G.SKILL International Enterprise Co., Ltd., the world's leading manufacturer of extreme performance memory and gaming peripherals, is announcing the world's highest performance DDR4 SO-DIMM memory running at DDR4-4000 MHz CL18-18-18-38 32 GB (4x8 GB) at 1.35V. Combining high frequency and ultra-low timing, this Ripjaws DDR4 SO-DIMM memory kit is capable of achieving the new high level of performance through rigorously hand-binned Samsung B-die DDR4 IC components.

Just two months ago, G.SKILL announced the high performance DDR4-3800MHz CL18-18-18-38 Ripjaws DDR4 SO-DIMM kit. Aiming to push memory limits to yet another level, G.SKILL strives to deliver the best memory performance possible on current systems, and this time for small form factor (SFF) PCs. With this new SO-DIMM memory kit, SFF PCs can now unlock the full potential of memory performance, as shown in the following screenshot, where this new memory kit is tested for over 6 hours on the ASRock X299E-ITX/ac mini-ITX motherboard with the Intel Core i9-7900X processor.

Intel today announced the availability of the Intel Stratix 10 MX FPGA, the industry's first field programmable gate array (FPGA) with integrated High Bandwidth Memory DRAM (HBM2). By integrating the FPGA and the HBM2, Intel Stratix 10 MX FPGAs offer up to 10 times the memory bandwidth when compared with standalone DDR memory solutions1. These bandwidth capabilities make Intel Stratix 10 MX FPGAs the essential multi-function accelerators for high-performance computing (HPC), data centers, network functions virtualization (NFV), and broadcast applications that require hardware accelerators to speed-up mass data movements and stream data pipeline frameworks.

In HPC environments, the ability to compress and decompress data before or after mass data movements is paramount. HBM2-based FPGAs can compress and accelerate larger data movements compared with stand-alone FPGAs. With High Performance Data Analytics (HPDA) environments, streaming data pipeline frameworks like Apache Kafka and Apache Spark Streaming require real-time hardware acceleration. Intel Stratix 10 MX FPGAs can simultaneously read/write data and encrypt/decrypt data in real-time without burdening the host CPU resources.

An engineering sample of Intel's next flagship notebook processor, the Core i7-8720HQ, surfaced on Chinese tech-forums. Built in the same 1440-pin BGA package as 7th generation Core mobile processors, this chip is unique, in that it is truly "8th gen" featuring the six-core "Coffee Lake" silicon. The chip features 6 cores, 12 threads enabled by HyperThreading, and yet interestingly, only 9 MB enabled of the 12 MB L3 cache physically present on the chip. The chip is clocked at 2.40 GHz, with 3.60 GHz Turbo Boost frequency. It rivals the desktop Core i5-8600K in multi-threaded tests, making up for the lower clock speeds with HyperThreading. The chip could power the next generation of high-end gaming notebooks, when it launches some time in Q1-2018.

Japanese cooling expert Scythe presents the significantly improved "Mark II" version of its Kotetsu CPU Cooler. While keeping the basic design of the predecessor, Kotetsu Mark II comes with both visual and technical improvements. One of the key advances is the offset, where the heatsink is not centered but moved to the side and the rear. This allows the CPU Cooler to increase the distance to the first PCI-Express slot, offering unchallenged compatibility to VGA card with outsized cooling solutions and avoid clearance issues with memory modules with large heatsinks at the same time. Kotetsu Mark II is able to deliver a significant performance boost compared to the first version, thanks to an optimization of the manufacturing process. Visual improvements include the new aluminum-look top-cover and nickel-plated heatpipes and base-plate. The Kotetsu Mark II is bundled with a high-quality PWM-fan from Scythe's Kaze Flex 120 PWM series. In spite of the significant improvements of performance and visuals, Kotetsu Mark II price is remaining to assure the best possible price-performance ratio.

Intel seems to be looking to further expand its lineup of the 900P SSD, according to an official Intel document the folks at myce.com got access to. The file, a Product Change Notification (PCN), is usually used by Intel to denote revisions or new products for their manufacturing facilities. And the PCN 115990 - 00 lists increased capacities of 960 GB and 1,5 TB for their 900P SSD.

The newly listed products aren't the only things of note here, though. There have also been some label changes, and reduced voltages across the board. The retail box label will now also include the firmware version the unit ships with, which will definitely come in handy in case there is a known bad batch in these SSDs (as unlikely as that is to be).

