The latest entry from Geekbench database pretty much confirmed that the ASUS ROG Ally will have two different versions, featuring two different Ryzen Z1 custom APUs. While both are AMD's Phoenix APUs with Zen 4 CPU and RDNA 3 GPU architectures, they will have different specifications, with the Ryzen Z1 Extreme featuring an 8-core/16-thread configuration with 12 Compute Units (CUs) GPU, the Ryzen Z1 non-Extreme will end up with a 6-core/12-thread CPU configuration and 4 RDNA 3 CUs.

The Ryzen Z1 Extreme SKU was detailed yesterday, and this newest leak also confirms two different versions of the ASUS ROG Ally handheld console, as previously leaked. The entry in Geekbench database also shows a small difference in clock speeds between those two Ryzen Z1 SKUs, with the base frequency of 3.2 GHz and Boost of 4.9 GHz (4,939 MHz) for the non-Extreme. The Ryzen Z1 Extreme has a base frequency of 3.3 GHz and Boost up to almost 5.1 GHz (5,062 MHz).

A tech reviewer, ETA PRIME, managed to get its hands on the ASUS TUF A15 laptop, based on the AMD Ryzen 9 7940HS APU, and run some benchmarks on the integrated Radeon 780M RDNA 3 iGPU, showing that it is capable of delivering playable framerates in some popular games at 1080p resolution. The Ryzen 9 7940HS is an 8-core/16-thread Zen 4 APU with a base clock of 4.0 GHz and a maximum boost clock of 5.2 GHz. It features the Radeon 780M RDNA 3 iGPU with 12 CUs (768 stream processors) working at 2800 MHz. The APU in the ASUS TUF A15 laptop was paired up with 32 GB of DDR5-5600 memory. The system comes with an NVIDIA GeForce RTX 4060 GPU, but the review was focused on the AMD Radeon 780M.

In 3DMark Fire Strike and Time Spy benchmark, the Radeon 780M GPU was 12 and 15 percent faster than the Radeon 680M, despite the other system being equipped with faster LPDDR5 memory. ETA PRIME was also keen to note that the early driver was obviously not ready, and it did crash in some games, so the performance could be even higher when the official driver is released. ETA PRIME benchmarked a couple of popular games with the CPU limited to 80 W, resulting in playable framerates in most of the games at 1080p and medium to high graphics settings. Bear in mind that the system was tested in Performance Mode set via ASUS Armory Crate software. According to ETA PRIME, the integrated GPU was easily overclocked up to 3 GHz, and it would crash at 3.25 GHz, which shows great promise and might be more stable with the final launch driver.

Earlier this month, AMD wrapped up the launch of its incredible Ryzen 7000X3D processor series, which storms the company's gaming performance competitiveness against Intel back to the top, setting it up for the crucial Spring-Summer season, when PC gamers tend to upgrade and play the latest games. The 3D Vertical Cache memory deployed on the Ryzen 9 7950X3D, 7900X3D, and Ryzen 7 7800X3D, supercharges the gaming performance of these processors, and our testing has shown that the 7800X3D is all that an elite gaming PC build needs if all you're doing is playing games with some domestic productivity on the side; whereas the 7950X3D is for those into heavy content creation and application workloads besides gaming, which means AMD levels up to Intel on both fronts.

We have extensively covered the technical aspects of what 3D Vertical Cache is, and how it works, in our reviews of the 7950X3D and 7800X3D. It is a fast 64 MB slice of SRAM cache stacked on top of the 32 MB on-die L3 cache of "Zen 4" chiplets, which extends the L3 cache size to 96 MB. This has a profound impact on gaming workloads, as the CPU cores have more amount of game data at much lower latency than DRAM. As part of our coverage of the Ryzen 7000X3D processor series, we had the opportunity to interview AMD on some of the technical aspects of Ryzen 7000X3D processor series. We also took the opportunity to ask a few general questions about the Ryzen 7000 desktop processor series itself. You can also catch our interview with Robert Hallock, the former technical marketing head, for some additional questions that you may find relevant.

The second-hand market in China is always full of gems, but we never expected to see an unreleased 5 nm 96-core EPYC 9684X Genoa-X CPU with 1152 MB of L3 cache. According to the seller, the CPU is "almost new" and in working condition.

