With the arrival of AMD's Ryzen 7000 series desktop processors based on the new Zen 4 architecture, the world's leading computer brand, GIGABYTE today announces its B650E and B650 motherboards ready to power these next-gen CPUs. Sporting the new AM5 socket, the AORUS B650E and B650 gaming motherboards are equipped with a direct digital power design and a full-covered cooling module to keep the circuitry cool. These AORUS motherboards come with PCIe 5.0 connectivity and support for DDR5 memory, which are AMD EXPO and Intel XMP capable of up to DDR5-6600 and beyond. The AORUS gaming motherboards are also equipped with the DIY-friendly PCIe and M.2 device fast installation and removal design, making future upgrades quick and easy.

Power delivery and thermal design have always been the top factors when it comes to CPU performance. To meet the needs of gamers looking for powerful yet stable system performance, the AORUS B650E and B650 gaming motherboards are designed with a maximum 16+2+2-phase twin digital power, covered by a massive heatsink that has four times more surface than the previous generation to ensure the smoothest power delivery even under loads. Other thermal designs, such as 8 mm mega-heatpipes and dedicated heatsinks on key components, greatly improves the system's stability and overall performance. With the friendly design of PCIe and M.2 EZ-Latch features on the AORUS B650 gaming motherboards, GIGABYTE makes components swapping a whole lot easier.

GIGABYTE Technology, (TWSE: 2376), an industry leader in high-performance servers and workstations, today announced supporting products for the new AMD AM5 platform starting with two GIGABYTE motherboards, MC13-LE0 & MC13-LE1, that pair a consumer CPU with IPMI management functionalities via BMC. Additionally, a new desktop workstation, W332-Z00, was released using the same motherboard series platform that supports remote management, but the W332 does so with a Realtek NIC that enables DASH.

The new GIGABYTE products designed to support host systems are deceivingly powerful with a small micro-ATX form factor motherboard and enterprise rich out-of-band management features on top of PCIe Gen 5 and DDR5 technologies. These new client friendly products will be found in office settings under a desk rather than a rack in a data center, as they be managed from anywhere, provided there is a network connection. Furthermore, these new products are purpose built for the mainstream AMD B650E chipset with AMD Zen 4 architecture for AMD Ryzen 7000 Series desktop processors.

An alleged AMD client product roadmap slide leaked to the web confirms the Ryzen 7000X3D series. This also builds on a confirmation by Robert Hallock that 3DV Cache technology remains a continued part of the company's client processor roadmap. The 3DV Cache tech played in instrumental role in shoring up gaming performance of AMD's previous-generation "Zen 3" microarchitecture to levels matching or exceeding those of the Intel "Alder Lake," with a performance uplift in the range of 10 to 25 percent. The expectations for 3DV Cache to work a similar miracle with "Zen 4" are set rather high.

While "Zen 4" has achieved gaming performance parity with "Alder Lake," Intel's next-generation "Raptor Lake" is right around the corner, with the company claiming 10-15% single-threaded performance uplifts that should restore the its gaming performance leadership over AMD. The alleged AMD roadmap does not specify when exactly the Ryzen 7000X3D comes out, but is part of the block that spans Q3-2022, deep into 2023. Rumors are abuzz that the company could unveil the 7000X3D in the first half of 2023.

The popular PlayStation 3 emulator for PCs, RPCS3, just received a major update that lets it take advantage of the AVX-512 instruction-set on processors based on the AMD Zen 4 microarchitecture (the recently launched Ryzen 7000 series). RPCS3 emulates the PS3's CELL Broadband Engine SoC entirely on CPU, and does not use your GPU to draw any raster graphics. To emulate both a CPU and GPU of that time entirely on a multi-threaded CPU of today is no easy task, but is helped greatly by leveraging the latest instruction-sets. RPCS3 supports an AVX-512 code-path on Intel processors such as the Core i9-11900K "Rocket Lake," but the company has been fidgeting with AVX-512 support on its client processors since 12th Gen "Alder Lake." The developer of RPCS3 in a tweet confirmed that they have enabled AVX-512 support for AMD Zen 4 with the latest build.

