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Intel Lowers Third-Quarter Revenue Outlook

Intel Corporation today announced that third-quarter revenue is expected to be below the company's previous outlook as a result of weaker than expected demand in a challenging macroeconomic environment. The company now expects third-quarter revenue to be $13.2 billion, plus or minus $300 million, compared to the previous expectation of $13.8 billion to $14.8 billion.

Relative to the prior forecast, the company is seeing customers reducing inventory in the supply chain versus the normal growth in third-quarter inventory; softness in the enterprise PC market segment; and slowing emerging market demand. The data center business is meeting expectations.

Intel Xeon Processors and Xeon Phi Powers World's Most Efficient HPC Data Center

Signaling its commitment to energy-efficient high- performance computing, Intel Corporation today announced that it will work with HP to help design and provide the U.S. Department of Energy's National Renewable Energy Laboratory (NREL) with a supercomputing system that will drive research across a number of energy-related initiatives, including renewable energy and energy-efficient technologies. The new High Performance Computer (HPC) data center promises to become one of the world's most efficient installations.

The system is scheduled to deliver full compute capacity in the summer of 2013 and will feature approximately 3,200 Intel Xeon processors including current-generation Intel Xeon processor E5-2670, future 22nm Ivy Bridge based processors and approximately 600 new Intel Xeon Phi co-processors. The total peak performance of the system is expected to exceed 1 Petaflop (equivalent to a thousand trillion floating point operations per second) and it will be the largest supercomputer dedicated solely to renewable energy and energy efficiency research. Leading energy-efficient capabilities of Intel Xeon processors and Intel Xeon Phi co-processors combined with the new HP warm water cooling solution and innovative data center design will result in this facility likely being the world's most efficient data center with a power usage effectiveness (PUE) rating of 1.06 or better.

Intel Rounds Off 3rd Generation Core Processor Family with Core i3-3000 Series

3rd Generation Intel Core i3 desktop processors are now available providing value-priced CPU horsepower for those wanting to take advantage of features such as Intel HD Graphics with Intel Quick Sync Video, Intel Wireless display, and more. They will be offered in standard and low wattage models, designated by an "s" or a "t" in the processor name, with frequencies ranging from 2.8 GHz to 3.4 GHz. More information is available here.

Intel Releases More Desktop and Mobile Processors

Intel Corp. has yesterday expanded its CPU offer, adding to it both desktop and mobile models built on 22 nm and 32 nm technology. On the desktop side, the company launched several Core i5 and i3 chips, including the GPU-less Core i5-3350P, plus one Celeron and six Pentium CPUs based on the Sandy Bridge architecture (see the SB mention in the chart). These mid- to low-end desktop parts are priced between $177 and $37.

While Intel had nothing high-end for desktops, the company did introduce a new mobile flagship, the 22 nm Core i7-3940XM which costs a whopping $1,096 and packs four cores clocked at 3.0 GHz. Other releases include two more quad-core models - the 2.8 GHz i7-3840QM and the 2.7 GHz i7-3740QM, and a couple of low-end Celerons (B830 & 887).

Besides rolling out new chips Intel has also lower the price tag of three processors, the 3.40 GHz Core i3-2130 (from $138 to $117), the Pentium G2120 (from $86 to $75) and the Pentium G550 (from $52 to $42).

Intel Reveals Architecture Details of Intel Xeon Phi Co-Processor

During HotChips symposium, George Chrysos, the leading architect of Intel Xeon Phi co-processor shared the new architecture details of upcoming Intel's HPC powerhouse. Designed for highly-parallel applications, Intel Xeon Phi co-processor based on Intel Mani Integrated Core architecture will deliver the combination of industry leading performance per watt with the ability to re-use the existing code and applications without necessity of re-writing them.

Equipped with more than 50 cores and built using Intel's latest 22nm 3D Tri-gate transistor technology, new co-processors will be in production this year with first supercomputers from top500 list already taking advantage of this technology. In his blog here, George shares his aspirations and goals during designing the co-processor and summarizes all new disclosed information. The HotChips presentation is also available below.

Toshiba Satellite U920T Convertible Ultrabook Launched

Toshiba UK today announces the launch of the Satellite U920T - a new hybrid device combining the ease-of-use, wake up time and performance of an Ultrabook with a tablet's touchscreen interface and portability. The 31.8cm (12.5") touchscreen transforms easily from laptop mode to a tablet with a simple sliding motion that reveals a full size keyboard.

