. The chip is designed to be implemented as a standalone SoC, and so it supports both DDR5 RDIMMs and LPDDR5X, giving end-users the flexibility to go with the two vastly different memory standards depending on what their application is. These capabilities make the Versal Premium Series Gen 2 well-suited for demanding applications in sectors like data centers, communications, test and measurement, aerospace, and defense, where high-speed data processing is critical.

AMD today announced that AMD President Victor Peng is retiring effective August 30, 2024. He will continue to serve on the AMD executive team in an advisory role and support the transition until his retirement date. "Victor re-joined AMD in 2022 following the acquisition of Xilinx and played an important role successfully integrating and scaling our embedded business and leading our cross-company AI strategy," said AMD Chair and CEO Dr. Lisa Su. "Under his leadership, AMD became the industry's #1 provider of FPGA and adaptive computing solutions. On behalf of the AMD Board, executive leadership team and the thousands of employees who have worked with him, I want to thank Victor for his outstanding leadership and wish him the best in his retirement."

Peng retires with over 40 years of experience defining and delivering leadership technologies across FPGAs, SoCs, GPUs and high-performance CPUs. He has served as president at AMD since February 2022 when he rejoined the company after the acquisition of Xilinx, where he spent 14 years, most recently serving as president, CEO and member of the board of directors.

Intel Corporation today outlined a new financial reporting structure that is aligned with the company's previously announced foundry operating model for 2024 and beyond. This new structure is designed to drive increased cost discipline and higher returns by providing greater transparency, accountability and incentives across the business. To support the new structure, Intel provided recast operating segment financial results for the years 2023, 2022 and 2021. The company also shared a targeted path toward long-term growth and profitability of Intel Foundry, as well as clear goals for driving financial performance improvement and shareholder value creation.

"Intel's differentiated position as both a world-class semiconductor manufacturer and a fabless technology leader creates significant opportunities to drive long-term sustainable growth across these two complementary businesses," said Pat Gelsinger, Intel CEO. "Implementing this new model marks a key achievement in our IDM 2.0 transformation as we hone our execution engine, stand up the industry's first and only systems foundry with geographically diverse leading-edge manufacturing capacity, and advance our mission to bring AI Everywhere."

AMD today announced the AMD Spartan UltraScale+ FPGA family, the newest addition to the extensive portfolio of AMD Cost-Optimized FPGAs and adaptive SoCs. Delivering cost and power-efficient performance for a wide range of I/O-intensive applications at the edge, Spartan UltraScale+ devices offer the industry's highest I/O to logic cell ratio in FPGAs built in 28 nm and lower process technology, deliver up to 30 percent lower total power consumption versus the previous generation, and contain the most robust set of security features in the AMD Cost-Optimized Portfolio.

"For over 25 years the Spartan FPGA family has helped power some of humanity's finest achievements, from lifesaving automated defibrillators to the CERN particle accelerator advancing the boundaries of human knowledge," said Kirk Saban, corporate vice president, Adaptive and Embedded Computing Group, AMD. "Building on proven 16 nm technology, the Spartan UltraScale+ family's enhanced security and features, common design tools, and long product lifecycles further strengthen our market-leading FPGA portfolio and underscore our commitment to delivering cost-optimized products for customers."

AMD has quietly issued a product discontinuation notice—their PDF document is dated January 1 2024—for a whole bunch of Xilinx Complex Programmable Logic Device (CLPD) and lower-end FPGA models. Team Red's opening statement on the matter reads: "AMD will be discontinuing XC9500XL, CoolRunner XPLA 3, CoolRunner II, Spartan II, and Spartan 3, 3A, 3AN, 3E, 3ADSP Commercial/ Industrial "XC" and Automotive "XA" Product Families due to declining run-rate and supplier sustainability reasons." The American multinational semiconductor inherited a large back catalog of programmable logic products once their acquisition of Xilinx was completed back in 2022.

Industry analysts believed that this takeover was mainly motivated by a desire to expand into FPGA territories, although Team Red indicated that it would carry on producing and supporting Xilinx's older CLPD products—for example, the Spartan 3 family debuted back in 2011, while a couple of the CoolRunner II parts on the list are of 2002 vintage. AMD's discontinuation notice provides details of Last Time Buy (LTB) final orders—the cut-off date for soon-to-be-axed devices appears to be June 29 2024.