LG Electronics (LG) will introduce its latest LG gram notebooks that deliver superior portability, enhanced powerful performance and convenience features. Since the incredibly lightweight notebook line debuted in 2014, LG has consistently surprised consumers by maximizing portability without sacrificing performance. The 2018 LG gram notebooks push the boundaries of portable computing with improved mobility and durability, as well as upgraded processors and more versatility.

"The new LG gram PCs have been designed for those users who want an all-round, high performance notebook with maximum portability," said Tim Alessi, head of product marketing at LG Electronics USA. "The 2018 gram series ticks all the boxes for users who want versatile and lightweight notebooks with faster processing capabilities."

Intel has decided to rollback investment - read, funding - for its "Intel inside" marketing campaign, which has been with us since 1991. The "Intel inside" campaign is one where Intel has been offering OEMs and system integrators some amount of compensation and marketing funding for their Intel-based products, and is aimed at helping OEMs and channel partners drive PC sales growth. However, if CRN's report is right, Intel is looking towards cutting funding for this program by 40% to 60%.

OEMs have been including Intel's "Intel inside" funding as part of their annual marketing budgets, and the reduction of this funding from Intel can go one of two ways: manufacturers reduce marketing budget, or keep the same budget, but pass on the increased expenses towards consumers. For companies, the second option is likelier to be true, simply because marketing plays such a prominent role in company's visibility in the usually crowded markets.

Shuttle Computer Group, Inc., one of the world's leading designers of small form computers, announces a new and powerful cube-sized computer, its SZ270R9, designed for advanced home and portable gaming, along with virtual reality applications. Unlike other PCs, once set, users can overclock with the Turbo button for the quickest, most realistic action. In spite of its small size, it has an impressive expansion capability and storage capacity. With lots of interior space, the SZ270R9 supports large-format dual-slot graphics cards; users can install up to four 2.5" or 3.5" hard drives and two m.2 bays. It also supports Intel's new Optane Memory to improve data processing and system speed.

"This is the ultimate gaming PC, power packed with an external design that looks like you're ready for battle," said Robert Garcia, channel manager, Shuttle Computer Group. "And when you press the overclock button, watch out! You'll be the winner for sure."

The latest version of Intel's desktop client-platform roadmap has been leaked to the web, which reveals timelines and names of the company's upcoming product lines. To begin with, it states that Intel will upgrade its Core X high-end desktop (HEDT) product line only in Q4-2018. The new Core X HEDT processors will be based on the "Cascade Lake-X" silicon. This is the first appearance of the "Cascade Lake" micro-architecture. Intel is probably looking to differentiate its Ringbus-based multi-core processors (eg: "Coffee Lake," "Kaby Lake") from ones that use Mesh Interconnect (eg: "Skylake-X"), so people don't compare the single-threaded / less-parallized application performance between the two blindly.

Next up, Intel is poised to launch its second wave of 6-core, 4-core, and 2-core "Coffee Lake" processors in Q1-2018, with no mentions of an 8-core mainstream-desktop processor joining the lineup any time in 2018. These processors will be accompanied by more 300-series chipsets, namely the H370 Express, B360 Express, and H310 Express. Q1-2018 also sees Intel update its low-power processor lineup, with the introduction of the new "Gemini Lake" silicon, with 4-core and 2-core SoCs under the Pentium Silver and Celeron brands.

Today, Amazon Web Services announced DeepLens, its first fully programmable, deep learning-enabled wireless video camera designed for developers. It was revealed during AWS CEO Andy Jassy's keynote at its annual re:Invent conference in Las Vegas. AWS and Intel collaborated on the DeepLens camera to provide builders of all skill levels with the optimal tools needed to design and create artificial intelligence (AI) and machine learning products.

AI and machine learning are poised to power a new generation of smart industries, including smart homes, smart retail, smart industrial and many others, making lives easier through intelligent interactions with devices. This collaboration reinforces Intel's commitment to providing developers with tools to create AI and machine learning products, and follows the recent introduction of the Intel Speech Enabling Developer Kit, which provides a complete audio front-end solution for far-field voice control and makes it easier for third-party developers to accelerate the design of consumer products integrating Alexa Voice Service.

So much of the discussion around autonomous driving has naturally focused on the car as a mode of transportation, but as driverless cars become a reality, we must start thinking of the automobile as a new type of consumer space. In fact, we have barely scratched the surface in thinking about the way cars will be designed, the interaction among passengers, and how passengers will spend time while they are riding and not driving. In this respect, autonomous driving is today's biggest game changer, offering a new platform for innovation from in-cabin design and entertainment to life-saving safety systems.