The Satellite U920T is perfect for users looking for a versatile computer in an extremely compact form. Offering the best of both worlds for both content consumption and creation, the convertible Ultrabook can be operated in tablet mode, or in a more traditional laptop position when required, such as writing lengthy emails or for web chats.

Core i3 "Ivy Bridge" Desktop CPUs Up For Pre-Order

Intel's new entry-mainstream line of client processors, the Core i3-3000 series, is inching toward a Q3-2012 launch. The new chips are based on the company's 22 nm "Ivy Bridge" silicon. Ukranian retailer Hotline.ua listed two of the first five Core i3-3000 series models for pre-order. These include the Core i3-3240 and Core i3-3220. The Core i3-3240 is clocked at 3.40 GHz, while the i3-3220 runs at 3.30 GHz. The two are socket LGA1155 dual-core processors featuring 3 MB of L3 cache. When launched, the i3-3240 will sell for around US $147, while the i3-3220 will sell for US $125.

IDT and Intel Partner to Develop Silicon for Intel's Wireless Charging Technology

Integrated Device Technology, Inc., the Analog and Digital Company delivering essential mixed-signal semiconductor solutions, today announced that Intel has selected IDT to develop an integrated transmitter and receiver chipset for Intel's wireless charging technology based on resonance technology. Wireless charging ICs by IDT will provide industry-leading size and cost reduction, while simplifying product development and integration. Intel, along with IDT, aims to deliver validated reference designs that are targeted for deployment in Ultrabooks, all-in-one (AiO) PCs, smartphones, and standalone chargers.

"Our extensive experience in developing the innovative and highly integrated IDTP9030 transmitter and multi-mode IDTP9020 receiver has given IDT a proven leadership position in the wireless power market," said Arman Naghavi, vice president and general manager of the Analog and Power Division at IDT. "We welcome the advancements in resonance technology and will support its continued success by delivering the most integrated and full-featured ICs in the world. IDT is excited to collaborate with Intel and looks forward to playing a key role in the proliferation of wireless power technology, resulting in benefits for IDT customers and shareholders."

Samsung Introduces New Line of Powerful, Stylish and Intuitive Touchscreen All-in-One

Samsung Electronics America Inc., a subsidiary of Samsung Electronics Co. Ltd, today announced at IFA 2012 its new Series 7 and Series 5 All-In-One (AIO) PCs. Engineered to provide high-performance computing power in a sleek form factor, the new AIO PCs build on the premium qualities of Samsung's existing PC line. Each of the new models features a high-resolution, ten-point touch, slim bezel display on an elegant metal base, as well as a third generation Intel Core processor. The products are designed to run Windows 8, resulting in a PC that is just as powerful as it is eye-catching.

"Our new Series 7 and Series 5 All-In-One PCs are designed to meet a range of consumer needs across the home, all within highly stylized form factors that users will be proud to put on display," said Todd Bouman, vice president of product marketing at Samsung's Enterprise Business Division. "The expansion of our AIO line speaks to the success we've had in the PC market over the past year. Both of these new models take Samsung's convergence technologies to the next level, completing the home computing experience by connecting the PC to other devices in the home environment."

TRIM on RAID 0 for Intel X79 Chipset Coming Soon

While the PC enthusiast community at large welcomed news of SSD TRIM command being made possible in RAID 0 setups, provided Intel 7-series chipset RAID controllers are used, users of Sandy Bridge-E HEDT platform, running Intel X79 chipset, didn't. The feature was advertised to be initially available only to users of 7-series client chipset (such as Z77, H77), with Rapid Storage Technology (RST) driver version 11.0 and above. Intel made amends by announcing that users of Intel X79 chipset will be able to take advantage of TRIM command in RAID 0 setups, with a future version of RSTe (Rapid Storage Technology Enterprise) driver, without being specific about the version or its release date.

Said Intel in its note, "Current RSTe drivers specific to X79 do NOT support TRIM on RAID 0, but an updated RST driver version coming soon will add support for X79 based systems, including the TRIM on RAID 0 feature. Note that on client 7-series chipsets (non X79), RST driver version 11.0 and beyond supports TRIM on RAID 0."

