2013 promises to be another year, with another new line of processors by Intel, and like every alternate year, the company will introduce a new client desktop CPU socket. With its 4th generation Core "Haswell" processor family, Intel will introduce a brand new CPU architecture that steps up IPC over current Core "Ivy Bridge," hence, Intel's Core desktop processor lineup will not ship with higher clock speeds, yet higher performance. The new chips will be built in the LGA1150 package, and will be accompanied by Intel's 8-series "Lynx Point" chipset.

By Q2-2013, Intel will have launched as many as 14 Core desktop CPU models, including six in the mainline, and eight power-optimized ones. Its nomenclature is somewhat similar to that of current Core "Ivy Bridge" lineup, except the 4000-series numbering. Leading the pack is the Core i7-4770K (unlocked) and i7-4770, clocked at 3.50 GHz with 3.90 GHz Turbo Boost, featuring eight threads with HyperThreading, 8 MB of L3 cache, Intel HD Graphics 4600 iGPU clocked up to 1250 MHz, with 84W TDP; followed by Core i5-4670K (unlocked) and i5-4670 clocked at 3.40 GHz with 3.80 GHz Turbo Boost, and 6 MB L3 cache. The Core i5-4570 and i5-4430 are clocked at 3.20 GHz (3.60 GHz Turbo) and 3.00 GHz (3.20 Turbo).

Intel Corporation introduced the Intel Atom processor S1200 product family today, delivering the world's first low-power, 64-bit server-class system-on-chip (SoC) for high-density microservers, as well as a new class of energy-efficient storage and networking systems. The energy-sipping, industrial-strength microprocessor features essential capabilities to achieve server-class reliability, manageability and cost effectiveness.

"The data center continues to evolve into unique segments and Intel continues to be a leader in these transitions," said Diane Bryant, vice president and general manager of the Datacenter and Connected Systems Group at Intel. "We recognized several years ago the need for a new breed of high-density, energy-efficient servers and other datacenter equipment. Today, we are delivering the industry's only 6-watt SoC that has key datacenter features, continuing our commitment to help lead these segments."

Intel's 22 nanometer tri-gate technology, which goes into building today's 3rd Generation Core desktop and notebook processors, and soon the entry-level Pentium and Celeron ones, will make it to mobile SoCs (systems on chips), which will drive battery life-sensitive devices such as smartphones and tablets. Intel announced that development of such chips is in progress, speaking at the 2012 International Electron Devices Meeting. The new 22 nm SoCs could feature anywhere between 20 to 65 percent higher performance than today's 32 nm low-power chips. The new chips will allow Intel to take on mid- and high-grade ARM SoCs. Intel didn't go into the specifics.

Validity Sensors, Inc., the leader in Natural ID authentication, today announced that Intel Capital has completed a strategic investment as part of its Series E Financing. Intel's investment combined with additional strategic investments from World Fair and DDS brings the total Series E capital commitments to more than $22 million. This follows an initial closing on October 4, 2012, led by TeleSoft Partners that included full participation from Qualcomm Ventures, VentureTech Alliance (the venture capital arm of TSMC), Panorama Capital and Crosslink Capital.

"Validity's technology addresses an important need to make computing devices and the transactions completed on them more secure while actually increasing ease of use for the end user," said Dave Flanagan, Managing Director, Intel Capital. "This investment reflects our commitment to collaborate with the fingerprint sensor market leader to create differentiated products for mobile and computing platforms."

PROMISE Technology Inc., a leader in providing high-performance storage solutions for the rich media market and the leader in designing cutting-edge Thunderbolt enabled devices, is proud to announce creative professionals and power users on PCs can now leverage the unparalleled performance of the award-winning Pegasus J2 to power them through their creative projects. The ultra-portable PROMISE Pegasus J2, one of the first storage devices with Thunderbolt technology to be certified for PC by Intel Corporation, can deliver up to 750 MB/s of performance, yet it's pocket-sized, enabling users to harness high bandwidth to transfer, playback, or edit media directly from the Pegasus J2 from anywhere.

