Starting next year, AMD will move to a new model number scheme for its mobile processors and it appears that the company has decided to use the first digit to represent the model year, which should alleviate some past confusion. The second digit in the model name will represent where in the product stack the specific chip will sit and here we're potentially getting some new 6 and 8 models, although nothing guarantees that AMD will actually implement these segments into real products. The third digit represents the architecture, so a four equals Zen 4 for example.

The last digit in the model names is a new addition where AMD has sub SKUs that offer some performance advantage of the base SKU of a specific model and this digit will apparently only be represented by a 0 or a 5. Finally AMD has added a new suffix too, where C stands for Chromebook. This translates to 15-28 Watt chips that have been designed specifically for Chromebook usage. The current HX, HS and U suffix lettering will carry over, alongside the lower-case e for 9 W versions the U SKUs. AMD has also segmented it's mobile CPUs according to the chart below, to try and deliver a clearer use case for its various CPU models. The chart is pretty self explanatory, although some of the segmentation will apply to updated models of current designs, whereas others will only apply to new laptop designs. The new model numbering scheme will apply to at least 2025.

AMD Ryzen 7000 "Zen 4" processors can hit up to 95 °C at stock settings, with cooling most appropriate to the TDP level. This is because the PPT (package power tracking) limits for the 170 W TDP processors is as high as 230 W, and for the 105 W TDP models, it's 130 W. After reaching this temperature threshold, the processor begins to downclock itself to lower temperatures. Harukaze5719 discovered that higher than needed core voltages could be at play, and manually undervolting the processors could free up significant thermal headroom, letting the processors hold on to higher boost multipliers better.

With its recent announcement of the Ryzen 7000 desktop processors, the action now shifts to the server, with AMD preparing a wide launch of its EPYC "Genoa" and "Bergamo" processors this year. Powered by the "Zen 4" microarchitecture, and contemporary I/O that includes PCI-Express Gen 5, CXL, and DDR5, these processors dial the CPU core-counts per socket up to 96 in case of "Genoa," and up to 128 in case of "Bergamo." The EPYC "Genoa" series represents the main trunk of the company's server processor lineup, with various internal configurations targeting specific use-cases.

The 96 cores are spread twelve 5 nm 8-core CCDs, each with a high-bandwidth Infinity Fabric path to the sIOD (server I/O die), which is very likely built on the 6 nm node. Lower core-count models can be built either by lowering the CCD count (ensuring more cores/CCD), or by reducing the number of cores/CCD and keeping the CCD-count constant, to yield more bandwidth/core. The leaked product-stack table below shows several of these sub-classes of "Genoa" and "Bergamo," classified by use-cases. The leaked slide also details the nomenclature AMD is using with its new processors. The leaked roadmap also mentions the upcoming "Genoa-X" processor for HPC and cloud-compute uses, which features the 3D Vertical Cache technology.

AMD in its Discord AMA confirmed DDR5-6000 to be the "sweetspot" memory overclock for its upcoming Ryzen 7000 "Zen 4" processors. A sweetspot frequency in AMD jargon is an inflection of performance, stability, cost, and ease. For the very first Ryzen, this was DDR4-3200. For Ryzen 2000, it was DDR4-3400. For the Ryzen 3000 "Zen 2," it climbed to DDR4-3800, the Ryzen 5000 "Zen 3" it was DDR4-4000.

At the architectural-level, it is usually the highest frequency where FClk, UClk, and MClk maintain a 1:1:1 ratio, before having to engage dividers that impact performance, making it a point of diminishing returns for investing in faster memory modules. AMD's Robert Hallock, leading the Discord AMA, recommended that FClk be left untouched at "Auto" for the best results, and overclockers look for an Auto:1:1 ratio for the FClk, UClk, and MClk. As with both AMD and Intel now, the highest frequencies are possible only with one single-rank DIMM per memory channel (1DPC), and memory overclocking yield lower results with dual-rank DIMMs, or two DIMMs per memory channel. Among the AMD EXPO-certified DIMMs announced over the past few days, some do engage memory clocks beyond DDR5-6000. It would be interesting to see how they affect the "golden ratio" for Zen 4.

