SilverStone introduced the XE360-SP5, an all-in-one liquid CPU cooler for AMD Socket SP5, making it fit for servers and workstations based on the EPYC "Genoa" and "Genoa-X" processors, and its upcoming Ryzen Threadripper HEDT processors, assuming AMD sticks to this socket infrastructure. The cooler features a copper water block that's optimized for the chiplet design of Socket SP5 processors, considering the hottest components (the up to twelve "Zen 4" CCDs) are toward the edges, and the central region has the relatively cooler sIOD. The block does not have an integrated pump, which makes it 1U-capable. It measures 92 mm (W) x 25 mm (H) x 118 mm (D). The block is made of nickel-plated copper, with come of its structural parts being made of aluminium.

A set of 46 cm-long coolant tubes connects the block to the 28 mm-thick 360 mm x 120 mm radiator. This radiator has an integrated pump that turns at speeds of up to 4,000 RPM. A set of three SilverStone 120 mm fans comes included, each of these takes in 4-pin PWM input, turns at speeds ranging between 600 to 2,800 RPM, with a noise level of up to 46 dBA, airflow of up to 87.72 CFM, and 3.09 mm H₂O pressure. The company didn't reveal pricing.

AMD's Ryzen Threadripper Pro 7000 "Storm Peak" CPU series has not received any form of official announcement—we have relied solely on leaks to find out nitty-gritty details about Team Red's Zen 4-based follow-up to the Ryzen Threadripper Pro 5000 lineup. Pre-release samples have been landing online at an increased rate—courtesy of benchmark suite database leaks—with various news sites theorizing that AMD is preparing for an autumn launch window. This prediction is seemingly coming into focus, according to the latest information from insiders at AMD and connected supply chains.

Wccftech reckons that an October 19 launch day has been pencilled in: "Our sources have told us that AMD is all set to unveil its Ryzen Threadripper PRO 7000 CPU family on the 19th of October. This marks more than 1.5 years since the introduction of the Zen 3-based Ryzen Threadripper Pro 5000 CPUs. The new processors will once again be primarily positioned in the premium workstation segment with limited DIY availability. OEMs will be offering their pre-built designs along with DIY TRX50 motherboards from various manufacturers."

MINISFORUM today is launching their BD770i ITX "Mobile on Desktop" motherboard which comes equipped with AMD's 8-core "Zen 4" Ryzen 7 7745HX. Upon the CPU sits a custom "integrated advanced cooling system" which partially exhausts out of the I/O shield and supports installation of a 120 mm fan, which is not included. The board features dual actively cooled M.2 2280 PCI-E Gen 5 SSDs plus M.2 2230 E-Key for WLAN cards, 2.5G Ethernet, a pair of USB 2.0 ports, another pair of USB 3.2 Gen 1 ports, and a USB 3.2 Gen 2 Type-C port that also supports display out as DisplayPort 1.4. The BD770i also features dual SODIMM slots for up to DDR5-5200 DRAM, as well as a full length PCI-E Gen 5 x16 for dedicated graphics cards. A small detail we noticed in the product images is the silhouette of two more M.2 ports on the rear of the board that aren't in the specifications. On the product page there are mentions of a higher-end BD790i with the Ryzen 9 7945HX which does not seem to be available yet, so perhaps this higher end board will feature these extra ports.

Despite the AMD Ryzen 7 7745HX supporting overclocking features such as an unlocked multiplier, AMD EXPO, and Precision Boost Overdrive; MINISFORUM has chosen to not support those features on the BD770i. Perhaps the upcoming BD790i will include OC support and features, we'll have to wait and see. Pricing for the BD770i is currently set at $399 USD for early orders, however the price is expected to increase to $499 USD after the launch period promotion expires.

A couple of slides from AMD's internal presentation were leaked to the web by Moore's Law is Dead, referencing what's allegedly the next-generation "Zen 5" microarchitecture. Internally, the performance variant of the "Zen 5" core is referred to as "Nirvana," and the CCD chiplet (CPU core die) based on "Nirvana" cores, is codenamed "Eldora." These CCDs will make up either the company's Ryzen "Granite Ridge" desktop processors, or EPYC "Turin" server processors. The cores themselves could also be part of the company's next-generation mobile processors, as part of heterogenous CCXs (CPU core complex), next to "Zen 5c" low-power cores.