Today, AMD announced it will showcase automotive innovation at CES 2024 and expand its portfolio with the introduction of two new devices, the Versal AI Edge XA adaptive SoC and Ryzen Embedded V2000A Series processor. The devices underscore AMD automotive technology leadership and are designed to serve key automotive focus segments including infotainment, advanced driver safety and autonomous driving. Working alongside a growing automotive partner ecosystem, AMD will demonstrate at CES 2024 the broad range of capabilities and applications for these new devices in automotive solutions available today and in the future.

Versal AI Edge XA adaptive SoCs add an advanced AI Engine, enabling the devices to be further optimized for numerous next-generation advanced automotive systems and applications including: forward cameras, in-cabin monitoring, LiDAR, 4D radar, surround-view, automated parking and autonomous driving. Versal AI Edge XA adaptive SoCs are also the first AMD 7 nm device to be auto-qualified, bringing hardened IP and added security to automotive applications where safety is paramount.

Introducing the Versal HBM Series VHK158 Evaluation Kit. This features the Versal HBM series VH1582 device, which integrates multi-Tbps High Bandwidth Memory (HBM), hardened connectivity IP, and adaptive compute in a single device, eliminating the bottlenecks between memory, I/O, and compute while delivering up to 6 times more memory bandwidth.

The VHK158 evaluation kit is an evaluation platform for the Versal HBM series VH1582 device designed to keep up with the higher memory needs of compute intensive, memory bound applications, providing adaptable acceleration for data center, wired networking, test & measurement, and aerospace & defense applications. The VHK158 board's primary focus is to enable demonstration and evaluation of the VH1582 silicon and support customer application development

AMD today announced the AMD Versal Premium VP1902 adaptive system-on-chip (SoC), the world's largest adaptive SoC. The VP1902 adaptive SoC is an emulation-class, chiplet-based device designed to streamline the verification of increasingly complex semiconductor designs. Offering 2X the capacity over the prior generation, designers can confidently innovate and validate application-specific integrated circuits (ASICs) and SoC designs to help bring next generation technologies to market faster.

AI workloads are driving increased complexity in chipmaking, requiring next-generation solutions to develop the chips of tomorrow. FPGA-based emulation and prototyping provides the highest level of performance, allowing faster silicon verification and enabling developers to shift left in the design cycle and begin software development well before silicon tape-out. AMD, through Xilinx, brings over 17 years of leadership and six generations of the industry's highest capacity emulation devices, which have nearly doubled in capacity each generation.

AMD today announced plans for continued growth in Ireland through an investment of up to $135 million over four years. The investment is intended to fund several strategic R&D projects through the addition of up to 290 highly skilled engineering and research positions, as well as a broad range of additional support roles. The development is being formally announced in Dublin today by Minister for Enterprise, Trade and Employment, Simon Coveney TD, and Ruth Cotter, senior vice president, Marketing, Communications and Human Resources at AMD. The new investment is supported by the Irish government through IDA Ireland.

"I warmly welcome the ambitious plans of AMD to expand their advanced R&D and engineering operations in Ireland. This significant investment will not only bolster our thriving technology sector but also create long-term career opportunities for both highly experienced professionals and new graduates from engineering disciplines. The company's plans to add up to 290 new positions and its funding of strategically important R&D projects demonstrate its confidence in Ireland's supportive enterprise environment and infrastructure. The Irish government, through IDA Ireland, is delighted to support this expansion, further solidifying our commitment to nurturing a vibrant ecosystem for research, development, and engineering," said Simon Coveney TD, Minister for Enterprise, Trade and Employment.

AMD today announced its Ryzen PRO 7040 line of processors for the all-important commercial notebook segment. A commercial notebook is a class of notebook that are purchased in large quantities by businesses or government organizations, to be handed out to their employees. The key distinction from consumer notebooks is their in-built security and remote-management features that let the organization remotely handle user credentials, securely store company data, and remotely deploy software updates. Most importantly, the organization maintains ownership over the device and can remotely de-activate it at whim. This is a particularly important market segment for both AMD and Intel (which sells 13th Gen Core vPro processors). AMD's launch today includes Ryzen PRO 7040 series mobile processors for both the 15 W to 28 W ultraportable, and 35 W to 55 W thin-and-light (mainstream) commercial notebook form-factors.

