Intel's Coffee Lake launch has shown the telltale signs of a product that wasn't originally planned to launch as early as it did. Intel's decision to pull the release date of Coffee Lake based CPUs - and its accompanying platform - have translated into an overall lack of availability for the latest Intel core processors, and a staggered launch for their platform chipsets, with only the higher-tier Z370 being available for motherboard designs as of writing.

It's expected that Intel's lower tier chipsets, such as the B360 chipset, will only be released during the first quarter of 2018. However, a recent leak that has surfaced in Sisoftware's Official Live Ranker has revealed a SuperMicro C7B360-CB-M board. following SuperMicro's known naming scheme, it's a somewhat "in your face" statement that this is a B360 chipset test board, in the Micro-ATX form-factor. The fact that this board has surfaced already (and especially considering SuperMicro's Z370 board, SuperMicro's C7Z370-CG-L, surfaced just 85 days before the platform launch) could point towards an earlier than expected release time-frame for B360 boards. It's arguable that this Intel generation is the one that offers itself the most to budget chipset offerings, considering Intel's Core i5 8400's placement as one of the best bang-for-buck CPUs from the Intel field in a long while.

"Industry contacts" have told TweakTown that a successor to Intel's well received 750 series NVMe drives will launch within weeks. The second generation Optane 900P SSDs will be available in both the U.2 and AIC (PCI-E 3.0) form factors, with capacities of 280, 480, 960 and 1500 GBs. Like the Intel 750 series, the Optane 900P has enterprise roots, namely Intel's ridiculously expensive 375GB P4800X; which we covered earlier. As the 900P is aimed at consumers, maybe more accurately prosumers, prices should be "affordable".Slide courtesy of TweakTown

A user from [H]ardOCP has posted on the website's forums an exchange he had with the customer service over at Newegg. If availability of Intel's latest 8th Gen CPUs was rumored to be limited before, this seems to bring some more credence to those reports. Case in point: over at Newegg, orders for the Core i5 8600K processor are currently being put on back-order, with estimated shipping dates of 15 to 20 days. Pore over the i7 8700K processor, though, and you'll find it currently out of stock.

Newegg has apparently ordered over 3000 units of the Core i7 8700K CPU alone, in order to keep pace with demand (these have been well-received chips as you can see on TPU's own reviews). Newegg expects these to come in at around a "3 to 5 weeks" time-frame. What separates this particular availability problem from being simply an issue of overly high demand is that Intel's Coffee Lake processors were already expected to be limited in availability even before they were launched. Remember that while Intel probably had such six-core processors as these taped out well in advance already, they did pull up their launch window so as to better compete with current AMD Ryzen offerings.

For those users who thought they'd like some silver with their Intel, german webshop Caseking has a product for you. The company has taken the binning concept that we've already seen with other webshops, which pass the onus of the silicon lottery towards themselves, and taken it to the next level. Caseking will offer Core i7 8700K products that have not only been binned towards achieving guaranteed speeds of 5 GHz, 5.1 GHz and 5.2 GHz, but they're also retrofitting these binned 8700K processors with a 99.9% purity silver heatspreader to improve operating temperatures for these guaranteed-overclocking processors.

After giving users the chance to have an M4-powered M.2 drive in the form of the PT920 Commando PCIe NVMe SSD, Apacer is looking to allow users to put even more figurative firepower inside their rigs. The new COMMANDO DDR4 memory sticks seemingly take a page from the G36c rifle's looks, which Apacer says "brings a real body blow to your opponents." The design "features a distinctive tactical rail which comes with effective heat dissipation. With COMMANDO DDR4 at your disposal, you will enjoy the exciting game play."

Apart from marketing talk, specs are pretty par of the course for DDR memory, with XMP 2.0 support, as well as AMD and Intel platform support. There are a number of configurations available, scaling in both clockspeeds and memory capacity, which you can check in the below table. Speeds for the Apacer COMMANDO DDR4 top out at 3466 MHz at 1.35 V, with timings of 18-18-18-42.

MSI, the world leading gaming motherboard manufacturer, together with the launch of Intel's 8th Gen processors, has prepared new motherboards, inviting PC Enthusiasts and Gamers to enter into a new world. Based on the new Z370 platform, MSI introduces a complete lineup in 4 segments with all models fully supporting Intel 6-core CPUs.