In case you missed it earlier, AMD is working on 5 nm Genoa-X EPYC CPUs which will feature up to 96 Zen 4 cores in 5 nm with over 1 GB of L3 cache per socket. These are scheduled to release this year, optimized for technical computing and databases. AMD is also working on Siena CPUs, which should also come this year, featuring up to 64 Zen 4 cores with optimized performance-per-watt, meant for intelligent edge and telco markets.

ASUS is keeping the hype up for its upcoming ROG Ally handheld console, and now it has confirmed the worldwide release and teased that it could come sooner than anyone expected, which is pretty impressive. Announced on April 1st, the ASUS ROG Ally has impressive specifications, running on yet to be detailed AMD 4 nm custom APU based on Zen 4 CPU and RDNA 3 GPU architecture.

The ASUS ROG Ally measures at 280 x 133 x 39 mm and weighs 608 grams, making it shorter, narrower, thinner, and lighter than its competitor, Valve's Steam Deck. It has a 7-inch display with 1920x1080 resolution, 120 Hz refresh rate, 5 ms response time, and 500 nits of brightness. According to earlier hands-on previews of the prototype from Dave2D and LinusTechTips, ASUS did a great job with the dual-fan cooling solution, making it very quite. It will also have a dedicated PCIE Gen 3 x8 XG connector, which allows it to connect to the recently launched XG Mobile GPU, an external RTX 4090 GPU which retails at $1999.99 in the US. Linus also noted that the ROG Ally will offer 50 percent higher performance at 15 W and twice the performance at 35 W, compared to the Steam Deck. As noted, ASUS has now confirmed that the ROG Ally will launch worldwide, and that it might be sooner that we expect, linking to Best Buy for those that live in North America.

When you buy a notebook powered by a Ryzen 7000 series mobile processor, you're either getting a cutting-edge chip powered by the company's latest "Zen 4" CPU cores, or one that has been rebadged from the company's previous-gen Ryzen 6000 "Zen 3+" or even Ryzen 5000 "Zen 3" (DDR4) processor series. The question on the tech buyer's mind will be "how to I spot a Ryzen 7000 series processor-powered notebook that actually gives me "Zen 4" CPU cores?"

AMD attempted to answer this with an exclusive new case badge for Ryzen 7000 series processors with "Zen 4" CPU cores. This new case badge looks not much different from the AMD Expo logo, in that the AMD Ryzen main branding is set against an orange backdrop. This bit is surrounded by a silver-metallic frame, with the 5/7/9 brand extension on its corner, along with "7000 series" marked. This case badge is only to be included with a Ryzen 7040 series "Phoenix" or Ryzen 7045 series "Dragon Range" processor present, and cannot be used with Ryzen 7035 series "Rembrandt Refresh" or Ryzen 7030 series "Barcelo Refresh," or Ryzen 7020 series "Mendocino."

As it turned out that ASUS ROG Ally handheld console is not actually an April Fools' Day prank, more details have started to appear about this Steam Deck competitor, and these first details look pretty promising. According to the Dave2D video, showing the prototype unit in full details, the ASUS ROG Ally will indeed be based on a 4 nm custom AMD APU, featuring Zen 4 CPU and RDNA3 iGPU, so we are most likely looking at a custom AMD Phoenix APU.

The video had a few nice pictures of the pre-production PCB as well as the cooling setup as well as details on the screen, and some performance of the ASUS ROG Ally. The ROG Ally measures at 280 x 133 x 39 mm and weighing 608 grams. This makes it shorter, narrower, thinner, as well as lighter, compared to the Steam Deck. It also comes with 7-inch display, but this time around, it is a 500 nits, 1920x1080 resolution, 16:9 aspect ratio, display with a 120 Hz refresh rate and 5 ms response time, which makes it much better compared to the Steam Deck.

Update: LinusTechTips is the second one to get access to ASUS ROG Ally prototype and has provided a bit more details on specifications, performance, and other things about the upcoming handheld console.

While AMD has yet to officially launch the 7040 Series Phoenix APUs, yet another SKU has been spotted online, the 6-core/12-thread AMD Ryzen 5 7540U. Based on AMD's Zen 4 architecture and featuring RDNA3 iGPU, this SKU will join the recently spotted Ryzen 5 7640U and the Ryzen 7 7840U.