The world-records set by those with access to AMD Ryzen 9 7950X "Zen 4" 16-core/32-thread processors, keep tumbling in. The latest such is a Cinebench R23 nT score of a stunning 50395 points. This was achieved with a 6.70 GHz overclock under extreme cooling using an LN2 evaporator. Another feat from the same source sees a 6.45 GHz all-core overclock under extreme cooling, which yields an impressive 48235 points in the same test. Both feats come from Sampson, who's been leading HWBot charts under the AMD Overclocking team.

The highest known/leaked Cinebench R23 score yielded with a Core i9-13900K "Raptor Lake" sample so far, is 40616 points, although serious official OC feats with the processor are yet to start. The Intel chip is already in the news for an 8 GHz frequency record. Any attempt to take the crown from the 7950X will involve pushing the 8 P-cores to insane frequencies, but then it will boil down to the 16 E-cores, and just how far those can be pushed. The highest post-launch CB R23 score obtained on a current-gen i9-12900K is 26299, and for the 5950X this is 26291.

The first reliable benchmark figures of AMD's Ryzen 7000-series CPUs have arrived, courtesy of SiSoftware. The benchmark suite software developer has released benchmark figures for the Ryzen 5 7600X and Ryzen 9 7950X. Keep in mind that these benchmarks are limited to the different tests in SiSoftware Sandra. Also note that the graphs for the Ryzen 5 7600X have typos, as the SiSoftware wrote Ryzen 5 7760X instead of 7600X and the Core i5-12600K is listed as a Core i7 CPU. Starting with the 7600X, the CPU appears to perform similar to, or slightly slower than the Intel Core i5-12600K in the arithmetic tests. On the other hand, it handily crushes the older Ryzen 5 5600X in every test here, by somewhere between 17 and 36 percent depending on the test.

Moving on to the vector SIMD tests, AMD's Zen 4 architecture shows much greater performance improvements, beating the Intel Core i5-12600K in all but one of the tests, where it loses by a fairly small margin. Here it beats the Ryzen 5 5600X by anything from 28 to a massive 86 percent. Where AMD's Zen 4 architecture really kicks things up a notch is in the image processing test, at least compared to the Zen 3 architecture, thanks to its AVX512 capabilities. As such, it's over twice as fast in many of the tests, but it still loses out in half of the tests to Intel's Core i5-12600K. AMD has also improved the inter-thread/core latency in the same module, by a not insignificant amount. Where the Ryzen 5 7600X doesn't fare so well is when it comes to performance vs. power, largely due to the fact that AMD moved the TDP from 65 to 105 W, but it still offers better performance per Watt than Intel's current models.

Update 17:31 UTC: Updated with the Ryzen 7 7700X results.

It's game on for clock-speed records, as some of the first ones are being set with the AMD Ryzen 9 7950X "Zen 4" processors. The first such feat is an absolute clock-speed record of 7.25 GHz (7247 MHz), set without disabling any cores. This is probably the highest clock achieved on a single core for "Zen 4," set using a multiplier value of 72.5x, and a scorching 1.506 V juice. The second feat is even more impressive, even though it's a lower-clock speed in absolute terms. The 7950X was overclocked to 6.50 GHz across all cores (that's all 16 of its cores). This was set using a core voltage of 1.465 V. In both feats, extreme cooling solutions such as liquid-nitrogen evaporators were used, and this only the first round of OC feats with these chips. Interesting times ahead for 7950X vs. i9-13900K overclocking and benchmark feats. The 6.50 GHz all-core OC in particular could pose a formidable challenge to the i9-13900K, which can sustain its maximum (5 GHz+) all-core OC clocks only on its 8 P-cores.