The next generation MSI motherboards are found in the well-known three GAMING segments: Enthusiast GAMING, Performance GAMING and Arsenal GAMING to serve perfectly to any type of gamer around the world. For designers, content creators and workstation users, MSI has prepared new PRO Series models. MSI motherboards are packed with unique features to cater to any PC Enthusiast, Gamer or Professional user. To top things off, making sure anyone can squeeze maximum performance out of the new 6-core processors, Z370 GODLIKE GAMING has been created as the most extreme Z370 motherboard available.

EVGA has announced three new enthusiast motherboards based on Intel's Z370 Express chipset. These boards support Intel's brand new eighth generation processors, including the powerful i7 8700K. All three boards feature metal-reinforced PCI Express and memory slots, NVIDIA SLI support, and M.2 slots. Also included are Gigabit NICs from either Intel or Killer, multiple headers for RGB lighting, and unique cutouts in the boards to make cable routing easier.

The Z370 Series comes in three models: the full ATX Z370 Classified K and Z370 FTW, and the Z370 Micro in the micro ATX form factor. All three are clad in a black and gray color scheme, leaving color accents and lighting styles up to the user. VRM and southbridge heat sinks will keep overclocked systems cool, with the two larger boards sporting gray heat sink and I/O covers with RGB lighting that can be synced with the onboard headers. All three boards have 100% solid state capacitors, and DUAL switchable onboard BIOS chips, which should make for hassle-free overclocking.

Hot from the semiconductor presses, but even hotter from our very own reviews of Intel's latest-generation Coffee Lake CPUs, Intel's 8700K, unlocked six-core, 12-threaded processor has already been overclocked up to 7.45 GHz under extreme cooling. The feat, achieved by HWBOT user Kovan Yang, currently stands in first place of 8700 K processors, and is in sixth-place in overall CPU frequency ranking - which marks the first time in a while an Intel Core branded processor has achieved such a feat.

The overclock was achieved in a system that was configured with MSI's Z370 Godlike Gaming motherboard, unspecified DDR4 memory, an NVIDIA 8400 GS graphics card. The INtel 8700K was configured with a multiplier of 73x, and the base BUS speed was increased to 101 MHz. Expect more daring overclocks with Intel's latest family of Core processors in the future - der8auer has achieved a speed of 7.3 GHz on the same processor already, but more users and big overclock players are sure to make their overclocking feats known. In our own review, our very own W1zzard found that Intel's latest 8700K was the fastest, more future-proof consumer-level, non-HEDT Intel processor, and that it can be easily overclocked on air to 5 GHz.

G.SKILL International Enterprise Co., Ltd., the world's leading manufacturer of extreme performance memory and gaming peripherals, is thrilled to announce new Trident Z and Trident Z RGB specifications for latest 8th Gen Intel Core processors built on the Coffee Lake microarchitecture and Z370 chipset motherboards, manufactured with ultra-high performance Samsung B-die DDR4 ICs.

Fastest 32 GB (4x 8GB) RGB Memory on the Market
With every new platform launch, G.SKILL aims to maximize performance with higher memory specifications. This time paired with the new 8th Gen Intel Core processors and Z370 chipset, the Trident Z RGB memory is pushed to a blistering DDR4-4000 MHz CL18-19-19-39 32 GB (4x 8 GB) at 1.35 V. The image below shows the new RGB kit stress tested on the ASUS ROG MAXIMUS X HERO (WI-FI AC) motherboard and an Intel Core i5-8600K processor.

Intel this Tuesday, issued a curious-looking product-change notification (PCN) directed at retail-channel distributors, which points to the re-branding of 7th generation Pentium "Kaby Lake" desktop processors under the new Pentium Gold brand (PCN #115827-00). The re-brand affects retail SKUs of the Pentium G4560, G4620, and G4600. Intel is borrowing the precious-metal nomenclature from its Xeon product-line over to the Pentium brand, which will help consumers tell the MSDT (mainstream-desktop) Pentium processors from the ULP (ultra low-power) chips branded Pentium.

When this product-change comes into effect from the 2nd of November, 2017, MSDT Pentium dual-core chips will be branded Pentium Gold, while low-power "Gemini Lake" SoCs will bear the Pentium Silver brand, besides Celeron. Re-branded names apart, the Pentium Gold SKUs will be identical to the parts they are replacing. The Pentium G4560, for example, will be re-branded Pentium Gold G4560 (or simply "4560") and will carry an identical feature-set. You probably won't even need to update your motherboard BIOS (of your 100-series and 200-series chipset motherboards) to use these chips. It's not likely that these chips will work on 300-series chipset motherboards since they feature a different pin-map, and the retail box design will reflect that with clear markings. The name change also comes with a refreshed case-badge and a slightly modified box design.

