Thermaltake, being the industry pioneer brand with expertise in PC chassis, power supply and thermal solution, is launching the new reinvent CPU cooler - the "BigTyp Revo", the COMPUTEX 2012 d&i award winner, an award recognises Thermaltake being the pacemaker of CPU cooler, which also made the debut during CeBIT 2012 this March, to users and gamers who favor the down draft rather than the tower cooler.

Thermaltake BigTyp Revo is the next substantial down draft CPU air cooler after the introduction of the Orb Series and the Typhoon Series that marked a brand-new new CPU cooler era for Thermaltake.

Around three years after the European Commission slapped Intel with a record €1.06 billion fine for anti-competitive practices against market rival AMD, the company appealed against the fine, on grounds that the commission relied on "profoundly inadequate" evidence to establish anti-competition charges against the company, which lead to the fine. A 5-member bench of General Court in Luxembourg, Europe's second highest, will hear arguments of both Intel and EU's regulators, during a 4-day hearing. Intel wants its conviction quashed and its fine reduced/removed. According to European regulators, major computer manufacturers such as HP, Dell, and Lenovo, received unfair rebates from Intel for opting for its chips. The case is T-286/09, Intel vs Commission.

The UEFI Forum has ratified an update to the UEFI 2.3.1 Specification that adds important firmware considerations and addresses numerous engineering change requests. The updated Specification will be referred to as "UEFI 2.3.1C".

• UEFI 2.3.1C adds: An OS Indications Variable - OS/FW feature & capability communication - when implemented, allows end-users to make an OS menu request to enter BIOS setup after next reboot.
• UEFI 2.3.1C adds: A mechanism which, when implemented, facilitates Open Source Operating System installations and OS- agnostic end-user configurations of retaining the factory default keys while in Setup Mode (see Specification for full technical detail of Setup Mode).
• UEFI 2.3.1C removes: Runtime driver requirement on Network UNDI drivers - this allows UNDI drivers to be delivered in EFI Byte Code (EBC) Virtual Machine format supporting systems based on different processor architectures.

MSI launch MS-9893 with the latest Intel Atom Platform. This is the multi-display outputs of mini-ITX form factor board with the latest 32nm process technology for the highest HD graphics quality, and offers lower power consumption and enhanced graphic and media performance.

MSI MS-9893 supports multi-display outputs, including single Channel 18/24 bit LVDS, VGA, one HDMI. It has great graphics performance and support for up to 1080P high definition video.MSI MS-9893 is equipped with single-channel DDR3 1066 MHz memory up to a maximum of 4 GB in 1 x 204 SO-DIMM slots. MS-9893 supports D2550(10W) / N2800(6.5W) two SKU, with VGA, HDMI, Video Output: LVDS/ Single CH 24bit by D2550 (LVDS/ Single CH 18bit by N2800). Power Input support, one ATX for D2550, and another is DC-in 12V for D2550 / N2800. I/O, and expansion connectivity, including 6* COM-ports(2 x Real, 4 x Internal), 6* USB2.0(4 x Real, 2 x Internal), and 8*GPIO(4 x GPI, 4 x GPO), one PCI slot and one Mini-PCIe slot could support the m-SATA/wireless function.

Hard drive prices refuse to budge after last year's floods that struck manufacturing facilities in Thailand, even as manufacturers turn record profit. The solid-state drive market, on the other hand, is finally rolling with competition, high volume production, and advancements in NAND flash technologies. With memory majors such as Hynix adding new NAND flash manufacturing facilities to their infrastructure, SSD is expected to finally get its big break in the mainstream market.

SSD prices, according to price aggregators, are on a free-fall. Models which once held relative pricing as high as $2 per gigabyte, and going deep within the $1 mark. For example, Crucial's widely-praised M4 256 GB SSD has a price per GB of 'just' $0.82, and a market price around $200, something unheard of, for a 256 GB SSD with transfer rates of over 500 MB/s. With SSD major OCZ Technology releasing new generations of drives under the Vertex 4 and Agility 4 series that use Indilinx processors, older Vertex 3 and Agility 3 models are being phased out, some of these are seeing sub $1/GB prices. Intel is also responding to market trends, with prices of its SSD 520 series dropping sharply. Find a boat-load of stats at the source.

MSI announced today that their Intel 6/7 series mainboards have officially acquired Windows 8 certification from Microsoft. During the Computex exhibition this year, MSI already lead the Windows 8 market by displaying several mainboards that meet the Windows 8 certification requirements and showing off various new Windows 8 features live for the exhibition audience.