Advancing what's possible in autonomous driving, today at the Los Angeles Auto Show, Intel announced a collaboration with entertainment company Warner Bros.* to develop in-cabin, immersive experiences in autonomous vehicle (AV) settings. Called the AV Entertainment Experience, we are creating a first-of-its-kind proof-of-concept car to demonstrate what entertainment in the vehicle could look like in the future. As a member of the Intel 100-car test fleet, the vehicle will showcase the potential for entertainment in an autonomous driving world.

In order to avoid severe security vulnerabilities for the platforms, MSI motherboards now support the latest Intel Trusted Execution Engine (TXE) 3.0 for safer system protection. According to recent Intel comprehensive security review, security vulnerabilities are identified and could potentially allow attackers to gain unauthorized access to platforms features, secrets and 3rdparty secrets protected by Intel TXE. Therefore, Intel has validated and released Intel TXE 3.0 updates to address the encountered security situations.

Currently all MSI 100,200 and 300 series motherboards are supporting the newest Intel TXE 3.0 by updating to the latest BIOS and installing the latest software updates. MSI always places strong emphasis on security and anti-hack issues to makes sure all MSI motherboard users are operating under the most secure circumstances. MSI will continue to provide additional updates if necessary to ensure maximum platform security protection for users.

GIGABYTE TECHNOLOGY, a leading manufacturer of motherboards and graphics cards, has implemented safety measures aligned with Intel's response to the Intel Management Engine (ME) and Intel Trusted Execution Engine (TXE) security vulnerabilities, so customers can be reassured their motherboards are fully protected. For all customers who have purchased GIGABYTE motherboards for Intel platforms, please visit the official website to download the latest BIOS versions as well as ME and TXE drivers.

The updates for the motherboards will be released starting with the Z370, 200 series and then previous generation motherboards. For more information on the Intel ME and TXE security vulnerabilities, please visit this page. GIGABYTE is committed to ensuring the quality and service of our motherboards. Any issues that affect the user's experience with our products will be addressed with the utmost concern.

GE Healthcare today announced an expanded partnership with Intel that aims to enhance patient care and reduce costs for hospitals and health systems using digital imaging solutions, deployed via edge and cloud. Together, the companies anticipate their solutions will offer greater hospital efficiency through increased asset performance, reduced patient risk and dosage exposure - with faster image processing - and expedited time to diagnosis and treatment.

Through the expanded partnership, GE Healthcare will use the new Intel Xeon Scalable platform with an aim towards lowering the total cost of ownership for imaging devices by up to 25 percent. Paired with GE Healthcare's imaging solutions, the Intel Xeon Scalable platform may improve radiologists' reading productivity compared to the prior generation by reducing first image display down to under 2 seconds and full study load times down to under 8 seconds.

"Radiologist workdays can be enhanced by use of real-time data analytics and increased performance," said Jonathan Ballon, vice president Internet of Things Group at Intel. "The combination of innovative imaging solutions from GE Healthcare with the breakthrough speed of Intel processors promises great advances in imaging that could make a real difference in patient care."

Intel created the Core i9 brand to differentiate two key groups of Core X series HEDT (high-end desktop) processors, with the Core i7 X-series parts featuring 28-lane or 16-lane PCIe interfaces, while the Core i9 X-series parts featuring the full 44-lane interfaces present on the "Skylake-X" silicon. The Core i9 brand also earned a degree of exclusivity as it allows Intel to ask upwards of $999 for these client-segment parts, with the top-end i9-7980XE scraping the $2,000-mark. Intel sees the potential for a similar segmentation for its mobile processor lineup, even if not on grounds of PCIe lane budget or core-counts.

The Core i9 mobile processor family could bring the highest-levels of 6-core "Coffee Lake" desktop processor performance to the notebook platform. Intel is giving final touches to the Core i9-8000 series "Coffee Lake-H" processor lineup, which could feature the full 6-core/12-thread configuration of the "Coffee Lake" silicon, alongside 12 MB L3 cache. The first SKU in the lineup could be the Core i9-8950HK, sniffed out from the change-log of the latest FinalWire AIDA64. These chips could enable large (>17-inch) gaming notebooks with one or more high-end graphics cards, the latest advancements in cooling, 4K UHD or curved displays, etc.

