French tech print magazine "Canard PC" is ready with early benchmarks of an AMD Ryzen 8-core processor. The scan of a page from its Ryzen performance review article got leaked to the web, revealing three key performance takeaways. In the first selection of tests, Canard PC put Ryzen through synthetic CPU-intensive tests that take advantage of as many CPU cores/threads as you can throw at them. These include the likes of H.264 and H.265 video encoding, WPrime, Blender, 3DSMax 2015, and Corona. Ryzen was found to be faster than the quad-core Core i7-6700K, and the six-core i7-6800K, but somewhere between the i7-6800K and the eight-core i7-6900K.

The next selection of tests focused on PC gaming, with a list of contemporary AAA titles, including "Far Cry 4," "Battlefield 4," "The Witcher 3: Wild Hunt," "Anno 2070," "GRID: Autosport," and "ARMA III." Here, the Ryzen sample was found to be underwhelming - it was slower than the Core i5-6600 quad-core chip clocked at 3.30-3.90 GHz; but faster than the i5-6500, clocked at 3.20-3.60 GHz. The fastest chip in the table is the i7-6700K (4.00-4.20 GHz). The reviewer still notes that Ryzen has a decent IPC gain unseen from the AMD stable in a while.

Intel's 7th generation Core "Kaby Lake" processors are slated for a January 2017 launch, beginning with the flagship Core i7-7700K processor. Ahead of their launch, here are pictures of the retail boxes of Core i7, Core i5, and Core i3 "Kaby Lake" processors. As you can see, they're nearly identical to those of the 6th generation Core "Skylake" boxes, except for the "7th Generation" marking on the box, Intel HD Graphics 630 markings, and an interesting-looking "For a Great VR Experience" marking on the box. The processor model number sticker will be pasted right where you'd expect it. Intel Core "Kaby Lake" processors will run on motherboards with Intel 200-series chipset out of the box, and on 100-series chipset motherboards with BIOS updates.

Intel and AMD's cross-licensing arrangements could get more equitable in the future, with reports hinting at the possibility of Intel licensing AMD Radeon intellectual property to be used as Intel processors' integrated GPUs. Rumors of such a deal were first reported by HardOCP this Spring, where it stated that the two companies were negotiating a licensing agreement. Earlier this week, HardOCP editor Kyle Bennett commented on the site's forums that a licensing agreement has been reached between the two, even though Intel does not want this to be public.

Such an agreement could see AMD sharing designs of its Radeon integrated graphics processors with Intel, which will integrate it into its processor designs, and manufacture them. Whether the amalgamated graphics solution will continue to be branded "AMD Radeon" or whether it will be marketed under the Intel graphics brands, remains to be seen.

On their Facebook page, MSI have given a little tease regarding their upcoming next generation Intel Z270 boards. Details are scarce at the moment, but these motherboards are to be marketed under MSI's PRO series, with the Z270 SLI Plus featuring a clean, high-contrast black and white color scheme, while the Z270 SLI opts for an almost totally black design.

The Z270 SLI Plus is the higher-end product of the two. It sports a 10-Phase PWM circuitry, cooled with the aid of two heatsinks in the ATX form-factor. As usual, it has four DIMM slots which leverage MSI's DDR4 Boost feature, and support for XMP profiles. All of these four DIMM slots are protected by metal shielding, and expansion slots include three PCIe 3.0 x16 (x16/x8/x8 electrical), three PCIe 3.0 x1 and two Turbo M.2 NVMe slots. Storage options include 6 SATA III ports and a dual USB 3.0 front panel header. It also features MSI's latest Audio Boost panel for premium audio quality, with what they call a "Mystic Light" RGB solution, and the I/O panel is covered by a black and white shroud.

New reports have surfaced that indicate NVIDIA is all set to launch a new mid range mobile graphics solution, the GTX 1050 M at CES 2017 in Las Vegas. While NVIDIA has already released mobile variants of the GTX 1080, GTX 1070 and GTX 1060, people not willing to spend big on higher tier products from the green camp are limited to "Maxwell" based GTX 960 M or GTX 950 M offerings. Reports also indicate there has been somewhat of a surge in demand for GTX 1060 M equipped laptops, where the new GTX 1050 M could be nicely positioned to further augment consumer appetite.

