Altera Corporation and Intel Corporation today announced their collaboration on the development of multi-die devices that leverage Intel's world-class package and assembly capabilities and Altera's leading-edge programmable logic technology. The collaboration is an extension of the foundry relationship between Altera and Intel, in which Intel is manufacturing Altera's Stratix 10 FPGAs and SoCs using the 14 nm Tri-Gate process.

Altera's work with Intel will enable the development of multi-die devices that efficiently integrates monolithic 14 nm Stratix 10 FPGAs and SoCs with other advanced components, which may include DRAM, SRAM, ASICs, processors and analog components, in a single package. The integration will be enabled through the use of high-performance heterogeneous multi-die interconnect technology. Altera's heterogeneous multi-die devices provide the benefit of traditional 2.5 and 3D approaches with more favorable economic metrics. The devices will address the performance, memory bandwidth and thermal challenges impacting high-end applications in the communications, high-performance computing, broadcast and military segments.

GIGABYTE Technology, a leading creator of high performance server hardware, is proud to announce the GA-6PXSVT, its first single 2011 socket based workstation motherboard featuring an integrated 10 Gigabit Ethernet LAN controller.

Following the ever increasing need for bandwidth at every level, GIGABYTE offers with the GA-6PXSVT a strong solution for professional users. Regrouping on an ATX form factor ultra-fast networking, a large storage platform, the support of Intel Xeon E5-1600 V2 & E5-2600 V2 processors, and support for up to 256GB of ECC memory, all the features required for a rock-solid workstation or a high performance rack server are gathered.

Intel today unveiled the Intel Solid-State Drive 730 Series, a powerful performance SSD perfect for gamers and workstation users alike. Both the NAND and the third-generation Intel controller have been infused with data center DNA for quality and reliability, and factory tuned for extreme performance. Delivering low latency and consistently high throughput, the 730 Series helps PCs respond quickly. The drive is protected by a 5-year warranty, ensuring peace of mind with stunning performance.

The Intel SSD 730 Series is available today for pre-order, and will be available for purchase starting on March 18. Get more information on the 730 Series, including where to pre-order.

After the first PIO (Parts-In-One) desktop series HA210 and HA211, Huntkey advanced its part-in-one desktop pcs and delivers HA230 and HA212, which will bring your digital home to life. Fueled by smart power supply, powerful graphics, and vivid audio, its full HD display looks beautiful and performs even better. Plus, it is easy to install or upgrade by yourself.

Reclaim your desk and reduce the amount of space needed by up to 80 percent, compared to traditional desktop configurations. The integrated power supply means one cable is all you need, cutting down on clutter. And this new series of part-in-one desktop includes an ergonomically designed adjustable screen angle (0 to 45 degrees) and multiple stand offerings, for maximum user comfort from a compact footprint.

Jon Peddie Research (JPR), the industry's research and consulting firm for graphics and multimedia, announced estimated graphics chip shipments and suppliers' market share for 2013 4Q. The quarter was the second quarter in a row to show a gain in shipments, up 1.6% quarter-to-quarter, and up 2% compared to the same quarter last year.

Quick highlights:

• AMD's overall unit shipments decreased 10.4%, quarter-to-quarter, Intel's total shipments increased 5.1% from last quarter, and Nvidia's increased 3.4%.
• The attach rate of GPUs to PCs for the quarter was 137% and 34% of PCs had discrete GPUs that means 66% of the PCs are using embedded graphics.
• The overall PC market increased 1.8% quarter-to-quarter, but declined 8.5% year-to-year.

To help companies in a variety of industries from retail and healthcare to banking and transportation turn data into actionable insights, Intel Corporation today introduced the Intel Xeon processor E7 v2 family.

Using analytics enables businesses to make decisions that improve top-line and bottom-line results. The Intel Xeon processor E7 v2 family delivers new capabilities to process and analyze large, diverse amounts of data to unlock information that was previously inaccessible.

Intel Corp. has kicked off February by informing partners (and anyone interested) about the discontinuance schedule of nine products including two Ivy Bridge mobile processors - the Core i7-3840QM (2.8 GHz) and i7-3740QM (2.7 GHz), and seven Bay Trail-based SoCs - the Pentium N3510 (2.0 GHz) and J2850 (2.41 GHz) and the Celeron N2910 (1.6 GHz), N2810 (2.0 GHz), N2805 (1.46 GHz), J1850 (2.0 GHz) and J1750 (2.41 GHz).