Provided Intel's idea of the "foreseeable future" doesn't end at 2014, PC enthusiasts can breathe a sigh of relief as it came out with a statement saying it is committed to socketed CPU platforms. "Intel remains committed to the growing desktop enthusiast and channel markets, and will continue to offer socketed parts in the LGA package for the foreseeable future for our customers and the Enthusiast DIY market," said Intel spokesperson Daniel Snyder, adding "However, Intel cannot comment on specific long-term product roadmap plans at this time, but will disclose more details later per our normal communication process."

Reports of Intel abandoning socketed client CPUs in favor of BGA (ball grid array) packages -- in which the processor is permanently soldered onto motherboards à la graphics cards -- first surfaced in October with industry observer PC Watch, which maintains a spotless record on predicting long-term Intel roadmaps, claiming Intel will abandon socketed CPUs after 4th generation Core "Haswell." The news even prompted AMD to come out with a statement that it's never gonna give you up, never gonna let you down, never gonna turn around and desert you.

Intel will be capable making chips on the 14 nanometer silicon fabrication process, in 18-inch diameter wafers, "in two years," as development of the technology and machinery to make it happen is making good progress, according to company CTO Justin Rattner. He noted that Intel's aggressive tech advancement will keep Moore's Law relevant for at least the next 10 years. By the end of 2013, Intel's D1X Fab in Oregon, Fab 42 in Arizona, in the US, and Fab 24 in Ireland will begin producing batches of simple chips such as P1272 and P1273 series SoCs. After 14 nm, development for 10 nm, 7 nm, and 5 nm will follow, in order.

Even as Intel neither confirms nor denies reports of it abandoning socketed client desktop processors in favor of BGA packages that permanently bind chips to motherboards, AMD has come forward and asserted that it won't abandon socketed client processors, and will continue to support the DIY PC enthusiast market, reinforced with the fact that BClk multiplier-unlocked processors from the company start for as low as US $129.99. In a statement to the TechReport, AMD's Chris Hook said:

AMD has a long history of supporting the DIY and enthusiast desktop market with socketed CPUs & APUs that are compatible with a wide range of motherboard products from our partners. That will continue through 2013 and 2014 with the "Kaveri" APU and FX CPU lines. We have no plans at this time to move to BGA only packaging and look forward to continuing to support this critical segment of the market.

As the company that introduced new types of BGA packages in ultrathin platforms several years ago, and today offers BGA-packaged processors for everything from ultrathin notebooks to all-in-one desktops, to embedded applications and tablets, we certainly understand Intel's enthusiasm for the approach. But for the desktop market, and the enthusiasts with whom AMD has built its brand, we understand what matters to them and how we can continue to bring better value and a better experience.

Intel Corporation today announced the pricing of four series of senior unsecured notes for an aggregate principal amount of $6.0 billion pursuant to an effective shelf registration statement previously filed with the Securities and Exchange Commission.

Of these notes, $3.0 billion will mature on Dec. 15, 2017 and will bear interest at an annual rate of 1.35%, $1.5 billion will mature on Dec. 15, 2022 and will bear interest at an annual rate of 2.70%, $750 million will mature on Dec. 15, 2032 and will bear interest at an annual rate of 4.0%, and $750 million will mature on Dec. 15, 2042 and will bear interest at an annual rate of 4.25%. The notes were offered to the public at a price of 99.894% of par in the case of the 2017 notes, 99.573% of par in the case of the 2022 notes, 99.115% of par in the case of the 2032 notes and 99.747% of par in the case of the 2042 notes. The offering is expected to close on Dec. 11, 2012, subject to customary closing conditions.

With the dawn of 2013, and no catastrophes in sight, Intel is going ahead with its usual business of phasing out old processor models, and making way for new ones. By the end of 2012, Intel will stop taking orders for several processor models mostly based on the older 32 nm "Sandy Bridge" silicon. These include chips such as the Core i7-2700K, Core i5-2310, Core i3-2105, Pentium G440, and surprisingly, an early demise of the 22 nm Core i5-3450, which is cannibalized by the Core i5-3470 at the same price point. Pentium G870, G645 and G645T as well as Celeron G555, G550 and G550T are the other chips on the chopping block.

