At its 2013 International CES booth, Intel exhibited a side-by-side comparison of two systems, one running its next-generation Core "Haswell" processor's integrated graphics, the HD 4500 GT3 (all components enabled), and the other a discrete NVIDIA GeForce GTX 650 GPU. A highly forgiving DirectX 11-generation title, DiRT 3, was made to run on both GPUs. Visitors noted that even if not as smooth as the GTX 650, Intel's Haswell iGPU did produce playable frame-rates.

Sources close to the company have been claiming a significant, in fact, 100 percent performance lead of the Haswell iGPU over previous-generation HD 4000 iGPU featured in today's Core "Ivy Bridge" chips. If true, Intel's graphics may have come perilously close to, or even caught up with, AMD's A-Series "Trinity" line of APUs, which feature the fastest integrated graphics processor ever made.

With Intel's 2011-launched Core "Sandy Bridge" processors, Intel CPU overclocking as we know it changed. No longer could you overclock the CPU by stepping up BClk (base clock), a frequency that processors use to time various components, including the effective clock speed, and in some cases, memory, and uncore. Sandy Bridge left consumers with only one effective way of overclocking, stepping up an unlocked BClk multiplier, a feature only available with a handful expensive models.

According to a Hardcoreware report, when Intel took up the "one BClk to rule them all" approach with Sandy Bridge, it may have overlooked the possibility of the integrated GPU waking other components up from lower power states to use the L3 cache, affecting the chip's overall energy efficiency, which carried on to successive Core "Ivy Bridge" silicon. "Haswell" may present Intel with an opportunity to split core and uncore from sharing the same base clock, and as such it could be possible to crank up CPU clock speeds using BClk, without destabilizing the uncore. The author admits this is speculation on his part, but quite likely.

NCS Technologies Inc., a leading domestic computing systems manufacturer for government, enterprise and education, announced the availability of the NCS Altus XT mobile workstation, a powerful laptop PC featuring available Intel 3rd generation i3/i5/i7 Quad Core processor family technologies.

The NCS Altus XT and other advanced computing products are manufactured at a modern campus outside of Washington, D.C. At this headquarters NCS designs, manufactures, distributes and supports a wide range of computing products for customers worldwide.

Intel Media SDK 2013 now supports fixed-function hardware acceleration for video on Intel Atom processor-based tablets with Microsoft* Windows operating systems including video playback, editing and conversion.

The SDK, newly optimized for upcoming 4th generation Intel Core processors, codenamed "Haswell," includes enhanced support for Windows 8 including Microsoft DirectX 11, fully accelerated MPEG2 encode and MPEG/JPEG decode, and a Windows Store development sample. Use of Intel Media SDK 2013 also includes free licensing and source for integration with Open Source projects. The SDK is available as a free download.

Intel Corporation executives held a press conference today to outline a plan to accelerate new mobile device experiences across the company's growing portfolio of smartphone, tablet and Ultrabook offerings.

The announcements included a new smartphone platform for emerging markets, details on a forthcoming 22 nm quad-core SoC for tablets, and more personal and intuitive Ultrabook devices in innovative convertible designs were outlined by Mike Bell, vice president and general manager of the Mobile and Communications Group, and Kirk Skaugen, vice president and general manager of the PC Client Group at Intel.

McAfee and Intel today announced their commitment to lead in delivering innovative security solutions aimed at protecting a consumer's entire digital life, reflecting the broad adoption and usage of personal devices. Together with Intel, McAfee is redefining the consumer security experience with a focus on safeguarding consumer devices, securing personal data and protecting identities online. This user-centric approach will deliver a comprehensive and valuable service offering that helps meet the evolving needs of consumers as they enjoy their digital lives, anywhere, from any device. The first of these personalized security offerings from McAfee is available in beta to partners, with a consumer version of the product available mid-year 2013.

The explosion in connected devices and the availability of online content and services has consumers spending more of their lives online. Always-connected consumers who are shopping, banking, and sharing information online have an unprecedented amount of their personal and financial information at risk to increasingly sophisticated attacks and scams. Because of these new usages and the resulting distribution of personal information, a more comprehensive approach to security is required to protect consumers.

