ASRock Rack, the leading innovative server company, today announced its support of 4th Gen AMD EPYC processors with AMD "Zen 4c" architecture and 4th Gen AMD EPYC processors with AMD 3D V-Cache technology, as well as the expansion of their new products ranging from high-density storage, GPU, multi-nodes servers all for the new AMD processors.

"4th Gen AMD EPYC processors offer the highest core density of any x86 processor in the world and will deliver outstanding performance and efficiency for cloud-native workloads," said Lynn Comp, corporate vice president, Server Product and Technology Marketing, AMD. "Our latest family of data center processors allow customers to balance workload growth and flexibility with critical infrastructure consolidation mandates, enabling our customers to do more work, with more energy efficiency at a time when cloud native computing is transforming the data center."

Giga Computing, a subsidiary of GIGABYTE and an industry leader in high-performance servers, server motherboards, and workstations, today announced support for the latest 4th Gen AMD EPYC processors. The new processors, based on "Zen 4c" architecture and featuring AMD 3D V-Cache technology, enhance Giga Computing's enterprise solutions, enabling superior performance and scalability for cloud native computing and technical computing applications in GIGABYTE enterprise solutions. To date, more than thirty unique GIGABYTE systems and platforms support the latest generation of AMD EPYC 9004 processors. As time goes on Giga Computing will roll out more new GIGABYTE models for this platform, including more SKUs for immersion-ready servers and direct liquid cooling systems.

"For every new generation of AMD EPYC processors, GIGABYTE has been there, offering diverse platform options for all workloads and users," said Vincent Wang, Sales VP at Giga Computing. "And with the recent announcement of new AMD EPYC 9004 processors for technical computing and cloud native computing, we are also ready to support them at this time on our current AMD EPYC 9004 Series platforms."

Today, at the "Data Center and AI Technology Premiere," AMD announced the addition of two new, workload optimized processors to the 4th Gen EPYC CPU portfolio. By leveraging the new "Zen 4c" core architecture, the AMD EPYC 97X4 cloud native-optimized data center CPUs further extend the EPYC 9004 Series of processors to deliver the thread density and scale needed for leadership cloud native computing. Additionally, AMD announced the 4th Gen AMD EPYC processors with AMD 3D V-Cache technology, ideally suited for the most demanding technical computing workloads.

"In an era of workload optimized compute, our new CPUs is pushing the boundaries of what is possible in the data center, delivering new levels of performance, efficiency, and scalability," said Forrest Norrod, executive vice president and general manager, Data Center Solutions Business Group, AMD. "We closely align our product roadmap to our customers' unique environments and each offering in the 4th Gen AMD EPYC family of processors is tailored to deliver compelling and leadership performance in general purpose, cloud native or technical computing workloads."

AMD today announced its Ryzen PRO 7040 line of processors for the all-important commercial notebook segment. A commercial notebook is a class of notebook that are purchased in large quantities by businesses or government organizations, to be handed out to their employees. The key distinction from consumer notebooks is their in-built security and remote-management features that let the organization remotely handle user credentials, securely store company data, and remotely deploy software updates. Most importantly, the organization maintains ownership over the device and can remotely de-activate it at whim. This is a particularly important market segment for both AMD and Intel (which sells 13th Gen Core vPro processors). AMD's launch today includes Ryzen PRO 7040 series mobile processors for both the 15 W to 28 W ultraportable, and 35 W to 55 W thin-and-light (mainstream) commercial notebook form-factors.

At the heart of the Ryzen PRO 7040 series processors is the 4 nm "Phoenix" silicon, which combines the "Zen 4" microarchitecture for the CPU, with RDNA3 graphics architecture for the iGPU, and introduces the Ryzen AI on-die accelerator based on the Xilinx-designed XDNA architecture, to the commercial notebook segment. The silicon physically features an 8-core/16-thread "Zen 4" CPU, with several processor models boosting to the 5.00 GHz-mark. Each core has 1 MB of dedicated L2 cache, and the eight cores share a 16 MB L3 cache. The iGPU meets full DirectX 12 Ultimate logo requirements, and features 12 RDNA3 compute units, which work out to 768 dual issue-rate stream processors, 24 AI Accelerators (intrinsic to RDNA3 and not related to Ryzen AI); and 12 Ray Accelerators, besides 48 TMUs and industry-leading 32 ROPs. AMD is backing the iGPU on these processors with AMD Software PRO (the same class of drivers as Radeon PRO GPUs), which come with superior support from AMD, and special packages for remote deployment by organizations.