At the heart of the Ryzen PRO 7040 series processors is the 4 nm "Phoenix" silicon, which combines the "Zen 4" microarchitecture for the CPU, with RDNA3 graphics architecture for the iGPU, and introduces the Ryzen AI on-die accelerator based on the Xilinx-designed XDNA architecture, to the commercial notebook segment. The silicon physically features an 8-core/16-thread "Zen 4" CPU, with several processor models boosting to the 5.00 GHz-mark. Each core has 1 MB of dedicated L2 cache, and the eight cores share a 16 MB L3 cache. The iGPU meets full DirectX 12 Ultimate logo requirements, and features 12 RDNA3 compute units, which work out to 768 dual issue-rate stream processors, 24 AI Accelerators (intrinsic to RDNA3 and not related to Ryzen AI); and 12 Ray Accelerators, besides 48 TMUs and industry-leading 32 ROPs. AMD is backing the iGPU on these processors with AMD Software PRO (the same class of drivers as Radeon PRO GPUs), which come with superior support from AMD, and special packages for remote deployment by organizations.

Edge sensors, such as LiDAR, radar and 3D surround-view camera systems, are becoming more prevalent in the automotive market, especially with the growing adoption in autonomous driving. As more sensors are needed for autonomy, there are increasing needs for faster signal processing, reduced device costs and smaller form factors. Functional safety is also critical for many of these autonomous applications.

To address these market needs, we're introducing two additions to our AMD Automotive XA Artix UltraScale+ family: the XA AU10P and XA AU15P cost-optimized processors, which are automotive-qualified and optimized for use in advanced driver-assistance systems (ADAS) sensor applications. The Artix UltraScale+ devices extend the AMD portfolio of automotive-grade, functional-safety proven and highly scalable FPGA and adaptive SoCs, joining the automotive-grade Spartan 7, Zynq 7000 and Zynq UltraScale+ product families.

The global economy has faced increased inflation risks and downstream inventory corrections in 2H22, which have affected IC design houses faster than wafer foundries, as they are far more sensitive and responsive to market reversals. TrendForce reports that adverse factors such as weak overall consumption, restrictions from China, and the slowdown of corporate IT spending and CSP demand have impacted the revenue performance of the world's top 10 IC design houses in 4Q22, leading to a QoQ decline of 9.2%, or approximately US$33.96 billion.

TrendForce predicts that the revenue of these top 10 companies keep declining—though with a slight convergence—into 1Q23, owing to ongoing inventory corrections across the entire supply chain as well as Q1 being the traditional off-season for consumer demand. Demand will continue to be weak despite new product launches and inventory replenishment in the supply chain.

AMD today announced the AMD Alveo MA35D media accelerator featuring two 5 nm, ASIC-based video processing units (VPUs) supporting the AV1 compression standard and purpose-built to power a new era of live interactive streaming services at scale. With over 70% of the global video market being dominated by live content, a new class of low-latency, high-volume interactive streaming applications are emerging such as watch parties, live shopping, online auctions, and social streaming.

The Alveo MA35D media accelerator delivers the high channel density, with up to 32x 1080p60 streams per card, power efficiency and ultra-low-latency performance critical to reducing the skyrocketing infrastructure costs now required for scaling such compute intensive content delivery. Compared to the previous generation Alveo U30 media accelerator, the Alveo MA35D delivers up to 4x higher channel density, 4x max lower latency in 4K and 1.8x greater compression efficiency to achieve the same VMAF score—a common video quality metric.

AMD today announced the appointment of five technical leaders to the role of AMD Corporate Fellow. These appointments recognize each leader's significant impact on semiconductor innovation across various areas, from graphics architecture to advanced packaging. "David, Nathan, Suresh, Ben and Ralph - whose engineering contributions have already left an indelible mark on our industry - represent the best of our innovation culture," said Mark Papermaster, chief technology officer and executive vice president of Technology and Engineering at AMD. "Their appointments to Corporate Fellow will enable AMD to innovate in new dimensions as we work to deliver the most significant breakthroughs in high-performance computing in the decade ahead."