As we reported in November, we can expect that in line with the existing "Pascal" based mobile solutions, the new GTX 1050 M to sport the same (or better) core-configuration as its desktop counterpart, but with significantly higher clock speeds. This should make the GTX 1050 M an attractive option as it would endow the laptop with graphical horsepower exceeding the very capable GTX 970 M. All in all with new Intel "Kaby Lake" processors set to take the stage at CES 2017 too, we could see quite an array of new or reconfigured laptops scattered throughout the show.

AMD's December 13th "New Horizon" event is supposedly (and expectedly) a pivotal moment for the company - a celebration of sorts for the impending launch of their ZEN-based microprocessors. The event, which will be presented mainly by Gametrailers TV-based journalist Geoff Keighley, is now turning up to be a Summit Ridge celebration of sorts as well.

According to recent reports, a small number of motherboard manufacturers should also be in attendance at the event, showing-off their AM4-compatible motherboards based on the top-of-the-line X370 chipset. The X370 is the most advanced version of the Zen-compatible chipsets and is expected to provide extensive overclocking features and up to two third-generation PCIe x16 lanes for multi-GPU systems. Below the X370, the B350 and A320 take over the role of the mid-range and entry-level chipsets respectively. The new chipsets are expected to bring native M.2 NVMe & SATA Express connectivity, PCIe gen 3, DDR4 memory compatibility and USB 3.1 Gen2 to the company's high-end desktop platform for the very first time.

Remember ASRock's Beebox? The original Mini PC was originally reviewed here on TechPowerUp to a glowing score and wholehearted recommendation, and now, the company has announced an upgrade to its innards that is sure to give a new lease of life to the device's appeal. The upgraded systems are powered by either Intel's Core i5-7100U (2C/4T, 2.5 GHz base and 3.1 GHz Boost clocks) or i3-7200U (2C/4T, 2.4 GHz base clock) CPUs, featuring the Kaby Lake micro-architecture, but are, apart from that, identical to their predecessors. The system can also be equipped with up to 32 GB of DDR4-2133 memory (two SO-DIMM slots), an M.2-2280 NVMe SSD and a 2.5" SSD/HDD depending on your particular demands. Meanwhile, Intel's 802.11ac Wi-Fi + BT 4.0 wireless module is pre-installed.

Finally putting the lid on all of ASUS' leaked and detailed motherboards, comes, the PRIME Z270-A, which doesn't belong to a special, bang-and-whistle-filled product line, and is just concerned with getting the job done. It clads itself in a simple and appealing white and gray color-scheme, and is expected to keep most of the important features in ASUS' more expensive product lines.

The PRIME Z270-A comes with ASUS' 8+2+2 Phase Digital power design, fed by an 8-pin connector, that features 10K black metallic capacitors, MicroFine Alloy Chokes, NexFET PW (Power) block MOSFET and DIGI+ Power Control Utility for real-time adjustment, courtesy of the new ASUS Extreme Engine Digi+ technology that improves CPU stability and overclocking. It features four DDR4 DIMM slots that can support up to 64 GB of memory with speeds of up to 3866 MHZ (O.C+), and expansion slots on the motherboard include three PCIe 3.0 x16 (x16/x8/x4 electrical), four PCIe 3.0 x1 and dual M.2 slots that deliver up to 32 GB/s transfer speeds, with the PCIe slots being armored for higher resistance.

Moving on from the Strix series, ASUS' TUF Z270 Mark 1 has also been detailed. Designed around so-called military standards purported to ensure longer stability and extreme durability, the new TUF Z270 motherboards incorporates features such as Tough Inside, Thermal Armor, TUF Networking, TUF Audio, Ultimate Cooling, 24/7 Durability and high speed transfer. This motherboard is one of ASUS' most premium and feature-packed products, so you should expect to pay a pretty, pretty penny for it, if history - and pricing history in particular - is anything to go by (and it usually is).