Intel's next-generation SSD 530 series, which sees a single product line covering 2.5-inch and compact form-factors, arrives in the second quarter of 2013. The new series is being designed to offer high-performance even at smaller card form-factors, which is particularly important for the ultra-thin/Ultrabook ecosystem. The drive has been pictured in the newer NGFF (next generation form-factor), which is designed to be even smaller than mSATA.

While mSATA drives typically measure 51 x 30 mm, NGFF measures 42 x 22 mm. NGFF is a single interface featuring pins for both SATA and PCI-Express x2 or x4, and cards designed around its specification can either be SATA SSDs, or other bandwidth-heavy devices (such as 802.11ac WLAN controllers). Cards can even be designed to have an SATA SSD subunit on one side, and a PCI-Express device on the other, saving swathes of PCB real-estate in the process. The form-factor even supports double-sided SSDs such as this one from Lite-On, which features an independent SSD subunit on each side, which is striped in RAID 0. The NGFF Intel SSD 530 family will be introduced in Q2-2013, in two capacities - 80 GB and 180 GB.

The latest in a series of Intel Desktop Boards designed for overclocking K-series 2nd and 3rd gen Intel Core processors, the Intel DZ75ML-45K delivers flexible overclocking and Lucid* Virtu MVP at an affordable price. Additionally, Intel Desktop Boards has extended a Lucid MVP upgrade to existing Intel 7-series performance boards currently using Lucid Virtu Universal.

The Lucid MVP GPU Virtualization feature enables use of Intel QuickSync whether your monitor cable is connected to a discrete graphics card or you are using Intel HD graphics built in to the CPU. Visit the Intel Download Center to upgrade. To learn more about Lucid's enhanced gaming and visual performance offering, visit www.lucidlogix.com. Intel Desktop Boards is also the proud launch partner of Lucid Virtu MVP2.0 coming in 2013. For more information about the DZ75ML-45K, visit the product page.

It looks like Intel's Core "Haswell" processor family will miss its anticipated March-May launch window, with the company choosing Computex 2013 as its next launch-pad. According to a leaked document intended for distributors and large retailers, desktop Core "Haswell" processors will launch only after May 27, before June 7, and retailers are told to hold off advertising the launch till June 2nd.

Among the products featuring in the new May 27 - June 7 launch window are the Core i7-4770K flagship product, i7-4770, i7-4770S, i7-4770T, i7-4765T, i5-4670K, i5-4670, i5-4670S, i5-4670T, i5-4570, i5-4570S, i5-4570T, i5-4430, and i5-4430S, all of which are quad-core parts. In addition, socket LGA1150 motherboards based on Intel Z87 (flagship, OC-ready), H87, Q87, Q85, and B85 chipsets, will be launched. In all likelihood, one piece of decoration the CES venue could miss, is the wall of LGA1150 motherboards, which is usually put up by Intel.

CPU cooler manufacturer Arctic (aka Arctic Cooling) may have inadvertently leaked a very long list of 4th generation Intel Core processors based on its LGA1150 socket. Longer than any currently posted lists of Core "Haswell" processors, the leak includes model numbers of nine Core i7, seventeen Core i5, five Core i3, and two Pentium models. Among the Core i7 models are already known i7-4770K flagship chip, i7-4770S, and a yet-unknown i7-4765T. The Core i5 processor list is exhaustive, and it appears that Intel wants to leave no price-point unattended. The Core i5-4570K could interest enthusiasts. In comparison to the Core i5 list, the LGA1150 Core i3 list is surprisingly short, indicating Intel is serious about phasing out dual-core chips. The Pentium LGA1150 list is even shorter.

The list of LGA1150 processor models appears to have been leaked in the data-sheets of one of its coolers, in the section that lists compatible processors. LGA1150 appears to have the same exact cooler mount-hole spacing as LGA1155 and LGA1156 sockets, and as such upgrading CPU cooler shouldn't be on your agenda. Intel's 4th generation Core processor family is based on Intel's spanking new "Haswell" micro-architecture, which promises higher performance per-core, and significantly faster integrated graphics over previous generation. The new chips will be built on Intel's now-mature 22 nm silicon fabrication process. The new chips will begin to roll out in the first-half of 2013.