In broad strokes, AMD describes "Zen 5" as introducing a 10% to 15% IPC increase over the current "Zen 4." The core will feature a larger 48 KB L1D cache, compared to the current 32 KB. As for the core itself, it features an 8-wide dispatch from the micro-op queue, compared to the 6-wide dispatch of "Zen 4." The integer execution stage gets 6 ALUs, compared to the current 4. The floating point unit gets FP-512 capabilities. Perhaps the biggest announcement is that AMD has increased the maximum cores per CCX from 8 to 16. At this point we don't know if it means that "Eldora" CCD will have 16 cores, or whether it means that the cloud-specific CCD with 16 "Zen 5c" cores will have 16 cores within a single CCX, rather than spread across two CCXs with smaller L3 caches. AMD is leveraging the TSMC 4 nm EUV node for "Eldora," the mobile processor based on "Zen 5" could be based on the more advanced TSMC 3 nm EUV node.

Earlier this year, we introduced the world to the ROG Ally: a Windows gaming handheld that can play all your games, anywhere you go. With its bright and colorful 1080p 120 Hz screen, ergonomic form factor, and incredible AMD Ryzen Z1 Extreme APU, the ROG Ally is a AAA monster, taking modern handhelds to a new level. Now, we're happy to announce that the Ryzen Z1 variant of the ROG Ally is also available for purchase, with all the same features and a more affordable price tag.

The AMD Ryzen Z1 comes is built on the same Zen 4 architecture as the Ryzen Z1 Extreme, with the latest RDNA 3 graphics engine and full support for AMD's incredible upscaling technologies like FidelityFX Super Resolution (FSR) and Radeon Super Resolution (RSR). With six cores and twelve threads alongside four graphics compute units, the Ryzen Z1 has the same robust power delivery and ROG Intelligent Cooling improvements that make the Z1 Extreme so potent, at a more affordable price.

A trio of allegedly official presentation slides appeared on X yesterday, posted by Underfox3—the leaker stopped short of revealing the origin of this material. They simply commented: "AMD Threadripper Pro is coming...🔥." The next generation HEDT processor family is expected to arrive in the fall, and the opening slide pretty much confirms this launch window (starting September 22—autumnal equinox). There has been a noticeable uptick in Zen 4 "Storm Peak" 7000-series pre-release units appearing online lately—so the timing seems plausible. Text segments do not mention the 7000-series in specifics, but an IHS render visible on the second slide looks somewhat similar—in shape—to a grey market-listed Threadripper Pro 7985WX. VideoCardz has compiled various leaked SKUs into a chart (see below).

A very general claim is made on the second slide—boasting a 20% performance increase over their Threadripper Pro 5000 series—but detailed information (prowess in single or multi-core tests) or in-depth benchmark results are not included. VideoCardz surmises from an interpretation of the third slide—noting: "support for 96 cores, marking a 50% boost over the TR PRO 5000 series. This suggests that the 20% improvement likely pertains to the single-core Zen 4 boost." The final slide also shows said 96-core Threadripper Pro processor tipped against Intel's Xeon W9-3495X CPU (a 56-core Sapphire Rapids candidate)—the former is said to produce 75% more renders per day. Per frame completion time is 657 second versus 1125 seconds (respectively).

Activity on the next-gen Ryzen Threadripper front has ramped up over the past week—we previously witnessed a fairly comprehensive spec leak of Pro 7995WX and 7975WX processors last week, thanks to Dell Precision Tower workstations getting tested out in SiSoftware's Sandra suite. Pre-release "Zen 4" HEDT hardware seems to be out in the wild—YuuKi_AnS has posted a photo of an allegedly SP6 socket-ready AMD Ryzen Threadripper Pro 7985WX CPU.

This sample is apparently for up for sale on an unspecified online marketplace, advertised as having a TDP rating of 350 W. An AMD OPN core code reads: "100-00000454," although the photographed unit lacks any external "Threadripper" branding. The seller describes the for-sale processor as possessing "minor signs of use" as evidenced by scuffs and marks, but it is said to be fully functional and no repairs are required to get it in operational mode. The screen grab does not include any details about pricing or location.

