According to a leaked SSD product stack roadmap by Intel, scored by VR-Zone, the company is close to launching its next-generation performance-segment consumer SSDs, the SSD 530 series. The line succeeds Intel's SSD 520 and SSD 525 series, features the latest 20 nm MLC NAND flash, but the same LSI-SandForce SF-2281 controller (probably the latest revision, backed by a better firmware). According to the roadmap, the series should have debuted back in June, which never happened. Apparently, it's off by a month, and Intel moved its launch window to some time between the 8th and 12th of this month.

Intel's SSD 530 series will be available in three form-factors, including the familiar 2.5-inch SATA (7 mm-thick), NGFF M2, and mSATA. The drives will be available in 80 GB, 180 GB, 240 GB, and 360 GB for the M2 and mSATA form-factors; and 180 GB, 240 GB, 360 GB, and 480 GB for the 2.5-inch form-factor. At this point, nothing is known about their rated performance or pricing. Elsewhere in the lineup, SSD 335 series will continue throughout the year, going into Q1 2014, as Intel's mid-range SSD offering.

EVGA launched its flagship socket LGA2011 motherboard, the X79 Dark (model: 150-SE-E789-KR). It made its debut at this year's International CES event. Designed for open-air benches, this motherboard requires a case that can seat E-ATX motherboards. It measures 304.8 x 263.5 mm (LxW). It draws power from a combination of a 24-pin ATX input, two 8-pin EPS inputs, and a 6-pin PCIe input, to stabilize bus-supplied power for add-on cards. The X79 Dark from EVGA comes with a plethora of features for CPU and VGA overclockers alike. In addition to onboard controls, EVBot support, consolidated voltage measurement points, EVGA deployed a brand new UEFI setup program interface, which debuted with some of its premium Z87-based motherboards.

EVGA X79 Dark features a 12-layer PCB. It uses a 12+2 phase VRM to power the CPU, a 4-phase VRM for the memory, and features power-gating to individual PCI-Express slots. On the expansion front, you get five PCI-Express 3.0 x16 slots, from which two are electrical x16-capable, and all five electrical x8-capable, depending on how the slots are populated. Storage connectivity includes six SATA 6 Gb/s internal ports, two of which are from the X79 PCH, four from third-party controllers; four SATA 3 Gb/s ports from the PCH, and two eSATA 3 Gb/s. The rest of its connectivity includes 8-channel HD audio, two gigabit Ethernet interfaces (both driven by Intel-made controllers), six USB 3.0 ports (four on the rear panel, two by header), Bluetooth, and a number of USB 2.0/1.1 ports. EVGA X79 Dark bear a street-price of US $399.99.Many Thanks to Radrok for the tip

Who ever said that only K series CPUs and the Z-family platform are capable of being overclocked? The avant-garde company ASRock has broken this limitation with an exciting new feature named Non-Z OC! Via this feature overclockers may install their K series CPUs to ASRock's Fatal1ty H87 Performance or any other H87 B85 chipset motherboards and start overclocking immediately!

The first ASRock motherboard that implements the Non-Z OC feature is Fatal1ty H87 Performance, which is also the H87 motherboard with the most number of power phases in the market currently. Along with its powerful 8 Power Phase design, the CPU frequency can be effortlessly overclocked up to 26%! Simply update to the latest version of our UEFI, then you'll find the Non-Z OC feature sitting in the OC Tweaker page, select a frequency from a couple of preset settings, restart, kick back to enjoy your drink and voila!

Coolaler.com community member "Toppc" scored an engineering sample of Intel's upcoming Core i7-4960X "Ivy Bridge-E" socket LGA2011 processor, and wasted no time in taking a peek inside its integrated heatspreader (IHS). Beneath the adhesive layer that holds the IHS to the package, which could be fairly easily cut through, "Toppc" discovered that Intel is using a strong epoxy/solder to fuse the processor's die to the IHS, and not a thermal paste, like on Core i7-3770K. Solders tend to have better conductivity than pastes, but make it extremely difficult to de-lid the processors, not to mention potentially disastrous. In the process of delidding this chip, "Toppc" appears to have knocked out a few components around the die. Unless you're good at precision soldering, something like that would be a fatal blow to your $1000 investment.