It's no secret that nearly all Intel Core processors are carved out of essentially one or two physical dies, be it the "2M" die that physically features four cores and 8 MB of L3 cache, or the "1M" die, which physically features two cores and 4 MB of L3 cache. The two silicons are further graded for energy-efficiency and performance before being assigned a package most suited to them: desktop LGA, mobile PGA, mobile BGA, and with the introduction of the 4th generation Core "Haswell," SoC (system on chip, a package that's going to be a multi-chip module of the CPU and PCH dies). The SoC package will be designed to conserve PCB real-estate, and will be suited for extremely size-sensitive devices such as Ultrabooks.

The third kind of grading for the two silicons relates to its on-die graphics processor, which makes up over a third of the die area. Depending on the number of programmable shaders and ROPs unlocked, there are two grades: GT2, and GT3, with GT3 being the most powerful. On the desktop front (identified by silicon extension "-DT,") Intel very much will retain dual-core processors, which will make up its Core i3, Pentium, and Celeron processor lines. It will be lead by quad-core parts. All desktop processors feature the GT2 graphics core.

In an interview with DigiTimes, ASUS general manager of motherboard business Joe Hsieh commented on reports of Intel abandoning CPU sockets in favor of processors being hardwired to motherboards in BGA packages. Hsieh said that the issue will not be as bad as people think and Intel could find a strategy that allows both soldered and socketed processors to be sold, which is much like today, except that hardwired processors are limited to notebooks (Core i3 and i5 processors in the BGA1224 package) and low-end Atom-driven desktop motherboards.

What lends Hsieh's statement weight, apart from the fact that he leads the biggest PC motherboard design team, is that Intel recently denied those reports, saying it would provide socketed CPUs for "the foreseeable future." Last month, Japanese publication PC Watch, credited for generally accurate tech predictions based on information at hand, reported that following its 22 nm Core "Haswell" CPU family, Intel could transform its entry-, mainstream-, and performance-segment client CPUs to hardwired BGA packages, probably leaving socketed CPUs only to HEDT (high-end desktop) and enterprise Xeon processor lines. Other PC motherboard vendors DigiTimes spoke with echoed ASUS' opinion, they don't believe Intel could "suddenly" completely change the way processors are sold to consumers.

Intel's Core i7 "Haswell" line of high-performance mobile processors will launch around roughly the same time as its first desktop counterparts, in April 2013. The April launch will consist of three models, which occupy conventional TDP ratings, making them fit for performance/gaming classes of notebooks, they're not quite Ultrabook-material.

Leading the pack is the Core i7-4930MX Extreme Edition, which enables nearly every component on the silicon. The quad-core chip features HyperThreading, which enables 8 logical CPUs, 3.00 GHz clock speed with 3.90 GHz maximum Turbo and 3.70 GHz all-core Turbo, new Intel HD 4600 Graphics clocked at 400 MHz with 1350 MHz maximum boost, 8 MB L3 cache, and 57W TDP.

NEC Japan rolled out the world's thinnest Ultrabook, the 15.6-inch LaVie X (model: LX850/JS). It is just 12.8 mm thick (375 x 255 x 12.8 mm), weighing 1.59 kg. NEC achieved its thickness thanks to innovations in cooling that spreads cooling components apart. It features an LED backlit IPS LCD screen featuring 1920 x 1080 pixels resolution, Intel Core i7-3517U processor, 4 GB of RAM, 256 GB SSD storage, and Windows 8. Connectivity includes two USB 3.0 ports, 802.11 b/g/n WLAN, Bluetooth 4.0 +HS, HDMI display-output, SDHC/SDXC card slot, and a 2-megapixel web-camera. It is slated for market availability on December 27.

In addition to last month's NE01 and NE02 full-aluminum replacement cases for Intel's revolutionary NUC desktop, Japanese PC case maker Abee debuted the NE03 and NE04 (pictured in that order). Available in five metallic color options, the NE03 features a brick-shaped design with a clear acrylic top. It measures 140 x 200 x 50 mm (WxDxH). The NE04, on the other hand, features a cubical design, is available in five soft color options of its own, measures 125 x 110 x 117 mm, and supports a 60 mm fan. The two are priced at 17,980¥ (US $213) and 15,980¥ ($190), respectively.