Appointment to AMD Corporate Fellow is an honor bestowed on the most accomplished AMD innovators. AMD Corporate Fellows are appointed after a rigorous review process that assesses not only specific technical contributions to the company, but also involvement in the industry, mentoring of others and improving the long-term strategic position of the company. Currently, only 13 engineers at AMD hold the title of Corporate Fellow.

AMD announced that its adaptive computing technology is powering leading mobility supplier DENSO Corporation's next-generation LiDAR platform. The new platform will enable over 20X1 improvement in resolution with extremely low latency for increased precision in detecting pedestrians, vehicles, free space and more. The DENSO LiDAR platform, targeted to begin shipping in 2025, will leverage the AMD Xilinx Automotive (XA) Zynq UltraScale+ adaptive SoC and its functional safety suite of developer tools to enable ISO 26262 ASIL-B certification.

DENSO is using the AMD XA Zynq UltraScale+ multi-processor system-on-a-chip (MPSoC) platform in its Single-Photon Avalanche Diode (SPAD) LiDAR system, which generates the highest point-cloud density level of any LiDAR system on the market today. Point-cloud density describes the number of points within a given area and is analogous to image resolution, where richer data ensures that crucial decision-making details are captured.

AMD today launched two distinct kinds of mobile processors, the Ryzen 7045 "Dragon Range" serves the 45 W H- and HX-segments of performance and enthusiast notebooks with CPU core counts of up to 16-core/32-thread; while the U-segment, P-segment, and a portion of the H-segment (ranges of 15 W, 28 W, and 35 W), will be led by the Ryzen 7040 "Phoenix Point." Unlike the "Dragon Range" MCM, "Phoenix Point" is a monolithic silicon built entirely on the TSMC 4 nm EUV foundry node, and introduces a wealth of process-level and system-level power-management features.

AMD "Phoenix Point" combines an 8-core/16-thread CPU based on the "Zen 4" microarchitecture, with a powerful iGPU based on the latest RDNA3 graphics architecture, and a feature-packed AI acceleration engine based on the XDNA architecture AMD built after the Xilinx acquisition. The CPU component is a fully-fledged "Zen 4" CCX, with 8 CPU cores featuring 1 MB of dedicated L2 cache per-core, and sharing a large 32 MB L3 cache. This is an increase from the previous generation "Rembrandt" and "Cezanne" dies that had a reduced 16 MB L3 shared among the eight "Zen 3" or "Zen 3+" CPU cores.

Xilinx Field Programmable Gate Arrays (FPGAs), now part of AMD, are always in demand in the semiconductor industry. Today, AMD has shared a letter to Xilinx customers that the selected FPGA device series will receive an 8-25% price increase. Citing AMD's investment into the supply chain, along with increased prices from the suppliers, Xilinx FPGAs will get more expensive. From January 9, 2023, the cost of the Spartan 6 series will increase by 25%, the price of the Versal series will not increase, and all other Xilinx products will increase by 8%. Interestingly, the older series manufactured on 40-28 nm nodes will increase while the latest Versal series doesn't experience any change.

Regarding lead times, the 16 nm UltraScale+ series, 20 nm UltraScale series, and 28 nm 7 series all take 20 weeks from order to delivery, which will remain until the third quarter of 2023. You can read the entire document below.

Innodisk, a leading global provider of industrial-grade flash storage, DRAM memory and embedded peripherals, has announced its latest step into the AI market, with the launch of EXMU-X261, an FPGA Machine Vision Platform. Powered by AMD's Xilinx Kria K26 SOM, which was designed to enable smart city and smart factory applications, Innodisk's FPGA Machine Vision Platform is set to lead the way for industrial system integrators looking to develop machine vision applications.