We already know that AMD is working on a variant of the "Zen 4" CPU complex die (CCD) featuring 3D Vertical Cache (3DV-cache) memory, through company roadmaps, and AMD even confirmed to us that the technology continues to be a part of the client roadmap of the company. We're now getting news that the first Ryzen 7000X3D ("Zen 4" with 3DV cache) processors could be unveiled by the 2023 International CES (January next year). It appears like while the conventional Ryzen 7000 series beats the 12th Gen Core "Alder Lake" at gaming, it might trade blows with the 13th Gen "Raptor Lake," and AMD will count on the 3DV cache technology to give it a competitive edge.

Greymon55, a reliable source with AMD leaks, hints at the possibility of three 7000X3D-series SKUs: the Ryzen 7 7800X3D (8-core/16-thread) positioned above the 7700X; the Ryzen 9 7900X3D (12-core/24-thread), and the Ryzen 9 7950X3D (16-core/32-thread). Older reports suggest the 3DV cache on these processors will be a generation more advanced to keep sync with the on-die L3 cache of the "Zen 4" CCD, and the L3D (the die on which the 3DV cache is located), will likely be built on the 6 nm process.

An AMD Ryzen 9 7950X "Zen 4" 16-core/32-thread processor was put through the Geekbench 5.4.5 benchmark, and it's becoming all too clear that AMD has a highly competitive product on its hands. The 7950X yielded a single-threaded score of 2217 points, and 24396 points in the multi-threaded tests. With these scores, the 7950X is about 14% faster than the "Golden Cove" P-cores of the i9-12900K "Alder Lake" processor in the single-threaded tests, and comes out as being 41% faster than it in the multi-threaded test. Against the leaked i9-13900K "Raptor Lake," the 7950X is shown being about 4% slower in the single-threaded test (against the "Raptor Cove" P-cores); and about 7.8% slower in the multi-threaded test.

AMD CEO Lisa Su, who has supervised the company's rise from the ashes, looked to assuage fears of reduced stock for the launch of AMD's next-gen Ryzen 7000 series CPUs. Hardware enthusiasts being understandably burned from the last generation of GPU and CPU's lack of availability (and ensuing scalping practices), the CEO in today's announcement of the Ryzen 7000 series carried a promise: "It is true that if you look at the past 18 months there have been a number of things, whether its capacity limitations or logistics," she said. "From an AMD standpoint, we have dramatically increased our overall capacity, in terms of wafers, as well as substrates and on the back end. So with our launch of Zen 4 we don't expect any supply constraints."

AMD's Zen 4 family is being launched with the new AM5 socket, which AMD says will live through 2025+ for subsequent CPU releases. The company has managed to increase IPC by 13% while decreasing the overall CCD size by 18% compared to that of Zen 3 (reducing the area/cost impact of adding integrated graphics throughout the lineup). Frequencies have gone up to a maximum 5.7 GHz thanks to smart circuitry redesign and TSMC's 5 nm node. AMD says its Ryzen 7000 can thus be expected to provide up to 29% higher single-core and 45% higher multi-core performance. Of course, with macroeconomics being what they are, and recent reports on lack of low-price chips throughout the market, it's not only the availability of Ryzen 7000 CPUs that matters: AM5 motherboards and DDR5 memory chip stocks have to be taken into account as well. But all in all, AMD seems to be prepared for a successful and quantity-adequate launch.

The latest version 2.02 of CPU-Z adds support for a handful unreleased Ryzen 7000 series "Zen 4" processors. These include "non-X" SKUs, namely the Ryzen 9 7950, and Ryzen 9 7900. Keeping up with past trends, these are possibly 65 W TDP variants of the 7900X and 7950X to be released only in the OEM market, and will make it to pre-built desktops. In the past, OEM processors by AMD have found their way to brick-and-mortar retail stores, where they're sold off the tray. The retailers get these chips from AMD by claiming to be SI (system integrators). They tend to bundle these with motherboards, memory kits, and SSDs. AMD in its announcement presentation for the Ryzen 7000 underscored the extreme levels of efficiency "Zen 4" exhibits in chips with 65 W power limits. Single-threaded or lightly threaded performance is mostly unaffected, but heavy multi-threaded workloads could see lower performance in comparison to the retail "X" chips.