A member of the HKEPC tech community, with access to an upcoming Core i7-8700K six-core mainstream-desktop processor, wasted no time in de-lidding it (removing its integrated heatspreader or IHS). It was revealed that Intel is still using thermal-paste between the IHS and the CPU die. The "Coffee Lake" die itself is as wide as the "Kaby Lake," but is visibly longer. It has a die area of approximately 151 mm², compared to the 126 mm² of "Kaby Lake." This is due to its increased CPU core count to 6, and a proportionate increase in last-level cache (L3 cache) to 12 MB. The die is marginally northwest of center, so you can get away placing your TIM blob dead-center of the IHS.

Intel Corporation today announced that the company's former CEO Paul Otellini passed away in his sleep Monday, Oct. 2, 2017, at the age of 66. Paul Otellini became Intel's fifth chief executive officer in 2005. Under his leadership the company made important strategic, technological and financial gains. These included transforming operations and cost structure for long-term growth; assuming a leadership position in the server market segment; and maintaining profitability during the global recession.

Other accomplishments included signing on notable new customer engagements, such as winning the Apple PC business, and business partnerships and strategic acquisitions that expanded Intel's presence in security, software and mobile communications. On the financial front, Intel generated more revenue during his eight-year tenure as CEO than it did during the company's previous 45 years. In the last full year before he was named CEO, Intel had $34 billion in sales; by 2012, the number had grown to $53 billion.

Intel is set to release its newest generation of processors, known as code name Coffee Lake in just a few days. Recent controversy has focused around the inability of newer processors to be used with motherboards supporting the previous generation CPUs. Intel has released data sheets for Coffee Lake CPUs, and images of the socket's layout support Intel's statement that Coffee Lake will indeed need a new socket design. Specifically, there are more pins responsible for delivering the main power for the CPU cores, known as VCC pins, with Coffee Lake motherboards sporting 146 VCC pins illustrated in the first image below, compared to Kaby Lake and Skylake's 128 illustrated in the second image.

With these pins responsible for delivering power to the CPU cores, this may suggest that previous generation motherboards allowed for lower power operation than is possible with the higher core count of Coffee Lake processors. Whatever the reason, it definitely confirms that Coffee Lake CPUs are hardware-incompatible with previous generation motherboards, and not simply a software or BIOS-level lock.

Normally, motherboards go on shelves at the same time as processors do. In this occasion, Intel has confirmed that their Coffee Lake processors will launch on October 5. As per tradition, images of some of the upcoming motherboards from various brands have been leaked on the web. Meanwhile, we know that many of you are already planning your future Z370 builds or deciding on which motherboard to accompany your PC upgrade. If you're a fan of ASUS products, we have a treat for you. From what VideoCardz have gathered so far, ASUS plans to release sixteen different models from their Republic of Gamers (ROG), The Ultimate Force (TUF), Strix and Prime series.

The ROG line will father five Maximus X models: Apex, Formula, Code, Hero with Wi-Fi AC, and Hero. There is no mention of an Extreme model, but our experience tells us that model usually comes at a later date. It's also possible that it may never see the light of day for this generation. From what we can make of the images, the Maximus X Hero will employ a 10-phase digital VRM design. The motherboard retains the black and grey theme with RGB illuminated heatsinks just like its predecessor. Wi-Fi and Bluetooth functionality were present on the Code models and above in the previous generation. We're happy to see ASUS offering a Hero variant this time with those two functionalities.

Ahead of the 5th October reviews NDA, Lab501 posted their review of the Core i7-8700K six-core processor using samples not provided by Intel, paired with an Aorus Z370 Ultra Gaming motherboard. The tests reveal that the i7-8700K trades blows with the Ryzen 7 1800X in multi-threaded tests, despite two fewer cores, and has a clear leadership in single-threaded tests. It also reveals that the i7-8700K may not be as pricier than the i7-7700K as previously thought. Interestingly, the i7-8700K also spells trouble for "Skylake-X" Core i7 SKUs such as the i7-7800X and i7-7820X, as it offers multi-threaded performance in proximity to them, while being cheaper overall.

The Core i7-8700K is able to sustain its Turbo Boost frequencies of 4.20 GHz better than Intel's other Core X HEDT chips, which translates into higher gaming performance. The tests reveal that today's games still don't need six cores, and on the merit of high sustained clock speeds alone, the i7-8700K is shaping up to be among the fastest processors you can choose for gaming PC builds. Lab501 also got the i7-8700K to overclock to 5.1 GHz with relative ease. The chip runs feisty hot at overclocked speeds, but rewards with HEDT-like performance. Find other interesting findings of Lab501 in the source link below.