ASRock Rack, the leading innovative server company, today announced its latest server motherboard lineup now supports the AMD EPYC 8004 Series processors which extend the 4th Gen EPYC Family into new markets.

The AMD EPYC 8004 Series processors bring the benefits of the "Zen 4c" processor core to markets that seek strong performance but also have significant requirements for efficient, dense form factors, limited available power, and quieter operations. "AMD EPYC 8004 Processors are purpose-built to deliver strong performance and energy efficiency in an optimized, single-socket package," said Lynn Comp, corporate vice president, Server Product and Technology Marketing, AMD. "The combination of impressive performance and streamlined platform componentry of the EPYC 8004 Series CPUs means system builders can offer their customers cost-efficient business-relevant configurations."

GIGABYTE Technology: Giga Computing, a subsidiary of GIGABYTE and an industry leader in high-performance servers, server motherboards, and workstations, today announced new GIGABYTE enterprise series solutions for the AMD EPYC 8004 Series processors. Giga Computing is committed to reaching all sizes of data centers to deliver the best compelling solution, and now is doing so with new AMD EPYC 8004 CPUs that target edge applications, CSPs, and value enterprises. For these uses, the new R243 and R143 server series are poised alongside ME33 and ME03 motherboard series to deliver cost-optimized performance.

Leveraging the "Zen 4c" core architecture, the AMD EPYC 8004 Series CPUs deliver performance and power efficiency with built-in security capabilities in an optimized single-socket platform. Additionally, the new SP6 socket was designed to enable the power, cost, and form factor requirements for the AMD EPYC 8004 Series CPUs' target markets as well as diverse applications such as intelligent edge computing and telco.

Supermicro, Inc., a Total IT Solution Provider for Cloud, AI/ML, Storage, and 5G/Edge, is announcing the AMD based Supermicro H13 generation of WIO Servers, optimized to deliver strong performance and energy efficiency for edge and telco datacenters powered by the new AMD EPYC 8004 Series processors. The new Supermicro H13 WIO and short-depth front I/O systems deliver energy-efficient single socket servers that lower operating costs for enterprise, telco, and edge applications. These systems are designed with a dense form factor and flexible I/O options for storage and networking, making the new servers ideal for deploying in edge networks.

"We are excited to expand our AMD EPYC-based server offerings optimized to deliver excellent TCO and energy efficiency for data center networking and edge computing," said Charles Liang, president and CEO of Supermicro. "Adding to our already industry leading edge-to-cloud rack scale IT solutions, the new Supermicro H13 WIO systems with PCIe 5.0 and DDR5-4800 MHz memory show tremendous performance for edge applications."

AMD today rolled out the new compacted Socket SP6 server platform designed for smaller servers locally deployed at the edge by organizations. With CPU core-counts of up to 64-core/128-thread, these processors are based on the "Zen 4c" microarchitecture, which comes with identical IPC and ISA to "Zen 4," but with smaller L3 cache available per core. The EPYC 8004 series targets traditional data-centers located on-site for organizations. Even if the heavy-lifting of the IT for them is performed by remote data-centers or cloud providers, organizations still need smaller edge server deployments. The EPYC 8004 series caters to a different kind of servers than the ones the lower core-count models of EPYC 9004 "Genoa" do.

With the EPYC 8004 series, AMD is debuting a new smaller CPU socket called SP6. The socket measures 58.5 mm x 75.4 mm, compared to the 76.0 mm x 80.0 mm of Socket SP5 powering EPYC 9004 "Genoa" and EPYC 97x4 "Bergamo." Socket SP5 is an LGA with a pin count of 4,844, compared to SP5, which is LGA-6096. The first line of processors for this socket, the EPYC 8004 series, are codenamed "Siena." These are very much part of the 4th Gen EPYC series, a lineage it shares with "Genoa" for data-center servers, "Genoa-X" for compute servers, and "Bergamo" for high-density cloud.

A pair of Dell Precision workstations have been tested in SiSoftware's Sandra benchmark suite—database entries for the 7875 Tower (Dell 00RP38) and 7875 Tower (Dell 00RP38) reveal specifications of next generation AMD Ryzen Threadripper Pro CPUs. The 32 core 7975WX model was outed a couple of weeks ago, but the Sandra benchmark database has been updated with additional scores. Its newly leaked sibling is getting a lot of attention—the recently benchmarked 7995WX sample appears to possess 96 Zen 4 cores, and 192 threads (via SMT) with a 5.14 GHz maximum single-core boost clock. Tom's Hardware is intrigued by benchmark data showing that the CPU has: "a 3.2 GHz all-core turbo frequency."

