Intel created the Core i9 brand to differentiate two key groups of Core X series HEDT (high-end desktop) processors, with the Core i7 X-series parts featuring 28-lane or 16-lane PCIe interfaces, while the Core i9 X-series parts featuring the full 44-lane interfaces present on the "Skylake-X" silicon. The Core i9 brand also earned a degree of exclusivity as it allows Intel to ask upwards of $999 for these client-segment parts, with the top-end i9-7980XE scraping the $2,000-mark. Intel sees the potential for a similar segmentation for its mobile processor lineup, even if not on grounds of PCIe lane budget or core-counts.

The Core i9 mobile processor family could bring the highest-levels of 6-core "Coffee Lake" desktop processor performance to the notebook platform. Intel is giving final touches to the Core i9-8000 series "Coffee Lake-H" processor lineup, which could feature the full 6-core/12-thread configuration of the "Coffee Lake" silicon, alongside 12 MB L3 cache. The first SKU in the lineup could be the Core i9-8950HK, sniffed out from the change-log of the latest FinalWire AIDA64. These chips could enable large (>17-inch) gaming notebooks with one or more high-end graphics cards, the latest advancements in cooling, 4K UHD or curved displays, etc.

GIGABYTE TECHNOLOGY Co. Ltd, a leading manufacturer of motherboards and graphics cards, has unveiled the new X299 AORUS Gaming 7 Pro motherboard. With support for the new Intel 18-Core i9 7980XE processor, the new motherboard is ready to elevate performance to the next level. Featuring an updated VRM design paired with Smart Fan 5 technology to satiate the power demands of the new 18-core processor while keeping the system icy cool, the new X299 AORUS Gaming 7 Pro is the definitive motherboard of choice for users who value performance first and foremost.

"The X299 AORUS Gaming 7 Pro motherboard is designed to fully support Intel's newest Core i9 7980XE processor." said Vincent Liu, Senior Associate Vice President of GIGABYTE's Motherboard Business Unit. "With our tried-and-true approach and seasoned experience, we have designed a motherboard that truly fulfills enthusiasts' highest expectations."

Security researchers have found glaring security flaws with Intel Management Engine, the on-chip micro SoC that, besides governing the functionality of the processor, provides on-chip management and security features. These security flaws render "potentially millions" of PCs and notebooks, based on Intel processors, according to the researchers. Intel on Monday released a Detection Tool application that lets you identify vulnerabilities in the Management Engine of your Intel processor-powered PC, and suggests updates to Intel Management Engine drivers, or points to BIOS updates from your PC manufacturer.

Updates to Intel ME are specific to TXE 3.0 (trusted execution engine version 3.0), which is featured on processors based on "Skylake," "Kaby Lake," and "Coffee Lake" micro-architectures, across client- and enterprise market segments, and Atom processors released in the past three years. Intel chronicled this security flaw further under Security Advisory 86, and released the SA-00086 Detection Tool.

As big data usage is becoming ubiquitous, and workload data-sets increase in both size and complexity, new ways of connecting processing resources to storage are being developed. Intel and Micron's partnership in developing 3D XPoint memory came as a way for computer systems to reduce their bottlenecks in storing data for processing, with a particular emphasis on reducing latency. Samsung, however, has enough resources to try and provide alternatives for the emergent market needs, and being one of the most important players in the NAND industry, it seems the company is betting on the Z-NAND wagon.

For now, Z-NAND as it is being developed by Samsung, is expected to be a new rendition of SLC (Single-Level Cell) NAND, with increased controller tweaks and improvements to achieve greater IOPS in both random and sequential workloads. SLC has already been widely used in the SSD market, though in recent years it has been giving way to density-oriented technologies, such as MLC and, more recently, TLC NAND, in an effort to lower the $/GB equation. Z-NAND is a return to the SLC roots, with some very relevant tricks up its sleeve - while 3D XPoint's call to fame was sometimes up to 10x lower latency (in the order of 10/10μs), Z-NAND is also bringing latency to levels hitherto unknown to NAND memory - specifically, to the 12-20/16μs realms.