The EUROCOM X5 has been stress tested and benchmarked with an Intel Core i7-4930MX processor and NVIDIA GeForce GTX 780M graphics with extreme results. "Eurocom created the X5 gaming laptop so our gaming warrior clients could discover their dark side, the performance and design are unmatched" Mark Bialic, Eurocom President. The EUROCOM X5 will be equipped with high resolution 17.3" 1920x1080 IPS and 3D displays, upgradeable extreme processors, next generation NVIDIA GTX 700M graphics, multiple storage options (up to 5 physical drives) and up to 32 GB of DDR3-1600 memory.

Personalize your own Eurocom laptop weapon with a custom backlit keyboard, with 7 colours, 3 zones and 8 modes to dominate and stand out. To store the latest games and software the X5 can support up to 5 storage drives, with 2 mSATA solid state drives for fast boot up times and blazing responsiveness. The following 4th gen CPUs will be available: Intel Core i7-4930MX with 4 cores and 8 threads running at 3 GHz with 8 MB L3 cache, Intel Core i7-4900MQ, Intel Core i7-4800MQ and Intel Core i7-4700MQ.

Lenovo today announced its new ThinkPad S531, a premium laptop PC featuring an ultra-thin bezel and bevelled edges, giving the illusion that the PC is floating. Optimized for Windows 8, the ThinkPad S531 offers small businesses enhanced performance and 15 per cent faster processor speed than previous generations. The ThinkPad S531 is being launched today at the Xander Zhou fashion show at London Fashion Week in conjunction with the designer's new men's fashion collection.

Lenovo's first 15-inch ThinkPad Ultrabook delivers high style and performance to image-conscious small businesses and is ideal for professionals who want a combination of design and substance. It is also a fit for small businesses that need a laptop to do it all - great performance for work tasks and an excellent experience for personal computing

Acer America today announced that a new model in its Acer C7 Chromebook line, the Acer C710-2856, is now available at 2,800 Walmart stores for the low price of only $199. The new Acer C710-2856 Chromebook has a 16GB Solid State Drive (SSD) that provides fast boot times and quick access to apps and media for speedier all-around performance.

The affordable price and wide range of capabilities make the new Acer C7 Chromebook the ideal additional laptop for families, students and professionals who need a fast, easy and secure way to get online to do their computing in the cloud, such as using Gmail, keeping up on social networks, shopping and paying bills. The new model is available at an ideal time, since many consumers are looking for a portable computer for summer travel, or are already planning ahead for back-to-college.

A system built with thousands of Intel processors and co-processors was just named the most powerful supercomputer in the world in the 41st edition of the Top500 list of supercomputers. The system, known as "Milky Way 2," includes 48,000 Intel Xeon Phi coprocessors and 32,000 Intel Xeon processors and operates at a peak performance of 54.9 PFlops (54.9 quadrillion floating point operations per second) -- more than twice the performance of the top rated system from the last edition of the Top500 list in November 2012. This is the first exclusively Intel-based system to take the top spot on the list since 1997.

Intel also announced the expansion of the Intel Xeon Phi coprocessors portfolio and revealed details of the second generation of Intel Xeon Phi products code named "Knights Landing." The new products and technologies will continue to radically increase the energy efficiency and performance of supercomputers worldwide.

Another day, another Intel leak and a few surprises as well. During the last few days we covered Intel's desktop roadmap for the next twelve months, bringing you news and insights on Intel's plans for the aforementioned time interval. Today we bring you news on what's to follow in the second half of 2014, specifically, on Intel's Premium Desktop plans for the interval, namely Haswell-E, DDR4 and the X99 PCH.

