Even as Intel neither confirms nor denies reports of it abandoning socketed client desktop processors in favor of BGA packages that permanently bind chips to motherboards, AMD has come forward and asserted that it won't abandon socketed client processors, and will continue to support the DIY PC enthusiast market, reinforced with the fact that BClk multiplier-unlocked processors from the company start for as low as US $129.99. In a statement to the TechReport, AMD's Chris Hook said:

AMD has a long history of supporting the DIY and enthusiast desktop market with socketed CPUs & APUs that are compatible with a wide range of motherboard products from our partners. That will continue through 2013 and 2014 with the "Kaveri" APU and FX CPU lines. We have no plans at this time to move to BGA only packaging and look forward to continuing to support this critical segment of the market.

As the company that introduced new types of BGA packages in ultrathin platforms several years ago, and today offers BGA-packaged processors for everything from ultrathin notebooks to all-in-one desktops, to embedded applications and tablets, we certainly understand Intel's enthusiasm for the approach. But for the desktop market, and the enthusiasts with whom AMD has built its brand, we understand what matters to them and how we can continue to bring better value and a better experience.

Intel Corporation today announced the pricing of four series of senior unsecured notes for an aggregate principal amount of $6.0 billion pursuant to an effective shelf registration statement previously filed with the Securities and Exchange Commission.

Of these notes, $3.0 billion will mature on Dec. 15, 2017 and will bear interest at an annual rate of 1.35%, $1.5 billion will mature on Dec. 15, 2022 and will bear interest at an annual rate of 2.70%, $750 million will mature on Dec. 15, 2032 and will bear interest at an annual rate of 4.0%, and $750 million will mature on Dec. 15, 2042 and will bear interest at an annual rate of 4.25%. The notes were offered to the public at a price of 99.894% of par in the case of the 2017 notes, 99.573% of par in the case of the 2022 notes, 99.115% of par in the case of the 2032 notes and 99.747% of par in the case of the 2042 notes. The offering is expected to close on Dec. 11, 2012, subject to customary closing conditions.

With the dawn of 2013, and no catastrophes in sight, Intel is going ahead with its usual business of phasing out old processor models, and making way for new ones. By the end of 2012, Intel will stop taking orders for several processor models mostly based on the older 32 nm "Sandy Bridge" silicon. These include chips such as the Core i7-2700K, Core i5-2310, Core i3-2105, Pentium G440, and surprisingly, an early demise of the 22 nm Core i5-3450, which is cannibalized by the Core i5-3470 at the same price point. Pentium G870, G645 and G645T as well as Celeron G555, G550 and G550T are the other chips on the chopping block.

Come 2013, Intel will release Pentium and Celeron series processors based on its 22 nm "Ivy Bridge" micro-architecture. These include the Pentium G2130, G2020 and G2020T and Celeron G1620, G1610 and G1610T. In the mobile (notebook) CPU sphere, Intel will launch dual-core "Ivy Bridge" chips to layer out its Ultrabook product segment. These include the Core i7-3687, Core i5-3437U, Celeron 1037U, 1007U, 1020M and 1000M. In March, the company is expected to launch its 4th generation Core "Haswell" line of processors.

Sapphire officially launched the Vapor-X CPU cooler it talked about at trade shows earlier this year. It uses a vapor-chamber plate to draw heat from the CPU, and convey it to four 7 mm-thick nickel-plated copper heat pipes, which then pass through a dense aluminum fin stack, that's ventilated by two 120 mm PWM controlled fans (replaceable) in push-pull configuration. Spinning at speeds ranging between 495 and 2,200 RPM, the fans push 77 CFM of air, each. Measuring 135 x 110.4 x 163.5 mm, the heatsink weighs about 925 g. Nearly every modern client CPU socket type is supported, including Intel sockets LGA2011, LGA115x, LGA775, and AMD sockets AM3+/AM3/AM2+/AM2, and FM2/FM1. Expect a sub-$80 price.