It is not clear how many SKUs will AMD actually have in the Ryzen 7040 U-Series, but so far three SKUs have leaked online. The earlier slide, which mentioned the Ryzen 7040 Series, put it in the thin and light segment with TDP ranging from 15 W to 28 W. Bear in mind that AMD will also have the 7040 series non-U Phoenix APUs that will fit the 35 W - 45 W "thin enthusiast" HS-series segment. There is also the "ultra enthusiast" HX-series segment with the recently launched 7045 Series Dragon Range APUs.

AMD's hotly anticipated gaming CPU, the Ryzen 7 7800X3D "Zen 4," which launches early-April, is beginning to show up in online benchmark databases. The 8-core/16-thread processor has 64 MB of 3D Vertical Cache, which takes its L3 cache size up to an impressive 96 MB, and total cache up to 104 MB. The chip is showing up on the SiSoftware SANDRA online database, where it was tested on an MSI MEG X670E Ace motherboard. It obtained a score of 395.07 GOPS, with 527.56 GIPS dhrystone INT, 552.04 GIPS dhrystone long; 316 GFLOP/s whetstone single-precision floating point, and 264.71 GFLOP/s whetstone double-precision floating point.

The score puts it at roughly 37% faster than the Ryzen 7 5800X3D "Zen 3," although it's somewhere between its other 8-core "Zen 4" compatriots, the 7700X and 7700. The 7800X3D, much like its predecessor, is expected to perform either on-par or slightly worse than the 7700X in frequency/IPC dependent "lightweight" tasks, but zoom past in cache-favoring workloads such as gaming. Its predecessor, the 5800X3D, beat the fastest Intel processor of its time, the i9-12900K, so the 7800X3D has its task cut out—to beat the i9-13900K in gaming.

According to the latest leak, AMD's upcoming Phoenix accelerated processing units (APUs) could feature a hybrid design, featuring Performance and Efficiency cores. While there are no precise details, the latest AMD processor programming guide, leaked online, clearly marks these as two types of cores, most likely standard Zen 4 and energy-efficient Zen 4c cores.

These two set of cores will features a different feature set, and the latest document gives software designers guidelines. Such hybrid CPU design, similar to ARM's BIG.little architecture, will allow AMD to be more competitive with Intel's similar P- and E-core design, allowing it to achieve certain performance levels while also maintaining power efficiency.

AMD is preparing a rather late counter to the Xeon W-2400 and W-3400 series "Sapphire Rapids" workstation platform with the Threadripper 7000 series and the Socket TR5 platform, in the second half of 2023, according to an ASUS product manager. While high core-count Threadripper Pro 5000WX processors still offer performance competitive to the latest Xeon W processors, the Intel platform offers the latest I/O, including support for faster DDR5 memory and PCIe Gen 5. The expectation with the Threadripper 7000 "Storm Peak" series is to increase CPU core IPC with the switch to "Zen 4," and introduce support for the latest DDR5 and PCIe Gen 5.

AMD's delay in releasing the Threadripper 7000 series has to do with the company wanting to push more high-margin EPYC "Genoa" processors to its large enterprise customers first; and possibly to take the time to redraw its platform to better counter the sub-classification Intel introduced within its Xeon W family, where the W-2400 series is targeted more toward the HEDT consumer, with its 4-channel memory and 64-lane PCIe interface; while the W-3400 series with its 8-channel memory interface, targets serious workstation use-cases; while both processors share a common socket and chipset. AMD could take a similar approach to the TR5 platform.

AMD's EPYC lineup already features the new Zen 4 core designed for better performance and efficiency. However, since the release of EPYC Milan-X processors with 3D V-cache integrated into server offerings, we wondered if AMD will continue to make such SKUs for upcoming generations. According to the report from Wccftech, we have a leaked table of specifications that showcase what some seemingly top-end Genoa-X SKUs will look like. The two SKUs listed here are the "100-000000892-04" coded engineering sample and the "100-000000892-06" coded retail sample. With support for the same SP5 platform, these CPUs should be easily integrated with the existing offerings from OEM.

As far as specifications, this processor features 384 MBs of L3 cache coming from CCDs, 768 MBs of L3 cache from the 3D V-Cache stacks, and 96 MBs of L2 cache for a total of 1248 MBs in the usable cache. A 3 MB stack of L1 cache is also dedicated to instructions and primary CPU data. Compared to the regular Genoa design, this is a 260% increase in cache sizes, and compared to Milan-X, the Genoa-X design also progresses with 56% more cache. With a TDP of up to 400 Watts, configurable to 320 Watts, this CPU can boost up to 3.7 GHz. AMD EPYC Genoa-X CPUs are expected to hit the shelves in the middle of 2023.