Not only did the MSI mainboards get officially certified from Microsoft, they are currently the only leading mainboard brand that runs 3DMark for Windows 8 successfully on their certified mainboards, which proves that MSI is fully ready for Windows 8 in terms of both software and hardware, safeguarding the Windows 8 system's stability and compatibility for consumers and providing the best user experience!

Today during the Structure Conference in San Francisco, Jason Waxman, GM of the Cloud Infrastructure Group outlined Intel's vision and roadmap for microservers and discussed how they best suited to handle emerging "scale-out" applications. Waxman provided an update on Intel's roadmap for microservers including new generations of Intel Xeon processors and Intel Atom architecture based 22nm SoC chips codenamed "Avoton", both scheduled for 2013. In his blog Jason also talks about why within the new segment of servers it is the application that will decide which core - Intel Atom or Xeon - will be the optimal solution. Waxman's presentation can be found here.

InterDigital, Inc. and Intel Corporation today announced that certain of InterDigital's subsidiaries have signed a definitive agreement to sell to Intel roughly 1,700 patents and patent applications for $375 million in cash.

The agreement involves patents primarily related to 3G, LTE and 802.11 technologies. InterDigital is an active developer of advanced wireless technologies including WCDMA (Wideband CDMA), HSDPA (High Speed Download Packet Access) and HSUPA (High Speed Upload Packet Access) 3G technologies as well as LTE (Long Term Evolution) and LTE-Advanced 4G technologies.

The Intel Xeon processor E5-2600 product family reached a new supercomputing milestone as the fastest adopted new processing technology to power 44 systems, including 3 Petascale-class supercomputers on the 39th edition of the Top500 list announced today.

The "SuperMUC" supercomputer at LRZ in Germany, which ranked fourth on the list, delivers 2.9 PetaFLOPs of performance, making it the most powerful in Europe, as well as the largest installation based on the new Intel Xeon processors E5 family.

The Leibniz Supercomputing Centre (LRZ), in collaboration with IBM, today announced the world's first commercially available hot-water cooled supercomputer, a powerful, high-performance system designed to help researchers and industrial institutions across Europe investigate and solve some of the world's most daunting scientific challenges.

The new LRZ "SuperMUC" system was built with IBM System x iDataPlex Direct Water Cooled dx360 M4 servers with more than 150,000 cores to provide a peak performance of up to three petaflops, which is equivalent to the work of more than 110,000 personal computers. Put another way, three billion people using a pocket calculator would have to perform one million operations per second each to reach equivalent SuperMUC performance. Also, a revolutionary new form of hot-water cooling technology invented by IBM allows the system to be built 10 times more compact and substantially improve its peak performance while consuming 40 percent less energy than a comparable air-cooled machine.

The Panasonic Toughbook CF-19 has transformed the way professionals work in field utilities, emergency services, defence, transport maintenance and a huge range of field services by providing access to data and applications, wherever and whenever they need it. This latest device will mark a decade for the product line of market-leading rugged convertible notebooks, enabling customers to benefit from the latest design and technology enhancements whilst continuing to use the wide range of peripherals built around the range, such as docking stations and car mounts.

The new Toughbook CF-19 includes the 3rd generation Intel Core i5 Processor & Chipset. The high performance Intel Core i5-3320 vPro (2.60 GHz, up to 3.30 GHz with Intel Turbo Boost Technology) standard voltage processor with Intel HD 4000 graphics, ensures the device is capable of handling the most intensive applications. To ensure reliability in the most challenging environments, the CF-19 remains unique in the market with its fan less design; instead using Panasonic energy optimisation and optimised heat pipes to cool the full performance, standard voltage CPU.

Corsair launched a new affordable high-density DDR3-1600 MHz dual-channel memory kit, model: CMZ16GX3M2A1600C9. The kit consists of two 8 GB modules, which operate at 1600 MHz (PC3-12800), with timings of 9-9-9-24, and DRAM voltage of 1.5V. The modules pack an Intel XMP v1.3 profile that enables the advertised speeds. Apart from these, the kit is built in the conventional Corsair Vengeance module design. It is expected to be priced at US $135.

Apple today updated MacBook Air with the latest Intel Core processors, faster graphics and flash storage that is up to twice as fast as the previous generation.* MacBook Air is the ultimate everyday notebook, and with new lower prices it is more affordable than ever. The current generation 13-inch and 15-inch MacBook Pro have also been updated with the latest Intel Core processors and powerful discrete graphics from NVIDIA. Apple's popular AirPort Express has been redesigned to include features previously available only in AirPort Extreme.