Intel Corporation recently announced its latest communications platform, previously code named "Crystal Forest," will help service providers and telecom equipment manufacturers (TEMs) encrypt and process data across the network more efficiently. The platform will also offer superior communications workload consolidation via a single architecture for greater cost efficiency.

The platform will particularly benefit TEMs that are developing low-end products (such as wireless access and branch routers), as well as high-end equipment (for example LTE core network elements and enterprise security appliances).

Jon Peddie Research (JPR), the industry's research and consulting firm for graphics and multimedia, announced estimated graphics chip shipments and suppliers' market share for Q3'12.

The news was terrific for Nvidia and disappointing for everyone the other major players. From Q2 to Q3 Intel slipped in both desktop (7%) and notebook (8.6%). AMD dropped (2%) in the desktop, and (17%) in notebooks. Nvidia gained 28.3% in desktop from quarter to quarter and jumped almost 12% in the notebook segment.

The processor-motherboard combination as PC enthusiasts know it could end, with Intel LGA1150 processors under the "Haswell" micro-architecture, likely to becoming the last client processors to ship in the retail channel (processor-in-box). Future Intel client processors, codenamed "Broadwell" could ship only in BGA (ball-grid array) packages, with existing motherboard vendors selling their products with processors permanently soldered onto them. The information comes from Japanese PC Watch, which cites sources in the PC industry.

With a compacted socket-processor launch cycle that spans nearly 2 years under the company's "tick-tock" product strategy, the scope for processor updates in the client computing industry might be lower than what it was in the LGA775 days. Perhaps statistics at Intel don't show a sizable proportion of people upgrading processors on existing motherboards, or upgrading motherboards while retaining the processor, rather buying a combination of the two, not to mention the fact that pre-built PCs outsell DIY assembled ones in major markets. With the processor being "tied" to the motherboard, Intel gets room to compact the platform further, combining processor and core logic completely into a single package. It's likely that Intel could still leave processor interchangeability to its HEDT (high-end desktop) platform, which sees processors start at $300, and motherboards at $200.

Abee unveiled the Acubic NE01 and NE02 lines of replacement cases for Intel NUC. Made of brushed, anodized aluminum, the cases are available in a variety of glossy colors. The NE01, the first group of cases pictured below, measures 125 x 111 x 41 mm, featuring an edgy design. The NE02, on the other hand, measures 126 x 111 x 42 mm, featuring a slightly rounded and curvy design. Both cases weigh roughly 450 g. Designed strictly for the NUC form-factor, the two support Intel Desktop Boards D33217CK and D33217GKE only, are are compatible with their rear-panel bracket, and front USB port positions. Both cases support VESA mount, and can latch onto your flat-panel. Slated for Wednesday (28/11), the NE01 and NE02 are priced around US $99.

Intel's SSD 525 line of performance mSATA SSDs may be slated for 2013, but made an early debut with the company's NUC (next unit of computing) desktop. A 180 GB variant of the drive was put to test by VR-Zone, which is driven by LSI-SandForce SF-2281 processor, and features three Intel-made 20 nm MLC NAND flash chips (6-channels). The drive cracked Anvil Storage Utilities benchmark with 504 MB/s (compressible) and 463 MB/s (incompressible) sequential read speeds, 468 MB/s (compressible) and 240 MB/s (incompressible) sequential writes, and about 55,841 IOPS 4K random write (QD16) performance. The performance numbers make the drive appear nearly as fast as larger 2.5-inch SATA SSDs, and could be a boon for Ultrabook makers.

Creative Technology Ltd today announced it has entered into an agreement with Intel Corporation for Intel to license certain technology and patents from ZiiLABS Inc. Ltd, a wholly-owned subsidiary of Creative, and acquire certain engineering resources and assets related to its UK subsidiary ZiiLABS Limited (formerly known as 3DLABS Limited).

The US$50 million deal includes US$20 million to Creative for the licensing of certain technologies to Intel relating to ZiiLABS' high performance GPU technology. The second part of the deal is US$30 million to Creative for the transfer of certain engineering resources and assets in the UK subsidiary to Intel. The UK subsidiary is a design entity engaged in, primarily on behalf of ZiiLABS Inc. Ltd, the development of various silicon solutions, including the ZMS chips for Creative. The transfer of engineering resources and assets will be through the divestment of the UK subsidiary by Creative.