2013 promises to be another year, with another new line of processors by Intel, and like every alternate year, the company will introduce a new client desktop CPU socket. With its 4th generation Core "Haswell" processor family, Intel will introduce a brand new CPU architecture that steps up IPC over current Core "Ivy Bridge," hence, Intel's Core desktop processor lineup will not ship with higher clock speeds, yet higher performance. The new chips will be built in the LGA1150 package, and will be accompanied by Intel's 8-series "Lynx Point" chipset.

By Q2-2013, Intel will have launched as many as 14 Core desktop CPU models, including six in the mainline, and eight power-optimized ones. Its nomenclature is somewhat similar to that of current Core "Ivy Bridge" lineup, except the 4000-series numbering. Leading the pack is the Core i7-4770K (unlocked) and i7-4770, clocked at 3.50 GHz with 3.90 GHz Turbo Boost, featuring eight threads with HyperThreading, 8 MB of L3 cache, Intel HD Graphics 4600 iGPU clocked up to 1250 MHz, with 84W TDP; followed by Core i5-4670K (unlocked) and i5-4670 clocked at 3.40 GHz with 3.80 GHz Turbo Boost, and 6 MB L3 cache. The Core i5-4570 and i5-4430 are clocked at 3.20 GHz (3.60 GHz Turbo) and 3.00 GHz (3.20 Turbo).

Intel Corporation introduced the Intel Atom processor S1200 product family today, delivering the world's first low-power, 64-bit server-class system-on-chip (SoC) for high-density microservers, as well as a new class of energy-efficient storage and networking systems. The energy-sipping, industrial-strength microprocessor features essential capabilities to achieve server-class reliability, manageability and cost effectiveness.

"The data center continues to evolve into unique segments and Intel continues to be a leader in these transitions," said Diane Bryant, vice president and general manager of the Datacenter and Connected Systems Group at Intel. "We recognized several years ago the need for a new breed of high-density, energy-efficient servers and other datacenter equipment. Today, we are delivering the industry's only 6-watt SoC that has key datacenter features, continuing our commitment to help lead these segments."

Intel's 22 nanometer tri-gate technology, which goes into building today's 3rd Generation Core desktop and notebook processors, and soon the entry-level Pentium and Celeron ones, will make it to mobile SoCs (systems on chips), which will drive battery life-sensitive devices such as smartphones and tablets. Intel announced that development of such chips is in progress, speaking at the 2012 International Electron Devices Meeting. The new 22 nm SoCs could feature anywhere between 20 to 65 percent higher performance than today's 32 nm low-power chips. The new chips will allow Intel to take on mid- and high-grade ARM SoCs. Intel didn't go into the specifics.

Validity Sensors, Inc., the leader in Natural ID authentication, today announced that Intel Capital has completed a strategic investment as part of its Series E Financing. Intel's investment combined with additional strategic investments from World Fair and DDS brings the total Series E capital commitments to more than $22 million. This follows an initial closing on October 4, 2012, led by TeleSoft Partners that included full participation from Qualcomm Ventures, VentureTech Alliance (the venture capital arm of TSMC), Panorama Capital and Crosslink Capital.

"Validity's technology addresses an important need to make computing devices and the transactions completed on them more secure while actually increasing ease of use for the end user," said Dave Flanagan, Managing Director, Intel Capital. "This investment reflects our commitment to collaborate with the fingerprint sensor market leader to create differentiated products for mobile and computing platforms."

PROMISE Technology Inc., a leader in providing high-performance storage solutions for the rich media market and the leader in designing cutting-edge Thunderbolt enabled devices, is proud to announce creative professionals and power users on PCs can now leverage the unparalleled performance of the award-winning Pegasus J2 to power them through their creative projects. The ultra-portable PROMISE Pegasus J2, one of the first storage devices with Thunderbolt technology to be certified for PC by Intel Corporation, can deliver up to 750 MB/s of performance, yet it's pocket-sized, enabling users to harness high bandwidth to transfer, playback, or edit media directly from the Pegasus J2 from anywhere.

Provided Intel's idea of the "foreseeable future" doesn't end at 2014, PC enthusiasts can breathe a sigh of relief as it came out with a statement saying it is committed to socketed CPU platforms. "Intel remains committed to the growing desktop enthusiast and channel markets, and will continue to offer socketed parts in the LGA package for the foreseeable future for our customers and the Enthusiast DIY market," said Intel spokesperson Daniel Snyder, adding "However, Intel cannot comment on specific long-term product roadmap plans at this time, but will disclose more details later per our normal communication process."