"Today we've updated the entire MacBook line with faster processors, graphics, memory, flash storage and USB 3 connectivity," said Philip Schiller, Apple's senior vice president of Worldwide Marketing. "We've made the world's best portable family even better and we think users are going to love the performance advances in both the MacBook Air and MacBook Pro."

Intel's Next Unit of Computing (NUC) 4-inch mini-PC concept is taking shape as more of a premium mini-PC, than an affordable mainstream PC. According to sources, the NUC will arrive some time in Q3 2012, priced at US $400. The base system will be powered by a Core i3 dual-core processor paired with HM65 chipset, about 4 GB of dual-channel DDR3 memory, 40 GB mSATA SSD, HDMI, mini-DisplayPort, WiFi, and Bluetooth. The first-generation NUC hence sticks to mature previous-generation components, while 7-series chipset, and 22 nm processors could be part of its specifications a little later. The demo system at Computex was driven by a Core i5 "Ivy Bridge" processor, with a Turbo Boost speed of 2.70 GHz. A cheaper Celeron-powered version of the NUC is also on the cards.

Phoenix Technologies Ltd., the global leader in UEFI firmware technology, products and tools, today announced it has signed an agreement with Intel Corporation to be its collaborative partner for BIOS. The two companies will jointly develop the new reference UEFI firmware for the Intel code base.

Phoenix will provide on-site engineers who will work collaboratively with Intel across various global locations to create the reference UEFI core code firmware that will greatly improve and standardize the code base support for all future Intel client platforms. These improvements will be included in areas such as tools, re-visioning schemes and other firmware structures that will support bringing customer products to market quickly and efficiently. This jointly created reference standard for UEFI BIOS on Intel platforms will optimize an OEM's ability to meet market demands such as long battery life, instant-on and always connected for ultra-thin client products, as well as reliability, scalability and performance.

Russian Communication Technology LTD. launched DETSEL-01, one of the smallest Intel x86-powered mini-PCs ever. Measuring just 125 x 74 x 12 mm (roughly the size of a Seagate GoFlex 2.5-inch portable HDD), the DETSEL-01 is driven by an Intel Atom E680 processor (1.60 GHz, single-core with HTT, 4.5W TDP), with 1 GB of DDR2-800 memory, with 128 GB or 64 GB SATA 3 Gb/s SSD handling storage, and an external 12V DC input powering it. Connectivity is aplenty, with 802.11 b/g/n, gigabit Ethernet, Bluetooth 4.0, D-Sub display output (HDMI coming soon), stereo HD audio, and two USB 2.0 ports. The best part about this pocket-sized PC is its ability to run 32-bit Windows XP and Windows 7.

Toshiba's Digital Products Division (DPD), a division of Toshiba America Information Systems, Inc., today announced its enhanced business laptops product line with 3rd generation Intel Core processors and new technology developed with IBM that enables IT professionals to better control the security and power management across enterprise deployments. The new models include the Portégé Z930 Ultrabook and the Portégé R930 ultraportable, as well as upgrades to its Tecra line of laptops, business workhorses with enhanced durability, security and reliability.

Toshiba's Digital Products Division (DPD), a division of Toshiba America Information Systems, Inc., today announced its roadmap of new computing devices designed for Microsoft Windows 8. Toshiba's new mobile solutions showcase the advanced functionality and capabilities Toshiba plans to bring to market while enhancing the experience of the new operating system.

"These inspiring new PC and tablet designs will allow consumers and business users to interact with Windows in amazing new ways," said Carl Pinto, vice president of marketing, Toshiba America Information Systems, Inc., Digital Products Division. "These products reflect Toshiba's long history of engineering breakthrough computing hardware in thin and light form factors and our close relationships with Microsoft and our silicon partners to bring them to market."

Intel Corporation Senior Vice President Tom Kilroy officially introduced the next wave of Ultrabook systems during a keynote address at Computex Taipei 2012. Making a bold statement around the importance of touch technology, Kilroy also announced that Intel has signed agreements with several leading touch panel manufacturers to ensure adequate capacity to meet the expected demand for touch-enabled Ultrabook experiences over the next several years.

He also highlighted the company's efforts to deliver user-centric experiences across a range of mobile devices from the Ultrabook to smartphones and tablets, pointing to momentum across all three.