Intel is guiding its motherboard partners to remove legacy BIOS support from their UEFI firmware by 2020. The company's client- and enterprise-platforms that come out in 2020 will lack CSM (compatibility support module), a component which lets UEFI-unaware operating systems and bootable devices run on newer machines with UEFI. Devices featuring this CSM-devoid runtime will be graded "UEFI Class 3," as the runtime only exposes UEFI or UEFI PI interfaces.

This practically marks the end of 32-bit operating systems on the newer machines, as 32-bit Windows and desktop Linux distributions require CSM. You'll still be able to use 32-bit software running on 64-bit Windows through WoW64 translation layers. The lack of CSM will also affect devices with 16-bit OpROM, such as older network adapters, and older RAID HBAs. You'll have to depend on OS-based programs to configure those devices. Newer versions of Windows Secure Boot will require UEFI Class 3 devices to function. This also affects booting with your main display plugged into graphics cards older than 4 years (launched roughly before 2013), which lack UEFI-ready video BIOS.

There were some rumors regarding an expected low availability of Intel's latest, 8th Gen "Coffee Lake" CPUs. Then, in a new report, those rumors were sort of confirmed by Newegg. Now, we have it straight from the blue giant themselves, as Intel has announced that they're adding another facility to their 8th Gen Coffee Lake production and certification facilities. Stock of Intel 8th Gen CPUs has been spotty, to say the least, and pricing of the lineup's unlocked CPUs (8600K and 8700K, which are the most interesting for enthusiasts) have been particularly affected. If current output isn't enough to satisfy demand, the oldest trick in the book is to simply improve output. And Intel is doing it.

While Intel has been mainly using its assembly and test facilities based in Malaysia, the company is adding a new, certified assembly to the list: one in Chengdu, China. That shouldn't send alarms ringing, however; Intel's assembly and test facilities are a part of Intel's Copy Exactly! (CE!) program. This means that in order to be certified, all facilities must have identical methodologies and process technologies across different production sites throughout the world - there should be no quantifiable difference in quality. Intel's customers will begin to receive the aforementioned processors assembled in China starting from December 15. There is no real way to know exactly how much difference the new assembly facility will make on the worldwide supply of Intel 8h Gen CPUs - but it should only improve.

Intel today announced substantial advances in its wireless product roadmap to accelerate the adoption of 5G. Highlights include the introduction of the Intel XMM 8000 series, Intel's first family of 5G new radio (5G NR) multi-mode commercial modems, and Intel's latest LTE modem, the Intel XMM 7660. Intel also announced it has successfully completed a full end-to-end 5G call based on its early 5G silicon, the Intel 5G Modem - a key milestone in its development. Finally, the Intel XMM 7560 modem unveiled at Mobile World Congress 2017 has achieved gigabit-class speeds.

"Intel is committed to delivering leading 5G multi-mode modem technology and making sure the transition to 5G is smooth," said Dr. Cormac Conroy, Intel corporate vice president and general manager of the Communication and Devices Group. "Our investments in a full portfolio of modem technologies and products are critical to achieving the vision of seamless 5G connectivity."

Intel announced today that it has issued a notice of redemption to redeem on December 18, 2017 all of its outstanding 2.95% Junior Subordinated Convertible Debentures due 2035 (CUSIP Number 458140AC4) (the "Securities"). As of November 15, 2017, approximately $1.6 billion of the Securities was outstanding.

The Securities called for redemption will be redeemed at a stated redemption price equal to 100% of the aggregate principal amount of such Securities, plus accrued and unpaid interest to (but excluding) the redemption date.

The conversion rate of the Securities as of November 16, 2017 is 37.1860 shares of Intel common stock per $1,000 principal amount of the Securities, which is equivalent to a conversion price of $26.89 per share of common stock. The Securities called for redemption may be converted at any time before 5:00 p.m., New York City time, on December 15, 2017, the business day immediately preceding the redemption date. Intel has elected to settle the conversion obligation with respect to the Securities in cash.

Today, Intel launched a fundraising effort on Charitybuzz to benefit the Second Harvest Food Bank of Santa Clara and San Mateo counties. The company is auctioning a VIP experience at the 2018 Consumer Electronics Show in Las Vegas including travel, deluxe lodging and a backstage meet and greet with Intel CEO Brian Krzanich before his opening keynote on Jan. 8, 2018.

