ADATA Technology, a leading manufacturer of high-performance DRAM modules and NAND Flash application products, today launched a successor to the company's popular XPG DRAM lineup. The new XPG V2 series are designed for 3rd Generation Intel Core Processors and the Z87 platform, and feature colorful and visually striking heat spreaders.

The XPG V2 modules all feature 2oz copper, 8 layer PCB (Printed Circuit Board) aluminum heat spreaders employing Thermal Conductive Technology (TCT). Additionally, the heat spreaders have been re-designed with a futuristic form that will appeal to those who take pride in both the performance and the visual outlook of their high-end system. The 2800 MHz memory runs at timings of CL 12-14-14-36 at 1.65 volts, delivering the performance demanded by gamers and power users.

Be Quiet!, market leader with power supplies in Germany for seven consecutive years, confirms that all of it's current PSU models support Intel's fourth generation of Core processors (Codename Haswell). Intel's upcoming Haswell CPUs impose stricter requirements on the power supply regarding energy saving features. To lower the power consumption of current computers even more, the new processors feature new sleep states called C6 and C7. In these states, the processor is nearly shut off completely, bringing down the power consumption close to zero.

Lenovo announced that customers can place orders for the IdeaPad Yoga 11S beginning today on www.lenovo.com or pre-order on www.bestbuy.com. The acclaimed 360° flip and fold Yoga 11S premiered in January at the International Consumer Electronics Show, following its popular predecessor, the IdeaPad Yoga 13.

Sized well for mobility in a thin, 11.6-inch design, the Yoga 11S Ultrabook convertible comes with choices of a powerful third generation Core i3, i5 or i7 Intel processor giving consumers the ability to create high-performance content and presentations and seamless graphics that make it a great entertainment device.

ECS introduces the first Intel 8-Series Motherboards featuring the new 4th Generation Intel Core processor family for their new family of desktop motherboards Pro, Deluxe and Essentials.

The new ECS (Elitegroup Computer Systems) family of motherboards featuring the new Intel 8-series Chipset family with new designed specifically for the new 4th Generation Intel Core processor family of CPUs, which will be available and shipping worldwide in Q2 2013. The new chipset features support for full SATA III 6 Gb/s internal ports and PCI-Express Gen.3 x16 bus design. They also integrate USB 3.0, Thunderbolt, and enable responsiveness technologies like Intel Smart Response, Intel Smart Connect, and Intel Rapid Start.

Noctua today presented a new revision of its much acclaimed NH-U12DX and NH-U9DX quiet CPU coolers for Intel Xeon workstations and servers. The new i4 models support LGA2011 (both Square and Narrow ILM), LGA1356 and LGA1366 based Xeon platforms and now come with PWM fans for automatic speed control. Fitted with the professional SecuFirm2 mounting system and bundled with Noctua's industrial-grade NT-H1 thermal compound, the NH-U12DX i4 and NH-U9DX i4 form complete premium quality packages for quietly cooling Xeon based workstations and servers.

"Builders of quiet workstations and servers still have trouble finding quality cooling solutions for Intel's LGA2011 socket with Narrow ILM mounting", explains Mag. Roland Mossig (Noctua CEO), "so we've decided to update our DX line of coolers to work with both Square ILM and Narrow ILM based LGA2011 platforms. At the same time, we've added PWM control and switched the U12 version to the new, slimmer layout of the NH-U12S, which not only provides better performance but also ensures easier access to the RAM slots, which was another long time request from our industry partners."

HP today announced the HP SlateBook x2 and the HP Split x2, two detachable PCs that offer the full functionality of a notebook with a removable screen that also is a sleek tablet. Powered by the Android and Microsoft Windows 8 operating systems (OS), respectively, these versatile two-in-one devices combine power and portability, giving customers the flexibility to create, consume and share content in more places.

HP's unmatched portfolio of next-generation PCs is designed to enable users to connect with their information on devices that easily adapt to their needs. By releasing the magnetic hinge, users can move elegantly between the two form factors -- tablet and notebook PC -- all in one device.

SeaSonic Electronics congratulates Intel on the launch of the Haswell Processors. We are inspired by the continuing efforts made by Intel to push the boundaries of performance and at the same time, be environmentally conscious through reduction of energy consumption. These are the exact same attributes which have driven Sea Sonic for the past 35+ years.