The Intel Z370 chipset launch provides a thrilling end to an exciting year of technology breakthroughs for computer enthusiasts. As the CPU competition heats up, there's never been a better time to buy or upgrade, with an unprecedented range of power and performance options to choose from. ASRock understands that many users are looking to a new Z370 motherboard to provide extreme performance, maximum overclocking ability, and limitless expandability. ASRock promises to deliver all that, and more.

To support the increase of core count on the 8th Generation Intel Core Processors, ASRock has upgraded its CPU VRM design to provide more power phases than ever. More cores can demand more power when overclocking, and so, with up to twelve power phases, the ASRock power system is designed for maximum overclocking ability and stability. While the spotlight is focused on CPU and graphics performance, less glamorous subsystems are just as important. These new ASRock motherboards feature Hyper DDR4 design to provide outstanding memory overclocking ability - up to an insanely fast DDR4 4333 MHz

Intel has been steadily increasing its portfolio of products in the AI space, through the acquisition of multiple AI-focused companies such as Nervana, Mobileye, and others. Through its increased portfolio of AI-related IP, the company is looking to carve itself a slice of the AI computing market, and this sometimes means thinking inside the box more than outside of it. It really doesn't matter the amount of cores and threads you can put on your HEDT system: the human brain's wetware is still one of the most impressive computation machines known to man.

That idea is what's behind of neuromorphic computing, where chips are being designed to mimic the overall architecture of the human brain, with neurons, synapses and all. It marries the fields of biology, physics, mathematics, computer science, and electronic engineering to design artificial neural systems, mimicking the morphology of individual neurons, circuits, applications, and overall architectures. This, in turn, affects how information is represented, influences robustness to damage due to the distribution of workload through a "many cores" design, incorporates learning and development, adapts to local change (plasticity), and facilitates evolutionary change.

IBASE, a global leader in the manufacture of embedded computing and IIoT solutions, launches its new IB990 PICMG 1.3 full-size CPU card. The board supports the latest 7th/6th Generation Intel Xeon/Core i7/i5/i3 processors with speeds up to 4.0GHz. Based on the chipset family formerly known as Skylake, Intel C236 and Q170 Express chipsets, the high-performance IB990 SBC is built with two DIMM sockets to support DDR4 2133 MHz memory modules with up to 32GB in total and six superfast SATA III ports featuring RAID 0/1/5/10 and 6 Gb/s speed.

As a perfect solution for control systems in factory automation and other industrial applications, IB990 is designed for compute, data and graphics intensive applications and enables up to three independent displays via DVI-I, VGA and DVI-D interface. This long-life single board computer incorporates a rich set of I/O connectivity including two Gigabit Ethernet, four COM, two USB 2.0 and three USB 3.0 ports, plus a Mini PCI-E expansion socket for optional wireless modules. Additionally, the IB990 takes advantage of Intel AMT 11.0 for remote management and powering-on functionalities.

While enthusiasts are preparing their wallets for the Intel Coffee Lake launch on October 5, Gigabyte is diligently filling retailers' shelves with their upcoming Z370 AORUS motherboards. With as many as six different models to choose from, consumers will surely find a motherboard that best suit their needs. The Gigabyte Z370 AORUS Gaming 7, in particular, is bound to attract a lot of attention from the more hardcore crowd. Being the cream of the crop of Gigabyte's Z370 lineup means that this motherboard will bring many unique features to the table.

Overclocker extraordinaire Der8auer has been able to put Intel's flagship, HCC HEDT 7980XE CPU, through its paces under extreme cooling, which resulted in a veritable show of force from the blue giant. Intel's $1,979, 18-core, 36-thread CPU has cemented itself as the flagship consumer CPU of choice, surpassing AMD's 1950X Threadripper in all fields. And yes, we do mean single-core and multi-core benchmarks, but also power consumption figures.

With 18 cores in need of adequate cooling, every piece of real-estate that may serve as an heatsink of sorts comes at a premium; that is why thermal paste for this Intel processor was applied not only to the CPU die itself, but also to the entire PCB around it. Der8auer says that doing this allows heat to be better dissipated form the CPU die, allowing for up to 400 MHz increased clock-speeds under load. Direct contact with the die was also tried, and achieved by cutting off the central pat of the IHS, while keeping the edges of it as a way of better load balancing the weight of the cooler (in this case, an LN2 cooler) over the CPU's PCB, in order to avoid different amounts of pressure on the CPU pins. However, the extreme overclocker ended up not recommending that venue, for it didn't offer consistent success in their extreme cooling efforts.