"CES is an incredible show for anyone interested in the future of technology, and I'm really excited to share a VIP CES experience while raising money for a great cause," Krzanich said. "The top bidder will be my guest at the show and get exclusive access to our opening keynote, exhibit space and more."

The first socket LGA1151 motherboard based on Intel's upcoming Z390 Express chipset was spotted on SiSoft SANDRA database. The board is SuperMicro C7Z390-PGW, a client-segment motherboard by SuperMicro under its SuperO brand. Intel is slating launch of the Z390 Express chipset for some time in the second half of 2018, following the early-2018 launches of H370 Express, B360 Express, and H310 Express.

The Z390 Express chipset adds to the feature-set of the platform, with an integrated Programmable Quad-Core Audio DSP, SoundWire digital audio interface, an integrated 10 Gbps USB 3.1 controller, integrated 802.11ac WLAN controller (with external PHY), an integrated SDIO controller (for card readers), and support for newer generation "Titan Ridge" Thunderbolt 3.0 controller.

Intel has reportedly slated launch of its Optane DIMM for the second half of 2018. The Optane DIMM marks the biggest change in computer memory in over two decades, and heralds the era of "persistent memory," which combines the best characteristics of DRAM and NAND flash, in that it has the speed and low-latency of DRAM, but the persistence (ability to store data in the absence of power) of NAND flash. Combining the two will be made possible with improvements to the speed and latency of 3D XPoint memory. Intel is currently selling consumer SSDs based on the technology, and has increased production of 3D XPoint chips.

Intel presented the Optane DIMM at the 2017 USB Global Technology Conference. It described Optane DIMM as a primary storage device that will function as a memory-mapped device, but with much higher storage densities than what's possible with current DDR4 DRAM. The enterprise segment, as usual, will have the first take of the technology, with Intel targeting the exascale computing (supercomputers nearing ExaFLOP/s compute throughput) industry, trickling down to other enterprise segments, before finally making its way to the client/consumer segments. This development is also a polite nudge to the DRAM industry to get its act together, and either bring down prices or scale up densities, or miss the bus of change.

The fiftieth TOP500 list of the fastest supercomputers in the world has China overtaking the US in the total number of ranked systems by a margin of 202 to 143. It is the largest number of supercomputers China has ever claimed on the TOP500 ranking, with the US presence shrinking to its lowest level since the list's inception 25 years ago.

Just six months ago, the US led with 169 systems, with China coming in at 160. Despite the reversal of fortunes, the 143 systems claimed by the US gives them a solid second place finish, with Japan in third place with 35, followed by Germany with 20, France with 18, and the UK with 15.

Today, Intel and Micron announced the completion of an expansion to Building 60 (B60) at the IM Flash facilities in Lehi, Utah. The expanded fab will produce 3D XPoint memory media, a building block of Intel Optane technology that includes Intel Optane memory for clients, the recently announced Intel Optane SSD 900P Series and new capacities and form factors of the Intel Optane SSD DC P4800X Series. A ribbon-cutting was held at the facility with Utah Gov. Gary Herbert, employees of the facility and representatives from Intel and Micron.

The IM Flash joint venture was created in 2006 to manufacture non-volatile memory for both Intel and Micron, starting with NAND for use in SSDs, phones, tablets and more. In 2015, IM Flash began manufacturing 3D XPoint technology, the first entirely new memory media in 25 years. The technology was developed to meet the quickly expanding data needs for all types of customers. 3D XPoint technology uses a crosspoint structure to deliver a cell and array architecture that can switch states significantly faster than NAND.

Fujitsu unveils a new generation of its best-selling notebook, the Fujitsu Notebook LIFEBOOK E5 and LIFEBOOK E4 series. A refreshed, slimmer design gives the business notebook line a contemporary look. Under the skin, the fully featured LIFEBOOK E5 is based on the latest Intel processors and is packed with connectivity options, ensuring secure, convenient access to corporate networks via cable, wireless or mobile networks.

All new LIFEBOOK E4 and LIFEBOOK E5 series models feature the new area type fingerprint sensor that responds instantly to provide one-touch login and system unlock. Also focusing on ease-of-use, Fujitsu introduces a precision touchpad that is more accurate, with support for three-finger gestures as featured in the latest version of Microsoft Windows 10, and a sculpted, ergonomic palm rest.