Intel Corporation today announced that the company's president and CEO, Paul Otellini, has decided to retire as an officer and director at the company's annual stockholders' meeting in May, starting an orderly leadership transition over the next six months. Otellini's decision to retire will bring to a close a remarkable career of nearly 40 years of continuous service to the company and its stockholders.

"Paul Otellini has been a very strong leader, only the fifth CEO in the company's great 45-year history, and one who has managed the company through challenging times and market transitions," said Andy Bryant, chairman of the board. "The board is grateful for his innumerable contributions to the company and his distinguished tenure as CEO over the last eight years."

As confirmed by some freshly-leaked slides, 2014 will see Intel bring some new guns to the fight with ARM, including Bay Trail-T, the successor of Clover Trail and the first Atom platform to take advantage of the 22 nm manufacturing process.

The star of Bay Trail-T is the Valleyview SoC which will feature four (out-of-order) Silvermont cores clocked at up to 2.1 GHz (delivering up to 60% higher performance than the Clover Trail chip), a two-channel LPDDR3 memory controller, an upgraded video decoder, support for resolutions up to 2560 x 1600 pixels, and a new GPU boasting DirectX 11 capabilities and offering up to a 3x performance boost over Clover Trail.

Devices based on Bay Trail-T are expected to have a standby battery life of 20 days and would last for 11 hours of continuous video playback, before needing to be charged.

Marking a new era in high-performance computing, Intel Corporation introduced the Intel Xeon Phi coprocessor, a culmination of years of the research and collaboration, to bring unprecedented performance for innovative breakthroughs in manufacturing, life sciences, energy and other areas.

The ability to quickly compute, simulate and make more informed decisions has propelled the growth of high performance computing (HPC) and analytics. This has been driven by global business and research priorities to more accurately predict weather patterns, create more efficient energy resources, and develop cures for diseases among many other pressing issues. With the breakthrough performance per watt and other new attributes of Intel Xeon Phi coprocessor, the industry will have even greater reliability in generating accurate answers, help proliferate high-performance computing beyond laboratories and universities and achieve maximum productivity.

Going into 2013, Intel's tough balancing act between keeping a low power/thermal envelope, and advancing performance, all while staying on the 22 nm silicon fab process, will be care of its Core "Haswell-ULT" processor. The chip will feature some radical changes to traditional Intel processor design, which will help it achieve its design goals. According to a deck of leaked slides scored by Expreview, Intel plans to use additional C-states that drop the processor's base clock, and redesign the processor package to accommodate the PCH silicon, reducing the board footprint.

To begin with, Haswell-ULT will be designed to support 24 MHz base clock speed, which running in "deep" energy-saving idle states. Modern processors with FSB replacement interconnect technologies such as QuickPath Interconnect and HyperTransport need a base clock to time other components on the processor, and for low-level communications, while a bulk of the data is transported by the primary interconnect. Intel found a way to turn off the 100 MHz base clock signal (which is also used to time the PCI-Express root complex and integrated graphics core), and replace it with a 24 MHz clock, when the processor is idling. As the processor returns to lower (more active) C-states, the 100 MHz base clock is reapplied. The 24 MHz base clock is activated by three new power states, C8, C9, and C10, introduced by Haswell-ULT. The third slide below details what happens to the various components in the new C-states.

In what could be the very first time two different machine architectures share a platform, future versions of Intel's Xeon and Itanium processors could be socket-compatible. Intel Itanium is based on the Itanium64 (IA64) machine architecture, while Xeon is x86-64 based. Intel plans to implement its common platform strategy with the next generation models of the two, that's "Kittson" Itanium, and "Haswell" Xeon.

This level of convergence could make it easier for companies to deploy select amounts of Itanium and Xeon processors in their data-centers, to suit specific tasks, and save money on buying common platforms for both. Itanium processors are typically preferred for in mission-critical environments, where there's close to zero margin for error (think military, medical, and space-exploration); while Xeon is good at handling heavy serial processing loads (think servers, database management, cloud). Introduction of the converged platform is expected in the 2013-2015 time range, using Xeon "Haswell" launch as a point of reference.