Belkin today announced new upgrades to its upcoming Thunderbolt Express Dock, as well as a new Thunderbolt cable for both Mac and PC users. Belkin's new Thunderbolt offerings will be on display at the Intel Exhibition Showcase, Booth M410, at Computex, June 5-9, 2012.

The Thunderbolt Express Dock is a first-of-its-kind docking solution for both PC and Mac users that enables instant access to up to nine desktop peripherals with one cable, and provides an easy transition from a desktop workstation to a mobile device. Upgrades to the latest version of the dock include the addition of three USB 3.0 ports, instead of USB 2.0 ports, as well as an eSATA port.

DisplayLink, the leading provider of technology for virtual graphics and USB-connected computing, today announced its support for 3rd generation Intel Core processors and supporting mobile Intel QM77 and Intel QS77 express chipsets with SuperSpeed USB 3.0.

DisplayLink's DL-3000 chip platform with USB 3.0 is shipping today in adapters, monitors and docking stations from leading vendors. The broad availability of onboard USB 3.0 in systems using 3rd generation Intel Core processors means that a huge new segment of the market now has access to easy-to-use docking, and multi-display possibilities. With DisplayLink technology, Ultrabook devices can now enjoy full docking station functionality, portable USB 3.0 monitors can be quickly connected without the need for a separate power cable, and up to six displays can be driven by a single computer over just one "Plug and Display" USB cable.

At IDF Beijing, 2012, Intel unveiled a large selection of its upcoming Ultrabook designs, including what it referred to as "Letexo," a sliding-Ultrabook, which bridges the gap between high-performance Windows 8 tablets, and Ultrabooks (devices with keyboards). MSI is working on one such device, which lays to rest the looming question of whether the company plans to do Ultrabook PCs. The unnamed Letexo by MSI was unveiled as a teaser picture, earlier today. The device is a fully functional Windows 8 tablet, driven by Intel architecture, a comfortable and responsive chiclet keyboard slides out, when you have a lot of typing to do. We expect to see this device at Computex.

Dell is reimagining the all-in-one computer with a new portfolio of solutions for consumers who desire beautifully designed systems for multimedia creation and entertainment. The new computers include the XPS One 27, Dell's largest ever all-in-one and part of the premium XPS performance family, and the Inspiron One 23 and Inspiron One 20 all-in-one computers for families. The three desktop computers are slim and stylish and reflect Dell's design aesthetic that places a premium on unique materials, form factors and experiences.

The XPS One 27 delivers a big-screen experience - from the diagonal to the resolution - with one of the most vibrant displays Dell has offered. The XPS One 27 is 27-inches of stunning 2560x1440 Full Quad HD clarity and color. The wide format 16:9 WLED display makes digital work, movies, games and photos appear crisp, colors vivid. It delivers optional high-performance graphics from NVIDIA and entertainment features such as Waves MaxxAudio 4 and Infinity-branded speakers, an optional slot load Blu-ray disc drive, and optional internal TV tuner, making it an entertainment and multimedia powerhouse.

As revealed by a leaked slide, Dell's Windows 8 plans include the launch of a 10-inch tablet running Microsoft's upcoming operating system. Interestingly-enough, although Windows 8 will be ARM-friendly the tablet Dell has in the works, named Latitude 10, is going to be powered by an x86 processor, more specifically, a dual-core Intel Atom (Clover Trail).

The Latitude 10 will feature a 10.1-inch (1366 x 768) capacitive touchscreen, integrated graphics, 2 GB of LPDDR2 memory, up to a 128 GB SSD, an 8-megapixel rear-facing camera, a 2MP front camera, stereo speakers, WiFi, Bluetooth and optional broadband, and a removable 2-cell or 4-cell battery enabling up to 8/12 hours of operation.

The tablet is rumored to become available around October/November.

Intel Corporation today announced it will invest more than $40 million over the next 5 years in a worldwide network of university research communities called the Intel Collaborative Research Institutes (ICRI). The ICRI program is based on the successful U.S.-based Intel Science and Technology Centers (ISTCs), and will bring together experts from academia and industry to help explore and invent in the next generation of technologies that could impact the lives of many in the future.

"The new Intel Collaborative Research Institute program underscores our commitment to establishing and funding collaborative university research to fuel global innovation in key areas and help address some of today's most challenging problems," said Justin Rattner, chief technology officer at Intel. "Forming a multidisciplinary community of Intel, faculty and graduate student researchers from around the world will lead to fundamental breakthroughs in some of the most difficult and vexing areas of computing technology."