In addition to the Ryzen PRO 7045 series mobile processors for commercial notebooks, AMD announced the Ryzen PRO 7000 processors for commercial desktops. These are desktops deployed by medium-large businesses and enterprises in their offices, which remain connected to the enterprise network at all times, and require remote management and security features. This particular segment is addressed by Intel using its 13th Gen Core vPro processors. The Ryzen PRO 7000 processors are based on the Socket AM5 platform, which is ready for next-generation connectivity. AMD is also introducing a new motherboard chipset to go with these processors, although they are compatible with consumer AMD 600-series chipset motherboards.

The Ryzen PRO 7000 series processor models being launched today are based on the "Raphael" MCM, which depending on the model, comes with one or two 5 nm "Zen 4" CCDs, and a 6 nm I/O die. What makes these processors especially formidable compared to past attempts by AMD at commercial desktop processors, is that while the previous-generation chips were based on monolithic APU dies for their integrated graphics; these chips are based on the full-featured MCM for this generation, with integrated graphics as standard. AMD's decision to make integrated graphics standard should prove particularly helpful for adoption in the commercial desktop space.

CPUID recently released version 2.06 of the globally popular free CPU-Z utility which includes updates to support reporting of a variety of recent or obscure CPU and GPU models. Intel's "Alder Lake-N", AMD's recently released "Dragon Range" mobile Zen 4 processors, Zhoaxin's KH-40000 and KX-6000G, and of course NVIDIA's RTX 4060 Ti as well as AMD's RX 7600. Most interesting of all is a small addition down at the very bottom of the list, "Preliminary support for AMD Storm Peak platform." "Storm Peak" is AMD's yet to be announced Ryzen Threadripper 7000 series which will feature "Zen 4" and hopefully heat up competition in the HEDT market. No detailed specifications or information on SKUs have been released yet with "Storm Peak" expected to receive a proper announcement sometime in Q3 2023. The mention on CPU-Z suggests that the platform is nearing market readiness, and possibly that the folks at CPUID have been seeded samples or specifications to prepare with. Threadripper 7000 is expected to be released on yet another new socket, TR5, and has been rumored to be coming in both HEDT and workstation variants.

Intel brought competition to the HEDT market for the first time in nearly 4 years with the release of their Sapphire Rapids Xeon W range of processors back in February. Xeon W features unlocked SKUs tackling AMD's Threadripper 5000 series from top to bottom; going as high as the 56-core Xeon w9-3495X at a blistering $5,889 USD to as low as ~$1,000 USD for the 12-core Xeon w5-2455X. Intel also interspersed some lower cost locked SKUs to allow system integrators to offer the new platform as workstations to the prosumer market that generally cares little about overclocking. With Intel competing directly with Threadripper again it was expected that it wouldn't be long before AMD would be cooking up a response with their latest and greatest.

AMD Ryzen 9 7900X3D, the 12-core/24-thread Socket AM5 processor that's been playing middle-child to the popular 8-core 7800X3D and 16-core 7950X3D flagship, just got a major retailer price-cut. It can now be had for as low as $499, down from its launch price of $599. The chip could be briefly available last month at $549. The $499 price is available on Newegg, where the chip is listed at $589.99, but with the promo-code "MDSCS2343," that shaves $90 off, you arrive at $499. The Ryzen 9 7900X3D is a 12-core/24-thread processor featuring 3D Vertical Cache technology on one of its two CCDs. The processor hence has 128 MB of L3 cache, besides 1 MB of dedicated L2 cache per core.