Reports of Intel abandoning socketed client CPUs in favor of BGA (ball grid array) packages -- in which the processor is permanently soldered onto motherboards à la graphics cards -- first surfaced in October with industry observer PC Watch, which maintains a spotless record on predicting long-term Intel roadmaps, claiming Intel will abandon socketed CPUs after 4th generation Core "Haswell." The news even prompted AMD to come out with a statement that it's never gonna give you up, never gonna let you down, never gonna turn around and desert you.

Intel will be capable making chips on the 14 nanometer silicon fabrication process, in 18-inch diameter wafers, "in two years," as development of the technology and machinery to make it happen is making good progress, according to company CTO Justin Rattner. He noted that Intel's aggressive tech advancement will keep Moore's Law relevant for at least the next 10 years. By the end of 2013, Intel's D1X Fab in Oregon, Fab 42 in Arizona, in the US, and Fab 24 in Ireland will begin producing batches of simple chips such as P1272 and P1273 series SoCs. After 14 nm, development for 10 nm, 7 nm, and 5 nm will follow, in order.

Even as Intel neither confirms nor denies reports of it abandoning socketed client desktop processors in favor of BGA packages that permanently bind chips to motherboards, AMD has come forward and asserted that it won't abandon socketed client processors, and will continue to support the DIY PC enthusiast market, reinforced with the fact that BClk multiplier-unlocked processors from the company start for as low as US $129.99. In a statement to the TechReport, AMD's Chris Hook said:

AMD has a long history of supporting the DIY and enthusiast desktop market with socketed CPUs & APUs that are compatible with a wide range of motherboard products from our partners. That will continue through 2013 and 2014 with the "Kaveri" APU and FX CPU lines. We have no plans at this time to move to BGA only packaging and look forward to continuing to support this critical segment of the market.

As the company that introduced new types of BGA packages in ultrathin platforms several years ago, and today offers BGA-packaged processors for everything from ultrathin notebooks to all-in-one desktops, to embedded applications and tablets, we certainly understand Intel's enthusiasm for the approach. But for the desktop market, and the enthusiasts with whom AMD has built its brand, we understand what matters to them and how we can continue to bring better value and a better experience.

Intel Corporation today announced the pricing of four series of senior unsecured notes for an aggregate principal amount of $6.0 billion pursuant to an effective shelf registration statement previously filed with the Securities and Exchange Commission.

Of these notes, $3.0 billion will mature on Dec. 15, 2017 and will bear interest at an annual rate of 1.35%, $1.5 billion will mature on Dec. 15, 2022 and will bear interest at an annual rate of 2.70%, $750 million will mature on Dec. 15, 2032 and will bear interest at an annual rate of 4.0%, and $750 million will mature on Dec. 15, 2042 and will bear interest at an annual rate of 4.25%. The notes were offered to the public at a price of 99.894% of par in the case of the 2017 notes, 99.573% of par in the case of the 2022 notes, 99.115% of par in the case of the 2032 notes and 99.747% of par in the case of the 2042 notes. The offering is expected to close on Dec. 11, 2012, subject to customary closing conditions.

With the dawn of 2013, and no catastrophes in sight, Intel is going ahead with its usual business of phasing out old processor models, and making way for new ones. By the end of 2012, Intel will stop taking orders for several processor models mostly based on the older 32 nm "Sandy Bridge" silicon. These include chips such as the Core i7-2700K, Core i5-2310, Core i3-2105, Pentium G440, and surprisingly, an early demise of the 22 nm Core i5-3450, which is cannibalized by the Core i5-3470 at the same price point. Pentium G870, G645 and G645T as well as Celeron G555, G550 and G550T are the other chips on the chopping block.

Come 2013, Intel will release Pentium and Celeron series processors based on its 22 nm "Ivy Bridge" micro-architecture. These include the Pentium G2130, G2020 and G2020T and Celeron G1620, G1610 and G1610T. In the mobile (notebook) CPU sphere, Intel will launch dual-core "Ivy Bridge" chips to layer out its Ultrabook product segment. These include the Core i7-3687, Core i5-3437U, Celeron 1037U, 1007U, 1020M and 1000M. In March, the company is expected to launch its 4th generation Core "Haswell" line of processors.