Noctua today confirmed that all its CPU coolers and mounting-kits that support AMD AM4 also support the upcoming AM5 socket, except the NH-L9a-AM4 low-profile cooler and the NM-AM4-L9aL9i mounting-kit. For the latter, Noctua announced the new NM-AM5-L9aL9i kit that will be available free-of-charge from end of October. Mounting upgrade kits for older heatsink models that do not yet support AM4 will also be provided to customers at no additional cost.

"We have offered free-of-charge mounting upgrade kits to our customers ever since AMD introduced AM2 in 2006, and we're proudly continuing this tradition with the upcoming Ryzen 7000 series processors and their new AM5 socket", says Roland Mossig (Noctua CEO). "While all our current multi-socket coolers already support AM5 out of the box and don't require any updates, customers will be able to upgrade the NH-L9a as well as most older coolers at no additional cost, so even 15-year-old coolers can be used on the latest processors!"

TechPowerUp released the latest version of TechPowerUp GPU-Z, the popular graphics information and diagnostics utility for gamers and PC enthusiasts. Version 2.49.0 adds support for the iGPU of the upcoming Ryzen 7000-series "Zen 4" desktop processors, codenamed "Raphael." CPU temperature monitoring for these processors works the same way as it does for older Ryzens, so no changes needed in that regard. The GPU model reporting for Intel Arc A750/A770 has been fixed. Support is added for the Intel Arc A580. Some rare application crashes with AMD Radeon cards have been fixed. The NVIDIA DLSS game scan we introduced with the previous version doesn't actually "use" DLSS in any way, it only scans for games supporting DLSS, so we made it available on all systems.

DOWNLOAD: TechPowerUp GPU-Z 2.49.0

Ahead of its September 27 market availability, AMD Ryzen 9 7950X "Zen 4" has already hit the gray-markets in China. Some retailers in Europe even started listing them. Chinese online gray-markets (peer to peer commerce) sites, list the 7950X at RMB ¥5,999 (around USD $850). None of these listings show a box, so it's likely that the sellers bought a tray of these chips in the OEM or SI channels, and is selling them off piecemeal. OEM-only AMD SKUs usually land in the retail channel this way. Over in Europe, French retailer Cdiscount has the 7950X listed at 1,099€ including taxes ($1,102). The store also lists the 7900X at 749€ ($751), the 7700X at 589€ ($591), and the 7600X at 409€ ($410).

An AMD Ryzen 9 7900X 12-core/24-thread processor sample was put through CPU-Z Bench, the internal benchmark of the app. The chip boosted up to 5.20 GHz in the test, and ran at temperatures as high as 86°C, as reported by CPU-Z. It scored 766 points in the single-threaded test, and 11882 points in the multi-threaded one. The single-threaded numbers in particular are interesting. 766 points would put the 7900X behind the Core i7-12700K and its "Golden Cove" P-core by around 3%. In the multi-threaded test, however, the 7900X, with its 11822 points, is in the league of the next-generation Core i7-13700K (8P+8E) processor, which was recently spotted scoring 11877 points with a 6.20 GHz overclock. The 7900X will hence be pushed as a superior alternative to the i7-13700K for productivity and creator tasks, whereas its single-threaded score ensures that it falls behind the i7-13700K in gaming by a fair bit.

OneRaichu, who has access to engineering samples of both the AMD "Raphael" Ryzen 7000-series, and Intel 13th Gen Core "Raptor Lake," performed IPC comparisons between the two, by disabling E-cores on the "Raptor Lake," fixing the clock speeds of both chips to 3.60 GHz, and testing them across a variety of DDR5 memory configurations. The IPC testing was done with SPEC, a mostly enterprise-relevant benchmark, but one that could prove useful in tracing where the moderately-clocked enterprise processors such as EPYC "Genoa" and Xeon Scalable "Sapphire Rapids" land in the performance charts. OneRaichu also threw in scores obtained from a 12th Gen Core "Alder Lake" processor for this reason, as its "Golden Cove" P-core powers "Sapphire Rapids" (albeit with more L2 cache).