AMD's cheapest Zen 4 X3D processor is shaping up to be its most popular. Sales numbers from Germany's Mindfactory posted by TechEpiphany seemingly shows the recently launched Ryzen 7 7800X3D outselling last year's Ryzen 7 5800X3D nearly 2:1, with 4,720 7800X3Ds selling to the 5800X3D's 2,510 over a few week period. While these figures show sales for only a single region, evidence for this momentum is reflected in other regional retailers as well as some global outlets. On Amazon, for example, the 7800X3D has made a frequent appearance on the top 10 best selling CPUs list, with the rest of the Zen 4 lineup trailing well behind. Newegg reports the 7800X3D to be among the top 5 best selling CPUs on the site at time of writing. Microcenter also shows the 7800X3D and 5800X3D side-by-side in seventh and eighth places respectively for popularity.

Despite recent troubles with the AM5 platform and Zen 4 X3D processors, the Ryzen 7 7800X3D is proving to be quite a success for AMD. The 7800X3D in our review was shown to be one of the most efficient processors we've ever tested, and offered gaming performance at or near the top of the charts across the gauntlet of games and resolutions thrown at it. The staggered release of the 7000X3D lineup, with the 7950X3D and 7900X3D launching first and the 7800X3D launching later, gave early signals that AMD knew what they had and wanted to push as many early adopters away from the better value chip as they could. Pricing for the Ryzen 7 7800X3D has been steady since it released, however we've already seen retailers offering discounts on the Ryzen 9 7950X3D and Ryzen 9 7900X3D, as they presumably struggle to sell as well as the more aggressively positioned 7800X3D.

The AMD Ryzen 7 7700X has been discounted down to $294.99 in the US, which actually makes it less expensive than the Ryzen 7 7700 (non-X). Since it launched at $399.99 and later pushed down to $329.99, the latest discount makes it quite a catch. In Europe, the price is still holding at around €320, depending on the region, although it has been seen at €309 earlier.

The AMD Ryzen 7 7700X is an 8-core/16-thread Zen 4 CPU with 40 MB of cache and a 105 W TDP. It works at 4.5 GHz base and 5.4 GHz Turbo clocks. As spotted by Videocardz, the discount was available on both Amazon and Newegg but the one on Amazon has either been removed or ended and now holds at $339. It is possible that it was a limited deal coming directly from AMD. The next step is the Ryzen 7 7800X3D, but the price has not budged from $449.

Just a few hours before the official launch, ASUS ROG Ally handheld console has been leaked online in Europe, where German retailers, Mediamarkt and Saturn, have it listed for €799.99. This is the price of the high-end model equipped with AMD Ryzen Z1 Extreme APU and 512 GB of internal storage. So far, there is no listing for the less expensive version that should come with the Z1 non-Extreme APU.

The listing does not offer any new details, but it does say that it will ship on June 13th, so this can be considered as a pre-order. In case you missed it, the ASUS ROG Ally RC71L will pack the AMD Ryzen Z1 Extreme APU, featuring 8-core/16-thread Zen 4 CPU and RDNA 3 GPU with 12 Compute Units. The less expensive one, will get the Ryzen Z1 APU, packing a 6-core/12-thread Zen 4 CPU and RDNA 3 GPU with only 4 Compute Units. Both versions will feature a 7-inch 120 Hz screen with 1920x1080 resolution. As detailed earlier, the ASUS ROG Ally will ship with the Windows 11 OS and 90 days of free Xbox PC Game Pass Ultimate membership.

AMD today released its Ryzen 7040U series "Zen 4" mobile processors for the Ultraportable segment. These are processors with a 15 W TDP that's configurable up to 30 W by notebook designers to enable better boost frequency residency. AMD technically announced its entire Ryzen 7040 series at the 2023 International CES, but put out details for only the 7040HS series with a 28 W to 45 W TDP targeting thin-and-light and mainstream notebook form-factors. This would be the first time we're seeing details of the 7040U series. The company announced that processors in the 7040U series are shipping to notebook manufacturers, but it did not put out a specific date on which you can buy notebooks powered by these processors.