The LGA 1151 socket supports the latest 6th and 7th generation Intel Core processors, with the MARK 1 sporting an aggressive heatsink design that features ASUS' AURA RGB technology and a full cover TUF Thermal Armor and Fortifier shield. The chassis of the board houses a 40mm fan that offers significant cooling performance to the VRMs.

Continuing the trend of revealing ASUS' ROG lineup of motherboards based on the Z270 chipset, and zipping down the product line, comes the ROG STRIX Z270F Gaming, which also sports the standard ATX form factor. The motherboard features an all around solid design with an impressive metallic black / silver color scheme. The LGA 1151 socket supports the latest 6th and 7th generation Intel Core processors. ASUS went with an aggressive heatsink design that features their AURA RGB technology for a full LED illuminated color showcase. In terms of features, the ROG STRIX Z270F Gaming continues the trend of intelligent cost-cutting so as to achieve a product with an (expectedly) lower price-point. Compared to the ROG STRIX Z270E, this mobo cuts on the 2×2 MU-MIMO 802.11ac WI-FI on the back I/O, and the USB front header is downgraded to a 2.0 solution.

The ASUS ROG Strix Z270F comes with a 8+2+1 Phase Digital power design that features 10K black metallic capacitors, MicroFine Alloy Chokes, NexFET PW (Power) block MOSFET and DIGI+ Power Control Utility for real-time adjustment. All of these components are part of the new ASUS Extreme Engine Digi+ technology that improves CPU stability and overclocking. Power is fed through a single 8-Pin connector.

The team over at Tom's Hardware have gotten their hands on Intel's new 'Kaby Lake' CPU - The Core i7-7700K. While the chip is not marked as an engineering sample, they cannot confirm with confidence that it is a retail part. They then did what we all hoped and expected, they put the new i7 through a series of benchmarks both at its stock speeds and overclocked. Without a retail Z270 series motherboard to test with, Kaby Lake compatible firmware was loaded onto their Gigabyte GA-Z170X-Ultra Gaming board.

In line with what has been reported so far, the stock clock speeds of their sample was 4.20GHz base and 4.50GHz max turbo boost with a TDP of 95W, up marginally from the i7-6700K's 91W. As tested the 7700K drew slightly more power under load than the 6700K whilst achieving benchmark results that are more-or-less in line with the percentage clock speed increase. Using the same core voltage for overclocking, the 7700K was able to manage a 4.8GHz overclock at 1.3v where the 6700K achieved 4.6GHz. As Intel did not change the core micro architecture between Skylake and Kaby Lake, it appears that save for HEVC and VP9 8/10-bit encode/decode and other possible features we may not yet know of, slightly faster clock speeds is the principal improvement. Given this is a pre-release test conducted on a motherboard that may not be able to unleash the full potential of the i7-7700K, the results should be taken with their appropriate pinch of salt. For the article and detailed findings, please follow the source link.

ASUS' ROG Maximus IX Code, the company's step-down product from the already detailed Maximus IX Formula, has also been leaked. Like the Formula, it's in the ATX form factor with the red and black colors of the ROG line; the difference between thie Maximus IX Hero and the Code stands in that the Hero is absent from the Code's PCB front shielding, the 2×2 MU-MIMO 802.11 AC WI-FI capabilities, as well as the and USB 2.0 (2+4) front panel connectors, putting it in an even lower tier in product placement, and, we expect, pricing (though, being part of the ROG line, that doesn't mean it will be cheap).

Intel's third overclocker-friendly SKU from its 7th generation Core "Kaby Lake" processor family, the Core i3-7350K, is shaping up to be an interesting option for gaming PC builds. It may be a dual-core chip, which at $177 is within striking-range of the current $189 Core i5-6400 quad-core chip, but the lack of two cores appears to be more than made up for by its significantly higher clock speeds, even in multi-threaded benchmarks. The i3-7350K is clocked at 4.00 GHz, out of the box. It's also the only Core i3 desktop SKU to feature Turbo Boost, with a frequency of 4.20 GHz. It chip comes with an unlocked base-clock multiplier, letting you overclock it with ease.