With DDR5-4800 memory, and testing on SPECCPU2017 Rate 1, at 3.60 GHz, the AMD "Zen 4" core ends up with the highest scores in SPECint, topping even the "Raptor Cove" P-core. It scores 6.66, compared to 6.63 total of the "Raptor Cove," and 6.52 of the "Golden Cove." In the SPECfp tests, however, the "Zen 4" core falls beind "Raptor Cove." Here, scores a 9.99 total compared to 9.91 of the "Golden Cove," and 10.21 of the "Raptor Cove." Things get interesting at DDR5-6000, a frequency AMD considers its "sweetspot," The 13th Gen "Raptor Cove" P-core tops SPECint at 6.81, compared to 6.77 of the "Zen 4," and 6.71 of "Golden Cove." SPECfp sees the "Zen 4" fall behind even the "Golden Cove" at 10.04, compared to 10.20 of the "Golden Cove," and 10.46 of "Raptor Cove."

With Intel's 13th Gen Core "Raptor Lake" facing stiff competition from AMD's Ryzen 7000 series, and the "Zen 4" series being augmented with 7000X3D series in early-2023, it's becoming a foregone conclusion that Intel will launch a possible "Core i9-13900KS" SKU, which is on its way to being the world's first desktop processor that can boost up to the 6.00 GHz mark. The processor should be able to boost its 8 "Raptor Cove" P-cores to the 6.00 GHz mark, given that the maximum boost frequency of the stock i9-13900K is already rumored to be at 5.70 GHz.

At its Tech Tour event in Israel, Intel confirmed that "Raptor Lake" brings a 15% single-threaded, and 41% multi-threaded performance gain over "Alder Lake." The single-threaded gain is from the higher IPC of the "Raptor Cove" P-core, coupled with its frequency set as high as 5.70 GHz; whereas the multi-threaded performance gain is a combination of increased IPC of the P-cores, and increased frequencies for both the P-cores and E-cores. The E-core clusters get more shared L2 cache, which should improve their performance, too.

AMD Ryzen 5 7600X "Zen 4" 6-core/12-thread processor is shaping up to be a speed-demon for purely gaming builds, with the company claiming higher gaming performance than Intel current flagship Core i9-12900K. A combination of high clock speeds (4.70 GHz nominal, 5.30 GHz max boost), high power limits from 105 W TDP (130 W limit), the "Zen 4" IPC, and the fact that all that power headroom is available to just 6 cores, means that the chip is able to sustain boost frequencies better. But what when Core Performance Boost (CPB) is disabled? VideoCardz scored screenshots of a Cinebench R23 run to answer just that.

With CPB disabled (in the motherboard BIOS), the Ryzen 5 7600X scores 1681 points in the single-threaded test, and 13003 points in the multi-threaded one. With CPB enabled (which is the default setting), the 7600X bags 1920 points single-threaded, and 14767 points multi-threaded, which is a 14% performance increase just from the processor's boosting algo. Disabling CPB is generally seen as a silver-bullet against high temperatures for AMD processors, and even here, we see the chip running under 60°C, and pulling 60.2 W peak, as measured by HWinfo; whereas with CPB enabled, the chip can run as hot as 92.1°C, pulling up to 110 W, pushing clock speeds up to 4.45 GHz.

Starting next year, AMD will move to a new model number scheme for its mobile processors and it appears that the company has decided to use the first digit to represent the model year, which should alleviate some past confusion. The second digit in the model name will represent where in the product stack the specific chip will sit and here we're potentially getting some new 6 and 8 models, although nothing guarantees that AMD will actually implement these segments into real products. The third digit represents the architecture, so a four equals Zen 4 for example.