AMD in its Ryzen 7000 series launch event shared its near-future CPU architecture roadmap, in which it confirmed that the "Zen 4" microarchitecture, currently on the 5 nm foundry node, will see an optical-shrink to the 4 nm process in the near future. This doesn't necessarily indicate a new-generation CCD (CPU complex die) on 4 nm, it could even be a monolithic mobile SoC on 4 nm, or perhaps even "Zen 4c" (high core-count, low clock-speed, for cloud-compute); but it doesn't rule out the possibility of a 4 nm CCD that the company can use across both its enterprise and client processors.

The last time AMD hyphenated two foundry nodes for a single generation of the "Zen" architecture, was with the original (first-generation) "Zen," which debuted on the 14 nm node, but was optically shrunk and refined on the 12 nm node, with the company designating the evolution as "Zen+." The Ryzen 7000-series desktop processors, as well as the upcoming EPYC "Genoa" server processors, will ship with 5 nm CCDs, with AMD ticking it off in its roadmap. Chronologically placed next to it are "Zen 4" with 3D Vertical Cache (3DV Cache), and the "Zen 4c." The company is planning "Zen 4" with 3DV Cache both for its server- and desktop segments. Further down the roadmap, as we approach 2024, we see the company debut the future "Zen 5" architecture on the same 4 nm node, evolving into 3 nm on certain variants.

AMD in its Ryzen 7000 launch event teased its next-generation Radeon graphics card based on the RDNA3 graphics architecture. Built on an advanced process node just like "Zen 4," AMD is hoping to repeat the magic of the RX 6000 series, by achieving a 50% performance-per-Watt gain over the previous generation. which allows it either to build some really efficient GPUs, or consume the power headroom to offer significantly higher performance at power levels similar as the current-gen.

AMD's teaser included a brief look at the air-cooled RDNA3 flagship reference-design, and it looks stunning. The company showed off a live demo of the card playing "Lies of P," a AAA gaming title that made waves at Gamescom for its visuals. The game was shown playing on an RDNA3 graphics card running on a machine with a Ryzen 9 7950X processor at 4K, with extreme settings. AMD CEO Dr Lisa Su confirmed a 2022 launch for RDNA3.

AMD today announced the Ryzen 7000 series "Zen 4" desktop processors. These debut the company's new "Zen 4" architecture to the market, increasing IPC, performance, with new-generation I/O such as DDR5 and PCI-Express Gen 5. AMD hasn't increased core-counts over the previous-generation, the Ryzen 5 series is still 6-core/12-thread, the Ryzen 7 8-core/16-thread, and Ryzen 9 either 12-core/24-thread, or 16-core/32-thread; but these are all P-cores. AMD is claiming a 13% IPC uplift generation over generation, which coupled with faster DDR5 memory, and CPU clock speeds of up to 5.70 GHz, give the Ryzen 7000-series processor an up to 29% single-core performance gain over the Ryzen 5000 "Zen 3."

At their press event, AMD showed us an up to 35% increase in gaming performance over the previous-generation, and an up to 45% increase in creator performance (which is where it gets the confidence to stick to its core-counts from). The "Zen 4" CPU core dies (CCDs) are built on the TSMC 5 nm EUV (N5) node. Even the I/O die sees a transition to 6 nm (N6), from 12 nm. The switch to 5 nm gives "Zen 4" 62 percent lower power for the same performance, or 49% more performance for the same power. versus the Ryzen 5000 series on 7 nm. The "Zen 4" core along with its dedicated L2 cache is 50% smaller, and 47% more energy efficient than the "Golden Cove" P-core of "Alder Lake."

A screenshot of an alleged AMD Ryzen 9 7950X "Zen 4" processor surfaced on the web, courtesy of OneRaichu, and this time there's no blur-out with the score field—15645 points. When compared to the alleged CPU-Z Bench scores of the Core i9-13900K "Raptor Lake" from last week, the Intel 8P+16E hybrid processor ends up 7.9% faster than this score, but still a very close second.

The Ryzen 9 7950X ends up a significant 23.47% faster than the leaked score of the Core i7-13700K (8P+8E), and the AMD flagship scores 33.5% faster than the previous-gen Intel flagship Core i9-12900K. While both the i7-13700K and i9-12900K are 8P+8E, the "Raptor Lake" gets ahead with higher IPC for the P-cores, slightly higher clocks, and more cache for the E-core clusters. The 7950X is also 32.12% faster than its predecessor, the Ryzen 9 5950X "Zen 3," and a whopping 58.39% faster than the Core i7-12700K (8P+4E).