The Pentium N3510, J2850 and Celeron N2910 are the first to go as they will only be available for orders until February 21st and will continue shipping until April 25th. The rest are set to survive quite a bit longer, their last order date being August 22nd, while shipments won't end until February 6th, 2015.

Lenovo today announced the 1U ThinkServer RD340 two-processor rack server, the storage-rich, 2U ThinkServer RD440 two-processor rack server, and the ThinkServer TD340, a new enterprise-grade, two-processor tower server, designed for customers who need full enterprise capability in a tower form factor. Along with the two-processor rack and tower servers, Lenovo announced the ThinkServer SA120, a modular and scalable rack-mount, direct-attached storage (DAS) enclosure. Together these product additions expand the ThinkServer enterprise portfolio, addressing more workloads and providing better choices for customers.

The 1U ThinkServer RD340 and 2U ThinkServer RD440 rack servers are ideal solutions for small- to mid-sized education, retail, professional service, state and local government, and healthcare customers seeking feature-rich server solutions at budget-friendly prices. Both two-processor servers are equipped with the next-generation Intel Xeon E5-2400 v2 series processors with up to 10 cores each - delivering 25 percent faster performance than previous-generation, award-winning ThinkServer systems.

MSI announces the MSI AE202 All-in-One PC, featuring a Full-HD 19.5" display and Intel ULV processor. By using a 3rd Generation ULV processor, efficient Military Class components and an LED backlight display, the AE202 offers a power saving solution to businesses, schools, stores and exhibition areas. The Full-HD panel, the Com Port on the rear I/O panel and the RoHS and Energy Star certifications are completing the essence of the AE202's commercial usage.

The MSI AE202 All-in-One PC is especially designed for commercial segments that require performance with high efficiency. With the 3rd Generation ULV processor, the AE202 is a powerful and reliable tool for growing businesses. Furthermore, it also comes with a the Com Port, which is the common interface between various business applications. In order to provide a comfortable using experience, the AE202 is equipped with an anti-glare display to reduce background reflections in offices, well-lit shop floors, and in study rooms, thereby helping to reduce eyestrain and enabling users to better concentrate on the contents of their computer monitor without being distracted by reflections.

Intel Corporation's board of directors has declared a quarterly dividend of 22.5 cents per share (90 cents per share on an annual basis) on the company's common stock. The dividend will be payable on March 1, 2014, to stockholders of record on Feb. 7, 2014. Intel (NASDAQ: INTC) is a world leader in computing innovation. The company designs and builds the essential technologies that serve as the foundation for the world's computing devices.

Axiomtek, one of the world's leading designers and manufacturers of innovative, high performance and reliable PC-based industrial computer products, has introduced OPS880-HM, its new cost-effective OPS digital signage player with the support of 4K resolution. The OPS880-HM is powered by 4th Generation Intel Core i5 and i3 processors (codename: Haswell) with the Mobile Intel HM86 Express chipset. The OPS880-HM supports one DDR3L SO-DIMM socket with memory maximum up to 8GB. In addition, it features one mSATA interface as storage device and two PCI Express Mini Card slots for graphics-enhanced video card, wireless LAN card for 802.11 b/g/n and 3G/GPRS, and tuner/AV capture card. The outstanding OPS digital signage module is an ideal choice for various display applications in different environments, e.g., shopping mall, corporate, education, bank, transportation, retail store, restaurant, performing art center.

Intel Corporation unveiled innovative education-focused reference devices for the 21st century interactive learning environment today at Bett 2014. The new Intel Education Tablet and the Intel classmate PC are part of Intel Education Solutions, which includes devices, software, content, services and teacher professional development that work together to transform learning and teaching for student success.

Both the Intel Education Tablet and the classmate PC are student-friendly, rugged designs that can withstand dropping off a desk (from 70 cm) and provide water-resistance and dust-resistance to promote anytime, anywhere learning.

Intel's processor portfolio has just been expanded to include no less than ten new mobile offerings including five Core i7 models, four Core i5s and one Celeron chip. At the head of this new wave is the Core i7-4940MX which features 4 cores clocked at 3.1 GHz and bears a price tag of $1,096. This model takes the top spot in Intel's mobile line-up, pushing aside the 3.0 GHz i7-4930X.