There are 12 CCDs onboard, with a combined total of 384 MB of L3 cache (each CCD has access to 32 MB of L3)—therefore Wccftech believes that "this chip is based on the Genoa SP5 die and will adopt the top 8-channel and SP5 socket platform. The chip also features 96 MB of L2 cache and the top clock speed was reported at 5.14 GHz." The repeat benched Ryzen Threadripper Pro 7975WX CPU is slightly less exciting—with 32 Zen 4 cores, 64 threads, 128 MB of L3 cache, and 32 MB of L2 cache. According to older information, this model is believed to have a TDP rating of 350 W and apparent clock speeds peaking at 4.0 GHz—Wccftech reckons that this frequency reflects an all-core boost. They have produced a bunch of comparative performance charts and further analysis—well worth checking out.

A die-shot of AMD's 4 nm "Phoenix 2" monolithic APU emerged over the weekend—possibly the first example of a Team Red hybrid core processor, utilizing a combination of bog standard Zen 4 cores as well as "compacted" Zen 4c units. Phoenix 2 has been hiding in plain sight it seems, within Ryzen Z1 series APUs—that have much in common with mobile/laptop-oriented 7040U products. David Huang has posted an analysis of a Ryzen Z1 APU via his review as posted on Zhuanlan, where he investigates the intriguing combination of Zen 4 and Zen 4c cores.

As interpreted/translated by Tom's Hardware: "HWiNFO, a system information, monitoring, and diagnostics utility, confirms that the Ryzen Z1, codenamed Phoenix 2, is on the PHX2-A0 stepping. It differs from AMD's Ryzen 7040U series (Phoenix) with the PHX-A1 stepping. The Ryzen Z1 has been rumored to be a clone of the Ryzen 5 7540U for a long time now." Laptops housing the latter APU are reported to have reached retail markets in certain territories, while the Ryzen Z1 (non-Extreme) SoC has not debuted in any new devices. A cheaper ASUS ROG Ally is expected to arrive in the near future with the lesser chip.

The 4 nm "Phoenix 2" monolithic APU silicon powering the lower end of AMD's Ryzen 7040-series mobile processors, could very well be the company's first hybrid core processor, even though the company doesn't advertise it as such. We first caught whiff of "Phoenix 2" back in July, when it was described as being a physically smaller chip than the regular "Phoenix." It was known to have just 6 CPU cores, and a smaller iGPU with 4 RDNA3 compute units; in comparison to the 8 CPU cores and 12 compute units of the "Phoenix" silicon. At the time a lack of 2 CPU cores and 8 CUs were known to be behind the significant reduction in die size from 178 mm² to 137 mm², but it turns out that there's a lot more to "Phoenix 2."

A die shot of "Phoenix 2" emerged on Chinese social media platform QQ, which reveals two distinct kinds of CPU cores. There are six cores in all, but two of them appear larger than the other four. The obvious inference here, is that the larger cores are "Zen 4," and the smaller ones are the compacted "Zen 4c." The "Zen 4c" core has the same core machinery as "Zen 4," albeit it is re-arranged to favor lower area on the die. The trade-off here is that the "Zen 4c" core operates at lower voltages and lower clock-speeds than the regular "Zen 4" cores. At the same clock speeds, both kinds of cores have an identical IPC. The two also have an identical ISA, so any software threads migrating between the cores will not encounter runtime errors. Unlike Intel Thread Director, AMD can use a less sophisticated software-based solution to ensure that the right kind of workload is allocated to the right kind of cores, and prevent undesirable migration between the two kinds of cores. Unlike the hardware-based Thread Director, AMD's solution can be continually updated.

AMD's Zen 4 high-end desktop (HEDT) family could be closing in on a launch window—AsRock's European office has registered a number of motherboards with the EEC, and KOMACHI_ENSAKA spotted a model sporting a TRX50 chipset sitting in the middle of mainstream gaming Lightning and Riptide offerings. The "TRX50 WS" seems to be the first sighting of an AMD Threadripper 7000 "Storm Peak" series workstation board. TRX50 is presumably the logical successor to Team Red's existing TRX40 platform—the latter supports third generation (Zen 3) Ryzen Threadripper 5000 "Chagall" processors. AMD has not publicly published any details regarding next-gen Threadripper and Threadripper Pro product lineups, but several leaks have pointed to the new HEDT platform arriving within the second half of 2023.