The Ryzen 7040U series consists of four processor models (SKUs). The lineup is led by the Ryzen 7 7840U, followed by the Ryzen 5 7640U, the Ryzen 5 7540U, and has the Ryzen 3 7440U at the entry level. All four processor models offer the latest "Zen 4" CPU cores and RDNA3 graphics. The Ryzen 7 7840U packs an 8-core/16-thread CPU clocked at 3.30 GHz with up to 5.10 GHz boost frequency. The Ryzen 5 7640U has a 6-core/12-thread CPU clocked at 3.50 GHz with up to 4.90 GHz boost. The Ryzen 5 7540U differs from the 7640U not just in slightly lower CPU clock speeds—3.20 GHz with up to 4.90 GHz boost—but also the lack of the XDNA Ryzen AI feature. The Ryzen 3 7440U has a leaner CPU still, with just 4-core/8-thread, clocked at 3.00 GHz with up to 4.70 GHz boost, half the shared L3 cache size of the other three models, and a lack of Ryzen AI.

Researchers at the Technical University of Berlin have published a paper called "faulTPM: Exposing AMD fTPMs' Deepest Secrets," highlighting AMD's firmware-based Trusted Platform Module (TPM) is susceptible to the new exploit targeting Zen 2 and Zen 3 processors. The faulTPM attack against AMD fTPMs involves utilizing the AMD secure processor's (SP) vulnerability to voltage fault injection attacks. This allows the attacker to extract a chip-unique secret from the targeted CPU, which is then used to derive the storage and integrity keys protecting the fTPM's non-volatile data stored on the BIOS flash chip. The attack consists of a manual parameter determination phase and a brute-force search for a final delay parameter. The first step requires around 30 minutes of manual attention, but it can potentially be automated. The second phase consists of repeated attack attempts to search for the last-to-be-determined parameter and execute the attack's payload.

Once these steps are completed, the attacker can extract any cryptographic material stored or sealed by the fTPM regardless of authentication mechanisms, such as Platform Configuration Register (PCR) validation or passphrases with anti-hammering protection. Interestingly, BitLocker uses TPM as a security measure, and faulTPM compromises the system. Researchers suggested that Zen 2 and Zen 3 CPUs are vulnerable, while Zen 4 wasn't mentioned. The attack requires several hours of physical access, so remote vulnerabilities are not a problem. Below, you can see the $200 system used for this attack and an illustration of the physical connections necessary.

ASUS ROG Ally, the company's handheld game console that started out as an April Fool's joke before being announced as a serious product development and ASUS's answer to the Steam Deck, is a lean-mean gaming machine powered by the AMD Ryzen Z1 Extreme processor. Announced earlier today, the Z1 Extreme is a highly power-optimized version of the 4 nm "Phoenix" silicon that packs an 8-core/16-thread CPU based on the "Zen 4" microarchitecture, along with its full-config iGPU based on the latest RDNA3 graphics architecture, with 12 CU (768 stream processors), and an LPDDR5 memory interface.

On the ROG Ally, the Z1 Extreme is configured with a 1.70 GHz CPU clock-speed, along with a 2.10 GHz iGPU engine clock. Multiplayer Italy went hands-on with the ROG Ally, and showed off a gameplay of "DOOM Eternal," where the ROG Ally pumps out 71 FPS, with an SoC power-draw of 25.7 W, and an SoC temperature of just 56°C. ASUS and AMD are expected to give the ROG Ally the full spectrum of software-level optimizations suitable for the device, such as dynamic resolution (Radeon Boost), which should hold frame-rates above 60 FPS at all times.

Today, AMD introduced the new Ryzen Z1 Series processors, the ultimate high-performance processor for handheld PC gaming consoles. The Ryzen Z1 Series features two high performance processors, the Ryzen Z1 and Ryzen Z1 Extreme, both offering industry-leading gaming experiences, uncompromising battery life, and featuring AMD RDNA 3 architecture-based graphics. AMD is partnering with Asus to launch the first Ryzen Z1 Series device with the Asus ROG Ally, a premium handheld PC console, featuring up to a Ryzen Z1 Extreme processor.