The last digit in the model names is a new addition where AMD has sub SKUs that offer some performance advantage of the base SKU of a specific model and this digit will apparently only be represented by a 0 or a 5. Finally AMD has added a new suffix too, where C stands for Chromebook. This translates to 15-28 Watt chips that have been designed specifically for Chromebook usage. The current HX, HS and U suffix lettering will carry over, alongside the lower-case e for 9 W versions the U SKUs. AMD has also segmented it's mobile CPUs according to the chart below, to try and deliver a clearer use case for its various CPU models. The chart is pretty self explanatory, although some of the segmentation will apply to updated models of current designs, whereas others will only apply to new laptop designs. The new model numbering scheme will apply to at least 2025.

AMD Ryzen 7000 "Zen 4" processors can hit up to 95 °C at stock settings, with cooling most appropriate to the TDP level. This is because the PPT (package power tracking) limits for the 170 W TDP processors is as high as 230 W, and for the 105 W TDP models, it's 130 W. After reaching this temperature threshold, the processor begins to downclock itself to lower temperatures. Harukaze5719 discovered that higher than needed core voltages could be at play, and manually undervolting the processors could free up significant thermal headroom, letting the processors hold on to higher boost multipliers better.

With its recent announcement of the Ryzen 7000 desktop processors, the action now shifts to the server, with AMD preparing a wide launch of its EPYC "Genoa" and "Bergamo" processors this year. Powered by the "Zen 4" microarchitecture, and contemporary I/O that includes PCI-Express Gen 5, CXL, and DDR5, these processors dial the CPU core-counts per socket up to 96 in case of "Genoa," and up to 128 in case of "Bergamo." The EPYC "Genoa" series represents the main trunk of the company's server processor lineup, with various internal configurations targeting specific use-cases.

The 96 cores are spread twelve 5 nm 8-core CCDs, each with a high-bandwidth Infinity Fabric path to the sIOD (server I/O die), which is very likely built on the 6 nm node. Lower core-count models can be built either by lowering the CCD count (ensuring more cores/CCD), or by reducing the number of cores/CCD and keeping the CCD-count constant, to yield more bandwidth/core. The leaked product-stack table below shows several of these sub-classes of "Genoa" and "Bergamo," classified by use-cases. The leaked slide also details the nomenclature AMD is using with its new processors. The leaked roadmap also mentions the upcoming "Genoa-X" processor for HPC and cloud-compute uses, which features the 3D Vertical Cache technology.

AMD in its Discord AMA confirmed DDR5-6000 to be the "sweetspot" memory overclock for its upcoming Ryzen 7000 "Zen 4" processors. A sweetspot frequency in AMD jargon is an inflection of performance, stability, cost, and ease. For the very first Ryzen, this was DDR4-3200. For Ryzen 2000, it was DDR4-3400. For the Ryzen 3000 "Zen 2," it climbed to DDR4-3800, the Ryzen 5000 "Zen 3" it was DDR4-4000.

At the architectural-level, it is usually the highest frequency where FClk, UClk, and MClk maintain a 1:1:1 ratio, before having to engage dividers that impact performance, making it a point of diminishing returns for investing in faster memory modules. AMD's Robert Hallock, leading the Discord AMA, recommended that FClk be left untouched at "Auto" for the best results, and overclockers look for an Auto:1:1 ratio for the FClk, UClk, and MClk. As with both AMD and Intel now, the highest frequencies are possible only with one single-rank DIMM per memory channel (1DPC), and memory overclocking yield lower results with dual-rank DIMMs, or two DIMMs per memory channel. Among the AMD EXPO-certified DIMMs announced over the past few days, some do engage memory clocks beyond DDR5-6000. It would be interesting to see how they affect the "golden ratio" for Zen 4.