A mid-August Geekbench database entry outed the AMD Ryzen Threadripper PRO 7995WX—this 96 core/192 thread CPU scored 2095 points in single-core tests, and 81408 multi-core points—these results have it positioned as one of the fastest processors submitted to Geekbench. The test system was running Geekbench v5.5 for Linux (Ubuntu 22.04 LTS). It is speculated that four (or more) models could be released with differing core counts: 16, 32, 64 and 96—please refer to the VideoCardz authored chart (below). Past rumors have SP5 and SP6 socket types linked to the "Storm Peak" family, with the introduction of DDR5 memory standard to Threadripper.

Giga Computing, a trailblazing force in high-performance technology and a distinguished GIGABYTE subsidiary, proudly presents the next evolution in computing. Behold the sleek and powerful ultra-compact mini-PC, a masterpiece meticulously designed for the BRIX Extreme lineup. This dynamic addition harnesses the formidable capabilities of the AMD Ryzen 7040U and 7035U series processors. As AMD propels mobile platforms into a new era with the Zen 4 architecture and TSMC's cutting-edge 4 nm process, the BRIX Extreme rises as the ultimate symbol of performance, style, and innovation.

Enveloped in GIGABYTE's exclusive design, the BRIX Extreme of 2022 boasts an enhanced appearance that seamlessly integrates four display outputs—HDMI 2.1, USB Type C, 2.5G Ethernet, and Wi-Fi 6E. This unleashes the unprecedented power of the most dominant mini-PC, delivering breathtaking performance and responsiveness. Unleash your creativity, dominate your games, and immerse yourself in limitless possibilities.

During its "Xiamen HighFun" event in China, Minisforum announced the latest addition to its compact series of gaming PCs, this time with no official name. The 6-liter system, code-named "Project RPFXI" for Intel and "Project DRFXI" for AMD, will support up to 100 W TDP and utilize the most powerful Ryzen CPU, the Ryzen 9 7945HX3D. This hybrid mobile/desktop processor combines the desktop-level performance of 16 Zen 4 cores with 144 MB of 3D V-cache, all within a 55 W power limit. Minisforum confirmed the 7945HX3D would be available in the AMD platform version, positioned as a premium model compared to the existing 7945HX system.

Interestingly, the GPU support is literally external, as the potential GPU needs to be attached to the outside part of the case, which is then secured using screws. The case could accommodate the fastest GPUs like NVIDIA GeForce RTX 4090 with a powerful enough power supply. The 6-liter mini PC is expected to launch in late 2023, either in 24-core Intel (HX line) configuration, of 16-core AMD configuration.

AMD today announced revenue for the second quarter of 2023 of $5.4 billion, gross margin of 46%, operating loss of $20 million, net income of $27 million and diluted earnings per share of $0.02. On a non-GAAP basis, gross margin was 50%, operating income was $1.1 billion, net income was $948 million and diluted earnings per share was $0.58.

"We delivered strong results in the second quarter as 4th Gen EPYC and Ryzen 7000 processors ramped significantly," said AMD Chair and CEO Dr. Lisa Su. "Our AI engagements increased by more than seven times in the quarter as multiple customers initiated or expanded programs supporting future deployments of Instinct accelerators at scale. We made strong progress meeting key hardware and software milestones to address the growing customer pull for our data center AI solutions and are on-track to launch and ramp production of MI300 accelerators in the fourth quarter."

AMD today announced the Ryzen 9 7945X3D mobile processor, which it claims is the fastest notebook processor for gaming, faster than even Intel's Core i9-13980HX. The 7945X3D is a 16-core/32-thread processor that leverages AMD 3D Vertical Cache technology. Much like the desktop Ryzen 9 7950X3D, the 7945X3D features 64 MB of stacked 3D vertical cache memory on one of its two "Zen 4" CCDs, which gives it 96 MB of last-level cache. The second one is a regular "Zen 4" CCD with 32 MB of L3 cache—again, just like the desktop 7950X3D. The most interesting aspect has to be that AMD claims to have pulled off leadership gaming performance at a 55 W+ TDP.