Haswell-E will be Intel's last and best offering using the 22 nm fabrication process, it will come in two versions, core count wise, 8 core part(s) as well as 6 core part(s) with hyper-threading enabled, therefore, boasting no less that 16 execution threads for the 8 core chips and 12 execution threads for the 6 core version(s). Judging by that alone, Haswell-E should constitute a far superior upgrade over Ivy Bridge-E, compared to what the latter will be in relation to Sandy Bridge-E, Haswell-E offering two additional physical cores that translate into four additional execution threads. The new chips will boast 2.5 MB of L3 Cache per core, summing up to 20 MB total L3 cache for the 8 core parts. TDP will remain in the same neighborhood it was in the case of its predecessors, around 130-140 W.

We know from older reports that Intel will refresh its socket LGA2011 HEDT (high-end desktop) product family with three new parts, based on the new 22 nm "Ivy Bridge-E" silicon. A table detailing their clock speeds was leaked to the web. In addition, we got details of what Intel's entry-level Core i3 "Haswell" line of dual-core processors would look like, specs-wise. The Ivy Bridge-E silicon, is to a large part an optical shrink of the Sandy Bridge-E silicon, with a few improvements. The chip is fabricated on Intel's 22 nm node with tri-gate transistors, the IMC natively supports DDR3-1866 MHz, the PCI-Express root complex is gen 3.0 certified, and the CPUID features the new RdRAND instruction set. Aside from these clock speeds are increased across the board, although TDP isn't lowered from the previous 130W.

Leading the Core i7 "Ivy Bridge-E" pack is the Core i7-4960X Extreme Edition, with its 3.60 GHz core, 4.00 GHz maximum Turbo Boost, unlocked base-clock multiplier, and 15 MB L3 cache. This six-core chip will command a four-figure price. Next up, is the Core i7-4930K, with 3.40 GHz core, 3.90 GHz maximum Turbo Boost, unlocked base-clock multiplier, and 12 MB L3 cache. This chip could be 30-40 percent cheaper than the i7-4960X. The cheapest of the lot, though, is the Core i7-4820K. This quad-core part, interestingly, features unlocked base-clock multiplier, unlike its predecessor, the i7-3820. Perhaps Intel didn't want a repeat of Core i7-3770K cannibalizing the i7-3820. The i7-4820K features 3.70 GHz core, 3.90 GHz Turbo Boost, and 10 MB of L3 cache. The chip may be priced in the same range as the i7-4770K. All three parts feature quad-channel DDR3 integrated memory controllers, with native support for DDR3-1866.

AsRock, the renowned motherboard manufacturer, earlier today updated the CPU Support List for its LGA 2011 platform products with Intel's next generation Xeon E5 processors, using Ivy Bridge-EP silicon and scheduled for launch in Q3 this year. Along with the part number list, specifications such as clock frequency, cache size and TDP value were made public as well. Information from which we can deduce that the new chips will come in three core count versions, specifically 8 core, 10 core and 12 core parts. TDP ranges from 70 W for the E5-2650L v2, a 10 core chip running at 1.7 Ghz, to 150 W for the E5-2687W v2, also a 10 core chip but running at 3.4 Ghz.

Intel Corporation today announced the Intel Solid-State Drive DC S3500 Series, its latest solid-state drive (SSD) for data centers and cloud computing. Designed for read-intensive applications such as Web hosting, cloud computing and data center virtualization, the Intel DC S3500 Series is an ideal replacement for traditional hard disk drives (HDD), allowing data centers to save significant costs by moving toward an all-SSD storage model.

Intel SSDs, including the Intel SSD DC S3500 Series, enable transformational improvements in cloud infrastructure, fostering new and enriching Web experiences. End customers experience quicker Web page loads and improved response times as a result of dramatically improved data access times and reduced latency. IT managers and cloud developers are rewarded with improved total cost of ownership as a result of reduced power consumption, more consistent performance and smaller space requirements. More than half of U.S. businesses now employ cloud computing applications, and IDC predicts that worldwide spending on cloud services will reach $44.2 billion this year. Data centers powering these cloud applications need to quickly, efficiently and reliably scale to handle the tremendous growth of connected users and data traffic.