As we strive for industry leading performance, we continue to research the long term effects of each of our design. By continuously improving our efficiency we try to achieve maximum energy savings and by using high quality components we aim to prolong product lifetime; all to achieve long term sustainability. Our full lines of 80 PLUS Platinum and Gold power supplies have been designed to be ready to meet Haswell's new technical requirements!

Intel has announced the production release of the Intel SDK for Open CL Applications XE 2013 that launched as a beta program in December. The new SDK broadens options for developers on Intel architecture and includes tools, optimization guides and training.

The SDK helps OpenCL developers improve performance and efficiency on Intel Xeon Phi coprocessors and Intel Xeon processors as well as create highly parallel applications for high performance computing workstations, data analytics and other uses. Download the Intel SDK for OpenCL Applications XE 2013 here.

MSI has released the all new AE1941 based around the Intel 847 CPU. The AE1941 retains the fantastic white color and crystal frame design of the AE1900 series while introducing Intel's new generation of ULV (Ultra Low Voltage) CPUs, especially its Fanless design, which is an industry first. The integration of touch control and multimedia sharing functions together with an even more energy-efficient, stylish and space-saving for home interiors giving the AE1941 a high-tech class of its own.

Intel Corporation today took the wraps off its brand new, low-power, high-performance microarchitecture named Silvermont. The technology is aimed squarely at low-power requirements in market segments from smartphones to the data center. Silvermont will be the foundation for a range of innovative products beginning to come to market later this year, and will also be manufactured using the company's leading-edge, 22nm Tri-Gate SoC manufacturing process, which brings significant performance increases and improved energy efficiency.

"Silvermont is a leap forward and an entirely new technology foundation for the future that will address a broad range of products and market segments," said Dadi Perlmutter, Intel executive vice president and chief product officer. "Early sampling of our 22nm SoCs, including "Bay Trail" and "Avoton" is already garnering positive feedback from our customers. Going forward, we will accelerate future generations of this low-power microarchitecture on a yearly cadence."

Advantech, a global embedded platform manufacturer, today unveiled the new ASMB-822I server-grade motherboard powered by Intel Xeon processor E5-2600 family technology. This new technology comprises 64-bit multi-core processors, PCI Express Gen3 high speed communications, and DDR3 memory with total capacity up to 96GB. ASMB-822I is perfect designed for high performance demands such as NVR, DVR and also target to video wall, video conferencing, surveillance and other mission-critical applications.

"Advantech is committed to providing a full spectrum of embedded systems with advanced and intelligent built-in technology, from fanless and ruggedized to high-performance solutions," said Linda Tsai,Director of Advantech Embedded Systems Group. The ASMB-822I is an ATX server board equipped with LGA 2011 Intel Xeon processor E5-2600 series and Intel C602J series chipset. It supports six DDR3 registered DIMM slots for a 96 GB total capacity and dual GbE LANs using Intel controllers.

Computex is Asia's largest high-tech event and will run from June 4th to to 8th, 2013 in Taipei, Taiwan and BIOSTAR will be showcasing their embedded/IPC solutions and graphics cards products as well as their line of Intel and AMD based motherboards in the Nangang Exhibition Hall at Booth M0402. The theme of their exhibition this year is their Hi-Fi Puro integrated products, including Intel's next generation Haswell based boards and their FM2 motherboards that support AMD's new Fusion "Richland" CPU. Continuing the tradition of their own in-house audio technology called "Puro Hi-Fi Technology"; Biostar is going to present the 2nd generation of this technology, called "Hi-Fi 3D".

Targeting audiophiles, HTPC enthusiasts and high-end gamers alike, Puro Hi-Fi features an integrated independent audio power design with a built-in amplifier. The technology utilizes audio components with an independent power delivery design for a significant reduction in electronic noise producing superb sound quality. The unique noise-blocking multi-layer PCB layout is conducive for an exceptionally clean signal. That design feature, together with a sampling rate of 192 kHz/24-bit, delivers high quality audio through an analog connection to your home theater system, multi-channel speakers or high-end headphones, allowing you to enjoy true high-definition 7.1-channel surround sound.

McAfee today announced the execution of a definitive agreement to initiate a conditional tender offer for the acquisition of Stonesoft Oyj, a leading innovator in next-generation network firewall products, for an aggregate equity value of approximately $389 million in cash.

Stonesoft delivers software-based, dynamic, customer-driven, cyber security solutions to secure information flow and simplify security management. Stonesoft's product portfolio of next-generation firewalls, evasion prevention systems, and SSL VPN solutions addresses businesses of all sizes. Through the pending acquisition of Stonesoft, McAfee expects to extend its leadership position in network security.