The Ryzen 9 7945X3D is based on the "Dragon Range" multi-chip module. This is essentially a mobile-optimized BGA variant of the desktop "Raphael" MCM, with a higher degree of power optimization. The processor features 16 "Zen 4" CPU cores spread across two CCDs, each with 1 MB of L2 cache. The first CCD has 96 MB of L3 cache thanks to the 3DV cache, while the second CCD has 32 MB of it. Despite its power constrained form-factor, the 7945X3D has a maximum boost frequency of 5.40 GHz. Each of the two CCDs is built on the 5 nm EUV foundry node. The L3D (the die stacked on top of the first CCD) is built on 6 nm, as is the client I/O die (cIOD). The processor supports dual-channel DDR5, and has a 28-lane PCI-Express Gen 5 root complex. AMD claims that the Ryzen 9 7945X3D is on average 15% faster at gaming than its current flagship processor, the 16-core Ryzen 9 7945HX. This should mean that the processor is faster than the Intel Core i9-13980HX. The first notebook to debut the AMD Ryzen 9 7945X3D is the ASUS ROG Strix SCAR 17 X3D, which goes on sale on August 22, 2023.

Talking with XDA-Developers, AMD has confirmed more details about the upcoming Phoenix2 APU, which should debut with Ryzen 3 7440U and Ryzen 5 7540U APUs. Unlike the larger Phoenix APU, the Phoenix2 APU will have a hybrid design with Zen 4 and Zen 4c cores. As confirmed by AMD, the Phoenix2 APU will be a 6-core design, which makes it pretty clear it will feature two Zen 4 and four Zen 4c cores. It will also come with a Radeon 740M GPU with 4 RDNA3 compute units (CUs). The Phoenix2 APU will also lack the Ryzen AI core. Unlike Intel's hybrid approach, Zen 4c cores will have the same IPC as Zen 4, same instructions, but have less L3 cache per core.

AMD has previously confirmed that the Ryzen 3 7440U will have a smaller die size of 137 mm², compared to 178 mm² on the Ryzen 5 7640U. While AMD did not directly confirmed that the Ryzen 5 7540U will also be based on the Phoenix2 APU, official specification shows it with the same 4 GPU cores and without Ryzen AI core, making it pretty obvious it will be based on the same Phoenix2 APU. Hopefully, AMD will come up with more official details about its Phoenix2 APU as there are still a lot of unknowns.

The China-specific AMD Ryzen 5 7500F desktop processor could see a wider international launch, reports VideoCardz, citing the AMD website, which has marked its regional availability as "global." The processor is priced at USD $180 for the retail PIB package. The 7500F is a 6-core/12-thread processor based on the same "Raphael" Zen 4 MCM as the 7600X, but lacks integrated graphics, has a lower 65 W TDP, and slightly lower clock speeds. The processor saw a China-exclusive release earlier this week. Chinese and regional media with access to samples reviewed the processor, noting that its gaming performance 6% behind that of the Ryzen 5 7600X at 1080p, but more importantly, the Ryzen 5 7500F is 13% faster than the Core i5-13400 in terms of average FPS, and about 8% faster in 1% low FPS.

This makes the Ryzen 5 7500F a faster gaming processor than the $200 Core i5-13400, and the $180 Core i5-13400F, which it was originally designed to square off against. The Ryzen 5 7500F is configured with 6 cores and 12 threads, 1 MB of L2 cache per core, and 32 MB of shared L3 cache. The processor has a base frequency of 3.70 GHz, with a 5.00 GHz boost that's just 100 MHz behind that of the Ryzen 5 7600 (65 W), and 300 MHz behind the 7600X (105 W). The "F" in the brand extension indicates a lack of integrated graphics, which shouldn't be a dealbreaker for the processor's intended audience—PC gamers. AMD is including a Wraith Stealth stock cooler with the retail 7500F, which coupled with A620 chipset motherboards that start at $125, should make for a formidable mainstream gaming PC platform with ample upgrade headroom.