Giada Announces i35G Series Mini PC

Giada, a brand of Jehe Technology Inc., (JEHE) is pleased to announce the i35G mini PC series. The i35G series is built on the powerful Intel Atom D2500 series processor, and with the NVIDIA GT610 GPU this mini PC can offer impressive system performance in consumer and digital signage applications.

Supporting 1080p Full High Definition graphics, the i35G series has up to 2GB of DDR3 memory with 512MB of VRAM on board. The i35G keeps power consumption to a minimum at 35W, while still having the flexibility to provide high performance solutions for digital signage for advertising, hospitality, brand promotion and digital menu boards as well as for consumers looking for a compact work station that also allows for light gaming.

SSD TRIM Command on RAID 0 Possible - With A Few Riders

Intel made it possible for SSDs to utilize the TRIM command feature when striped in RAID 0, provided a few meaty requirements are met. The TRIM command feature works to minimize write performance degradation on SSDs, but thus far it has been impossible to enable the feature on any other host controller mode than standalone AHCI, due to the manner in which the feature works at a physical level.

According to a report, TRIM over RAID 0 will be made possible with Windows 8 operating system, provided the system is running an Intel 7-series chipset (such as Z77 Express), has RAID BIOS (Option ROM) version 11.5 or higher, and Rapid Storage Technology (RST) device driver version 11.5 or higher. While obtaining the required Windows and driver versions is relatively easy, the RAID Option ROM version is in the hands of motherboard manufacturers, who have to release motherboard BIOS updates that include the required RAID Option ROM updates.

Intel Gears Software Developers Up for Windows 8

Ahead of Microsoft Windows 8 general availability, Intel has updated two toolkits for application developers - Intel Media SDK 2012 R3 and Intel SDK for OpenCL Applications 2013 Beta. In addition to Windows 8, Intel Media SDK also supports DirectX 11 with optimized access to hardware accelerated video encoding, decoding and transcoding for applications on 3rd Generation Intel Core processors.

The Intel SDK for OpenCL Applications Beta now supports OpenCL 1.2 API previews on CPU and other features such as a new kernel builder and GNU project debugger, which ease the creation of parallel and visual computing apps. Both kits support the new Intel HD Graphics Driver for Windows 8 and are available now as free downloads.

Intel to Standardize SSD Specifications for Ultrabook

Intel plans to standardize SSD specifications for its Ultrabook platform, which would steer it toward slimmer, faster Ultrabooks. The company plans to invite a large number of industry players, including NAND flash memory makers SanDisk, Micron, and Samsung, for discussions into what is known as Next Generation Form Factor (NGFF), a new SSD form-factor derived from mSATA (think Apple's SSD form-factor found in the MacBook Air).

Intel is in a bit of a hurry with its NGFF SSD plans because the current mSATA form-factor poses limitations, including limited PCB area, in which a limited number of ONFI channels can be wired out. NGFF most likely is mSATA with greater PCB area, allowing the same number of ONFI channels as 2.5-inch SSDs, with the latest generation of controllers and toggle-NAND flash memory. NGFF doesn't increase the thickness of the SSD compared to mSATA, but merely elongates it (again, similar in form to Apple's SSD specifications). Five length standards are being discussed between Intel and Ultrabook partners.

Intel Declares Quarterly Cash Dividend

Intel Corporation's board of directors has declared a 22.5 cents per share (90 cents per share on an annual basis) quarterly dividend on the company's common stock. The dividend will be payable on Sept. 1, 2012 to stockholders of record on Aug. 7, 2012.

Intel (NASDAQ: INTC) is a world leader in computing innovation. The company designs and builds the essential technologies that serve as the foundation for the world's computing devices. Additional information about Intel is available at newsroom.intel.com and blogs.intel.com.

Intel Core i7-3970X Extreme Arrives in Q4

Intel's next high-end desktop processor, the Core i7-3970X Extreme, arrives in Q4, 2012, according to a DonanimHaber report. The i7-3970X is expected to ship with clock speeds of 3.50 GHz, with maximum Turbo Boost frequency of 4.00 GHz. The six-core chip is based on the 32 nm "Sandy Bridge-E" silicon, and built in the LGA2011 package. Its feature-set is consistent with that of the Core i7-3960X, with 15 MB shared L3 cache, HyperThreading, and unlocked base-clock multiplier. In all likelihood, the i7-3970X could displace the i7-3960X from its price-point.