A PC enthusiast with access to a Core i3-7350K sample put it through Geekbench, where it scored 5,137 points in the single-threaded tests, and 10,048 in multi-threaded tests. Here's where it gets interesting - the Core i5-6400 quad-core chip scores 3,686 points (single-threaded), and 9,982 points (multi-threaded. The i5-6400 is clocked at a mere 2.70 GHz, with 3.30 GHz Turbo Boost. Even the higher clocked i5-4670K "Haswell" quad-core chip (3.40 GHz core, 3.80 GHz Turbo Boost) doesn't manage to beat the i3-7350K, with 4,361 points (single-threaded), and 10,036 points (multi-threaded).

Jon Peddie Research (JPR), the graphics and multimedia industry's research and consulting firm, announced estimated PC graphics add-in-board (AIB) shipments and suppliers' market share for Q3'16. The last two quarters have seen both NVIDIA and AMD release and expand a new AIB line-up, the former launching the GeForce 10 series, powered by "Pascal" GPU's and the latter releasing the Radeon 400 series, powered by "Polaris" GPU's.

JPR's AIB Report tracks PC add-in graphics boards (AIBs), which carry discrete graphics chips. AIBs are used in desktop PCs, workstations, servers, and other devices such as scientific instruments. They can be factory installed or sold directly to customers as aftermarket products. In all cases, AIBs represent the higher end of the graphics industry using discrete chips and private high-speed memory, compared to the integrated GPUs in CPUs or SOCs that share slower system memory.

Intel is preparing their Skylake-EP Xeon E5 processor lineup for launch in mid-2017. And judging by the leaks regarding their next top-of-the-line processors in the server market, the Xeon E5-2699 V5 looks like Intel's response to AMD's expected Naples server platform. The leak should, naturally, be taken with a grain of salt, since the leaked chip appears to not yet be a finalized version of Intel's silicon. If you trust the source, you can secure one of these engineering samples for the tidy sum of ¥ 26500 (around $3845).

Early 2017, a new wave of socket LGA1151 motherboards based on Intel 200-series chipset will launch, alongside the company's 7th generation Core "Kaby Lake" processors. The lineup will be led by the Z270 Express, targeting performance desktops, and H270 Express, targeting premium commercial desktops. The question on your mind probably is what sets these chipsets apart from the current 100-series Z170 and H170 chipsets. Here are some pointers.

To begin with, motherboards based on Z270 and H270 chipsets are assured to support Core "Kaby Lake" processors, out of the box. The 100-series chipset motherboards inventory with retailers may require BIOS updates, although some of the newer production batches could ship with the latest BIOS that support "Kaby Lake." Secondly, the Z270 and H270 support Intel Optane technology, a new breed of bleeding-edge performance SSDs based on the company's 3D X-point non-volatile memory, which is the very latest in sold-state storage, and purported to be the fastest. The chipets also support Rapid Storage Technology v15.

Intel's upcoming "Coffee Lake" micro-architecture, or the 9th generation Core processor family by Intel, is scheduled for launch in the second half of 2018. It succeeds the 8th generation "Cannon Lake" family of notebook processors (which likely doesn't see a desktop launch), and the 7th Gen Core "Kaby Lake" socket LGA1151 processors slated for January 2017. While it's not known if mainstream desktop "Coffee Lake" chips will continue to be based on the LGA1151 socket, the possibility is diminishing, looking at a platform layout diagram leaked to the web by Benchlife.info, supported by new connectivity interfaces coming out of the CPU package. The biggest selling-point of "Coffee Lake," is its core-count.