We already know that AMD is working on a variant of the "Zen 4" CPU complex die (CCD) featuring 3D Vertical Cache (3DV-cache) memory, through company roadmaps, and AMD even confirmed to us that the technology continues to be a part of the client roadmap of the company. We're now getting news that the first Ryzen 7000X3D ("Zen 4" with 3DV cache) processors could be unveiled by the 2023 International CES (January next year). It appears like while the conventional Ryzen 7000 series beats the 12th Gen Core "Alder Lake" at gaming, it might trade blows with the 13th Gen "Raptor Lake," and AMD will count on the 3DV cache technology to give it a competitive edge.

Greymon55, a reliable source with AMD leaks, hints at the possibility of three 7000X3D-series SKUs: the Ryzen 7 7800X3D (8-core/16-thread) positioned above the 7700X; the Ryzen 9 7900X3D (12-core/24-thread), and the Ryzen 9 7950X3D (16-core/32-thread). Older reports suggest the 3DV cache on these processors will be a generation more advanced to keep sync with the on-die L3 cache of the "Zen 4" CCD, and the L3D (the die on which the 3DV cache is located), will likely be built on the 6 nm process.

An AMD Ryzen 9 7950X "Zen 4" 16-core/32-thread processor was put through the Geekbench 5.4.5 benchmark, and it's becoming all too clear that AMD has a highly competitive product on its hands. The 7950X yielded a single-threaded score of 2217 points, and 24396 points in the multi-threaded tests. With these scores, the 7950X is about 14% faster than the "Golden Cove" P-cores of the i9-12900K "Alder Lake" processor in the single-threaded tests, and comes out as being 41% faster than it in the multi-threaded test. Against the leaked i9-13900K "Raptor Lake," the 7950X is shown being about 4% slower in the single-threaded test (against the "Raptor Cove" P-cores); and about 7.8% slower in the multi-threaded test.

AMD CEO Lisa Su, who has supervised the company's rise from the ashes, looked to assuage fears of reduced stock for the launch of AMD's next-gen Ryzen 7000 series CPUs. Hardware enthusiasts being understandably burned from the last generation of GPU and CPU's lack of availability (and ensuing scalping practices), the CEO in today's announcement of the Ryzen 7000 series carried a promise: "It is true that if you look at the past 18 months there have been a number of things, whether its capacity limitations or logistics," she said. "From an AMD standpoint, we have dramatically increased our overall capacity, in terms of wafers, as well as substrates and on the back end. So with our launch of Zen 4 we don't expect any supply constraints."

AMD's Zen 4 family is being launched with the new AM5 socket, which AMD says will live through 2025+ for subsequent CPU releases. The company has managed to increase IPC by 13% while decreasing the overall CCD size by 18% compared to that of Zen 3 (reducing the area/cost impact of adding integrated graphics throughout the lineup). Frequencies have gone up to a maximum 5.7 GHz thanks to smart circuitry redesign and TSMC's 5 nm node. AMD says its Ryzen 7000 can thus be expected to provide up to 29% higher single-core and 45% higher multi-core performance. Of course, with macroeconomics being what they are, and recent reports on lack of low-price chips throughout the market, it's not only the availability of Ryzen 7000 CPUs that matters: AM5 motherboards and DDR5 memory chip stocks have to be taken into account as well. But all in all, AMD seems to be prepared for a successful and quantity-adequate launch.

The latest version 2.02 of CPU-Z adds support for a handful unreleased Ryzen 7000 series "Zen 4" processors. These include "non-X" SKUs, namely the Ryzen 9 7950, and Ryzen 9 7900. Keeping up with past trends, these are possibly 65 W TDP variants of the 7900X and 7950X to be released only in the OEM market, and will make it to pre-built desktops. In the past, OEM processors by AMD have found their way to brick-and-mortar retail stores, where they're sold off the tray. The retailers get these chips from AMD by claiming to be SI (system integrators). They tend to bundle these with motherboards, memory kits, and SSDs. AMD in its announcement presentation for the Ryzen 7000 underscored the extreme levels of efficiency "Zen 4" exhibits in chips with 65 W power limits. Single-threaded or lightly threaded performance is mostly unaffected, but heavy multi-threaded workloads could see lower performance in comparison to the retail "X" chips.