Kingmax, a memory expert, released Zeus Dragon DDR4 on November 13, 2017. This is made for gamers and DIY enthusiasts. The innovative design is integrated with aesthetics and functions which amazes everyone. Gamers can enjoy its appearance and function.

Zeus Dragon DDR4 uses aluminum alloy heat sink to effectively emit heat, therefore protecting memory and extending the service life. Zeus Dragon uses the dragon symbol blending both Eastern and Western style. The luxurious etchings present the superiority of the dragon and display the assertiveness and dignity of royalty. The dragon is above all other creatures and has extraordinary power and stunning speed. Besides its shiny scales, its powerful magic is neck and neck when it fights against Zeus, the ruler of all gods, in order to protect treasure.

We recently reported about MINIX, the hidden Unix-like OS that Intel was secretly shipping in all of their modern processors. This came as a shock to most of us and to MINIX creator Andrew Tanenbaum as well. Although Andrew wasn't completely surprised by the news, since Intel approached him couple years back asking him to make a few changes to the MINIX system. He stated in the open letter that he wasn't looking for economic remuneration, but it would have been nice if Intel had told him about their plans to distribute his operating system in their processors.

Today, Intel announced the Intel Optane SSD DC P4800X Series, the world's most responsive data center solid state drive, is now available in a new 750GB capacity in both half-height, half-length add-in card and a hot-swappable 2.5-inch U.2 form factor. Both form factors and capacities will be broadly available this month.

Increased capacity and multiple form factors expand data center implementation options and deliver both solution-level and total cost of ownership flexibility for customers. Intel Optane technology for data centers combines the attributes of memory and storage with low latency, high endurance, outstanding quality of service and high throughput, creating a new data tier that increases scale per server and reduces transaction costs.

All things must come to an end, and Intel has decided that it's time to retire their Broadwell-E line of processors. The Broadwell-E family is comprised of four models: the Intel Core i7-6800K, 6850K, 6900K and 6950X. According to the Product Change Notification (PCN) document, Intel is still accepting orders until May 25, 2018, while the last shipment is scheduled for November 9 of the same year. So, there is still sufficient time left for those who plan to acquire one of the aforementioned models. However, we don't see any reason to do so now considering that there are far better options on the market.

Broadwell-E processors debuted last year and were received with mixed reactions. With just one year under their belt, they were eventually replaced by the more powerful Skylake-X models. Intel is probably getting rid of their unsold inventory of Broadwell-E models. Who knows? Maybe we'll even see some price cuts in the not-so-near future.

Elitegroup Computer System (ECS), the global leading motherboard, Mini-PC, Notebooks and mobile device manufacturer, is proud to announce the new LIVA Q, pocket-sized mini-pc featuring Intel Apollo Lake SOC processors, along with 4GB RAM, 64GB eMMC storage and HDMI 2.0; this little monster is capable of handling 4K content playback with ease.

The new LIVA Q pocket-sized mini-pc allows you to stay connected with dual network options, a standard RJ45 LAN connector for more stabilized connection and 802.11ac + Bluetooth 4.1 for wireless connections. There's also a MicroSD card slot that support up to 128GB memory cards for those who seeks more storage and x2 USB slots for peripherals.

Intel hired Raja Koduri, who resigned as head of AMD's Radeon Technologies Group (RTG), earlier this week. Koduri has been made Senior Vice President and Chief Architect of Intel's future discrete GPUs. That's right, Intel has renewed its dreams to power high-end graphics cards that compete with AMD and NVIDIA. Intel's last attempt at a discrete GPU was "Larrabee," which evolved into a super-scalar multi-core processor for HPC applications under the Xeon Phi line.

This development heralds two major theories. One, that Intel's collaboration with AMD RTG on graphics IP could only go further from here, and what is a multi-chip module of Intel and AMD IP now, could in the future become a true heterogeneous die of Intel's and AMD's IP. Two, that the consolidation of AMD's graphics assets and IP into a monolithic entity as RTG, could make it easier to sell it lock, stock, and barrel, possibly to Intel.