This latest release wave also includes three ultra-low voltage CPUs, the Core i5-4360U, i5-4310U and the Celeron 2980U, the ladder being the cheapest of the lot, costing $107. The rest of the processors are found in the table below.

Intel Corporation today reported full-year revenue of $52.7 billion, operating income of $12.3 billion, net income of $9.6 billion and EPS of $1.89. The company generated approximately $20.9 billion in cash from operations, paid dividends of $4.5 billion, and used $2.1 billion to repurchase 94 million shares of stock.

For the fourth quarter, Intel posted revenue of $13.8 billion, operating income of $3.5 billion, net income of $2.6 billion, and EPS of 51 cents. The company generated approximately $6.2 billion in cash from operations, paid dividends of $1.1 billion, and used $528 million to repurchase 22 million shares of stock.

In an effort to make interaction with technology simpler, more natural and immersive, Intel Corporation today outlined how it, in collaboration with other companies, is bringing human-like senses to Intel-based devices in a new family of hardware and software products called Intel RealSense technology.

The Intel RealSense 3D camera is one of the first products in the new family and is the world's first integrated 3D depth and 2D camera module that helps devices "see" depth much like the human eye.

GIGABYTE TECHNOLOGY Co. Ltd., a leading manufacturer of motherboards and graphics cards announces its attendance at CES 2014, teaming up with Intel, G.SKILL and Enermax to host the 2014 CES Extreme Overclock event, also demonstrating a range of the latest enthusiast motherboards and systems.

Join GIGABYTE during CES 2104 at the Caesar's Palace Conference Center, Las Vegas from January 6th, 2014 where a GIGABYTE Overclocking team led by renowned Overclockers Hicookie and Dinos22 will be joined by other world class talent from around the globe, demonstrating all the skills and experience need to break world records on a GIGABYTE Z87X-OC motherboard.

"We are really excited about hosting some of the world's top Overclockers in Las Vegas," commented Hicookie, Chief Overclocking Evangelist, GIGABYTE Motherboard Business Unit. "It promises to be a fantastic OC showcase event, one that underlines our commitment to extreme overclocking and the development of world-class overclocking motherboards like the Z87X-OC."

The last Sunday of 2013 has seen Intel do a little price slashing, taking between 4% and 26% off the price tag of 31 processors, mostly mobile models. The only desktop chips that got a cut (between 9% and 11%) were three low-power Haswell-based chips, namely the Core i7-4770R, i5-4670R and i5-4570R.

On the mobile front we have lower prices for a trio of high-end quad-cores (i7-4960HQ/5% cut, i7-4950HQ/5% cut, i7-4850HQ/7% cut) as well as for a multitude of Celeron CPUs based on the Ivy Bridge, Haswell and Bay Trail architectures. The full list of price cuts is available in the table below.

Intel is planning to launch its 4th generation Core i7 HEDT (high-end desktop) platform, codenamed "Haswell-E," in the third quarter of 2014 (after June), which should space its launch roughly a year from Core i7 "Ivy Bridge-E." With Haswell-E, Intel is expected to increase core counts across the board, launching an "affordable" six-core part around the $400 mark, an eight-core part around the $600 mark, and an Extreme Edition eight-core part around the $1,000 mark. The three will be based on the LGA2011-3 socket, which has the same pin count as today's LGA2011, yet is incompatible with it, because the pin map of Haswell-E will differ from its predecessors'. Driving the platform will be Intel's X99 Express chipset, with support for up to ten SATA 6 Gb/s ports, and a large number of USB 3.0 ports. Some of the first X99 motherboards are expected to be unveiled at Computex 2014.

Mindspeed Technologies, Inc., a leading supplier of semiconductor solutions for network infrastructure, today announced that it has signed a definitive agreement to sell the assets of its wireless infrastructure business unit to Intel Corporation. The asset sale was contemplated by the agreement and plan of merger with M/A-COM Technology Solutions Holdings, Inc., announced on November 5, 2013.

"We are excited that our wireless infrastructure business is being incorporated into Intel," commented Raouf Y. Halim, chief executive officer of Mindspeed.