Intel Reports Second-Quarter Revenue of $13.5 Billion

Intel Corporation today reported quarterly revenue of $13.5 billion, operating income of $3.8 billion, net income of $2.8 billion and EPS of $0.54. The company generated approximately $4.7 billion in cash from operations, paid dividends of $1.1 billion and used $1.1 billion to repurchase stock.

"The second quarter was highlighted by solid execution with continued strength in the data center and multiple product introductions in Ultrabooks and smartphones," said Paul Otellini, Intel president and CEO. "As we enter the third quarter, our growth will be slower than we anticipated due to a more challenging macroeconomic environment. With a rich mix of Ultrabook and Intel-based tablet and phone introductions in the second half, combined with the long-term investments we're making in our product and manufacturing areas, we are well positioned for this year and beyond."

Intel Intros 240 GB SSD 330 Series Variant

Intel expanded its mainstream client SSD 330 series with the addition of a new 240 GB variant. The SSD 330 series, till date, only had sub-200 GB capacities, with 180 GB leading the pack. It was believed that Intel was making sure SSD 330 steered clear of the performance-segment SSD 520 series, to prevent internal competition that could end up hurting the SSD 520, and its higher margins for Intel. It appears, though, that with large-scale price-cuts, room has been created for a new 240 GB SSD 330 series model.

Built in the 2.5-inch 9.5 mm-thick form-factor with SATA 6 Gb/s interface, and driven by an LSI-SandForce controller, the 240 GB SSD 330 comes with sequential speeds of up to 500 MB/s (reads) and 450 MB/s (writes). It has rated 4K random access performance of 42,000 IOPS (reads) with 52,000 IOPS (writes). The SSD will be sold in bulk as drive-only trays, drive-only retail packages, and retail packages with migration-kits and 3.5-inch bay adapters (for desktops). Intel is yet to release pricing details, although a price of around US $200 seems likely. In related news, the wide-ranging price-cuts reported last week, have taken effect, according to the company.

Intel Federal LLC to Propel Supercomputing Advancements for the U.S. Government

With the U.S. Government increasingly using high- performance computing (HPC) to address current and future national challenges, Intel Corporation today announced it has been awarded two subcontracts totaling $19 million with the U.S. Department of Energy (DOE). As part of these two awards, Intel Federal LLC, a wholly owned subsidiary, will be a major participant in the Lawrence Livermore National Security, LLC (LLNS) managed Extreme-Scale Computing Research and Development "FastForward" program aimed at driving advancements in exascale computing.

The DOE has been a leading developer of supercomputing technology for a broad range of critical applications in the space of national security, economy, energy resources and consumption. The "FastForward" program will harness the talents of the national laboratories, academia and U.S. industry to develop the next generation of HPC technologies.

Giada Launches i53: Powerful Performance in a Book-Sized Mini PC

Giada, a brand of Shenzhen Jiehe Technology Development, Co., Ltd, today announces the i53 Mini PC. With full HD 1080P video, high connectivity, support, and an attractive design, Giada's new book-sized i53 Mini PC is an ideal choice for home entertainment, web browsing, and document writing.

The i53 is based around Intel's Mobile HM76 Express chipset and Ivy Bridge technology platform. Even while offering great performance, this environmentally friendly PC only uses 35W.

Intel Releases WHQL-certified Graphics Driver for Windows 8

Today, Intel released their WHQL-certified graphics driver for the Microsoft's upcoming Windows 8 operating system. The driver runs on Windows 8 Release Preview with support for 3rd generation Intel Core processors with HD Graphics 4000/2500 and 2nd generation Intel Core processors with Intel HD Graphics 3000/2000.

The driver also provides support for OpenGL 4.0 and Windows Display Driver Model Version 1.2 (WDDM1.2) features such as native stereoscopic 3D support, optimized screen rotation detection and integrated DirectX 11 video playback. Intel encourages users to try the latest driver and provide feedback for future releases.