Possible launch SEP pricing of AMD's Ryzen 7000 series "Zen 4" desktop processors leaked to the web by Wccftech, which appear to be similar to those of the Ryzen 5000 "Zen 3" at launch. AMD will launch a slim set of four SKUs in its first round of these processors—the flagship Ryzen 9 7950X (16-core/32-thread), followed by the second-best Ryzen 9 7900X (12-core/24-thread), the Ryzen 7 7700X (8-core/16-thread), and the mid-range Ryzen 5 7600X (6-core/12-thread).

Apparently, the series debuts with the Ryzen 5 7600X at $299, or the same SEP of the Ryzen 5 5600X at launch. The Ryzen 7 7700X launches at $449. The Ryzen 9 7900X comes in at $549, and the flagship Ryzen 9 7950X at $799, which again, is identical to that of the 5950X. Besides processors, motherboard vendors are expected to launch their first Socket AM5 motherboards, debuting with the AMD X670E and X670 chipsets. There's talk of mid-range chipsets such as the B650 and B650E, but we haven't seen any confirmed products show up on motherboard vendors' websites, yet. Pre-launch pricing for the X670E and X670 put them at a significant premium over the current Socket AM4 flagship boards based on the X570. Besides processors and motherboards, we could see announcements from memory vendors launching their first DDR5 memory products to feature AMD EXPO technology.

Fmax (or Frequency max), is the maximum clock speed an AMD "Zen" processor will automatically boost/overclock to, at stock multiplier settings. To go beyond this, you'll have to increase the multiplier value, and overclock the traditional way. The Fmax value for AMD's upcoming flagship desktop processor, the Ryzen 9 7950X "Zen 4," is reportedly set at 5.85 GHz. To facilitate this, you'll have to enable settings such as Precision Boost Overdrive (PBO), to eke out the power limits needed to get here. Competing Intel parts, such as the "Raptor Lake" Core i9-13900K, is reported to have a similar maximum boost frequency, of 5.80 GHz, but that's just for its 8 P-cores.

Y-Cruncher is a multi-threaded Pi calculation benchmark. Its author, Alexander Yee, has access to an AMD Ryzen 9 7950X 16-core/32-thread sample, and has developed the latest version 0.7.10 of the Y-Cruncher binary with optimization for the "Zen 4" microarchitecture, and to take advantage of the AVX-512 instruction-set on these chips. Without disclosing the juicy performance numbers obtained in his testing, Yee posted a screenshot of Y-cruncher with the 7950X, on a machine with Windows 11 22Hx, and 64 GB of memory. You know it's optimized, since the multi-core efficiency is as high as 98% (all threads are being saturated with the Pi calculation workload).

Alleged Cinebench R23 single-threaded benchmark numbers of the upcoming Ryzen 7 7700X and Ryzen 5 7600X "Zen 4" processors, leaked to the web by Greymon55, and tabulated by VideoCardz, show the two chips to be matching Intel's 12th and 13th Gen Core processors. The 7700X 8-core/16-thread processor is shown scoring anywhere between 2000 to 2099 points (denoted as 20xx), while the 7600X does anywhere between 1900 to 1999 points (19xx). This would see the two easily match/beat the 12th Gen Core "Alder Lake" P-cores, with the i9-12900K scoring 2000 points, and the i5-12600K getting 1920 points.

Numbers for the unreleased 13th Gen Core "Raptor Lake" put Intel at an advantage, with the i9-13900K allegedly scoring 2290 points, and the i5-13600K allegedly 1967 points, but what's important is that the single-thread performance, and application performance of less-parallelized workloads, such as games, could be highly competitive for "Zen 4" against Intel.

AMD is allegedly ready with a working "Zen 4" chiplet that has stacked 3D Vertical Cache (3DV cache) memory, which supplements the on-die L3 cache, and is found to massively improve gaming performance. "Moore's Law is Dead" reports that the Zen 4 + 3DV Cache chiplet will be used with various Ryzen 7000X3D SKUs, as well as special EPYC "Genoa" SKUs.