AMD's 4 nm "Phoenix" silicon could serious turn the company's fortunes around in the ultra-thin notebook space. The 28-Watt Ryzen 7 7840U surfaced on Cinebench R23 screenshots, where it is shown beating the previous-generation 55 W flagship, the Ryzen 9 6900HX. If this is any indication of performance across the board, then the 15-28 W models of Ryzen 7040-series "Phoenix" could unleash an open-season against competing 15-28 W-category 13th Gen Core processors that have lower P-core counts, such as 2P+8E. The 7840U has all eight "Zen 4" CPU cores enabled, along with a fast RDNA3 graphics architecture based iGPU. In the screenshot, the 7840U is shown with a Cinebench R23 multi-threaded score of 14285 points, a score that is higher than that of the "Zen 3+" based 6900HX "Rembrandt," and a touch below the 45 W Core i7-12800H, which means it could have the upper hand over several 13th Gen and 12 Gen SKUs in the 15-28 W category.

If you were one of those that were waiting with bated breath for AMD's Zen 4 based "Phoenix" line-up of mobile CPUs, you're going to be waiting a little longer. Late on Friday afternoon AMD announced that they have delayed the launch of their Ryzen Mobile 7040HS series of CPUs, pushing the expected launch window from late March to some time in April. Speculation abound as to why this may be, but the direct correspondence from AMD's PR department is sparse:

To align with platform readiness and ensure the best possible user experience, we now expect our OEM partners to launch the first notebooks powered by Ryzen 7040HS Series processors in April.

As a refresher on the "Phoenix" line of CPUs these are the next-generation Zen 4 based monolithic SoCs built on TSMC's 4 nm process first announced back in January. These chips feature up to 8 Zen 4 cores with turbo clocks reaching 5 to 5.2 GHz, an RDNA3 based integrated GPU with clocks as high as 3 GHz, and AMD's first AI coprocessor dubbed Ryzen AI. Despite being Zen 4 these SoCs are still using PCI-E Gen 4 but are not hamstrung by a lack of lanes like some previous generations. We've already seen substantial leaks over the past few days hinting at the performance of these chips which suggests they will offer good competition to Intel's shipping 13th Gen Raptor Lake mobile offerings.

AMD has announced the immediate availability of its Ryzen 7045 HX-series (Dragon Range) processors for high performance laptop devices. In a Youtube video released on March 10, AMD's Jason Banta has announced the availability of the world's most powerful mobile processor, the Ryzen 9 7945HX. He listed the OEM partners who have integrated the 7945HX into flagship level laptop models. He also declared that this range topping CPU is a competition beater. Gaming benchmark tests have demonstrated that the Ryzen 9 7945HX beats Intel's Raptor Lake Core i9-13950HX by an average margin of 10%.

There are two distinct developments in the client processor space for AMD—first, its Ryzen 7000X3D desktop processors have managed to retain gaming performance competitiveness against Intel's fastest 13th Gen Core "Raptor Lake" processors; and second, that its Ryzen 7045HX "Dragon Range" mobile processors are picking up interest in the enthusiast-segment notebook community, where its advanced 5 nm + 6 nm process is dealing damage to 13th Gen Core mobile processors in performance/Watt, and gaming performance. Can AMD dial things up a notch? Technically, yes.

It should technically be possible for AMD to build "Dragon Range" multi-chip modules using "Zen 4" + 3D Vertical Cache CCDs (CPU complex dies), much in the same way it did for the desktop product stack. Such a processor would either have one CCD with the 3DV cache for a CPU core-count of up to 8-core/16-thread; or a contraption similar to the desktop 7950X3D, wherein one of the CCDs has 3DV cache, while the other is a regular "Zen 4" CCD, for core-counts of up to 16-core/32-thread. But will AMD build such chips? A lot would depend on the volumes of L3Ds (the 6 nm dies with the 64 MB 3D Vertical cache memory that operates at 2.5 TB/s), the production of CCDs with 3DV cache; and whether AMD is able to achieve the right performance/Watt numbers against Intel's fastest 8P+16E "Raptor Lake" mobile processors.