AMD in its Ryzen 7000 series launch event shared its near-future CPU architecture roadmap, in which it confirmed that the "Zen 4" microarchitecture, currently on the 5 nm foundry node, will see an optical-shrink to the 4 nm process in the near future. This doesn't necessarily indicate a new-generation CCD (CPU complex die) on 4 nm, it could even be a monolithic mobile SoC on 4 nm, or perhaps even "Zen 4c" (high core-count, low clock-speed, for cloud-compute); but it doesn't rule out the possibility of a 4 nm CCD that the company can use across both its enterprise and client processors.

The last time AMD hyphenated two foundry nodes for a single generation of the "Zen" architecture, was with the original (first-generation) "Zen," which debuted on the 14 nm node, but was optically shrunk and refined on the 12 nm node, with the company designating the evolution as "Zen+." The Ryzen 7000-series desktop processors, as well as the upcoming EPYC "Genoa" server processors, will ship with 5 nm CCDs, with AMD ticking it off in its roadmap. Chronologically placed next to it are "Zen 4" with 3D Vertical Cache (3DV Cache), and the "Zen 4c." The company is planning "Zen 4" with 3DV Cache both for its server- and desktop segments. Further down the roadmap, as we approach 2024, we see the company debut the future "Zen 5" architecture on the same 4 nm node, evolving into 3 nm on certain variants.

AMD in its Ryzen 7000 launch event teased its next-generation Radeon graphics card based on the RDNA3 graphics architecture. Built on an advanced process node just like "Zen 4," AMD is hoping to repeat the magic of the RX 6000 series, by achieving a 50% performance-per-Watt gain over the previous generation. which allows it either to build some really efficient GPUs, or consume the power headroom to offer significantly higher performance at power levels similar as the current-gen.

AMD's teaser included a brief look at the air-cooled RDNA3 flagship reference-design, and it looks stunning. The company showed off a live demo of the card playing "Lies of P," a AAA gaming title that made waves at Gamescom for its visuals. The game was shown playing on an RDNA3 graphics card running on a machine with a Ryzen 9 7950X processor at 4K, with extreme settings. AMD CEO Dr Lisa Su confirmed a 2022 launch for RDNA3.

AMD today announced the Ryzen 7000 series "Zen 4" desktop processors. These debut the company's new "Zen 4" architecture to the market, increasing IPC, performance, with new-generation I/O such as DDR5 and PCI-Express Gen 5. AMD hasn't increased core-counts over the previous-generation, the Ryzen 5 series is still 6-core/12-thread, the Ryzen 7 8-core/16-thread, and Ryzen 9 either 12-core/24-thread, or 16-core/32-thread; but these are all P-cores. AMD is claiming a 13% IPC uplift generation over generation, which coupled with faster DDR5 memory, and CPU clock speeds of up to 5.70 GHz, give the Ryzen 7000-series processor an up to 29% single-core performance gain over the Ryzen 5000 "Zen 3."

At their press event, AMD showed us an up to 35% increase in gaming performance over the previous-generation, and an up to 45% increase in creator performance (which is where it gets the confidence to stick to its core-counts from). The "Zen 4" CPU core dies (CCDs) are built on the TSMC 5 nm EUV (N5) node. Even the I/O die sees a transition to 6 nm (N6), from 12 nm. The switch to 5 nm gives "Zen 4" 62 percent lower power for the same performance, or 49% more performance for the same power. versus the Ryzen 5000 series on 7 nm. The "Zen 4" core along with its dedicated L2 cache is 50% smaller, and 47% more energy efficient than the "Golden Cove" P-core of "Alder Lake."