Intel today released its latest Graphics Driver for Windows (GDW). Version 15.60 WHQL (15.60.0.4849), which is applicable for integrated graphics embedded into 6th generation "Skylake," 7th generation "Kaby Lake," and 8th generation "Coffee Lake" processors. The drivers are WDDM 2.3 compliant (Windows 10 Fall Creators Update), and add support for Netflix HDR and YouTube HDR on Windows 10. The drivers also add support for 10-bpc (1.07 billion colors) displays over HDMI, and adds video decode hardware acceleration for several formats introduced after DirectX 12.

For those with beefier Iris Pro graphics, Intel GDW 15.60 adds optimization for "Middle-earth: Shadow of War," "Pro Evolution Soccer 2018," "Call of Duty: WWII," "Destiny 2," and "Divinity: Original Sin." As a WDDM 2.3 compliant driver, version 15.60 enables Windows Mixed Reality headsets plugged into the integrated graphics connectors. Download the driver from the link below.DOWNLOAD: Intel Graphics Driver for Windows 15.60

Intel Xeon Scalable processors are deployed by today's cloud service providers to deliver disruptive performance efficiency across a diverse range of cloud workloads. Today, Intel announced Amazon Web Services' (AWS) public cloud customers can now harness the workload-optimized performance that the Intel Xeon Scalable platform delivers in Amazon's latest cloud instance. Available now, the Amazon EC2 C5 instances are AWS' latest generation, most powerful compute-optimized instances with the best price-to-compute performance.

Intel Xeon Scalable processors are highly agile, high-performance compute engines that allow public cloud environments to seamlessly transition among general purpose compute, high-performance computing (HPC) and AI/deep learning compute. This agility provides public cloud users a wide range of options for their target workloads. Intel Xeon Scalable processors are uniquely architected for today's evolving cloud data center infrastructure, offering energy efficiency and system-level performance that average 1.65x higher performance over the prior generation Xeon processors.

Kontron, a leading global provider of Embedded Computing Technology (ECT), introduces a new member of its high-end industrial computer platforms for control cabinet environments - the Kontron KBox C-102-4. The new model allows the integration of up to four PCIe expansions slots and is thus ideally suited for users requiring a large number of additional interfaces, industrial I/Os, or fieldbuses.

The KBox C-102 series is now available in four alternative design variants: the compact KBox C-102-0 without additional expansion slots, the KBox C-102-1 and KBox C-102-2 with one or two PCI(e) expansion slots respectively, and the new KBox C-102-4 with four PCI(e) expansion slots. The industrial computers are used mainly for control, visualization, and inspection in the production process.

Following today's surprise announcement of an Intel-AMD collaboration (of which NVIDIA seems to be the only company left in a somewhat more fragile position), there have already been a number of benchmark leaks for the new Intel + AMD devices. While Intel's original announcement was cryptic enough - to be expected, given the nature of the product and the ETA before its arrival to market - some details are already pouring out into the world wide web.

The new Intel products are expected to carry the "Kaby Lake G" codename, where the G goes hand in hand with the much increased graphics power of these solutions compared to other less exotic ones - meaning, not packing AMD Radeon graphics. For now, the known product names point to one Intel Core i7-8705G and Intel Core i7-8809G. Board names for these are 694E:C0 and 694C:C0, respectively.

Rumors of the unthinkable silicon collaboration between Intel and AMD are true, as Intel announced its first multi-chip module (MCM), which combines a 14 nm Core "Coffee Lake-H" CPU die, with a specialized 14 nm GPU die by AMD, based on the "Vega" architecture. This GPU die has its own HBM2 memory stack over a 1024-bit wide memory bus. Unlike on the AMD "Vega 10" and "Fiji" MCMs, in which a silicon interposer is used to connect the GPU die to the memory stacks, Intel deployed the Embedded Multi-Die Interconnect Bridge (EMIB), a high-density substrate-level wiring. The CPU and GPU dies talk to each other over PCI-Express gen 3.0, wired through the package substrate.

This multi-chip module, with a tiny Z-height, significantly reduces the board footprint of the CPU + discrete graphics implementation, when compared to having separate CPU and GPU packages with the GPU having discrete GDDR memory chips, and enables a new breed of ultra portable notebooks that pack a solid graphics muscle. The MCM should enable devices as thin as 11 mm. The specifications of the CPU and dGPU dies remain under the wraps. The first devices with these MCMs will launch by Q1 2018.A video presentation follows.