At an industry event in Taipei today, Hermann Eul, general manager of Intel's Mobile and Communications Group, unveiled new details about the company's forthcoming Intel Atom processor-based SoC for tablets ("Bay Trail-T") due in market for holiday this year. Based on the new Silvermont microarchitecture, the next generation 22nm Intel technology for tablets and ultra-mobile devices will enable sleek designs with 8 or more hours of battery life2 and weeks of standby, as well as support Android* and Windows 8.1*.

Eul also spoke to recent momentum and announcements around the smartphone business and demonstrated the Intel XMM 7160 multimode 4G LTE solution, now in final interoperability testing (IOT) with Tier 1 service providers across North America, Europe and Asia. "The mobile category is undergoing a tremendous amount of innovation and constant change," said Eul. "As we look at growing it, we continue to invest in and accelerate our efforts across all aspects of mobility with a focus on smartphones, tablets and wireless communications. Intel's unique assets will enable more compelling and differentiated products and experiences, while at the same time helping to shape and lead markets in the future."

Today Intel introduced the new Intel Xeon processor E3-1200 v3 product family based on Haswell microarchitecture and the company's 22nm manufacturing process. When deployed in cloud data center environments, the new Intel Xeon processors will help reduce costs and increase media processing capabilities for cloud-based media service providers to better support customers wanting to upload and share videos with friends across different mobile devices. In addition to a better offering for cloud media workloads than discrete graphic-based servers, new Intel Xeon processors offer exceptional energy efficiency and lowest TDP ever at 13 Watts for highly dense environments like microservers. Get the Intel Xeon processor E3-1200 v3 product family fact sheet.

Creative Technology Ltd today announced the new Creative Senz3D interactive gesture camera, introducing an immersive multi-dimensional gaming, video conferencing and voice control experience for PC enthusiasts and early adopters. Designed for use with 2nd generation and later Intel Core processors, the Creative Senz3D will be on display at Computex Taipei, Taiwan from June 4 - 8 at the Taipei World Trade Center (TWTC) Nangang Exhibition Hall, Intel Booth #M410.

Creative Senz3D combines advanced depth sensor technology with a camera and dual array microphones to deliver a new multi-dimensional interactive experience. Users can play PC games using hand and finger gestures to control and interact with characters and environments. Its 3D sensing technology is able to enhance facial recognition and also extract a person's image for various applications. In addition to a variety of games and applications that ship with the Creative Senz3D, users will experience a robust bundle of software which enables interactive video conferencing, voice control of a PC, creation of video blog environments, and much more.

ASUS launched its socket LGA1150 motherboard lineup with three products in its coveted Republic of Gamers (ROG) lineup, the flagship Maximus VI Extreme, the micro-ATX Maximus VI Gene, and the mid-range Maximus VI Hero. A little earlier today, the mini-ITX Maximus VI Impact joined the team with a stunning feature-set for its size. At Computex, we pictured the last piece of the puzzle, the Maximus VI Formula. Pictured below, this ATX motherboard based on the Z87 chipset is best suited for liquid-cooled rigs with 3-way graphics cards. It borrows a piece of technology over from the TUF series, a thermal armor that covers most parts of the board. The armor makes contact with a water block that actively cools the board's CPU VRM.

The Maximus VI Formula uses an identical CPU VRM to the Maximus VI Extreme. The board draws power from a combination of 24-pin ATX and 8-pin EPS. A 4-pin ATX and Molex can be optionally connected to stabilize overclocks. The LGA1150 socket is wired to four DDR3 DIMM slots, and three PCI-Express 3.0 x16 slots (x16/NC/NC or x8/x8/NC or x8/x4/x4), it lacks the PEX8747 bridge chip of its bigger sibling. Three other PCI-Express 2.0 x1 chips make for the rest of the expansion. Connectivity on the Maximus VI Formula includes ten SATA 6 Gb/s ports, eight USB 3.0 ports, SupremeFX audio, gigabit Ethernet (Intel controller), 802.11 ac WiFi, and Bluetooth 4.0. ASUS didn't reveal launch plans.

Phoenix Technologies Ltd., the global leader in UEFI firmware, products and tools, will preview major advances for BIOS technology and future developments at this year's Computex.