AMD "Zen 4" processors offer unmatched efficiency at lower power, and notebook manufacturers are beginning to notice that the company's high core-count Ryzen 7045HX series "Dragon Range" mobile processors offer performance and battery-life highly competitive to 13th Gen Core "Raptor Lake" processors. The Ryzen 7 7745HX is an 8-core/16-thread processor with a single 5 nm "Zen 4" chiplet, and default TDP of 55 W. Chinese tech publication Golden Pig Upgrade reviewed a notebook powered by the 7745HX, and compared it with one rocking a Core i7-13700HX 8P+8E. The reviewer found the 7745HX to offer superior performance/Watt and gaming performance that either matches or beats the "Raptor Lake," which is held back by aggressive power-management and an older 10 nm-class process node.

Over the past month, memory manufacturers started releasing DDR5 memory modules of 24 GB and 48 GB densities, which make up 48 GB (2x 24 GB), 96 GB (2x 48 GB or 4x 24 GB) and even 192 GB (4x 48 GB) capacities. There's only one catch—these modules only work with 12th Gen Core "Alder Lake" and 13th Gen Core "Raptor Lake" processors, as their memory controllers support a maximum of 192 GB of memory, and 24/48/96 GB DIMM densities. MEGAsizeGPU decided to find out what happens when one of these kits is installed on an AMD Ryzen 7000 "Zen 4" platform.

A Corsair Vengeance DDR5-5600 48 GB (2x 24 GB) memory kit was installed on a machine consisting of an AMD Ryzen 5 7600X processor, and an ASUS ROG Strix B650E-E Gaming motherboard (BIOS version 1222). It turns out that the machine POSTs, and is able to start the UEFI setup program. Here, the program is able to display the correct 48 GB memory amount, and the memory density of each of the two modules. The trouble is, Windows would not boot, and does not go past the Boot Manager. It halts with an error message that indicates a hardware problem.

Although we've known most of the details of AMD's I/O die in its Zen 4 processors, until now, AMD hadn't shared a die shot of the cIOD, but thanks to its ISSCC 2023 presentation, we not only have a die shot of the cIOD, but some friendly people on the internet have also made annotations for us mere mortals. There are no big secrets here, but based on the annotations by @Locuza_ we now know for certain that it's not possible to use the current I/O die with three CCDs, as it only has two GMI3 interfaces, to which the CCDs are connected.

If you're wondering about the 2x 40-bit memory interface, it's for ECC memory support outside of the on-die ECC support of DDR5 memory. Also note that DDR5 memory is two times 32-bit in non ECC mode. That said, it's up to the motherboard makers to implement support for ECC memory, but it would appear all Zen 4 CPUs support it. The addition of a GPU, even a basic one like this, takes up a fair bit of space inside the cIOD, especially once you add things like video decoders/encoders and so on. In fact, it appears that the parts related to the GPU and video decoders/encoders take up at least a third of the space inside the I/O die, yet thanks to a significant die shrink from the Zen 3 era cIOD, it's physically smaller in the Zen 4 processors, while having an estimated 58 percent increase in transistors.

GIGABYTE TECHNOLOGY Co. Ltd, a leading manufacturer of motherboards, graphics cards, and hardware solutions, announced today that GIGABYTE X670, B650 motherboard lineup with advanced configuration provides a perfect match for the latest AMD Raphael X3D processors with 3D V-Cache technology. This match delivers remarkable improvements on gaming performance for building ultimate gaming systems.

AMD first launched 3D V-Cache technology on Ryzen 7 5800X3D processors in 2022 and made it one of the best gaming CPUs. Now AMD brings 3D V-Cache technology to Zen 4 and introduces AMD Ryzen 9 7950X3D, Ryzen 9 7900X3D, and upcoming Ryzen 7 7800X3D processors with superior gaming performance. This new generation 3D V-Cache CPUs with more cores also raise L3 cache up to 128 MB, and boost gaming performance thanks to the extra 64 MB cache of 3D V-Cache.

AMD's top two new desktop processors, the Ryzen 9 7950X3D 16-core/32-thread; and the Ryzen 9 7900X3D 12-core/24-thread, go on sale later today (starting 3 PM Central European time, 9 AM EST). The two "Zen 4" processors feature the company's 3D Vertical Cache technology, which significantly improves gaming performance. The 7950X3D in particular attains parity with the Intel Core i9-13900K in both gaming and multi-threaded productivity performance.