Come 2013, Intel will release Pentium and Celeron series processors based on its 22 nm "Ivy Bridge" micro-architecture. These include the Pentium G2130, G2020 and G2020T and Celeron G1620, G1610 and G1610T. In the mobile (notebook) CPU sphere, Intel will launch dual-core "Ivy Bridge" chips to layer out its Ultrabook product segment. These include the Core i7-3687, Core i5-3437U, Celeron 1037U, 1007U, 1020M and 1000M. In March, the company is expected to launch its 4th generation Core "Haswell" line of processors.

Sapphire officially launched the Vapor-X CPU cooler it talked about at trade shows earlier this year. It uses a vapor-chamber plate to draw heat from the CPU, and convey it to four 7 mm-thick nickel-plated copper heat pipes, which then pass through a dense aluminum fin stack, that's ventilated by two 120 mm PWM controlled fans (replaceable) in push-pull configuration. Spinning at speeds ranging between 495 and 2,200 RPM, the fans push 77 CFM of air, each. Measuring 135 x 110.4 x 163.5 mm, the heatsink weighs about 925 g. Nearly every modern client CPU socket type is supported, including Intel sockets LGA2011, LGA115x, LGA775, and AMD sockets AM3+/AM3/AM2+/AM2, and FM2/FM1. Expect a sub-$80 price.

Intel Corporation recently announced its latest communications platform, previously code named "Crystal Forest," will help service providers and telecom equipment manufacturers (TEMs) encrypt and process data across the network more efficiently. The platform will also offer superior communications workload consolidation via a single architecture for greater cost efficiency.

The platform will particularly benefit TEMs that are developing low-end products (such as wireless access and branch routers), as well as high-end equipment (for example LTE core network elements and enterprise security appliances).

Jon Peddie Research (JPR), the industry's research and consulting firm for graphics and multimedia, announced estimated graphics chip shipments and suppliers' market share for Q3'12.

The news was terrific for Nvidia and disappointing for everyone the other major players. From Q2 to Q3 Intel slipped in both desktop (7%) and notebook (8.6%). AMD dropped (2%) in the desktop, and (17%) in notebooks. Nvidia gained 28.3% in desktop from quarter to quarter and jumped almost 12% in the notebook segment.

The processor-motherboard combination as PC enthusiasts know it could end, with Intel LGA1150 processors under the "Haswell" micro-architecture, likely to becoming the last client processors to ship in the retail channel (processor-in-box). Future Intel client processors, codenamed "Broadwell" could ship only in BGA (ball-grid array) packages, with existing motherboard vendors selling their products with processors permanently soldered onto them. The information comes from Japanese PC Watch, which cites sources in the PC industry.

With a compacted socket-processor launch cycle that spans nearly 2 years under the company's "tick-tock" product strategy, the scope for processor updates in the client computing industry might be lower than what it was in the LGA775 days. Perhaps statistics at Intel don't show a sizable proportion of people upgrading processors on existing motherboards, or upgrading motherboards while retaining the processor, rather buying a combination of the two, not to mention the fact that pre-built PCs outsell DIY assembled ones in major markets. With the processor being "tied" to the motherboard, Intel gets room to compact the platform further, combining processor and core logic completely into a single package. It's likely that Intel could still leave processor interchangeability to its HEDT (high-end desktop) platform, which sees processors start at $300, and motherboards at $200.

Abee unveiled the Acubic NE01 and NE02 lines of replacement cases for Intel NUC. Made of brushed, anodized aluminum, the cases are available in a variety of glossy colors. The NE01, the first group of cases pictured below, measures 125 x 111 x 41 mm, featuring an edgy design. The NE02, on the other hand, measures 126 x 111 x 42 mm, featuring a slightly rounded and curvy design. Both cases weigh roughly 450 g. Designed strictly for the NUC form-factor, the two support Intel Desktop Boards D33217CK and D33217GKE only, are are compatible with their rear-panel bracket, and front USB port positions. Both cases support VESA mount, and can latch onto your flat-panel. Slated for Wednesday (28/11), the NE01 and NE02 are priced around US $99.