"At AMD, we're continually advancing the next generation of gaming experiences, from consoles to desktops to on-the-go handheld devices," said Jason Banta, corporate vice president and general manager, Client OEM at AMD. "Ryzen Z1 processors deliver gamers an elite gaming experience and extreme portability in exciting gaming form factors."

The latest entry from Geekbench database pretty much confirmed that the ASUS ROG Ally will have two different versions, featuring two different Ryzen Z1 custom APUs. While both are AMD's Phoenix APUs with Zen 4 CPU and RDNA 3 GPU architectures, they will have different specifications, with the Ryzen Z1 Extreme featuring an 8-core/16-thread configuration with 12 Compute Units (CUs) GPU, the Ryzen Z1 non-Extreme will end up with a 6-core/12-thread CPU configuration and 4 RDNA 3 CUs.

The Ryzen Z1 Extreme SKU was detailed yesterday, and this newest leak also confirms two different versions of the ASUS ROG Ally handheld console, as previously leaked. The entry in Geekbench database also shows a small difference in clock speeds between those two Ryzen Z1 SKUs, with the base frequency of 3.2 GHz and Boost of 4.9 GHz (4,939 MHz) for the non-Extreme. The Ryzen Z1 Extreme has a base frequency of 3.3 GHz and Boost up to almost 5.1 GHz (5,062 MHz).

A tech reviewer, ETA PRIME, managed to get its hands on the ASUS TUF A15 laptop, based on the AMD Ryzen 9 7940HS APU, and run some benchmarks on the integrated Radeon 780M RDNA 3 iGPU, showing that it is capable of delivering playable framerates in some popular games at 1080p resolution. The Ryzen 9 7940HS is an 8-core/16-thread Zen 4 APU with a base clock of 4.0 GHz and a maximum boost clock of 5.2 GHz. It features the Radeon 780M RDNA 3 iGPU with 12 CUs (768 stream processors) working at 2800 MHz. The APU in the ASUS TUF A15 laptop was paired up with 32 GB of DDR5-5600 memory. The system comes with an NVIDIA GeForce RTX 4060 GPU, but the review was focused on the AMD Radeon 780M.

In 3DMark Fire Strike and Time Spy benchmark, the Radeon 780M GPU was 12 and 15 percent faster than the Radeon 680M, despite the other system being equipped with faster LPDDR5 memory. ETA PRIME was also keen to note that the early driver was obviously not ready, and it did crash in some games, so the performance could be even higher when the official driver is released. ETA PRIME benchmarked a couple of popular games with the CPU limited to 80 W, resulting in playable framerates in most of the games at 1080p and medium to high graphics settings. Bear in mind that the system was tested in Performance Mode set via ASUS Armory Crate software. According to ETA PRIME, the integrated GPU was easily overclocked up to 3 GHz, and it would crash at 3.25 GHz, which shows great promise and might be more stable with the final launch driver.

Earlier this month, AMD wrapped up the launch of its incredible Ryzen 7000X3D processor series, which storms the company's gaming performance competitiveness against Intel back to the top, setting it up for the crucial Spring-Summer season, when PC gamers tend to upgrade and play the latest games. The 3D Vertical Cache memory deployed on the Ryzen 9 7950X3D, 7900X3D, and Ryzen 7 7800X3D, supercharges the gaming performance of these processors, and our testing has shown that the 7800X3D is all that an elite gaming PC build needs if all you're doing is playing games with some domestic productivity on the side; whereas the 7950X3D is for those into heavy content creation and application workloads besides gaming, which means AMD levels up to Intel on both fronts.

We have extensively covered the technical aspects of what 3D Vertical Cache is, and how it works, in our reviews of the 7950X3D and 7800X3D. It is a fast 64 MB slice of SRAM cache stacked on top of the 32 MB on-die L3 cache of "Zen 4" chiplets, which extends the L3 cache size to 96 MB. This has a profound impact on gaming workloads, as the CPU cores have more amount of game data at much lower latency than DRAM. As part of our coverage of the Ryzen 7000X3D processor series, we had the opportunity to interview AMD on some of the technical aspects of Ryzen 7000X3D processor series. We also took the opportunity to ask a few general questions about the Ryzen 7000 desktop processor series itself. You can also catch our interview with Robert Hallock, the former technical marketing head, for some additional questions that you may find relevant.