Phoenix next-generation BIOS featured on Intel's 2013 Ultrabook FFRD
As Intel's elected partner in developing the UEFI BIOS for next-generation devices, Phoenix is demonstrating its forward-thinking leadership in support of Ultrabook designs with a feature set that optimizes responsiveness, mobility, connectivity and power efficiency focused on delivering an extraordinary user experience. At Computex 2013, Phoenix will demonstrate Intel's next-generation Ultrabook FFRD featuring Phoenix SecureCore Technology 3.1 in certified compliance with Intel Rapid Start Technology, Smart Response Technology, Smart Connect Technology, Anti-Theft Technology and Identity Protection Technology.

Velocity Micro, the premier builder of award winning enthusiast desktops, laptops, and peripherals announces the immediate availability of expertly crafted systems powered by 4th Generation Intel Core Processors. Formerly code-named "Haswell," Intel's latest generation of processors provide better performance, increased efficiency, and improved on-board graphics, making them a perfect fit for Velocity Micro's enthusiast customer base. Custom built, made in the USA 4th Generation Intel Core processor systems from Velocity Micro start at just $1524.

"Because we make some of the most reliable, well-built desktops in the world, our customers expect nothing but the very latest hardware," said Randy Copeland, President and CEO of Velocity Micro. "Intel has been the leader in processor technology for years now and we're honored to be able to offer these new CPUs to our customers on launch day to satisfy their craving for the best of the best available."

Acer today announced the launch of the new 13.3" Aspire S3 Ultrabook at Computex Taipei. The S3 has inherited some of the industry-leading design and innovations of the Aspire S7, making it an impressively stylish and productive PC. As on the celebrated Aspire S7, the S3's patented dual-torque hinge design allows users to easily open the lid up to 180° for sharing content, while keeping the display wobble-free for an outstanding touch experience.

With Acer TwinAir cooling technology, the S3 is always cool to the touch without sacrificing performance. The light-sensing keyboard auto adjusts its brightness to ambient light for better visual comfort in dim settings. In addition, evoking the family design and visual purity of the S7's gorilla glass cover, the new S3 cover is made from aluminum and sprayed Sparkling White with a mirror-polish finish; the operation area is made from anodized aluminum throughout. Just 17.8 mm thin and weighing only 1.67 kg, this Ultrabook is slim and easy to carry anywhere.

Acer presents the next-generation 13.3-inch Aspire S7Ultrabook at Computex Taipei. In addition to retaining the celebrated characteristics of the previous model, the new S7 Ultrabook has improved battery life for all-day computing, a refined electroluminescent (EL) backlit keyboard for more natural typing, and 2nd generation Acer TwinAir cooling with less fan noise. In addition, it is equipped with wireless display (WiDi) technology for big-screen entertainment and productivity.

"We designed the S7 to be the best touch Ultrabook in the world, bar none," said Jim Wong, Acer Corporate President. "We listened carefully to users to find substantial ways to make it even better." The re-engineered S7 delivers improved battery life of up to 7 hours, a 33% increase from its predecessor. Its new light-sensing EL backlit keyboard is also refined, with a deeper keystroke for more natural and comfortable typing. Plus, thanks to 2nd generation Acer TwinAir cooling technology, the noise at maximum load is more than 20% lower than the previous S7, keeping the system quiet and cool.

Intel announced its much anticipated 4th generation Core processor family, codenamed "Haswell." The company launched as many as eight desktop retail processor models, all of which are quad-core, and spread across the Core i7 and Core i5 families. Leading the pack is the Core i7-4770K, which fully utilizes the 1.4 billion-transistor silicon, including four x86-64 cores with HyperThreading enabling eight logical CPUs, a new-generation HD Graphics 4600 core with 20 execution units, 8 MB of L3 cache, a dual-channel integrated memory controller supporting up to 32 GB of high-frequency DDR3 memory, and a 20-lane PCI-Express gen 3.0 root complex. The chip features unlocked base-clock multiplier, three BClk ratios, and iVR (integrated VRM).