The 9th generation Core "Coffee Lake" family could introduce Intel's first 6-core processor to the mainstream desktop platform. The company's first 6-core client part was launched in its LGA1366 HEDT (high-end desktop) platform with the Core i7 "Gulftown" processor, way back in 2010. An increase in core-count from 4 has eluded the mainstream-desktop lineup. The 6-core "Coffee Lake" silicon will be built on a highly-refined 14 nm node by Intel, with a die-size of 149 mm². Quad-core parts won't be carved out of this silicon by disabling two cores, but rather be built on a smaller 126 mm² die. For reference, the quad-core "Kaby Lake" die is expected to be 123 mm², and the current quad-core "Skylake-D" die measures 122.6 mm².

As we inch ever closer to AMD's Zen launch, more and more information seems to be slipping through the cracks. This time, MAXSUN, an AMD China partner (poised to provide customers with AM4 platform motherboards) is the source of the proverbial leak, with information that, if true, is sure to stir the pot of bubbling Zen excitement even more.

According to MAXSUN, Zen's initial release date is pegged for January 17th, which, if true, would probably mean a product announcement around CES 2017 (scheduled from the 5th of January through the 8th) - at the same time as Intel is expected to fully unveil their Kaby Lake parts. The company also reports a second release window at March 2017, which lends further credence to AMD's expected staggered launch of Zen-based processors, first for the High-Performance-Desktop (HEDT) market, and trickling down from there. MAXSUN also confirms the pricing scheme we reported yesterday, with regards to the companies' SR7 processors (the top-of-the-line parts in the Zen line-up, and whose naming scheme I think isn't the final one) - the company states these are expected to be priced at around 1500-2000 Yuan SKU ($250-$300).

Here are some of the first pictures of a production version of an ASRock Z270 Fatal1ty-branded motherboard. While there's no picture of the board in full, Expreview scored pictures of its key sections, including its CPU VRM area, showing us prominent "Z270" badging on a VRM heatsink, a Fatal1ty logo on the PCH heatsink and its print on the PCB; and an Intel Gigabit Ethernet on the rear I/O hood, and Creative Sound Blaster Cinema 3 logo on the audio area hood; all pointing to this being a production version.

The rear I/O picture reveals two gigabit Ethernet interfaces, provision for a WLAN card, four USB 3.1 ports (of which one is type-C), two USB 3.0 ports, 8-channel HD audio with a TOSLINK connector; and display outputs including DVI, D-Sub, and HDMI. Storage appears to include eight SATA 6 Gb/s ports, and at least one M.2 slot (with Intel Optane support out of the box). Not much else is revealed by these pictures. Intel 200-series chipset motherboards are expected to launch alongside 7th generation Core "Kaby Lake" processors, in January 2017.

Intel Corporation today announced a range of new products, technologies and investments from the edge to the data center to help expand and accelerate the growth of artificial intelligence (AI). Intel sees AI transforming the way businesses operate and how people engage with the world. Intel is assembling the broadest set of technology options to drive AI capabilities in everything from smart factories and drones to sports, fraud detection and autonomous cars.

At an industry gathering led by Intel CEO Brian Krzanich, Intel shared how both the promise and complexities of AI require an extensive set of leading technologies to choose from and an ecosystem that can scale beyond early adopters. As algorithms become complex and required data sets grow, Krzanich said Intel has the assets and know-how required to drive this computing transformation. In a blog Krzanich said: "Intel is uniquely capable of enabling and accelerating the promise of AI. Intel is committed to AI and is making major investments in technology and developer resources to advance AI for business and society."

At the SC16 (Super Computing 2016) conference, Intel introduced its new Intel Xeon E5-2699A v4, which is a newer, faster version of the existing Broadwell E5-2699 v4. The "newer, faster" bit basically amounts to an increased base (from 2.2GHz to 2.4GHz) and boost clock (from 3.4GHz to 3.6GHz). Like its predecessor, the Xeon E5-2699A features 22 cores and 55MB of L3 cache, and the company cited vague improvements to the now-mature 14nm process that which amount to a 4.8% gain in LINPACK performance - which can surely be attributed almost exclusively to its clockspeed increase (not unlike the expected performance differential between Intel's current Skylake and upcoming Kaby Lake architectures). The E5-2699A v4 carries an MSRP of $4,938, which marks an eye-watering 20% increase over the $4,115 of its 200-MHz slower predecessor.