Intel's SSD 525 line of performance mSATA SSDs may be slated for 2013, but made an early debut with the company's NUC (next unit of computing) desktop. A 180 GB variant of the drive was put to test by VR-Zone, which is driven by LSI-SandForce SF-2281 processor, and features three Intel-made 20 nm MLC NAND flash chips (6-channels). The drive cracked Anvil Storage Utilities benchmark with 504 MB/s (compressible) and 463 MB/s (incompressible) sequential read speeds, 468 MB/s (compressible) and 240 MB/s (incompressible) sequential writes, and about 55,841 IOPS 4K random write (QD16) performance. The performance numbers make the drive appear nearly as fast as larger 2.5-inch SATA SSDs, and could be a boon for Ultrabook makers.

Creative Technology Ltd today announced it has entered into an agreement with Intel Corporation for Intel to license certain technology and patents from ZiiLABS Inc. Ltd, a wholly-owned subsidiary of Creative, and acquire certain engineering resources and assets related to its UK subsidiary ZiiLABS Limited (formerly known as 3DLABS Limited).

The US$50 million deal includes US$20 million to Creative for the licensing of certain technologies to Intel relating to ZiiLABS' high performance GPU technology. The second part of the deal is US$30 million to Creative for the transfer of certain engineering resources and assets in the UK subsidiary to Intel. The UK subsidiary is a design entity engaged in, primarily on behalf of ZiiLABS Inc. Ltd, the development of various silicon solutions, including the ZMS chips for Creative. The transfer of engineering resources and assets will be through the divestment of the UK subsidiary by Creative.

Intel Corporation today announced that the company's president and CEO, Paul Otellini, has decided to retire as an officer and director at the company's annual stockholders' meeting in May, starting an orderly leadership transition over the next six months. Otellini's decision to retire will bring to a close a remarkable career of nearly 40 years of continuous service to the company and its stockholders.

"Paul Otellini has been a very strong leader, only the fifth CEO in the company's great 45-year history, and one who has managed the company through challenging times and market transitions," said Andy Bryant, chairman of the board. "The board is grateful for his innumerable contributions to the company and his distinguished tenure as CEO over the last eight years."

As confirmed by some freshly-leaked slides, 2014 will see Intel bring some new guns to the fight with ARM, including Bay Trail-T, the successor of Clover Trail and the first Atom platform to take advantage of the 22 nm manufacturing process.

The star of Bay Trail-T is the Valleyview SoC which will feature four (out-of-order) Silvermont cores clocked at up to 2.1 GHz (delivering up to 60% higher performance than the Clover Trail chip), a two-channel LPDDR3 memory controller, an upgraded video decoder, support for resolutions up to 2560 x 1600 pixels, and a new GPU boasting DirectX 11 capabilities and offering up to a 3x performance boost over Clover Trail.

Devices based on Bay Trail-T are expected to have a standby battery life of 20 days and would last for 11 hours of continuous video playback, before needing to be charged.

Marking a new era in high-performance computing, Intel Corporation introduced the Intel Xeon Phi coprocessor, a culmination of years of the research and collaboration, to bring unprecedented performance for innovative breakthroughs in manufacturing, life sciences, energy and other areas.

The ability to quickly compute, simulate and make more informed decisions has propelled the growth of high performance computing (HPC) and analytics. This has been driven by global business and research priorities to more accurately predict weather patterns, create more efficient energy resources, and develop cures for diseases among many other pressing issues. With the breakthrough performance per watt and other new attributes of Intel Xeon Phi coprocessor, the industry will have even greater reliability in generating accurate answers, help proliferate high-performance computing beyond laboratories and universities and achieve maximum productivity.