In an era of unprecedented growth in data usage, businesses require powerful computing solutions that can deliver scalable and resilient performance to run IT's most mission-critical applications. The new Intel Itanium processor 9500 series is more than twice as powerful as the previous generation, making it ideal for today's most demanding workloads, including business analytics, database, and large-scale enterprise resource planning (ERP) applications. Systems based on Intel's Itanium processors run in more than three-quarters of the World's Global 100 companies across industries such as aerospace, energy, life sciences and telecommunications. With the Intel Itanium processor 9500 series, these industries will benefit from a leap in performance and an increase in world-class reliability, availability and serviceability (RAS) capabilities.

Intel has this week announced the discontinuance schedule for two more products, the 2.8 GHz Core i5-3450S desktop CPU and the 1.5 GHz Atom Z670 mobile chip. The i5-3450S will be available for orders until May 24th, 2013 and will ship until November 8th (for the tray version) or until supplies are depleted (boxed). As for the Z670, Intel will be taking orders for it up to May 31st, 2013 and will ship it while supplies last.

The Core i5-3450S was introduced in Q2 2012 while the Atom Z670 debuted last year (Q2).

As big data, high-performance computing (HPC) and cloud-computing applications push the demand for real-time access of data into the zettabytes, Intel Corporation announced today its next-generation data center solid-state drive (SSD), the Intel Solid-State Drive DC S3700 Series, designed to remove storage bottlenecks and maximize multi-core CPU performance. The Intel SSD DC S3700 Series delivers fast, consistent performance and low latencies along with strong data protection and high endurance to help IT personnel support today's most demanding data center applications.

"Today's data explosion creates unique storage challenges for data center professionals," said Rob Crooke, Intel vice president and general manager for the Intel Non-Volatile Memory (NVM) Solutions Group. "High latencies and slow storage I/O can cripple data centers' ability to deliver exciting big data or cloud-computing applications with fast, low latency data access. Intel's next-generation Intel SSD DC S3700 Series breaks through SSD limitations for the data center on all fronts - fast, consistent performance, strong data protection and high endurance -- so IT professionals can deliver on their most demanding technology initiatives."

Market research firm TrendForce released NAND flash shipment figures for 3Q 2012. The global NAND flash market is valued at US $4.626 billion, a healthy 6.6% growth over the previous quarter. A TrendForce DRAMeXchange report provided a break-down of shipments of NAND flash by manufacturers. Leading the pack is Samsung, with 41.2% market-share, registering a 1.8% QoQ growth. Trailing behind is Toshiba, with 24.7% market share, and a significant 12.9% QoQ growth. In September, Toshiba cut prices and scaled up production, which may have contributed to the growth. Micron holds 14.4% of the market with 2.8% growth, SK Hynix 11.6% with 6.4% growth (the company began mass-production of SSD-grade NAND flash this quarter), and Intel with 7.6% of the market-share, growing at 19.7%. Bear in mind, these numbers represent NAND flash components used not only in SSDs, but also USB flash drives, memory cards, etc.

Intel's 2011-launched Core i7 "Sandy Bridge-E" HEDT platform is based on a 32 nm silicon that's common with Xeon E5 series processors. While the silicon physically packs eight CPU cores and 20 MB last-level cache (LLC, or L3 cache), client Core i7 processors are configured with only a maximum of six cores, and up to 15 MB L3 cache. According to a MyDrivers.com report, the maximum core count won't change with next-generation 22 nm Ivy Bridge-E Core i7 processors.

Ivy Bridge-E will be an upscale of Ivy Bridge. Similar to Sandy Bridge-E, the silicon will feature up to eight cores and 20 MB L3 cache. In its Core i7 avatar, however, the chip will be configured with no more than six cores, and no more than 15 MB L3 cache. The new chip will introduce IPC improvements, PCI-Express Gen 3.0 certified root complex (one which NVIDIA will approve of), higher CPU core clock speeds, and support for faster memory.

STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications and a top player in ICs for home multimedia, today added the STDP43 series of products to its innovative DisplayPort portfolio. These Systems-on-Chips (SoCs) are the world's first high-speed active-protocol bi-directional media-routing devices that manage audio and video data from various sources and send this data to multiple displays. The devices support DisplayPort 1.2 and HDMI 1.4, the latest versions of the two most common digital-display interface technologies used in computer and consumer electronics. The STDP43 SoCs are catalytic in the rapidly expanding markets for next-generation digital signage, universal docking stations and video hubs required by the new generation of notebooks and PCs based on the latest Intel and AMD CPUs that support the multi-stream features of DisplayPort 1.2.

Researchers at Intel have begun ground work on many-core processors that could drive ultra-mobile devices (such as tablets, smartphones, Ultrabooks, etc.,) in the near future. It design calls for no less than 48 processing cores on a piece of silicon, built on the "single-chip cloud computer" (SCC) design. The new technology could reach the markets anywhere between five to ten years from now, probably since current silicon fabrication technologies aren't advanced enough to put that much processing power into a chip that runs off a smartphone battery.

"If we're going to have this technology in five to 10 years, we could finally do things that take way too much processing power today," said Patrick Moorhead, an analyst with Moor Insights and Strategy. "This could really open up our concept of what is a computer... The phone would be smart enough to not just be a computer but it could be my computer." With devices like Microsoft Surface, which transform from a tablet to a fully-functional desktop with a dock, or a notebook with the flip of a smart cover, the definition of what constitutes a personal computer is changing. In a few years, your mobile could transform into a computing device of any shape and size for consumers.

Intel's newest flagship desktop processor, the Core i7-3970X Extreme Edition, started selling. In Singapore, the chip is being sold at S$ 1,425 (US $1,167), including local taxes. Based on the 32 nm "Sandy Bridge-E" silicon, and built in the LGA2011 package, the i7-3970X is a six-core processor clocked at 3.50 GHz, with maximum Turbo Boost frequency of 4.00 GHz. The six-core chip is bolstered by HyperThreading, enabling 12 logical CPUs, 256 KB L2 cache per core, 15 MB shared L3 cache, and a quad-channel DDR3 integrated memory controller, supporting up to 128 GB of memory. Surprisingly, the chip's 200 MHz speed bump over the Core i7-3960X affected its TDP, which is rated at 150W, up from 130W of the i7-3960X.

Crucial, a leading global brand of memory and storage upgrades, and Intel, a world leader in computing innovation, today announced the inclusion of Crucial server memory modules in the Intel Demo Depot Program. This service lends fully configured Intel Xeon-based servers to customers for evaluation and testing prior to final purchase. As a brand of Micron Technology, Inc., one of the largest memory manufacturers in the world, Crucial supplies the Intel Demo Depot Program with DDR3L registered DIMMs ranging from 8 GB to 16 GB densities, in speeds of 1600 MT/s and 1333 MT/s to support Intel's latest generation of servers.

The Intel Demo Depot Program consists of more than 200 servers and is available to interested customers throughout North America. Potential customers procure evaluation servers for 30-day periods to test equipment and proof-of-concept trials. Servers are also used by various technology manufacturers for demonstrations at tech-focused tradeshows and customer demos by Intel field account engineers.

Intel Capital portfolio company Crossing Automation announced today that it is being acquired by Brooks Automation (NASDAQ: BRKS) for $63 million. Intel Capital invested in Crossing in 2005 and provided financial support and strategic and operational planning guidance to the company, which manufactures fab and tool automation equipment for the semiconductor market, enabling Crossing to achieve significant revenue and operating income growth.

The deal follows on the heels of FormFactor's (NASDAQ: FORM) $117 million acquisition of Intel Capital portfolio company MicroProbe, which provides advanced wafer test solutions to global semiconductor manufacturers. These successful exits signal a revival of opportunities in the semiconductor investment sector where Intel Capital is well positioned to add value to these companies.