Intel expanded the upper end of its Core X "Skylake-X" HEDT processor family, with the introduction of the Core i9-7980XE 18-core flagship processor, and the i9-7960X 16-core processor. Designed to give pro-sumers and PC enthusiasts extreme mega-tasking performance, the i9-7980XE features all components physically present on the 14 nm "Skylake-X" silicon, featuring 18 cores, with HyperThreading enabling 36 threads; 1 MB of dedicated L2 cache per core, 24.75 MB of shared L3 cache, and rather restrained clock speeds of 2.60 GHz, with Turbo Boost speeds of 4.20 GHz, and Turbo Boost Max 3.0 frequency of 4.40 GHz.

Despite its gargantuan core-count, the TDP of this chip is rated at 165W, lower than the 180W rated for competing Ryzen Threadripper processors. The other high-end processor launched by Intel is the Core i9-7960X. This 16-core/32-thread chip features clock speeds of 2.80 GHz, with 4.20 GHz Turbo Boost, and 4.40 GHz Turbo Boost Max 3.0. It features 22 MB of shared L3 cache, and 1 MB of dedicated L2 cache per core. The Core i9-7980XE is priced at USD $1,999 in the retail channel; while the Core i9-7960X goes for $1,699.

Intel today announced that its new family of 8th Gen Intel Core desktop processors will be available for purchase beginning Oct. 5, 2017. The new desktop processor family is built for gamers, content creators and overclockers who require premium performance. Ranging from Intel Core i3 to Intel Core i7, these processors deliver premium performance for what comes next, opening the door for a new level of faster, easier and more immersive experiences.

This new family introduces the first-ever 6-core Intel Core i5 desktop processor and first-ever 4-core Intel Core i3 desktop processor. The family offers a wide range of performance options for consumers with unlocked1 "K" processors that deliver maximum tuning flexibility at each brand level and up to 40 platform PCIe 3.0 lanes for system expandability on graphics, storage and I/O. These processors are supported with new Intel Z370 chipset-based motherboards.

Intel is reportedly delaying the roll-out of its first processors built on its 10 nanometer silicon fabrication process, codenamed "Cannon Lake" for the third time since its inception. The first products based on the silicon will now come out only by late-2018. In the meantime, Intel could continue to ride on its new 8th generation Core "Coffee Lake" processors, including the augmentation of an 8-core mainstream desktop (MSDT) part in the second-half of 2018.

Notebook manufacturers are less than enthusiastic about "Cannon Lake," and plan to skip it altogether for its successor, codenamed "Ice Lake," which could come out in 2019. It won't be the first time OEMs have done this, as Intel's 5th generation Core "Broadwell" architecture was mostly skipped over in the notebook and MSDT segments.

The 8-core processor Intel is planning to launch in the second half of 2018 will be based on the current 14 nanometer "Coffee Lake" micro-architecture, according to leaked XTU errata log. A curious looking change-log entry reads "[CFL] Added support for 8,2 core," where "CFL" is the three-letter contraction of "Coffee Lake," just as "KBL" stands for "Kaby Lake" and "HSW" for "Haswell."

This hints at the two directions in which Intel is expanding its 8th generation mainstream desktop lineup. On the upper-end of the spectrum, one can expect the augmentation of 8-core/16-thread parts, while at the lower end, one can expect dual-core parts, likely branded under the Pentium and Celeron brands. Intel's MSDT lineup will be led by 6-core parts under the Core i5 and Core i7 extensions, and quad-core parts under the Core i3 extension; with 6-core/12-thread Core i7 SKUs leading the pack till the second-half of 2018.

Intel is undoubtedly at the forefront of silicon processing technology these days, and has been for a long time. Being a fully integrated company from the bottom up, through the design and actual production of its silicon semiconductors, really does have a way of either paying of tremendously (as has been the case with Intel), or not at all (as was the case with AMD). That fabrication processes' nm ratings don't mean much in thhe industry right now has been the case for a while now; different companies use different calculations towards achieving a 22 nm or 14 nm claim, with some components in the same nm process having almost double the size of the same components in a competitor's equivalent. Intel has always been one of the more adamant defenders of an industry-wide categorization, both to avoid confusion and - naturally - put into perspective their process leadership.