Automated defect inspection, a key machine vision application, is an essential technology in modern manufacturing. Automated visual inspection guarantees that the product works as expected and meets specifications. In these cases, it is vital that a fast and highly accurate inspection system is used. Without AI, operators must manually inspect each product, taking an average of three seconds per item. Now, with the help of AI solutions such as Innodisk's FPGA Machine Vision Platform, product inspection in factories can be automated, and the end result is not only faster and cheaper, but can be completely free of human error.

According to the latest TrendForce statistics, revenue of the top ten global IC design houses reached US$39.56 billion in 2Q22, growing 32% YoY. Growth was primarily driven by demand for data centers, networking, IoT, and high-end product portfolios. AMD achieved synergy through mergers and acquisitions. In addition to climbing to third place, the company also posted the highest annual revenue growth rate in 2Q22 at 70%.

Qualcomm continues in the No. 1 position worldwide, exhibiting growth in the mobile phone, RF front-end, automotive, and IoT sectors. Sales of mid/low-end mobile phone APs were weak but demand for high-end mobile phone APs was relatively stable. Company revenue reached US$9.38 billion, or 45% growth YoY. NVIDIA benefitted from expanded application of GPUs in data centers to expand this product category's revenue share past the 50% mark to 53.5%, making up for the 13% YoY slump in its game application business, bringing total revenue to US$7.09 billion, though annual growth rate slowed to 21%. AMD reorganized its business after the addition of Xilinx and Pensando. The company's embedded division revenue increased by 2,228% YoY. In addition, its data center department also made a considerable contribution. AMD posted revenue of US$6.55 billion, achieving 70% growth YoY, highest amongst the top ten. Broadcom's sales performance in semiconductor solutions remained solid and demand for cloud services, data centers, and networking is quite strong. The company's purchase order backlog is still increasing with 2Q22 revenue reaching US$6.49 billion, an annual growth rate of 31%.

Samsung Electronics Co., Ltd., the world leader in advanced memory technology, today announced that it has successfully developed a second generation of its pioneering SmartSSD. The new proprietary computational storage incorporates data processing functionality within a high-performance SSD. Unlike existing SSDs, Samsung's SmartSSD can process data directly, thereby minimizing data transfers between the CPU, GPU and RAM. This technology can avoid the bottlenecks that often occur when moving data between storage devices and CPUs, resulting in markedly improved system performance and much higher energy efficiency.

The SmartSSD is playing an increasingly important role, especially with the growth of next-generation technologies such as AI, machine learning and 5G/6G, which require large amounts of data processing. Leveraging software and intellectual property (IP) developed by customers, along with in-built Arm cores, Samsung's second-generation SmartSSD enables much more efficient data processing. Compared to conventional data center solid-state drives, processing time for scan-heavy database queries can be slashed by over 50%, energy consumption by up to 70% and CPU utilization by up to 97%.

AMD in its 2022 Financial Analyst Day presentation announced the codename for the second generation of Ryzen desktop processors for Socket AM5, which is "Granite Ridge." A successor to the Ryzen 7000 "Raphael," the next-generation "Granite Ridge" processor will incorporate the "Zen 5" CPU microarchitecture, with its CPU complex dies (CCDs) built on the 4 nm silicon fabrication node. "Zen 5" will feature several core-level designs as detailed in our older article, including a redesigned front-end with greater parallelism, which should indicate a much large execution stage. The architecture could also incorporate AI/ML performance enhancements as AMD taps into Xilinx IP to add more fixed-function hardware backing the AI/ML capabilities of its processors.

The "Zen 5" microarchitecture makes its client debut with Ryzen "Granite Ridge," and server debut with EPYC "Turin." It's being speculated that AMD could give "Turin" a round of CPU core-count increases, while retaining the same SP5 infrastructure; which means we could see either smaller CCDs, or higher core-count per CCD with "Zen 5." Much like "Raphael," the next-gen "Granite Ridge" will be a series of high core-count desktop processors that will feature a functional iGPU that's good enough for desktop/productivity, though not gaming. AMD confirmed that it doesn't see "Raphael" as an APU, and that its definition of an "APU" is a processor with a large iGPU that's capable of gaming. The company's next such APU will be "Phoenix Point."