3D Vertical Cache is a 64 MB SRAM die that augments the 32 MB on-die L3 cache of one of the two CCDs in these processors. The combined 96 MB cache has a profound impact on compute latencies for gaming. In our testing, the 7950X3D matches the gaming performance of the i9-13900K "Raptor Lake," which means AMD now has a truly competitive processor with Intel's latest. It also matches or exceeds the I/O feature-set, including DDR5 memory, PCIe Gen 5 (including for the CPU-attached NVMe slot); and an iGPU, although it loses out on DDR4 memory support. The Ryzen 9 7950X3D commands an MSRP of USD $700, and the 7900X3D $600.

Catch the TechPowerUp Review of the AMD Ryzen 9 7950X3D.

AMD is preparing to release the latest version of its Chipset software. Version 5.01.29.2026 WHQL should be of particular interest for users planning to buy an upcoming Ryzen 7000X3D series processor. The chipset driver includes the "3D V-Cache Performance Optimizer driver" component, version 1.0.0.7. This gives Windows a degree of awareness of the asymmetric nature of 3DV cache on the 16-core 7950X3D and 12-core 7900X3D, where only one of the two CCDs (chiplets) has the 3DV cache memory, while the other is a regular "Zen 4" CCD with 32 MB on-die L3 cache. This awareness should in theory improve performance in less-parallelized workloads (such as games). The AMD website doesn't yet list this driver, but it should appear as we head closer to the market-availability date of the 7950X3D and 7900X3D (February 28). From the looks of it, the optimization works for both Windows 11 and Windows 10, so those on the older operating system for reasons, can keep rocking it.

EK, the leading liquid cooling gear manufacturer, launches a workstation and a 1U rack-compatible high-performance liquid cooling solution for AMD Zen 4-based EPYC server processors. Code-named "Genoa," these AMD CPUs come with up to 96 cores and 192 threads and have a TDP of up to 360W. These specifications render these processors perfect for liquid cooling, especially in a dual-socket motherboard environment.

EK-Pro CPU WB SP5 Ni + Acetal
This is a dedicated enterprise-grade water block developed specifically for AMD processors. It features three standard G1/4" threaded ports located on the top of the water block and is intended for workstations and taller server racks.

Intel has recently updated its open-source C++ header file library for high-performance SIMD-based sorting to support the AVX-512 SIMD instruction set. Extending the capability of regular AVX2 support, the sorting functions now implement 512-bit extensions to offer greater performance. According to Phoronix, the NumPy Python library for mathematics that underpins a lot of software has updated its software base to use the AVX-512 boosted sorting functionality that yields a fantastic uplift in performance. The library uses AVX-512 to vectorize the quicksort for 16-bit and 64-bit data types using the extended instruction set. Benchmarked on an Intel Tiger Lake system, the NumPy sorting saw a 10-17x increase in performance.

Intel's engineer Raghuveer Devulapalli changed the NumPy code, which was merged into the NumPy codebase on Wednesday. Regarding individual data types, the new implementation increases 16-bit int sorting by 17x and 32-bit data type sorting by 12-13x, while float 64-bit sorting for random arrays has experienced a 10x speed up. Using the x86-simd-sort code, this speed-up shows the power of AVX-512 and its capability to enhance the performance of various libraries. We hope to see more implementations of AVX-512, as AMD has joined the party by placing AVX-512 processing elements on Zen 4.

In the wake of its Ryzen 7000X3D series announcement, AMD cut the price of its Ryzen 7 7700X 8-core/16-thread "Zen 4" processor. The Ryzen 7000X3D series is available from February 28, however, the 8-core 7800X3D will only be available from April 6. Despite this, sales prospects of the 7700X could be affected, as the SKU faces cannibalization not just from the 7800X3D, but also the recently launched 65 W Ryzen 7 7700, which has shown decent overclocking potential with motherboard-level power limit unlocks. What's interesting is that the 105 W 7700X at $299 puts it below the 65 W 7700 that launched at $325, which means that the 7700 could get even cheaper. This series of price-cuts and SKU re-positioning could make AMD competitive against Intel's 13th Gen Core i5 SKUs such as the i5-13600 and i5-13500 6P+8E models.