Akasa rolled out the Tesla H, an all-aluminium fanless case for Intel's second-generation NUC, based on its Core "Haswell" processor. At 240 x 150 x 48 mm, it's somewhere in between traditional NUCs and slimline mini-ITX cases; but uses that volume productively, in adding not one, but two 2.5-inch drive bays. The first one takes advantage of the standard SATA 6 Gb/s port on the D54250WYK motherboard, and the other requires the included mSATA to SATA adapter. The case is also compatible with Intel's D54250WYB and D34010WYB motherboards.

As mentioned earlier, the all-aluminium case features ridges along its body that let it double up as a passive heatsink for the Core "Haswell" processor and PCH. In addition to the two 2.5-inch drive bays, the Tesla H offers two front-panel USB 3.0 ports, HDA audio jacks, a USB infrared receiver, three holes for WLAN/Bluetooth antennae, a Kensington lock slot, and VESA wall mounts. Akasa didn't announce pricing or availability details.

Organizations can now achieve a higher level of storage performance with Intel RAID RS3 controllers, powered by LSI Technology. They are specifically designed to meet the demands of I/O-intensive applications, cloud datacenters and virtualized server environments.

Businesses that use Intel RAID RS3 controllers as the basis for their storage infrastructure can achieve more than 1 million IOPs in JBOD mode. With 12 Gb/s SAS-3 technology, it can accelerate business-critical applications in enterprise, Web and cloud datacenters.

According to some newly-leaked slides, Intel is planning quite a solid state drive release spree for the second quarter of 2014, one that will see the introduction of three storage solutions - the SSD Pro 2500 Series (codename Temple Star), SSD DC P3500 Series (Pleasantdale) and SSD DC P3700 Series (Fultondale). All three SSD families are going to utilize 20 nm MLC NAND Flash memory, will be available in two form factors and will be backed by a five-year warranty.

The National Cheng Kung University (NCKU) Supercomputing Research Center (RSC) has built the world's first switchless cluster computer. Known as the "CK-Star", this computer connects eight computers without switch control, thus breaking Intel's performance record. Together with the computer systems provided by Acer, the CK-Star is jointly built by NCKU RSC Director Dr. Chi-Chuan Hwang and Dr. Yuefan Deng of Mainland China's National Supercomputing Center in Jinan (NSCCJN), who is also a Distinguished Professor at the State University of New York (SUNY).

NCKU RSC Director Dr. Chi-Chuan Hwang added that CK-Star is the most unique switchless cluster supercomputer compared to traditional cluster supercomputer which requires switch control to control interaction between nodes. He explained that the weakness of the traditional one is that switches will become performance bottlenecks when the number of nodes is large. Besides, switches also consume large amount of power, estimated to be 50% of the total power consumption. With the introduction of the CK-Star which allows the unrestricted expansion of supercomputers, these problems can be overcome.

Intel has just revealed plans to discontinue two of its quad-core Ivy Bridge mobile processors, the 2.7 GHz Core i7-3820QM and 2.6 GHz i7-3720QM. Both models are being pushed aside to leave more room for Haswell-based chips.

The Core i7-3820QM and i7-3720QM will still be available for orders up until June 27th, 2014, and are set to ship till December 5th.

As SSDs play catch-up with HDDs on the capacity front, the focus will shift to NAND flash memory designers increasing transistor densities using newer silicon fabrication technologies. In the absence of that, SSD designers will have to cram more number of NAND flash chips to achieve desired high capacities. That throws up two key issues with having too many chips in one place - heat and power. Intel is gearing up to deal with heat on its upcoming "Fultondale" and "Pleasantdale" SSDs for data-centers. Leaked company documents seen by VR-Zone reveal renders of what Intel expects the drives to look like.

Built in the 3.5-inch form-factor the drives are built almost entirely of chunky metal, with a retractable top lid, and its body. The body doubles up as heatsink, it features metal ridges which dissipate heat drawn from the NAND flash chips of the SSD to the air. Internally, the drive will feature at least two PCBs, one which holds the controller, cache RAM (if any), and some NAND flash chips; while the other holds NAND flash chips entirely. How hot can things get? According to the source, the drive could draw as much as 25W of power. That could amount to enough heat to warrant a passive heatsink. Intel is expected to unveil the two drives at IDF Beijing, slated for Q4-2014.