Launch of Intel's Core i7-4770K "Haswell" processor may be a month away, but the chip has been in circulation for some time now. An overclocker going by the handle "rtiueuiurei" managed to get an engineering sample of the chip past the 7 GHz mark, 7012.65 MHz to be precise. A base clock of 91.07 MHz, multiplier of 77.0x, and a staggering 2.56V core voltage, unless CPU-Z read it wrong. A single 2 GB memory module was used; no other details were revealed. Core i7-4770K and a fleet of compatible socket LGA1150 motherboards launch around the first week of June.

Intel Corporation announced today that the board of directors has unanimously elected Brian Krzanich as its next chief executive officer (CEO), succeeding Paul Otellini. Krzanich will assume his new role at the company's annual stockholders' meeting on May 16.

Krzanich, Intel's chief operating officer since January 2012, will become the sixth CEO in Intel's history. As previously announced, Otellini will step down as CEO and from the board of directors on May 16.

At a media event held in its Taipei headquarters, GIGABYTE demonstrated its AMP-UP integrated audio solution that will feature on some of its upcoming motherboards. On that pretense, it even got to show of two of its top socket LGA1150 motherboards, built for Core "Haswell" processors, the G1.Sniper 5, and the G1.Sniper M5. Positioned in gamer-overclocker targeted G1.Killer series, the two boards are based on Intel Z87 Express chipset. The G1.Sniper 5 is the larger standard ATX motherboard; while the M5 is a compact micro-ATX offering. The pictures also confirm that socket LGA1150 retention module and bolt-spacing is identical to sockets LGA1155 and LGA1156.

The G1.Sniper 5 appears to feature a 16-phase VRM, which uses ferrite-core chokes, and the same International Rectifier PowIRstage components as Ultra Durable 5 motherboards from the previous generation. This time around, the CPU plays a greater role in voltage regulation. The driver-MOSFETs on the board are cooled by an active fan-heatsink, which also has a liquid channel running through it, so you could make it part of your CPU loop. Thankfully GIGABYTE didn't let its imagination run away with designs of the other heatsinks on the board, one of which cools the Z87 Express chipset, and the other we imagine, a PLX PEX8747 48-lane PCI-Express 3.0 bridge chip. This chip gets you 4-way SLI/CrossFireX support.

Is this what Intel's 4th generation Core i7 "Haswell" retail box looks like? That is the question. For the first time in a decade, Intel could use a collage of pictures in its box-art. The running theme appears to be "creativity," with the box asking "what will you make?" You'll also notice that the box-art doesn't feature a small case-badge art. The top half of the front side could be what the badge ends up looking like. A little while ago, Intel made a cryptic Facebook post confirming a series launch along the sidelines of Computex 2013, held between 3rd and 7th June.

Intel expanded its performance-segment SSD 335 series with a new entry-level 80 GB variant (model: SSDSC2CT080AK5). It joins the 180 GB and 240 GB variants, and occupies a price-point around the 110€ mark (excl VAT), which makes it particularly pricey in comparison to 120 GB drives. SSD 335 combines an LSI-SandForce SF-2281 series controller with Intel-made 20 nm MLC NAND flash.

Intel didn't update the product sheet with details of the new 80 GB model, but its bigger siblings offer sequential speeds as high as 500 MB/s reads, with up to 450 MB/s writes. Built in the 9.5 mm-thick 2.5-inch form-factor, SSD 335 features SATA 6 Gb/s interface, and supports most standard consumer SSD features, including TRIM and NCQ. The drive should begin showing up on online stores worldwide, in both OEM (drive-only) and retail (includes bay-adapters and data migration software) trims.

Intel is expected to unveil its 4th generation Core "Haswell" processor family by early-June, along the sidelines of the 2013 Computex event. In addition to being available in 1000-unit tray quantities to OEMs, the desktop variants of these processors will be available in their familiar retail box packages. Multiple sources confirm that pricing of these chips will be largely identical to that of the current Core "Ivy Bridge" series, with succeeding next-generation part for each current generation one. The table below describes their US MSRP (excl. taxes).

ADATA Technology Co., Ltd. a world leader in DRAM modules and NAND Flash storage application products, today announced the start of shipments of its latest advanced in gaming technology, the XPG Gaming v2.0 Series DDR3-2600 MHz DRAM 8GB modules. These dual channel kits are designed and engineered to bring optimum performance to third generation Intel Core processors and the Z77 platform.