The second-hand market in China is always full of gems, but we never expected to see an unreleased 5 nm 96-core EPYC 9684X Genoa-X CPU with 1152 MB of L3 cache. According to the seller, the CPU is "almost new" and in working condition.

In case you missed it earlier, AMD is working on 5 nm Genoa-X EPYC CPUs which will feature up to 96 Zen 4 cores in 5 nm with over 1 GB of L3 cache per socket. These are scheduled to release this year, optimized for technical computing and databases. AMD is also working on Siena CPUs, which should also come this year, featuring up to 64 Zen 4 cores with optimized performance-per-watt, meant for intelligent edge and telco markets.

ASUS is keeping the hype up for its upcoming ROG Ally handheld console, and now it has confirmed the worldwide release and teased that it could come sooner than anyone expected, which is pretty impressive. Announced on April 1st, the ASUS ROG Ally has impressive specifications, running on yet to be detailed AMD 4 nm custom APU based on Zen 4 CPU and RDNA 3 GPU architecture.

The ASUS ROG Ally measures at 280 x 133 x 39 mm and weighs 608 grams, making it shorter, narrower, thinner, and lighter than its competitor, Valve's Steam Deck. It has a 7-inch display with 1920x1080 resolution, 120 Hz refresh rate, 5 ms response time, and 500 nits of brightness. According to earlier hands-on previews of the prototype from Dave2D and LinusTechTips, ASUS did a great job with the dual-fan cooling solution, making it very quite. It will also have a dedicated PCIE Gen 3 x8 XG connector, which allows it to connect to the recently launched XG Mobile GPU, an external RTX 4090 GPU which retails at $1999.99 in the US. Linus also noted that the ROG Ally will offer 50 percent higher performance at 15 W and twice the performance at 35 W, compared to the Steam Deck. As noted, ASUS has now confirmed that the ROG Ally will launch worldwide, and that it might be sooner that we expect, linking to Best Buy for those that live in North America.

When you buy a notebook powered by a Ryzen 7000 series mobile processor, you're either getting a cutting-edge chip powered by the company's latest "Zen 4" CPU cores, or one that has been rebadged from the company's previous-gen Ryzen 6000 "Zen 3+" or even Ryzen 5000 "Zen 3" (DDR4) processor series. The question on the tech buyer's mind will be "how to I spot a Ryzen 7000 series processor-powered notebook that actually gives me "Zen 4" CPU cores?"

AMD attempted to answer this with an exclusive new case badge for Ryzen 7000 series processors with "Zen 4" CPU cores. This new case badge looks not much different from the AMD Expo logo, in that the AMD Ryzen main branding is set against an orange backdrop. This bit is surrounded by a silver-metallic frame, with the 5/7/9 brand extension on its corner, along with "7000 series" marked. This case badge is only to be included with a Ryzen 7040 series "Phoenix" or Ryzen 7045 series "Dragon Range" processor present, and cannot be used with Ryzen 7035 series "Rembrandt Refresh" or Ryzen 7030 series "Barcelo Refresh," or Ryzen 7020 series "Mendocino."

As it turned out that ASUS ROG Ally handheld console is not actually an April Fools' Day prank, more details have started to appear about this Steam Deck competitor, and these first details look pretty promising. According to the Dave2D video, showing the prototype unit in full details, the ASUS ROG Ally will indeed be based on a 4 nm custom AMD APU, featuring Zen 4 CPU and RDNA3 iGPU, so we are most likely looking at a custom AMD Phoenix APU.

The video had a few nice pictures of the pre-production PCB as well as the cooling setup as well as details on the screen, and some performance of the ASUS ROG Ally. The ROG Ally measures at 280 x 133 x 39 mm and weighing 608 grams. This makes it shorter, narrower, thinner, as well as lighter, compared to the Steam Deck. It also comes with 7-inch display, but this time around, it is a 500 nits, 1920x1080 resolution, 16:9 aspect ratio, display with a 120 Hz refresh rate and 5 ms response time, which makes it much better compared to the Steam Deck.