GIGABYTE TECHNOLOGY Co. Ltd, a leading manufacturer of motherboards and graphics cards, has unveiled the new X299 AORUS Gaming 7 Pro motherboard. With support for the new Intel 18-Core i9 7980XE processor, the new motherboard is ready to elevate performance to the next level. Featuring an updated VRM design paired with Smart Fan 5 technology to satiate the power demands of the new 18-core processor while keeping the system icy cool, the new X299 AORUS Gaming 7 Pro is the definitive motherboard of choice for users who value performance first and foremost.

"The X299 AORUS Gaming 7 Pro motherboard is designed to fully support Intel's newest Core i9 7980XE processor." said Vincent Liu, Senior Associate Vice President of GIGABYTE's Motherboard Business Unit. "With our tried-and-true approach and seasoned experience, we have designed a motherboard that truly fulfills enthusiasts' highest expectations."

Security researchers have found glaring security flaws with Intel Management Engine, the on-chip micro SoC that, besides governing the functionality of the processor, provides on-chip management and security features. These security flaws render "potentially millions" of PCs and notebooks, based on Intel processors, according to the researchers. Intel on Monday released a Detection Tool application that lets you identify vulnerabilities in the Management Engine of your Intel processor-powered PC, and suggests updates to Intel Management Engine drivers, or points to BIOS updates from your PC manufacturer.

Updates to Intel ME are specific to TXE 3.0 (trusted execution engine version 3.0), which is featured on processors based on "Skylake," "Kaby Lake," and "Coffee Lake" micro-architectures, across client- and enterprise market segments, and Atom processors released in the past three years. Intel chronicled this security flaw further under Security Advisory 86, and released the SA-00086 Detection Tool.

As big data usage is becoming ubiquitous, and workload data-sets increase in both size and complexity, new ways of connecting processing resources to storage are being developed. Intel and Micron's partnership in developing 3D XPoint memory came as a way for computer systems to reduce their bottlenecks in storing data for processing, with a particular emphasis on reducing latency. Samsung, however, has enough resources to try and provide alternatives for the emergent market needs, and being one of the most important players in the NAND industry, it seems the company is betting on the Z-NAND wagon.

For now, Z-NAND as it is being developed by Samsung, is expected to be a new rendition of SLC (Single-Level Cell) NAND, with increased controller tweaks and improvements to achieve greater IOPS in both random and sequential workloads. SLC has already been widely used in the SSD market, though in recent years it has been giving way to density-oriented technologies, such as MLC and, more recently, TLC NAND, in an effort to lower the $/GB equation. Z-NAND is a return to the SLC roots, with some very relevant tricks up its sleeve - while 3D XPoint's call to fame was sometimes up to 10x lower latency (in the order of 10/10μs), Z-NAND is also bringing latency to levels hitherto unknown to NAND memory - specifically, to the 12-20/16μs realms.

Intel is guiding its motherboard partners to remove legacy BIOS support from their UEFI firmware by 2020. The company's client- and enterprise-platforms that come out in 2020 will lack CSM (compatibility support module), a component which lets UEFI-unaware operating systems and bootable devices run on newer machines with UEFI. Devices featuring this CSM-devoid runtime will be graded "UEFI Class 3," as the runtime only exposes UEFI or UEFI PI interfaces.

This practically marks the end of 32-bit operating systems on the newer machines, as 32-bit Windows and desktop Linux distributions require CSM. You'll still be able to use 32-bit software running on 64-bit Windows through WoW64 translation layers. The lack of CSM will also affect devices with 16-bit OpROM, such as older network adapters, and older RAID HBAs. You'll have to depend on OS-based programs to configure those devices. Newer versions of Windows Secure Boot will require UEFI Class 3 devices to function. This also affects booting with your main display plugged into graphics cards older than 4 years (launched roughly before 2013), which lack UEFI-ready video BIOS.

There were some rumors regarding an expected low availability of Intel's latest, 8th Gen "Coffee Lake" CPUs. Then, in a new report, those rumors were sort of confirmed by Newegg. Now, we have it straight from the blue giant themselves, as Intel has announced that they're adding another facility to their 8th Gen Coffee Lake production and certification facilities. Stock of Intel 8th Gen CPUs has been spotty, to say the least, and pricing of the lineup's unlocked CPUs (8600K and 8700K, which are the most interesting for enthusiasts) have been particularly affected. If current output isn't enough to satisfy demand, the oldest trick in the book is to simply improve output. And Intel is doing it.