The 3DV Cache deployed with the "Zen 4" chiplet is a second-generation to the one on the "Zen 3 + 3DV cache" chiplet, and AMD has worked on a number of bandwidth and latency improvements, so it performs in-sync with the generationally-faster on-die L3 cache of the "Zen 4" chiplet. Unlike the CCD below it that's built on TSMC N5 (5 nm EUV), the L3D (the stacked die with the 3DV cache) is possibly be built on an older node, such as N6 (6 nm), since it only contains a slab of memory and doesn't warrant N5. "Moore's Law is Dead" reports that AMD expects to repeat the magic of the 5800X3D when it comes to gaming performance, and expects Ryzen 7000X3D processors to dominate Intel's 13th Gen "Raptor Lake" processors. This was echoed by another reliable source, greymon55.

AMD is now TSMC's second largest customer for its 5 nanometer N5 silicon fabrication node, according to a DigiTimes report. The Taiwan-based semiconductor industry observer also reports that AMD is more resilient than Intel in facing any downturns in the PC industry, in the coming few months. PC sales are expected to slump by as much as 15 percent in the near future, but the lower market-share compared to Intel; and the flexibility for AMD to move its CPU chips over to enterprise product to feed the growth in server processor segment, means that the company can ride over a bumpy road in the near future. The lower market-share translates to "lesser pain" from a slump compared to Intel. The report also says that embracing TSMC for processors "just in time" means that AMD has a front-row seat with product performance, time-to-market, yields, and delivery.

AMD is on the anvil of two major product launches on 5 nm, the Ryzen 7000 series "Raphael" desktop processors on August 30 (according to the report), and EPYC "Genoa" server processors in November 2022. The company is planning to refresh its notebook processor lineup in the first half of 2023, with "Dragon Range," and "Phoenix Point" targeting distinct market segments among notebooks. "Dragon Range" is essentially "Raphael" (5 nm chiplet + 6 nm cIOD) on a mobile-optimized BGA package, letting AMD cram up to 16 "Zen 4" cores, and take on Intel's high core-count mobile processors. The iGPU of "Dragon Range" will be basic, since designs based on this chip are expected to use discrete GPUs. "Phoenix Point" is a purpose-built mobile processor with up to 8 "Zen 4" cores, and a powerful iGPU based the RDNA3 architecture.

The Cinebench R20 score of an AMD Ryzen 7 7700X "Zen 4" processor (possibly engineering sample), was allegedly leaked to the web by "Extreme Player Hall," a video-format tech news published on Bili Bili, as discovered by 9550pro on Twitter. The 8-core/16-thread processor was shown scoring 773 points in the single-thread test, and 7701 points in the multi-threaded one. These numbers put it 25-30 percent faster than the current Ryzen 7 5800X, as pointed out by Greymon55. The multi-threaded performance of this chip is roughly on par with that of the 5900X, which means AMD is overcoming a 50% CPU core-deficit on the backs of higher IPC and memory bandwidth.

The 25% single-core performance gain over the 5800X, if extrapolated to other less-parallized workloads such as gaming, could put this processor about 5-10% ahead of the 5800X3D, and about 4-9% ahead of the Core i9-12900K. The 7700X could face an uphill task measuring up to "Raptor Lake" in multi-threaded tests, given that Intel is doubling down on its Hybrid Architecture, with more E-cores across the lineup. AMD may still have a crack at matching Raptor Lake's gaming performance with future variants that have 3DV Cache.

An alleged AMD Ryzen 5 7600X "Zen 4" engineering sample showed up on the Chinese gray market. The sample is reportedly clocked at 4.40 GHz, which is below the 4.70 GHz base frequency of the 7600X as shown in leaked specs sheets; with a rumored boost frequency of up to 5.30 GHz. It looks like 6-core/12-thread will indeed be the core-configuration for the Ryzen 5 7000 series, with which Intel hopes to take on 13th Gen Core i5 that has 6P+4E (16-thread) on the lower-end SKUs, and 6P+8E (20-thread) on the higher-end ones.