Going into 2013, Intel's tough balancing act between keeping a low power/thermal envelope, and advancing performance, all while staying on the 22 nm silicon fab process, will be care of its Core "Haswell-ULT" processor. The chip will feature some radical changes to traditional Intel processor design, which will help it achieve its design goals. According to a deck of leaked slides scored by Expreview, Intel plans to use additional C-states that drop the processor's base clock, and redesign the processor package to accommodate the PCH silicon, reducing the board footprint.

To begin with, Haswell-ULT will be designed to support 24 MHz base clock speed, which running in "deep" energy-saving idle states. Modern processors with FSB replacement interconnect technologies such as QuickPath Interconnect and HyperTransport need a base clock to time other components on the processor, and for low-level communications, while a bulk of the data is transported by the primary interconnect. Intel found a way to turn off the 100 MHz base clock signal (which is also used to time the PCI-Express root complex and integrated graphics core), and replace it with a 24 MHz clock, when the processor is idling. As the processor returns to lower (more active) C-states, the 100 MHz base clock is reapplied. The 24 MHz base clock is activated by three new power states, C8, C9, and C10, introduced by Haswell-ULT. The third slide below details what happens to the various components in the new C-states.

In what could be the very first time two different machine architectures share a platform, future versions of Intel's Xeon and Itanium processors could be socket-compatible. Intel Itanium is based on the Itanium64 (IA64) machine architecture, while Xeon is x86-64 based. Intel plans to implement its common platform strategy with the next generation models of the two, that's "Kittson" Itanium, and "Haswell" Xeon.

This level of convergence could make it easier for companies to deploy select amounts of Itanium and Xeon processors in their data-centers, to suit specific tasks, and save money on buying common platforms for both. Itanium processors are typically preferred for in mission-critical environments, where there's close to zero margin for error (think military, medical, and space-exploration); while Xeon is good at handling heavy serial processing loads (think servers, database management, cloud). Introduction of the converged platform is expected in the 2013-2015 time range, using Xeon "Haswell" launch as a point of reference.

In an era of unprecedented growth in data usage, businesses require powerful computing solutions that can deliver scalable and resilient performance to run IT's most mission-critical applications. The new Intel Itanium processor 9500 series is more than twice as powerful as the previous generation, making it ideal for today's most demanding workloads, including business analytics, database, and large-scale enterprise resource planning (ERP) applications. Systems based on Intel's Itanium processors run in more than three-quarters of the World's Global 100 companies across industries such as aerospace, energy, life sciences and telecommunications. With the Intel Itanium processor 9500 series, these industries will benefit from a leap in performance and an increase in world-class reliability, availability and serviceability (RAS) capabilities.

Intel has this week announced the discontinuance schedule for two more products, the 2.8 GHz Core i5-3450S desktop CPU and the 1.5 GHz Atom Z670 mobile chip. The i5-3450S will be available for orders until May 24th, 2013 and will ship until November 8th (for the tray version) or until supplies are depleted (boxed). As for the Z670, Intel will be taking orders for it up to May 31st, 2013 and will ship it while supplies last.

The Core i5-3450S was introduced in Q2 2012 while the Atom Z670 debuted last year (Q2).

As big data, high-performance computing (HPC) and cloud-computing applications push the demand for real-time access of data into the zettabytes, Intel Corporation announced today its next-generation data center solid-state drive (SSD), the Intel Solid-State Drive DC S3700 Series, designed to remove storage bottlenecks and maximize multi-core CPU performance. The Intel SSD DC S3700 Series delivers fast, consistent performance and low latencies along with strong data protection and high endurance to help IT personnel support today's most demanding data center applications.

"Today's data explosion creates unique storage challenges for data center professionals," said Rob Crooke, Intel vice president and general manager for the Intel Non-Volatile Memory (NVM) Solutions Group. "High latencies and slow storage I/O can cripple data centers' ability to deliver exciting big data or cloud-computing applications with fast, low latency data access. Intel's next-generation Intel SSD DC S3700 Series breaks through SSD limitations for the data center on all fronts - fast, consistent performance, strong data protection and high endurance -- so IT professionals can deliver on their most demanding technology initiatives."