While Intel has been mainly using its assembly and test facilities based in Malaysia, the company is adding a new, certified assembly to the list: one in Chengdu, China. That shouldn't send alarms ringing, however; Intel's assembly and test facilities are a part of Intel's Copy Exactly! (CE!) program. This means that in order to be certified, all facilities must have identical methodologies and process technologies across different production sites throughout the world - there should be no quantifiable difference in quality. Intel's customers will begin to receive the aforementioned processors assembled in China starting from December 15. There is no real way to know exactly how much difference the new assembly facility will make on the worldwide supply of Intel 8h Gen CPUs - but it should only improve.

Intel today announced substantial advances in its wireless product roadmap to accelerate the adoption of 5G. Highlights include the introduction of the Intel XMM 8000 series, Intel's first family of 5G new radio (5G NR) multi-mode commercial modems, and Intel's latest LTE modem, the Intel XMM 7660. Intel also announced it has successfully completed a full end-to-end 5G call based on its early 5G silicon, the Intel 5G Modem - a key milestone in its development. Finally, the Intel XMM 7560 modem unveiled at Mobile World Congress 2017 has achieved gigabit-class speeds.

"Intel is committed to delivering leading 5G multi-mode modem technology and making sure the transition to 5G is smooth," said Dr. Cormac Conroy, Intel corporate vice president and general manager of the Communication and Devices Group. "Our investments in a full portfolio of modem technologies and products are critical to achieving the vision of seamless 5G connectivity."

Intel announced today that it has issued a notice of redemption to redeem on December 18, 2017 all of its outstanding 2.95% Junior Subordinated Convertible Debentures due 2035 (CUSIP Number 458140AC4) (the "Securities"). As of November 15, 2017, approximately $1.6 billion of the Securities was outstanding.

The Securities called for redemption will be redeemed at a stated redemption price equal to 100% of the aggregate principal amount of such Securities, plus accrued and unpaid interest to (but excluding) the redemption date.

The conversion rate of the Securities as of November 16, 2017 is 37.1860 shares of Intel common stock per $1,000 principal amount of the Securities, which is equivalent to a conversion price of $26.89 per share of common stock. The Securities called for redemption may be converted at any time before 5:00 p.m., New York City time, on December 15, 2017, the business day immediately preceding the redemption date. Intel has elected to settle the conversion obligation with respect to the Securities in cash.

Today, Intel launched a fundraising effort on Charitybuzz to benefit the Second Harvest Food Bank of Santa Clara and San Mateo counties. The company is auctioning a VIP experience at the 2018 Consumer Electronics Show in Las Vegas including travel, deluxe lodging and a backstage meet and greet with Intel CEO Brian Krzanich before his opening keynote on Jan. 8, 2018.

"CES is an incredible show for anyone interested in the future of technology, and I'm really excited to share a VIP CES experience while raising money for a great cause," Krzanich said. "The top bidder will be my guest at the show and get exclusive access to our opening keynote, exhibit space and more."

The first socket LGA1151 motherboard based on Intel's upcoming Z390 Express chipset was spotted on SiSoft SANDRA database. The board is SuperMicro C7Z390-PGW, a client-segment motherboard by SuperMicro under its SuperO brand. Intel is slating launch of the Z390 Express chipset for some time in the second half of 2018, following the early-2018 launches of H370 Express, B360 Express, and H310 Express.

The Z390 Express chipset adds to the feature-set of the platform, with an integrated Programmable Quad-Core Audio DSP, SoundWire digital audio interface, an integrated 10 Gbps USB 3.1 controller, integrated 802.11ac WLAN controller (with external PHY), an integrated SDIO controller (for card readers), and support for newer generation "Titan Ridge" Thunderbolt 3.0 controller.

Intel has reportedly slated launch of its Optane DIMM for the second half of 2018. The Optane DIMM marks the biggest change in computer memory in over two decades, and heralds the era of "persistent memory," which combines the best characteristics of DRAM and NAND flash, in that it has the speed and low-latency of DRAM, but the persistence (ability to store data in the absence of power) of NAND flash. Combining the two will be made possible with improvements to the speed and latency of 3D XPoint memory. Intel is currently selling consumer SSDs based on the technology, and has increased production of 3D XPoint chips.

Intel presented the Optane DIMM at the 2017 USB Global Technology Conference. It described Optane DIMM as a primary storage device that will function as a memory-mapped device, but with much higher storage densities than what's possible with current DDR4 DRAM. The enterprise segment, as usual, will have the first take of the technology, with Intel targeting the exascale computing (supercomputers nearing ExaFLOP/s compute throughput) industry, trickling down to other enterprise segments, before finally making its way to the client/consumer segments. This development is also a polite nudge to the DRAM industry to get its act together, and either bring down prices or scale up densities, or miss the bus of change.