The next-generation flagship AMD GENOA EPYC CPU has recently appeared on Geekbench 5 in a dual-socket configuration for a total of 192 cores and 384 threads. The processors were installed in an unknown Suma 65GA24 motherboard running at 3.51 GHz and paired with 768 GB of DDR5 memory. This setup achieved a single-core score of 1460 and multi-core result of 96535 which places the processor approximately 17% ahead of an equivalently clocked 128 core EPYC 7763 in single-threaded performance. The Geekbench listing also includes an OPN code of 100-000000997-01 which most likely corresponds to the flagship AMD EPYC 9664 with a max TDP of 400 W according to existing leaks.

Someone with access to an AMD Ryzen 7 7700X "Zen 4" processor posted one of the first pictures of an AMD Ryzen 7 7700X "Zen 4" desktop processor installed on a motherboard. The picture shows the 7700X seated in the Socket AM5. The retention brace of the socket only clutches against two side protrusions of the IHS. AMD explained in its recent interview with us that the odd shape of the IHS is to accommodate the various electrical SMDs outside the IHS for better thermal management. With the processor installed, we can see that they're exposed and not covered up by the retention brace. The IHS is taller than the brace, so there will be some passive ventilation for the SMDs. Installing a Ryzen 7000 processor on Socket AM5 involves familiar steps to installing Intel mainstream-desktop processors for the past 15 years. This particular processor has the "D" marking on the IHS, which denotes a non-retail sample (possibly a review sample).

Today, AMD (NASDAQ: AMD) announced "together we advance_PCs," a livestream premiere to unveil next generation AMD PC products. Chair and CEO Dr. Lisa Su, CTO and EVP Mark Papermaster, and other AMD executives will present details on the latest "Zen 4" architecture that powers upcoming AMD Ryzen processors and the all new AM5 platform built around the latest technologies including DDR5 and PCIe 5.0, all designed to drive a new era of performance desktop PCs.

The show will premiere at 7 p.m. ET on Monday, August 29, on the AMD YouTube channel. A replay can be accessed a few hours after the conclusion of the event at AMD.com/Ryzen.

CORSAIR, a world leader in enthusiast components for gamers, creators, and PC builders, today announced its readiness for the new AMD Ryzen 7000 Series processors and accompanying motherboard chipsets. Featuring all new Zen 4 CPU architecture, AMD Ryzen 7000 Series chips deliver a substantial performance boost over previous-generation processors, and CORSAIR has the components to help support this generational upgrade. Those looking to build a new AMD system can take advantage of the free online CORSAIR PC Builder to help shortlist compatible parts for their new system.

CORSAIR has been working closely with AMD in the lead-up to the AMD Ryzen 7000 Series launch, and has already updated its PC Builder database to include the new processors so that you can curate a parts list for a powerful new AMD PC in minutes. The CORSAIR PC Builder takes your chosen CPU, graphics card, and motherboard and checks them for compatibility against a vast database of PC parts, coming up with a comprehensive list of CORSAIR parts guaranteed to work with your system. From a correctly sized case and appropriate fans, to a PSU rated to power your build and even RGB lighting, the CORSAIR PC Builder takes the guesswork out of building your new Ryzen 7000 Series powered PC. The CORSAIR PC Builder is even able to intelligently optimize the parts selected, so that you don't overspend or bottleneck your build with a mismatched component.

AMD has reportedly pushed market-availability date of its next-generation Ryzen 7000 series "Zen 4" desktop processors from September 15 to September 27, 2022. This would clash with the rumored product-announcement date of the Intel 13th Generation Core "Raptor Lake" processor series. If true, this is possibly a move designed to prevent Intel from sharing performance numbers of Ryzen 7000-series processors in the product-announcement presentation of "Raptor Lake," as Intel can only compare the chips it is announcing with competing AMD products that are available in the market at the time.

A September 27 market availability could still mean a late-August product announcement along the sidelines of Gamescom, with product reviews in the following weeks. It's just that the market availability date is now pushed to late-September. Intel's launch cycle for "Raptor Lake" could see a late-September announcement, but it remains to be seen if product availability is immediate, or timed weeks later. The 13th Gen Core "Raptor Lake" processor is built on the same LGA1700 package as current "Alder Lake," and compatible with existing Intel 600-series motherboards with a UEFI firmware update; although will be launched alongside new Intel 700-series chipset motherboards. AMD's Ryzen 7000-series product launch will be timed with those of compatible Socket AM5 motherboards based on the AMD 600-series chipset, and a new line of DDR5 memory modules featuring the AMD EXPO technology.