Update: LinusTechTips is the second one to get access to ASUS ROG Ally prototype and has provided a bit more details on specifications, performance, and other things about the upcoming handheld console.

While AMD has yet to officially launch the 7040 Series Phoenix APUs, yet another SKU has been spotted online, the 6-core/12-thread AMD Ryzen 5 7540U. Based on AMD's Zen 4 architecture and featuring RDNA3 iGPU, this SKU will join the recently spotted Ryzen 5 7640U and the Ryzen 7 7840U.

It is not clear how many SKUs will AMD actually have in the Ryzen 7040 U-Series, but so far three SKUs have leaked online. The earlier slide, which mentioned the Ryzen 7040 Series, put it in the thin and light segment with TDP ranging from 15 W to 28 W. Bear in mind that AMD will also have the 7040 series non-U Phoenix APUs that will fit the 35 W - 45 W "thin enthusiast" HS-series segment. There is also the "ultra enthusiast" HX-series segment with the recently launched 7045 Series Dragon Range APUs.

AMD's hotly anticipated gaming CPU, the Ryzen 7 7800X3D "Zen 4," which launches early-April, is beginning to show up in online benchmark databases. The 8-core/16-thread processor has 64 MB of 3D Vertical Cache, which takes its L3 cache size up to an impressive 96 MB, and total cache up to 104 MB. The chip is showing up on the SiSoftware SANDRA online database, where it was tested on an MSI MEG X670E Ace motherboard. It obtained a score of 395.07 GOPS, with 527.56 GIPS dhrystone INT, 552.04 GIPS dhrystone long; 316 GFLOP/s whetstone single-precision floating point, and 264.71 GFLOP/s whetstone double-precision floating point.

The score puts it at roughly 37% faster than the Ryzen 7 5800X3D "Zen 3," although it's somewhere between its other 8-core "Zen 4" compatriots, the 7700X and 7700. The 7800X3D, much like its predecessor, is expected to perform either on-par or slightly worse than the 7700X in frequency/IPC dependent "lightweight" tasks, but zoom past in cache-favoring workloads such as gaming. Its predecessor, the 5800X3D, beat the fastest Intel processor of its time, the i9-12900K, so the 7800X3D has its task cut out—to beat the i9-13900K in gaming.

According to the latest leak, AMD's upcoming Phoenix accelerated processing units (APUs) could feature a hybrid design, featuring Performance and Efficiency cores. While there are no precise details, the latest AMD processor programming guide, leaked online, clearly marks these as two types of cores, most likely standard Zen 4 and energy-efficient Zen 4c cores.

These two set of cores will features a different feature set, and the latest document gives software designers guidelines. Such hybrid CPU design, similar to ARM's BIG.little architecture, will allow AMD to be more competitive with Intel's similar P- and E-core design, allowing it to achieve certain performance levels while also maintaining power efficiency.

AMD is preparing a rather late counter to the Xeon W-2400 and W-3400 series "Sapphire Rapids" workstation platform with the Threadripper 7000 series and the Socket TR5 platform, in the second half of 2023, according to an ASUS product manager. While high core-count Threadripper Pro 5000WX processors still offer performance competitive to the latest Xeon W processors, the Intel platform offers the latest I/O, including support for faster DDR5 memory and PCIe Gen 5. The expectation with the Threadripper 7000 "Storm Peak" series is to increase CPU core IPC with the switch to "Zen 4," and introduce support for the latest DDR5 and PCIe Gen 5.

AMD's delay in releasing the Threadripper 7000 series has to do with the company wanting to push more high-margin EPYC "Genoa" processors to its large enterprise customers first; and possibly to take the time to redraw its platform to better counter the sub-classification Intel introduced within its Xeon W family, where the W-2400 series is targeted more toward the HEDT consumer, with its 4-channel memory and 64-lane PCIe interface; while the W-3400 series with its 8-channel memory interface, targets serious workstation use-cases; while both processors share a common socket and chipset. AMD could take a similar approach to the TR5 platform.