According to the latest TrendForce statistics, the top ten IC designers worldwide posted a combined revenue of US$39.43 billion in 1Q22, or 44% growth YoY. Qualcomm, NVIDIA, Broadcom ranked in the top three. After the acquisition of Xilinx, AMD surpassed MediaTek in the fourth position. In addition, according to TrendForce tracking of IC design industry trends, revenue generated by Will Semiconductor and Cirrus Logic was enough to be included in the top ten for the first time.

Benefiting from growth performance in handsets and RF front-end divisions in addition to its IoT and automotive divisions in 1Q22, Qualcomm's quarterly revenue reached US$9.55 billion, or 52% growth YoY, ranking number one in the world. The expanded application of GPUs in data centers boosted this portion of NVIDIA's revenue to 45.4%, surpassing the 45% accounted for by its gaming business, combining for a total revenue of US$7.9 billion, or 53% growth YoY. Broadcom's revenue from semiconductor solutions is substantial, including network chips, broadband communication chips, and storage and bridging chips. Its business has maintained stable sales performance, with revenue reaching US$6.11 billion, or 26% growth YoY. After the addition of Xilinx, AMD's revenue reached US$5.89 billion, or 71% growth YoY. However, even excluding Xilinx, due to strong sales in its enterprise, embedded and semi-customized divisions, AMD's own business revenue still hit an all-time high of US$5.33 billion.

GIGABYTE Technology, (TWSE: 2376), an industry leader in high-performance servers and workstations, today announced its participation in Computex, which runs from May 24-27. GIGABYTE's booth will showcase the latest in accelerated computing, liquid & immersion cooling, and edge solutions, as well as provide an opportunity for attendees to get a glimpse at next gen enterprise hardware. GIGABYTE also announced plans to support the NVIDIA Grace CPU Superchip and NVIDIA Grace Hopper Superchip. With the new hardware innovations, GIGABYTE is charting a path to meet the requirements for the foreseeable future in data centers, accordingly many of those important technological modernizations that will be on show at Computex, as well as behind the NDA curtain.

Computex is unquestionably the world's largest computer expo, which has been held annually in Taiwan for over 20 years. Computex has continued to generate great interest and anticipation from the international community. The Nangang Exhibition Center will once again have a strong presence of manufacturers and component buyers encompassing the consumer PC market to enterprise.

Today AMD announced the Kria KR260 Robotics Starter Kit, the latest addition to the Kria portfolio of adaptive system-on-modules (SOMs) and developer kits. A scalable and out-of-the-box development platform for robotics, the Kria KR260 offers a seamless path to production deployment with the existing Kria K26 adaptive SOMs. With native ROS 2 support, the standard framework for robotics application development, and pre-built interfaces for robotics and industrial solutions, the new SOM starter kit enables rapid development of hardware-accelerated applications for robotics, machine vision and industrial communication and control.

"The Kria KR260 Robotics Starter Kits builds on the success of our Kria SOMs and KV260 Vision AI Starter Kit for AI and embedded developers, providing roboticists with a complete, out-of-the-box solution for this rapidly growing application space," said Chetan Khona, senior director of Industrial, Vision, Healthcare and Sciences Markets at AMD. "Roboticists will now be able to work in their standard development environment on a platform that has all the interfaces and capabilities needed to be up and running in less than an hour. The KR260 Starter Kit is an ideal platform to accelerate robotics innovation and easily take ideas to production at scale."

AMD today announced that the AMD board has elected President and CEO Dr. Lisa Su as the chair of the board and John E. Caldwell as lead independent director. Caldwell joined the AMD board in 2006 and has served as chair since May 2016. AMD also announced that former Xilinx board members Jon Olson and Elizabeth Vanderslice have joined the AMD board in conjunction with the close of AMD's acquisition of Xilinx.

"Under Lisa's leadership, AMD has successfully executed a multi-year strategy that has significantly re-shaped the company's product portfolio and customer set and delivered industry-leading growth," said Caldwell. "As CEO and chair, Lisa will now have an ability to drive an even sharper focus for AMD and create greater shareholder value. I am also excited to welcome Jon and Elizabeth to the board as a part of the successful completion of the Xilinx acquisition. Their depth of industry knowledge and expertise are valuable additions to the board that will help AMD continue its strong growth."