AYANEO, an Asian manufacturer known for its mobile handhelds, has introduced a new device, the AYANEO Kun. The Kun is powered by the latest AMD Ryzen 7 7840U mobile processor from the Ryzen 7040 series. This SoC includes eight Zen 4 cores and an integrated graphics unit based on the RDNA 3 architecture with 12 compute units. The console's dimensions stand at 312 x 133 x 21.9 mm, making it slightly wider but slimmer than ASUS's ROG Ally, with the exact weight yet to be disclosed. Kun's battery capacity is rated for 75Wh, as compared to other handhelds' 40 Wh, potentially indicating a longer battery life.

The AYANEO Kun's other notable features include its 8.4-inch display with an IPS panel and resolution of 1,920 x 1,200 pixels. For controls, the device utilizes a D-Pad and two Hall sensor-equipped joysticks for gaming. The shoulder buttons also employ Hall sensor technology. There are touchpads on either side of the display, along with other function keys and the A/B/X/Y keys. For the first time, AYANEO has integrated buttons at the back of the device, offering customizable functions. The device provides two Type-C (likely USB4), one USB Type-A, and one 3.5 mm jack connection. More comprehensive technical details, model variants, and pricing information are to be released during the official unveiling of the AYANEO Kun scheduled for August.

Best Buy has slashed $100 off of the AMD Ryzen 5 7600X's normal asking price—North American customers can obtain these 6-core/12-thread processors for $199.90 a piece. Amazon US price matching the consumer electronics store's offer earlier today, but their stocks were depleted at some point this afternoon. AMD's Ryzen 5 7600 (non-X) processor is still stuck at MSRP ($229), so its X-model sibling presents a better deal at its current lower price. Buyers will have to splash out extra on a CPU cooling solution, since Team Red does not include a Wraith Stealth or Prism air cooler as standard with the Ryzen 5 7600X's retail package. AMD + Bethesda's Starfield Game Bundle partnership campaign kicked off last week, and all of the AM5 desktop Ryzen 7000-series models qualify for the active promotion. This plays a part in boosting customer interest, but a nice discount also goes a long way—hence the quick run on Amazon's supplies of the Ryzen 5 7600X.

Intel decided to drop the relatively new AVX-512 instruction set for laptop/mobile platforms when it was discovered that it would not work in conjunction with their E-core designs. Alder Lake was the last generation to (semi) support these sets thanks to P-cores agreeing to play nice, albeit with the efficiency side of proceedings disabled (via BIOS settings). Intel chose to fuse off AVX-512 support in production circa early 2022, with AMD picking up the slack soon after and working on the integration of AVX-512 into Zen 4 CPU architecture. The Ryzen 7040 series is the only current generation mobile platform that offers AVX-512 support. Phoronix decided to benchmark a Ryzen 7 7840U against older Intel i7-1165G7 (Tiger Lake) and i7-1065G7 (Ice Lake) SoCs in AVX-512-based workloads.

Team Red's debut foray into AVX-512 was surprisingly performant according to Phoronix's test results—the Ryzen 7 7840U did very well for itself. It outperformed the 1165G7 by 46%, and the older 1065G7 by an impressive 63%. The Ryzen 7 APU was found to attain the highest performance gain with AVX-512 enabled—a 54% performance margin over operating with AVX-512 disabled. In comparison Phoronix found that: "the i7-1165G7 Tiger Lake impact came in at 34% with these AVX-512-heavy benchmarks or 35% with the i7-1065G7 Ice Lake SoC for that generation where AVX-512 on Intel laptops became common."

AMD's laptop-oriented Ryzen 7040 series of Zen 4 processors APUs—based on 4 nm "Phoenix" monolithic silicon—have been slow to hit the market, but folks have had plenty of time to study spec sheets and press material. The presence of similar-ish 7040HS and 7040H product assignments (also sharing nearly identical specifications) has caused some confusion within the PC hardware community. Team Red has finally got round to explaining the significance of their -HS and -H identifiers—product pages were updated with new information this month, showing that the Ryzen 7040H series exists as a Chinese market exclusive. NA, EMEA, APJ, LATAM regions will be getting the closely related Ryzen 7040HS lineup instead. ASUS, Lenovo, and Machenike are set to launch new laptop models in China that will feature Ryzen 7040H APUs—VideoCardz found it interesting that "some of them will not have discrete graphics and will have a higher TDP of 65 W".