The i7-4770K features 3.50 GHz clocks, and 3.90 GHz Turbo Boost. It is priced around US $350 in most stores. A variant without the unlocked base-clock multiplier and 3.40 GHz clocks, the Core i7-4770, is being sold around $320. An energy-efficient version of this chip, the Core i7-4770S, is priced around $310, it lacks unlocked BClk multiplier, and is clocked at 3.10 GHz, with the same 3.90 GHz Turbo Boost. While the other two feature 84W TDP, the i7-4770S features 65W.

ORIGIN PC announces the availability of new Intel Core 4th generation processors to their line of award-winning GENESIS, MILLENNIUM, and CHRONOS desktops and EON laptops. Now gamers, artists, professionals and enthusiasts will have the power to game, create, work and inspire like never before with Intel's latest Core processors. The new Intel Core 4th generation processors raise the bar in multi-core processing technology with a 15% CPU performance increase over last generation, low power consumption to enhance battery life, and built in security features to help keep your data safe and secure. ORIGIN PC will also be including a free digital copy of the upcoming PC title, GRID 2 with the purchase of any ORIGIN PC gaming system with Intel Core 4thgeneration processors.

"ORIGIN PC is thrilled to be an official launch partner of Intel and we're really excited to include their latest 4th generation processors inside our award-winning systems" says Kevin Wasielewski, CEO/Co-Founder of ORIGIN PC. "The incredible speed, increase in performance and stunning Ultra HD 4K video playback on Intel's 4thgeneration Haswell processors really shows a whole new level of processing power inside all of our ORIGIN desktops and laptops."

G.SKILL International Co. Ltd., the worldwide leading high performance memory designer and manufacturer, is pleased to announce the fastest, new DDR3 Memory Kit, "DDR3 3000MHz 32GB(4x8GB)"; it is the latest addition to the TridentX Series designed for the latest 4th Gen Intel Core Processors and Z87 system.

G.SKILL presents the ultimate speed of DDR3 3000 MHz C12 with up to 32GB (4x8GB) ultra high capacity. The following screen shows the kit passing Memtest pro with the low voltage of 1.65v, this was achieved using an Intel 4770K processor and the ASUS Maximus VI Extreme.

It turns out that the 4th generation Core "Haswell" retail box-art that surfaced late last month wasn't fake. With Intel's next-gen chips less than a week away from launch, retailers are stocked up on them. One such retailer in Japan let a box face the lens. Pictured below is a retail box of the Core i7-4770K. The paperboard box, for the first time in several generations, features a collage of true-color images, with the running theme being "creativity." The box features a cutout at its usual location, letting you take a good look at what you're spending $330 on.

Ahead of its grand Computex launch alongside the Core "Haswell" processor family, Intel's homebrew socket LGA1150 Desktop Board products are being previewed online. One such covers the company's flagship motherboard, the DZ87KLT-75K "Kinsley." The board features a CPU power supply that's most compliant to Intel's iVR design for Core "Haswell" processors, with an 8-phase design. You'll either love or hate the new heatsink design. Expansion slots include three PCI-Express 3.0 x16 (x16/x8/x4), three PCI-Express 2.0 x1, and surprisingly, a legacy PCI.

Storage connectivity includes six SATA 6 Gb/s ports from the Z87 PCH, two from a third-party controller, and an mSATA 6 Gb/s. The board features a single first-generation Thunderbolt port, which doubles up as mini-DisplayPort, the only other display output than HDMI. A variant of this board without Thunderbolt (in which the port works only as mini-DisplayPort), could be sold as DZ87KL-70K. Rest of the board's connectivity include eight USB 3.0 ports (six rear, two by header), eight USB 2.0/1.1 ports, two 800 Mbps FireWire ports (one rear, one by header), 8-channel HD audio with optical SPDIF, two gigabit Ethernet interfaces, and an optional front-panel module that gives the board front-panel USB 3.0 ports, 802.11 b/g/n WiFi, and Bluetooth 4.0. In addition to the five 4-pin PWM fan headers, the board appears to feature several overclocker-friendly features. Find a video presentation at the source.