With early tests showing minimal CPU core performance gains (IPC) over the current-gen Core "Skylake" processors, Intel is taking a different approach to selling its 7th generation Core "Kaby Lake" processors to DIY PC enthusiasts. The lineup will have a third overclockable "K" processor SKU, besides the top-dog Core i7-7700K and the performance-segment Core i5-7600K. Intel is planning to spice things up for the sub-$200 market with an overclockable dual-core part, the Core i3-7350K.

The Core i3-7350K will be the company's first overclockable Core i3 part. The company had celebrated the 20th anniversary of the Pentium brand with an overclockable Pentium dual-core G3258 processor. The i3-7350K will feature an unlocked base-clock multiplier, letting you easily overclock it. The dual-core chip will feature HyperThreading, enabling 4 logical CPUs for the OS to address. Out of the box, it will come with clocks of 4.00 GHz, and 4.20 GHz Turbo Boost. It will also feature 4 MB of L3 cache. Interestingly, its TDP will be rated at 91W, the same as overclockable quad-core parts. The chip could likely come in a special PIB package that lacks a stock cooling solution. The chip is rumored to be priced at US $177.

Delivering his keynote address at the LA Auto Show's AutoMobility conference, Brian Krzanich, Intel Corporation chief executive officer, today announced that Intel Capital is targeting more than $250 million of additional new investments over the next two years to make fully autonomous driving a reality. This is the first time Intel is keynoting at an automotive conference, signifying how critical the automotive market has become for the company.

These investments will drive the development of technologies that push the boundaries on next-generation connectivity, communication, context awareness, deep learning, security, safety and more. Drilling down into the areas that will be fueled by the fresh investments, Krzanich highlighted technologies that will drive global Internet of Things (IoT) innovation in transportation; areas where technology can directly mitigate risks while improving safety, mobility, and efficiency at a reduced cost; and companies that harness the value of the data to improve reliability of automated driving systems.

Today at Autodesk University, HP Inc. unveiled the world's first mini workstation designed for users in CAD and other compute-intensive industries. The stylish, new HP Z2 Mini Workstation delivers breakthrough power and versatility and at only 2.3" high is 90% smaller than a traditional business-class tower. With this new offering, HP is positioned to extend its workstation leadership by delivering a new category of workstation that offers superb performance, elegance and efficiency.

HP Z Workstation products have become the industry standard for customers demanding a full performance workstation. Building off the success of the HP Z240 SFF, the HP Z2 Mini Workstation is twice as powerful as any commercial mini PC on the market today and has the ability to support six displays right out of the box. The HP Z2 Mini was designed for the millions of CAD users demanding smaller hardware without compromising acoustics and performance and mission-critical reliability.

TYAN, an industry-leading server platform design manufacturer and subsidiary of MiTAC Computing Technology Corporation, is showcasing a wide range of HPC server platforms optimized for enterprise, storage and data center applications at SC16 this week in Salt Lake City's Salt Palace Convention Center.

TYAN's comprehensive HPC platforms span a wide range of hardware specifications. The Intel Xeon E7-based, 4U quad-socket FT76-B7922 offers a memory capacity of 6TB and supports up to 4x Intel Xeon Phi coprocessors for the most demanding HPC users; the Intel Xeon E5-based, 4U dual-socket FT77C-B7079 supports up to 8x Intel Xeon Phi coprocessors for highly parallelized application deployment, the 2U dual-socket TA80-B7071 supports up to 4x Intel Xeon Phi coprocessors for large-scale production deployment in various high performance computing segments; and the 1U dual-socket GA80-B7081 supports up to 3x Intel Xeon Phi coprocessors for ISVs, universities, and small businesses looking for parallelized application development or proof of concept solution deployment.