DOWNLOAD: Intel HD Graphics Driver for Windows 8 WHQL

Patriot Memory Launches New Exclusive Intel Extreme Masters Limited Edition Memory

Patriot Memory, a global pioneer in high-performance memory, NAND flash, storage and enthusiast computer products today announces the launch of the new Intel Extreme Masters Limited Edition DDR3 Memory. Built exclusively for gamers, the Intel Extreme Masters Limited Edition will provide the rock solid performance and stability needed for today's most extreme gaming systems.

Designed specifically to take full advantage of the performance capabilities of the newest 2nd and 3rd generation Intel Core processor family, the Intel Extreme Masters Limited Edition is fully certified for Intel XMP 1.3 delivering frequencies of 1600MHz, 1866MHz, and 2133MHz*. Featuring the same great custom high performance heat shield as the Viper III, the Intel Extreme Masters Limited Edition will provide superior thermal protection when used during long and demanding gaming sessions. The new Intel Extreme Masters Limited Edition modules will be available in dual and quad-channel kits and offered in 8GB, 16GB, and 32GB capacities.

Intel Plans Price Cuts for Consumer SSDs

Intel is planning a series of price cuts for its three current consumer SSD lines, the SSD 320, SSD 330, and SSD 520. The new prices could take effect from August, and will render several models with price per GB under $1. While prices of most lower-capacity SSD 320 series products are left untouched (partly because they are being phased out of the market), those of the 300 GB and 600 GB are cut significantly. The 300 GB SSD 320 could get a price cut from US $519 to $464, while that of the 600 GB SSD 320 could go down from $1,059 down to $879.

Intel's current mainstream SSD line, the SSD 330, could face price cuts on some of its best selling models. The 60 GB model could see its price go down from $94 to $69, the 120 GB from $149 to $104, and the 180 GB from $234 to $154. Intel's performance SSD line, the SSD 520 series, sees prices cut for nearly every model. The 60 GB model is down from $109 to $99, 120 GB from $189 to $139, 180 GB from $279 to $199, 240 GB from $349 to $259, and 480 GB $809 to $594. The new prices restore competitiveness of Intel's consumer SSD lines against competitors' offerings, as SSD prices continue on their free-fall.

AVADirect Now Offers Personal Supercomputer

AVADirect, a leading provider of custom computer systems, offers the first personal supercomputer workstation with Dual 8-Core Xeon CPUs, 192GB Memory and Four Graphics Cards. Because of the close partnership with EVGA, AVADirect now offers ground breaking capabilities based on new EVGA SR-X motherboard with wide variety of component combinations to meet the needs of the most demanding professionals or enthusiasts.

Within the past month, manufacturers began to release new motherboards based on the E5 2600 XEON processors. End-users have seen them offered in rackmount and tower configurations from Supermicro, Asus, and Intel. Now, AVADirect is proud to announce that EVGA has released an enthusiast series motherboard that AVADirect offers in a custom configuration. Supported by the EVGA Classified SR-X dual-socket 2011 motherboard, the configuration boasts a whole new level of performance and expandability, including 7x PCI e expansion slots (with PCI-E 16x 3.0 support), 6x USB 3.0 ports, and 8x internal SATA ports; 4 being SATA III 6Gb/s. More importantly, the system will support up to 192GB of certified, Quad-Channel ECC RAM.

Intel and ASML Reach Agreements to Accelerate Key Next-Generation Silicon Fab Tech

Intel Corporation today announced it has entered into a series of agreements with ASML Holding N.V. intended to accelerate the development of 450-millimeter (mm) wafer technology and extreme ultra-violet (EUV) lithography totaling €3.3 billion (approximately $4.1 billion). The objective is to shorten the schedule for deploying the lithography equipment supporting these technologies by as much as two years, resulting in significant cost savings and other productivity improvements for semiconductor manufacturers.

To achieve this, Intel is participating in a multi-party development program that includes a cash contribution by Intel to fund relevant ASML research and development (R&D) efforts as well as equity investments in ASML. The first phase of this program consists of Intel committing to R&D funding of €553 million (approximately $680 million) to assist ASML in accelerating the development and delivery of 450-mm manufacturing tools, as well as an equity investment of €1.7 billion (approximately $2.1 billion) for approximately 10 percent of ASML's pre-transaction issued shares. Intel will record the R&D investment as a combination of R&D expense and pre-payments on future tool deliveries.
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