XPG DRAM modules signify Xtreme Performance Gear, providing the extreme speed and performance required by advanced users. The XPG Gaming series v2.0 is targeted specifically at the distinct performance and cooling needs of the worldwide gaming community. These latest DDR3 2600G 8GB modules offer new levels of data transfer speed, along with the many features that are hallmarks of the XPG series.

Intel Corporation today reported first-quarter revenue of $12.6 billion, operating income of $2.5 billion, net income of $2.0 billion and EPS of $0.40. The company generated approximately $4.3 billion in cash from operations, paid dividends of $1.1 billion, and used $533 million to repurchase 25 million shares of stock.

"Amidst market softness, Intel performed well in the first quarter and I'm excited about what lies ahead for the company," said Paul Otellini, Intel president and CEO. "We shipped our next generation PC microprocessors, introduced a new family of products for micro-servers and will ship our new tablet and smartphone microprocessors this quarter. We are working with our customers to introduce innovative new products across multiple operating systems. The transition to 14nm technology this year will significantly increase the value provided by Intel architecture and process technology for our customers and in the marketplace."

Intel may be a couple of months away from launching its Core "Haswell" processor family, and the 8-series "Lynx Point" family of chipset to back it, but is already talking to partners about the platform's successor, slated for the second quarter of 2014. Core "Haswell" introduces the industry to socket LGA1150 motherboards, and Core "Broadwell" could, in all likelihood, provide continuity to it, much in the same way "Ivy Bridge" did to "Sandy Bridge." Intel could introduce a new chipset to tag along with "Broadwell."

According to a roadmap slide seen by VR-Zone, Intel's 9-series chipset will include at least two models, the Z97 targeting enthusiasts, and the H97 targeting mainstream consumers. These chipset could drive socket LGA1150 motherboards going into the second half of 2014, and could support both "Haswell" and "Broadwell," in the same way today's 7-series chipset support "Sandy Bridge" and "Ivy Bridge." Intel could introduce a major feature with 9-series, SATA Express.

To tackle upcoming generations of Ultrabooks and NUC that lack space for discrete graphics, yet having to keep up with the demands of higher display resolutions (i.e. proliferation of 3840 x 2160), Intel is designing special variants of its Core "Haswell" processors that feature large integrated graphics cores bolstered by fourth-level eDRAM caches on-package. Pictured below, is one such contraption.

The graphics-enhanced Core "Haswell" processor is an MCM (multi-chip module) of two dies, the larger one is the actual "Haswell" processor complex with cores, uncore, and the larger GT3 integrated graphics core. While the standard Haswell silicon with GT1 and GT2 integrated GPU options, physically features up to 20 execution units (EUs), the large GT3 silicon features double that, at 40 EUs.

At the Intel Developer Forum (IDF) 2013 event held in Beijing last week, the company ran two separate seminars related to "Haswell," one related to the micro-architecture itself, and the other overclocking it. The company detailed improvements to the ways in which you can overclock these chips, without necessarily having to shell out dough for the base clock multiplier unlocked "-K" parts.

To begin with, tweaking Core "Haswell" processors will be similar to tweaking Core "Sandy Bridge-E" high-end desktop (HEDT) platform. Naturally then, overclocking "non-K" parts will be similar to overclocking the Core i7-3820. The chips ship with a base clock speed of 100 MHz. As with "Ivy Bridge," not just CPU cores, but also certain uncore components rely on this frequency. Also, as with "Ivy Bridge," overclockers will be given 5 to 7 percent headroom for tweaking this frequency, but it doesn't end there.

At the ongoing Intel Developer Forum (IDF) 2013 event in Beijing, Intel announced second-generation Thunderbolt specification. Pin and plug-compatible with existing Thunderbolt devices, the second-generation Thunderbolt doubles bandwidth over its predecessor, offering devices an enormous 20 Gb/s of bandwidth, four times that of USB 3.0 SuperSpeed. The bandwidth enables users the ability to transfer uncompressed 4K Ultra-HD video without causing display to lag.

To back the specification, Intel announced the "Falcon Ridge" line of Thunderbolt host controllers, mass production of which will commence by late-2013, going into 2014. In addition, the company launched two "Redwood Ridge" host controllers, DSL4510 and DSL4410. The two add DisplayPort 1.2 capability when connecting to native DP displays, improve power management, and reduce platform BOM cost.